A Guide to Failure Analysis

Eric L. Minson

Topical Guide

Failure Isolation
Probing Map
Multi-meter
Probing Station
o Setup

1-2
1
1
2
2

Cross Section
Sample Preparation
o Packaged DIE
o Wafer
Polishing Wheel
o Lapping Paper
o Polishing Cloth (Brown and Red)
o Polishing Solution
o Time

3-7
3
3
3
7
6
6
6
6

Scanning Electron Microscope

Procedure
Sample Preparation
Sample Inspection/ Pictures
Wet Etch
De-capsulation
o Sample Preparation
o Acid Etchants
De-process
o Acid Etchants
o Steps
X-RAY
Procedures

8
8
9
10-11
10
10
10
11-12
11-12
13
13

Failure Isolation
Failure isolation is a technique used in failure analyis to find failed locations within a
wafer or package. This technique helps engineers and technicians with their projects by
helping them determine which techiniques to use and provides them an exact location
to concentrate on. The first thing that is done with failure isolation is to print off an
isolation map. The isolation map shows which pads on a die or printed circuit board
(PCB) to probe for a specific area. The Isolation map is nothing more than a map of a
wafer or package. It shows how each location is connected. This connection is similar to
that of a road but it is made up of different metals such as copper, silver, platinum,
titanium and others. These connections are the different pathways that electricity
travels. Each type of wafer, DIE and package has an its own isolation map. For this
reason it is critical to print off the correct map. Once the isolation map has been printed
and examined the next step is to complete the isolation. There are two methods to
complete the failure isolation that will be discussed. The first involves just a regular
multi-meter. This is mainly used for packages attached to a printed circuit board (PCB).
The PCB has small circular cut outs filled with metal that is used for the probing. These
openings are called pads. These pads are attached to metal that runs inside the PCB.
They eventually connect to the package through another opening in the middle of the
PCB. There is solder that is placed on the ends of
these opening and attached to the other side of
the solder is the package. The isolation map will
state which pads to probe and will have a key to
show the exact location the two pads being
probed corrolate too.
The first thing you want to do when probing with a
multi-meter is ensure that the black and red cords
to the probing needles are connected to the
correct connector locations on the multimeter. If
they are not in the proper connectors you will
obtain inproper measurements which will lead to
false results. When the connectors are on
correctly turn the knop on the multi-meter to
power it on. You need to turn the knob to the
resistance measurement setting. This settings wil
be caculated in Ohms and will show the Ohm
symbal () for the resistance setting. Now, all
that is left to do is use the probing needles and
probe the pads following the isolation map.
Fluke Multi-Meter
Resistance Setting
Probing Needles

Probing Cord
Connection

The second method of failure isolation involves using a piece of equipment known as a
Probing Station. A probing Station is used when the samples are small and probing is
done on a microscopic level. Probing stations are used mostly for wafers. Wafers also
have a probing map that shows which pads to probe and a key to show the location.
The pads on a wafer do the exact same thing as a PCB pad. However, they are smaller
and need a smaller probing needle. This requires a probing station. A Probing Station is
a microscope with small probing needles on the sides. The microscope is used to view
the wafer and the pads on the wafer. On the side of the microscope there are probing
needles that are attached to a holder. This holder controls the up and down (y)
movement and the left and right (x) movement. Normally, there are three to four of
these on each probing station. This allows probing multiple things at once. However, for
the type of probing we are discussing we only need to use two (one on each side). The
first thing in setting up the probing station is to attach cords from the probing needle
holder to the multi-meter. This requires two chords (black and red). It connects the
same way as the stated in the previous page. Once the cords are attached properly its
time to put the sample under the microscope. Then we need to look at the isolation map
and determine the placement of the two probing needles. Once placement is
determined we use the x and y control on the needle holder to put the probing needles
into place. You will know the needles are in place by looking through the microscope,
the needles will curve up once they have touched the pad. The next step is to look at
the multi-meter and record the measurement. The multi-meter settings are the same as
discussed in the previous page. When you are through recording the settings move the
probing needles to the next pads based on the isolation map.
X Control
Y Control

Probing
Needle
Holder
Black cord
connects
the probing
needle
holder to
the multimeter
Probing Station
Probing Needles
Microscope

