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  • Crack-Free Direct-Writing On Glass Using A Low-Power UV Laser in The Manufacture of A Microfluidic Chip

    Загружено:

    Aloisio Nunes
    7 просмотров4 страницы
    A low-power UV laser can directly write on glass without cracks for microfluidic chip manufacturing. Key advantages are varied channel geometries can be rapidly prototyped crack- and debris-free. Roughness and CNC instability are challenges. An example application showcased a microreactor and concentrator with concentration and extraction modes controlled by fluid port inputs.

    Исходное описание:

    Laser induced backside wet etching : a new fabrication technique for microfluidic devices.

    Оригинальное название

    LIBWE Microfluidics

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    A low-power UV laser can directly write on glass without cracks for microfluidic chip manufacturing. Key advantages are varied channel geometries can be rapidly prototyped crack- and debris-free. Roughness and CNC instability are challenges. An example application showcased a microreactor and concentrator with concentration and extraction modes controlled by fluid port inputs.

    Авторское право:

    © All Rights Reserved
    Скачайте в формате PPTX, PDF, TXT или читайте онлайн в Scribd
    Отметить как неприемлемый контент
    7 просмотров4 страницы

    Crack-Free Direct-Writing On Glass Using A Low-Power UV Laser in The Manufacture of A Microfluidic Chip

    Загружено:

    Aloisio Nunes
    A low-power UV laser can directly write on glass without cracks for microfluidic chip manufacturing. Key advantages are varied channel geometries can be rapidly prototyped crack- and debris-free. Roughness and CNC instability are challenges. An example application showcased a microreactor and concentrator with concentration and extraction modes controlled by fluid port inputs.

    Авторское право:

    © All Rights Reserved
    Скачайте в формате PPTX, PDF, TXT или читайте онлайн в Scribd
    Отметить как неприемлемый контент
    из 4

    Crack-free direct-writing on glass

    using a low-power UV laser in the


    manufacture of a microfluidic chip
    Andrew Pieterick
    Paolo Ferrari

    Fabrication
    Laser Induced Backside Wet Etching
    Components
    Materials
    Controls

    Features
    Pros:
    Varied aspect-ratios
    Variable cross-section
    Rapid prototyping
    Crack/debris free

    Cons:
    Roughness
    CNC instability

    Example Device
    Microreactor (A + B)
    Microconcentrator (A + B + C)
    Concentration mode (port E)
    Extraction mode (port D)

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