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4

SAMSUNG PROPRIETARY

Table of Contents

THIS DOCUMENT CONTAINS CONFIDENTIAL


PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

DRESDEN-INT
PCB Thinckness:1.1mm

p.
s
om

//
m

Model Name : DRESDEN-INT


PBA Name
: MAIN
PCB Code
: BA41-01024A (GCE)
BA41-01025A (NY)
BA41-01026A (HST)
Dev. Step : MP(PR)
Revision
: 1.00
T.R. Date : 2008.12.24

yc

DRAW
-

ht

tp
:

CHECK

APPROVAL

COVER
OPERATION BLOCK DIAGRAM
POWER DIAGRAM
DIAGRAM
POWER SEQUENCE
TIMING DIAGRAM,POWER ON
CLOCK DISTRIBUTION
BOARD INFORMATION
BLOCKS
CLOCK GEN.
THERMAL SENSOR&FAN CONTROL
S1g2 CPU
RS780MN
SODIMM DDR2
SB700
HW STRAP
SPI ROM (BIOS)
HDMI REPEATER
LVDS (LCD CONNECTOR)
CRT CONNECTOR
EXPRESS CARD
MEMORY CARD (2 IN 1)
WLAN
HD AUDIO (MIC / SPK / HP)
HDD / ODD
MICOM
LOM(88E8057)
CAMERA, MDC CONN. & BLUETOOTH
LEDS & TOUCHPAD
SUB, DEBUG & KEYBOARD CONN.
CHARGER
P3.3V_AUX / P5.0V_AUX / P12V_ALW
CS POWER(P1.2V / VCC_NB)
CS POWER(P2.5V,P1.5V,P1.1V,P1.2V_AUX)
DDR2 POWER
CPU VRM
SWITCHED POWER (5.0V, 3.3V, 1.8V)
POWER DISCHARGER
EMC
MOUNT HOLE & ICT
TP PAGE
SUB BOARD
INDEX PAGE

u/
x/

CPU
:AMD GRIFFIN
Chip Set :AMD RS780MN + SB700
Remarks :AMD PUMA Platform w/ IGP
2 SODIMMs DDR2

Page. 1
Page. 2
Page. 3
Page. 4
Page. 5
Page. 6
Page. 7
Page. 8~9
Page. 10
Page. 11
Page. 12~14
Page. 15~17
Page. 18~20
Page. 21~24
Page. 25
Page. 26
Page. 27
Page. 28
Page. 29
Page. 30
Page. 31
Page. 32
Page. 33~36
Page. 37
Page. 38
Page. 39
Page. 40
Page. 41
Page. 42
Page. 43
Page. 44
Page. 45
Page. 46
Page. 47
Page. 48
Page. 49
Page. 50
Page. 51
Page. 52
Page. 53
Page. 54~55
Page. 56

A
DATE

DRAW

HS CHO

11/26/2007

SAMSUNG

DRESDEN-INT

DEV. STEP

CHECK

HS LEE / BM LEE
APPROVAL

MP(PR)
REV

YB CHUN
MODULE CODE

TITLE

1.00

ELECTRONICS

COVER
PART NO.

CONTENTS

BA41-01024~6A

LAST EDIT

December 24, 2008 14:36:53 PM

4
COM-22C-015(1996.6.5) REV. 3

PAGE

OF

49

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN

SRP Sheet Number: 1 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

OPERATION BLOCK DIAGRAM


SODIMM0
MAX 2 GB

PG 43

CPU_CORE0/1
CPU_VDD_NB
AMD PN!

PG 43

PG 48

CPU VR

AUX PWR
VR

CHIPSET
VR
PG 45/46

Mobile Processor

PG 11

EMC2012
PG 11

DDR II Power
PG 47
Channel B (Reverse)

DDR II 800

SODIMM1
MAX 2 GB

636pin

PG 19

L2 Cache : 2M/1M/512K

g
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a
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S fid
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C
PG 12~14

CRT

HyperTransport Gen3

u/
x/

PG 29

Clock Gen.

CRT

TFT_LCD
14.1" WIDE

North Bridge

PG 54,55
PG 36

AUDIO CODEC
ALC272

HD0

Internal MIC

PG 34

PG 34

SATA1

CABLE

PG 40

2P

PG 21

SATA

ODD

PG 39

WLAN
802.11abg

PG 39

PG 32

EXPRESS CARD

PCI-E x1 Lane1

USB2.0

USB PORT 4

EXPRESS CARD
INSERT
THIS SIDE UP
34mm

SB700

PG 30

528 BGA

HD1

HDD

USB PORT 10

PG 21~25

SATA0

ht

RTC
Batt.

//
m

12P

RJ11

L
R

SPEAKER

Audio AMP
TPA6017A2

PCI-E X1 Lane0

PCI Express x4
(A-LINK GEN2)

South Bridge

PG 33

LANTransformer

PG 39

tp
:

JACK

EXTERNAL MIC

yc

PG 15~17

LOM

GbE
Marvell
88E8057

PCI-E x1 Lane2

om

528 FCBGA

SUB BOARD

PG 35

RS780MN

PG 27

HDMI

HEADPHONE

HDMI

p.
s

HDMI
Repeater

PG 28

CK for AMD CPU


PG 10

LCD

1280 X 800

PG 55

Dual channel

AMD Griffin CPU


(S1g2 socket)

CPU
Thermistor

PG 49

PG 44

PG 20

PG 18

Channel A (Reverse)

FAN

Switched
PWR

RJ45

Charging
Circuit

Smart
Battery
Module

Termination

ALCOR
AU6371B51

MultiMedia Crad
2in1 SOCKET

SD / MMC

PG 31

PG 31

USB PORT 6

3.3V LPC, 33MHz

USB PORT 8

USB PORT 5

ANT

USB PORT 0

SPI

USB PORT 2

KBC
H8S - 2110B

SPI EEPROM
MX25L1605A

PG 38

PG 26

USB (UP)
USB (Down)

USB (Right)

WEB CAMERA BLUETOOTH


PG 40

PG 40

80 Port

2.5inch
SATA only

SUB BOARD

PS/2

PG 54,55

PG 14

SYNAPTICS

TOUCHPAD

DRAW

HS CHO

Space bar

LID SWITCH
POWER BUTTON

DATE

CHECK

KEYBOARD

11/26/2007
MP(PR)
REV

APPROVAL

PG 41

YB CHUN
MODULE CODE

SAMSUNG

DRESDEN-INT

DEV. STEP

HS LEE / BM LEE

PG 42

TITLE

1.00

ELECTRONICS

MAIN
PART NO.

BLOCK DIAGRAM

BA41-01024~6A

LAST EDIT

December 24, 2008 14:36:53 PM

4
COM-22C-015(1996.6.5) REV. 3

PAGE

OF

49

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN

SRP Sheet Number: 2 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

POWER DIAGRAM
D

KBC3_PWRON

KBC3_SUSPWR

P5.0V
CAMERA
ICH9M
TOUCHPAD
CRT
FAN
MICOM
HDD

P5.0V_AUX
DDR2 Power VRM
VRMs
USB Ports

VDC

Battery DC
11.1V

P3.3V

RX781
SB700
LAN
GFX
CLOCK
SODIMM
HDD
SPI

SB700
MDC
MINICARD
LOM
THERMAL
EXPCARD

P12.0V_ALW
SWITCHED POWER

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
P3.3V_AUX

u/
x/

AC Adapter
19V

KBC3_VRON /
VCCP3_PWRGD

THERMAL SENSOR
MEMORY CARD
BLUETOOTH
LEDs
LCD/CRT
EXP-CARD
MICOM
AUDIO

p.
s

ALWAYS ON

P1.2V_AUX

RTC Battery
3V
SB700

P0.9V
DDR II-Termination
CPU

P1.8V
RX781
GDDR3
GFX

EGFX_CORE

+V

SUSPWR PWRON

VRON

Full On

ON

ON

ON

S3

ON

ON

OFF

S4

ON

OFF

OFF

S5

ON

OFF

OFF

//
m

NB9M

Rail
+V*Always +V*AUX
State

yc

P3.3V_MICOM
MICOM

P1.8V_AUX
SODIMM (DDR II)
CPU

om

SB700

P5.0V_ALW
VRMs

VDD_CPU_NB
CPU
P1.2V

ht

tp
:

CPU
RX781
SB700

S5 / S4

P1.1V
RX781
GFX

CPU_CORE
CPU

S0

S3

A
DRAW

HS CHO

11/26/2007

SAMSUNG

DRESDEN-INT

DEV. STEP

CHECK

HS LEE / BM LEE

MP(PR)
REV

APPROVAL

YB CHUN
MODULE CODE

TITLE

DATE

1.00

ELECTRONICS

MAIN
PART NO.

POWER DIAGRAM

BA41-01024~6A

LAST EDIT

December 24, 2008 14:36:53 PM

4
COM-22C-015(1996.6.5) REV. 3

PAGE

OF

49

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN

SRP Sheet Number: 3 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

POWER SEQUENCE

Rev. 0.1

3) P12.0V_ALWS
3) P5.0V_ALWS

PRTC

3) P3.3V_MICOM

RST Circuit

g
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S fid
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7) P3.3V_AUX

4) KBC3_RST#

7) P5V_AUX

RES#

5) KBC3_CHKPWRSW#

POWER S/W

6) KBC3_SUSPWR

10ms Delay

9) KBC3_RSMRST*

13) VCCP_PWRGD

10.3) CHP3_SLPS3#

16) VRM3_CPU_PWRGD

110ms Delay

14) KBC3_VRON(NC)

7.1) P5V_AUX
7.2) P1.2V_AUX

P1.2V_AUX

IMVP6
ISL6266

MIC5291
DDR2 POWER

SC486
EGFX_CORE

8) P1.8V_AUX
12.2) P0.9V

12.3) EGFX_CORE

SC471
P1.5V

12.4) P1.5V

SC486
12.1) P5.0V

Switched
Power

12.2) P3.3V
12.5) P1.8V

RSMRST#
SLP_M#
SLP_S3#
SLP_S4#
S4_STATE#
SLP_S5#
VRMPWRGD
PWROK
CLPWROK
SUS_STAT#

SB700

LAN100_SLP

1) CHP3_RTCRST#

RTC
Battery

17) CHP3_CLK_PWRGD

CLOCK
CK505

RTCRST#

CK_PWRGD

CPUPWRGD

CL_RST#
PLTRST#
PCIRST#

18) Clock Running


C

20) CPU1_PWRGDCPU

PWRGOOD

CPU

15) VCC_CORE

RESET#

22) PLT3_RST#

23) CPU1_CPURST#

CPURST#

PWROK
CLPWROK

21) CHP3_CL_RST0#

15) CPU_CORE

CL_RST#
RSTIN#

GMCH
B

Discrete
GFX.

tp
:

7.3) AUX5_PWRGD

EN

ht

TPS51120

//
m

7.1) P3.3V_AUX
P5V_AUX & P3V_AUX

7) P1.05V_CL
7) P1.05V_LAN

PRTC

yc

MICOM

om

19) KBC3_PWRGD

EN

p.
s

10.1/2) CHP3_SLPS5#/S4#

11) KBC3_PWRON

INTVRMEN

7) P1.05V_AUX
7) P1.5V_AUX
7) P1.5V_CL

u/
x/

ALWAYS
POWER

2) VDC

A
DRAW

HS CHO

11/26/2007

SAMSUNG

DRESDEN-INT

DEV. STEP

CHECK

HS LEE / BM LEE

MP(PR)
REV

APPROVAL

YB CHUN
MODULE CODE

TITLE

DATE

1.00

ELECTRONICS

MAIN
PART NO.

POWER SEQUENCE

BA41-01024~6A

LAST EDIT

December 24, 2008 14:36:53 PM

4
COM-22C-015(1996.6.5) REV. 3

PAGE

OF

49

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN

SRP Sheet Number: 4 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

Timing Diagram, Power ON


S5

S3

S3

S5

Rev. 0.1 Phil 2008-04-15

S0

S0

D
VDC
P12.0V_ALW
P5.0V_ALW
P3.3V_MICOM

200ms

KBC3_RST#
KBC3_CHKPWRSW#

g
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a
s
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a
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S fid
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C
P5.0V_AUX

u/
x/

100ms

KBC3_SUSPWRON

Tr 2ms

P3.3V_AUX

Tr 2ms

P1.8V_AUX

Tr 300us

~1.6ms

SUSPWRGD

15.26ms

KBC3_RSMRST#

97.85ms

p.
s

CHP3_SLPS5#

30.5us

CHP3_SLPS4#

61us

CHP3_SLPS3#

3.6ms

KBC3_PWRON

Tr 37us

P3.3V

Tr 48us

om

P5.0V

EGFX_CORE

Tr 86us

P1.8V

Tr 913us

P1.5V

yc

Tr 210us

P1.1V

Tr 985us

P1.05V

Tr 1.1ms

CPU_CORE

VRM3_CPU_PWRGD
CHP3_CLK_PWRGD
KBC3_PWRGD

170us

Tr 372us
170us

300ns

117.5ms

1.038ms

139.8us

tp
:

CPU1_CPUPWRGD

//
m

VCCP_PWRGD

CHP3_CL_RST0#

61us

CHP3_SUSSTAT#
PLT3_RST#

1.182ms

>=1ms

ht

CPU1_CPURST#

>= 1ms

SPI Signals

BIOS Boot

soft strap read

CL0 (MCH-ICH)

MCH soft straps

DMI

BSEL[2:0]

CPU_RST_DONE/ACK

BIOS Boot

Toggling (Valid)

Valid

CHP3_CPUSTP#

CHP3_PCISTP#

0 ~ 1ms

CLK0_HOST_CPU

Toggling (Valid)

CLK0_HOST_GMCH

Toggling (Valid)

A
DRAW

DATE

HS CHO
CHECK

11/26/2007

SAMSUNG

DRESDEN-INT

DEV. STEP

HS LEE / BM LEE
APPROVAL

MP(PR)
REV

YB CHUN
MODULE CODE

TITLE

1.00

ELECTRONICS

MAIN
PART NO.

TIMING DIAGRAM

BA41-01024~6A

LAST EDIT

December 24, 2008 14:36:53 PM

4
COM-22C-015(1996.6.5) REV. 3

PAGE

OF

49

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN

SRP Sheet Number: 5 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

CLOCK DISTRIBUTION

Rev. 0.1

BSEL(2:0)

CLK0_HCLK0 / HCLK0#

266 MHz
CHP3_CLK_PWRGD

PENRYN

CK505

BSEL

CPU
FSB

Main PLL
SSC

667/800 MHz

CLK0_HCLK1 / HCK1#

266 MHz

HPLL
MPLL

333/400 MHz

MCH3_CLKREQ#

CLK1_MCH3GPLL / 3GPLL#

3GPLL

100 MHz

CLK1_PEG / PEG#

X16 PEG

PM45
Cantiga
MCH

333/400 MHz

CLK1_MCLK2/2#

333/400 MHz

CLK1_MCLK3/3#

X4 DMI

CLK1_PCIEICH / ICH#

CHP3_SATACLKREQ#
CLK1_SATA / SATA#

48 MHz

CLK3_USB48

14.318 MHz

CLK3_ICH14

33 MHz

CLK3_PCLKICH

MDC

PCIEPLL

HDA3_AUD_BCLK

SATAPLL

HDA3_HDMI_BCLK

NB9M

SPI3_CLK
17.86 / 31.25 MHz

SPI

HD Audio

HD 24 MHz

USBPLL

ICH9-M

yc

100 MHz

//
m

SEL_LCDCLK#
PCI_STP#

100MHz
/33MHz
SSC

SODIMM B

HDA3_MDC_BCLK

om

100 MHz

CLK1_MCLK1/1#

333/400 MHz

p.
s

CLK1_27M
CLK1_27M_SS

NB9M

SODIMM A

g
n
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u
a
s
i
t
m
n
a
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S fid
n
o
C
100 MHz

48/96MHz
NO SSC

CLK1_MCLK0/0#

u/
x/

CPU_STP#

RTC Clock
32.768 KHz

32.768 KHz
OSC

2801-000111

MIN3_CLKREQ#

MINI CARD (WLAN)

CLK1_MINIPCIE / MINIPCIE#

tp
:

100 MHz

EXP3_CLKREQ#

100 MHz

EXPRESS CARD

CLK1_EXPCARD / EXPCARD#

LOM3_CLKREQ#

ITP_EN

33 MHz

14 MHz
OSC

48 MHz

CLK3_PCLKMICOM

CLK3_FM48

14.318 MHz
2801-004667

25 MHz

LOM

CLK1_PCIELOM / PCIELOM#

ht

100 MHz

MICOM
AU6371

2801-004668

10 MHz

2801-004665
A

12 MHz
2801-004666

DATE

DRAW

HS CHO

CLK3_DBGLPC

11/26/2007

HS LEE / BM LEE

DEBUG PORT

APPROVAL

MP(PR)
REV

YB CHUN
MODULE CODE

SAMSUNG

DRESDEN-INT

DEV. STEP

CHECK

33 MHz

TITLE

1.00

ELECTRONICS

MAIN
CLOCK DISTRIBUTION

COM-22C-015(1996.6.5) REV. 3

BA41-01024~6A

LAST EDIT

December 24, 2008 14:36:53 PM

PART NO.

PAGE

OF

49

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN

SRP Sheet Number: 6 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

BOARD INFORMATION

SCHEMATIC ANNOTATIONS AND BOARD INFORMATION


PCI Devices

Crystal / Oscillator

Devices

IDSEL#

REQ/GNT#

Interrupts

TYPE

FREQUENCY

DEVICE

USAGE

Crystal
Crystal
Crystal
Crystal
Crystal

32.768KHz
10MHz
14.318MHz
12MHz
25MHz

ICH
MICOM
CLOCK-GENERATOR
MEMORY CARD
LAN

Real Time Clock


H8S/2110BV
ICS951461
MEMORY CARD
LAN

P3.3V
P5.0V
P3.3V_AUX
P5V_AUX
PRTC_BAT
P3.3V_MICOM
P5.0V_ALW
P12.0V_ALW

3.3V switched power rail (off in S3-S5)


5.0V switched power rail (off in S3-S5)
3.3V power rail (off in S4-S5)
5.0V power rail (off in S4-S5)
3.0V power rail (ALWAYS ON)
3.3V always on power rail for MICOM
5V power rail (Always On)
12V power rail (Always On)

Address

Hex

Bus

Master
1010 000X
1010 010X
1101 001x

A0h
A4h
D2h

SMBUS Master
Clock, Unused Clock Output Disable

MICOM
BATTERY
EMC2102(Thermal Sensor)

Master
0001 011X
0111 101X

16h
7Ah

SMBUS Master
Thermal Sensor

ASSIGNED TO
SYSTEM PORT A
SYSTEM PORT B
EXPRESS CARD
BLUETOOTH
SYSTEM PORT C
CAMERA
MINIPCI-E (WLAN)
MEMORY CARD

ht

USB PORT Assign

tp
:

Devices
ICH
SODIMM0
SODIMM1
CK-505 (Clock Generator)

PORT NUMBER
0
1
4
5
6
8
9
10

Voltage

VID(6:0)
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0

0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1

0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0

0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0

0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1

0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1

0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1

VID(6:0)

1.5000 V
1.4875 V
1.4750 V
1.4625 V
1.4500 V
1.4375 V
1.4250 V
1.4125 V
1.4000 V
1.3875 V
1.3750 V
1.3625 V
1.3500 V
1.3375 V
1.3250 V
1.3125 V
1.3000 V
1.2875 V
1.2750 V
1.2625 V
1.2500 V
1.2375 V
1.2250 V
1.2125 V
1.2000 V
1.1875 V
1.1750 V
1.1625 V
1.1500 V
1.1375 V
1.1250 V
1.1125 V
1.1000 V
1.0875 V
1.0750 V
1.0625 V
1.0500 V
1.0375 V
1.0250 V
1.0125 V

0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1

1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1

0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1

1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0

0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0

0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0

0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0

VID(6:0)

1.0000 V
0.9875 V
0.9750 V
0.9625 V
0.9500 V
0.9375 V
0.9250 V
0.9125 V
0.9000 V
0.8875 V
0.8750 V
0.8625 V
0.8500 V
0.8375 V
0.8250 V
0.8125 V
0.8000 V
0.7875 V
0.7750 V
0.7625 V
0.7500 V
0.7375 V
0.7250 V
0.7125 V
0.7000 V
0.6875 V
0.6750 V
0.6625 V
0.6500 V
0.6375 V
0.6250 V
0.6125 V
0.6000 V
0.5875 V
0.5750 V
0.5625 V
0.5500 V
0.5375 V
0.5250 V
0.5125 V
0.5000 V

1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1

DPRSLPVR 1
DPRSTP*
0
0 or 1
PSI2*

1
0 or 1

Deeper Sleep/Extended Deeper Sleep


Dual Mode Region

Voltage

Deeper Slp

Active
DPRSLPVR 0
DPRSTP*
PSI2*

IMVP-6

Active/Deeper Sleep
Dual Mode Region

Active Mode

I2C / SMB Address

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
CPU Core Voltage Table

p.
s

1.8V power rail for DDR2 (off in S4-S5)


0.9V switched power rail (off in S3-S5)
1.8V power rail for GDDR3 (off in S3-S5)
1.1V power rail for GFX (off in S3-S5)
1.5V power rail for ICH (off in S3-S5)

om

P1.8V_AUX
P0.9V
P1.8V
P1.1V
P1.5V

yc

Primary DC system power supply (7 to 21V)


Core voltage for Processor (1.308~1.068V)
Processor System Bus(PSB) Termination (1.05V)
GMCH & ICH8 Core Voltage

//
m

VDC
VCC_CORE
P1.05V

u/
x/

Voltage Rails

0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1

Voltage
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1

0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1

0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1

0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
1
0
0
1
1
0
0
1
1

1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1

0.4875 V
0.4750 V
0.4625 V
0.4500 V
0.4375 V
0.4250 V
0.4125 V
0.4000 V
0.3875 V
0.3750 V
0.3625 V
0.3500 V
0.3375 V
0.3250 V
0.3125 V
0.3000 V
0.2875 V
0.2750 V
0.2625 V
0.2500 V
0.2375 V
0.2250 V
0.2125 V
0.2000 V
0.1875 V
0.1750 V
0.1625 V
0.1500 V
0.1375 V
0.1250 V
0.1125 V
0.1000 V
0.0875 V
0.0750 V
0.0625 V
0.0500 V
0.0375 V
0.0250 V
0.0125 V
0.0000 V
0.0000 V
0.0000 V
0.0000 V
0.0000 V
0.0000 V
0.0000 V
0.0000 V

*"1111111" : 0V power good asserted.

System Power States


A

CHP3_SLPS1* S1, Powered-On-Suspend(POS) : In this state, all clocks(except the 32.768KHz clock) are stopped.
The system context is maintained in system DRAM. Power is maintained to PCI, the CPU, memory controller, memory, and all other criticial subsystems.
Note that this state does not preclude power being removed from non-essential devices, such as disk drives. During this state, CPU can be selected
for either Deep Sleep or Deeper Sleep.
In Deeper Sleep, CPU voltage reduced in this state to reduce the leakage power.
CHP3_SLPS3* S3, Suspend-To-RAM(STR) : The system context is maintained in system DRAM, but power is shut off to non-critical circuits.
Memory is retained, and refreshes continue. All clocks stop except RTC clock.
CHP3_SLP4S* S4, Suspend-To-Disk(STD) : The Context of the system is maintained on the disk. All power is then shut off to the system except for the logic required to resume.
Externally appears same as S5, but may have different wake events.
CHP3_SLPS5* S5, Soft Off(SOFF) : System context is not maintained. All power is shut off except for the logic required to restart. A full boot is required when waking.

DATE

DRAW

HS CHO
CHECK

11/26/2007

SAMSUNG

DRESDEN-INT

DEV. STEP

HS LEE / BM LEE

MP(PR)
REV

APPROVAL

YB CHUN
MODULE CODE

TITLE

1.00

ELECTRONICS

MAIN
BOARD INFORMATION

COM-22C-015(1996.6.5) REV. 3

BA41-01024~6A

LAST EDIT

December 24, 2008 14:36:53 PM

PART NO.

PAGE

OF

49

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN

SRP Sheet Number: 7 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

p.
s

u/
x/

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

//
m

yc

om

ht

tp
:

A
DRAW

HS CHO
CHECK

11/26/2007

SAMSUNG

DRESDEN-INT

DEV. STEP

HS LEE / BM LEE
APPROVAL

MP(PR)
REV

YB CHUN
MODULE CODE

TITLE

DATE

1.00

ELECTRONICS

MAIN
PART NO.

BLOCKS (1/2)

BA41-01024~6A

LAST EDIT

December 24, 2008 14:36:53 PM

4
COM-22C-015(1996.6.5) REV. 3

PAGE

OF

49

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN

SRP Sheet Number: 8 of 55

SAMSUNG PROPRIETARY

MCD3_SDCD#
MCD3_SDCLK
MCD3_SDCMD
MCD3_SDDATA0
MCD3_SDDATA1
MCD3_SDDATA2
MCD3_SDDATA3
MCD3_SDWP
USB3_P10+
USB3_P10-

THIS DOCUMENT CONTAINS CONFIDENTIAL


PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

MCD3_SDCD#
MCD3_SDCLK
MCD3_SDCMD
MCD3_SDDATA0
MCD3_SDDATA1
MCD3_SDDATA2
MCD3_SDDATA3
MCD3_SDWP
USB3_P10+
USB3_P10-

u/
x/

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
Multi_MV_Au6371

EXP3_CPPE#
EXP3_CPUSB#
EXP3_PERST#
SMB3_CLK
SMB3_DATA
USB3_P4+
USB3_P4-

Graphics_IF_CRT

CLK3_FM48
PLT3_RST#

p.
s

CRT3_BLUE
CRT3_DDCCLK
CRT3_DDCDATA
CRT3_GREEN
CRT3_HSYNC
CRT3_RED
CRT3_VSYNC

CLK3_FM48
PLT3_RST#

CHP3_SLPS3#
CLK1_EXPCARD
CLK1_EXPCARD#
PEX1_EXPCARDTXN1
PEX1_EXPCARDTXP1
PEX3_RST#

EXP3_CLKREQ#
PEX1_EXPCARDRXN1
PEX1_EXPCARDRXP1
PEX3_WAKE#

yc

EXP3_CLKREQ#
CHP3_SLPS3#
CLK1_EXPCARD
PEX1_EXPCARDRXN1
CLK1_EXPCARD#
PEX1_EXPCARDRXP1
PEX1_EXPCARDTXN1
PEX3_WAKE#
PEX1_EXPCARDTXP1
PEX3_RST#

om

CRT3_BLUE
CRT3_DDCCLK
CRT3_DDCDATA
CRT3_GREEN
CRT3_HSYNC
CRT3_RED
CRT3_VSYNC

EXP3_CPPE#
EXP3_CPUSB#
EXP3_PERST#
SMB3_CLK
SMB3_DATA
USB3_P4+
USB3_P4-

CRT5_DDCCLK
CRT5_DDCDATA

CRT5_DDCCLK
CRT5_DDCDATA

KBC3_BKLTON
LCD1_ACLK
LCD1_ACLK#
LCD1_ADATA0
LCD1_ADATA0#
LCD1_ADATA1
LCD1_ADATA1#
LCD1_ADATA2
LCD1_ADATA2#
LCD3_BRIT
LCD3_EDID_CLK
PEG3_BKLTEN
PEG3_LCDVDDON

//
m

CLK1_MINIPCIE
CLK1_MINIPCIE#
KBC3_RFOFF#
PEX1_MINITXN0
PEX1_MINITXP0
PEX3_RST#

CLK1_MINIPCIE
CLK1_MINIPCIE#
KBC3_RFOFF#
PEX1_MINITXN0
PEX1_MINITXP0
PEX3_RST#

MIN3_CLKREQ#
PEX1_MINIRXN0
PEX1_MINIRXP0
PEX3_WAKE#
WLON_LED#

MIN3_CLKREQ#
PEX1_MINIRXN0
PEX1_MINIRXP0
PEX3_WAKE#
WLON_LED#

PCIE_Minicard_Slot

KBC3_BKLTON
LCD1_ACLK
LCD1_ACLK#
LCD1_ADATA0
LCD1_ADATA0#
LCD1_ADATA1
LCD1_ADATA1#
LCD1_ADATA2
LCD1_ADATA2#
LCD3_BRIT
LCD3_EDID_CLK
PEG3_BKLTEN
PEG3_LCDVDDON

ht

tp
:

LCD3_BKLTON
LCD3_EDID_DATA

LCD3_BKLTON
LCD3_EDID_DATA

Express_Card

CHP3_BIOSWP#
SPI3_CLK
SPI3_CS0#
SPI3_MOSI
SPI3_MISO

CHP3_BIOSWP#
SPI3_CLK
SPI3_CS0#
SPI3_MOSI
SPI3_MISO

SPI_BIOS_ROM_16Mbit

LCD_IF_14p1
A

A
DATE

DRAW

HS CHO

11/26/2007

SAMSUNG

DRESDEN-INT

DEV. STEP

CHECK

HS LEE / BM LEE
APPROVAL

MP(PR)
REV

YB CHUN
MODULE CODE

TITLE

1.00

ELECTRONICS

MAIN
PART NO.