Sample Placement
Needles

Red cord
connects
the probing
needle
holder to
the multimeter

Cross Section
Cross section is another valuable tool for failure analysis work. Cross sectioning is when
sample (wafer or packaged) is cut horizontally so you can see the inside. This technique
is crucial because it allows you to find cracks, delamination and other artifacts that
cause and integrated circuit (IC) to fail. Normally, probing comes first. By probing the
sample you will find the location to where the cross section needs to occur. To perform
a cross section you need the following:

Polishing wheel (Multi-prep tool)

Sample holder
Stud
Lapping paper
3 disks (blank, brown cloth, red cloth)
Epoxy
Wax
Hotplate
Oven
Glass slip
Diamond saw
Needle nose plyers
Beaker of water
X-ray (Optional- helps with tracking location)

The first thing you will need to do is put epoxy on the sample. The epoxy is always in
the freezer for preservation. Pull the epoxy out of the freezer wait ten minutes for it to
thaw. While waiting for the epoxy to thaw turn the oven on and set the temperature to
150 Celsius. Once it has thawed place a small portion on you sample. If you are
working with a wafer place a majority over the targeted location. Place the sample on
the hotplate at 150 Celsius until the epoxy becomes liquefied. Now that the epoxy is
liquefied place a glass slip (small and thin piece of glass) on top. Lay the sample in the
oven and let sit for 30 minutes. This allows for the epoxy to cure. If you are working with
a package mounted to a PCB, place epoxy on the side of the package that is closest to
the failed location. Place the sample on the hotplate at 150 Celsius until the epoxy
becomes liquefied. When the epoxy is liquefied use needle nose plyers to turn the
sample sideways so that the epoxy flows between the package and the PCB. Solder
balls are also located in this area. The reason you want to have epoxy in this location is
because it fortifies the sample and the solder joints. It also prevents unwanted damage
during the cross section.

When the epoxy has cured remove the sample from the oven. Place the metal stud on
the hotplate. Let it heat for a 3 minutes to heat the metal. While the metal stud is heating
take the sample to the diamond saw. If the sample is a wafer cut the sample so that you
are close to the targeted location but not to close that you cause unwanted damage. If
your sample is a packaged attached to the PCB cut on the side closest to the targeted
location. Cut the PCB next to the package. Only cut the PCB and not the package. Now
that your sample is cut, it is now ready to mount on the metal stud. The metal stud
should be heated. The next step is to put wax on top of the metal stud. With the stud
heated the wax should melt onto the stud. Place the sample on the waxed stud with the
targeted area sticking out or hanging over the front edge. The wax is an adhesive and
will not permit the part from falling off. When the sample is mounted, pick up the stud
with needle nose plyers and place in a beaker of water. This allows the sample and the
wax to cool. When the wax cools it will harden and cause the sample and the stud to
become adhered together.

Glass Slips

Epoxy

Wax

Hot plate

Metal Stud
Diamond Saw

Now that the sample is mounted on the stud we can

begin the actual cross section. The first thing we need
to do is attach the stud with the sample to the top of the
sample holder. This is done with a mounting screw.
You slide the stud into position and tighten up the
screw. The next step is to adjust the plastic screws at
the bottom of the sample holder. This is done to
prevent one side becoming tilted more than the other. It
also ensures that both sides will cut at the same rate
and they will be even. To adjust screws properly places
the sample next to a black piece of metal called an
alignment bar. Adjust the screw so that the sample at
top aligns with the alignment bar.

