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10/12/09 11:25 PM 1
OUTLINE
Introduction
What are heat pipes?
What are loop heat pipes?
Basic components of loop heat pipes
Operating principles of LHP
Conditions for the operation of LHP
LHP design
Types of LHP’s
Limitations of loop heat pipes
Applications of LHP
Conclusions
References
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INTRODUCTION
The loop heat pipe (LHP) was invented in Russia in the early
1980’s
Thermal management is an important factor .All applications
generate high concentrated heat so need to control this
heat
The LHP is known for its high pumping capability and robust
operation because it uses fine-pored metal wicks and the
integral evaporator/hydro-accumulator design
two-phase heat transfer devices that utilize the evaporation
and condensation of working fluid to transfer heat
capillary forces developed in fine porous wicks to circulate
the fluid
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HEAT PIPES ?
Offer 100 to a 1000 times more effective thermal
conductivity than that offered by a solid copper rod.
Hollow cylindrical channel lined with a wick structure.
Channel evacuated and a working fluid is injected.
One end heated so phase change of the working fluid
occurs.
Vapor flows through the hollow middle section.
Fluid is wicked back
through the wick structure.
Used as an efficient
heat path between a heat
source and a heat sink.
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LOOP HEAT PIPES??
serious constraint on conventional heat
pipes is the reduction of transport
capabilities when condenser is located
below evaporator section in a
gravitational field.
Loop heat pipes are the solution
Can perform at any orientation in a
gravitational field over long distances
Phase change from liquid to vapor
state by absorbing latent heat
vapor is transported to the cooling sink
where it cools down and change phase
to the liquid form
utilizes the thermodynamic pressure
difference developed between the
evaporator and condenser to circulate
a working fluid through a closed loop
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BASIC COMPONENTS OF A
LOOP HEAT PIPE
The evaporator
The working
fluid
The wick or
capillary
structure
condenser
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EVAPORATOR
Three main layers
Top layer “ vapor chamber ”
Middle layer “ Wick material “
Bottom layer “compensation chamber “
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WICK
function of the wicking material
•Hold the meniscus using capillary
pressures
•Surface meniscus to withstand the back
pressure effects of the gas
•Provide liquid return from
Types condenser
of wicks
•Primary wick
to evaporator primary wick will not be totally
wetted
• Secondary wick
The primary function of
secondary wick is to wet the
primary CPS wick
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OPERATING PRINCIPLES OF
LHP
Heat applied into evaporator
liquid is vaporized and the menisci formed at the liquid/vapor interface in the
evaporator wick develop capillary forces to push the vapor through the vapor
line to the condenser
Vapor condenses in the condenser
the capillary forces continue to push liquid back to the evaporator
The waste heat from the heat source provides the driving force for the
circulation of the working fluid and no external pumping power is required
The two-phase compensation chamber stores excess liquid and controls the
operating temperature of the loop
In order for the loop to continue to function, the wick in the evaporator must
develop a capillary pressure to overcome the total pressure drop in the loop.
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CONDITIONS OF
OPERATION
Total pressure drop =frictional pressure of(evaporator
Total pressure drop =frictional pressure of(evaporator
grooves +vapor line +condenser +the liquid line
evaporator wick) +any static pressure drop due to
gravity
Capillary pressure rise= 2σ cos α /R
σ is the surface tension of the working fluid,
R is the radius of curvature of the meniscus in the wick,
α is the contact angle between the liquid and the wick
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LHP DESIGN
the LHP consists of sealed tubes (liquid line and evaporator line) connecting an
evaporator (heat source) with a condenser (heat sink)
The evaporator consists of a top cap, coherent porous silicon wick (CPS) and the
compensation chamber which acts as a reservoir for the working fluid.
The CPS wick as shown is an array of micron-range silicon dioxide capillaries
micro machined using KOH through ordinary (100) electronic quality silicon
wafers.
main concerns in LHP is heat leak from the vapor side to the liquid side
Ideally the pump core is always fully primed with liquid and the only heat leak is
through the wick material
presence of two phases can arise in the core section due to heat leak.
extra volume is provided in the form of a reservoir
Major components of the evaporator package like top cap, CPS wick and
compensation chamber gets heated up before the water in the wick due to their
thermal capacitance.