BLOCKS (2/2)

BA41-01024~6A

LAST EDIT

December 24, 2008 14:36:53 PM

4
COM-22C-015(1996.6.5) REV. 3

PAGE

OF

49

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN

SRP Sheet Number: 9 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

Clock Gen.

P3.3V

P1.5V

B29
BLM18PG181SN1

B513
BLM18PG181SN1

6.3V
22000nF-X5R

C626

CLK3_PWRGD#

LOM3_CLKREQ#
MIN3_CLKREQ#
EXP3_CLKREQ#

C309
0.022nF
50V

Place 14.318MHz within


500mils of CLOCK GEN.

51

23
45
44
39
38

1
24
46
7
52
43
33
18
10

XTAL_IN
XTAL_OUT

ATIGCLK_0
ATIGCLK_0#
SB_SRC_1
SB_SRC_1#
SB_SRC_0
SB_SRC_0#

SRC_7_27M_SS
SRC_7#_27M

SRC_6_SATA
SRC_6#_SATA#
SRC_4
SRC_4#
SRC_3
SRC_3#

PD#

CLKREQ_0#
CLKREQ_1#
CLKREQ_2#
CLKREQ_3#
CLKREQ_4#

SRC_2
SRC_2#

SRC_1
SRC_1#
SRC_0
SRC_0#

VSS_48M
VSS_ATIG
VSS_CPU
VSS_DOT
VSS_HTT
VSS_SATA
VSS_SB_SRC
VSS_SRC_1
VSS_SRC_0

HTT_0#_66M_1
HTT_0_66M_0
48MHZ_0

REF_0_SEL_HTT66
REF_1_SEL_SATA
REF_2_SEL_27
THERMAL

R613
R616

30
29

R602
R608

SB Link

CLK REQ 1

LOM3_CLKREQ#

LOM

CLK REQ 2

MIN3_CLKREQ#

MINI CARD

CLK REQ 3

EXP3_CLKREQ#

EXP CARD

CLK REQ 4

SB_SRC

10K 1%
10K 1%
0
0

CLK1_NBGFX
CLK1_NBGFX#

R594
R599

10K 1%
10K 1%

nostuff
nostuff

R590
R589

10K 1%
10K 1%

nostuff
nostuff

6
5

R635
R639

10K 1%
10K 1%

nostuff
nostuff

42
41

R596
R591

10K 1%
10K 1%

nostuff
nostuff

9
8

R645
R646

0
0

13
12

R642
R643

0
0

15
14

R637
R638

0
0

20
19

R624
R630

0
0

22
21

R619
R623

0
0

CLK1_SBSRC
CLK1_SBSRC#

CLK1_EXPCARD
CLK1_EXPCARD#

CLK1_MINIPCIE
CLK1_MINIPCIE#

CLK1_PCIELOM
CLK1_PCIELOM#
CLK1_SBLINK
CLK1_SBLINK#

53
54

R609
R614

0
0

64

R633

33 1%

59
58
57
65

R632
R620

33 1%
150
1%

This part is 64pin QFN package.

nostuff
nostuff

37
36

SRC PORT

CLK REQ 0

CLK0_HCLK0
CLK0_HCLK0#

32
31

R618

DEVICE

10K

28
27

1205-003515

CLK REQ

R617

p.
s
ATIGCLK_1
ATIGCLK_1#

R223
R222

50V

ht

C308
0.022nF

tp
:

2801-004667

Y1
14.31818MHz

nostuff
R604

SCL
SDA

//
m

nostuff

1M
1%

VDD_48
VDD_ATIG
VDD_CPU
VDD_DOT
VDD_HTT
VDD_SATA
VDD_SB_SRC
VDD_SRC

50
49

10K 1%

2
3

61
62

R227

VDD_SRC_IO_1
VDD_SRC_IO_0
VDD_CPU_IO
VDD_ATIG_IO
VDD_SB_SRC_IO

om

63
26
48
4
55
40
35
16

CPU_K8_0
CPU_K8_0#

yc

10K 1%
10K 1%
10K 1%

SMB3_CLK
SMB3_DATA

R595
R597
R592

nostuff
nostuff
nostuff

10K 1%

10V
100nF

C628

VDD_REF

VDD_48

17
11
47
25
34

R603

10V
100nF

10V
100nF

C630

C297

10V
100nF

10V
100nF

10V
100nF

10V
100nF

C601

C608

C624

10V
2200nF

C304

C307

10V
2200nF

C632

VDD_REF
VSS_REF

10K
10K

u/
x/

U509
SLG8SP628VTR

56
60

10K 1%
10K 1%

B512
BLM18PG181SN1

R224
R221

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
nostuff
nostuff
nostuff

P3.3V

1%

10V
100nF

C609

P3.3V

1%
1%

10V
100nF

10V
100nF

C629

C623

10V
100nF

10V
100nF

C607

10V
100nF

C618

C305

nostuff

CLK0_HTT#
CLK0_HTT

nostuff

CLK3_FM48

CLK3_USB48
CLK3_NB14

RS780M/RX781M : 1.1V (OSC_14MHz)

158 ohm, 1608

R621
75
1%

C816
0.01nF
0.5pF
50V

90.9 ohm

for EMC Review


PV-16
on 31-Oct-08

SEL_HTT66

(Pin 59)

1
0*

66MHz 3.3V single HTT clock


100MHz differential clock

SEL_SATA

(Pin 58)

1
0*

SRC6 diff. clock


100MHz spreading diff. clock

SEL_27M

(Pin 57)

1*
0

27MHz/27MHz_SS graphics clock


SRC7 diff. clock

DRAW

HS CHO

11/26/2007

SAMSUNG

DRESDEN-INT

DEV. STEP

HS LEE / BM LEE
APPROVAL

MP(PR)
REV

YB CHUN
MODULE CODE

TITLE

DATE

CHECK

1.00

ELECTRONICS

MAIN
PART NO.

CLOCK GEN

BA41-01024~6A

LAST EDIT

December 24, 2008 14:36:53 PM

4
COM-22C-015(1996.6.5) REV. 3

nostuff

PAGE

10

OF

49

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN

SRP Sheet Number: 10 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

THERMAL SENSOR & FAN CONTROL


D

P3.3V

10
25
26
28

FAN3_FDBACK#

13

CPU3_THRMTRIP#
R629
P3.3V_AUX
nostuff
R628
200K
1%

9
11
8
15
21

THERMTRIP#
SHDN_SEL
TRIP_SET
NC_1
NC_2
NC_3
1209-001718

R2

DN3
DP3

CLK_SEL
CLK_IN

GND
THRM_PAD

2
3

10K 1%

0.47nF
50V

4
5

CPU2_THERMDA
CHP3_NB_THERMDN

C617
2.2nF
50V

6
7

10mil width and 10mil spacing.

CHP3_NB_THERMDP

C620

17
18

2.2nF
50V

MMBT3904
Q508

20
29

Opposite side of CPU.

P3.3V

Line Width = 20 mil

R593

R634
20K
1%

TRIP_SET pin voltage = (T-75)/21


3.3 * [R2/(R1+R2)] = (T-75)/21

J505
HDR-4P-1R-SMD

10K
1%

P1.8V

51.1K
1%

CPU2_THERMDC

C612

SMBUS Address 7Ah

R631
93 degree C

DN2
DP2

THM3_ALERT#
THM3_STP#

//
m

R1

DN1
DP1

FAN_MODE
FAN_1
FAN_2
TACH

KBC3_THERM_SMDATA
KBC3_THERM_SMCLK

19
12

u/
x/

FAN5_VDD

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
ALERT#
SYS_SHDN#

POWER_OK
RESET#

22
23

p.
s

14
16

SMDATA
SMCLK

om

KBC3_PWRGD

VDD_3V
VDD_5V_1
VDD_5V_2

yc

U508
EMC2102
1
24
27

R627

100nF
10V

10K 1%

C610

100nF
10V

R607

C606

10000nF
6.3V

10K 1%

C604

10K 1%

49.9
1%

R605

R600

P3.3V_AUX

R598

P3.3V_AUX

P5.0V

FAN5_VDD

FAN3_FDBACK#

R625

C605

2K
1%

10000nF
6.3V

CHP1_THRMTRIP#

5
6

1
2
3
4
MNT1
MNT2
3711-000456

Q506
MMBT3904

ht

tp
:

CPU1_THRMTRIP#

P3.3V

P1.8V

nostuff

R626

R644

10K
1%

2K
1%

CPU3_THRMTRIP#

Q507
MMBT3904

CPU1_THRMTRIP#

A
DRAW

DATE

11/26/2007

HS CHO
CHECK

SAMSUNG

DRESDEN-INT

DEV. STEP

HS LEE / BM LEE
APPROVAL

MP(PR)
REV

YB CHUN
MODULE CODE

TITLE

1.00

ELECTRONICS

MAIN
THERMAL SENSOR&FAN CONTROL

COM-22C-015(1996.6.5) REV. 3

BA41-01024~6A

LAST EDIT

December 24, 2008 14:36:53 PM

PART NO.

PAGE

11

OF

49

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN

SRP Sheet Number: 11 of 55

SAMSUNG PROPRIETARY

S1g2 CPU (1/3)

P1.8V_AUX
P2.5V

C248

CPU500-1
S1G2

CPU1_CLKIN_0
CPU1_CLKIN_1
CPU1_CLKIN_0#
CPU1_CLKIN_1#
CPU1_CTLIN_0
CPU1_CTLIN_1
CPU1_CTLIN_0#
CPU1_CTLIN_1#

J3
J5
J2
K5
N1
P3
P1
P4

L0_CLKIN_H0
L0_CLKIN_H1
L0_CLKIN_L0
L0_CLKIN_L1
L0_CTLIN_H0
L0_CTLIN_H1
L0_CTLIN_L0
L0_CTLIN_L1
0185482000

3.3nF
50V

L0_CADOUT_H0
L0_CADOUT_H1
L0_CADOUT_H2
L0_CADOUT_H3
L0_CADOUT_H4
L0_CADOUT_H5
L0_CADOUT_H6
L0_CADOUT_H7
L0_CADOUT_H8
L0_CADOUT_H9
L0_CADOUT_H10
L0_CADOUT_H11
L0_CADOUT_H12
L0_CADOUT_H13
L0_CADOUT_H14
L0_CADOUT_H15
L0_CADOUT_L0
L0_CADOUT_L1
L0_CADOUT_L2
L0_CADOUT_L3
L0_CADOUT_L4
L0_CADOUT_L5
L0_CADOUT_L6
L0_CADOUT_L7
L0_CADOUT_L8
L0_CADOUT_L9
L0_CADOUT_L10
L0_CADOUT_L11
L0_CADOUT_L12
L0_CADOUT_L13
L0_CADOUT_L14
L0_CADOUT_L15

CPU500-4
S1G2

AE2
AE3
AE4
AE5
AD1
AC2
AB1
AA2
W2
V1
U2
T1
AD4
AD5
AB4
AB5
Y5
V4
V5
T4
AC1
AC3
AA1
AA3
W3
U1
U3
R1
AD3
AC5
AB3
AA5
W5
V3
U5
T3

C587

CLK0_HCLK0
CPU1_HTOUT(15:0)

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

C586

CLK0_HCLK0#

F8
F9

3.9nF
50V

R574
169
1%

3.9nF
50V

A9
A8

4/5

L0_CLKOUT_H0
L0_CLKOUT_H1
L0_CLKOUT_L0
L0_CLKOUT_L1

L0_CTLOUT_H0
L0_CTLOUT_H1
L0_CTLOUT_L0
L0_CTLOUT_L1

Y1
Y4
W1
Y3
R2
T5
R3
R5

CLKIN_H
CLKIN_L

SVC
SVD

CPU1_VDD0_FB
CPU1_VDD0_FB#
CPU1_VDD1_FB
CPU1_VDD1_FB#

P1.8V_AUX

CPU1_CLKOUT_0
CPU1_CLKOUT_1
CPU1_CLKOUT_0#
CPU1_CLKOUT_1#

RESET_L
PWROK
LDTSTOP_L
LDTREQ_L

u/
x/

CPU1_SIC
CPU1_SID
CPU1_ALERT#
44.2 1%
R96
44.2 1%
R97

P1.2V

CPU1_HTOUT#(15:0)

B7
A7
F10
C6

nostuff
nostuff

nostuff
nostuff
nostuff

CPU1_CTLOUT_0
CPU1_CTLOUT_1
CPU1_CTLOUT_0#
CPU1_CTLOUT_1#

AF4
AF5
AE6

R6
P6
F6
E6

Y6
AB6

G10
AA9
AC9
AD9
AF9

R94

301 1%

AD7

R161
R163

301 1%
301 1%

H10
G9

R192
R196

301 1%
301 1%

E9
E8

R91
R564
R558
R559
R95
R565

301 1%
301 1%
301 1%
301 1%
301 1%
301 1%

AB8
AF7
AE7
AE8
AC8
AF8

R575

C2
AA6

A3
A5
B3
B5
C1

CPU Socket : 0185482000 (3704-001228)

THERMTRIP_L
PROCHOT_L
MEMHOT_L

SIC
SID
ALERT_L

THERMDC
THERMDA

HT_REF0
HT_REF1

VDDIO_FB_H
VDDIO_FB_L

VDD0_FB_H
VDD0_FB_L

VDDNB_FB_H
VDDNB_FB_L

VDD1_FB_H
VDD1_FB_L
DBRDY
TMS
TCK
TRST_L
TDI

DBREQ_L
TDO

TEST23

TEST28_H
TEST28_L

TEST18
TEST19

TEST25_H
TEST25_L

TEST17
TEST16
TEST15
TEST14

TEST21
TEST20
TEST24
TEST22
TEST12
TEST27

TEST7
TEST10
TEST8

TEST9
TEST6

TEST29_H
TEST29_L

RSVD1
RSVD2
RSVD3
RSVD4
RSVD5

RSVD10
RSVD9
RSVD8
RSVD7
RSVD6

R170

M11

KEY1
(VSS)
W18
(RSVD) KEY2

VDDA1
VDDA2

A6
A4

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
CPU1_LDTRST#
CPU1_PWRGDCPU
CPU1_LDTSTP#
CPU1_LDTREQ#

tp
:

C218

220nF
10V

p.
s

L0_CADIN_H0
L0_CADIN_H1
L0_CADIN_H2
L0_CADIN_H3
L0_CADIN_H4
L0_CADIN_H5
L0_CADIN_H6
L0_CADIN_H7
L0_CADIN_H8
L0_CADIN_H9
L0_CADIN_H10
L0_CADIN_H11
L0_CADIN_H12
L0_CADIN_H13
L0_CADIN_H14
L0_CADIN_H15
L0_CADIN_L0
L0_CADIN_L1
L0_CADIN_L2
L0_CADIN_L3
L0_CADIN_L4
L0_CADIN_L5
L0_CADIN_L6
L0_CADIN_L7
L0_CADIN_L8
L0_CADIN_L9
L0_CADIN_L10
L0_CADIN_L11
L0_CADIN_L12
L0_CADIN_L13
L0_CADIN_L14
L0_CADIN_L15

VLDT_B0
VLDT_B1
VLDT_B2
VLDT_B3

om

CPU1_HTIN#(15:0)

E3
E1
G3
G1
J1
L3
L1
N3
E5
F3
G5
H3
K3
L5
M3
N5
E2
F1
G2
H1
K1
L2
M1
N2
F5
F4
H5
H4
K4
M5
M4
P5

C230

1/5
HT LINK

yc

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

VLDT_A0
VLDT_A1
VLDT_A2
VLDT_A3

//
m

D1
D2
D3
D4
CPU1_HTIN(15:0)

4700nF-X7R
6.3V

P1.2V

P1.2V

301 1%
301 1%
301 1%

B22
BLM18PG181SN1

R563
R89
R100

THIS DOCUMENT CONTAINS CONFIDENTIAL


PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

CPU1_SVC
CPU1_SVD

AF6
AC7
AA8

CPU1_THRMTRIP#
CPU1_PROCHOT#

W7
W8

CPU2_THERMDC
CPU2_THERMDA

W9
Y9

CPU1_VDDIO_FB
CPU1_VDDIO_FB#

H6
G6

CPU1_VDDNB_FB
CPU1_VDDNB_FB#
P1.8V

E10

AE9
J7
H8
D7
E7
F7
C7

R172
R173

301 1%
301 1%

nostuff
nostuff

C3
K8
C4
C9
C8

H18
H19
AA7
D5
C5

ht

0185482000

CPU1_LDTREQ#
CPU1_LDTRST#
CPU1_PWRGDCPU
CPU1_LDTSTP#

P1.2V

C205

C212

C201

C217

C94

C91

C92

4700nF-X7R
6.3V

4700nF-X7R
6.3V

4700nF-X7R
6.3V

220nF
10V

220nF
10V

0.18nF
50V

0.18nF
50V

CPU1_SIC
CPU1_SID
CPU1_ALERT#

P1.8V

R171
R572
R573
R582

301 1%
301 1%
301 1%
301 1%

R556
R562
R557

390
390
1K
1%

P1.8V_AUX

nostuff

A
HS CHO

11/26/2007

SAMSUNG

DRESDEN-INT

DEV. STEP

CHECK

HS LEE / BM LEE
APPROVAL

MP(PR)
REV

YB CHUN
MODULE CODE

TITLE

DATE

DRAW

1.00

ELECTRONICS

MAIN
PART NO.

S1G2 CPU 1/3

BA41-01024~6A

LAST EDIT

December 24, 2008 14:36:53 PM

4
COM-22C-015(1996.6.5) REV. 3

PAGE

12

OF

49

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN

SRP Sheet Number: 12 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

S1g2 CPU (2/3)


MEM1_ADQS(7:0)

MEM1_ADM(7:0)
G13
G16
C22
G22
AD23
AB19
Y15
W12
H13
G15
C21
G21
AC23
AB20
W15
W13

C11
A11
A14
B14
G11
E11
D12
A13
A15
A16
A19
A20
C14
D14
C18
D18
D20
A21
D24
C25
B20
C20
B24
C24
E23
E24
G25
G26
C26
D26
G23
G24
AA24
AA23
AD24
AE24
AA26
AA25
AD26
AE25
AC22
AD22
AE20
AF20
AF24
AF23
AC20
AD20
AD18
AE18
AC14
AD14
AF19
AC18
AF16
AF15
AF13
AC12
AB11
Y11
AE14
AF14
AF11
AD11

AF10
AE10

39.2 1%
39.2 1%

H16

MEM1_BDQ(63:0)

T19
V22
U21
V19

MEM1_ODT0
MEM1_ODT1

tp
:

ht

MB_DQS_H0
MB_DQS_H1
MB_DQS_H2
MB_DQS_H3
MB_DQS_H4
MB_DQS_H5
MB_DQS_H6
MB_DQS_H7
MB_DQS_L0
MB_DQS_L1
MB_DQS_L2
MB_DQS_L3
MB_DQS_L4
MB_DQS_L5
MB_DQS_L6
MB_DQS_L7

u/
x/

T20
U19
U20
V20

MEM1_CKE0
MEM1_CKE1

J22
J20

N19
E16
Y16
P19
N20
F16
AA16
P20

CLK1_MCLK0
CLK1_MCLK1

CLK1_MCLK0#
CLK1_MCLK1#

MEM1_AMA(15:0)

yc

om

p.
s

MEM1_CS0#
MEM1_CS1#

MEM1_ABS(2:0)

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

N21
M20
N22
M19
M22
L20
M24
L21
L19
K22
R21
L22
K20
V24
K24
K19

0
1
2

R20
R23
J21

R19
T22
T24

MEM1_ARAS#
MEM1_ACAS#
MEM1_AWE#

MEM:CMD/CTRL/CLK

MEMZP
MEMZN

MEM1_BDQS#(7:0)

MEM1_BDM(7:0)

VTT_SENSE

RSVD_M1

MEMVREF

MA0_ODT0
MA0_ODT1
MA1_ODT0
MA1_ODT1

RSVD_M2

MEM1_BDQS(7:0)

MB0_ODT0
MB0_ODT1
MB1_ODT0

MA0_CS_L0
MA0_CS_L1
MA1_CS_L0
MA1_CS_L1

MB0_CS_L0
MB0_CS_L1
MB1_CS_L0
MB_CKE0
MB_CKE1

MA_CKE0
MA_CKE1

MA_CLK_H5
MA_CLK_H1
MA_CLK_H7
MA_CLK_H4
MA_CLK_L5
MA_CLK_L1
MA_CLK_L7
MA_CLK_L4

MB_CLK_H5
MB_CLK_H1
MB_CLK_H7
MB_CLK_H4
MB_CLK_L5
MB_CLK_L1
MB_CLK_L7
MB_CLK_L4

MA_ADD0
MA_ADD1
MA_ADD2
MA_ADD3
MA_ADD4
MA_ADD5
MA_ADD6
MA_ADD7
MA_ADD8
MA_ADD9
MA_ADD10
MA_ADD11
MA_ADD12
MA_ADD13
MA_ADD14
MA_ADD15

MB_ADD0
MB_ADD1
MB_ADD2
MB_ADD3
MB_ADD4
MB_ADD5
MB_ADD6
MB_ADD7
MB_ADD8
MB_ADD9
MB_ADD10
MB_ADD11
MB_ADD12
MB_ADD13
MB_ADD14
MB_ADD15

MA_BANK0
MA_BANK1
MA_BANK2

MB_BANK0
MB_BANK1
MB_BANK2

MA_RAS_L
MA_CAS_L
MA_WE_L

MB_RAS_L
MB_CAS_L
MB_WE_L

Y10

CPU1_VTTSENSE

W17

MEM1_VREF

B18
W26
W23
Y26

MEM1_ODT2
MEM1_ODT3

V26
W25
U22

MEM1_CS2#
MEM1_CS3#

J25
H26

MEM1_CKE2
MEM1_CKE3

P22
A17
AF18
R26
R22
A18
AF17
R25
P24
N24
P26
N23
N26
L23
N25
L24
M26
K26
T26
L26
L25
W24
J23
J24

CLK1_MCLK2
CLK1_MCLK3

CLK1_MCLK2#
CLK1_MCLK3#
MEM1_BMA(15:0)

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

MEM1_BBS(2:0)

R24 0
U26 1
J26 2
U25
U24
U23

MEM1_BRAS#
MEM1_BCAS#
MEM1_BWE#

P0.9V

PLACE EACH CAP NEAR W17 pin

MEM1_VREF

C111

C122

100nF

1nF

10V

50V

C90

C80

C95

C219

C96

C220

C227

C221

4700nF-X7R
6.3V

4700nF-X7R
6.3V

4700nF-X7R
6.3V

4700nF-X7R
6.3V

220nF
10V

220nF
10V

220nF
10V

220nF
10V

C241

C243

C242

0.18nF
50V

0.18nF
50V

0.18nF
50V

C97

C87

C85

C240 C86

1nF
50V

1nF
50V

1nF
50V

1nF
50V

0.18nF
50V

P3.3V
R159

0 1 2 3 4 5 6 7

VTT5
VTT6
VTT7
VTT8
VTT9

W10
AC10
AB10
AA10
A10

0185482000

C12
D16
A24
F26
AC25
AF21
AE16
AF12
B12
C16
A23
E26
AC26
AF22
AD16
AE12
0 1 2 3 4 5 6 7

0 1 2 3 4 5 6 7

MB_DATA0
MB_DATA1
MB_DATA2
MB_DATA3
MB_DATA4
MB_DATA5
MB_DATA6
MB_DATA7
MB_DATA8
MB_DATA9
MB_DATA10
MB_DATA11
MB_DATA12
MB_DATA13
MB_DATA14
MB_DATA15
MB_DATA16
MB_DATA17
MB_DATA18
MB_DATA19
MB_DATA20
MB_DATA21
MB_DATA22
MB_DATA23
MB_DATA24
MB_DATA25
MB_DATA26
MB_DATA27
MB_DATA28
MB_DATA29
MB_DATA30
MB_DATA31
MB_DATA32
MB_DATA33
MB_DATA34
MB_DATA35
MB_DATA36
MB_DATA37
MB_DATA38
MB_DATA39
MB_DATA40
MB_DATA41
MB_DATA42
MB_DATA43
MB_DATA44
MB_DATA45
MB_DATA46
MB_DATA47
MB_DATA48
MB_DATA49
MB_DATA50
MB_DATA51
MB_DATA52
MB_DATA53
MB_DATA54
MB_DATA55
MB_DATA56
MB_DATA57
MB_DATA58
MB_DATA59
MB_DATA60
MB_DATA61
MB_DATA62
MB_DATA63

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63

//
m

0185482000

R561
R560

VTT1
VTT2
VTT3
VTT4

2/5

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

CPU500-3
S1G2
3/5

A12
B16
A22
E25
AB26
AE22
AC16
AD12

MA_DATA0
MA_DATA1
MA_DATA2
MA_DATA3
MA_DATA4
MA_DATA5
MA_DATA6
MA_DATA7
MA_DATA8
MA_DATA9
MA_DATA10
MA_DATA11
MA_DATA12
MA_DATA13
MA_DATA14
MA_DATA15
MA_DATA16
MA_DATA17
MA_DATA18
MA_DATA19
MA_DATA20
MA_DATA21
MA_DATA22
MA_DATA23
MA_DATA24
MA_DATA25
MA_DATA26
MA_DATA27
MA_DATA28
MA_DATA29
MA_DATA30
MA_DATA31
MA_DATA32
MA_DATA33
MA_DATA34
MA_DATA35
MA_DATA36
MA_DATA37
MA_DATA38
MA_DATA39
MA_DATA40
MA_DATA41
MA_DATA42
MA_DATA43
MA_DATA44
MA_DATA45
MA_DATA46
MA_DATA47
MA_DATA48
MA_DATA49
MA_DATA50
MA_DATA51
MA_DATA52
MA_DATA53
MA_DATA54
MA_DATA55
MA_DATA56
MA_DATA57
MA_DATA58
MA_DATA59
MA_DATA60
MA_DATA61
MA_DATA62
MA_DATA63

D10
C10
B10
AD10

0 1 2 3 4 5 6 7

MA_DQS_H0
MA_DQS_H1
MA_DQS_H2
MA_DQS_H3
MA_DQS_H4
MA_DQS_H5
MA_DQS_H6
MA_DQS_H7
MA_DQS_L0
MA_DQS_L1
MA_DQS_L2
MA_DQS_L3
MA_DQS_L4
MA_DQS_L5
MA_DQS_L6
MA_DQS_L7

E12
C15
E19
F24
AC24
Y19
AB16
Y13

G12
F12
H14
G14
H11
H12
C13
E13
H15
E15
E17
H17
E14
F14
C17
G17
G18
C19
D22
E20
E18
F18
B22
C23
F20
F22
H24
J19
E21
E22
H20
H22
Y24
AB24
AB22
AA21
W22
W21
Y22
AA22
Y20
AA20
AA18
AB18
AB21
AD21
AD19
Y18
AD17
W16
W14
Y14
Y17
AB17
AB15
AD15
AB13
AD13
Y12
W11
AB14
AA14
AB12
AA12

MA_DM0
MA_DM1
MA_DM2
MA_DM3
MA_DM4
MA_DM5
MA_DM6
MA_DM7

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63

MB_DM0
MB_DM1
MB_DM2
MB_DM3
MB_DM4
MB_DM5
MB_DM6
MB_DM7

MEM1_ADQ(63:0)

CPU500-2
S1G2

P1.8V_AUX

MEM1_ADQS#(7:0)
0 1 2 3 4 5 6 7

P0.9V

P0.9V

0 1 2 3 4 5 6 7

R566

1%
10K
1%
10K

MCH3_EXTTS0#
MCH3_EXTTS1#

DRAW

SAMSUNG

CHECK

ELECTRONICS
PART NO.

