BI C THM

Mt s thnh tu cng ngh c kh ch to th gi trong

th k XX v xu hng pht trin n nm 2030
Khoa hc v cng ngh (KH&CN) c kh ch to ca th gii trong th
k XX c nhng bc pht trin vt bc nh ng dng cc cng ngh hin
i nh: Cng ngh thng tin, vt liu nano, t ng ho... Trong kinh t, ngnh
cng nghip c kh ch to vn ng vai tr ch o, gp phn lm thay i din
mo th gii, vi trn 20 triu doanh nghip ang hot ng trn cc chu lc,
chim ti 28% s lng vic lm v ng gp 25% gi tr tng sn phm ca th
gii. Bi vit ny, tc gi gii thiu mt s thnh tu cng ngh c kh ch to
th gii trong th k XX v xu hng pht trin n nm 2030.
Cc giai on pht trin ca c kh ch to th gii t th k XX n nay
T nm 1900 n 1910: Ti trin lm Pari nm 1900 cp n cng ngh
gia cng ct gt kim loi. Nm 1906, F.W.Taylor v M.White pht trin my ct
gt kim loi. Nm 1909, Hng Ford p dng dy chuyn sn xut t ng.
T 1911 n 1930: Pht trin nhiu my cng c, dng c v vt liu ch to
mi. Nm 1921, t c cc nguyn cng hiu qu, Hng Ford bt u thc
hin php phn tch k thut lng vt liu cn thit trong gia cng ch to t.
T 1931 n 1940: Xut hin nhng phng php mi phn tch cc h
thng iu khin trong ngnh c kh ch to.
T 1941 n 1950: Nm 1946, my tnh in t u tin dng n in t
(ENIAC) do J.W.Mauchly v J.P.Eckert ch to. Nm 1947, thut ng T ng
ho (Automation) c D.S. Header ca Hng Ford Motor t ra. Cui nm
1949, bt u p dng iu khin t ng cho nhiu h thng, my mc v quy
trnh khc nhau.
Thp k 50: u thp k sng ch ra mch tch hp (IC) v my tnh s u
tin. Nm 1952, pht trin k thut iu khin s (Numerically Controlled-NC)
v khi u ca my cng c. Cui thp k 50, tng trng nhanh ngnh in t
v t ng ha.

Thp k 60: Nm 1960, ln u tin s dng rbt cng nghip do Unimate ch

to v Ford thc hin. Giai on 1960-1972, bt u p dng iu khin s bng
my tnh CNC (Computer Numerically Controlled- CNC) nh tin b ca cc
my tnh mini dn n vic nng cao nng sut, cht lng, chnh xc i vi
sn phm c kh ch to. Trong cc nm 1965-1966, ln u tin IBM v GM
(General Motors) p dng iu khin bng my tnh cho dy chuyn sn xut.
Nm 1968, b iu khin logic kh lp trnh PLC (Programmable Logical
Controllers) c thit k v s dng ti GM.
Thp k 70: u thp k 70 gia tng cc nghin cu iu khin s i vi
cc ng c tr ng nhm nng mc iu khin quy trnh gia cng. Nm
1971, M.E. Hoff sng ch ra b vi x l u tin Intel 4004. Nm 1973, a ra
khi nim ban u v ch to c tch hp my tnh CIM (Computer Integrated
Manufacturing). Nm 1974, Cincinati Milacron ln u tin a ra th trng
rbt c iu khin bng my tnh mini. Gia v cui thp k 70, H.Volckez
pht trin chng trnh thit k c tr gip bng my tnh - CAD (Computer
aid Design) v bt u p dng ch to c tr gip bng my tnh -CAM
(Computer aid Manufacturing). Nm 1977, xut hin my vi tnh c nhn.
Thp k 80: Tip tc t c nhiu tin b trong l thuyt iu khin, h thng
v tr tu nhn to nh nhn dng h thng, iu khin ngu nhin, iu khin
thch nghi, mng nron, h chuyn gia, logic m v quy hoch tin ho. H
thng ch to linh hot FMS (Flexible Manufacturing System) ra i, theo ,
nhiu loi sn phm c sn xut trn cng mt dy chuyn.
Thp k 90 n nay: Vic s dng cng ngh CAD/CAM i tr cho php,
ch to sn phm c kh nhanh hn, ch to cc loi my cng c c tc cao,
chnh xc, thng minh v hiu qu hn. Nm 1995, s dng rng ri thit b iu
khin my cng c da vo PC, phc v c cc chc nng PLC v CNC. Cng
trong nm 1995, m ra Pha 1 (1995-2005), Chng trnh Quc t IMS
(Intelligent Manufacturing Systems - Cc h thng ch to thng minh) vi s
tham gia ca 300 cng ty, vin nghin cu ca xtrylia, Canada, M, EU, Nht
Bn, Hn Quc v Thy S.

