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DS8500 Evaluation Kit

General Description

The DS8500 evaluation kit (EV kit) provides a convenient platform to evaluate the DS8500 HART modem.
It allows quick evaluation through a demonstration mode
and in-depth evaluation using HART Communication
Foundation (a part of FieldComm Group) tools.

EV Kit Contents

DS8500 EV Kit Board


Micro-USB Cable

Evaluates: DS8500

Benefits and Features

The EV Kit Provides Fast and Simple Evaluation by


Providing a Total HART Communications Chain on
Board
Example HART Master and Field Device Circuits
Demonstrate Usage in the Two Most Common HART
Connection Configurations
HART Registered Modem IC
On-Board Isolated 4mA20mA Communications Loop
MAXQ622 USB Microcontroller with Demo Firmware
External Connections Allow for Advanced Evaluation
of the DS8500 in Other Configurations

Figure 1. USB Connection and READY LEDs


HART and HART Registered are registered trademarks of the
HART Communication Foundation Corp.

19-5641; Rev 1; 9/15

Evaluates: DS8500

DS8500 Evaluation Kit

Quick Start

Detailed Description of Hardware

1) Download and install the DS8500 EVKIT Software


GUI at www.maximintegrated.com/evkitsoftware.

Power Supply

2) Use the included Micro-USB cable to connect and


power the EV kit as shown in Figure 1.

On-Board 420mA Current Loop

The DS8500 EV kit comes with demonstration firmware


already loaded.

3) Wait until the READY LEDs (circled in Figure 1) light


after the board has finished USB enumeration. This
can take several seconds.
4) Start the DS8500 EVKIT GUI from the Start menu
by selecting Maxim Integrated | DS8500 | DS8500
Evaluation Kit. Figure 2 shows the demo GUI.
It automatically finds the USB-connected EV kit.
5) Simply type messages from the Master or Field
Device window and press the Send button to
transmit and receive modulated data over the
on-board 420mA current loop.

Users must also use the DS8500 IC data sheet in conjunction with this EV kit data sheet.
The EV kit uses USB power for all on-board devices.
The current loop is isolated from board ground and
power allowing communications between Master and
Field Device, both implemented by serial ports on the
MAXQ622. This common connection necessitates use
of a fully isolated 420mA loop, which is very sensitive
to ground loops, thus direct probing of the on-board loop
is strongly discouraged and could damage the EV kit.
Note that this is a nontypical configuration specifically
designed for demonstration purposes. In typical installations, Master and Field Device are separately located,
with the Field Device floating, often powered by loop
current.

6) Observe the ACTIVE LEDs lighting while transmitting


and receiving.

Figure 2. DS8500 EV Kit Demo GUI

www.maximintegrated.com

Maxim Integrated 2

Evaluates: DS8500

DS8500 Evaluation Kit

Interface Ports

Jumpers JP2JP5 provide direct access to the serial


control signals for the Master side of the HART loop.
Jumpers JP8JP11 provide direct access to the serial
control signals for the Field Device side of the HART
loop. These allow connection to an embedded microcontroller or computer running a HART stack via 3.3V TTL
serial UART. See Table 1 and the Advanced Evaluation
section for more details.
Each DS8500 exposes FSK_OUT and FSK_IN signals
via jumper for probing purposes (Table 2).

Jumper Functions

The DS8500 EV kit is equipped with 17 jumpers for


disconnecting pins and modifying the EV kit features.
Table 3 details the jumpers not previously covered.

External Connectors

The EV kit has three terminal blocks for easy loop/wire


connections. See Table 4.

Advanced Evaluation

The DS8500 EV kit can communicate directly with actual


HART devices or software-emulated devices. The onboard MAXQ622 is only for demonstration purposes

Table 1. Master and Field Device Control Signals


PORT PIN

PIN NAME

PIN TYPE

DESCRIPTION

JP2

HRXD_M

Output

Digital serial data output from MASTER DS8500 (DOUT)

JP3

HOCD_M

Output

Carrier detect output from MASTER DS8500

JP4

HTXD_M

Input

Digital serial data input to MASTER DS8500 (DIN)

JP5

HRTS_M

Input

Active-low request to send signal for MASTER DS8500

JP8

HRXD_F

Output

Digital serial data output from FIELD DEVICE DS8500 (DOUT)

JP9

HOCD_F

Output

Carrier detect output from FIELD DEVICE DS8500

JP10

HTXD_F

Input

Digital serial data input to FIELD DEVICE DS8500 (DIN)

JP11

HRTS_F

Input

Active-low request to send signal for FIELD DEVICE DS8500

Note: Serial signals are 3.3V TTL.

Table 2. FSK Probe and Disconnect Jumpers


JUMPER

NAME

TYPE

JP6

FSK_IN_M

Input

MASTER side incoming FSK-modulated serial signal

JP7

RAW_FSK_M

Output

MASTER side outgoing FSK-modulated serial signal

JP12

FSK_IN_F

Input

FIELD DEVICE side incoming FSK-modulated serial signal

JP13

RAW_FSK_F

Output

FIELD DEVICE side outgoing FSK-modulated serial signal

www.maximintegrated.com

DESCRIPTION

Maxim Integrated 3

Evaluates: DS8500

DS8500 Evaluation Kit

Table 3. Jumper Settings


JUMPER
JP1 (1-2)
JP1 (2-3)
J4
J5
J7
J9
JP14

SETTING

EFFECT

Closed*

Powers the 420mA loop from on-board power

Open

Disconnects 420mA loop from on-board power

Closed

Connect external loop power from connector J2

Open*

Disconnects external loop power from connector J2

Closed*

Connects loop power to master device

Open

Isolates loop power from master device

Closed*

Connect master to field device via loop

Open

Isolates master from field device via loop

Closed*

Connects field device to master via loop

Open

Isolates field device from master via loop

Closed*

Connects field device to loop return

Open

Isolates field device from loop return

Closed*
Open

Connects VBUS power (5V) to loop 24V power supply


Disconnects power from loop supply for noise reduction

*Default position.

Table 4. External Connectors


CONNECTOR

PURPOSE

J2

Power the 420mA loop from an external galvanic isolated supply or battery

J5

Wire connection interface to MASTER

J8

Wire connection interface to FIELD DEVICE

(USB interface) and does not implement a HART software


stack. The serial UART data and control pins are exposed
via jumpers as detailed in Table 1. They allow a hardware
serial port on a PC or laptop to transmit and receive
modulated signals. Note that these serial pins expect TTL
level signals (3.3V), not RS-232 level, so a serial level
shifter board is typically required for communications.
The following examples detail two evaluation setups.
Other configurations are possible, including emulating
both simultaneously, or connection to an actual Field
Device. However, these are beyond the scope of this document. Note: The following configurations require hardware and software tools available from the FieldComm
Group or other sources and are not included with the
DS8500 EV kit.

Emulated HART Field Device

To use the DS8500 EV kit as a Field Device interface,


follow the setup detailed in Figure 3, using the on-board
24V loop power supply and load resistor. Simply connect
a personal computer running HART master software,
(e.g., HCF_KIT_180) and a HART serial modem (e.g.,
HCF_TOOL-35, available with the Physical Layer Test Kit
HCF_KIT-116). The reference modems loop connections
attach across the Field Device as shown. Verify that the
jumpers (J7 and J9) remain in place, even with the loop
connections attached.
Another personal computer simulates the behavior of an
actual field device by running the XMTR MV tool (HCF_
TOOL-039). Remove jumpers JP8JP11 and connect the
serial signals to the computer via a RS-232 level shifter.
To test, launch the XMTR MV program, then start the
Master software and observe communications.

www.maximintegrated.com

Maxim Integrated 4

Evaluates: DS8500

DS8500 Evaluation Kit

USB
JP2

RXD M

RXD F

JP8

JP3

OCD M

OCD F

JP9

JP4

TXD M

TXD F

JP10

JP5

RTS M

RTS F

JP11

PC/LAPTOP
RS232
LEVEL
SHIFTER

FIELD DEVICE
XMTR MV
HCF_TOOL-039

DS8500 EVKIT BOARD


+ 24V -

FIELD
DEVICE

MASTER

J4

J9

250
J6

J7

REFERENCE
MODEM
HCF_TOOL-35

PC/LAPTOP
MASTER
HCF_KIT_180

Figure 3. Setup for Emulated Field Device Evaluation

www.maximintegrated.com

Maxim Integrated 5

Evaluates: DS8500

DS8500 Evaluation Kit

Emulated HART Primary/Secondary Master

Another personal computer simulates the behavior of the


Field Device by running the XMTR MV tool (HCF_TOOL039) and using a HART serial modem (e.g., HCF_TOOL35, available with the Physical Layer Test Kit HCF_KIT116). The reference modems loop connections attach
across the load resistor as shown in Figure 4.