APPROVAL

MODULE CODE

LAST EDIT

undefined

4
COM-22C-015(1996.6.5) REV. 3

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN

SRP Sheet Number: 13 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

Bottom side decoupling

S1g2 CPU (3/3)

CPU_CORE0
1%
100

R160

CORE0_RUN

10V
220nF

10nF

0.18nF 50V

C192

C197

C195

16V

6.3V
22000nF-X5R

C161

6.3V
22000nF-X5R

C175

6.3V
22000nF-X5R

C174

1%
100

R162

6.3V
22000nF-X5R

C193

CPU1_VDD0_FB

CPU1_VDD0_FB#

0.18nF 50V

C133

16V
10nF

C134

C135

6.3V
22000nF-X5R

C156

10V

6.3V
22000nF-X5R

220nF

6.3V
22000nF-X5R

C155

C127

6.3V
22000nF-X5R

22000nF-X5R
6.3V

22000nF-X5R
6.3V

22000nF-X5R
6.3V

22000nF-X5R
6.3V

22000nF-X5R
6.3V

10V
220nF

220nF

0.18nF

0.18nF

C176

C162

C150

C136

C189

C157

C145

C164

C196

50V

50V

P1.8V_AUX

VDD_CPU_NB

10V

1%
100

CORE1_RUN

C144

u/
x/

p.
s

R103

Decoupling between processor and Memory


Place close to processor as possible

0.18nF 50V

C184

16V
10nF

C113

16V
10nF

C177

10V
220nF

C114

10V
220nF

C102

10V
220nF

C116

10V

220nF

C115

6.3V

4700nF-X7R

C183

6.3V

4700nF-X7R

C182

6.3V

P1.8V_AUX

4700nF-X7R

ht

CPU Socket : 0185482000

CPU1_VDD1_FB#

4700nF-X7R

0185482000

CPU1_VDD1_FB

1%
100

om

Y25
V25
V23
V21
V18
U17
T25
T23
T21
T18
R17
P25
P23
P21
P18

VSS66
VSS67
VSS68
VSS69
VSS70
VSS71
VSS72
VSS73
VSS74
VSS75
VSS76
VSS77
VSS78
VSS79
VSS80
VSS81
VSS82
VSS83
VSS84
VSS85
VSS86
VSS87
VSS88
VSS89
VSS90
VSS91
VSS92
VSS93
VSS94
VSS95
VSS96
VSS97
VSS98
VSS99
VSS100
VSS101
VSS102
VSS103
VSS104
VSS105
VSS106
VSS107
VSS108
VSS109
VSS110
VSS111
VSS112
VSS113
VSS114
VSS115
VSS116
VSS117
VSS118
VSS119
VSS120
VSS121
VSS122
VSS123
VSS124
VSS125
VSS126
VSS127
VSS128
VSS129

R107

C112

VDDIO1
VDDIO2
VDDIO3
VDDIO4
VDDIO5
VDDIO6
VDDIO7
VDDIO8
VDDIO9
VDDIO10
VDDIO11
VDDIO12

VDDIO27
VDDIO26
VDDIO25
VDDIO24
VDDIO23
VDDIO22
VDDIO21
VDDIO20
VDDIO19
VDDIO18
VDDIO17
VDDIO16
VDDIO15
VDDIO14
VDDIO13

P1.8V_AUX

VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
VSS10
VSS11
VSS12
VSS13
VSS14
VSS15
VSS16
VSS17
VSS18
VSS19
VSS20
VSS21
VSS22
VSS23
VSS24
VSS25
VSS26
VSS27
VSS28
VSS29
VSS30
VSS31
VSS32
VSS33
VSS34
VSS35
VSS36
VSS37
VSS38
VSS39
VSS40
VSS41
VSS42
VSS43
VSS44
VSS45
VSS46
VSS47
VSS48
VSS49
VSS50
VSS51
VSS52
VSS53
VSS54
VSS55
VSS56
VSS57
VSS58
VSS59
VSS60
VSS61
VSS62
VSS63
VSS64
VSS65

J6
J8
J10
J12
J14
J16
J18
K2
K7
K9
K11
K13
K15
K17
L6
L8
L10
L12
L14
L16
L18
M7
M9
AC6
M17
N4
N8
N10
N16
N18
P2
P7
P9
P11
P17
R8
R10
R16
R18
T7
T9
T11
T13
T15
T17
U4
U6
U8
U10
U12
U14
U16
U18
V2
V7
V9
V11
V13
V15
V17
W6
Y21
Y23
N6

C181

H25
J17
K18
K21
K23
K25
L17
M18
M21
M23
M25
N17

VDDNB_1
VDDNB_2
VDDNB_3
VDDNB_4
VDDNB_5

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
AA4
AA11
AA13
AA15
AA17
AA19
AB2
AB7
AB9
AB23
AB25
AC11
AC13
AC15
AC17
AC19
AC21
AD6
AD8
AD25
AE11
AE13
AE15
AE17
AE19
AE21
AE23
B4
B6
B8
B9
B11
B13
B15
B17
B19
B21
B23
B25
D6
D8
D9
D11
D13
D15
D17
D19
D21
D23
D25
E4
F2
F11
F13
F15
F17
F19
F21
F23
F25
H7
H9
H21
H23
J4

yc

K16
M16
P16
T16
V16

VDD1_1
VDD1_2
VDD1_3
VDD1_4
VDD1_5
VDD1_6
VDD1_7
VDD1_8
VDD1_9
VDD1_10
VDD1_11
VDD1_12
VDD1_13
VDD1_14
VDD1_15
VDD1_16
VDD1_17
VDD1_18
VDD1_19
VDD1_20
VDD1_21
VDD1_22
VDD1_23
VDD1_24
VDD1_25
VDD1_26

P8
P10
R4
R7
R9
R11
T2
T6
T8
T10
T12
T14
U7
U9
U11
U13
U15
V6
V8
V10
V12
V14
W4
Y2
AC4
AD2

//
m

VDD_CPU_NB

VDD0_1
VDD0_2
VDD0_3
VDD0_4
VDD0_5
VDD0_6
VDD0_7
VDD0_8
VDD0_9
VDD0_10
VDD0_11
VDD0_12
VDD0_13
VDD0_14
VDD0_15
VDD0_16
VDD0_17
VDD0_18
VDD0_19
VDD0_20
VDD0_21
VDD0_22
VDD0_23

5/5

tp
:

CPU_CORE1

CPU_CORE1
CPU500-5
S1G2

G4
H2
J9
J11
J13
J15
K6
K10
K12
K14
L4
L7
L9
L11
L13
L15
M2
M6
M8
M10
N7
N9
N11

6.3V

CPU_CORE0

A
DRAW

HS CHO

11/26/2007

SAMSUNG

DRESDEN-INT

DEV. STEP

CHECK

HS LEE / BM LEE

MP(PR)
REV

APPROVAL

YB CHUN
MODULE CODE

TITLE

DATE

1.00

ELECTRONICS

MAIN
PART NO.

S1G2 CPU 3/3

BA41-01024~6A

LAST EDIT

December 24, 2008 14:36:53 PM

4
COM-22C-015(1996.6.5) REV. 3

PAGE

14

OF

49

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN

SRP Sheet Number: 14 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

RS780MN(1/3)

U507-2
216-0674026

T22
AB23
M22
R21

CPU1_CLKOUT_0
CPU1_CLKOUT_1
CPU1_CTLOUT_0
CPU1_CTLOUT_1

T23
AA22
M23
R20

CPU1_CLKOUT_0#
CPU1_CLKOUT_1#
CPU1_CTLOUT_0#
CPU1_CTLOUT_1#

R165

301
1%

C23
A24

HT_RXCAD0N
HT_RXCAD1N
HT_RXCAD2N
HT_RXCAD3N
HT_RXCAD4N
HT_RXCAD5N
HT_RXCAD6N
HT_RXCAD7N
HT_RXCAD8N
HT_RXCAD9N
HT_RXCAD10N
HT_RXCAD11N
HT_RXCAD12N
HT_RXCAD13N
HT_RXCAD14N
HT_RXCAD15N

HT_TXCAD0N
HT_TXCAD1N
HT_TXCAD2N
HT_TXCAD3N
HT_TXCAD4N
HT_TXCAD5N
HT_TXCAD6N
HT_TXCAD7N
HT_TXCAD8N
HT_TXCAD9N
HT_TXCAD10N
HT_TXCAD11N
HT_TXCAD12N
HT_TXCAD13N
HT_TXCAD14N
HT_TXCAD15N

HT_RXCLK0P
HT_RXCLK1P
HT_RXCTL0P
HT_RXCTL1P

HT_TXCLK0P
HT_TXCLK1P
HT_TXCTL0P
HT_TXCTL1P

HT_RXCLK0N
HT_RXCLK1N
HT_RXCTL0N
HT_RXCTL1N

HT_TXCLK0N
HT_TXCLK1N
HT_TXCTL0N
HT_TXCTL1N

HT_RXCALP
HT_RXCALN

HT_TXCALP
HT_TXCALN

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

D25
E25
F25
F22
H22
J24
K25
K22
G21
H21
J21
K17
J19
L18
P21
M18

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

H24
L21
M24
P19
H25
L20
M25
R18

A5
A4
C3
D1
E2
F4
F1
H4
H1
J2
K4
K1
M4
M1
N2
P1
B5
B4
B2
D2
E1
F3
F2
H3
H2
J1
K3
K2
M3
M2
N1
P2

PEG3_TX2P_HDMI
PEG3_TX1P_HDMI
PEG3_TX0P_HDMI
PEG3_TXCP_HDMI

u/
x/

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
CPU1_HTIN#(15:0)

AE3
AD4
AE2
AD3
AD1
AD2
V5
W6
U5
U6
U8
U7

PEX1_MINIRXP0
PEX1_MINIRXN0
PEX1_EXPCARDRXP1
PEX1_EXPCARDRXN1
PEX1_GLAN_RXP2
PEX1_GLAN_RXN2

CPU1_CLKIN_0
CPU1_CLKIN_1

CPU1_CTLIN_0
CPU1_CTLIN_1

CPU1_CLKIN_0#
CPU1_CLKIN_1#

CPU1_CTLIN_0#
CPU1_CTLIN_1#

B24
B25 R164

301
1%

PEX1_SB_TXP(3:0)

PEX1_SB_TXN(3:0)

0
1
2
3

0
1
2
3

AA8
AA7
AA5
W5
Y8
Y7
AA6
Y5

GPP_RX0P
GPP_RX0N
GPP_RX1P
GPP_RX1N
GPP_RX2P
GPP_RX2N
GPP_RX3P
GPP_RX3N
GPP_RX4P
GPP_RX4N
GPP_RX5P
GPP_RX5N

PCIE I/F GPP

SB_RX0P
SB_RX1P
SB_RX2P
SB_RX3P

PCIE I/F SB

GPP_TX0P
GPP_TX0N
GPP_TX1P
GPP_TX1N
GPP_TX2P
GPP_TX2N
GPP_TX3P
GPP_TX3N
GPP_TX4P
GPP_TX4N
GPP_TX5P
GPP_TX5N
SB_TX0P
SB_TX1P
SB_TX2P
SB_TX3P

SB_TX0N
SB_TX1N
SB_TX2N
SB_TX3N

SB_RX0N
SB_RX1N
SB_RX2N
SB_RX3N

PCE_CALRN_PCE_BCALRN
PCE_CALRP_PCE_BCALRP

ht

0904-002431

D24
E24
F24
F23
H23
J25
K24
K23
F21
G20
J20
J18
L19
M19
M21
P18

2/5

GFX_RX0P
GFX_TX0P
GFX_TX1P
GFX_RX1P
GFX_TX2P
GFX_RX2P
GFX_TX3P
GFX_RX3P
GFX_TX4P
GFX_RX4P
GFX_TX5P
GFX_RX5P
GFX_TX6P
GFX_RX6P
GFX_TX7P
GFX_RX7P
GFX_TX8P
GFX_RX8P
GFX_TX9P
GFX_RX9P
GFX_RX10P
GFX_TX10P
GFX_TX11P
GFX_RX11P
GFX_TX12P
GFX_RX12P
GFX_TX13P
GFX_RX13P
GFX_TX14P
GFX_RX14P
GFX_TX15P
GFX_RX15P
GFX_RX0N PCIE I/F GFX GFX_TX0N
GFX_TX1N
GFX_RX1N
GFX_TX2N
GFX_RX2N
GFX_TX3N
GFX_RX3N
GFX_TX4N
GFX_RX4N
GFX_TX5N
GFX_RX5N
GFX_TX6N
GFX_RX6N
GFX_TX7N
GFX_RX7N
GFX_TX8N
GFX_RX8N
GFX_TX9N
GFX_RX9N
GFX_RX10N
GFX_TX10N
GFX_RX11N
GFX_TX11N
GFX_TX12N
GFX_RX12N
GFX_TX13N
GFX_RX13N
GFX_TX14N
GFX_RX14N
GFX_TX15N
GFX_RX15N

p.
s

Y24
V23
V24
U25
T24
P23
P24
N25
AC25
AB24
AA25
Y23
W20
V20
U21
U18

HT_TXCAD0P
HT_TXCAD1P
HT_TXCAD2P
HT_TXCAD3P
HT_TXCAD4P
HT_TXCAD5P
HT_TXCAD6P
HT_TXCAD7P
HT_TXCAD8P
HT_TXCAD9P
HT_TXCAD10P
HT_TXCAD11P
HT_TXCAD12P
HT_TXCAD13P
HT_TXCAD14P
HT_TXCAD15P

om

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

HT_RXCAD0P
HT_RXCAD1P
HT_RXCAD2P
HT_RXCAD3P
HT_RXCAD4P
HT_RXCAD5P
HT_RXCAD6P
HT_RXCAD7P
HT_RXCAD8P
HT_RXCAD9P
HT_RXCAD10P
HT_RXCAD11P
HT_RXCAD12P
HT_RXCAD13P
HT_RXCAD14P
HT_RXCAD15P

yc

CPU1_HTOUT#(15:0)

Y25
V22
V25
U24
T25
P22
P25
N24
AC24
AB25
AA24
Y22
W21
V21
U20
U19

CPU1_HTIN(15:0)

tp
:

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

1/5

HYPER TRANSPORT CPU I/F

CPU1_HTOUT(15:0)

//
m

U507-1
216-0674026

D4
A3
C2
E5
G5
H5
J6
J7
L5
M8
P7
P5
R8
R6
P4
T4
C4
B3
C1
F5
G6
H6
J5
J8
L6
L8
M7
M5
P8
R5
P3
T3

AC1
AC2
AB4
AB3
AA2
AA1
Y1
Y2
Y4
Y3
V1
V2

C598
C597
C603
C602
C600
C599

100nF
100nF
100nF
100nF
100nF
100nF

AD7
AE6
AB6
AD5

C591
C592
C594
C596

100nF
100nF
100nF
100nF

AE7
AD6
AC6
AE5

C589
C590
C593
C595

AB8
AC8

R187
R199

PEG3_TX2N_HDMI
PEG3_TX1N_HDMI
PEG3_TX0N_HDMI
PEG3_TXCN_HDMI

10V
10V
10V
10V
10V
10V

100nF
100nF
100nF
100nF

PEX1_MINITXP0
PEX1_MINITXN0
PEX1_EXPCARDTXP1
PEX1_EXPCARDTXN1
PEX1_GLAN_TXP2
PEX1_GLAN_TXN2

10V
10V
10V
10V
10V
10V
10V
10V

PEX1_SB_RXP(3:0)

0
1
2
3
0
1
2
3

B
PEX1_SB_RXN(3:0)

P1.1V

2K
1%
1.24K 1%

0904-002431

AMD recommandation 1608, 1.27Kohm (2007-007669)

A
DRAW

DATE

HS CHO

11/26/2007

SAMSUNG

DRESDEN-INT

DEV. STEP

CHECK

HS LEE / BM LEE
APPROVAL

MP(PR)
REV

YB CHUN
MODULE CODE

TITLE

1.00

ELECTRONICS

MAIN
PART NO.

RS780MN 1/3

BA41-01024~6A

LAST EDIT

December 24, 2008 14:36:53 PM

4
COM-22C-015(1996.6.5) REV. 3

PAGE

15

OF

49

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN

SRP Sheet Number: 15 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

RS780MN(2/3)
P3.3V

B28
BLM18PG181SN1

P1.8V

C292
2200nF-X5R
10V

U507-3
216-0674026

C270
100nF
10V

F12
E12
F14
G15
H15
H14

2200nF-X5R
10V

RHU002N06
Q28

R194
4.7K
1%

0
0

nostuff

CLK0_HTT
CLK0_HTT#

REFCLK_P_OSCIN_OSCIN
REFCLK_N_PWM_GPIO3

T2
T1

GFX_REFCLKP
GFX_REFCLKN

U1
U2

GPP_REFCLKP
GPP_REFCLKN

V4
V3

CLK1_SBLINK
CLK1_SBLINK#

NC_10
NC_11
NC_12
NC_13
NC_14
NC_15

B10

CHP3_STRAP
KBC3_PWRGD

R190

MIS.

NC_37
NC_38

SUS_STAT#_PWM_GPIO5

THERMALDIODE_P
THERMALDIODE_N
TESTMODE

u/
x/

p.
s
2200nF-X5R
10V

C14
D15
C16
C18
C20
E20
C22

P1.8V
B18
BLM18PG181SN1

C226

C216

100nF
10V

4700nF-X7R
6.3V

U507-4
216-0674026

E9
F7
G12

AB12
AE16
V11
AE15
AA12
AB16
AB14
AD14
AD13
AD15
AC16
AE13
AC14
Y14

PEG3_LCDVDDON
LCD3_BRIT
PEG3_BKLTEN

R202

R195

R188

4.7K
1%

4.7K
1%

4.7K
1%

D9
D10

R191

D12

AD16
AE17
AD17

PEG3_HPD_HDMI

W12
Y12
AD18
AB13
AB18
V14

CHP3_SUSSTAT#

AE8
AD8

CHP3_NB_THERMDP
CHP3_NB_THERMDN

D13

nostuff
nostuff

NC_16

R178

0904-002431

R184

1.91K
1%

V15
W14

40.2
1%

AE12
AD12

1.8k ohm

R581

2.2K

2.2K

R578

R580

2.2K

2.2K

CRT3_HSYNC
CRT3_VSYNC

nostuff
nostuff

R181

CRT3_HSYNC (Side Port Memory Option)


High : Not Available *
Low : Available

NC_39
NC_40
NC_41
NC_42
NC_43
NC_44
NC_45
NC_46
NC_47
NC_48
NC_49
NC_50
NC_51
NC_52
NC_53
NC_54
NC_55
NC_56
NC_57
NC_58
NC_59
NC_60
NC_61

NC_62
NC_63
NC_64
NC_65

4/5
NC_66
NC_67
NC_68
NC_69
NC_70
NC_71
NC_72
NC_73
NC_74
NC_75
NC_76
NC_77
NC_78
NC_79
NC_80
NC_81
NC_82
NC_83
NC_84
NC_85
NC_86
NC_87
IOPLLVDD18_NC
IOPLLVDD_NC
IOPLLVSS_NC
MEM_VREF_NC

AA18
AA20
AA19
Y19
V17
AA17
AA15
Y15
AC20
AD19
AE22
AC18
AB20
AD22
AC22
AD21
Y17
W18
AD20
AE21
W17
AE19
AE23
AE24
AD23
AE18

A
HS CHO

CRT3_VSYNC (Debug Bus Access)


High : Disable *
Low : Enable

TITLE

DATE

CHECK

11/26/2007

SAMSUNG

DRESDEN-INT

DEV. STEP

HS LEE / BM LEE
APPROVAL

MP(PR)
REV

YB CHUN

1.00

ELECTRONICS

MAIN
PART NO.

RS780MN 2/3

BA41-01024~6A

LAST EDIT

December 24, 2008 14:36:53 PM


COM-22C-015(1996.6.5) REV. 3

P1.1V P1.8V

40.2
1%

DRAW

MODULE CODE

0904-002431

P1.8V

R579

C247

A15
B15
A14
B14

RSVD

150
1%

P3.3V

GPIO3
GPIO2
GPIO4

STRP_DATA

G11

C8

P3.3V

A13
B13

LCD1_ACLK
LCD1_ACLK#
P1.8V
B21
BLM18PG181SN1

GPPSB_REFCLKP_SB_REFCLKP
GPPSB_REFCLKN_SB_REFCLKN

B9
A9
A8
B8
B7
A7

KBC3_NB_PWRGD#

VSSLT1_VSS
VSSLT2_VSS
VSSLT3_VSS
VSSLT4_VSS
VSSLT5_VSS
VSSLT6_VSS
VSSLT7_VSS

HT_REFCLKP
HT_REFCLKN

E11
F11

CLK1_NBGFX
CLK1_NBGFX#

CRT / TVOUT

SYSRESET#
POWERGOOD
LDTSTOP#
ALLOW_LDTSTOP

C25
C24

LCD3_EDID_CLK
LCD3_EDID_DATA
PEG5_HDMI_CLK
PEG5_HDMI_DATA

R209

VDDA18PCIEPLL1
VDDA18PCIEPLL2

D8
A10
C10
C12

VDDLT18_1_NC
VDDLT18_2_NC
VDDLT33_1_NC
VDDLT33_2_NC

B16
A16
D16
D17

om

C238

2200nF

C273

2200nF

D7
E7

10V

R189
4.7K
1%

VDDA18HTPLL

ht

H17

CLK3_NB14

R186
R185

PLLVDD_NC
PLLVDD18_NC
PLLVSS_NC

VDDLTP18_NC
VSSLTP18_NC

B18
A18
A17
B17
D20
D21
D18
D19

SBD_MEM / DVO_I/F

1K
1%
D

10V

P1.1V

R583

10K
1%

CPU1_LDTSTP#
CPU1_LDTREQ#
CPU1_ALL_LDTSTP

RHU002N06
Q27

R210

P1.8V

10V

LCD1_ADATA0
LCD1_ADATA0#
LCD1_ADATA1
LCD1_ADATA1#
LCD1_ADATA2
LCD1_ADATA2#

yc

nostuff
P3.3V

C237

0
0
0

2200nF-X5R

R201
R200
R585

NC_33
NC_34
NC_35
NC_36

NC_9

A12
D14
B12

6.3V

C239
22000nF-X5R

nostuff
CPU1_LDTRST#
PLT3_RST#
CHP3_NB_PWRGD

DAC_HSYNC_PWM_GPIO4
DAC_VSYNC_PWM_GPIO6
NC_7
NC_8

715 1% G14

B19
B20
B25

NC_25
NC_26
NC_27
NC_28
NC_29
NC_30
NC_31
NC_32

//
m

P1.8V

C582
2200nF-X5R
10V

NC_4
VSS35
NC_5
VSS36
NC_6
VSS37

LVTM

140 1%
150 1%
150 1%

R169
R175
R166

B511
BLM18PG181SN1

NC_1
NC_2
NC_3

A11
B11
F8
E8

CRT3_HSYNC
CRT3_VSYNC
CRT3_DDCCLK
CRT3_DDCDATA
R177

A22
B22
A21
B21
B20
A20
A19
B19

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
E17
F17
F15

G18
G17
E18
F18
E19
F19

P1.1V

301 1%

nostuff

PLL PWR

0.012nF 50V
0.012nF 50V
0.012nF 50V

C224
C225
C214

R176

NC_17
NC_18
NC_19
NC_20
NC_21
NC_22
NC_23
NC_24

PM

CRT3_RED
CRT3_GREEN
CRT3_BLUE

3/5

AVDD1_NC
AVDD2_NC
AVDDDI_NC
AVSSDI_NC
AVDDQ_NC
AVSSQ_NC

CLOCKs

B27
BLM18PG181SN1 C281

tp
:

P1.8V

PAGE

16

OF

49

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN

SRP Sheet Number: 16 of 55

SAMSUNG PROPRIETARY

RS780MN(3/3)

P1.1V
VCC_NB
C269

C267

C265

C272

C271

100nF
10V

100nF
10V

1000nF-X5R
6.3V

1000nF-X5R
6.3V

4700nF
6.3V

P1.1V

R838

U507-5
216-0674026

100nF
10V

C204

C209

C208

C207

10000nF
6.3V

100nF
10V

100nF
10V

100nF
10V

P1.2V

R839
0

C200

C211

C213

C203

C223

4700nF-X7R
6.3V

100nF
10V

100nF
10V

100nF
10V

100nF
10V

P1.8V

B23
CIC21J601NE
C278
22000nF-X5R
20%
6.3V

C257

C277

C256

C264

C262

C263

4700nF-X7R
6.3V

4700nF-X7R
6.3V

100nF
10V

100nF
10V

100nF
10V

100nF
10V

P1.8V

C266
1000nF-X5R
6.3V

10000nF-X5R
6.3V

C234

C236

C253

C252

100nF
10V

100nF
10V

100nF
10V

100nF
10V

5/5
VDDPCIE_1
VDDPCIE_2
VDDPCIE_3
VDDPCIE_4
VDDPCIE_5
VDDPCIE_6
VDDPCIE_7
VDDPCIE_8
VDDPCIE_9
VDDPCIE_10
VDDPCIE_11
VDDPCIE_12
VDDPCIE_13
VDDPCIE_14
VDDPCIE_15
VDDPCIE_16
VDDPCIE_17

VDDHT_1
VDDHT_2
VDDHT_3
VDDHT_4
VDDHT_5
VDDHT_6
VDDHT_7

A6
B6
C6
D6
E6
F6
G7
H8
J9
K9
M9
L9
P9
R9
T9
V9
U9

A25
D23
E22
G22
G24
G25
H19
J22
L17
L22
L24
L25
M20
N22
P20
R19
R22
R24
R25
H20
U22
V19
W22
W24
W25
Y21
AD25

VSSAHT1
VSSAHT2
VSSAHT3
VSSAHT4
VSSAHT5
VSSAHT6
VSSAHT7
VSSAHT8
VSSAHT9
VSSAHT10
VSSAHT11
VSSAHT12
VSSAHT13
VSSAHT14
VSSAHT15
VSSAHT16
VSSAHT17
VSSAHT18
VSSAHT19
VSSAHT20
VSSAHT21
VSSAHT22
VSSAHT23
VSSAHT24
VSSAHT25
VSSAHT26
VSSAHT27

VSSAPCIE1
VSSAPCIE2
VSSAPCIE3
VSSAPCIE4
VSSAPCIE5
VSSAPCIE6
VSSAPCIE7
VSSAPCIE8
VSSAPCIE9
VSSAPCIE10
VSSAPCIE11
VSSAPCIE12
VSSAPCIE13
VSSAPCIE14
VSSAPCIE15
VSSAPCIE16
VSSAPCIE17
VSSAPCIE18
VSSAPCIE19
VSSAPCIE20
VSSAPCIE21
VSSAPCIE22
VSSAPCIE23
VSSAPCIE24
VSSAPCIE25
VSSAPCIE26
VSSAPCIE27
VSSAPCIE28
VSSAPCIE29
VSSAPCIE30
VSSAPCIE31
VSSAPCIE32
VSSAPCIE33
VSSAPCIE34
VSSAPCIE35
VSSAPCIE36
VSSAPCIE37
VSSAPCIE38
VSSAPCIE39
VSSAPCIE40

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
H18
G19
F20
E21
D22
B23
A23

AE25
AD24
AC23
AB22
AA21
Y20
W19
V18
U17
T17
R17
P17
M17
J10
P10
K10
M10
L10
W9
H9
T10
R10
Y9
AA9
AB9
AD9
AE9
U10

F9
G9
AE11
AD11

VDDHTRX_1
VDDHTRX_2
VDDHTRX_3
VDDHTRX_4
VDDHTRX_5
VDDHTRX_6
VDDHTRX_7

VDDHTTX_1
VDDHTTX_2
VDDHTTX_3
VDDHTTX_4
VDDHTTX_5
VDDHTTX_6
VDDHTTX_7
VDDHTTX_8
VDDHTTX_9
VDDHTTX_10
VDDHTTX_11
VDDHTTX_12
VDDHTTX_13

VDDA18PCIE_1
VDDA18PCIE_2
VDDA18PCIE_3
VDDA18PCIE_4
VDDA18PCIE_5
VDDA18PCIE_6
VDDA18PCIE_7
VDDA18PCIE_8
VDDA18PCIE_9
VDDA18PCIE_10
VDDA18PCIE_11
VDDA18PCIE_12
VDDA18PCIE_13
VDDA18PCIE_14
VDDA18PCIE_15

VDD18_1
VDD18_2
VDD18_MEM1_NC
VDD18_MEM2_NC

VDDC_1
VDDC_2
VDDC_3
VDDC_4
VDDC_5
VDDC_6
VDDC_7
VDDC_8
VDDC_9
VDDC_10
VDDC_11
VDDC_12
VDDC_13
VDDC_14
VDDC_15
VDDC_16
VDDC_17
VDDC_18
VDDC_19
VDDC_20
VDDC_21
VDDC_22

u/
x/

100nF
10V

C233

10000nF-X5R
6.3V

p.
s

100nF
10V

C250

100nF
10V

K12
J14
U16
J11
K15
M12
L14
L11
M13
M15
N12
N14
P11
P13
P14
R12
R15
T11
T15
U12
T14
J16

om

4700nF-X7R
6.3V

C258

100nF
10V

L12
M14
N13
P12
P15
R11
R14
T12
U14
U11
U15
V12
W11
W15
AC12
AA14
Y18
AB11
AB15
AB17
AB19
AE20
AB21
K11

yc

C229

C251

100nF
10V

//
m

C235

POWER

C228

VDD_MEM1_NC
VDD_MEM2_NC
VDD_MEM3_NC
VDD_MEM4_NC
VDD_MEM5_NC
VDD_MEM6_NC

tp
:

C202

J17
K16
L16
M16
P16
R16
T16

C254

VDD33_1_NC
VDD33_2_NC

AE10
AA11
Y11
AD10
AB10
AC10
H11
H12

VSS11
VSS12
VSS13
VSS14
VSS15
VSS16
VSS17
VSS18
VSS19
VSS20
VSS21
VSS22
VSS23
VSS24
VSS25
VSS26
VSS27
VSS28
VSS29
VSS30
VSS31
VSS32
VSS33
VSS34

VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
VSS10

A2
B1
D3
D5
E4
G1
G2
G4
H7
J4
R7
L1
L2
L4
L7
M6
N4
P6
R1
R2
R4
V7
U4
V8
V6
W1
W2
W4
W7
W8
Y6
AA4
AB5
AB1
AB7
AC3
AC4
AE1
AE4
AB2

AE14
D11
G8
E14
E15
J15
J12
K14
M11
L15

ht

0904-002431

GROUND

THIS DOCUMENT CONTAINS CONFIDENTIAL


PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

P3.3V

C287

R203
C291

100nF
10V

100nF
10V

A
DRAW

DATE

HS CHO
CHECK

11/26/2007

SAMSUNG

DRESDEN-INT

DEV. STEP

HS LEE / BM LEE
APPROVAL

MP(PR)
REV

1.00

YB CHUN
MODULE CODE

TITLE

ELECTRONICS

MAIN
PART NO.