Nm 2005, bt u Pha 2 Chng trnh Quc t IMS.

Mt s thnh tu
Cng ngh gia cng ch to
S i mi lin tc ca CAD/CAM gip cho cc nh ch to tit kim v ti
chnh, thi gian, ngun lc, v CAD v CAM u l nhng phng php da
vo my tnh m ho d liu hnh hc, nn to kh nng cho cc quy trnh
thit k v ch to c tch hp cao . H CAD tt nhin khng hiu c cc
khi nim ca th gii thc, chng hn nh bn cht hay chc nng ca i
tng c thit k. H CAD thi hnh chc nng ca mnh nh kh nng m
ho cc khi nim hnh hc. Do vy, qu trnh thit k da vo CAD lin quan
n vic chuyn tng ca ngi thit k thnh m hnh hnh hc. Cc nhc
im khc ca CAD ang c khc phc nh R&D trong lnh vc h chuyn
gia. Lnh vc ny c hnh thnh t cc nghin cu v tr tu nhn to (Actifial
Intelligence- AI). Mt v d v h chuyn gia bao hm vic kt hp thng tin v
bn cht ca vt liu, trng lng, ng lc, bn, do vo phn mm CAD.
Nh tch hp c cc d liu v nhng d liu khc vo phn mm nn h
CAD c th bit c nhng g m ngi k s bit khi ngi to ra mt bn
v thit k. Sau , CAD c th bt chc cch ngh ca ngi k s v thc
hin cng vic thit k. Do cng ngh CAD/CAM ngy cng hon thin nn
to c s pht trin cc cng ngh gia cng nh:
Cng ngh to nguyn mu, c v cn nhanh: Ngoi vic tng cng cc
phng php gia cng truyn thng, cng ngh to nguyn mu nhanh ang ni
ln, em li cuc cch mng cho nhng khi nim ang din ra, t m hnh my
tnh n chi tit nguyn mu hon tt. Cc thit b to nguyn mu nhanh in
hoc to dng cc chi tit 3D trc tip t m hnh lp th 3D CAD bng cc vt
liu polyme. C 2 cng ngh thng dng l in lito lp th - SLA (Stereo
Lithography) v kt ta. Cng ngh SLA s dng tia laser kch hot qu trnh
lu ho nha epoxy trong cc lp mng c xc nh chnh xc to nn chi
tit. Cng ngh kt ta s dng cc kim phun nh ph cc lp mng polyme
do nng chy, to nn chi tit. Nh trc tip ch to ra cc chi tit t nhng file

d liu CAD, cng ngh to nguyn mu nhanh gip gim c rt nhiu thi
gian v chi ph lin quan ti vic ch to cc m hnh nguyn mu hin th
cc thit k v kim tra mc ph hp, hnh dng v chc nng.
Cng ngh to nguyn mu nhanh vi chi ph thp m ng cho cc cng ngh
c polyme v cc kim loi m nu kt hp vi cc cng on gia cng hon tt
th s em li trin vng gim c rt nhiu thi gian v chi ph cho mt s chi
tit my.
Cng ngh ch to in ho (Electrochemical Fabrication - EFAB): EFAB l
mt cng ngh ch to cc chi tit khng cn khun c. Cng ngh ny c th
dng ch to cc chi tit kim loi vi m lp th, c hnh dng phc tp, m
cc cng ngh khc khng th thc hin c, chng hn nh cng ngh gia
cng bng tia la in, cng ngh laser, cng ngh ch to vi mch. Quy trnh
EFAB t ng ch to cc chi tit kim loi bng cch m in hnh thnh nn
rt nhiu lp c lp, theo mt mu xc nh, ri kt hp cc lp vi nhau
to ra chi tit cn thit. Quy trnh ny cng tng t nh cng ngh to nguyn
mu nhanh, chng hn nh cng ngh in lit lp th, da trn c s xp chng
nhiu lp c lp mu t trc to ra sn phm. Quy trnh EFAB c
thit k kt hp nhng u im ca cc cng ngh gia cng truyn thng vi
nhng u im ca cng ngh ch to vi mch bn dn. Vi cc cng ngh gia
cng chnh xc, chng hn nh laser hoc gia cng bng tia la in, c th gia
cng mt lot cc chi tit mt cch nhanh chng v t hiu qu v chi ph nh
mt my cng c n l.
EFAB kt hp c nhiu u im ca gia cng chnh xc v cng ngh ch to
vi m, tng t nh my cng c CNC, EFAB c thc hin bng mt h
thng duy nht, hon ton t ng, c kh nng ch to cc chi tit t khi bt
u n khi kt thc. Bt k mt k s thit k no quen vi CAD 3D u c
th thc hin quy trnh ny. EFAB l cng ngh gia cng hiu qu sn xut l
ln cc chi tit c chnh xc cao (c th ch to cc chi tit cha nhng phn
t nh hn 0,001 inch, dung sai di 0,0001 inch). EFAB kt hp c cc
c tnh v tc cao, d s dng v linh hot ca my cng c vi cc c tnh