To use the DS8500 EV kit as a Master or Secondary


Master, follow the setup detailed in Figure 4. This example does not require loop power so completely remove
jumpers J4 and J6 to isolate the Master side of the EV kit
from the on-board loop. Remove jumpers JP2JP5 and
connect the serial signals to the computer via a RS-232
level shifter. This computer runs HART master software
(e.g., HCF_KIT_180).

To test, launch the XMTR MV program, then start the


Master software and observe communications.

USB

PC/LAPTOP
MASTER
HCF_KIT_180

RS232
LEVEL
SHIFTER

JP2

RXD M

RXD F

JP8

JP3

OCD M

OCD F

JP9

JP4

TXD M

TXD F

JP10

JP5

RTS M

RTS F

JP11

DS8500 EVKIT BOARD


+ 24V -

FIELD
DEVICE

MASTER

J4

PC/LAPTOP
FIELD DEVICE
XMTR MV
HCF_TOOL-039

REFERENCE
MODEM
HCF_TOOL-35

J9

250
J6

J7

Figure 4. Setup for Emulated Master Evaluation

www.maximintegrated.com

Maxim Integrated 6

Evaluates: DS8500

DS8500 Evaluation Kit

Component List, Schematics, and PCB


Layout
See the following links for component list, PCB layout,
and schematics:
DS8500-KIT BOM
DS8500-KIT schematics
DS8500-KIT PCB layout

www.maximintegrated.com

Ordering Information
PART
DS8500-KIT#

TYPE
EV Kit

#Denotes RoHS compliant.

Maxim Integrated 7

Evaluates: DS8500

DS8500 Evaluation Kit

Revision History
REVISION
NUMBER

REVISION
DATE

PAGES
CHANGED

11/10

Initial release

9/15

Rewrote data sheet to include GUI and jumper descriptions and settings

DESCRIPTION

18

For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrateds website at www.maximintegrated.com.
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time.

Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.

2015 Maxim Integrated Products, Inc. 8

Bill of Materials (BOM) (Rev 1; 6/15)


Item Number
Quantity Part Reference
1
4 BMP1 BMP2 BMP3 BMP4
2
2 C1 C2
3
8 C3 C13 C15 C17 C19 C35 C36 C50
C5 C7 C11 C12 C14 C16 C18 C20 C24
C25 C26 C27 C34 C37 C41 C42 C43 C44
4
21 C47 C48 C51
5
2 C9 C10
6
3 C21 C38 C54
7
2 C22 C39
8
2 C23 C40
9
4 C28 C29 C45 C46
10
4 C30 C32 C52 C53
11
1 C31
12
1 C33
13
1 C49
14
1 C55
15
1 C56
16
1 C57
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40

1
1
3
2
2
1
1
1
1
1
1
1
3

C59
D1
D2 D3 D5
D4 D6
D7 D9
D8
F1
H1
H2
H3
H4
J1
J2 J5 J8

1 J3
J4 J6 J7 J9 JP2 JP3 JP4 JP5 JP6 JP7 JP8
17 JP9 JP10 JP11 JP12 JP13 JP14
1 JP1
2 L1 L5
2 L2 L3
1 L4
1 PCB1
1 Q1
1 Q2
1 Q3
1 Q4

Value
Bumper
10uF
1uF

BOM_Description
BUMPER CYLIN 0.375" DIA BLK
CAP CER 10uF 10V 10% X7R 0805
CAP CER 1uF 10V 20% X5R 0603

Manufacturer_PN
SJ61A4
GRM21BR71A106KE51L
GRM188R61A105MA61D

Vendor_PN
SJ5750-0-ND
490-3905-1-ND
490-1544-1-ND

Vendor
Digi-Key
Digi-Key
Digi-Key

PKG_Size
0.375" Dia x 0.311" H
0805
0603

100nF
18pF
2.2nF
10nF
1uF
15pF
33nF
2.2uF
2.2uF
1nF
22uF
1uF
100nF

CAP CER 0.1uF 16V 10% X7R 0603


CAP CER 18PF 50V 5% NP0 0402
CAP CER 2200PF 50V 5% NP0 0805
CAP CER 10000PF 50V 5% NP0 0805
CAP CER 1uF 16V 10% X7R 0603
CAP CER 15PF 50V 5% NP0 0603
CAP CER 0.033UF 10V 10% X7R 0603
CAP CER 2.2uF 10V 10% X5R 0603
CAP CER 2.2UF 50V 10% X7R 1206
CAP CER 1nF 50V 5% NP0 0603
CAP ALUM 22UF 50V 20% SMD
CAP CER 1UF 50V 10% X7R 1206
CAP CER 0.1UF 50V 10% X7R 0603

C0603C104K4RACTU
GRM1555C1H180JA01D
GRM2165C1H222JA01D
GRM2195C1H103JA01D
GCM188R71C105KA64D
GRM1885C1H150JA01D
C0603C333K8RACTU
C0603C225K8PACTU
GRM31CR71H225KA88L
GRM1885C1H102JA01D
RPS1H220MCN1GS
C3216X7R1H105K160AB
C0603C104K5RACTU

399-1096-1-ND
490-5858-1-ND
490-1628-1-ND
490-1642-1-ND
490-5241-1-ND
490-1407-1-ND
399-9070-1-ND
399-4911-1-ND
490-3367-1-ND
490-1451-1-ND
493-6648-1-ND
445-1423-1-ND
399-5089-1-ND

Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key

0603
0402
0805
0805
0603
0603
0603
0603
1206
0603
Alum 8mm Dia (Case E)
1206
0603

47uF
SMF5.0A-TP
GRN
YEL
SMCJ36CA
1N5819HW-7-F
350mA
DNI
DNI
DNI
DNI
MICRO USB AB RCPT RA
2P 3.5mm

CAP ALUM 47UF 6.3V 20% SMD 5mm Dia


TVS 200W 5V UNIDIR SOD-123FL
LED 565NM WTR CLR GREEN 1206 SMD
LED ALINGAP YELLOW CLR 1206 SMD
TVS DIODE 36VWM 58.1VC SMC
DIODE SCHOTTKY 40V 1A SOD123
FUSE PTC RESET 350MA SMD 0603
DNI MTG 125DRL 300PAD
DNI MTG 125DRL 300PAD
DNI MTG 125DRL 300PAD
DNI MTG 125DRL 300PAD
CONN RCPT MICRO USB AB R/A SMD
TERM BLOCK 3.5MM VERT 2POS PCB
MAXQ_POGO_PIN CBL PLUG-OF-NAILS 10PIN

