Part Number System Change Notice

Effective from September 1, 2007, a more concise part numbering system is utilized by
Hynix with the intention of managing product line with more consistency.
Devices developed after August 2007 and their respective products will be Refer to
the following pages for more details. (www.hynix.com/pn_notice.jsp)
Part Number with prefix HY -> Old Part Number Decoder Link
Part Number with prefix H -> New Part Number Decoder Link
H Part Number Last Updated: Aug. 2007
H 5 X X XX X X X X X - XX X
HYNIX MEMORY
PRODUCT FAMILY
POWER SUPPLY
DENSITY & REFRESH
ORGANI ZATI ON
NUMBER OF BANKS
OPERATING TEMPERATURE
& POWER CONSUMPTION
SPEED
PACKAGE MATERIAL
DIE GENERATION
: VDD =3.3V & VDDQ = 3.3V
: VDD =3.3V & VDDQ = 2.5V
: VDD =3.0V & VDDQ = 3.0V
: VDD =2.5V & VDDQ = 2.5V
: VDD =2.5V & VDDQ = 1.8V
: VDD =1.8V & VDDQ = 1.8V
: VDD =1.5V & VDDQ = 1.5V
: VDD =1.2V & VDDQ = 1.2V
5 : DRAM
V
A
Y
U
W
S
Q
R
: 16M / 4K REF / 64ms
: 32M / 4K REF / 64ms
: 64M / 4K REF / 64ms
: 128M / 4K REF / 64ms
: 256M / 8K REF / 64ms
: 256M / 4K REF / 64ms
: 256M / 4K REF / 32ms
: 512M / 8K REF / 64ms
: 512M / 8K REF / 32ms
: 512M / 4K REF / 64ms
: 1G / 8K REF / 64ms
: 1G / 8K REF / 32ms
: 2G / 8K REF / 64ms
: 4G / 8K REF / 64ms
16
32
64
12
25
26
27
51
52
53
1G
1H
2G
4G
6
2
A
: x16
: x32
: x64
: 2 Banks
: 4 Banks
: 8 Banks
: 16 Banks
: 32 Banks
C : Commercial Temp
1)
& Normal Power
E : Extended Temp
2)
& Normal Power
I : Industrial Temp
3)
& Normal Power
L : Commercial Temp
1)
& Low Power
G : Extended Temp
2)
& Low Power
J : Industrial Temp
3)
& Low Power

L : Leaded
P : Lead free (ROHS
4)
Compliant)
R : Lead & Halogen free
(ROHS
4)
Compliant)
D : 5th
E : 6th
F : 7th
G : 8th
M : 1st
A : 2nd
B : 3rd
C : 4th
PACKAGE TYPE
T
F
M
H
J
: TSOP II
: FBGA (Wire Bond)
: FBGA / DDP (Dual Die Package)
: FBGA / QDP (Quad Die Package)
: FBGA (Flip Chip)
1
2
3
4
5
60 : 166Mhz
55 : 183Mhz
50 : 200Mhz
43 : 233Mhz
40 : 250Mhz
36 : 275Mhz
33 : 300Mhz
28 : 350Mhz
26 : 385Mhz
25 : 400Mhz
22 : 450Mhz
20 : 500Mhz
18 : 550Mhz
16 : 600Mhz
14 : 700Mhz
12 : 800Mhz
11 : 900Mhz
N0 : 1.0Ghz
N1 : 1.1Ghz
N2 : 1.2Ghz
N3 : 1.3Ghz
N4 : 1.4Ghz
N5 : 1.6Ghz
PRODUCT MODE
D
P
T
R
F
G
: DDR SDRAM
: DDR2 SDRAM
: DDR3 SDRAM
: GDDR3 SDRAM
: GDDR4 SDRAM
: GDDR5 SDRAM
GRAPHICS MEMORY PART NUMBERING GRAPHICS MEMORY PART NUMBERING GRAPHICS MEMORY PART NUMBERING GRAPHICS MEMORY PART NUMBERING
1 2 3 4 5 6 7 8 9 10 11 12 13 14
Note.
1) Commercial Temperature: 0C ~85C
2) Extended Temperature: -25C ~85C
3) Industrial Temperature: -40C ~85C
4) ROHS : Restriction Of Hazardous Substances
HY Part Number Last Updated: Dec. 2006
HY XX X XX XX X X X X X X - XX X
HYNIX MEMORY
PRODUCT FAMILY
PROCESS & POWER SUPPLY
DENSITY & REFRESH
ORGANIZATION
# of BANK
INTERFACE
TEMPERATURE
SPEED
PACKAGE MATERIAL
POWER CONSUMPTI ON
DI E GENERATI ON
: VDD=3.3V & VDDQ=2.5V
: VDD=2.5V & VDDQ=2.5V
: VDD=2.5V & VDDQ=1.8V
: VDD=1.8V & VDDQ=1.8V
: VDD=1.5V & VDDQ=1.5V
5D
5P
5R
5F
: DDR SDRAM
: DDR2 SDRAM
: GDDR3 SDRAM
: GDDR4 SDRAM
V
U
W
S
C
: 32M 4K Refresh/32ms
: 64M 4K Refresh/64ms
: 128M 4K Refresh/32ms
: 256M 8K Refresh/64ms
: 256M 4K Refresh/32ms
: 512M 4K Refresh/32ms
: 512M 8K Refresh/32ms
: 1G 8K Refresh/64ms
: 2G 8K Refresh/64ms
32
64
28
56
57
11
12
1G
2G
16
32
: x16
: x32
: 2Banks
: 4Banks
: 8Banks
1
2
3
1
2
3
4
5
6
: SSTL_18
: SSTL_2
: Reserved
: Reserved
: POD_18
: POD_15
Blank
E
I
: Commercial (0~70)
: Extended (-25~85)
: Industrial (-40~85)
07
077
08
09
1
11
12
14
16
18
2
22
25
28
33
36
4
5
6
: 1.4GHz
: 1.3GHz
: 1.2GHz
: 1.1GHz
: 1.0GHz
: 900MHz
: 800MHz
: 700MhZ
: 600MHz
: 550MHz
: 500MHz
: 450MHz
: 400MHz
: 350MHz
: 300MHz
: 275MHz
: 250MHz
: 200MHz
: 166MHz
: Normal
: Lead free(ROHS* Compliant)
: Lead & Halogen free
(ROHS* Compliant)
BLANK
P
R
: Normal
: Low Power
BLANK
L
: 1st Gen.
: 2nd Gen.
: 3rd Gen.
: 4th Gen.
: 5th Gen.
BLANK
A
B
C
D
* ROHS : Restriction Of Hazardous Substances
** All GRAPHICS MEMORYs follow above Part Numbering System
GRAPHICS MEMORY PART NUMBERING GRAPHICS MEMORY PART NUMBERING GRAPHICS MEMORY PART NUMBERING GRAPHICS MEMORY PART NUMBERING
PACKAGE TYPE
T
Q
F
FS
FM
FC
: TSOP II
: LQFP
: FBGA (Wire Bond)
: FBGA(Smaller PKG Dimension)
: DDP FBGA
: FBGA (Flip Chip)