v chnh xc v kh nng m rng cp ca cng ngh ch to vi mch bn

dn.
Cng ngh gia cng ct gt vi m tc cao (Micro-Tooling): C nhiu li ch
khi s dng gia cng tc cao - HSM (High Speed Machining) vi cc nguyn
cng ct gt vi m. Hin cha c nh ngha thng nht hoc cc tham s tuyt
i v HSM nhng trong thc t ngi ta thng gia cng vi tc trc chnh
l 25.000 vng/pht hoc cao hn.
Cng ngh gia cng bng tia la in: Gia cng bng tia la in EMD
(Electrical Discharge Machining) c th c ng dng ct cc hnh dng
khc nhau, c bit l cc vt liu cng, chng hn nh thp dng c. Qu trnh
gia cng bng EMD nh sau: To ra mt lot tia la in c tc cao gia
dng c (in cc), phi v cht lng in phn; phi c nhng chm trong
cht lng cch in, chng hn nh du v c tim cn ti dng c; dng c
c ni vi ngun in mt chiu cao p (ngun in ny to ra hng triu h
quang nh, c tc dng cng ph phi theo tng lng nh); cc ht kim loi
gii phng ra, thng c dng hnh cu rng, c a ra khi khu vc gia cng
bng cht lng cch in. EDM c th c ng dng ct, khoan, to khun,
dp l. Cng ngh ny cng c th c dng thay th cho cc nguyn cng
phay, ct v khoan bng c kh, cng nh ct v khoan bng laser. Tc dng
gim ph thi ch yu ca EDM l khng xy ra gy dng c. N c vai tr
quan trng trong nhng ng dng c nhiu nguy c gy dng c.
Gia cng bng tia nc: Cng ngh ny c ng dng thay th cc cng
ngh ct bng c kh thng thng, cng nh thay th cho cng ngh laser,
plasma v xy. H thng to tia nc bao gm mt s my bm chuyn dng v
p sut nc c gia cng ln hn 3.400 Atm. Tip n c nn qua kim
phun bng kim loi hoc saphire to ra tia nc c ng knh 2 mm v t
ti tc cao hn nhiu ln so vi tc m thanh. i vi nhng vt liu qu
cng, c th b sung thm bt mi tng cng tc dng ct. ng dng cng
ngh gia cng bng tia nc c th gim hoc loi b nhng loi ph thi nht
nh, bao gm cht lng gia cng, nc thi b nhim, tro, x...

Vt liu ch to
Trong ngnh cng nghip c kh ch to, c 3 nhm vt liu c tnh truyn
thng, l vt liu kim loi, vt liu hu c polyme v vt liu v c ceramic.
Mt loi vt liu mi khc - vt liu compozit ang c u tin pht trin.
Compozit chnh l s kt hp nhn to ca hai hoc ba loi vt liu c bn ni
trn.
Vt liu kim loi, trc ht l thp, vn gi vai tr then cht trong ngnh cng
nghip ch to. Trong nhng thp k gn y cng ngh vt liu ang i vo
nghin cu v s dng cc loi thp c cht lng cao nh thp hp kim thp
bn cao, thp hp kim ho vi lng, thp nit, thp kt cu siu bn. Bn cnh
, nhm cng ng vai tr khng nh trong ngnh cng nghip ch to. Hp
kim nhm c bn cao, chng n mn tt, tr thnh loi vt liu thch hp
trong ngnh cng nghip ch to t, my bay, tu thu.
Vt liu polyme, c nhiu u im nh tnh do cao, tnh n nh ho hc cao
trong nhiu mi trng cng vi kh nng d to hnh v gia cng nu c, phm
vi ng dng rng. Tuy nhin, polyme l vt liu kt cu nn c nhng hn ch v
bn cha cao, kh nng chu nhit thp, tui th ngn.
Vt liu gm thng, ch s dng gii hn trong nhm vt liu chu la, vt liu
ct gt nhng hin ngi ta ang pht trin vt liu gm kt cu. Cc loi ng
c ch to t gm kt cu h cacbit c nghin cu ch th v m ra k
nguyn mi cho vic s dng ng c chy bng nhin liu hydro c hiu qu
cao, khng gy nhim mi trng. Gm thu tinh cng l mt loi gm kt
cu y tim nng.
Vt liu compozit, v thc cht l mt kiu lai, gia hai hoc nhiu loi vt liu,
sao cho tnh cht ca chng b sung cho nhau. i vi compozit kt cu th yu
cu v bn cao, tnh do tt l nhng yu cu hng u. Vic kim sot c
qu trnh xy ra khi ch to compozit c tm quan trng c bit pht trin
loi vt liu ny.
Vt liu ch to dng c ct gt