Alignment bar

Sample
holder

Alignment
Screws

The next phase is to cut the sample. This is done in with the polishing wheel. The
polishing will spins both directions. The cross section can be done with the wheel
spinning either direction. This is a preference setting. Next, the blank disk is either
attached or it is not attached. To attach the blank disk line up the two small plastic
knops with the circular engravings at the bottom of the disk. Once attached turn on the
machine, then turn on the water by pressing the water button. Let a small amount of
water spray onto the disk. Once small amounts of water is on the disk turn the water off
and choose the lapping paper. Lapping paper is chosen by how far the target location is
from the edge. I prefer using fifteen micron lapping paper when I begin the cross
section. Lapping paper is similar to sand paper, but on a microscopic level. The micron
of the paper refers to the size of the grit. The lapping paper needs to be changed as you
draw closer to the target. To attach the lapping papers to the wheel, place it on the
blank disk with the water. Use a squeegee (rubber rectangular piece) and wipe it over
the lapping paper forcing the water out to the side. Once the bubbles are removed the
lapping paper is adhered to the disk. Now, place the sample holder on the wheel
holding it so that he sample is parallel to the direction the wheel is spinning. Turn on the
water so that he lapping paper has a constant wetness. The RPM will need to be
adjusted based on the grit of the lapping paper. The sample needs to be checked
frequently (no more than 90 seconds on the
wheel). To check the sample, remove the stud
from the sample holder and place under
microscope. This is done to visual see the
location of the cross section as compared to the
target location. Based on location will determine
if you will change the lapping paper to a lower
grit and RPM or continue with the same. Another
reason is to see the tilt of the sample so you can
adjust the sample holder. The following page has
information about lapping paper grit to RPM. It
also has information about when to change
Sample holder parallel to the
lapping paper.
direction the wheel is spinning/
sample holder is on a blank disk

Lapping Paper Grinding

Lapping Paper Grit (Micron
Radius Per Minute
m)
(RPM)
30 m
175
15 m
150
9 m
175
6 m
175
3 m
175
1 m
175
.05 m
175
The rule for when to change
lapping paper is called the 3x
rule. This means that you
multiply the lapping paper grit
you are currently using by 3.
Whatever number you get
from this multiplication is the
distance in microns from the
current cut location to the
center of targeted location that
you will stop and change to a
finer lapping paper. The
picture to the right is an
example.

When the grinding with the lapping paper is complete it is time to for a fine polish. The
fine polish is completed to smooth out all the materials so that there is no scratched on
the surface. To complete the fine polish use the table below.
Fine Polish
Cloth RPM
Solution
1 m
Brown 75
Alumina
Suspension
.05 m
Brown 75
Alumina
Suspension
RED

75

.05 m
Colloidal
Silica

Time
3 minutes
Brown Cloth

Red Cloth

3 minutes
45
seconds
1 m Alumina
Suspension
.05 m Alumina
Suspension

.05 m
Colloidal Silica

Allied Multi-prep tool/ polishing wheel

Wheel
direction

Water

Starts wheel
rotation
Pauses wheel
rotation

Powers on
machine
Increases and
Decreases
RPM Speed

Scanning Electron Microscope

A Scanning Electron Microscope (SEM) is an extremely high powered microscope. A
(SEM) works by sending an electron beam over a sample. It then interacts with the
electrons on the sample which in return creates an image on the screen. A (SEM) is
used to capture images of small areas that a regular microscope is incapable of
viewing. This is an excellent piece of equipment to capture small defects in an
integrated circuit.

Hitachi SEM Software

Hitachi SEM

To use an (SEM) we must first use whats called a gold coat machine. This machine is
used to place a thin layer of gold on the sample. This is necessary because the (SEM)
electron beam interacts with the gold on the sample which creates the image. Once the
sample is coated with gold we need to place the sample inside the SEM. To do this we
attach the sample stud with the sample onto a special holder that goes inside the
(SEM). To put this holder inside the (SEM) we must open the door.
To open the door, press the air button. This releases the pressure. After a minute a red
light will turn on and then a beeping sound will ensue. You can now open the door.
Attach the sample to the rod and close the door. Press the Evac button which turns on
the air pump to vacuums out the air. Once you hear another beep press the Open
button. This opens the door to the chamber (Inner SEM). Push the rod with the sample
on it into the chamber. The holder will slide into place. Once the holder is in place, slide
the rod out and press the Close button to shut the door to the chamber. Once the door
closes its time to turn on the SEM. To do this we will use the software on the computer.

Home

On

Capture

Save

Image will
display
here

Hitachi SEM Software

To turn on the (SEM) press the ON button on the screen with the mouse. Also press the
HOME button which moved the sample inside the SEM to align it with the beam. Once
the (SEM) is on a picture of the sample will show up on the screen. Once the image has
shown up on the screen left click with the mouse on the screen and drag up, down, right
and left to navigate to the area on the sample you want to look at. To save the image,
press the CAPTURE button. This will capture the image and it will display at bottom.
Click the Save button, this will open up the folder window. Navigate where you want to
save the picture and save it.