RS780MN 3/3

BA41-01024~6A

LAST EDIT

December 24, 2008 14:36:53 PM

4
COM-22C-015(1996.6.5) REV. 3

PAGE

17

OF

49

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN

SRP Sheet Number: 17 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

DDR SO-DIMM #0
Height : 5.2mm (Reverse)

D
MEM1_ADQ(63:0)

DDR500-1
DDR2-SODIMM-200P-RVS

CLK1_MCLK0#
CLK1_MCLK1

C108
0.0015nF

CLK1_MCLK1#

MEM1_CS0#
MEM1_CS1#

0.0015nF
50V

50V

MEM1_CKE0
MEM1_CKE1
MEM1_ACAS#
MEM1_ARAS#
MEM1_AWE#
10K 1%
R86
10K 1%
R85
SMB3_CLK
SMB3_DATA
MEM1_ODT0
MEM1_ODT1
MEM1_ADM(7:0)

MEM1_ADQS(7:0)

MEM1_ADQS#(7:0)

P1.8V_AUX

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
107
106

110
115

30
32
164
166
79
80

113
108
109
198
200
197
195
114
119

0
1
2
3
4
5
6
7

10
26
52
67
130
147
170
185

0
1
2
3
4
5
6
7

13
31
51
70
131
148
169
188

0
1
2
3
4
5
6
7

11
29
49
68
129
146
167
186

BA0
BA1

S0*
S1*

CK0
CK0*
CK1
CK1*
CKE0
CKE1

CAS*
RAS*
WE*
SA0
SA1
SCL
SDA

ODT0
ODT1
DM0
DM1
DM2
DM3
DM4
DM5
DM6
DM7

DQS0
DQS1
DQS2
DQS3
DQS4
DQS5
DQS6
DQS7

DQS*0
DQS*1
DQS*2
DQS*3
DQS*4
DQS*5
DQS*6
DQS*7

u/
x/

DDR500-2
DDR2-SODIMM-200P-RVS

2/2

P3.3V

C564

100nF
10V

C563

112
111
117
96
95
118
81
82
87
103
88
104

p.
s

C198

DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63

2200nF
10V

199

om

CLK1_MCLK0

ME POWER RAIL UNDER ME ENABLE

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63

83
120
50
69
163

MCH3_EXTTS0#

MEM1_VREF

yc

MEM1_ABS(0)
MEM1_ABS(1)

A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10_AP
A11
A12
A13
A14
A15
A16_BA2

5
7
17
19
4
6
14
16
23
25
35
37
20
22
36
38
43
45
55
57
44
46
56
58
61
63
73
75
62
64
74
76
123
125
135
137
124
126
134
136
141
143
151
153
140
142
152
154
157
159
173
175
158
160
174
176
179
181
189
191
180
182
192
194

C282

C283

100nF
10V

1nF

201
202

50V

47
133
183
77
12
48
184
78
71
72
121
122
196
193
8

//
m

102
101
100
99
98
97
94
92
93
91
105
90
89
116
86
84
85

tp
:

MEM1_ABS(2)

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

ht

MEM1_AMA(15:0)

1/2

VDD1
VDD2
VDD3
VDD4
VDD5
VDD6
VDD7
VDD8
VDD9
VDD10
VDD11
VDD12

VDDSPD
NC1
NC2
NC3
NC4
NCTEST
VREF

GND0
GND1

VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
VSS10
VSS11
VSS12
VSS13
VSS14
VSS15

VSS16
VSS17
VSS18
VSS19
VSS20
VSS21
VSS22
VSS23
VSS24
VSS25
VSS26
VSS27
VSS28
VSS29
VSS30
VSS31
VSS32
VSS33
VSS34
VSS35
VSS36
VSS37
VSS38
VSS39
VSS40
VSS41
VSS42
VSS43
VSS44
VSS45
VSS46
VSS47
VSS48
VSS49
VSS50
VSS51
VSS52
VSS53
VSS54
VSS55
VSS56
VSS57

18
24
41
53
42
54
59
65
60
66
127
139
128
145
165
171
172
177
187
178
190
9
21
33
155
34
132
144
156
168
2
3
15
27
39
149
161
28
40
138
150
162

3709-001341

3709-001341

Tyco/Foxcn : 3709-001341
Suyin : 3709-001502

SAMSUNG
ELECTRONICS

SRP Sheet Number: 18 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

DDR SO-DIMM #1
Height : 9.2mm (Reverse)

D
MEM1_BDQ(63:0)
ME POWER RAIL UNDER ME ENABLE

DDR501-1
DDR2-SODIMM-200P-RVS
102
101
100
99
98
97
94
92
93
91
105
90
89
116
86
84
85

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15

C98

30
32
164
166
79
80

MEM1_CKE2
MEM1_CKE3

0.0015nF
50V

CLK1_MCLK3#
P3.3V

MEM1_BCAS#
MEM1_BRAS#
MEM1_BWE#
10K
R87
10K
R88
SMB3_CLK
SMB3_DATA
MEM1_ODT2
MEM1_ODT3
MEM1_BDM(7:0)

DDR501-2
DDR2-SODIMM-200P-RVS

2/2

198
200
197
195

1%
1%

114
119

0
1
2
3
4
5
6
7

10
26
52
67
130
147
170
185

0
1
2
3
4
5
6
7

13
31
51
70
131
148
169
188

0
1
2
3
4
5
6
7

11
29
49
68
129
146
167
186

CK0
CK0*
CK1
CK1*
CKE0
CKE1

CAS*
RAS*
WE*
SA0
SA1
SCL
SDA

ODT0
ODT1
DM0
DM1
DM2
DM3
DM4
DM5
DM6
DM7

DQS0
DQS1
DQS2
DQS3
DQS4
DQS5
DQS6
DQS7

ht

MEM1_BDQS(7:0)

113
108
109

S0*
S1*

MEM1_BDQS#(7:0)

DQS*0
DQS*1
DQS*2
DQS*3
DQS*4
DQS*5
DQS*6
DQS*7

C73

C74

100nF
10V

VDD1
VDD2
VDD3
VDD4
VDD5
VDD6
VDD7
VDD8
VDD9
VDD10
VDD11
VDD12

u/
x/

P3.3V

112
111
117
96
95
118
81
82
87
103
88
104

2200nF
10V

p.
s

110
115

BA0
BA1

tp
:

CLK1_MCLK2#
CLK1_MCLK3

0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63

MCH3_EXTTS1#

om

107
106

MEM1_CS2#
MEM1_CS3#

0.0015nF
50V

5
7
17
19
4
6
14
16
23
25
35
37
20
22
36
38
43
45
55
57
44
46
56
58
61
63
73
75
62
64
74
76
123
125
135
137
124
126
134
136
141
143
151
153
140
142
152
154
157
159
173
175
158
160
174
176
179
181
189
191
180
182
192
194

199

83
120
50
69
163
1

MEM1_VREF

C284

C288

100nF
10V

1nF
50V

yc

MEM1_BBS(2)

C222

DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
DQ32
DQ33
DQ34
DQ35
DQ36
DQ37
DQ38
DQ39
DQ40
DQ41
DQ42
DQ43
DQ44
DQ45
DQ46
DQ47
DQ48
DQ49
DQ50
DQ51
DQ52
DQ53
DQ54
DQ55
DQ56
DQ57
DQ58
DQ59
DQ60
DQ61
DQ62
DQ63

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

MEM1_BBS(0)
MEM1_BBS(1)
CLK1_MCLK2

A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10_AP
A11
A12
A13
A14
A15
A16_BA2

//
m

P1.8V_AUX

1/2

MEM1_BMA(15:0)

201
202

47
133
183
77
12
48
184
78
71
72
121
122
196
193
8

VDDSPD

NC1
NC2
NC3
NC4
NCTEST
VREF

GND0
GND1

VSS1
VSS2
VSS3
VSS4
VSS5
VSS6
VSS7
VSS8
VSS9
VSS10
VSS11
VSS12
VSS13
VSS14
VSS15

VSS16
VSS17
VSS18
VSS19
VSS20
VSS21
VSS22
VSS23
VSS24
VSS25
VSS26
VSS27
VSS28
VSS29
VSS30
VSS31
VSS32
VSS33
VSS34
VSS35
VSS36
VSS37
VSS38
VSS39
VSS40
VSS41
VSS42
VSS43
VSS44
VSS45
VSS46
VSS47
VSS48
VSS49
VSS50
VSS51
VSS52
VSS53
VSS54
VSS55
VSS56
VSS57

18
24
41
53
42
54
59
65
60
66
127
139
128
145
165
171
172
177
187
178
190
9
21
33
155
34
132
144
156
168
2
3
15
27
39
149
161
28
40
138
150
162

3709-001529

3709-001529

Foxcn : 3709-001390
Suyin : 3709-001503

SAMSUNG
ELECTRONICS

SRP Sheet Number: 19 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

SODIMM TERMINATION

D
P0.9V

P0.9V
P1.8V_AUX

P1.8V_AUX
0
1
2
3

R127
R133
R130
R129

47
47
47
47

4
5
6
7

R137
R140
R134
R145

47
47
47
47

8
9
10
11

R136
R144
R126
R141

47
47
47
47

C118

MEM1_BMA(15:0)

100nF

10V

C147
100nF
10V

C125

10V

100nF
10V

C128
C185

P1.8V_AUX

100nF

10V

100nF
10V

MEM1_ODT0
MEM1_ODT1

47
47

R157
R158

47
47

R109
R104

47
47

C165

100nF

10V

100nF
10V

C120

C117

P1.8V_AUX

100nF

10V

100nF
10V

P1.8V_AUX

C124
C158

100nF

10V

100nF
10V

R120
R121
R153

MEM1_ACAS#
MEM1_ARAS#
MEM1_AWE#

R112
R117
R116

47
47
47

C142
C123

P1.8V_AUX

100nF

10V

100nF
10V

47
47
47

P0.9V

C140
C172

MEM1_CS2#
MEM1_CS3#

MEM1_CKE2
MEM1_CKE3

MEM1_ODT2
MEM1_ODT3

10V

10V

10V

nostuff
nostuff
nostuff
nostuff
nostuff

ht

100nF 100nF 100nF 100nF 100nF


10V

8
9
10
11

R138
R150
R124
R139

47
47
47
47

12
13
14
15

R146
R106
R151
R147

47
47
47
47

R111
R101

47
47

R152
R156

47
47

R102
R110

47
47

C146

C110

100nF

10V

100nF
10V

C129

C187

P1.8V_AUX
100nF

10V

100nF
10V

C109

C131

P1.8V_AUX
100nF

C143

C160

10V

100nF
10V

P1.8V_AUX
100nF

10V

100nF
10V

C154

P1.8V_AUX
100nF

10V

100nF
10V

MEM1_BBS(0)
MEM1_BBS(1)
MEM1_BBS(2)

R122
R119
R155

MEM1_BCAS#
MEM1_BRAS#
MEM1_BWE#

R114
R115
R118

P1.8V_AUX

10V

47
47
47
47

100nF
10V

C169

47
47
47

C132

P1.8V_AUX
100nF

10V

100nF
10V

P1.8V_AUX

100nF

100nF
10V

C194 C141 C186 C166 C152

10V

R135
R142
R132
R143

100nF

10V

C159

C178

tp
:

MEM1_ABS(0)
MEM1_ABS(1)
MEM1_ABS(2)

p.
s

R113
R108

C151

om

MEM1_CKE0
MEM1_CKE1

47
47
47
47

4
5
6
7

C153

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
C190

yc

MEM1_CS0#
MEM1_CS1#

R148
R105
R154
R149

47
47
47
47

P1.8V_AUX

//
m

12
13
14
15

R123
R131
R125
R128

P1.8V_AUX
100nF

P1.8V_AUX

0
1
2
3

u/
x/

MEM1_AMA(15:0)

C170

47
47
47

C179

P1.8V_AUX
100nF

10V

100nF
10V

P0.9V

C171

C167

C139

C130

C168

C580

C579

C137

100nF
10V

100nF
10V

100nF
10V

100nF
10V

100nF
10V

100nF
10V

100nF
10V

100nF
10V

C126 C119 C149 C173 C148

100nF 100nF 100nF 100nF 100nF


10V

10V

10V

10V

10V

nostuff
nostuff
nostuff
nostuff
nostuff

Place near SO-DIMM0

Place near SO-DIMM1

SAMSUNG
ELECTRONICS

4
COM-22C-015(1996.6.5) REV. 3

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN

SRP Sheet Number: 20 of 55

SAMSUNG PROPRIETARY

SB700(1/4)
U514-1
SB700

P17
M18
M23
M22
J19
J18

L20
L19
M19
M20
N22
P22

P1.8V

L18
nostuff

R182

J21

301
1%

J20

20M

2801-003856

U510
32.768KHz

CPU1_ALL_LDTSTP
CPU1_PROCHOT#
CPU1_PWRGDCPU
CPU1_LDTSTP#
CPU1_LDTRST#

B3

R248

0
5%

F23
F24
F22
G25
G24

PCIE_PVDD
PCIE_PVSS

PCIE_RCLKP_NB_LNK_CLKP
PCIE_RCLKN_NB_LNK_CLKN
NB_DISP_CLKP
NB_DISP_CLKN
NB_HT_CLKP
NB_HT_CLKN

CPU_HT_CLKP
CPU_HT_CLKN

SLT_GFX_CLKP
SLT_GFX_CLKN
GPP_CLK0P
GPP_CLK0N
GPP_CLK1P
GPP_CLK1N
GPP_CLK2P
GPP_CLK2N
GPP_CLK3P
GPP_CLK3N

25M_48M_66M_OSC
25M_X1

INTE#_GPIO33
INTF#_GPIO34
INTG#_GPIO35
INTH#_GPIO36

25M_X2
X1
X2

0.033nF 50V

0.022nF 50V

C347

C339

PCI CLKS

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

PCIE_CALRP
PCIE_CALRN

ALLOW_LDTSTP
PROCHOT#
LDT_PG
LDT_STP#
LDT_RST#

RTC

0.018nF

0.018nF
3

R655

C648

A3

C647

P3.3V

for EMC Review PV-13 on 31-Oct-08

PCI3_AD23
PCI3_AD24
PCI3_AD25
PCI3_AD26
PCI3_AD27
PCI3_AD28

CHP3_A_RST#
SPI3_GPIO14

R269

10K

1%

R742

10K

1%

LPCCLK0
LPCCLK1
LAD0
LAD1
LAD2
LAD3
LFRAME#
LDRQ0#
LDRQ1#_GNT5#_GPIO68
BMREQ#_REQ5#_GPIO65
SERIRQ
RTCCLK
INTRUDER_ALERT#
VBAT

P3.3V

KBC3_CPURST#
KBC3_A20G

R274

10K

R277

10K 1%

nostuff

100nF
10V

U513
7SZ08

PEX3_RST#

PLT3_RST#

R685

R688
100K
1%

PRTC_BAT

nostuff
nostuff

PCI3_CLKRUN#

R682

C670

1M
1%

1000nF-X5R

R252
R245

0
1
2
3

22
22

LPC3_CLK0
LPC3_CLK1
LPC3_LAD(3:0)

R696

CHP3_RTCRST#

LPC3_LFRAME#

B
P3.3V_MICOM

J512
HDR-2P-SMD

510

3
4

1%

C685

C689

100nF
10V

1000nF
6.3V

1
2
MNT1
MNT2
3711-000541

Note: These RTC related Materials and TPs should be placed


on the bottom side
CHP3_SERIRQ

CHP3_RTCCLK
CHP3_INTRUDER#
CHP3_RTCRST#

SAMSUNG
ELECTRONICS

0904-002409

1%

C662

CHP3_INTRUDER#

C3
C2
B2

PCI3_CLKRUN#

LPC option ; These are used with LPC

P3.3V_MICOM

AD3
AC4
AE2
AE3

G22
E22
H24
H23
J25
J24
H25
H22
AB8
AD7
V15

CHP3_SERIRQ

K23
K22
M24
M25

nostuff
nostuff

N25
N24

CLK1_SBSRC
CLK1_SBSRC#

BAT54C
D13

P25

CLK3_PCLKMICOM
CLK3_DBGLPC
PCI3_CLK2
PCI3_CLK3
PCI3_CLK4
PCI3_CLK5

P24

C673

1%
1%
1%
1%
1%
1%

u/
x/

1%

2.05k ohm

1000nF-X5R
6.3V

10000NF
10V

T25
T24

U2
P7
V4
T1
V3
U1
V1
V2
T2
W1
T9
R6
R7
R5
U8
U5
Y7
W8
V9
Y8
AA8
Y4
Y3
Y2
AA2
AB4
AA1
AB3
AB2
AC1
AC2
AD1
W2
U7
AA7
Y1
AA6
W5
AA5
Y5
U6
W6
W4
V7
AC3
AD4
AB7
AE6
AB6
AD2
AE4
AD5
AC6
AE5
AD6
V5

22.6
22.6
22.6
22.6
22.6
22.6

nostuff
nostuff

p.
s

2K

N1

yc

C674

R266

AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
AD8
AD9
AD10
AD11
AD12
AD13
AD14
AD15
AD16
AD17
AD18
AD19
AD20
AD21
AD22
AD23
AD24
AD25
AD26
AD27
AD28
AD29
AD30
AD31
CBE0#
CBE1#
CBE2#
CBE3#
FRAME#
DEVSEL#
IRDY#
TRDY#
PAR
STOP#
PERR#
SERR#
REQ0#
REQ1#
REQ2#
REQ3#_GPIO70
REQ4#_GPIO71
GNT0#
GNT1#
GNT2#
GNT3#_GPIO72
GNT4#_GPIO73
CLKRUN#
LOCK#

R265
R262
R693
R697
R703
R699

P4
P3
P1
P2
T4
T3

//
m

B517
BLM18PG181SN1

562
1%

PCI INTERFACE

P1.2V

R273

LPC

P1.2V

PCIE_RX0P
PCIE_RX0N
PCIE_RX1P
PCIE_RX1N
PCIE_RX2P
PCIE_RX2N
PCIE_RX3P
PCIE_RX3N

PCIRST#

CLOCK GENERATOR

U22
U21
U19
V19
R20
R21
R18
R17

PEX1_SB_RXP(0)
PEX1_SB_RXN(0)
PEX1_SB_RXP(1)
PEX1_SB_RXN(1)
PEX1_SB_RXP(2)
PEX1_SB_RXN(2)
PEX1_SB_RXP(3)
PEX1_SB_RXN(3)

PCIE_TX0P
PCIE_TX0N
PCIE_TX1P
PCIE_TX1N
PCIE_TX2P
PCIE_TX2N
PCIE_TX3P
PCIE_TX3N

PCICLK0
PCICLK1
PCICLK2
PCICLK3
PCICLK4
PCICLK5_GPIO41

tp
:

V23
V22
V24
V25
U25
U24
T23
T22

10V
10V
10V
10V
10V
10V
10V
10V

PCI EXPRESS INTERFACE

100nF
100nF
100nF
100nF
100nF
100nF
100nF
100nF

1/5

A_RST#

ht

C707
C709
C706
C697
C692
C698
C683
C691

PEX1_SB_TXP(0)
PEX1_SB_TXN(0)
PEX1_SB_TXP(1)
PEX1_SB_TXN(1)
PEX1_SB_TXP(2)
PEX1_SB_TXN(2)
PEX1_SB_TXP(3)
PEX1_SB_TXN(3)

N2

RTC XTAL

33
1%

CPU

R694

CHP3_A_RST#

om

THIS DOCUMENT CONTAINS CONFIDENTIAL


PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

SRP Sheet Number: 21 of 55

SAMSUNG PROPRIETARY

SB700(2/4)
D

U514-2
SB700
SAT1_TXP0
SAT1_TXN0

AC10
AB10

SAT1_RXP0
SAT1_RXN0

AE10
AD10

SAT1_TXP1
SAT1_TXN1

AE11
AD11

AE15
AD15

AB16
AC16

AD16
AE16

SATA_RX3P
SATA_RX3N
SATA_TX4P
SATA_TX4N

SATA_RX4P
SATA_RX4N

SATA_TX5P
SATA_TX5N

SATA_RX5P
SATA_RX5N

SPI_DI_GPIO12
SPI_DO_GPIO11
SPI_CLK_GPIO47
SPI_HOLD#_GPIO31
SPI_CS#_GPIO32

LAN_RST#_GPIO13
ROM_RST#_GPIO14

10M

V12

1K
1%

Y12

AA12

C725

P3.3V

W11

R276
10K
1%

AA11

C738

C726

1000nF-X5R
6.3V

1000nF-X5R
6.3V

P3.3V
B35
BLM18PG181SN1

C729

C359

1000nF-X5R
6.3V

SATA_X2

SATA_ACT#_GPIO67

W12

PLLVDD_SATA

tp
:

B520
BLM18PG181SN1

100nF
10V

ht

P1.2V

CHP3_SATALED#

SATA_X1

//
m

0.01nF

SATA_CAL

XTLVDD_SATA

H/W MONITOR

R736

yc

R270

Y5021
25MHz

SATA PWR

0.01nF

AD24
AD23
AE22
AC22
AD21
AE20
AB20
AD19
AE19
AC20
AD20
AE21
AB22
AD22
AE23
AC23

u/
x/

AE14
AD14

SATA_TX3P
SATA_TX3N

IDE_D0_GPIO15
IDE_D1_GPIO16
IDE_D2_GPIO17
IDE_D3_GPIO18
IDE_D4_GPIO19
IDE_D5_GPIO20
IDE_D6_GPIO21
IDE_D7_GPIO22
IDE_D8_GPIO23
IDE_D9_GPIO24
IDE_D10_GPIO25
IDE_D11_GPIO26
IDE_D12_GPIO27
IDE_D13_GPIO28
IDE_D14_GPIO29
IDE_D15_GPIO30

p.
s

AC14
AB14

SATA_RX2P
SATA_RX2N

SPI ROM

AD13
AE13

SATA_TX2P
SATA_TX2N

om

AD12
AE12

C724

SATA_TX1P
SATA_TX1N
SATA_RX1P
SATA_RX1N

IDE_IORDY
IDE_IRQ
IDE_A0
IDE_A1
IDE_A2
IDE_DACK#
IDE_DRQ
IDE_IOR#
IDE_IOW#
IDE_CS1#
IDE_CS3#

AA24
AA25
Y22
AB23
Y23
AB24
AD25
AC25
AC24
Y25
Y24

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
AB12
AC12

SATA_TX0P
SATA_TX0N
SATA_RX0P
SATA_RX0N

SERIAL ATA

SAT1_RXP1
SAT1_RXN1

2/5

ATA 66/100/133

AD9
AE9

FANOUT0_GPIO3
FANOUT1_GPIO48
FANOUT2_GPIO49
FANIN0_GPIO50
FANIN1_GPIO51
FANIN2_GPIO52

TEMP_COMM
TEMPIN0_GPIO61
TEMPIN1_GPIO62
TEMPIN2_GPIO63
TEMPIN3_TALERT#_GPIO64
VIN0_GPIO53
VIN1_GPIO54
VIN2_GPIO55
VIN3_GPIO56
VIN4_GPIO57
VIN5_GPIO58
VIN6_GPIO59
VIN7_GPIO60

C356

AVDD

100nF
10V

AVSS

G6
D2
D1
F4
F3

R663
R664

12.1 1%
12.1 1%

R671

12.1 1%

U15
J1

SPI3_MISO
SPI3_MOSI
SPI3_CLK

P3.3V

10K
1%

R249

THIS DOCUMENT CONTAINS CONFIDENTIAL


PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

SPI3_CS0#

SPI3_GPIO14

M8
M5
M7
P5
P8
R8

C6
B6
A6
A5
B5

P3.3V_AUX

R234

A4
B4
C4
D4
D5
D6
A7
B7

20K

1%

P3.3V_AUX

F6

R237

G7

R253

0904-002409

SAMSUNG
ELECTRONICS

SRP Sheet Number: 22 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

SB700(3/4)

D
P3.3V
U514-5
SB700

C344

C343

C346

C345

C342

22000nF-X5R
20%
6.3V

1000nF-X5R
6.3V

1000nF-X5R
6.3V

1000nF-X5R
6.3V

1000nF-X5R
6.3V

100nF
10V

100nF
10V

AA14
AA15
AA17
AB18
AC18
AD17
AE17

nostuff
P1.2V

C723

C357

C362

C361

C358

22000nF-X5R
20%
6.3V

1000nF-X5R
6.3V

1000nF-X5R
6.3V

100nF
10V

100nF
10V

P3.3V_AUX
B514
BLM18PG181SN1
C642

C637

C321

C329

C323

C320

C325

10000NF
10V

10000NF
10V

1000nF-X5R
6.3V

1000nF-X5R
6.3V

100nF
10V

100nF
10V

100nF
10V

A16
B16
C16
D16
D17
E17
F15
F17
F18
G15
G17
G18

AVDD_SATA_1
AVDD_SATA_2
AVDD_SATA_3
AVDD_SATA_4
AVDD_SATA_5
AVDD_SATA_6
AVDD_SATA_7
AVDDTX_0
AVDDTX_1
AVDDTX_2
AVDDTX_3
AVDDTX_4
AVDDTX_5
AVDDRX_0
AVDDRX_1
AVDDRX_2
AVDDRX_3
AVDDRX_4
AVDDRX_5
0904-002409

CKVDD_1.2V_1
CKVDD_1.2V_2
CKVDD_1.2V_3
CKVDD_1.2V_4
S5_3.3V_1
S5_3.3V_2
S5_3.3V_3
S5_3.3V_4
S5_3.3V_5
S5_3.3V_6
S5_3.3V_7

S5_1.2V_1
S5_1.2V_2

A17
A24
B17
J4
J5
L1
L2

G2
G4

USB_PHY_1.2V_1
USB_PHY_1.2V_2

V5_VREF
AVDDCK_3.3V
AVDDCK_1.2V
AVDDC

C660

C337

C340

10000NF
10V

10000NF
10V

22000nF-X5R
20%
6.3V

u/
x/

CORE S0

PCIE_VDDR_1
PCIE_VDDR_2
PCIE_VDDR_3
PCIE_VDDR_4
PCIE_VDDR_5
PCIE_VDDR_6
PCIE_VDDR_7

ht

B519
BLM18PG181SN1

C661

C333

1000nF
16V

1000nF
16V

P3.3V_AUX

P1.2V_AUX

A10
B10

C332

C331

1000nF-X5R
6.3V

1000nF-X5R
6.3V

AE7
J16
K17
E9

2200nF
10V

C318

C668

100nF
10V

100nF
10V

22000nF-X5R
20%
6.3V

P1.2V_AUX

P3.3V

C646

C643

C638

100nF
10V

100nF
10V

22000nF-X5R
6.3V

C727

P3.3V P1.2V

C328

C319

1000nF-X5R
6.3V

B516
B34
C654 BLM18PG181SN1
2200nF

P5.0V

BAT54A
D517

C341

100nF
10V

yc

C677

P18
P19
P20
P21
R22
R24
R25

C334

100nF
10V

L21
L22
L24
L25

//
m

B518
BLM18PG181SN1

VDD33_18_1
VDD33_18_2
VDD33_18_3
VDD33_18_4

C335

P1.2V

3.3V_S5 I/O CLKGEN I/O

P1.2V

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
VDD_1
VDD_2
VDD_3
VDD_4
VDD_5
VDD_6
VDD_7
VDD_8
VDD_9

L15
M12
M14
N13
P12
P14
R11
R15
T16

POWER

CORE S5

Y20
AA21
AA22
AE25

PLL

P3.3V

VDDQ_1
VDDQ_2
VDDQ_3
VDDQ_4
VDDQ_5
VDDQ_6
VDDQ_7
VDDQ_8
VDDQ_9
VDDQ_10
VDDQ_11
VDDQ_12

tp
:

100nF
10V

PCI/GPIO I/O

C348

100nF
10V

IDE/FLASH

C349

100nF
10V

A-LINK I/O

C350

SATA I/O

C351
1000nF-X5R
6.3V

USB I/O

C355
1000nF-X5R
6.3V

P1.2V

3/5

AVSS_SATA_1
AVSS_SATA_2
AVSS_SATA_3
AVSS_SATA_4
AVSS_SATA_5
AVSS_SATA_6
AVSS_SATA_7
AVSS_SATA_8
AVSS_SATA_9
AVSS_SATA_10
AVSS_SATA_11
AVSS_SATA_12
AVSS_SATA_13
AVSS_SATA_14
AVSS_SATA_15
AVSS_SATA_16
AVSS_SATA_17
AVSS_SATA_18
AVSS_SATA_19
AVSS_SATA_20