PCS0J470MCL1GS
SMF5.0A-TP
SML-LX1206GC-TR
SML-LX1206SYC-TR
SMCJ36CA
1N5819HW-7-F
MF-FSMF035X-2

493-3966-1-ND
SMF5.0A-TPMSCT-ND
67-1357-1-ND
67-1699-1-ND
SMCJ36CALFCT-ND
1N5819HW-FDICT-ND
MF-FSMF035X-2CT-ND

Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key

47589-0001
OSTTE020161

WM17143CT-ND
ED2635-ND

Alum 5mm Dia SMD


SOD-123
1206
1206
SMC (DO-214AB)
SOD-123
0603
MTG 125DRL 300PAD
MTG 125DRL 300PAD
MTG 125DRL 300PAD
MTG 125DRL 300PAD
Digi-Key 47589-0001
Digi-Key 2P (3.5MM LS)

TC2050-IDC-NL

TC2050-IDC-NL-ND

Digi-Key TC2050-IDC-NL

CONN HEADER .100 SINGL STR 2POS (2x1)


CONN HEADER .100 SINGL STR 3POS
FERRITE CHIP SIGNAL 2000 OHM SMD
IND 100UH 0.16A MINI DRUM SMD
FIXED IND 6.8UH 640MA 270 MOHM

PEC02SAAN
PEC03SAAN
HZ1206C202R-10
82104C
82682C

S1012E-02-ND
S1012E-03-ND
240-2413-1-ND
811-2479-1-ND
811-2472-1-ND

Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key

2x1 (0.1" LS)


3X1 (0.1" LS)
1206
8200 Series
8200 Series

MOSFET P-CH 25V 460MA SOT-23


PHOTOCOUPLER PHOTORELAY 6-DIP
MOSFET N-CH 60V 2.8A SOT-223
TRANSISTOR GP NPN AMP SOT-23

FDV304P
TLP3545(F)
NDT014L
MMBT3904

FDV304PCT-ND
TLP3545(F)-ND
NDT014LCT-ND
MMBT3904FSCT-ND

Digi-Key
Digi-Key
Digi-Key
Digi-Key

SOT-23 3P
6P DIP
SOT-223
SOT-23-3

DNI
JUMPER
3P JUMPER
HZ1206C202R-10
100uH
6.8uH
PCB
FDV304P
TLP3545(F)
NDT014L
MMBT3904

41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60

61
62
63
64
65
66
67
68
69
70
71
72
73
74
75

1
4
4
2
2
2
1
2
1
1
1
4
5
2
1
1
1
1
1
1

17
1
1
3
6
1
1
1
1
2
1
1
1
1
2

R1
R2 R3 R4 R5
R6 R13 R18 R20
R7 R21
R8 R23
R9 R22
R10
R11 R15
R12
R14
R16
R17 R19 R24 R32
R25 R26 R27 R28 R29
R30 R33
R31
R34
R35
R36
R37
R38

681
150
100K
1.58K
221K
301K
49.9
10K
12.4K
249
10
1K
1.24M
300
511K
24.3
100
20K
10
10K

RES 681 OHM 1/10W 1% 0603 SMD


RES 150 OHM 1/10W 1% 0603 SMD
RES 100K OHM 1/10W 1% 0603 SMD
RES 1.58K OHM 1/10W 1% 0603 SMD
RES 221K OHM 1/10W 1% 0603 SMD
RES 301K OHM 1/10W 1% 0603 SMD
RES 49.9 OHM 1/10W 1% 0603 SMD
RES 10K OHM 1/10W 1% 0603 SMD
RES 12.4K OHM 1/10W 1% 0603 SMD
RES 249 OHM 1W 1% 2512 SMD
RES 10 OHM 1/10W 1% 0603 SMD
RES 1K OHM 1/10W 1% 0603 SMD
RES 1.24M OHM 1/10W 1% 0603 SMD
RES 300 OHM 1/10W 1% 0603 SMD
RES 511K OHM 1/10W 1% 0603 SMD
RES 24.3 OHM 1/10W 1% 0603 SMD
RES 100 OHM 1/10W 1% 0603 SMD
RES 20K OHM 1/10W .1% 0603 SMD
RES SMD 10 OHM 0.1% 1/8W 1206
RES SMD 10K OHM 1% 1/4W 1206

ERJ-3EKF6810V
ERJ-3EKF1500V
ERJ-3EKF1003V
ERJ-3EKF1581V
ERJ-3EKF2213V
ERJ-3EKF3013V
ERJ-3EKF49R9V
ERJ-3EKF1002V
ERJ-3EKF1242V
MCR100JZHF2490
ERJ-3EKF10R0V
ERJ-3EKF1001V
CRCW06031M24FKEA
ERJ-3EKF3000V
ERJ-3EKF5113V
ERJ-3EKF24R3V
ERJ-3EKF1000V
ERA-3AEB203V
CRT1206-BY-10R0ELF
ERJ-8ENF1002V

P681HCT-ND
P150HCT-ND
P100KHCT-ND
P1.58KHCT-ND
P221KHCT-ND
P301KHCT-ND
P49.9HCT-ND
P10.0KHCT-ND
P12.4KHCT-ND
RHM249BBCT-ND
P10.0HCT-ND
P1.00KHCT-ND
541-1.24MHCT-ND
P300HCT-ND
P511KHCT-ND
P24.3HCT-ND
P100HCT-ND
P20KDBCT-ND
CRT1206-BY-10R0ELFCT-ND
P10.0KFCT-ND

Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key

0603
0603
0603
0603
0603
0603
0603
0603
0603
2512
0603
0603
0603
0603
0603
0603
0603
0603
1206
1206

SJ1 SJ2 SJ3 SJ4 SJ5 SJ6 SJ7 SJ8 SJ9 SJ10
SJ11 SJ12 SJ13 SJ14 SJ15 SJ16 SJ17
SW2
T1
TP1 TP3 TP4
TP2 TP5 TP6 TP7 TP8 TP9
U1
U2
U3
U4
U5 U7
U6
U8
U9
Y1
Y2 Y3

SHUNT
DIP SW 4POS
MET-26
RED
BLK
MAX1806EUA33+
NME0524SC
MAXQ622G-0000+
MAX3207EAUT+T
DS8500-JND+
MAX4166EUA+
MAX6133A25+
MAX9620AXK+T
12MHz
3.6864MHz

CONN JUMPER SHORTING TIN


SWITCH DIP 4POS SEALED GOLD
TRANSFORMER 1KCT:1KCT 3.0MADC
TEST POINT PC COMPACT .063"D RED
TEST POINT PC COMPACT .063"D BLK
IC REG LDO 3.3V/ADJ 0.5A 8UMAX
CONV DC/DC 1W 5VIN 24V SIP SGL
IC MCU 16BIT 128KB IR MOD 64LQFP
ESD PROT DIFF SOT23-6
IC MODEM HART SGL 3.6V 20-TQFN
IC OPAMP GP 5MHZ RRO 8UMAX
IC VREF SERIES 2.5V 8UMAX
IC OPAMP CHOPPER 1.5MHZ SC70-5
CRYSTAL 12MHZ 18PF SMD
CRYSTAL 3.6864MHZ 18PF THRU

STC02SYAN
3-5435640-5
MET-26
5005
5006
MAX1806EUA33+
NME0524SC
MAXQ622G-0000+
MAX3207EAUT+T
DS8500-JND+
MAX4166EUA+
MAX6133A25+
MAX9620AXK+T
ABM3-12.000MHZ-D2Y-T
ECS-36-18-4X

S9000-ND
450-1404-ND
838-MET-26
5005K-ND
5006K-ND
MAX1806EUA33+-ND
811-1481-5-ND
MAXQ622G-0000+-ND
MAX3207EAUT+TCT-ND
DS8500-JND+-ND
MAX4166EUA+-ND
MAX6133A25+-ND
MAX9620AXK+TCT-ND
535-10634-1-ND
X1042-ND

Digi-Key
Digi-Key
Mouser
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key

BLK Shunt
8P DIP (0.1" LS)
MET-26
Compact
Compact
8P Power-Umax
4-SIP Module
64P LQFP
6P SOT-23
20P 5x5 TQFN
8P UMAX
8P UMAX
SC70 5P
5x3.2 ABM3
HC49/US

TP2
Black

VBUS GND

J1

TP1
RED

EVKIT POWER IN (USB VBUS)


MICRO USB/POWER

3V3
U1
MAX1806EUA33+

750ma trip
2 350mA
F1 1

L1

1
2
3
4

HZ1206C202R-10

C1
10uF

D1
SMF5.0A-TP

R1
681
C3

IN_1 OUT_1
IN_2 OUT_2
POK
SET
SHDN
GND
EP

TP3
RED

1
8
7
6
5
9

+3V3
C2
10uF

1uF

D2
GRN

GND_4
GND_3
GND_2
GND_1

VBUS
DM
DP
ID
GND

1
2
3
4
5

PRIMARY VOLTAGE REGULATOR

TP4
RED

POWER

9 8 7 6

+24VDC_LOOP_PWR
JP1

Add jumper to U2 power inlet. Simplify output filter.