Vt liu s dng ph bin nht ch to dng c ct gt c thnh phn l

carbide ph (58%), cermet (28%) v carbide cement ho (14%). Cermet l ht
gm c khuch tn vo nn kim loi. Vt liu cermet kt hp c c tnh
chu nhit cao ca gm vi dai v do ca carbide. Vi xu th vn ti
tc gia cng v hon tt ngy cng cao, cc dng c ct gt s dng cermet
Nht Bn chim 72% tng s dng c cermet ca ton th gii. Cc dng c
dng carbide ph ph bin nht c lp ph dy 0,5 mm, bao gm 6-8 micron l
TiCN, 2-3 micron l Al2O3 v 0,5 micron TiN lp ngoi cng. Lp ph kim cng s dng k thut kt ta hi ho hc (Chemical Vapor Deposition-CVD)
cng c p dng rt ph bin Nht Bn. u dng c DC46 ph kim cng ca Mitsubishi c lp ph cement ho. Vn cn khc phc i vi dng
c ph kim cng l bm dnh ca lp ph. Cc hng ch to p dng cc
phng php ci thin khc nhau, v d, i vi vic gia cng hp kim nhm
c hm lng silic cao (18%), i hi lp kim cng dy ti 10 micron, th vn
bm dnh l ht sc quan trng.
Vai tr ca khoa hc vt liu cng khng h thay i k nguyn thng tin ngy
nay, nu khng ch to c vt liu silic c tinh khit n 99,99999% th s
khng c chip my tnh, in thoi t bo hoc mng cp quang. Nhng thp k
va qua, ngnh ho v c iu ch c v s kim loi, hp kim v gm,
gip my bay c th bay cao hn v nhanh hn, gip t tr nn nh hn v tit
kim nhin liu hn...
Ngy nay, mt ln na khoa hc vt liu li ang chun b bin i th gii.
Khng tho mn vi nhng nguyn vt liu khai thc c trong lng t, cc
nh nghin cu ang lao vo khm ph v to ra cc cu trc hon ton mi. H
thc hin iu bng cch ph v nhng bc ro ngn cch gia ho hu c
v ho v c, iu m ch cch y t lu vn b coi l gi khoa hc (PseudoScience). Nhng hp cht v-hu c ca ngy mai s c iu ch phc v
ng nhu cu theo phng php t di i ln, t nh n ln, tc l ghp
nhng nguyn t hoc phn t vi nhau nhn c nhng tnh cht chnh xc
theo ng nhu cu s dng. Arden Bemen, mt k s trng i hc Durdue