R737
1K
1%

A15
B15
C14
D8
D9
D11
D13
D14
D15
E15
F12
F14
G9
H9
H17
J9
J11
J12
J14
J15
K10
K12
K14
K15

H18
J17
J22
K25
M16
M17
M21
P16
F9

10V

AVSS_USB_1
AVSS_USB_2
AVSS_USB_3
AVSS_USB_4
AVSS_USB_5
AVSS_USB_6
AVSS_USB_7
AVSS_USB_8
AVSS_USB_9
AVSS_USB_10
AVSS_USB_11
AVSS_USB_12
AVSS_USB_13
AVSS_USB_14
AVSS_USB_15
AVSS_USB_16
AVSS_USB_17
AVSS_USB_18
AVSS_USB_19
AVSS_USB_20
AVSS_USB_21
AVSS_USB_22
AVSS_USB_23
AVSS_USB_24
PCIE_CK_VSS_1
PCIE_CK_VSS_2
PCIE_CK_VSS_3
PCIE_CK_VSS_4
PCIE_CK_VSS_5
PCIE_CK_VSS_6
PCIE_CK_VSS_7
PCIE_CK_VSS_8
AVSSC

P3.3V_AUX

C645

C640

100nF
10V

2200nF
10V

B515
BLM18PG181SN1

5/5

GROUND

U514-3
SB700
L9
M9
T15
U9
U16
U17
V8
W7
Y6
AA4
AB5
AB21

1000nF-X5R
6.3V

C352

1000nF-X5R
6.3V

C722

1000nF-X5R
6.3V

p.
s

C336

22000nF-X5R
6.3V

om

C718

T10
U10
U11
U12
V11
V14
W9
Y9
Y11
Y14
Y17
AA9
AB9
AB11
AB13
AB15
AB17
AC8
AD8
AE8

VSS_1
VSS_2
VSS_3
VSS_4
VSS_5
VSS_6
VSS_7
VSS_8
VSS_9
VSS_10
VSS_11
VSS_12
VSS_13
VSS_14
VSS_15
VSS_16
VSS_17
VSS_18
VSS_19
VSS_20
VSS_21
VSS_22
VSS_23
VSS_24
VSS_25
VSS_26
VSS_27
VSS_28
VSS_29
VSS_30
VSS_31
VSS_32
VSS_33
VSS_34
VSS_35
VSS_36
VSS_37
VSS_38
VSS_39
VSS_40
VSS_41
VSS_42
VSS_43
VSS_44
VSS_45
VSS_46
VSS_47
VSS_48
VSS_49
VSS_50

PCIE_CK_VSS_9
PCIE_CK_VSS_10
PCIE_CK_VSS_11
PCIE_CK_VSS_12
PCIE_CK_VSS_13
PCIE_CK_VSS_14
PCIE_CK_VSS_15
PCIE_CK_VSS_16
PCIE_CK_VSS_17
PCIE_CK_VSS_18
PCIE_CK_VSS_19
PCIE_CK_VSS_20
PCIE_CK_VSS_21
AVSSCK

A2
A25
B1
D7
F20
G19
H8
K9
K11
K16
L4
L7
L10
L11
L12
L14
L16
M6
M10
M11
M13
M15
N4
N12
N14
P6
P9
P10
P11
P13
P15
R1
R2
R4
R9
R10
R12
R14
T11
T12
T14
U4
U14
V6
Y21
AB1
AB19
AB25
AE1
AE24

B
P23
R16
R19
T17
U18
U20
V18
V20
V21
W19
W22
W24
W25
L17

0904-002409

SAMSUNG
ELECTRONICS

SRP Sheet Number: 23 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

USB0 and 6 ports should be


connected with external ports

SB700(4/4)

USB0, 2 : Rear Port(Sub board)


USB4 : Express USB
USB5 : Bluetooth
USB6 : Right Port(Sub board)
USB8 : Camera
USB10 : 2-in-1

P3.3V

R241

R233
0

KBC3_PWRGD

nostuff

CHP3_SUSSTAT#
CHP3_SB_TEST2
P3.3V_AUX CHP3_SB_TEST1
CHP3_SB_TEST0
KBC3_A20G
KBC3_CPURST#
R675 KBC3_RUNSCI#
R670
10K
KBC3_EXTSMI#
nostuff 10K
1%
R672

BIOS CRISIS RECOVER STRAP

10K
1%

P1.8V

KBC3_WAKESCI#
EXP3_CPPE#

nostuff
nostuff
nostuff
nostuff
nostuff

HDA3_AUD_BCLK
HDA3_MDC_BCLK
HDA3_AUD_SDO
HDA3_MDC_SDO
HDA3_AUD_SYNC
HDA3_MDC_SYNC
HDA3_AUD_RST#
HDA3_MDC_RST#

B
P3.3V_AUX

10K

SMB3_ALERT#

1K 1%

PEX3_WAKE#

P3.3V

R232

10K

R749

2.2K

R735

10K

1%

R752

10K

1%

R734

2.2K

R753

2.2K

EXP3_CPPE#

R740

USB_FSD13P
USB_FSD13N
USB_FSD12P
USB_FSD12N
USB_HSD11P
USB_HSD11N
USB_HSD10P
USB_HSD10N
USB_HSD9P
USB_HSD9N
USB_HSD8P
USB_HSD8N
USB_HSD7P
USB_HSD7N
USB_HSD6P
USB_HSD6N
USB_HSD5P
USB_HSD5N
USB_HSD4P
USB_HSD4N
USB_HSD3P
USB_HSD3N
USB_HSD2P
USB_HSD2N
USB_HSD1P
USB_HSD1N
USB_HSD0P
USB_HSD0N

E6
E7
F7
E8
H11
J10
E11
F11
A11
B11
C10
D10
G11
H12
E12
E14
C12
D12
B12
A12
G12
G14
H14
H15
A13
B13
B14
A14

22.6
22.6
22.6
22.6

1%
1%
1%
1%

R261
R258
R691
R692

22.6
22.6
22.6
22.6

1%
1%
1%
1%

p.
s

USB3_OC#

P5.0V_AUX

B9
B8
A8
A9
E5
F8
E4

M1
M2
J7
J8
L8
M3
L6
M4
L5

HDA3_AUD_SDI0
HDA3_MDC_SDI1

nostuff
nostuff
nostuff

USB MISC

SATA_IS0#_GPIO10
CLK_REQ3#_SATA_IS1#_GPIO6
SMARTVOLT_SATA_IS2#_GPIO4
CLK_REQ0#_SATA_IS3#_GPIO0
CLK_REQ1#_SATA_IS4#_FANOUT3_GPIO39
CLK_REQ2#_SATA_IS5#_FANIN3_GPIO40
SPKR_GPIO2
SCL0_GPOC0#
SDA0_GPOC1#
SCL1_GPOC2#
SDA1_GPOC3#
DDC1_SCL_GPIO9
DDC1_SDA_GPIO8
LLB#_GPIO66
SHUTDOWN#_GPIO5
DDR3_RST#_GEVENT7#

H19
H20
H21
F25
D22
E24
E25
D23

USB_OC6#_IR_TX1_GEVENT6#
USB_OC5#_IR_TX0_GPM5#
USB_OC4#_IR_RX0_GPM4#
USB_OC3#_IR_RX1_GPM3#
USB_OC2#_GPM2#
USB_OC1#_GPM1#
USB_OC0#_GPM0#
AZ_BITCLK
AZ_SDOUT
AZ_SDIN0_GPIO42
AZ_SDIN1_GPIO43
AZ_SDIN2_GPIO44
AZ_SDIN3_GPIO46
AZ_SYNC
AZ_RST#
AZ_DOCK_RST#_GPM8#

IMC_GPIO0
IMC_GPIO1
SPI_CS2#_IMC_GPIO2
IDE_RST#_F_RST#_IMC_GPO3
IMC_GPIO4
IMC_GPIO5
IMC_GPIO6
IMC_GPIO7

IMC_GPIO8
IMC_GPIO9
IMC_PWM0_IMC_GPIO10
SCL2_IMC_GPIO11
SDA2_IMC_GPIO12
SCL3_LV_IMC_GPIO13
SDA3_LV_IMC_GPIO14
IMC_PWM1_IMC_GPIO15
IMC_PWM2_IMC_GPO16
IMC_PWM3_IMC_GPO17
IMC_GPIO18
IMC_GPIO19
IMC_GPIO20
IMC_GPIO21
IMC_GPIO22
IMC_GPIO23
IMC_GPIO24
IMC_GPIO25
IMC_GPIO26
IMC_GPIO27
IMC_GPIO28
IMC_GPIO29
IMC_GPIO30
IMC_GPIO31
IMC_GPIO32
IMC_GPIO33
IMC_GPIO34
IMC_GPIO35
IMC_GPIO36
IMC_GPIO37
IMC_GPIO38
IMC_GPIO39
IMC_GPIO40
IMC_GPIO41

A18
B18
F21
D21
F19
E20
E21
E19
D19
E18
G20
G21
D25
D24
C25
C24
B25
C23
B24
B23
A23
C22
A22
B22
B21
A21
D20
C20
A20
B20
B19
A19
D18
C18

11.8K
1%

USB3_P10+
USB3_P10USB3_P8+
USB3_P8USB3_P6+
USB3_P6USB3_P5+
USB3_P5USB3_P4+
USB3_P4-

C
USB3_P2+
USB3_P2USB3_P0+
USB3_P0-

CHP3_GPIO16
CHP3_GPIO17

CHP3_BIOS_CRI#

0904-002409

nostuff

nostuff

R242
27K

CHP3_BIOSWP#
USB3_OC#

nostuff
nostuff

2.2K

nostuff

CHP3_SUSSTAT#

R687
R264
R683
R684

//
m

2.2K

tp
:

R656

ht

0.01nF
50V

yc

C675

50V

om

SMB3_ALERT#

nostuff

C641
47nF

10K 1%
10K 1%
10K 1%

4.7K
1%

1
3

CHP3_BIOSWP#

R259
R246
R263

1
3

R650

R668

10K
1%

AUD3_SPKR
SMB3_CLK
SMB3_DATA

P3.3V_AUX
D513
BAV99LT1

D514
BAV99LT1

AE18
AD18
AA19
W17
V17
W20
W21
AA18
W18
K1
K2
AA20
Y18
C1
Y19
G5

R658
nostuff

CHP1_THRMTRIP#

USB 2.0

nostuff

KBC3_RSMRST#

CHP3_NB_PWRGD

INTEGRATED uC

PEX3_WAKE#
Q510
MMBT3906LT1

1%
0

R669

GPIO

1%

CLK3_USB48
R238

USB OC

300

100

HD AUDIO

R197

R657

USBCLK_14M_25M_48M_OSC
USB_RCOMP

C8
G8

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
nostuff

( Put it a debugger connector)

INTEGRATED Uc

PLACE NEAR KEYBOARD

PCI_PME#_GEVENT4#
RI#_EXTEVNT0#
SLP_S2_GPM9#
SLP_S3#
SLP_S5#
PWR_BTN#
PWR_GOOD
SUS_STAT#
TEST2
TEST1
TEST0
GA20IN_GEVENT0#
KBRST#_GEVENT1#
LPC_PME#_GEVENT3#
LPC_SMI#_EXTEVNT1#
S3_STATE_GEVENT5#
SYS_RESET#_GPM7#
WAKE#_GEVENT8#
BLINK_GPM6#
SMBALERT#_THRMTRIP#_GEVENT2#
NB_PWRGD
RSMRST#

4/5

USB 1.1

CHP3_SLPS3#
CHP3_SLPS5#
KBC3_PWRBTN#

E1
E2
H7
F5
G1
H2
H1
K3
H5
H4
H3
Y15
W15
K4
K24
F1
J2
H6
F2
J6
W14
D3

ACPI / WAKE UP EVENTS

CHP3_BIOS_CRI#

R254

U514-4
SB700

10K

u/
x/

AUD3_SPKR

R247
51K

SMB3_DATA

SAMSUNG

SMB3_CLK

ELECTRONICS

PU : No Reboot Mode

SRP Sheet Number: 24 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

SB700 HW STRAP

P3.3V_AUX
P3.3V

P3.3V

P3.3V

P3.3V

P3.3V

P3.3V

P3.3V

P3.3V

P3.3V_AUX

P3.3V_AUX

P3.3V

P3.3V_AUX

P3.3V
nostuff

D
R724

R729

R716

R739

R709

R706

10K
1%

10K
1%

10K
1%

10K
1%

10K
1%

10K
1%

nostuff
nostuff
nostuff
nostuff
nostuff
nostuff

PCI3_AD28
PCI3_AD27

nostuff

nostuff

nostuff

nostuff

nostuff

nostuff

nostuff

R272

R275

R704

R700

R250

R243

R235

R268

10K
1%

10K
1%

10K
1%

10K
1%

10K
1%

10K
1%

10K
1%

10K
1%

PCI3_CLK2
PCI3_CLK3
PCI3_CLK4

PCI3_AD26
PCI3_CLK5
PCI3_AD25

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
LPC3_CLK0

PCI3_AD24

u/
x/

LPC3_CLK1

PCI3_AD23

CHP3_RTCCLK

R723

R728

R717

R738

R710

R707

2.2K

2.2K

2.2K

2.2K

2.2K

2.2K

HDA3_AUD_RST#

USE PCI
PLL

USE
SHORT
RESET

BYPASS
PCI PLL

PCI3_AD(26)

PCI3_AD(25)

USE ACPI
BCLK

USE IDE PLL

BYPASS
ACPI
BCLK

BYPASS IDE
PLL

P3.3V_AUX

CHP3_SB_TEST2
CHP3_SB_TEST1
CHP3_SB_TEST0

R256

R255

R257

2.2K

2.2K

2.2K

PCI3_AD(24)

PCI3_AD(23)

USE DEFAULT
PCIE STRAPS

BOOTFAILTIMER
DISABLED

USE EEPROM
PCIE STRAPS

BOOTFAILTIMER
ENABLED

nostuff
nostuff
nostuff

R698

R280

R278

R251

R244

R239

R267

10K
1%

10K
1%

2.2K

10K
1%

10K
1%

10K
1%

2.2K

10K
1%

om

PCI3_AD(27)

USE
LONG
RESET

R271

nostuff

nostuff

PCI3_CLK3

nostuff

LPC3_CLK0

RTC_CLK

AUD_RST#

yc

STRAP
LOW

PCI3_AD(28)

BOOTFAIL
TIMER
ENABLED

USER
DEBUG
STRAPS

RESERVED

RESERVED

EC
ENABLED

CLKGEN
ENABLED

INTERNAL RTC

ENABLE PCI
MEM BOOT

BOOTFAIL
TIMER
DISABLED

IGNORE
DEBUG
STRAPS

RESERVED

RESERVED

EC
DISABLED

CLKGEN
DISABLED

EXRERNAL RTC
(PD on X1,
Apply 32KHz to
RTC_CLK)

DISABLE PCI
MEM BOOT

PCI3_CLK2

STRAP
HIGH

//
m

STRAP
HIGH

tp
:

DEBUG STRAPS

ht

p.
s

nostuff
nostuff
nostuff
nostuff
nostuff
nostuff

STRAP
LOW

PCI3_CLK4

PCI3_CLK5

LPC3_CLK1

P3.3V_AUX

R653

R654

GPIO17

2.2K
5%

2.2K
5%

GPIO16

ROM TYPE

nostuff

H, H = PCI ROM

CHP3_GPIO16
CHP3_GPIO17

H, L = SPI ROM

L, H = LPC ROM

R652
2.2K
5%

R651

L, L = FWH ROM

2.2K
5%

nostuff

SAMSUNG
ELECTRONICS

SRP Sheet Number: 25 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

02
03
04
06
08
09
0A
0B
0C
OE
0F
10
11
13

u/
x/

R659
10K
1%

nostuff

R679
10K
1%

CE*
VDD
SO HOLD*
WP* SCK
VSS
SI

8
7
6
5

C650

1107-001646

100nF
10V

1MByte (8Mbit)

ht

tp
:

SPI3_CLK
SPI3_MOSI

yc

R260

12.1

//
m

1%

om

U10
MX25L8005M2C-15G

1
2
3
4

14
16
18
1A
1C
20
22
24
26
28
32
34
38
3A
3C
3D
42
44
46
47
48
49
4A
4C
50
52
54
56
58
5A
5C
60
62
64

p.
s

P3.3V

SPI3_CS0#
SPI3_MISO
CHP3_BIOSWP#

66
6A
6C
6E
70
72
74
76
7C
7E
80
82
84
86
88
8A
8C
9A
9C
9E
A0
A4
A8
AA
AC
AE
B0
B2
B4
B6
B7
BA
BE
C0
D0
D2
D4
D6
D8
DA
DC
89
90
91
92
94
96
98

CONFIGURE ADVANCE CACHE REG.


DISPLAY EXTERNAL CACHE SIZE
DISPLAY SHADOW MESSAGE
DISPLAY NON-DISPOSABLE SEGMENT
DISPLAY ERROR MESSAGE
CHECK FOR CONFIGURATION ERROR
TEST REAL-TIME CLOCK
CHECK FOR KEYBOARD EERROR
SETUP HARDWARE INTERRUPT VECTOR
TEST COPROCESSER IF PRESENT
DISABLE ON-BOARD I/O PORT
DETECT AND INSTALL EXT.RS232C
DETECT AND INSTALL EXT.PARALLEL
RE-INIT. ON-BOARD I/O PORT
INIT. BIOS DATA ROM
INIT.EXTENDED BIOS DATA AREA
INIT. FDD CONTROLLER
SHADOW OPTION ROMS
SETUP POWER MANAGEMENT
ENABLE H/W INTERRUPT
SET TIME OF DAY
INIT. TYPEMATIC RATE
ERASE F2 PROMPT
SCAN FOR F2 KEY STROKE
ENTER SETUP
CLEAR IN POST FLAG
CHECK FOR ERRORS
POST DONE-PREPARE TO BOOT O/S
ONE BEEP
CHECK PASSWORD (OPTION)
ACPI INIT
DMI INIT
CLEAR SCREEN
TRY BOOT WITH INT19
INTERRUPT HANDLER ERROR
UNKNOWN INTERRUPT ERROR
PENDING INTERRUPT ERROR
SHUTDOWN 5
SHUTDOWN ERROR
EXTENDED BLOCK MOVE
SHUTDOWN 10
ENABLE NMI
INIT. HDD CONTROLLER
INIT. LOCAL BUS HDD CONTROLLER
JUMP TO USER PATCH 2
DISABLE A20 ADDRESS LINE
CLEAR HUGE ES SEGMENT REG.
SEARCH FOR OPTION ROMS

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

BIOS ROM
C

VERIFY REAL MODE


DISABLE NMI
GET CPU TYPE
INIT. SYSTEM H/W
INIT. CHIPSET REG.
SET IN POST FLAG
INIT CPU.REG
CPU CACHE ON
INIT.CACHE TO POST
INIT. I/O VALUE
ENABLE THE L-BUS IDE
INIT. POWER MANAGER
LOAD ALTERNATE REG.
PCI BUS MASTER RESET
WITH INITIAL POST VALUE
INIT. KEYBOARD CONTROLLER
CHECK CHECKSUM
8254 TIMER INIT.
8237 DMA CONTROLLER INIT.
RESET INTERRUP CONTROLLER
TEST DRAM REFRESH
TEST 8742 KEYBOARD CONTROLLER
SET ES SEGMENT REG. TO 4GB
ENABLE A20
AUTO SIZING DRAM
COMPUTE THE CPU SPEED
TESET CMOS RAM
SHADOW SYSTEM BIOS ROM
AUTO SIZING CACHE
CONFIGURE ADVANCED CHIPSET REG.
LOAD ALTER REG. WITH CMOS VALUE
INIT. INTERRUPT VECTOR
INIT. BIOS INTERRUPT
CHECK ROM COPYRIGHT NOTICE
INIT. I20 SUPPORT IF INSTALLED
CHECK VIDEO CONFIGURE AGAINST CMOS
INIT. PCI BUS AND DEVICE
INIT. ALL VIDEO BIOS ROM
SHADOW VIDEO BIOS ROM
DISPLAY CPU TYPE AND SPEED
TEST KEYBOARD
SET KEYCLICK IF ENABLED
ENABLE KEYBOARD
TEST FOR UNEXPECTED INTERRUPTS
DISPLAY " PRESS ...... SETUP"
TEST RAM GETWEEN 512K AND 640K
TEST EXTENDED MEMORY
TEST EXTENDED MEMORY ADDRESS LINE
JUMP TO USER PATCH 1

A
DRAW

HS CHO
CHECK

8/12/2006
MP(PR)
REV

APPROVAL

YB CHUN

1.00

COM-22C-015(1996.6.5) REV. 3

ELECTRONICS

SPI_BIOS_ROM
BIOS_ROM (1M)

PART NO.

BA41-01024~6A

LAST EDIT

December 24, 2008 14:36:53 PM

SAMSUNG

DRESDEN-INT

DEV. STEP

HS LEE / BM LEE

MODULE CODE

TITLE

DATE

PAGE

32

OF

60

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN/design_blocks/SPI_BIOS_ROM_16Mbit

SRP Sheet Number: 26 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

HDMI REPEATER

P3.3V_HDMI

P3.3V_HDMI

B4
ACM2012H-900-2P
1

U5
PI3HDMI412AD

10V

100nF

10V

PEG3_TX0P_HDMI
10V

C53

100nF

C52

100nF

C59

100nF

C61

100nF

C67

100nF

10V

PEG3_TX1P_HDMI

SMB3_CLK
SMB3_DATA

10V

PEG3_TX1N_HDMI

10V

PEG3_TX2N_HDMI
PEG3_HPD_HDMI

STUFF it @ STRAPS MODE


nostuff
0
R34

HDMI3_MS

10V

PEG3_TX2P_HDMI

BAT54
D8

R55
4.7K
1%

PEG3_TXCP_HDMI_C
PEG3_TXCN_HDMI_C
2

B5
ACM2012H-900-2P

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
D0+
D0D1+
D1D2+
D2D3+
D3-

16

PEG3_TX0N_HDMI

22
24
36
48

D0A+
D0AD1A+
D1AD2A+
D2AD3A+
D3A-

SEL_OUT

D0B+
D0BD1B+
D1BD2B+
D2BD3B+
D3B-

19
20
18
1
55
54
56
17

SCL_S3
SDA_S2
NC
MS
SEL_IN
TEST_IN
OE
TEST_OUT

GND_1
GND_2
GND_3
GND_4
GND_5
A0_S4
GND_6
GND_7
A1_S5
GND_8
A2_S6
GND_9
A3_S7
GND_10
THERMAL_PAD AGND

49
50
51
52

HDMI3_A0_S4
HDMI3_A1_S5
HDMI3_A2_S6
HDMI3_A3_S7

47
46
44
43
41
40
38
37

35
34
32
31
29
28
26
25

p.
s

C51

PEG3_TXCN_HDMI

AVDD
VDD_5
VDD_6
VDD_7

om

100nF

100nF
10V

VDD_1
VDD_2
VDD_3
VDD_4

4
5
7
8
9
10
12
13

PEG3_TXCP_HDMI
C48

0.1nF
50V

2
6
11
15

u/
x/

100nF

C566

yc

C46

10V

C565

B11
MMZ1608S121AT

57

PEG3_TX0P_HDMI_C
PEG3_TX0N_HDMI_C

B6
ACM2012H-900-2P

PEG3_TX1P_HDMI_C
PEG3_TX1N_HDMI_C

B8
ACM2012H-900-2P

PEG3_TX2P_HDMI_C
PEG3_TX2N_HDMI_C

3
14
21
27
30
33
39
42
45
53
23

//
m

1001-001458

P3.3V_HDMI

D10
CRS06
1

HDMI3_MS HIGH: SMBUS mode (Address = 110 A3A2A1A0 x = 1100 000x)


HDMI3_MS LOW: STRAPS mode

P3.3V_HDMI

ht

tp
:

P3.3V

nostuff

nostuff

nostuff

nostuff

R47

R35

R36

R37

R38

10K
1%

10K
1%

10K
1%

10K
1%

10K
1%

HDMI3_MS
HDMI3_A3_S7
HDMI3_A2_S6
HDMI3_A1_S5
HDMI3_A0_S4

nostuff

R46

R48

R49

R50

R51

SAMSUNG
ELECTRONICS

SRP Sheet Number: 27 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

LVDS
D

1CH WXGA LCD CONNECTOR


P3.3V

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

LCD1_ACLK#
LCD1_ACLK
LCD1_ADATA1#
LCD1_ADATA1

C55

C56

1000nF-X5R
6.3V

100nF
10V

LCD1_ADATA2
LCD1_ADATA2#
LCD1_ADATA0
LCD1_ADATA0#
LCD3_EDID_CLK
LCD3_EDID_DATA

31
32

3710-002498

PEG3_BKLTEN
R67

R68

100K
1%

100K
1%

nostuff

5
+
-

10K

yc

C54

SI2315BDS-T1

100nF

330nF
10V

C
P3.3V_AUX

Q15
RHU002N06

1%G
1

R53

nostuff

C60

100K
1%

C813
22000nF-X5R
20%
6.3V

for PI Review on 31-Oct-08

Inverter Power
VDC

VDC_INV

SHORT513

INSTPAR

SHORT514

INSTPAR

U4
TC7S08FU
4

R61

1K 1%

LCD3_BKLTON

ht

tp
:

P3.3V

KBC3_BKLTON

R40

//
m

Backlight ON
B

200K
1%

PEG3_LCDVDDON

Signals : #40AWG
LCD Vdd : #36AWG
Inverter Vdd : #36AWG
GND : #36AWG

R64

2.2K

R52

2.2K

LCD_VDD3V
Q16
S

R39

P3.3V_AUX

P5.0V_ALW

100nF
25V

p.
s

C57
100nF
25V

C27

om

LCD3_BRIT

FOR EBL

LCD Power

LCD3_BKLTON

30.1K
1%

1
2
3
4
5
6
8
7
10
9
11 12
13 14
15 16
17 18
19 20
21 22
23 24
25 26
27 28
29 30
MNT1
MNT2

u/
x/

LCD1
SOCK-30P-2R-SMD-MNT

VDC_INV

P3.3V VDC_INV

R65

LCD_VDD3V

A
DRAW

DATE

HS CHO
CHECK

8/12/2006
MP(PR)
REV

APPROVAL

YB CHUN
undefined
COM-22C-015(1996.6.5) REV. 3

1.00

ELECTRONICS

LCD_IF
PART NO.

LVDS

BA41-01024~6A

LAST EDIT

MODULE CODE

SAMSUNG

DRESDEN-INT

DEV. STEP

HS LEE / BM LEE

TITLE

December 24, 2008 14:36:53 PM

PAGE

34

OF

63

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN/design_blocks/LCD_IF_14p1

SRP Sheet Number: 28 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

P5.0V

CRT CONNECTOR

MMBD4148
D507

B24
BLM18PG181SN1
CRT500
DSUB-15-3R-F

C261

CRT3_DDCCLK

4.7K
1%
2

ht

R167

u/
x/
2

50V

BAV99LT1
D11

Q25
RHU002N06

R174
4.7K
1%

nostuff
nostuff

P3.3V

P3.3V

VCC_CRT

nostuff

nostuff

C246
100nF

R215

4.7K
1%

10V

CRT5_DDCCLK

BAV99LT1
D508

P5.0V
D506
MMBD4148

VCC_CRT

nostuff

R168

40.2 1%

Q30
RHU002N06

CRT3_DDCDATA

4.7K
1%

R213

R208

P3.3V

nostuff

R183

SN74AHCT1G125DCKR

tp
:

100nF
10V

5
+
4
3 U6

0.1nF

OE*

C260

50V

1%

50V

33

0.1nF

R180

100nF
10V

40.2 1%

0.27nF

CRT3_VSYNC

R198

U7
SN74AHCT1G125DCKR

C275

5
+
4
3

C245

OE*

50V

0.27nF

1%

C298

33

yc

R193

//
m

CRT3_HSYNC

C268

om

VCC_CRT

16
17

3701-001403

nostuff
nostuff
nostuff

CRT5_DDCDATA
CRT5_DDCCLK

1
6
11
2
7
12
3
8
13
4
9
14
5
10
15

D509
PGB1010603NR

D510
PGB1010603NR

p.
s

D511
PGB1010603NR

150 1%

140 1%

150 1%

R586

R587

R588

50V

50V

0.022nF

C279

50V

0.022nF

C285

C289

C286

50V

82nH

C276

CRT3_BLUE

50V

82nH

L1

0.022nF

L2

CRT3_BLUE

50V

CRT3_GREEN

0.022nF

82nH

0.022nF

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
L3

0.022nF

CRT3_GREEN

CRT3_RED

C280

CRT3_RED

CRT5_DDCDATA

A
DRAW

DATE

HS CHO
CHECK

8/12/2006

APPROVAL

MP(PR)
REV

YB CHUN

1.00

ELECTRONICS

CRT_IF
PART NO.

