PCB Design Checklist:

1. Board Size is according to the required dimensions.

2. While routing, make sure that a star connection exists for power tracks.
3. De-coupling capacitors (100n) should be kept as close as possible to the pin.
4. Footprints of SMD components should be verified (ICs etc).
5. Polarity Markings for polarized capacitors should be present.
a. In case of Tantulum, make sure that the capacitor Line marking is correct (Line
represents +ve)
6. Diodes markings should be correct (Cut represents -ve)
a. Synchronize it with the schematic and verify the pin numbers.
7. Enough keep-out area for the power section.
8. Make sure that there are no ground loops present.
a. Run a copper continuity check and make sure that No Errors appear.
9. Stitch the ground (Copper Area) thoroughly.
10. Power Tracks carrying high current should be kept THICK (at-least 30mils).
a. Power Tracks should be routed first.
11. Proper silkscreen labeling of all the connectors should be done.
a. ICs Pin number 1 should be clearly marked.
b. PCB Number as well as Revision should be mentioned with date and company logo.
12. Analog Ground and Digital ground should be combined at one point only (Via jumper or 0R
resistor) close to the input power section.
a. Make sure that copper area (Digital ground) does not come in the vicinity of the Analog
ground section.
13. After the routing is done, run a DRC Error check so that any routing errors that appear can be
resolved.
14. Also make sure that there is no track left un-routed.
a. Click on view-spread sheet--- > Statistics--- > % routed =100% --- >% un-routed=0%
15. Following layers should be created for two layer board design
a. Copper-Top/Bottom
b. Silkscreen-Top
c. Solder-mask-Top/Bottom
d. Solder-paste-Top (Depending on SMD components placement)
e. Drill Layer
16. Use standard package for resistors (0805) and ceramic capacitors (0603).