gi giai on ny l bui bnh minh ca mt k nguyn vt liu mi, vi s p

ng tng nhu cu s dng c th. K nguyn ny s ra i nhng loi vt liu
m ngay c to ho cng phi ghen t. s l nhng cht phun ph c cha
nhng ht gm v cng nh, gip vt liu c kh nng chng mi mn, nhng
dc phm v cht do mi, l nhng pin st - polyme c in lng ln gp
i so vi nhng loi pin chng ta dng hin nay. C th, chng ta s c c
nhng tm kim loi - compozit lm v t c kh nng phc hi li hnh
dng c sau khi b bin dng bi nhng c va p. S ra i nhng vt liu
compozit nh v dai tng cng sut ca ng c phn lc. S xut hin nhng
vt liu thng minh, m phng cc h thng sinh hc, c kh nng thch ng vi
iu kin mi trng, b p lng hao mn v cnh bo khi sp c s c. Vi
k thut v cng ngh nano, hu ht cc vt liu m ta mun c u c th sn
xut ra c - y l nhn nh ca W. Lance Haworth, chuyn gia iu hnh
hot ng nghin cu vt liu ca Qu Khoa hc Quc gia M (NSF). Hay quan
im ca John Weaver, Trng khoa Vt liu ca Trng i hc Illinois:
tng t ra y l khai thc, tm hiu nhng c ch phn t c c nh qu
trnh tin ho ca t nhin sn xut nhng vt liu mi. Nhng vt liu chng
ta sng ch v sn xut ra c t trc ti nay ch ging nh phn nhn thy
c ca tng bng tri, cn phn rt ln nm bn di ang ch s pht minh
v khm ph, y chnh l lnh vc ca vt liu nano.
Nhng nc pht trin nh M, Nht Bn, Anh, Php c nhng cng trnh
nghin cu v to ra c nhng vt liu nano ng dng vo trong ngnh c
kh ch to ch to ra cc loi rbt mini, cc dng c y sinh phc v cng
vic cha bnh. Cc vt liu nano khc c s dng trong vic ch to cc loi
my chnh xc, my siu chnh xc, trong ngnh hng khng v tr, trong cng
nghip quc phng, trong cng ngh khm ph v khai thc ti nguyn bin v
i dng
Nhng xu hng pht trin trong ngnh c kh ch to ca th gii n
nm 2030

Nhng nm u ca th k XXI, nhn loi c chng kin nhiu bin i su

rng ln ca th gii, nht l s pht trin nh v bo ca cuc cch mng
KH&CN hin i, m c trng l cc ngnh cng ngh cao nh cng ngh
thng tin, cng ngh sinh hc, cng ngh vt liu mi - cng ngh nano, cng
ngh nng lng mi, cng ngh hng khng v v trang tc ng su rng
n mi lnh vc ca i sng, kinh t, chnh tr quc t, lm thay i din mo
th gii ng i. Trong s pht trin v i , ngnh cng nghip c kh ch
to ng vai tr c tnh nn tng v c s hin din hu nh trong tt c cc lnh
vc kinh t - x hi ca cng ng quc t. Chnh v vy, xu hng pht trin
KH&CN c kh ch to vn c ch trng v ch yu tp trung pht trin mt
s lnh vc sau y:
V thit k v quy trnh gia cng ch to: Tip tc nghin cu v nng cp h
CAD/CAM, trong ch trng pht trin cc loi phn mm ng dng, phn
mm thng minh tin li trong giao din ngi - my, p ng nhu cu ngy
cng cao trong thit k v gia cng ch to. n nm 2030, s thay i mt cch
cn bn phng thc thit k, cc nh thit k ch yu lm vic bng my tnh
trc tuyn (On-Line). Thit k sn phm c s dng cc vt liu tr tu. Thit k
v lp k hoch ch to s v o. Phng thc thit k theo kiu mdun cho cc
h thng ch to lin tc. Tp trung hn vo t ng ho cc dy chuyn ch
to, cc quy trnh tin tin nht. Pht trin cng ngh gia cng cp nano (trong
phm vi 0,1-100 nano) to ra cc cu trc nano. Ch to cp phn t to
dng cc h thng t cp nguyn t hoc phn t. Tp trung nghin cu to
ra cc cng ngh s dng nhiu tri thc tin ti ch to ra cc loi sn phm
c kh gn, nh t tiu hao vt liu, nng lng v thn thin vi mi trng.
Nghin cu pht trin cc khi nim cng ngh gia cng mi trn c s hi t
cc cng ngh cao nh cng ngh thng tin, cng ngh vt liu mi, cng ngh
nano, cng ngh sinh hc. Nghin cu v hon thin h thng cm bin trong
cng ngh lp rp cc sn phm phc tp. Nghin cu pht trin cng ngh t
ng mi da vo ng dng giao din ngi - my thng minh c nhn thc.