CRT

BA41-01024~6A

LAST EDIT

December 24, 2008 14:36:53 PM

4
COM-22C-015(1996.6.5) REV. 3

SAMSUNG

DRESDEN-INT

DEV. STEP

HS LEE / BM LEE

MODULE CODE

TITLE

PAGE

35

OF

63

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN/design_blocks/Graphics_IF_CRT

SRP Sheet Number: 29 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

EXPRESS CARD

R711

SMB3_DATA
PEX3_WAKE#

R727

0
nostuff

EXP3_PERST#

8
9
11
13
16
17
18
19

EXP3_CLKREQ#
EXP3_CPPE#
CLK1_EXPCARD#
CLK1_EXPCARD

21
22

PEX1_EXPCARDRXN1
PEX1_EXPCARDRXP1

24
25

PEX1_EXPCARDTXN1
PEX1_EXPCARDTXP1

USB_DUSB_D+

3.3V_2
3.3V_1

CPUSB#

3.3V_AUX

SMB_DATA
1.5V_1

1.5V_2

WAKE#
PERST#

GND_4
GND_3
GND_2
GND_1

CLKREQ#
CPPE#
REFCLKREFCLK+
PERN0
PERP0

SMB_CLK
RESERVED_2
RESERVED_1

PETN0
PETP0

MNT1
MNT2

3711-006322

EXPRESS CARD
Type 1 module

INSERT
THIS SIDE UP

EXPRESS CARD

75.00 mm

34.00 mm

34.00 mm W
X
75.00 mm L
X
5.00 mm H

u/
x/

C747

C746

C734

C721

C711

C701

C739

100nF
10V

100nF
10V

100nF
10V

100nF
10V

100nF
10V

100nF
10V

100nF
10V

p.
s

P3.3V

15
14
12
10

26
23
20
1

R722

7
6
5

27
28

SMB3_CLK

CHP3_SLPS3#
PEX3_RST#

2
4

12
14

17

nostuff

R756

P3.3V_EXP P1.5V_EXP P3.3V_AUX_EXP

U516
R5538D001-TR-F

R750
10K

18

20
1
6
19

3.3VIN_1
3.3VIN_2

3.3VOUT_1
3.3VOUT_2

1.5VIN_1
1.5VIN_2

1.5VOUT_1
1.5VOUT_2
AUXOUT

AUXIN

PERST*
CPPE*
CPUSB*

RCLKEN

SHDN*
STBY*
SYSRST*

NC_5
GND

OC*

THERMAL

//
m

USB3_P4USB3_P4+
EXP3_CPUSB#

P1.5V

3
5

11
13
15

8
10
9

R714

EXP3_PERST#
EXP3_CPPE#
EXP3_CPUSB#

16
7

21

1205-002807

tp
:

2
3

P3.3V_AUX

P1.5V_EXP

J7
EXPRESS-26P-FRAME
1
2

MNT1
MNT2

ht

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

J8
EDGE-XPRESS-26P

10K

P3.3V_AUX_EXP

om

R762

P3.3V_EXP

yc

P3.3VP1.5V_EXP

3709-001522

0173707900

A
DRAW

DATE

HS CHO
CHECK

8/17/2007

DRESDEN-INT

MP(PR)

EXPRESS_CARD

REV

APPROVAL

YB CHUN

1.00

EXPRESS_CARD (34mm)

COM-22C-015(1996.6.5) REV. 3

ELECTRONICS
PART NO.

BA41-01024~6A

LAST EDIT

December 24, 2008 14:36:53 PM

SAMSUNG

DEV. STEP

HS LEE / BM LEE

MODULE CODE

TITLE

PAGE

42

OF

60

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN/design_blocks/Express_Card

SRP Sheet Number: 30 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

MEMORY CARD (2 IN 1)

C742

C743

C757

1000nF
6.3V

100nF
10V

100nF
10V

1000nF
6.3V

C761

U519
AU6371B51

For EMC Review


PR-7 on 15-Dec-08

R770
R754

USB3_P10+
USB3_P10-

1
10
13

0
0

4
5

nostuff nostuff

R743

1M

1%

P3.3V PLT3_RST#

7
8
47
2

Y501
12MHz

16

2801-004666

C732

C733

0.018nF
50V

0.018nF
50V

R780

R755

47K
1%

330

29
11
12
6
17

B
9
48

CLK3_FM48

CARD_POWER

VCC
VDDH

VDD
VDD_U
V18
DP
DM

XI
XO

RESET#
REXT

READER_EN
GPON6

NC_1
NC_2

GND
GNDH

GND_U
GND_VDD

150K
1%

10K
1%

18
19
20
21
22
23
24
25
26
27
28
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46

R801

5%
47

C784

0.022nF
50V

nostuff

C370

2200nF-X5R
10V

MCD3_SDCD#

MCD3_SDDATA3
MCD3_SDCMD

MCD3_SDCLK
MCD3_SDCMD

MCD3_SDDATA0
MCD3_SDDATA1
MCD3_SDDATA2
MCD3_SDCD#
MCD3_SDWP

C366
100nF
10V

J514
EDGE-SD-9P

R747
R751

49.9 1%
49.9 1%

R746
R745
R748

49.9 1%
49.9 1%
49.9 1%

1
2
3
4
5
6
7
8
9
10
11

MCD3_SDCLK

MCD3_SDWP

12
13

MCD3_SDDATA0
MCD3_SDDATA1
MCD3_SDDATA2
MCD3_SDDATA3

CD_DAT3
CMD
VSS1
VDD
CLK
VSS2
DAT0
DAT1
DAT2
CARD_DETECT
WRITE_PROTECT
MNT1
MNT2
3709-001492

C787

0.01nF
0.5pF
50V

nostuff

ht

0904-002297

MS_INS
SMCD#
CFCD#
SDCD#
XDCD#
CFRESET_XDWR#
CFWR#_XDRD#
CFRD#_XDCE#
CFAD2_XDALE
CFAD1_MSCLK_XDCLE
CFAD0_SDCLK_MSBS
CFD0_MSD0_SDCMD
CFD1_MSD1_XDWP#
CFD2_MSD2_SDWP
CFD3_MSD3_XDRB#
CFD4_SDD0
CFD5_SDD1
CFD6_SDD2
CFD7_SDD3
CFD8_SDD4_XDD0
CFD9_SDD5_XDD1
CFD10_SDD6_XDD2
CFD11_SDD7_XDD3
CFD12_XDD4
CFD13_XDD5
CFD14_XDD6
CFD15_XDD7
CFWT#

R800

15

//
m

B522
ACM2012-900-2P-T

3
14

R778

P3.3V_MCD

tp
:

1000nF
6.3V

om

C745

100nF
10V

yc

C744

u/
x/

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
P3.3V_MCD

P3.3V_MCD

p.
s

P3.3V

B521
BLM18PG181SN1

1.8V

A
DATE

DRAW

HS CHO
CHECK

8/17/2007
MP(PR)
REV

APPROVAL

YB CHUN

1.00

COM-22C-015(1996.6.5) REV. 3

ELECTRONICS

MEMORY CARD
PART NO.

MMC (2-IN-1)

BA41-01024~6A

LAST EDIT

December 24, 2008 14:36:53 PM

SAMSUNG

DRESDEN-INT

DEV. STEP

HS LEE / BM LEE

MODULE CODE

TITLE

PAGE

41

OF

60

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN/design_blocks/Multi_MV_Au6371

SRP Sheet Number: 31 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

Mini PCI-E Card (WLAN)


P3.3V

P3.3V_AUX

P1.5V

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
u/
x/

R708
0

R695
10K
1%

C315
100nF
10V

MIN3_CLKREQ#

CLK1_MINIPCIE#
CLK1_MINIPCIE

PEX1_MINIRXN0
PEX1_MINIRXP0

SIM_RSVD_C8
SIM_RSVD_C4
GND_5
PERN0
PERP0
GND_7
GND_8
PETN0
PETP0
GND_10
RSVD_11
RSVD_12
RSVD_13
RSVD_14
RSVD_15
RSVD_16
RSVD_17
RSVD_18

//
m

tp
:

KBC3_RFOFF#

Q544
RHU002N06

1
S

2
4
6
8
10
12
14
16

C682

18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52

10000nF
6.3V

C684
100nF

C313
100nF

KBC3_RFOFF#
PEX3_RST#

nostuff

R230

WLON_LED#

53
54

Height : 4mm

PCI Express Mini Card ElectroMechanical Spec. 1.0

WLAN MINICARD NUT

WLAN MINICARD NUT

Height : 4mm

Height : 4mm

M6
HEAD
DIA
LENGTH

M7
HEAD
DIA
LENGTH

Mini PCI Express Card


30.00 mm

nostuff

BA61-00932A

48.05 mm

ht
WLON_LED#

GND_4
W_DISABLE*
PERST*
P3.3V_AUX
GND_6
P1.5V_2
SMB_CLK
SMB_DATA
GND_9
USB_DUSB_D+
GND_11
LED_WWAN*
LED_WLAN*
LED_WPAN*
P1.5V_3
GND_12
P3.3V_2
MNT1
MNT2

3709-001401

P3.3V_1
GND_1
P1.5V_1
SIM_VCC_C1
SIM_DATAIO_C7
SIM_CLK_C3
SIM_RESET_C2
SIM_VPP_C6

yc

PEX1_MINITXN0
PEX1_MINITXP0

17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51

WAKE*
RSVD_1
RSVD_2
CLKREQ*
GND_2
REFCLKREFCLK+
GND_3

P3.3V

10V

50.95 mm

1
3
5
7
9
11
13
15

C330
100nF

p.
s

nostuff

om

R702

PEX3_WAKE#

J6
EDGE-MINIPCI-E-52P

Top
Pin 1

BA61-00932A

Odd Pins : Top side


Even Pins : Bottom Side

For Full size minicard

(Top)

For half size minicard

(Top)
HS CHO
CHECK

YB CHUN
undefined
COM-22C-015(1996.6.5) REV. 3

PCIE_MINICARD

SAMSUNG

1.00

ELECTRONICS
PART NO.

WLAN

BA41-01024~6A

LAST EDIT

MODULE CODE

DRESDEN-INT

MP(PR)
REV

APPROVAL

8/12/2006
DEV. STEP

HS LEE / BM LEE

TITLE

DATE

DRAW

December 24, 2008 14:36:53 PM

PAGE

40

OF

60

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN/design_blocks/PCIE_Minicard_Slot

SRP Sheet Number: 32 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

HDA CODEC ALC272


P3.3V

C779

C776

C772

10000nF
6.3V

100nF
10V

100nF
10V

U518
ALC272-GR
1
9

12

1000nF
6.3V

PLACE NEAR SOUTH BRIDGE

C338

47

0.015nF
50V
nostuff

45
48

DMIC-CLK1_2
DMIC-CLK3_4
GPIO0_DMIC01_2
GPIO1_DMIC-3_4

R782
R741

20K 1%
5.1K 1%

25
38

20K
1%

C730
100nF
10V

C748

LINE1-R_PORT-C-R
LINE1-L_PORT-C-L

SENSEA
SENSEB

LINE1-VREFO

DVSS_1
DVSS_2

LINE2-R_PORT-E-R
LINE2-L_PORT-E-L

AVDD1
AVDD2

LINE2-VREFO

MONO-OUT

26
42

100nF
10V

MIC2-VREFO

JDREF

4
7

P4.75V_AUD

R764

MIC2-R_PORT-F-R
MIC2-L_PORT-F-L

NC

13
34

H/P_A

MIC1-R_PORT-B-R
MIC1-L_PORT-B-L
MIC1-VREFO

SPDIFO2
SPDIFO1

40

MIC_B

CPVEE

EAPD

43

AUD5_SENS_MIC#
AUD5_SENS_HP#

CBP
CBN

PC_BEEP

46
44
2
3

AUD3_GPIO0#
AUD3_GPIO1#

HPOUT-R_PORT-I-R
HPOUT-L_PORT-I-L

AVSS1
AVSS2

32
33
29
30

2200nF
10V

C720

22
21

17
16

18

15
14

2200nF 10V

C752
C753

1000nF
1000nF

6.3V
6.3V G_AUD

AUD5_MIC1_RIGHT
AUD5_MIC1_LEFT

C759
C763

1000nF
1000nF

6.3V
6.3V

AUD5_MIC2_RIGHT
AUD5_MIC2_LEFT

28

24
23

VREF

G_AUD

AUD5_HP_O_RIGHT
AUD5_HP_O_LEFT

C719

31

19

SHORT504

u/
x/

SDATA-OUT
BCLK
SDATA-IN
SYNC
RESET#

39
41

p.
s

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
5
6
8
10
11

LOUT2-L_PORT-A-L
LOUT2-R_PORT-A-R

AUD5_LINE_O_RIGHT
AUD5_LINE_O_LEFT

om

C775

AUD3_BEEP

33 1%

36
35

AUD5_MIC1_LEFT

R760

4.7K

1%

R761

1%

BAT54A
D516

R798

R799

C
G_AUD

AUD5_MIC2_VREF

yc

R788

SHORT505
LOUT1-R_PORT-D-R
LOUT1-L_PORT-D-L

4.7K

C676

10nF

C316

10nF

25V

C656

10nF

25V

25V

AUD5_MIC1_RIGHT

G_AUD

20

37

27

//
m

HDA3_AUD_SDO
HDA3_AUD_BCLK
HDA3_AUD_SDI0
HDA3_AUD_SYNC
HDA3_AUD_RST#

DVDD
DVDD-IO

1205-003526

SHORT508

Place these R-Short on just opposite side of the CODEC.

SHORT507

G_AUD

tp
:

G_AUD

C714

C731

10000nF
6.3V

100nF
10V

B
P4.75V_AUD

P5.0V_AUD

U520
MIC5252-4.75BM5

G_AUD

1
2
3

P4.75V_AUD

ht

C780

C773

10000nF-X5R
10V

100nF

IN
OUT
GND
EN BYPASS

5
4

1203-003344

10V

C755

C754

100nF
10V

10000nF-X5R
10V

R786
20K
1%

SHORT511

PC BEEP
R785

1K

1%

Q530
RHU002N06

R787
1K
1%

6.3V

SHORT512

AUD3_BEEP

AUD3_SPKR

C760

1000nF-X5R

C774

G_AUD

4.7nF
25V

G_AUD

G_AUD G_AUD

1
S

G_AUD

SAMSUNG

G_AUD

ELECTRONICS

SRP Sheet Number: 33 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

AUDIO AMP & INT. SPEAKER

P5.0V_AMP

R718

17
7
2
3

C
AUD5_LINE_O_LEFT

100nF

RINRIN+
GAIN0
GAIN1

5
LIN9
LIN+
10

10V

G_AUD

18

ROUT+
14
ROUT-

10V

GAIN0

GAIN1

SPK5_L+
SPK5_L-

AUD3_SHDN#

NC

THERM

C690

R719

R726

C695

C681

C686

nostuff

SPK5_R+
SPK5_R-

21

1201-001991

nostuff

G_AUD

AUD3_GPIO0#

R720

10K
1%

1K
1%

Q520
RHU002N06

ht

R721

SHORT510

INSTPAR

SHORT509

INSTPAR

10dB

15.6dB

C777

C766

C756

21.6dB

10000nF-X5R
10V

100nF
10V

10000nF-X5R
10V

G_AUD

G_AUD

INTERNAL STEREO SPEAKERS


B15
B14
B13
B12

AUD3_SHDN#

KBC3_SPKMUTE

tp
:

P5.0V_AMP

6dB

//
m

G_AUD

P5.0V_AUD

yc

100nF

10V

16V

100nF

470nF

10V

100nF

19
SHDN*
12

GND4

100nF
10V

nostuff

16

VDD
6
PVDD1
15
PVDD2

BYPASS LOUT+
8
LOUT-

1
GND1
11 GND2
13
GND3
20

u/
x/

100K 1%

100nF
10V

C708

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
U515
TPA6017A2

C687

C696

10000nF-X5R
10V

p.
s

C705

C688
100nF

10V

om

AUD5_LINE_O_RIGHT

C704
100nF
10V

R725

nostuff

GAIN
10dB

100K 1%

P5.0V_AMP

BLM18PG181SN1
BLM18PG181SN1
BLM18PG181SN1
BLM18PG181SN1

SPK5_RSPK5_R+
SPK5_LSPK5_L+

C88

C84

C83

C82

1nF
50V

1nF
50V

1nF
50V

1nF
50V

nostuff
nostuff
nostuff
nostuff

J3
HDR-4P-SMD

5
6

1
2
3
4
MNT1
MNT2
3711-000922

G_AUD

SAMSUNG
ELECTRONICS

SRP Sheet Number: 34 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

AUDIO POWER & INT. MIC

It should be placed near internal MIC

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
AUD5_MIC2_VREF

J4
HDR-2P-SMD

2.2K

R641

R773

AUD5_MIC2_RIGHT

B16

330

3
4

BLM18PG181SN1

C188

47nF
25V

SHORT503

G_MIC

C636

10nF
25V

R649

C180
10nF

0.1nF
50V

p.
s

AUD5_MIC2_LEFT

1
2
MNT1
MNT2

3711-000541

C633

u/
x/

Internal MIC

R640

25V

G_MIC

G_MIC

om

G_MIC

G_AUD

C789

ht

tp
:

R804

KBC3_PWRON_INV#

R824

10K
1%

100nF
10V

100K
1%

R809

10K

D1 D2 D3 D4

1 2 5 6

4
S

P5.0V_AUD

Q540
SI3433BDV

P5.0V_AUX

//
m

yc

Audio Power (nostuff)

C785
2200nF
10V

1%

Q539
RHU002N06

C793
10nF
16V

nostuff
nostuff
nostuff
nostuff
nostuff
nostuff
nostuff
nostuff

SAMSUNG
ELECTRONICS

SRP Sheet Number: 35 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

HEADPHONE & EXT. MIC

HEADPHONE

P3.3V
2

R690

10K
1%

KBC3_SPKMUTE

R689

1K
1%

330

B31

BLM18PG181SN1

R226

330

B30

BLM18PG181SN1

50V

50V

1nF

0.1nF

R
L

G1
G2

3722-002416

nostuff

G_AUD

G_AUD

G_AUD

Connect to Mount-hole.

1K
1%

Q512
MMBT3904

G_AUD

//
m

R228

ht

AUD5_MIC1_LEFT

tp
:

AUD5_MIC1_RIGHT

Q511
MMBT3904

HP depop circuit

G_AUD

AUD5_SENS_MIC#

1K
1%

R686

Q513
RHU002N06

R680

yc

AUD3_GPIO1#

R236
20K

G_AUD

DTA114YUA
Q514

BLM18PG181SN1

C314

R229
20K

BLM18PG181SN1

C317

B32

J511
JACK-PHONE-6P-LIME

5
4
3
6
2
1

C324

B33

56.2

50V

56.2

R231

0.1nF

R240

p.
s

AUD5_HP_O_LEFT

om

AUD5_HP_O_RIGHT

u/
x/

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
AUD5_SENS_HP#

J510
JACK-PHONE-6P-PINK

C312

C311

C306

1nF

0.1nF

0.1nF

50V

50V

50V

5
4
3
6
2
1

R
L

G1
G2

3722-002365

MIC JACK

nostuff

G_AUD

G_AUDG_AUD

The traces led to Audio Jacks have the width over 10mil

SAMSUNG
ELECTRONICS

SRP Sheet Number: 36 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

SATA IF CONNECTOR

u/
x/

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

Main to HDD

C713
C710

10nF 25V
10nF 25V

C703
C694

10nF 25V
10nF 25V

P3.3V
nostuff
nostuff
nostuff

C663

C671

C667

10000nF
6.3V

100nF
10V

100nF
10V

P5.0V

C658

C651

C655

10000nF
6.3V

100nF
10V

10000nF
6.3V

100nF
10V

C657

100nF
10V

P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
M1
M2

GND
RX+
RXGND
TXTX+
GND

3.3V
3.3V
3.3V
GND
GND
GND
5.0V
5.0V
5.0V
GND
RESERVE
GND
12.0V
12.0V
12.0V

place near to connector

SAT1_TXP1
SAT1_TXN1

C259
C255

10nF 25V
10nF 25V

SAT1_RXN1
SAT1_RXP1

C249
C244

10nF 25V
10nF 25V

P5.0V

nostuff

C215

C199

C206

C210

10000nF
6.3V

10000nF
6.3V

100nF
25V

100nF
25V

J508
CDROM-SATA-13P

S1
S2
S3
S4
S5
S6
S7

P1
P2
P3
P4
P5
P6
14
15

GND_1
RX+
RXGND_2
TXTX+
GND_3

DP
5V_1
5V_2
MD
GND_4
GND_5
MNT1
MNT2

3710-002634

MNT
MNT

tp
:

nostuff

C649

S1
S2
S3
S4
S5
S6
S7

om

SAT1_RXN0
SAT1_RXP0

HDD500
SOCK-22P-1R

yc

SAT1_TXP0
SAT1_TXN0

p.
s

place near to connector

//
m

Main to ODD

ht

3710-002471

SAMSUNG
ELECTRONICS

SRP Sheet Number: 37 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

MICOM RESET

MICOM

P3.3V_AUX

KBC3_RST#

P3.3V_MICOM P3.3V_MICOM
P3.3V_MICOM

R806
P3.3V_MICOM
U525
TPS3809
3

R295

To measure leakage

GND
VDD
RESET*

R827

R828

C798

470K
1%

100nF
25V

nostuff

R811
D

47K

KBC5_KSO(0:7)

LPC3_LAD(0:3)

0
1
2
3
4
5
6
7

67
66
65
64
63
62
61
60
82
83
84
85
86
87
88
89

0
1
2
3

LPC3_LFRAME#
PLT3_RST#
CLK3_PCLKMICOM
CHP3_SERIRQ

2
3

C376
0.018nF

Y2

10MHz

2801-004665

P10
P11
P12
P13
P14
P15
P16
P17

0903-001439

P80
P81
P82
P83
P84
P85
P86

P30
P31
P32
P33
P34
P35
P36
P37

P90
P91
P92
P93
P94
P95
P96
P97

25
24
23
22
19
18
17
16

5
6

C363

100nF
10V

100nF
10V

1
2
3
4
MNT1
MNT2

C375

10K 1%

R283

10K 1%

R759

4.7K

1%

R765

4.7K

1%

10K

1%

R732

ADT3_SEL#

C808

BAT3_DETECT#

C699

R284

P3.3V_MICOM

KBC3_SMCLK#

P3.3V

nostuff
KBC3_WAKESCI#
3711-000456
KBC3_A20G
PCI3_CLKRUN#
To support Micom Crisis

KBC3_RFOFF#
KBC3_SPKMUTE
KBC3_THERM_SMCLK

4.7nF

25V

nostuff

TP2270

1
2
3
4

KBC3_MODE
KBC3_RFOFF#
KBC3_SPKMUTE

P5.0V_AUX

MODE0
TX
RX
GND

C374

FOR EMI

1nF
50V

R784
10K
1%

P3.3V_MICOM

P3.3V_MICOM

R730

10K 1%

R292

To support Micom Crisis

R291
100K
1%

10K
1%

R290
10K
1%

KBC3_SMDATA#

KBC3_BLCKPWRSW#
KBC3_PWRSW#

KBC3_CHKPWRSW#
C364

330nF
10V

Q34
RHU002N06

0.018nF

KBC3_SMDATA#

J509
HDR-4P-1R-SMD

KBC3_MODE

P5.0V

KBC5_TDATA

300K
1%

CHP3_SLPS3#
PEX3_WAKE#
KBC5_KSO(8:15)

KBC3_CHKPWRSW#
ADT3_SEL#
THM3_ALERT#
CHP3_SUSSTAT#
CHP3_SLPS5#

100K
1%

KBC5_TCLK

R285

KBC3_CHGEN

93
94
95
96
97
98
99

10nF
25V

P3.3V_MICOM

P3.3V

VRM3_CPU_PWRGD
LID3_SWITCH#
KBC3_PRECHG

8
9
10
11
12
13
14
15

R810

nostuff
nostuff
nostuff
nostuff
nostuff
nostuff
nostuff

p.
s

KBC3_LED_ACIN#
KBC3_LED_CHARGE#
KBC3_SMCLK#

26
27
28
29
32
33
34
35
38
39
40
41
42
43
44
45

C783

u/
x/

STBY*

4
9

P70
P71
P72
P73
P74
P75
P76
P77

P20
P21
P22
P23
P24
P25
P26
P27

XTAL
EXTAL

VCCB
VCL

6
5
MD0
MD1

36
37
59
VCC_1
VCC_2
VCC_3

U517
H8S-2110B

P60
P61
P62
P63
P64
P65
P66
P67

14
13
12

om

79
78
77
76
75
74
73
72

P50
P51
P52

KBC3_RSMRST#
KBC3_SUSPWR
KBC3_THERM_SMDATA
KBC3_BKLTON
KBC3_PWRBTN#
KBC3_VRON
KBC3_BLCKPWRSW#
KBC3_CPURST#

yc

0
1
2
3
4
5
6
7

PB0
PB1
PB2
PB3
PB4
PB5
PB6
PB7

49
50
51
52
53
54
55
56

//
m

KBC3_EXTSMI#
KBC3_RUNSCI#
KBC3_USBPWRON#
KBC3_CHG4.2V
CLK3_PWRGD#
KBC3_LED_POWER#
KBC3_PWRGD
KBC3_PWRON
KBC5_KSI(0:7)

P40
P41
P42
P43
P44
P45
P46
P47

150K
1%

100nF
10V

tp
:

91
90
81
80
69
68
58
57

R829

C369

ht

KBC5_TCLK
KBC5_TDATA
KBC3_SCLED#
KBC3_NUMLED#
KBC3_CAPSLED#

VSS_1
VSS_2
VSS_3
VSS_4
VSS_5

PA0
PA1
PA2
PA3
PA4
PA5
PA6
PA7

15
46
70
71
92

48
47
31
30
21
20
11
10

KBC3_NB_PWRGD#

NMI
RES*
RESO*

7
1
100

KBC3_RST#
KBC3_CHKPWRSW#

THM3_STP#

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
1

10K
1%

4.7K
1%

Q541
RHU002N06

R287

R796

Q533
BSS84

47K
100K

10V

R816

1203-002364

C790
100nF

To support Micom Crisis


P5.0V

1
1

nostuff

100nF

10K
1%

Q532
RHU002N06

100nF

R288

C371
100nF

C372

VDC P3.3V_MICOM

KBC3_MODE

R296
C373

100
1%

R289

0
nostuff

POWER SWITCH BLOCK WHILE MICOM UPDATE

MICOM Crisis Update

SAMSUNG

Condition: P90=P91=P92=High(MICOM_P3V)
MD0=MD1=Low(0V)
Serial Port: P84 & P85
4

ELECTRONICS

SRP Sheet Number: 38 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

LAN (88E5057)
Need at least 2.5mm or more clearance
from conductive material
P3.3V_AUX

P3.3V_AUX P3.3V
R512

For Removing P1.8V_AUX


VR Switching Noise

C49

C534

C544

C547

100nF
10V

100nF
10V

100nF
10V

100nF
10V

P1.2V_LAN

C518

C546

C533

C517

C545

C516

10000nF
6.3V

100nF
10V

100nF
10V

100nF
10V

100nF
10V

100nF
10V

nostuff

P1.8V_P2.5V_LAN

C19

C539

C527

C529

C21

10000nF
6.3V

100nF
10V

100nF
10V

100nF
10V

100nF
10V

2
7
13
33
39
44
48
58
32
28
22
19
57
52
51
23
64

Place Nearby Pin32


88E8055 NOSTUFF
88E8057 STUFF

VDDO_TTL_1
VDDO_TTL_2
VDDO_TTL_3
VDDO_TTL_4
AVDDH

CTRL12
PD18LDO
NC_1
NC_2

VMAIN_AVLBL

LOM_DISABLE#
XTALI

XTALO

AVDD18_OUT
AVDDL_2
NC_4
AVDDL_1
NC_12
NC_11
NC_10

LAN3_ACTLED#
LAN3_LINK10_100#
LAN3_LINK1000#

Trace width 12mils

3
4

CTRL_12

9
11

P3.3V_AUX P3.3V

NC_3

VDD_1
VDD_2
VDD_3
VDD_4
VDD_5
VDD_6
VDD_7
VDD_8

59
60
62
63

12

R530

47

R514

10

R531

4.7K

1%

15

46
29
24
25
16

10
11
12

TCT4
TD4+
TD4-

MCT4
MX4+
MX4-

13
14
15
16

15
14
13

For EMC Review PR-10


on 17-Dec-08

C827

C5

1nF
3KV

1nF
3KV

Trace width 12mils


Place crystal within 0.75inches from LAN chip.