LOOP PWR SEL

1
SJ17
SHUNT

J2

+24VDC 1
2

1
2

GALVANICALLY ISOLATED DC-DC CONVERTER

EXT
+ LOOP
POWER

LOOP_RET
U2
NME0524SC

DC-DC VIN
2

1 JP14

L4

6.8uH

C5

+ C59
47uF

100nF

C7

1
100nF

L2

+VIN

+VOUT

5V DC

24V DC

-VIN

-VOUT

100uH

L3

100uH

4
3

C57
100nF
50V

C56
1uF
50V

+ C55
22uF
50V

R38
10K

TP5
Black

LOOP_RET

U3
MAXQ622G-0000+

64
18pF

C9

18pF

Y1
12MHz
C10

15

MRST_N
L5

25
26

19

HZ1206C202R-10

18
16

MDM
MDP
C11

U4
MAX3207EAUT+T
1
6
NC6 5
2 IO1
3 GND VCC 4
NC3
IO2

100nF

ESD PROTECTION

23
22

3V3
C12

20

100nF

21
C13
1uF

C14
100nF

C15
1uF

C16
100nF

C17
1uF

C18
100nF

C19
1uF

100nF

36
46
47

8
17
24
35
63

J3

JTAG
3V3

MP24
MP27
MP26

1
2
3
4
5

TCK
GND
TDO
VREF
TMS
DNI

GND
TDI
VCC5
KEY
nRST

10
9
8
7
6

MP25
MRST_N

IRRX
HFXIN
HFXOUT
RESET
VBUS
DM
DP
REG18
VDD
VDDB

P0.0/IRTXM
P0.1/RX0
P0.2/TX0
P0.3/RX1/SDA
P0.4/TX1/SCL
P0.5/TBA0/TBA1
P0.6/TBB0
P0.7/TBB1
P1.0/INT0
P1.1/INT1
P1.2/INT2
P1.3/INT3
P1.4/INT4
P1.5/INT5
P1.6/INT6
P1.7/INT7
P2.0/MOSI0
P2.1/MISO0
P2.2/SCLK0
P2.3/SSEL0
P2.4/TCK
P2.5/TDI
P2.6/TMS
P2.7/TDO

VDDIO

C20

37
38
39
40

MAXQ622 PROGRAMMING JTAG PORT

IRTX

N.C._1
N.C._2
N.C._3
P5.0/MOSI1
P5.1/MISO1
P5.2/SCLK1
P5.3/SSEL1
GND
GND
GND
GND
GND

P3.0/INT8
P3.1/INT9
P3.2/INT10
P3.3/INT11
P3.4/INT12
P3.5/INT13
P3.6/INT14
P3.7/INT15
P4.0
P4.1
P4.2
P4.3
P4.4
P4.5
P4.6
P4.7

2
3
4
5
6
7
9
10
45
48
49
50
51
52
53
54

HRXD_M
HTXD_M
HRXD_F
HTXD_F

HOCD_F
HRTS_F
HRTS_M
HOCD_M

MOUNTING HOLES & BUMPERS


BMP1

H1

1
11
12
13
14
41
42
43
44
27
28
29
30
31
32
33
34
55
56
57
58
59
60
61
62

Bumper

Green - Master Ready


R2

150

MP24
MP25
MP26
MP27

D3

GRN

3V3

D4

1
DNI

Yellow - Master Activity


150

BMP2

H2

Bumper

READY

R3

DNI

YEL

3V3

ACTIVE

H3

BMP3

1
Bumper
DNI
H4

BMP4

1
Bumper
DNI

Green - Field Ready


R4

150

D5

GRN

3V3

READY
Yellow - Field Activity
R5

150

D6

YEL

ACTIVE

3V3

UART INTERFACE
SJ2
SHUNT

SJ3
SHUNT

SJ4
SHUNT

JP2 1

RXD M

HOCD_M

JP3 1

OCD M

HTXD_M

JP4 1

TXD M

HRTS_M

JP5 1

RTS M

3V3

R6
100K

EP_GND

3V3
DVDD
DVDD
OCD_M

DVDD
AGND
DVDD
FSKIN
DGND
REF
RST
FSKOUT
U5
OCD
DS8500-JND+ AVDD

C25
100nF

FSK BANDPASS FILTER

3V3

15
14
13
12
11

240Hz HiPass
JP6 1

FSKI_M
REF_M
FSKO_M
AVDD_M

FSK IN M

C21
R8

JP7 1
C26
100nF

C27
100nF

RAW FSK M

10.1KHz LoPass

2.2nF
NPO

R7

221K

C23

1.58K

C22
10nF
NPO

R9
301K

1uF
SJ6
SHUNT

6
7
8
9
10

C24
100nF

1
2
3
4
5

SJ5
SHUNT

DS8500
MASTER

RTS
XTAL1
XTAL2
DGND
XCEN

3V3

20
19
18
17
16

21

HRXD_M

DIN
DOUT
DGND
PIN17
DGND

SJ1
SHUNT

XMIT_ENABLE_N_M

Y2

3.6864MHz
C28
15pF
NP0

C29
15pF
NP0

INVERTING
RELAY DRIVER

TRANSMIT/RECEIVE
OPTICAL RELAY

Q1

3
R10

3V3

R15

10K

8
4

3V3

IN+
IN-

OUT

NC1
SHDN NC5
VEE

VCC

C32
33nF

3
2

LOOP POWER

T1
MET-26

U6
MAX4166EUA+
RAW_FSK_M

CAPACITIVE VOLTAGE DIVIDER

J4

ISOLATION TRANSFORMER

12.4K
D

C30
33nF

SJ7
SHUNT

C31

2.2uF

6
R13

1
5
3V3

100K

PRI

SEC

D7
SMCJ36CA
R16

10

C33

R14
249

J5

R LOAD

LOOP MASTER
MASTER_PLUS 1
MASTER_MINUS 2

2.2uF

7
C34

C35

100nF

1uF
SJ8
SHUNT

1
2

R12

10K

Q2
TLP3545(F)