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Wet Etch
Wet etch is used to remove the outer layer of an integrated circuit also known as a
package. One method to remove package is known as a de-capsulation. This is the
process of only removing part of the package that is directly over the integrated circuit
so that the integrated circuit is exposed. Another method is known as de-process. In this
method the entire package is removed to expose the entire integrated circuit. Both
these methods are used depending on the type of defect you are looking for.
To perform a de-capsulation we need the following:
A fume hood
98% fuming nitric acid
Acetone
Tweezers
An eye dropper
Gloves
Scribe
Low powered microscope
X-RAY
A hot plate set at 250C
To perform this task we are first going to take an X-ray picture of the package. The Xray picture will show the location of the integrated circuit (IC) inside the package. Once
we establish where the (IC) is located we need to use the scribe and carve the top of
the package so it aligns with the (IC). To do this we will use the scribe and the
microscope. Under the microscope place the sample and hold it either with fingers or
tweezers. Use the scribe and start cutting into the top of the package around the area
where the (IC) is located underneath. Go deep enough to create a small crevice any
farther than that you create a risk of hitting the (IC). This crevice is to drop acid into. We
will use acid to dig deeper into the package and expose the (IC).
Now that the Crevice is created we need to put gloves on to protect us from the acid.
Go into the acid room where the fume hood is located. Make sure the hot plate under
the fume hood is set at 250C. Take an eye dropper and fill it with 98% fuming Nitric
Acid. Place the Acetone bottle in the same fume hood. Place the sample on the hot
plate. Let it sit to heat it up. Once the sample is heated, place a drop of Nitric Acid in the
crevice that you created. Hold the sample on the hot plate with metal tweezers. Wait a
few seconds and the acid will start to bubble. Pull it off of the hot plate and place over
the sink in the fume hood and spray acetone on it to wash the acid off. Then blow it with
air to dry the sample. Repeat this process until the (IC) is exposed. Once this is
complete the sample is ready to inspect under a microscope.

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The second method of wet etching is de-process. This will involve 3 steps but first the
materials we will need:
Gloves
Hot plate set at 300C
40 ml glass Beaker
250 ml glass Beaker
Graduated Cylinder
Stirring rod
Tweezers
70% fuming Nitric Acid
Hydrochloric Acid
Hydrofluoric Acid
50% fuming Sulfuric Acid
Fume hood
tongues
H20

STEP 1
4 Parts.H20
3 Parts.70% fuming Nitric Acid
1 Parts.Hydrochloric Acid
While using acids always wear protective gear such as gloves. Measure in a beaker 40
ml of H20. Pour into a 250 ml beaker. Then, measure 30 ml of the 70% Nitric Acid with
the graduated cylinder. Pour into the beaker with the H20. Last measure 10 ml of
Hydrochloric Acid with the graduated cylinder and mix with the H20 and Nitric Acid. Stir
together using the stirring rod. Once the acid solution is properly stirred, place the
sample into the sample into the solution and let it sit in it for 15 minutes. This is done to
remove solder. After 15 minutes take the part out of the solution with tweezers and rinse
with water.

Step 2
In a beaker pour 70% Nitric Acid and in another beaker pour Hydrofluoric Acid. Use
extreme caution when using Hydrofluoric Acid.
Use the tweezers to dip the sample into the Nitric Acid. Count 3 seconds and then
immediately dip into Hydrofluoric Acid and count 3 seconds. Repeat this 3 times. Rinse
with water, after repeating this 3 times.
This removes what is call a seed layer or also known as a Ti layer. This is a thin layer of
metal.

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Step 3
1 Parts. 98% fuming Nitric Acid
1 Parts. 50% fuming Sulfuric Acid
Measure 20 ml of 98% fuming Nitric Acid with the graduated cylinder and pour into 40
ml beaker. Then measure 50% fuming Sulfuric Acid with the graduate cylinder and mix
with the Nitric Acid in a beaker. Place the beaker on the hot plate set at 300C. Let it sit
for 30 seconds to heat up. After 30 second is up drop the sample into the acid solution.
Leave the beaker on the hot plate. Waite 20 seconds and remove beaker of the hot
plate using tongues and drain the acid into the sink. Rinse the beaker with the sample
inside with water. Drain the water and remove the sample with tweezers. Dry the
sample using air. The sample is ready for inspection under the microscope.
This step is done to remove PBO. PBO is a plastic like material on the (IC) that helps
protect it.

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