2801-004517

R15

C531

C528

0.015nF
50V

0.015nF
50V

LAN3_ACTLED#
LAN3_LINK1000#
LAN3_LINK10_100#

4.99K

THERMAL

P3.3V_AUX P3.3V_AUX

MNT1
MNT2
MNT3
MNT4
3722-002390

FOR EMI

R4

R3

475
1%

475
1%
221

R24 1%

R5

P3.3V_AUX
B9
BLM18PG181SN1
FOR EMI
C515

C28

100nF
10V

100nF
10V

R62

4.7K
1%

C2

C3

C24

1nF
50V

1nF
50V

1nF
50V

For EMC Review PR-11


on 17-Dec-08

65

P1.2V_LAN

U3
BCP69-16

C31

C41

100nF
10V

4700nF-X5R 22000nF-X5R
20%
10V

C50
6.3V

C44

C47

C40

10000nF
6.3V

4700nF-X7R
6.3V

100nF
10V

nostuff
nostuff

CTRL_12

C828

C829

C837

C836

C830

C831

C832

C833

C834

C835

1nF
50V

1nF
50V

1nF
50V

1nF
50V

1nF
50V

1nF
50V

1nF
50V

1nF
50V

1nF
50V

1nF
50V

For EMC Review PR-12


on 17-Dec-08

100nF
10V

18
17
16

P3.3V_AUX

P1.8V_P2.5V_LAN

P3.3V

MCT3
MX3+
MX3-

1%

NC_5
NC_13
1205-003587

P3.3V_AUX

7
8
9

Y500
25MHz

14

TESTMODE
NC_8
NC_6
NC_7
RSET

100nF
10V

2603-000107

tp
:

VPD_CLK
VPD_DATA

TCT3
TD3+
TD3-

21
20
19

LED_ACTIVE#
LED_LINK10_100#
LED_LINK1000#
LED_DUPLEX#

SPI_CLK
SPI_DI
SPI_DO
SPI_CS#

MCT2
MX2+
MX2-

TD+
TDRD+
TERM1
TERM2
RDTERM3
TERM4
GREEN+
GREENYELLOW+
YELLOW-

1
40
45
61

P3.3V_AUX

C541

CLKREQ#
NC_9

TCT2
TD2+
TD2-

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
C530

ht

P3.3V_AUX

4
5
6

100nF
10V

24
23
22

38
41

C524

MCT1
MX1+
MX1-

1%
1%
1%
1%

37
35
34
36

nostuff

LAN3_MDI3P
LAN3_MDI3N
LAN3_MDI2P
LAN3_MDI2N
LAN3_MDI1P
LAN3_MDI1N
LAN3_MDI0P
LAN3_MDI0N

TCT1
TD1+
TD1-

75
75
75
75

LOM3_CLKREQ#

1
2
3
4
5
6
7
8
9
10
11
12

R11
R9
R8
R6

42
43

R511 0

30
31
26
27
20
21
17
18

1
2
3

u/
x/

10V
10V

MDI+_3
MDI-_3
MDI+_2
MDI-_2
MDI+_1
MDI-_1
MDI+_0
MDI-_0

PERST#
WAKE#
REFCLK+
REFCLKTX+
TXRX+
RX-

100nF
10V

p.
s

100nF
100nF

U503
88E8057
5
6
55
56
49
50
54
53

C514

om

C520
C525

4.7nF 25V

yc

C809

JACK-LAN-8P-LED

LT500
LFE9261-R

//
m

4.7K
1%

R513
4.7K
1%

PEX3_RST#
PEX3_WAKE#
CLK1_PCIELOM
CLK1_PCIELOM#
PEX1_GLAN_RXP2
PEX1_GLAN_RXN2
PEX1_GLAN_TXP2
PEX1_GLAN_TXN2

J506
P1.8V_P2.5V_LAN

C839

C838

100nF
10V

100nF
10V

For EMC Review PR-14


on 19-Dec-08

SAMSUNG
ELECTRONICS

SRP Sheet Number: 39 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

MDC connector

BLUETOOTH
Bluetooth 2.0 Standard

P3.3V
R837

P3.3V_AUX

33
1%

R522

R523

10K
1%

10K
1%

13
14
15
16
17
18

3710-002133

nostuff

nostuff

SOCK-12P-2R-SMD

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
HDA3_MDC_BCLK

C12

C13

100nF
10V

10000nF
6.3V

R529
10K
1%

nostuff

BA61-00963A|screw-115-4b

0
0

C770
100nF

9
10

C771
100nF

3711-002162

C526

C558

1nF
3KV

1nF
3KV

CIC21J601NE
B510

10K
1%

C
BLT1
HDR-8P-1R-SMD
1
2
3
4
5
6
7
8
MNT1
MNT2

3.3V
GND
USB+
USBCH_CLK / BLT_PRI
CH_DATA
LINK_IND
MODULE_DETECT

3711-003688

MainBD to RJ11
MDC1
HDR-2P-1R

3
4

1
2
MNT1
MNT2

CAMERA

3711-003609

P5.0V

ht

HDR-2P-1R
J507

3
4

R825

10V

10V

//
m

1
2
MNT1
MNT2

B509
CIC21J601NE

R797
R805

nostuff
nostuff

tp
:

MDC Module to MainBD

300K
1%

yc

BA70-00601A

M500
HEAD
DIA
LENGTH

om

EMI
CONTACT-PLATE-EMI

R812

SI2315BDS-T1

B523
ACM2012-900-2P-T

USB3_P5+
USB3_P5-

EMI500

R16

Q542

nostuff
nostuff
nostuff

HDA3_MDC_SYNC
HDA3_MDC_SDI1
HDA3_MDC_RST#

PIN2 Tied to P3.3V_AUX, 060812

u/
x/

HDA3_MDC_SDO

2
1
3
4
5
6
7
8
10
9
11 12
MNT1
MNT2
MNT3
MNT4
MNT5
MNT6

p.
s

U504

B10
ACM2012-900-2P-T

Camera
B7
BLM18PG181SN1 CAMERA1
HDR-4P-SMD

USB3_P8USB3_P8+

C37

C38

100nF
25V

100nF
25V

5
6

1
2
3
4
MNT1
MNT2
3711-000922

SAMSUNG
ELECTRONICS

4
COM-22C-015(1996.6.5) REV. 3

2
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN

SRP Sheet Number: 40 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

LEDS
P3.3V

TOUCH PAD

475
1%

0601-002037

475
1%

0601-002037

R834
R835

LED3
LED4

Blue 1608size
2 LTST-C193TBKT-AC

Blue 1608size
2 LTST-C193TBKT-AC

Blue 1608size

LED5 1

475
1%

0601-002037

475
1%

0601-002037

2 LTST-C193TBKT-AC

P3.3V

Blue 1608size
R830

LED6 1

2 LTST-C193TBKT-AC

KBC3_NUMLED#

NUMLOCK

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
KBC3_CAPSLED#

CAPSLOCK

KBC3_SCLED#

SCRLLOCK

CHP3_SATALED#

HDD LED

WLON_LED#

WLAN ON

KBC5_TDATA
T_R_BUTTON#
T_L_BUTTON#
KBC5_TCLK

u/
x/

0601-002037

R833

2 LTST-C193TBKT-AC

p.
s

475
1%

3
1

O
G

Amber

U522
BSS84

R818

R820

Green
0601-001130
P3.3V_MICOM

1
G

BSS84
U523

150
1%

R817

P3.3V_AUX
U524
7SZ14

LED8
5

LTST-C193TBKT-AC
0601-002037

Blue 1608size

R831

475
1%

R821
1M
1%

+
3

10K
1%

10K
1%

//
m

LED9
SML-020MLT-T86

C104

C107

0.1nF
50V

0.01nF

0.01nF
0.5pF
50V

0.5pF

50V

C103
100nF
10V

7
8

TP_SWITCH
P5.0V

nostuff

D519
DA204K-T147

T_L_BUTTON#

KBC3_LED_CHARGE#

tp
:

150
1%

SW2
SW-TACT-4P
Height : 5mm

3404-001311

P5.0V

KBC3_LED_ACIN#

ht

P3.3V_MICOM

C105

0.1nF
50V

yc

Adaptor-In / Charging LED

C106

1
2
3
4
5
6
MNT1
MNT2

For EMC Review PV-1 in 21-Oct-08

om

WIRELESS

R819

3708-002402
CONN-6P-FPC
TPAD1

P5.0V

Blue 1608size
LED2

R832

nostuff

D15
DA204K-T147

T_R_BUTTON#

3
4

SW3
SW-TACT-4P
Height : 5mm

3404-001311

KBC3_LED_POWER#

C794
1000nF
6.3V

SAMSUNG
ELECTRONICS

4
COM-22C-015(1996.6.5) REV. 3

2
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN

SRP Sheet Number: 41 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

KEYBOARD

Main to SUB Connector


P3.3V

P5.0V_AUX

C
PEG3_TXCP_HDMI_C
PEG3_TXCN_HDMI_C
PEG3_TX1P_HDMI_C
PEG3_TX1N_HDMI_C
PEG3_HPD_HDMI
PEG5_HDMI_CLK
C22

C7

0.1nF
50V

0.1nF
50V

42
44
46

MNT2
MNT4
MNT6

MNT1
MNT3
MNT5

u/
x/

KBC5_KSO(0:15)

USB3_P2+
USB3_P2-

KBC3_USBPWRON#

PEG3_TX2P_HDMI_C
PEG3_TX2N_HDMI_C
PEG3_TX0P_HDMI_C
PEG3_TX0N_HDMI_C

p.
s

USB3_P6+
USB3_P6-

LID3_SWITCH#

41
43
45

C8

C9

100nF
10V

100nF
10V

5
6

26
27

tp
:

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
MNT1
MNT2
3708-002166

//
m

3710-002648

J5
FPC-KBD-25P

7
8
9
10
11
12
13
14
15

PEG5_HDMI_DATA

yc

USB3_P0+
USB3_P0-

20K
1%

1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39

om

2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40

0
1
2
3
4
5
6
7
0
1
2
3

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
R7

J2
SOCK-40P-2R-SMD
KBC3_PWRSW#

KBC5_KSI(0:7)

P5.0V_AUX P3.3V

DEBUG PORT

ht

P5.0V P3.3V

DEBUG500
HDR-10P-1R-SMD

PLT3_RST#
CLK3_DBGLPC
LPC3_LFRAME#
For EMC Reivew PV-6
in 21-Oct-08

C812

C810

C811

0.01nF
0.5pF
50V

0.01nF
0.5pF
50V

0.01nF
0.5pF
50V

3
2
1
0

C295
LPC3_LAD(3:0)
nostuff nostuff

1nF
50V

1
2
3
4
5
6
7
8
9
10

11 MNT1
12

FOR DEBUG

MNT2

3711-000386

FOR EMI

SAMSUNG
ELECTRONICS

SRP Sheet Number: 42 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

CHARGER & POWER MANAGEMENT


VDC_ADPT

VDC

D7
B340A

1%

R21

Q9
AP4435GM
R517

R22

100K
1%

43.2K
1%
3

R546

R545

300K
1%

2.2

P3.3V_MICOM

22

C561

EC504
68uF

EC505
68uF

25V
AL

25V
AL

R27

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
1

Q10
RHU002N06

Q13-2
SI4804BDY-T1-E3

D1 5

D2

C562

27.4K
1%

U505
ISL6256AHRZ-T

1000nF

25V

G_CHG

(1.26V)

G_CHG

C66
1000nF

10K
1%

R555

30.1K

10K
1%

0.1%

475K
1%

BOOT
UGATE
PHASE
LGATE
PGND

CHLIM
VADJ
ACLIM
ICM

3
4

R83

VREF

R553

BGATE

CSOP
CSON
VREF
EN

CSIN

VDDP
VDD

R74
100
1%

C63

ht

Q20
RHU002N06

VREF

CSIP

SGATE
DCIN
ACSET
DCSET

tp
:

10K
1%

R84

13
26

7
9
8
5

R82

KBC3_PRECHG

1%
5.1

R58

25V

18
25
27
28

C64

6.8nF
50V

23
24

10nF
16V

20

ICOMP
VCOMP

CELLS
GND

ACPRN
DCPRN

THERM

14
15
16
12
11

R547

G_CHG

G_CHG

R80

R552

R554

43.2K
1%

100K

30.1K
1%

0.1%

C69

100nF
25V

R69

R549

10K
1%

R59

R60

22

22

C36
1nF
50V

For EMC Review


PR-3 on 15-Dec-08
Q13-1
SI4804BDY-T1-E3

100nF
25V

47nF
50V

For EMC Review


PV-11
on 31-Oct-08

VREF ( 2.39V )

G_CHG

R78
KBC3_CHG4.2V
Low : 1.748V@4.302V(2800Cell)
High : 1.196V@4.199V(2600Cell)

10K
1%

G_CHG

G_CHG

G_CHG

G_CHG

B507
BLM18PG181SN1

nostuff

50V

BAT3_SMDATA#
C522
0.1nF

B506
BLM18PG181SN1

nostuff

50V

B
BAT3_SMCLK#
C521
0.1nF

nostuff

50V

For EMC Review PV-11


on 31-Oct-08

CELLS
VDD

1K
1%

Cells N/B

GND

Float

P3.3V_MICOM

KBC3_CHGEN

C65
1nF
50V

P3.3V_MICOM

1
S

475K
1%

BAT3_DETECT#
C523
0.1nF

G_CHG G_CHG

R79

nostuff

For EMC Review


PR-4 on 15-Dec-08

R551

29

3711-006727

B508
BLM18PG181SN1

6
1

G_CHG

J504
BATT-CONN-7P

21
22

2
10

7
6
5
4
3
2

B525
HU-1M2012-121JT

C45

C559

3.3

1203-004471

nostuff

10

17

//
m

G_CHG

R57

10

For EMC Review PV-10


on 31-Oct-08

19

G_CHG

R45

To enhance
DMB performance (060310)

HU-1M2012-121JT
B2
B524
HU-1M2012-121JT

D4
BAV99LT1

R77

10nF
16V

G_CHG

SIQ1250-8R2PF

25V

30.1K
1%

om

R75

150K
1%

300K
1%

15.15V@1.264V

C70

R81

R73

300K
1%

300K
1%

D2

R66

D9
BAT54A

yc

R550
200K
1%

100nF
25V

nostuff
R71

D1 7

0.02
1W
1%

470K

C58

VDC

VDC_ADPT

BGATE

HU-1M2012-121JT
B3

R535

L502
8.2uH

1nF 50V

nostuff nostuff

C815

25V

10000nF

R18

C16

R63

p.
s

25V

10000nF

C17

25V

D5
BAV99LT1

100nF

25V

50V

C29

100nF

u/
x/

C30

VREF

D1
D2
D3
D4

BGATE

10K
1%

ADT3_SEL#

S1
S2
S3
G

Q6
AP4435GM

100nF

Q14
SI2307BDS-T1-E3

100nF
25V

25V

EMI

VCHG=12.906V
IPRECHG=0.27A
ICHG=2.56A FOR 5200mAh & 4000mAh

C26

D1 S1
D2 S2
D3 S3
D4 G

D1
D2
D3
D4

10000nF

S1
S2
S3
G

C18

1000nF

50V

C519
25V

D
8
7
6
5

1nF

100K
1%

1
2
3
4

1nF

R515

10nF

0.02
1W

C11

C513
25V

R536

1
2
3
4

C6

B505
HU-1M2012-121JT

100nF
25V

C512
100nF
25V

8
7
6
5

8
7
6
5

R10

C510

1
2
3
4

nostuff

Q5
AP4435GM

B504
HU-1M2012-121JT

MNT2
MNT1
4
3
2

3722-002191

nostuff

D6
B340A

J502
JACK-DC-POWER-3P

Q19
RHU002N06

R548

BAT3_SMDATA#

20K
1%

G_CHG

G_CHG

SHORT501

BAT3_SMCLK#

R520

100 1%

R519

100 1%

ADT3_SEL#
(ACTIVE LOW)

KBC3_SMDATA#

KBC3_SMCLK#

SAMSUNG

INSTPAR

ELECTRONICS

G_CHG

SRP Sheet Number: 43 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

P3.3V_AUX & P5.0V_AUX


P5.0V_FILT

nostuff
R826

C795
0.022nF
50V

R822

nostuff
R813

27.4K
1%

VDC
R823
11.8K
1%

VO2
COMP2
VFB2
GND
VREF2
VFB1
COMP1
VO1

RdsOn 30mohm

R769
P3.3V_MICOM 14.7K

R781

12.7K
1%

C765

10000nF
6.3V

P12.0V_ALW
R836

R808

C786

Q543
MMBT3904

1
2

30.1K
1%

nostuff

ZD500
BZX84C12L

32
31
30
29
28
27
26
25

C767

1000nF
6.3V

Q531
AP6680AGM

C781

G_P3.3V

R795

3.3

100nF
25V

P5.0V_AUX (8A)

L509
3.9uH

S1 S2 S3

SIQ1048-3R9

1 2 3
5 6 7 8

D1 D2 D3 D4

Q524
AP6680AGM

EC514
330uF

C751
100nF
10V

6.3V
AL
2402-001120
18 mohm

S1 S2 S3

1 2 3

RdsOn 16.5mohm

P5.0V_ALW

C768

1000nF
6.3V

C762

10000nF
6.3V
2203-006852

G_P3.3V

R297

P5V OCP(Typ) : 10.3A


P3.3V OCP(Typ) : 6.8A

KBC3_SUSPWR

R802
47K

Q36
BSS84

Q37
MMBT3904

C378

P5.0V_FILT

R803

100nF
25V

nostuff
nostuff

100K
1%

P3.3V_AUX
R298

4.7K 1%

THM3_STP#

nostuff
nostuff

AUX5_PWRGD

1nF
50V

tp
:

VDC

5.1
1%

ht

P12V_ALW

R779

P5.0V_FILT

//
m

2203-006852

yc

1%

D1 D2 D3 D4

G_P3.3V

2402-001120
18 mohm

EN5
EN3
SKIPSEL
TONSEL
PGOOD2
U521
EN2
PGOOD1
EN1
VBST2
DRVH2 TPS51120RHBR VBST1
1203-004687
DRVH1
LL2
DRVL2
LL1
DRVL1
PGND2
CS2
VREG3
V5FILT
VREG5
VIN
CS1
PGND1

100nF
10V

6.3V
AL

PAD

5 6 7 8

3.3

1nF
50V

33

17
18
19
20
21
22
23
24

D2

Q35-1
SI4804BDY-T1-E3

C764

C788

8
7
6
5
4
3
2
1

R794

25V
AL

100nF
25V

100nF
25V

9
10
11
12
13
14
15
16

C778

8 7 D1

EC10
330uF

EC513
15uF

C782

G_P3.3V

SIQ1048-3R9

VDC

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
Q35-2
SI4804BDY-T1-E3
G

100K
1%

G_P3.3V

G_P3.3V

6 5 D1
D2

R815

11.8K
1%

100nF
25V

P5.0V_ALW

L4
3.9uH

R814

5.09V @ HDMI

C377

P3.3V_AUX

50V

u/
x/

TONSEL VREF2
5V / 3.3V : 280KHz / 430KHz
(4A)

0.1nF

p.
s

25V

AL

C791

43.2K
1%

om

EC11
15uF

R807

C797

C792

4700nF

4700nF
25V

25V

SHORT4

nostuff

A
G_P3.3V

SAMSUNG
ELECTRONICS

SRP Sheet Number: 44 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

CHIPSET POWER(VCC_NB & P1.2V)


D

D
VDC

P5.0V_AUX

VDC

EC8
10uF

C678

C679

C715
100nF

100nF
25V

25V
AL

100nF
25V

10V

EC9
10uF
25V
AL
2409-001117

2409-001117
3
1

4
3 2 1
8 7 6 5

SIQ1045-1R8PF

2.5V
AL

nostuff

EC511
330uF
2.5V
AL

C634
100nF
10V

D4 D3 D2 D1

10000nF
6.3V

G_P1.2V

R715

R712

Q516
AP6680AGM

3.3

VDD1

2
24
1
4
23

20K
1%

3 2 1

C367

R286

100nF

0.47nF

10V

50V

5.11K
1%

C368

2402-001316

R294

R293

40.2K
1%

14.7K
1%

FB1
VOUT1

5
22
6
10
9

C740

G_P1.2V

4.7nF
25V

BST2
DH2
LX2
DL2
ILIM2

FB2
VOUT2

EN1
PGD1
SS1
TON
RTN

EN2
PGD2
SS2

17
19
18
15
20

11
12

14
21
13

PAD

25

10V

C360
100nF
25V

R282

3.3

R281

11.8K
1%

C365

10nF

25V

D1 D2 D3 D4

Q518
AP6680AGM
L508
2.2uH

1 2 3
5 6 7 8

D1 D2 D3 D4

C750

C741

0.47nF
50V

100nF

(294KHz ~ 321KHz)

PCMC063T-2R2MN

Q521
AP6680AGM

S1 S2 S3

R772

R768

10K
1%

150K
1%

10V

(8A)

P1.2V

S1 S2 S3

C680

EC512
330uF

100nF
10V

2.5V
AL

1 2 3

6.19K
1%

R763

5 6 7 8

0.75*(1+Rtop/Rbot) = 1.214V

2402-001316

ESR Max = 16.5mohm

G_P1.2V

nostuff

G_P1.2V

yc

OCP@VCC_NB = IVally12.12A / RMS 13.0A


OCP@1.2V = I Vally 12.12A / RMS 12.9A

G_P1.2V

C728
100nF

G_P1.2V

16

1203-004685

G_P1.2V

P5.0V_AUX

VDD2

BST1
DH1
LX1
DL1
ILIM1

8
7

4
S3 S2 S1

0.015ohm

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
C702

100nF
25V

S3 S2 S1

C712

U11
SC415MLTRT

u/
x/

(245KHz ~ 268KHz)

L506
1.8uH

Q517
AP6680AGM

D515
BAT54A

C717

10000nF
6.3V

p.
s

(8A)

10V

om

D4 D3 D2 D1

VCC_NB

EC515
330uF

C716
100nF

8 7 6 5

(PowerPlay : 1.0 ~ 1.1V)

G_P1.2V

VDC

47K

Q33
RHU002N06

1nF
50V

C353

1
S

22nF
50V

KBC3_VRON

C736 R744

10K 1%

100nF
10V

G_P1.2V

R713
10K
1%

VCCP3_PWRGD

G_P1.2V

G_P1.2V

CHP3_STRAP

VCC_NB

1.0V

1.1V

0.75*(1+Rtop/Rbot) = 1.010V
0.75*(1+Rtop/Rbot) = 1.105V

P3.3V

G_P1.2V

tp
:

2K
1%

C749

Q32
RHU002N06

R584

G_P1.2V

D14
MMBD4148

1M
1%

ht

CHP3_STRAP

R758

//
m

R279

D518
MMBD4148
1

KBC3_VRON

C735 R757
100nF

SHORT506
R1608-SHORT

10K 1%

10V

G_P1.2V

A
G_P1.2V

SAMSUNG
ELECTRONICS

SRP Sheet Number: 45 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

CHIPSET POWER(P2.5V & P1.5V & P1.1V & P1.2V_AUX)

P1.5V

P2.5V
P3.3V_AUX

P2.5V

P5.0V_AUX

U511
MIC5219B

4700nF-X7R
6.3V

1203-002062

C652
1nF
50V

C653
1nF
50V

KBC3_PWRON

R662

1K
1%

C327
22000nF-X5R

C326

4.99K
1%

C644

10000nF-X5R
6.3V

R661

22000nF-X5R
6.3V

EC7
330uF
2.5V
AL

nostuff

5.11K

KBC3_PWRON

1%

6.3V

2
3

R667
1K
1%

LX_1

VIN_2

LX_2

EN

PGND_1

om

22000nF-X5R
20%
6.3V

22000nF-X5R
20%
6.3V

1
2
3

R569

KBC3_VRON

1K 1%

VIN_1

LX_1

VIN_2

LX_2

EN

6
13

R570
0

16

11

SYNCH
SGND_1
NC_1
SGND_2

9
10

NC_2
NC_3

EP

17

C672
0.047nF
50V

C665

C666

22000nF-X5R

22000nF-X5R
6.3V

6.3V

12

11

R681
121K
1%

SGND_1

NC_1

SGND_2

EP

R674
121K
1%

10

NC_2
NC_3

FB Ref =0.8V

SYNCH

17

R673
14.7K
1%

1203-005382

R666

yc

C588

0.047nF
50V

P1.1V

C231

C232

22000nF-X5R
20%
6.3V

22000nF-X5R
20%
6.3V

C814

4700nF-X5R
10V

P1.2V_AUX

EC517
330uF

2.5V
AL

nostuff

FB Ref = 0.8V

P3.3V_AUX

P1.2V_AUX

U8
MIC5258-1.2BM5

R568

13
16

100K
1%

VFB

R571
0

PGND_2

12

PG

P5.0V_AUX

nostuff

R577
40.2K
1%

PGND_1

1nF
50V

15

VDD

C581
7

14

L504
0.82uH

tp
:

C584

nostuff

R665

ht

U506
ISL8014IRZ-T

C585

//
m

P5.0V_AUX

15

PG

P5.0V_AUX

P1.1V

PGND_2

VFB

14

VDD

1nF
50V

p.
s

VIN_1

C659

(1.513V)

IHLP2525-CZ-0.82uH

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
1

R660

u/
x/

C639

P1.5V

L507
0.82uH

U512
ISL8014IRZ-T

1
5
IN
OUT
3
EN
4
2
GND ADJ

R567
0

C290

C293

4700nF
6.3V

100nF
10V

1
5
IN
OUT
2
GND
4
3
PG
EN
1203-002546

C296

10000nF
6.3V

EC6
330uF
2.5V
AL
nostuff

1203-005382

SAMSUNG
ELECTRONICS

SRP Sheet Number: 46 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

DDR2 Power

1.5*(1+Rtop/Rbot) = 1.84V
AMT Support VTTEN @ P5.0V_AUX
AMT Support VCCA @ P5.0V_ALW
AMT Support VDDP @ P5.0V_ALW
AMT Support EN_PSV PullUp R @ P5.0V_ALW

R217
10K
1%

C299
1nF
50V

P5.0V_AUX

R216

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
P5.0V_AUX

nostuff

1000nF

1nF

1000nF

6.3V

50V

6.3V

G_DDR

C615

P1.8V_AUX

1nF
50V

nostuff

G_DDR

G_DDR

C622

1000nF

R612

6.3V

13
12

17
16

DH
ILIM
LX

VTT_1
VTT_2

VTTIN_1
VTTIN_2

PGND_2
PGND_3

DL
VDDP

PGND_1
THERM

R615

C303

R220
0

23
21
22

R225

100nF
25V

15K
1%

L505
1.8uH

S1 S2 S3

1 2 3
5 6 7 8

C621

1000nF
6.3V

1000nF
6.3V

P0.9V

G_DDR

100
1%

C310

10000nF
6.3V

10000nF
6.3V

C619

1nF

50V

nostuff

G_DDR

R647

10

10

1 2 3

C611
100nF
10V

EC509
330uF

EC516
330uF

2.5V
AL

2.5V
AL

2402-001168

15mohm

nostuff

nostuff
nostuff
nostuff

R576
R179

nostuff

100
1%
100
1%

CPU1_VDDIO_FB#
CPU1_VDDIO_FB

D12
MMBD4148
1

R219

0
5%

R206

R205

AUX5_PWRGD

C302
2.2nF
50V

G_DDR

ht

C625

R622

R648

1nF
50V

Q509
AP6680AGM

P1.8V_AUX
(8A)
(321 ~ 359KHz)

SIQ1045-1R8PF

C635

S1 S2 S3

//
m

C614

P0.9V

tp
:

10
5%

R636

OCP : 10.07A

R611

CPU1_VTTSENSE

Q505
AP6680AGM

D1 D2 D3 D4

18
25

D1 D2 D3 D4

1203-003765

MEM1_VREF

5 6 7 8

19
20

yc

10

15
14

25V
AL

25V

10

24

100nF

100nF
10V

C616

BST

EC510
10uF

C627

100nF
10V

C301

EN_PSV

p.
s

C300

PGD

VTTEN
VDDQS
TON
FB
REF
COMP
VTTS
VCCA
VSSA

om

U9
SC486IMLTRT

11
3
2
6
8
9
10
5
4

G_DDR

470K

C820

R610

R606

G_DDR

100nF
10V

10

C819

R601

715K
1%

100nF
10V

R214

10
5%

R218

VDC

BAT54A
D512

C818

43.2K
1%

C817

P5.0V_AUX

VDC

u/
x/

P1.8V_AUX

KBC3_SUSPWR

nostuff

INSTPAR

SHORT502

G_DDR

SAMSUNG
ELECTRONICS

SRP Sheet Number: 47 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

CPU VRM [INTERSIL]


P5.0V

P5.0V

VDC
VDC

R543

R544

2.2

100nF

48
G_CPU

G_CPU

30
47
1K
1%

220
1%

VDD_NB Freq = 1 / ( ( 1.5*10^-6) * Rfsetnb ) Hz


: 303KHz@22Kohm

C542

C549

1K
1%

nostuff

P3.3V

P3.3V

C555

P5.0V

G_CPU

R31
R32
R30

R44

OFS/VFIXEN(1Pin)
3.3V

VFIXEN
OFS
Disable Enable

GND

Enable

Disable

5V

Disable

Disable

VFIXEN VID CODES


SVC
0
0
1
1

SVD
0
1
0
1

VOUT
1.4V
1.2V
1.0V
0.8V

40.2K 7
8
1%

1K
1%

19

G_CPU

R56

50V

1nF

50V

20
21

22

SVD
0
1
0
1

VOUT
1.1V
1.0V
0.9V
0.8V

COMP_0

PGND_0

VW0

ISP_0
ISN_0

32

CPU_CORE0

R541

R539

10

10

4
5
6
3

0
0
0

1%

1nF 50V
0.007nF 50V

C35

1%

C532

2.21k
1%

25V

EC5
330uF

C554

S1 S2 S3

FB_1

UGATE_1

COMP_1

BOOT_1
PHASE_1

44
45

SVD
SVC
ENABLE
PWROK

PGND_1

ISP_1
ISN_1

VSEN0
RTN0
VSEN1
RTN1

nostuff
C15 nostuff
1nF
50V

50V

Q4
SI7686DP-T1-E3

PGOOD

220nF
25V

26

25
27

5 nostuff

C20

R17

1 2 3
5
D

S1 S2 S3

1 2 3

EP

1nF
50V

Q8

25V
AL

25V
AL

CPU_CORE1

MPO104-R39

SI7634BDP-T1-E3

R533

R527

10

10

R13

C14

2.21k
1%

25V

220nF

EC2
330uF

EC1
330uF

2V
AL

2V
AL

C548

S1 S2 S3

1nF

1 2 3

R14

nostuff
nostuff
nostuff

50V

4.99K

C540

C535

1nF
50V

1nF
50V

VDC

12.7K
1%

C34

220nF
25V

C43

C42

100nF
25V

4700nF
25V

4700nF
25V

PCMC063T-4R7MN

Q504-1
SI4804BDY-T1-E3 G

D1 7

PLACE NTC NEXT TO "L"