FSK BUFFER AMP


R11

+24VDC_LOOP_PWR

49.9

3V3

S
FDV304P

J6
R18
100K

INPUT REFERENCE
R19
1K

TP6

GND

Black

TP7

GND

Black

1
1

C36

C37

1uF

100nF

MASTER/FIELD LOOP

R17
1K

MASTER_FIELD_LOOP

+
-

UART INTERFACE
SJ9
SHUNT

SJ10
SHUNT

SJ11
SHUNT

SJ12
SHUNT
3V3

RXD F

JP9 1

OCD F

HTXD_F

JP10 1

TXD F

HRTS_F

JP11 1

RTS F

R20
100K

EP_GND

3V3

3V3

1
2
3
4
5

DVDD
DVDD
OCD_FLD

DVDD
DVDD
DGND
RST
OCD

AGND
FSKIN
U7
DS8500-JND+ REF
FSKOUT
AVDD

15
14
13
12
11

FSK BANDPASS FILTER

3V3

240Hz HiPass
JP12 1

FSKI_FLD
REF_FLD
FSKO_FLD
AVDD_FLD

FSK IN F

C38
R23

JP13 1
C43

RTS
XTAL1
XTAL2
DGND
XCEN

C42
100nF

SJ13
SHUNT

DS8500
FIELD
DEVICE

RAW FSK F

C40

C44

100nF 100nF

2.2nF
NPO

221K
R22
301K

10.1KHz LoPass
R21

1.58K

C39
10nF
NPO

1uF
SJ14
SHUNT

6
7
8
9
10

C41
100nF

20
19
18
17
16

21

JP8 1

DIN
DOUT
DGND
PIN17
DGND

HRXD_F
HOCD_F

XMIT_ENABLE_N_FLD

Y3

3.6864MHz
C45
15pF
NP0

C46
15pF
NP0

RAW_FSK_FLD

LOOP CURRENT SELECT

NC_1
NC_3
NC_7

8
5

C48
100nF

1
3
7

SW2

LOOP CURRENT SET

ALL OFF 4mA


ALL ON 20mA

MASTER_FIELD_LOOP
SJ15
SHUNT

LOOP CURRENT SET


ALL OFF = 4mA
POS 1 ON = 8mA
POS 1,2 ON = 12mA
POS 1-3 ON = 16mA
POS 1-4 ON = 20mA

J7

R24

1K

2
C52
33nF

R26
1.24M

R27
1.24M

R28
1.24M

R29
1.24M

3
1

R31

CAPACITIVE VOLTAGE DIVIDER

FIELD/MASTER

CURRENT REGULATOR
ERROR AMPLIFIER
C49

1nF

3V3

U9
MAX9620AXK+T
R25
1.24M
511K

GND

VDD

INOUT

5
4

REVERSE POLARITY PROTECTION


C50

1uF

C51

100nF

R30

Q3

LOOP FIELD
FIELD_PLUS
FIELD_MINUS

D 4
D 2

1 G

300

J8

D8
1N5819HW-7-F

PASS TRANSISTOR

S
NDT014L

IN+

SJ16
SHUNT

3 C
C53
33nF

B
R33
300

MODULATION GAIN SET


0.511M ohm
loop current = 2mA per 0.5V

R36
20K
0.1%

TP8

GND

Black

TP9

GND

Black

VREF_2V5

1
2
3
4

GND

I.C._2
I.C._1

C47
100nF

OUT

LOOP FEEDBACK GAIN SET


Rsense 10 ohms
Rfeedback 20K ohms
Loop current = 1mA per 0.5uA summing node current

1 R32

1K

C54
2.2nF
50V

2
E

Q4
MMBT3904

LOOP CURRENT
LIMITER

R34
24.3

LIMIT SENSE RESISTOR

IN

8
7
6
5

U8
MAX6133A25+

J9
D9
SMCJ36CA

LOOP RETURN

4mA
4mA
4mA
4mA

VOLTAGE REFERENCE
3V3

R35
100
LOOP_RET
R37
10
0.1%

LOOP SENSE RESISTOR

1
2

1
2

+
-

NOTES:

1. ALL MEASUREMENTS ARE IN INCHES.


2. THE PWB SHALL BE FABRICATED TO IPC-6012, CLASS 2 AND WORKMANSHIP
SHALL CONFORM TO IPC-A-600, CLASS 2, CURRENT REV. DIMENSIONING AND
TOLERANCE OF PRINTED WIRING BOARD SHALL BE PER IPC-D-300 (CURRENT REV).
3. BOARD MATERIAL TO BE MULTI-FUNCTIONAL FR-4 EXPOXY GLASS LIMINATE,

SILKSCREEN TOP

AND SHALL MEET OR EXCEED MIL-P-13949. COLOR - NATURAL.

SOLDER MASK TOP

4. BOARD MATERIAL AND CONSTRUCTION TO BE U.L. APPROVED AND MARKED ON

1 OZ. FINISHED COPPER

5. MINIMUM COPPER WALL THICKNESS OF PLATED-THRU HOLES TO BE.001 INCHES

PREPREG 0.0039"

6. OVERALL BOARD THICKNESS TO BE .062 +/- 10% AND APPLIES AFTER ALL

THE FINISHED BOARD.

LAYER 1 TOP

LAYER 2 GND PLANE

LAMINATION AND PLATING PROCESSES. MEASURED FROM COPPER TO COPPER.

0.5 OZ. COPPER

7. MAX WARP AND TWIST TO BE .01 INCHES PER INCH.

CORE 0.047"
LAYER 3 PWR PLANE

8. BOARD MUST BE ELECTRICALLY TESTED USING THE SUPPLIED IPC-D -356 NETLIST.
9. PLATE ALL EXPOSED AREAS WITH ELECTROLESS IMMERSION GOLD, NICKEL 100 MICROINCHES THK. GOLD 2-6

0.5 OZ. COPPER

MICROINCHES THK MIN.

PREPREG 0.0039"
LAYER 4 BOTTOM

PROCESS NOTES:

1 OZ. FINISHED COPPER

1. APPLY LPI SOLDERMASK, BOTH SIDES, OVER BARE COPPER (SMOBC)


COLOR: GREEN
SOLDERMASK SHALL CONFORM TO IPC-SM-840, CLASS H, AND CURRENT REVISION. VIAS SHALL BE TENTED OR

SOLDER MASK BOTTOM

CLEARED BY SOLDERMASK PER ARTWORK. FABRICATION VENDOR IS ALLOWED TO ADJUST SOLDERMASK FEATURES

SILKSCREEN BOTTOM

AS NEEDED AS LONG AS SOLDERMASK DAMS ARE MAINTAINED BETWEEN ALL SMD PADS.

2. SILKSCREEN BOTH SIDES USING LPI SILKSCREEN, COLOR: WHITE.


PLACE ANY VENDOR SERIAL NUMBER ASSOCIATED TO PANEL ON BOTTM SIDE OF BOARD.