The CPS wick as shown an array of micron-range silicon dioxide capillaries
10/12/09 11:25 PM 13
TYPES OF LHPS
0TH generation LHP
top-cap CPS wick and the bottom
reservoir were epoxied together
condenser was not designed
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2ND generation LHP
To avoid the thermal mismatch between the top-cap and the
compensation chamber, the top-cap was machined in Pyrex glass
A condenser was built but was never tested as it was leaking
significantly to make any calorimetric measurements.
Without insulation around the evaporator package the heat lost to
convection dominated the heat transfer
3RD generation LHP
out-gassing of the Lexan® used for the evaporator package. Thus
it was decided to use a thick piece of borosilicate 7740 (Pyrex®)
as of the back plate.
4TH generation LHP
A new compensation chamber was designed to use gravity to feed
the liquid back to the primary wick through the secondary wick.
condenser which was capable to perform calorimetric calculations
was built in this generation device
dual core condenser was designed and developed
10/12/09 11:25 PM 15
LIMITATIONS OF LOOP HEAT
PIPES
The capillary limit for a silicon wick is the pressure that will break the
interface and force the interface to leave the wick. So one bad or large
pore in the wick will dominate the capillary pressure effect and will be
responsible for the vapor-liquid interface to burst through
The sonic limit is the maximum allowable mass flow rate or heat transfer
that could choke the loop heat pipes. The vapor flow rate will choke, when
the vapor reaches the sonic speed. This could happen if the duct cross-
sectional area decreases while the working fluid is flowing in the pipe.
The entrainment limit is the maximum allowable mass flow rate or heat
transfer rate that can be used before causing the evaporator to dry out. In
general, this could happen in a conventional heat pipe when the vapor
shear is able to carry water droplets from the liquid stream flowing back to
the condenser. This will cause less flow to go to the evaporator and dry out
the evaporator.
Superheated liquid limit -Underneath the vapor-liquid interface a
superheated liquid exists, since the interface is separates a high-pressure
vapor and a low-pressure liquid with heat transfer across the interface.
Most interfacial studies support the assumption of no temperature jump
across the interface. Assuming no temperature jump across the interface,
one can deduct that the liquid underneath the interface has to be
superheated liquid and the evaporation process is a non-equilibrium one.
10/12/09 11:25 PM 16
APPLICATIONS
LOOP HEAT PIPES FOR AVIONICS
Aircraft thermal control applications
Acturator-mounted electronics cooling
Wing and cowl anti-icing using engine waste heat
Avionics Cooling
10/12/09 11:25 PM 18
REFERENCES
http://www.thermacore.com/Technologies/loop-heat-pipes.aspx
http://www.1-act.com/lhptech.html
http://www.nlr.nl/smartsite.dws?id=3029
http://altmine.mie.uc.edu/fgerner/public_html/lhp5.pdf
http://www.patentstorm.us/patents/pdfs/patent_id/6892799.html
http://www.patentstorm.us/patents/7347250/fulltext.html
http://altmine.mie.uc.edu/fgerner/public_html/lhp2.pdf
http://encyclopedia.thefreedictionary.com/Loop+Heat+Pipe
http://www2.tku.edu.tw/~tkjse/8-2/8-2-5.pdf
http://etd.ohiolink.edu/send-pdf.cgi/HAMDAN%20MOHAMMAD%20OMAR.pdf?
acc_num=ucin1049987207
http://etd.ohiolink.edu/send-pdf.cgi/SHARMA%20MONIKA.pdf?acc_num=ucin1132344889
http://etd.ohiolink.edu/send-pdf.cgi/Medis%20Praveen%20S.pdf?acc_num=ucin1131996727
http://etd.ohiolink.edu/send-pdf.cgi/Suh%20Junwoo.pdf?acc_num=ucin1131033062
http://etd.ohiolink.edu/send-pdf.cgi/Shuja%20Ahmed%20A.pdf?acc_num=ucin1179501051
http://www2.dem.inpe.br/rriehl/lhp.htm
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QUESTIONS ???
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THANK YOU !!
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