REFLOW SOLDERING PROFILE DATA - PEAK TEMPERATURE

REF DESIG. PEAK TEMPERATURE UCL MEAN LCL LSL USL

ABC 240°C 247°C 243°C 239°C 228°C 250°C
BCD 242°C 247°C 243°C 239°C 228°C 250°C
CDE 244°C 247°C 243°C 239°C 228°C 250°C
DEF 243°C 247°C 243°C 239°C 228°C 250°C
EFG 245°C 247°C 243°C 239°C 228°C 250°C
FGH 244°C 247°C 243°C 239°C 228°C 250°C
 CHART_PEAK TEMP

CONTROL CHART -
REFLOW SOLDRING PROCESS -
PEAK TEMPERATURE
250°C 260°C

240°C

245°C 220°C
PEAK TEMPERATURE, °C

200°C

180°C
240°C
160°C

140°C
235°C
120°C

100°C
230°C 80°C

60°C

225°C 40°C

20°C

220°C 0°C
ABC BCD CDE DEF EFG FGH
REFERENCE DESIGNATORS

Page 2
 CHART_PEAK TEMP

260°C

240°C

220°C

200°C

180°C

160°C

140°C

120°C

100°C

80°C

60°C

40°C

20°C

0°C
FGH

Page 3
 REFLOW SOLDERING PROFILE DATA - TIME ABOVE LIQUIDUS

REF DESIG. TIME ABOVE LIQUIDUS UCL MEAN LCL LSL USL
ABC 65 78 67 55 40 90
BCD 70 78 67 55 40 90
CDE 60 78 67 55 40 90
DEF 65 78 67 55 40 90
EFG 67 78 67 55 40 90
FGH 72 78 67 55 40 90
 CHART_TAL

CONTROL CHART -
REFLOW SOLDERING PROCESS -
TIME ABOVE LIQUIDUS (SECONDS)
100 90
85
TIME ABOVE LIQUIDUS, SECONDS

80
90 75
70
80 65
60
55
70 50
45
40
60
35
30
50 25
20
15
40
10
5
30 0
ABC BCD CDE DEF EFG FGH
REFERENCE DESIGNATORS

Page 5
 CHART_TAL

90
85
80
75
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
FGH

Page 6