4.50

BMP4

U3
42
41

40

C1
C

C3

R20

R4

C7

1C72

1
2
C41

R3

3
1

C57
4

C56 2

R24

C38

R21

C47

C47

R21

1
2
C40

C38

1
2
C44

C40

R23

C44

C52

1
2
C52

7
8

R37

R35

4mA

R2

R33
R24
C49
R30
2

C54

C54

C25

C26

1
2
C26

C35
1

C34

1
2
C35
1
2
C34
7

BMP1

2
1

C24

1
2
C51

4mA

1
2
R29

R35

Q4
Q4

R30

1
2
R25

1
2
R33

1
2
R28

1R22

R38

1
2
R36

1
2
R27

SW2
SW2

1
2
R26

R28
R27
R26

R29

GND
R32

R34 R32

D9

J8 J8

TP9

J5 J5

R14

1
2
R34

FIELD

C51

LOOP

R37

C50

U9

MASTER

C39

U8
1
2
C50

U9

LOOP

U8

R25
1

J9

1
2
C39

1
2
C49

4mA

C48

4mA

C48

R36

R38 2

1 R32

C53

TP5

RETURN

C25

L3 2

1
2
C57

C56
1

LOOP

C55

R4

R22

R7

R20

1
2
C46
C45

L3

L2 2

LOOP PWR SEL

C1

1
2
C2

C3

1
2
C17

1
2
C18

1
2
C19

1
2
C20

1
2
C15

C15
C20
C19
C18
C17
1

R6

C59

R6

C55

L2

C59

Y1
1
2
C24

L4 2

C10
1 2

Y1

1
2
C23

C43

C9

R5
R5

R22

R31

MUST BE GALVANICALLY

POWER

JP12
JP12

1
2
R23

R31

C42

33

C9 C10

POWER

J2

C53

R16

C42

C41

34

17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

1
2
C14

ALL ON 20mA

C21

35

1
2
C13

C2

38
37
36

1
2
C27

U1

C14
C13

ALL OFF 4mA

1
2
R16

39

16

L1

L4
2

C27
C23

7
14

C28

3
44
43

C11

J3
J3
1
2
C29

47
46
45

4
5

1
2
C30

3
15

L1

48

U3

2
13

C11

BMP4

64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
1

U4

12

16

C30

F1

F1

11

17

R11

L5

10

18

R12 R11

L5
19

R12

D1
20

15

14

EXT
LOOP

D7

13

FSK IN F

R LOAD

12

C43

LOOP CURRENT SET

C33 2

11

C33

10

LOOP

C31

GND

C46

D5

24V

TP4

U7
U7

JP13

J2
1

C22
R7

U2

Y3

21

D5

D6

READY

ACTIVE

R13

R1
C45 DS8500

Y3

R13

1
TP7

FIELD
DEVICE
D6

R10

1 R1
2

JP11

T1

GND

U2

J4

JP10

C21

T1

TP8

JP14
JP14

ISOLATED
1
2
C31

Q2

R9

R15

1
2
R15

1
2
C22

U6

U6

R8

Q2

C32

JP9

TXD F

2
TP1

1R18
2
1
2
C32

R9

1
2
R19

1R82

R18

JP8

RAW FSK F
3

1
2
C36
1
2
C37

JP6

JP7

R17

OCD F

JP1
1

FSK IN M

Q1
Q1
R17
C36
C37
R19

READY

15

14

13

12

11

ACTIVE

RXD F

16

10

D4

D3

17

18

21

D3

RTS F

C5

19

RAW FSK M

C5

20

C29

TP2

D4

VBUS

TP3
6

24V LOOP POWER1

U5
U5

H3

POWER

Y2

Y2

1
2
R10

MASTER
2

GND

RTS M

+3V3

C16

C28 DS8500

BMP3

1
2
C16

GND

1C12
2

DS8500 EV KIT

TP6

C12

JP5

BMP3

TXD M

JP4

D2

OCD M

D2

JP3

RXD M

JP2
JP2

10

J1
J1

MICRO USB/POWER

PCB-00050-2-0 [REV 2]

H4

Q3

BMP1
2

D7

Q3
R14
C

SN:

DS8500

EV

KIT

PASTE TEMPLATE
SOLDER
SILKSCREEN
ASSEMBLY
DRILL
LAYER
MASK
1MASK
4
-DRAWING
COMPONENT
SOLDER
BOTTOM
TOP
BOTTOM
TOP
BOTTOM
TOP
SIDE
SIDE
(BOTTOM)
(TOP)

02-19-2015

BMP2

FIELD/MASTER

PCB-00050-2-0

PCA-

D8
D8

MASTER/FIELD LOOP

J7

BMP2

D9
2

J6

H1

H2

3.50

NOTES:

1. ALL MEASUREMENTS ARE IN INCHES.


2. THE PWB SHALL BE FABRICATED TO IPC-6012, CLASS 2 AND WORKMANSHIP
SHALL CONFORM TO IPC-A-600, CLASS 2, CURRENT REV. DIMENSIONING AND
TOLERANCE OF PRINTED WIRING BOARD SHALL BE PER IPC-D-300 (CURRENT REV).
3. BOARD MATERIAL TO BE MULTI-FUNCTIONAL FR-4 EXPOXY GLASS LIMINATE,

SILKSCREEN TOP

AND SHALL MEET OR EXCEED MIL-P-13949. COLOR - NATURAL.

SOLDER MASK TOP

4. BOARD MATERIAL AND CONSTRUCTION TO BE U.L. APPROVED AND MARKED ON

1 OZ. FINISHED COPPER

5. MINIMUM COPPER WALL THICKNESS OF PLATED-THRU HOLES TO BE.001 INCHES

PREPREG 0.0039"

6. OVERALL BOARD THICKNESS TO BE .062 +/- 10% AND APPLIES AFTER ALL

THE FINISHED BOARD.

LAYER 1 TOP

LAYER 2 GND PLANE

LAMINATION AND PLATING PROCESSES. MEASURED FROM COPPER TO COPPER.

0.5 OZ. COPPER

7. MAX WARP AND TWIST TO BE .01 INCHES PER INCH.

CORE 0.047"
LAYER 3 PWR PLANE

8. BOARD MUST BE ELECTRICALLY TESTED USING THE SUPPLIED IPC-D -356 NETLIST.
9. PLATE ALL EXPOSED AREAS WITH ELECTROLESS IMMERSION GOLD, NICKEL 100 MICROINCHES THK. GOLD 2-6

0.5 OZ. COPPER

MICROINCHES THK MIN.

PREPREG 0.0039"
LAYER 4 BOTTOM

PROCESS NOTES:

1 OZ. FINISHED COPPER

1. APPLY LPI SOLDERMASK, BOTH SIDES, OVER BARE COPPER (SMOBC)


COLOR: GREEN
SOLDERMASK SHALL CONFORM TO IPC-SM-840, CLASS H, AND CURRENT REVISION. VIAS SHALL BE TENTED OR

SOLDER MASK BOTTOM

CLEARED BY SOLDERMASK PER ARTWORK. FABRICATION VENDOR IS ALLOWED TO ADJUST SOLDERMASK FEATURES

SILKSCREEN BOTTOM

AS NEEDED AS LONG AS SOLDERMASK DAMS ARE MAINTAINED BETWEEN ALL SMD PADS.

2. SILKSCREEN BOTH SIDES USING LPI SILKSCREEN, COLOR: WHITE.


PLACE ANY VENDOR SERIAL NUMBER ASSOCIATED TO PANEL ON BOTTM SIDE OF BOARD.

