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KTC ELECTROVERT WAVE SOLDERING PROFILE DOCUMENTATION

CUSTOMER NAME :
IS IT TIN-LEAD OR LEAD-FREE BUILD ?
BUILD DATE :
PRODUCT NAME :
PRODUCT CODE:
WORK ORDER #

PREVENTIVE MAINTENANCE VERIFICATION


Check Flux Level in Tank Solder Level in Pot with wave OFF Fingers are clean
Check For Bent Fingers De-dross Solder Pot Ceramic Glass Plate Cleaned
Flux Coverage (on Glass Plate) Preheaters are clean Flux Nozzles are clear

MACHINE PARAMETERS PROCESS PARAMETERS


PARAMETERS VALUES PROCESS PARAMETERS T/C #1 T/C #2 T/C #3 T/C #4 T/C #5 T/C #6 AVG
Conveyor Speed TOPSIDE BOARD TEMPERATURE (TSBT)
Flux Flow Rate MAXIMUM TSBT OVER THE WAVE
Flux Pressure DWELL TIME (GLASS PLATE)
Flux Spray Width FLUX DEPOSITION RATE (µgms/inch2)
Fluxer Conveyor Speed Setting DRAW THE PICTURE OF PCB PANEL WITH T/C LOCATIONS BELOW:
Convection Pre Heater 1
Convection Pre Heater 2
Topside IR Pre Heater
Lambda Pump Speed
Solder Temperature
Lead Clearance (Pb-Free Pot only)
Flux Penetration Test Result
COMMENTS:

PROCESS VERIFICATION / VALIDATION


Temperature Profile done Run First Ariticle Run 3 boards for Process Verification

PROCESS CONFORMANCE INDEX

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