Unit-1

1. What do you mean by Microelectronic circuits? Differentiate in between discrete components

and integrated chips. Also discuss the application of the IC technology.
2. Discuss about the classification of IC Technology. Also discuss their advantages and
disadvantages.
3. Why Silicon is preferred over than germanium in the fabrication of microelectronics circuits.
Differentiate in between Electronic Grade Silicon [EGS] and Metallurgical Grade Silicon
[MGS]. Which type of the silicon is preferred in the fabrication of the microelectronic
circuits?
4. What do you mean by bulk crystal growth? Discuss about the production process of EGS
from MGS with suitable diagram and sufficient chemical reactions. Also discuss about the
alternative process for the production of EGS.
5. Discuss the crystal growth process by Czochralski method [CZ] in detail. Also discuss about
the pull rate and growth rate of the Cz method.
6. Explain epitaxial growth process in IC fabrication. Discuss the types of Epitaxy? Why is it
needed?
7. Discuss Molecular Beam Epitaxy in detail. Also compare with Vapor Phase Epitaxy.
8. What do you mean by crystal structure of the silicon wafer used for IC technology? Also
discuss about different defects in silicon wafer.
9. What do you mean by solid solubility of impurity in the melt? The concentration of the
oxygen in the crystal (X=0.05) is 1.3X1018 atoms/cm3. Predict the concentration of oxygen in
the crystal at a fraction solidified of 0.4.