EC3
330uF

2V
AL

D2

TH500
NTCG163JF103HT

VDD_CPU_NB

L503
4.7uH

Place 4700nF like Zigzag

C560

Q504-2
D1 5 6
D2 SI4804BDY-T1-E3

39

EC503
10uF

L500
0.39uH

S1 S2 S3

1 2 3
5

2402-001306
6mohm

VDD_CPU_NB

40

FB_NB

R43

OCSET_NB
VSEN_NB
RTN_NB

100nF
25V

EC502
10uF

R12

COMP_NB

PGND_NB

C10

1%

36
38

FSET_NB

TH501
NTCG163JF103HT
VDC

23
24

37

PLACE NTC NEXT TO "L"

28

R41

LGATE_NB

2V
AL
2402-001306
6mohm

Q3
SI7686DP-T1-E3

nostuff
nostuff

BOOT_NB
PHASE_NB

C4

G_CPU

UGATE_NB

EC4
330uF

12.7K
1%

S1 S2 S3

29

OFS_VFIXEN

0.33nF

46

C536

1nF
50V

Q7
SI7634BDP-T1-E3

VW1

R518

nostuff
nostuff
nostuff

1nF

1 2 3

2V
AL

220nF

1%

G_CPU

VIDFF_1

nostuff
nostuff

20K

R516

R521

13
14

RBIAS
OCSET

LGATE_1

49
SVC
0
0
1
1

25V
AL

MPO104-R39

1 2 3

1nF

Pre-PWROK Metal VID

Q17
G

FB_0

50V

C32
C33
150K

25V
AL

L501
0.39uH

S1 S2 S3

1 2 3
5

SI7634BDP-T1-E3

3.3nF

C550

VRM3_CPU_PWRGD

EC507
10uF
2409-001117

4.99K

1nF
50V

G_CPU

nostuff
R33
2K
1%

11

15
16
18
17

CPU1_VDD0_FB
CPU1_VDD0_FB#
CPU1_VDD1_FB
CPU1_VDD1_FB#

10

12

6.19K
1%

C543
nostuff
nostuff

0
0

1 2 3
5

S1 S2 S3

tp
:

R26
R23

R28

LGATE_0

ht

CPU1_SVD
CPU1_SVC
KBC3_VRON
VCCP3_PWRGD
CPU1_PWRGDCPU

R25

S1 S2 S3

31

0.18nF 50V

R524
R540

VIDIFF_0

1nF

220
1%

G_CPU

1K
1%

1nF

50V

121K
C551
1%

R537

100nF
25V

Q18
SI7634BDP-T1-E3

50V

R528

R538

R542

50V

75K R19
5%

G_CPU

R29

VCC

3.3nF

C552

6.19K
1%

C537
R20

35
33

0.18nF 50V

R525

P1.8V

121K
C538
1%

R526

BOOT_0
PHASE_0

1nF
50V

EC506
10uF

Q12
SI7686DP-T1-E3

C39

u/
x/

VDD Freq = ( R_VW & COMP / 2.33 + 0.29 ) uS


: 342.6KHz@6.8Kohm

UGATE_0

nostuff

C25

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

R532
R534

VIN
PVCC

p.
s

G_CPU

220nF
25V

34

C23

U2
ISL6265HRTZ-T

25V

om

10V

C557

1000nF-X7R
6.3V

100nF

Q11
SI7686DP-T1-E3

yc

C553

C556

2.2

//
m

41
43
42

R42

100
1%

12.7K
1%

nostuff
CPU1_VDDNB_FB
CPU1_VDDNB_FB#

R54 nostuff

1203-005313

100
1%

G_CPU

SAMSUNG
ELECTRONICS

SHORT500

G_CPU

SRP Sheet Number: 48 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

Switched Power

Switched Power On (P3.3V)

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
D

VCCP3_PWRGD
KBC3_PWRON

R212

R211

3 Q29

RHU002N06

C294

S1 S2 S3

1 2 3

EC508
330uF

2200nF-X5R
10V

2.5V
AL

22nF

C274

50V

Q31
RHU002N06

//
m

yc

Q522 1
S 2
RHU002N06

300K
1%

S1 S2 S3

1 2 3

25V

om

KBC3_PWRON

R204

470K

P1.8V

Q26
AP6680AGM

R207

nostuff

10nF

4700nF
10V

RHU002N06
C758

KBC3_PWRON_INV#

C769

3 Q523

p.
s

nostuff

470K

R771

470K

D1 D2 D3 D4

R766
100K
1%

5 6 7 8

R767

P1.8V_AUX

P12.0V_ALW

D1 D2 D3 D4

P3.3V

Q529
AP6680AGM

5 6 7 8

P3.3V_AUX

P12.0V_ALW

u/
x/

P5.0V_ALW

Switched Power On (P1.8V)

P5.0V_AUX

Q519
AP4435GM

100nF
10V

100K
1%

R701

KBC3_PWRON

10K
1%

Q515
RHU002N06

1
S

1
2
3
4

S1
S2
S3
G

D1
D2
D3
D4

8
7
6
5

P5.0V

P5.0V_AUD

SHORT3

ht

C693

R705

tp
:

Switched Power On (P5.0V)


B

C669

C664

100nF
10V

4700nF
10V

SHORT2

C354

SHORT1

100nF
10V

SAMSUNG
ELECTRONICS

SRP Sheet Number: 49 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

POWER DISCHARGER

P5.0V_ALW

P1.8V_AUX

P5.0V_AUX

P3.3V_AUX

R776

R775

R774

100K
1%

1K
1%

49.9
1%

10

nostuff

nostuff

nostuff

nostuff

R777

R783

10K

1%

Q528
RHU002N06

Q527
RHU002N06

nostuff

nostuff

Q526
RHU002N06

nostuff

Q525
RHU002N06

nostuff

P3.3V

P5.0V

P1.5V

yc

om

p.
s

nostuff

u/
x/

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
D

KBC3_SUSPWR

R792

R791

R790

R789

10

1K
1%

10
5%

49.9
1%

10

Q538
RHU002N06

Q537
RHU002N06

Q536
RHU002N06

nostuff

nostuff

nostuff

Q535
RHU002N06

Q534
RHU002N06

ht

tp
:

//
m

P1.1V

R793

nostuff

KBC3_PWRON_INV#

P1.8V

SAMSUNG
ELECTRONICS

SRP Sheet Number: 50 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

EMC
Added on 18-Sep-08

D
P1.2V

C737

P5.0V

P3.3V_AUX

10nF
16V

C567

C796

C631

C583

C799

C700

C322

1nF
50V

1nF
50V

1nF
50V

1nF
50V

1nF
50V

1nF
50V

1nF
50V

For EMC Review ADV1-16

P3.3V

VDD_CPU_NB

VDC

C800

C571

C613

C138

C163

C191

C121

1nF
50V

1nF
50V

1nF
50V

1nF
50V

0.1nF
50V

0.1nF
50V

R70

R76

C802

C803

1nF
50V

1nF
50V

For EMC Review PV-2

For EMC Review PV-3

yc

ht

tp
:

R72

//
m

nostuff
nostuff

C801

1nF
50V

P5.0V_AUX

P3.3V

P3.3V

G_AUD

P5.0V_AUX

P3.3V_AUX

om

P3.3V

p.
s

1nF
50V

u/
x/

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
Added on 21-Oct-08

For EMC Review PV-4

P3.3V

For EMC Review PV-5

P3.3V

C804

C805

C806

C807

1nF
50V

1nF
50V

1nF
50V

1nF
50V

P5.0V_AUX

For EMC Review PV-9

Added on 15-Dec-08
P3.3V

P3.3V

P3.3V

P3.3V

P1.2V

B
P3.3V

C823

C821

C822

C824

C825

C826

0.1nF
50V

1nF
50V

1nF
50V

0.1nF
50V

0.1nF
50V

0.1nF
50V

For EMC Review PR-5

For EMC Review PR-6

For EMC Review PR-8

SAMSUNG
ELECTRONICS

SRP Sheet Number: 51 of 55

SAMSUNG PROPRIETARY

FAN-NUT

CPU RHE

M1
HEAD
DIA
LENGTH

M2
HEAD
DIA
LENGTH

BA81-02753A

BA81-02753A

THERMAL-NUT
M3
HEAD
DIA
LENGTH

MT9
RMNT-38-70-1P

MT12
RMNT-38-70-1P

MT8
RMNT-38-70-1P

MT6
RMNT-30-76-1P

MT5
RMNT-30-76-1P

MT17
RMNT-30-76-1P

MT13
RMNT-30-76-1P

MT10
RMNT-30-80-1P

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
M4
HEAD
DIA
LENGTH

M5
HEAD
DIA
LENGTH

BA61-00932A

BA61-00932A

MT20
RMNT-30-70-1P

MT14
RMNT-30-76-1P

MT15
RMNT-30-76-1P

MT18
RMNT-30-76-1P

3.1 - 7.5

MT16
RMNT-25-76-1P

MT7
RMNT-25-76-1P

p.
s

BA61-00932A

MT11
RMNT-38-70-1P

u/
x/

THIS DOCUMENT CONTAINS CONFIDENTIAL


PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

B
C79

C78

C76

C93

C81

C77

C62

0.1nF
50V

0.01nF
50V

470pF
50V

1nF
50V

0.018nF
50V

10nF
16V

0.0015nF
50V

C72

C75

0.01nF
0.5pF
50V

0.007nF
50V
0.5pF

C99

0.022nF
50V

0.18nF
50V

C68

0.27nF
50V

C100
0.33nF
50V

ht

TP2206

C71

//
m

1 ~ 499 SIDE

tp
:

ICT Cap : need to change with last BOM

yc

om

500 ~ SIDE

C575

C569

C572

C577

C570

C573

C568

C578

C576

C574

0.01nF
50V

0.015nF
50V

0.018nF
50V

0.18nF
50V

0.033nF
50V

0.1nF
50V

470pF
50V

1nF
50V

0.022nF
50V

0.047nF
50V

PCB REVISION CONTROL ( ICT )

NO CONNECTION DATE(YY/MM/DD)

REV500

ICT PORT

VDC VCC_NB P3.3V

P5.0V

J513
HDR-10P-1R-SMD
1
2
3
4
5
6
7
8
9
10

R733
R731

AUX5_PWRGD
VCCP3_PWRGD
VRM3_CPU_PWRGD
CPU1_PWRGDCPU
CPU1_LDTRST#

1K 1%
1K 1%

N.C.

1-2

2-3

3-1

1-2-3

N.C.

1-2

2-3

3-1

10

1-2-3

REVISION

STEP

ADV1
PV
1.0

MP(PR)

11
MNT1
12
MNT2

TP2209
3711-005753

nostuff
nostuff
nostuff

SAMSUNG
ELECTRONICS

SRP Sheet Number: 52 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

EXP3_CLKREQ#
FAN3_FDBACK#
CHP3_NB_THERMDN
CHP3_NB_THERMDP
HDA3_AUD_SDO
HDA3_MDC_SDO
KBC3_CPURST#
KBC3_EXTSMI#

HDMI3_MS
SMB3_CLK
SPI3_CLK
ADT3_SEL#
AUD3_BEEP
AUD3_SPKR
KBC3_A20G
KBC3_VRON
CTRL_12
SPK5_L+
SPK5_LSPK5_R+
SPK5_RFAN5_VDD

p.
s

yc

om

PEG5_HDMI_CLK
AUD5_LINE_O_LEFT
AUD5_HP_O_RIGHT
AUD5_MIC1_RIGHT
AUD5_MIC2_RIGHT
AUD5_HP_O_LEFT
AUD5_MIC1_LEFT
AUD5_MIC2_LEFT
AUD5_MIC2_VREF
CHP1_THRMTRIP#
CHP3_BIOS_CRI#
CHP3_INTRUDER#

u/
x/

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
THM3_ALERT#
VCCP3_PWRGD
BAT3_DETECT#
BAT3_SMDATA#
CHP3_RTCRST#
SMB3_ALERT#
MIN3_CLKREQ#
PCI3_CLKRUN#
CHP3_NB_PWRGD
CHP3_SATALED#
CHP3_SB_TEST0
CHP3_SB_TEST2
CHP3_SUSSTAT#
PEG3_HPD_HDMI

CPU1_PROCHOT#

CPU1_VDD0_FB#
CPU1_VDD1_FB#
CPU1_VDDIO_FB
CPU1_VDDNB_FB
HDA3_AUD_BCLK
HDA3_AUD_RST#
HDA3_AUD_SDI0
HDA3_AUD_SYNC
HDA3_MDC_BCLK
HDA3_MDC_RST#
HDA3_MDC_SDI1
HDA3_MDC_SYNC
KBC3_CAPSLED#
KBC3_NB_PWRGD#
VRM3_CPU_PWRGD
CPU1_ALL_LDTSTP
KBC3_BLCKPWRSW#
KBC3_LED_POWER#
KBC3_PWRON_INV#
USB3_SUB_PWRON#
CHP3_STRAP
KBC3_LED_CHARGE#
KBC3_THERM_SMCLK
LAN3_LINK10_100#
CPU1_THRMTRIP#
CPU1_VDDIO_FB#
CPU1_VDDNB_FB#
CPU3_THRMTRIP#
USB3_SUB_DISCHG#
AUD5_LINE_O_RIGHT
KBC3_THERM_SMDATA
PEG3_HDMI_SUB_CLK

//
m

EXP3_CPPE#
KBC3_CHGEN
KBC3_PWRGD
KBC3_PWRON
KBC3_PRECHG
KBC3_PWRSW#
KBC3_RFOFF#
KBC3_SCLED#
KBC3_SMCLK#
KBC3_SUSPWR
KBC5_KSI(0)
KBC5_KSI(1)
KBC5_KSI(2)
KBC5_KSI(3)
KBC5_KSI(4)
KBC5_KSI(5)
KBC5_KSI(6)
KBC5_KSI(7)
KBC5_KSO(0)
KBC5_KSO(1)
KBC5_KSO(2)
KBC5_KSO(3)
KBC5_KSO(4)
KBC5_KSO(5)
KBC5_KSO(6)
KBC5_KSO(7)
KBC5_KSO(8)
KBC5_KSO(9)
MCD3_SDCD#
MCD3_SDCLK
MCD3_SDCMD
LCD3_BKLTON
LPC3_LAD(0)
LPC3_LAD(1)
LPC3_LAD(2)
LPC3_LAD(3)
CPU2_THERMDA
CPU2_THERMDC

KBC3_CHKPWRSW#
KBC3_LED_ACIN#
KBC3_USBPWRON#
LAN3_LINK1000#
PEG5_HDMI_DATA
KBC3_WAKESCI#
LCD3_EDID_CLK
PEG5_HDMI_SUB_DATA

LPC3_LFRAME#
MCD3_SDDATA0
MCD3_SDDATA1
MCD3_SDDATA2
MCD3_SDDATA3
MCH3_EXTTS0#

tp
:

KBC3_NUMLED#
KBC3_PWRBTN#
KBC3_RSMRST#
KBC3_RUNSCI#
KBC3_SMDATA#
KBC3_SPKMUTE
KBC5_KSO(10)
KBC5_KSO(11)
KBC5_KSO(12)
KBC5_KSO(13)
KBC5_KSO(14)
KBC5_KSO(15)
LAN3_ACTLED#
LID3_SWITCH#

ht

MCD3_SDWP
MEM1_VREF
PCI3_AD23
PCI3_AD24
PCI3_AD25
PCI3_AD26
PCI3_AD27
PCI3_AD28
PEX3_WAKE#
PEX3_RST#
AUD3_GPIO0#
AUD3_GPIO1#
BAT3_SMCLK#
CHP3_A_RST#
CHP3_GPIO16
CHP3_GPIO17
CHP3_SERIRQ
CHP3_SLPS3#
CHP3_SLPS5#
CLK3_DBGLPC
CLK3_PWRGD#
CPU1_ALERT#
CRT3_DDCCLK
CRT5_DDCCLK
CRT3_DDCDATA
CRT5_DDCDATA
EXP3_CPUSB#
EXP3_PERST#
SMB3_DATA
SPI3_CS0#
SPI3_MISO
SPI3_MOSI
THM3_STP#
WLON_LED#
AUD3_SHDN#
AUX5_PWRGD
CRT3_HSYNC
CRT3_VSYNC

T_L_BUTTON#
T_R_BUTTON#
KBC3_BKLTON
KBC3_RST#
KBC5_TCLK
KBC5_TDATA
P3.3V_AUX_EXP
P1.8V_P2.5V_LAN
VDC
VREF
VDC_INV
VDC_ADPT
VDD_CPU_NB
P1.1V
P3.3V_MCD
P5.0V_ALW
P5.0V_AMP
P5.0V_AUD
P5.0V_AUX
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
GROUND
BGATE
CPU_CORE0
CPU_CORE1
G_AUD
G_CHG
G_CPU
G_DDR
G_MIC

G_P1.2V
G_P3.3V
LCD_VDD3V
P0.9V
P1.2V
P1.5V
P1.8V
P2.5V
P5.0V_SUB
P12.0V_ALW
P3.3V_HDMI
P4.75V_AUD
P5.0V_FILT
P3.3V_MICOM
P3.3V
PRTC_BAT
P1.2V_AUX
P1.2V_LAN
P1.5V_EXP
P1.8V_AUX
P3.3V_AUX
P3.3V_EXP
VCC_NB
P5.0V
VCC_CRT

PEG5_HDMI_SUB_CLK
PEG3_HDMI_SUB_DATA

SAMSUNG
ELECTRONICS

SRP Sheet Number: 53 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

Sub Board (1/2)

P5.0V_SUB
P3.3V_SUB P5.0V_SUB

P5.0V_SUB

U501
TPS2062
2

C509

J1
SOCK-40P-2R-SMD

MNT1
MNT3
MNT5

USB3_SUB_P1+
USB3_SUB_P1-

G_SUB

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C

SW1
SW-TACT-4P

R509

150
1%

//
m

LED1
LTST-C193TBKT-AC

U500
7SZ08

USB3_SUB_DISCHG#

G_SUB

PGB1010603NR
D504

PGB1010603NR
D505

nostuff
nostuff

G_SUB G_SUB

J501
JACK-8P-LED-MNT
1
2
3
4

PWR0
USB0USB0+
GND1

5
6
7
8

PWR1
USB1USB1+
GND2

9
10
11
12

MNT1
MNT2
MNT3
MNT4

3722-002601

B502
ACM2012-900-2P-T

G_SUB

PGB1010603NR
D502

PGB1010603NR
D503
nostuff

P5.0V_SUB

C511

8
5
3
4

100nF
10V

tp
:

G_SUB G_SUB

U502
TPS2062

USB3_SUB_PWRON#

G_SUB

G_SUB

USB3_SUB_P1USB3_SUB_P1+

P3.3V_SUB

PEG5_HDMI_SUB_DATA

USB3_SUB_P0USB3_SUB_P0+

PEG3_TX0P_HDMI_SUB
PEG3_TX0N_HDMI_SUB

KBC3_SUB_PWRSW#

USB Ports

B503
ACM2012-900-2P-T

PEG3_TX2P_HDMI_SUB
PEG3_TX2N_HDMI_SUB

G_SUB

G_SUB

USB3_SUB_PWRON#

41
43
45

BSS84
Q503

G_SUB

3710-002648

G_SUB

6.3V
AL

100nF
10V

MNT2
MNT4
MNT6

100nF
10V

42
44
46

C501

C507

100nF
10V

1%

PEG3_HPD_HDMI_SUB
PEG5_HDMI_SUB_CLK

C506

0.033nF
50V

PEG3_TX1P_HDMI_SUB
PEG3_TX1N_HDMI_SUB

C505

u/
x/

PEG3_TXCP_HDMI_SUB
PEG3_TXCN_HDMI_SUB

EC500
100uF

1205-002596

p.
s

USB3_SUB_P6+
USB3_SUB_P6-

USB3_SUB_PWRON#

om

USB3_SUB_P0+
USB3_SUB_P0-

LID3_SUB_SWITCH#

1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39

1K

USB PORT 0 USB PORT 2

2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40

nostuff

R508

OUT1
OC1*
OC2* OUT2
EN1*
EN2* GND

yc

KBC3_SUB_PWRSW#

100nF
10V

nostuff

IN

8
5
3
4

IN

OUT1

OC1*
OC2* OUT2
EN1*
EN2* GND

EC501
68uF

C504

25V
AL

100nF
10V

nostuff

R510

C503

nostuff

1K

1%
1

USB3_SUB_DISCHG#

BSS84
Q1

0.033nF
50V

B
3

1205-002596

G_SUB

G_SUB

G_SUB

G_SUB

P3.3V_SUB

ACM2012-900-2P-T
B1

C508
100nF
10V

USB3_SUB_P6+
USB3_SUB_P6-

G_SUB

P5.0V_SUB

PGB1010603NR
D2

PGB1010603NR
D3

nostuff

R2

nostuff
nostuff

1K
1%

USB3_SUB_DISCHG#
D

USB3_SUB_PWRON#

G_SUB G_SUB

MT1
MT2
RMNT-30-76-1P RMNT-30-76-1P

GND
DATA+
DATAPWR
MNT1
MNT2
MNT3
MNT4
3722-002792

G_SUB

Q2
RHU002N06

1
S

MT4
MT3
RMNT-25-76-1P RMNT-25-76-1P

J503
JACK-USB-4P
1
2
3
4
5
6
7
8

USB PORT 6

1009-001010

SUPPLY
OUTPUT
GND

LID3_SUB_SWITCH#

ht

U1
A3212ELH/HED55XXU12

R1
100K
1%

DRAW

DATE

HS CHO
G_SUB

G_SUB

G_SUB

nostuff

11/26/2007

G_SUB
CHECK

G_SUB

TITLE

APPROVAL

nostuff

MP(PR)
REV

YB CHUN
MODULE CODE

SAMSUNG

DRESDEN-INT

DEV. STEP

HS LEE / BM LEE

G_SUB

1.00

ELECTRONICS

SUB
PART NO.

SUB BOARD (1/2)

BA41-01024~6A

LAST EDIT

December 24, 2008 14:36:53 PM

4
COM-22C-015(1996.6.5) REV. 3

PAGE

48

OF

49

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN

SRP Sheet Number: 54 of 55

SAMSUNG PROPRIETARY
THIS DOCUMENT CONTAINS CONFIDENTIAL
PROPRIETARY INFORMATION THAT IS
SAMSUNG ELECTRONICS COS PROPERTY.
DO NOT DISCLOSE TO OR DUPLICATE FOR OTHERS
EXCEPT AS AUTHORIZED BY SAMSUNG.

Sub Board (2/2)


P5.0V_SUB

miniSMDC110-2
TH1

CRS06
D1

4.7K
1%

PEG3_TX2P_HDMI_SUB
PEG3_TX2N_HDMI_SUB

R506

R504

2.2K

2.2K

J500
47408-0001

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19

PEG3_TX0P_HDMI_SUB
PEG3_TX0N_HDMI_SUB
PEG3_TXCP_HDMI_SUB
PEG3_TXCN_HDMI_SUB

om

p.
s

PEG3_TX1P_HDMI_SUB
PEG3_TX1N_HDMI_SUB

B501
B500

PEG3_HDMI_SUB_CLK
PEG3_HDMI_SUB_DATA

P3.3V_SUB

R500

Q500
MMBT3904

//
m

PEG3_HPD_HDMI_SUB

100K

BLM18PG181SN1
BLM18PG181SN1

1%

yc

g
n
l
u
a
s
i
t
m
n
a
e
S fid
n
o
C
R507

4.7K
1%

u/
x/

R505

nostuff

R501

P3.3V_SUB

R502
10K
1%

20
21
22
23

C502

C500

0.01nF
50V

0.01nF
50V

D500
BAV99LT1

C1

D501
BAV99LT1

nostuff

100nF
10V

nostuff

G_SUB

G_SUB

G_SUB

ht

10K
1%

MNT1
MNT2
MNT3
MNT4

tp
:

P5.0V_SUB

ESD

47K

G_SUB

TMDS_DATA2
TMDS_DATA2_SHIELD
TMDS_DATA2#
TMDS_DATA1
TMDS_DATA1_SHIELD
TMDS_DATA1#
TMDS_DATA0
TMDS_DATA0_SHIELD
TMDS_DATA0#
TMDS_CLOCK
TMDS_CLOCK_SHIELD
TMDS_CLOCK#
CEC
RESERVED
SCL
SDA
DDC_GROUND
5V_POWER
HOT_PLUG_DETECT

3701-001391

nostuff

EMI

R503

PEG5_HDMI_SUB_DATA

PEG3_HDMI_SUB_CLK

RHU002N06
Q502

1
S

PEG5_HDMI_SUB_CLK

nostuff

RHU002N06
Q501

PEG3_HDMI_SUB_DATA

Note: These FETs should be placed near HDMI Connector

A
DRAW

DATE

HS CHO
CHECK

11/26/2007

SAMSUNG

DRESDEN-INT

DEV. STEP

HS LEE / BM LEE
APPROVAL

MP(PR)
REV

YB CHUN
MODULE CODE

TITLE

1.00

ELECTRONICS

SUB
PART NO.

SUB BOARD (2/2)

BA41-01024~6A

LAST EDIT

December 24, 2008 14:36:53 PM

4
COM-22C-015(1996.6.5) REV. 3

PAGE

49

OF

49

1
D:/Project/dresden-int/081224_pr/DRESDEN-INT_MAIN

SRP Sheet Number: 55 of 55

12/24/108
14:53:46

tp
:

//
m

yc

om

p.

su

/x
/

Sheet51 --------------- Root[sheet45]


Sheet52 --------------- Root[sheet46]
Sheet53 --------------- Root[sheet47]
Sheet54 --------------- Root[sheet48]
Sheet55 --------------- Root[sheet49]

ht

Sheet1 --------------- Root[sheet1]


Sheet2 --------------- Root[sheet2]
Sheet3 --------------- Root[sheet3]
Sheet4 --------------- Root[sheet4]
Sheet5 --------------- Root[sheet5]
Sheet6 --------------- Root[sheet6]
Sheet7 --------------- Root[sheet7]
Sheet8 --------------- Root[sheet8]
Sheet9 --------------- Root[sheet9]
Sheet10 --------------- Root[sheet10]
Sheet11 --------------- Root[sheet11]
Sheet12 --------------- Root[sheet12]
Sheet13 --------------- Root[sheet13]
Sheet14 --------------- Root[sheet14]
Sheet15 --------------- Root[sheet15]
Sheet16 --------------- Root[sheet16]
Sheet17 --------------- Root[sheet17]
Sheet18 --------------- Root[sheet18]
Sheet19 --------------- Root[sheet19]
Sheet20 --------------- Root[sheet20]
Sheet21 --------------- Root[sheet21]
Sheet22 --------------- Root[sheet22]
Sheet23 --------------- Root[sheet23]
Sheet24 --------------- Root[sheet24]
Sheet25 --------------- Root[sheet25]
Sheet26 --------------- SPI_BIOS_ROM_16Mbit[sheet1]
Sheet27 --------------- Root[sheet26]
Sheet28 --------------- LCD_IF_14p1[sheet1]
Sheet29 --------------- Graphics_IF_CRT[sheet1]
Sheet30 --------------- Express_Card[sheet1]
Sheet31 --------------- Multi_MV_Au6371[sheet1]
Sheet32 --------------- PCIE_Minicard_Slot[sheet1]
Sheet33 --------------- Root[sheet27]
Sheet34 --------------- Root[sheet28]
Sheet35 --------------- Root[sheet29]
Sheet36 --------------- Root[sheet30]
Sheet37 --------------- Root[sheet31]
Sheet38 --------------- Root[sheet32]
Sheet39 --------------- Root[sheet33]
Sheet40 --------------- Root[sheet34]
Sheet41 --------------- Root[sheet35]
Sheet42 --------------- Root[sheet36]
Sheet43 --------------- Root[sheet37]
Sheet44 --------------- Root[sheet38]
Sheet45 --------------- Root[sheet39]
Sheet46 --------------- Root[sheet40]
Sheet47 --------------- Root[sheet41]
Sheet48 --------------- Root[sheet42]
Sheet49 --------------- Root[sheet43]
Sheet50 --------------- Root[sheet44]

Index_Page

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