Nghin cu cc khi nim rbt mi nh rbt dch v, rbt t thch nghi,

rbt c nhn thc, cc by on rbt t qun.
V vt liu ch to: Tip tc nghin cu to ra tri thc mi v vt liu ch to
cht lng cao, vt liu thng minh phc v cc quy trnh ch to. Nghin cu
cc vt liu s dng nhiu tri thc vi cc thuc tnh ph hp, cc vt liu gm
mi nh gm p in, gm sinh hc, mng gm v vt liu thu tinh (gm thu
tinh, composit gm - thu tinh v thu tinh dn in). Nghin cu vic sp xp
trt t trong cc khi ng nht polyme. Tip tc nghin cu cng ngh in lit
vi cc vt liu mi, tnh n nh ca cu trc nano 3D. Nghin cu s tch hp
ca cc mc phn t nano macro trong cng ngh ho hc v cc vt liu gia
cng cng nghip. Nghin cu ng dng rng ri trong ngnh cng nghip ch
to cc vt liu nano mi, vt liu sinh hc v vt liu ghp.
Khoa hc nano v cng ngh nano: Tip tc nghin cu kh nng ch to cc
cu trc nano phc v siu hm lng cao. Ch to cc thit b nano di 20
nm, ch to cc cu trc nano 3D phc hp v tch hp a nng. Pht trin cc
m hnh tch hp hng lot cng ngh ch to nano mi. Nghin cu cc thit b
cm bin cp nano, tng hp ng nano ng nht, ch to dy nano fulleren v
cc bng nano, pht trin cc cu trc nano t nhiu loi vt liu. Nghin cu
ch to cc ng c c nano, my mc kch c nano.
V cng ngh ch to:Pht trin cc h thng ch to thng minhkhng gii hn
(Intelligent Manufacturing Systems - IMS). Cc h thng thng minh
(Intelligent System- IS) ha hn rt ln trong cc quy trnh ch to t ng ho
cng nghip v cc doanh nghip trong tng lai. Cc h thng ny ang thu ht
c s quan tm ngy cng tng ca cc ngnh cng nghip v ang c ng
dng vo ton b phm vi ca cc hot ng ch to to c sc cnh tranh
ton cu. Gi tr v tc ng ca cc cng ngh IS cn to ln hn so vi cc
cuc cch mng cng nghip trc y, gp phn a li k nguyn mi ca cc
ngnh cng nghip ch to. IS c nh ngha l cc h thng, trong m
phng v p dng tch cc mt s kha cnh ca tr tu con ngi nhm thc thi
nhim v. Hn th na, IS cn c gng nng cao nng lc nh con ngi

cm th, suy lun v ra quyt nh hnh ng. IS to kh nng cho cc my

mc/thit b d on c cc yu cu v ng ph hu hiu trong nhng hon
cnh phc tp, cha bit trc v cha th d bo trc.
IMS l chng trnh hp tc R&D trong ngnh cng nghip c kh ch to quy
m ton cu. Tham gia vo IMS l cc cng ty/doanh nghip, cc nh cung cp,
ngi tiu dng, cc t chc nghin cu, trng i hc v cc Chnh ph ca
cc nc/khi nc l EU, Nht Bn, Hn Quc, Thy S v M. Chng trnh
gm 2 giai on: Giai on 1 t 1995 n 2005; giai on 2 t 2005 tr i.
Chng trnh IMS c thit lp nhm pht trin cc cng ngh x l v cng
ngh ch to th h k tip. Nhng hot ng ca IMS bao gm: a ra khun
kh hp tc nghin cu ton cu; h tr thnh lp d n consortium; lin kt
mng li ton cu; t chc cc din n tm kim v a ra nhng nhu cu
trong ngnh cng nghip ch to hin ti v tng lai; ph bin cc kt qu t
cc hot ng ny. IMS c khi ngun t nm 1989 bi sng kin ca Gio
s Hiroyuki Yoshikawa, Gim c i hc Tokyo. Tm nhn ca IMS l hng
ti mt h thng ton cu v chia s cng ngh v hp tc cng nghip trong cc
d n hp tc v li ch nhn loi v li ch ca cc i tc tham gia. Chng
trnh IMS bt u t nm 1995, sau 3 nm nghin cu kh thi (1992-1994).
Tng cng, IMS hot ng ti 29 nc trn th gii nh l mt t chc m cho
cc thnh vin mi v khuyn khch cc Chnh ph tham gia.
Trong mt th trng ton cu ngy cng hi nhp, s cnh tranh khng ch
trong phm vi cc cng ty, m trong cc dy chuyn/mng li cung ng sn
phm v dch v ton cu. Thng qua s hp tc quc t, IMS to c hi cho cc
bn tham gia chui gi tr pht trin v cc gii php hng u th gii. IMS
em li nn tng h tr cho nghin cu cng nghip c kh ch to chia s
nhng kinh nghim tt nht, thc tin tt nht v pht trin mt tm nhn ton
cu ton din nht trong th k XXI.