4.50

BMP4

U3
42
41

40

C1
C

C3

R20

R4

C7

1C72

1
2
C41

R3

3
1

C57
4

C56 2

R24

C38

R21

C47

C47

R21

1
2
C40

C38

1
2
C44

C40

R23

C44

C52

1
2
C52

7
8

R37

R35

4mA

R2

R33
R24
C49
R30
2

C54

C54

C25

C26

1
2
C26

C35
1

C34

1
2
C35
1
2
C34
7

BMP1

2
1

C24

1
2
C51

4mA

1
2
R29

R35

Q4
Q4

R30

1
2
R25

1
2
R33

1
2
R28

1R22

R38

1
2
R36

1
2
R27

SW2
SW2

1
2
R26

R28
R27
R26

R29

GND
R32

R34 R32

D9

J8 J8

TP9

J5 J5

R14

1
2
R34

FIELD

C51

LOOP

R37

C50

U9

MASTER

C39

U8
1
2
C50

U9

LOOP

U8

R25
1

J9

1
2
C39

1
2
C49

4mA

C48

4mA

C48

R36

R38 2

1 R32

C53

TP5

RETURN

C25

L3 2

1
2
C57

C56
1

LOOP

C55

R4

R22

R7

R20

1
2
C46
C45

L3

L2 2

LOOP PWR SEL

C1

1
2
C2

C3

1
2
C17

1
2
C18

1
2
C19

1
2
C20

1
2
C15

C15
C20
C19
C18
C17
1

R6

C59

R6

C55

L2

C59

Y1
1
2
C24

L4 2

C10
1 2

Y1

1
2
C23

C43

C9

R5
R5

R22

R31

MUST BE GALVANICALLY

POWER

JP12
JP12

1
2
R23

R31

C42

33

C9 C10

POWER

J2

C53

R16

C42

C41

34

17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

1
2
C14

ALL ON 20mA

C21

35

1
2
C13

C2

38
37
36

1
2
C27

U1

C14
C13

ALL OFF 4mA

1
2
R16

39

16

L1

L4
2

C27
C23

7
14

C28

3
44
43

C11

J3
J3
1
2
C29

47
46
45

4
5

1
2
C30

3
15

L1

48

U3

2
13

C11

BMP4

64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
1

U4

12

16

C30

F1

F1

11

17

R11

L5

10

18

R12 R11

L5
19

R12

D1
20

15

14

EXT
LOOP

D7

13

FSK IN F

R LOAD

12

C43

LOOP CURRENT SET

C33 2

11

C33

10

LOOP

C31

GND

C46

D5

24V

TP4

U7
U7

JP13

J2
1

C22
R7

U2

Y3

21

D5

D6

READY

ACTIVE

R13

R1
C45 DS8500

Y3

R13

1
TP7

FIELD
DEVICE
D6

R10

1 R1
2

JP11

T1

GND

U2

J4

JP10

C21

T1

TP8

JP14
JP14

ISOLATED
1
2
C31

Q2

R9

R15

1
2
R15

1
2
C22

U6

U6

R8

Q2

C32

JP9

TXD F

2
TP1

1R18
2
1
2
C32

R9

1
2
R19

1R82

R18

JP8

RAW FSK F
3

1
2
C36
1
2
C37

JP6

JP7

R17

OCD F

JP1
1

FSK IN M

Q1
Q1
R17
C36
C37
R19

READY

15

14

13

12

11

ACTIVE

RXD F

16

10

D4

D3

17

18

21

D3

RTS F

C5

19

RAW FSK M

C5

20

C29

TP2

D4

VBUS

TP3
6

24V LOOP POWER1

U5
U5

H3

POWER

Y2

Y2

1
2
R10

MASTER
2

GND

RTS M

+3V3

C16

C28 DS8500

BMP3

1
2
C16

GND

1C12
2

DS8500 EV KIT

TP6

C12

JP5

BMP3

TXD M

JP4

D2

OCD M

D2

JP3

RXD M

JP2
JP2

10

J1
J1

MICRO USB/POWER

PCB-00050-2-0 [REV 2]

H4

Q3

BMP1
2

D7

Q3
R14
C

SN:

DS8500

EV

KIT

PASTE TEMPLATE
SOLDER
SILKSCREEN
ASSEMBLY
DRILL
LAYER
MASK
1MASK
4
-DRAWING
COMPONENT
SOLDER
BOTTOM
TOP
BOTTOM
TOP
BOTTOM
TOP
SIDE
SIDE
(BOTTOM)
(TOP)

02-19-2015

BMP2

FIELD/MASTER

PCB-00050-2-0

PCA-

D8
D8

MASTER/FIELD LOOP

J7

BMP2

D9
2

J6

H1

H2

3.50

PCB-00050-2-0 [REV 2]

H4

H3

D2

J1

C12

JP8

JP2
JP3

JP9

C16

TP3

TP2

TP1

JP4

JP10

JP5

JP11

TP6

JP14

R6

R20

C28

D3

U7

C46 C45

Y3

D6

D4

C29

Y2

TP7

U5

D5

JP1
U2

Q1

JP12

JP6

R35

C33

J5

R14

D9

J8

R34

R32

C40

C38
R21

Q4

C49

C54

D7

TP9

R37

R33

J9

R24

J4

R16

C50

U9

C31

T1

C44

U8
R25

R15

TP8

C47

TP5

R22

C39

C48

R7

TP4

R23

C51

C23

C22

U6

C52

R31

SW2

R13

Q2

R12

R11

C32

R9

C21

R18

C27

C30

R19

R8

C53

R10

JP13

J2

C36
C37

R30

JP7

R17

Q3

J6

J7

D8

H1

H2

DS8500

EV

KIT

PCB-00050-2-0
LAYER 1 -DRAWING
ASSEMBLY
COMPONENT
TOP SIDE

02-19-2015
(TOP)

NOTES:

1. ALL MEASUREMENTS ARE IN INCHES.


2. THE PWB SHALL BE FABRICATED TO IPC-6012, CLASS 2 AND WORKMANSHIP
SHALL CONFORM TO IPC-A-600, CLASS 2, CURRENT REV. DIMENSIONING AND
TOLERANCE OF PRINTED WIRING BOARD SHALL BE PER IPC-D-300 (CURRENT REV).
3. BOARD MATERIAL TO BE MULTI-FUNCTIONAL FR-4 EXPOXY GLASS LIMINATE,

SILKSCREEN TOP

AND SHALL MEET OR EXCEED MIL-P-13949. COLOR - NATURAL.

SOLDER MASK TOP

4. BOARD MATERIAL AND CONSTRUCTION TO BE U.L. APPROVED AND MARKED ON

1 OZ. FINISHED COPPER

5. MINIMUM COPPER WALL THICKNESS OF PLATED-THRU HOLES TO BE.001 INCHES

PREPREG 0.0039"

6. OVERALL BOARD THICKNESS TO BE .062 +/- 10% AND APPLIES AFTER ALL

THE FINISHED BOARD.

LAYER 1 TOP

LAYER 2 GND PLANE

LAMINATION AND PLATING PROCESSES. MEASURED FROM COPPER TO COPPER.

0.5 OZ. COPPER

7. MAX WARP AND TWIST TO BE .01 INCHES PER INCH.

CORE 0.047"
LAYER 3 PWR PLANE

8. BOARD MUST BE ELECTRICALLY TESTED USING THE SUPPLIED IPC-D -356 NETLIST.
9. PLATE ALL EXPOSED AREAS WITH ELECTROLESS IMMERSION GOLD, NICKEL 100 MICROINCHES THK. GOLD 2-6

0.5 OZ. COPPER

MICROINCHES THK MIN.

PREPREG 0.0039"
LAYER 4 BOTTOM

PROCESS NOTES:

1 OZ. FINISHED COPPER

1. APPLY LPI SOLDERMASK, BOTH SIDES, OVER BARE COPPER (SMOBC)


COLOR: GREEN
SOLDERMASK SHALL CONFORM TO IPC-SM-840, CLASS H, AND CURRENT REVISION. VIAS SHALL BE TENTED OR

SOLDER MASK BOTTOM

CLEARED BY SOLDERMASK PER ARTWORK. FABRICATION VENDOR IS ALLOWED TO ADJUST SOLDERMASK FEATURES

SILKSCREEN BOTTOM

AS NEEDED AS LONG AS SOLDERMASK DAMS ARE MAINTAINED BETWEEN ALL SMD PADS.

2. SILKSCREEN BOTH SIDES USING LPI SILKSCREEN, COLOR: WHITE.


PLACE ANY VENDOR SERIAL NUMBER ASSOCIATED TO PANEL ON BOTTM SIDE OF BOARD.

