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CLASSIFICATION

OF IC

PREPARED BY

S.H.Jubair
EEE-A II-YEAR
14-03-2012

WHAT ARE INTEGRATED CIRCUITS ?

 IC is a miniature ,low cost electronic circuit


consisting of active and passive components that are
joined together on a single crystal chip of silicon

ADVANTAGES:

Miniaturization
Reduced cost due to batch processing
Increased reliability
Reduced power consumption
Increased performance & operating speeds

CLASSIFICATION OF ICs:

ICs can be broadly classified based on their


application as
-DIGITAL ICs
-LINEAR ICs
Based on the above requirements two different
IC technologies have been developed
-Monolithic technology
-Hybrid technology

ICs can also be classified on the basis of their chip size


as given below :

Small scale integration (SSI)3 to 30 gates/chip.


Medium scale integration (MSI)30 to 300
gates/chip.
Large scale integration (LSI)300 to 3,000
gates/chip.
Very large scale integration (VLSI)more than
3,000 gates/chip.

MONOLITHIC INTEGRATED CIRCUITS:

In monolithic integrated circuits all circuit


components (both active and passive elements and
their inter connections )are manufactured into or top
of a single chip of silicon.
The monolithic circuit is ideal for application where
identical circuits are required in very large quantities
and hence provides lowest price per- unit-cost and
highest order of reliability

MONOLITHIC MICROWAVE INTEGRATED CIRCUITS:

MMIC
MMICs,
MMIC or Monolithic Microwave Integrated
Circuits,
Circuit are a type of IC devices that operate at
microwave frequencies (1 GHz to 300 GHz).

HYBRID INTEGRATED CIRCUITS:

A Hybrid Integrated Circuit,


Circuit Hybrid Circuit,
Circuit or
simply Hybrid is a miniaturized electronic circuit
constructed using individual devices, such as
semiconductor devices (e.g. transistors and diodes)
and passive components (e.g. resistors, inductors and
capacitors), bonded to a substrate or PCB

HYBRID ICs (contd..):

In hybrid circuit ,separate component parts are


attached to a ceramic substrate and interconnected by
means of either metallization pattern or wire bond
This technology is more adaptable to small quantity
custom circuits .

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