4.50

BMP3
9

D2

H3

POWER

64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49

F1

48

U3

1
2

U4

L5

47
44
43

RXD F

JP8

OCD F

JP9

TXD F

JP10

JP11

42

41

40

10

1
2
C2

1
2
C17

C9

2
2

C10
1 2

Y1

L4 2

1
2
C18

U1

1
2
C19

1
2
C14
1
2
C20

C3

33
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32

1
2
C13

1
2
C15

35
34

16

L1

36

14
15

37

13

38

12

2
TP1

39

11

TP2

RTS M

C11

J3

46
45

4
5

VBUS

TP3
6

JP5

GND

TXD M

1
2
C16

JP4

+3V3

DS8500 EV KIT

OCD M

JP3

1C12
2

RXD M

JP2

D1

C1

10

1 R1
2

J1

BMP4

MICRO USB/POWER

PCB-00050-2-0 [REV 2]

H4

RTS F
2

C5

R4

1C72
1

1
2
C57

C56 2

4mA

4mA

4mA

4mA

R38 2

1
2
C41
1
2
C40

1R22

1
5

C53

R22

3.50

C25
1
2
C26

C47

7
8

1
2
C51

R30

1
2
C49

3
6

4
5

R37

R35

1
2
R16

R24

1
2
R33

R32

Q4

C54

D9

J8

1
2
R34

J5

R14

GND
2

FIELD

LOOP

D7

TP9

MASTER

LOOP

R LOAD

LOOP CURRENT SET

R21

C48
1
2
R25

1
2
C50

1
2
R36

1
2
R29

1
2
R28
3

J9

J4

C33 2

U8

1
2
C31

U9

1
2
C34

1
2
R27

SW2

1
2
R26

1
2
C35

R7

TP5

RETURN

LOOP

MUST BE GALVANICALLY

POWER

LOOP

TP4

1
2
C39
1

C38

1 R32

R31

C21

JP12

1
2
R23

POWER

1
2
C44

1
2
C52

ALL ON 20mA

ALL OFF 4mA


1

L3 2

C55
R6

R20

1
2
C46
C45

1
2
C24

L2 2

C28

C59
1

R5

LOOP PWR SEL

1
2
C23

1
2
C27

1
2
C29

16

1
2
C30

17

EXT
LOOP

R11

18

13

12

11

R12

19

10

ISOLATED

R13

15

20

14

FSK IN F

24V

1
2
R15

T1

C43

U2

JP13

J2
1

1
2
C22

U6

TP8

GND

21

Q2

Y3

1
2
C32

1R18
2

R9

D5

1
2
R19

1
2
R10

1R82

D6

RAW FSK F
3

1
2
C36
1
2
C37

GND

JP6

JP7

JP1

U7

FSK IN M

READY

ACTIVE

15

14

13

12

11

READY

16

10

ACTIVE

17

D4

D3

18

21

19

Q1
R17

DS8500
5

20

RAW FSK M

TP7

FIELD
DEVICE

Y2

JP14

24V LOOP POWER1

U5

MASTER
DS8500

GND

C42

TP6

BMP1
2

PCA-

FIELD/MASTER

SN:

DS8500

EV

KIT

PCB-00050-2-0
PASTE TEMPLATE
SOLDER
SILKSCREEN
ASSEMBLY
DRILL
LAYER
MASK
1MASK
4
-DRAWING
COMPONENT
SOLDER
BOTTOM
TOP
BOTTOM
TOP
BOTTOM
TOP
SIDE
SIDE
(BOTTOM)
(TOP)

02-19-2015

BMP2

MASTER/FIELD LOOP

D8

J7

H1

J6

Q3
1

H2

DS8500

EV

KIT

PCB-00050-2-0
LAYER

GND

02-19-2015
PLANE

DS8500

EV

KIT

PCB-00050-2-0
LAYER

PWR

02-19-2015
PLANE

ASSEMBLY
LAYER
4 -DRAWING
SOLDER BOTTOM
SIDE (BOTTOM)
PCB-00050-2-0
DS8500

EV

02-19-2015
KIT
BMP2

BMP1

R36

R29
R28
R27
R26
C34
C35

R38

C56
R4

C43

R2
C26
C7

C57

R5

R3

C41

C24

C55
C42

L2

C25

L3

C59
C5

L4

Y1
C17

C18

C19

C20

C15

U1
C3

C2

L1

C9

C10

C14
C13

C11

L5
C1

D1

U4

J3

U3

F1

R1

BMP3

BMP4

MICRO USB/POWER

H4

D2

H3

POWER

J1

C12

RXD F

JP8

OCD F

JP9

TXD M

TXD F

JP10

RTS M

RTS F

JP11

VBUS

TP1

JP14

FSK IN F

JP12
ALL OFF 4mA
ALL ON 20mA

R31

R7

24V
TP4

TP5

MUST BE GALVANICALLY
ISOLATED

R15

LOOP

POWER

LOOP

RETURN

U8

LOOP

MASTER

J5

LOOP

FIELD

R14

D9

J8

GND
R34

R32

Q4

C54

D7

TP9

R37

T1

R LOAD

R35

GND

R16

LOOP CURRENT SET


C33

C49

J9

R24

J4

R22

C50

U9

C31

TP8

R23

C39

C48

POWER

C40

JP13
EXT
LOOP

C38

J2

R9

C22

U6

GND

RAW FSK F

R33

R13

Q2

R12

R11

C32

Y3

U2

4mA

R18

C23

R19

R8

JP1

C21

R10

C27

C30

C36
C37

D5

R21

JP6

JP7

R17

D6

READY

C44

LOOP PWR SEL

FSK IN M

RAW FSK M

Q1

ACTIVE

C47

READY

U7

C52

ACTIVE

R6

D4
D3

DS8500

SW2

C28
C29

Y2

TP7

FIELD
DEVICE

24V LOOP POWER

U5

R20

MASTER
DS8500

GND

C51

TP6

TP2

C46 C45

TP3

R30

JP5

GND

C16

4mA

JP4

DS8500 EV KIT

R25

OCD M

4mA

JP3

+3V3

4mA

RXD M

C53

JP2

Q3

J6
H1

MASTER/FIELD LOOP

DS8500

EV

FIELD/MASTER

KIT

PCB-00050-2-0
ASSEMBLY

DRAWING

D8

J7

02-19-2015
TOP

H2

ASSEMBLY

DRAWING

BOTTOM

PCB-00050-2-0
DS8500

EV

02-19-2015
KIT
BMP2

PCA-

SN:
BMP1

R36

R29
R28
R27
R26
C34
C35

R38

C56
R4

C43

R2
C26
C7

C57

R5

R3

C41

C24

C55
C42

L2

C25

L3

C59
C5

L4

Y1
C17

C18

C19

C20

C15

U1
C3

C2

L1

C9

C10

C14
C13

C11

L5
C1

D1

U4

J3

U3

F1

R1

BMP3

BMP4

NOTES:

1. ALL MEASUREMENTS ARE IN INCHES.


2. THE PWB SHALL BE FABRICATED TO IPC-6012, CLASS 2 AND WORKMANSHIP
SHALL CONFORM TO IPC-A-600, CLASS 2, CURRENT REV. DIMENSIONING AND
TOLERANCE OF PRINTED WIRING BOARD SHALL BE PER IPC-D-300 (CURRENT REV).
3. BOARD MATERIAL TO BE MULTI-FUNCTIONAL FR-4 EXPOXY GLASS LIMINATE,

SILKSCREEN TOP

AND SHALL MEET OR EXCEED MIL-P-13949. COLOR - NATURAL.

SOLDER MASK TOP

4. BOARD MATERIAL AND CONSTRUCTION TO BE U.L. APPROVED AND MARKED ON

1 OZ. FINISHED COPPER

5. MINIMUM COPPER WALL THICKNESS OF PLATED-THRU HOLES TO BE.001 INCHES

PREPREG 0.0039"

6. OVERALL BOARD THICKNESS TO BE .062 +/- 10% AND APPLIES AFTER ALL

THE FINISHED BOARD.

LAYER 1 TOP

LAYER 2 GND PLANE

LAMINATION AND PLATING PROCESSES. MEASURED FROM COPPER TO COPPER.

0.5 OZ. COPPER

7. MAX WARP AND TWIST TO BE .01 INCHES PER INCH.

CORE 0.047"
LAYER 3 PWR PLANE

8. BOARD MUST BE ELECTRICALLY TESTED USING THE SUPPLIED IPC-D -356 NETLIST.
9. PLATE ALL EXPOSED AREAS WITH ELECTROLESS IMMERSION GOLD, NICKEL 100 MICROINCHES THK. GOLD 2-6

0.5 OZ. COPPER

MICROINCHES THK MIN.

PREPREG 0.0039"
LAYER 4 BOTTOM

PROCESS NOTES:

1 OZ. FINISHED COPPER

1. APPLY LPI SOLDERMASK, BOTH SIDES, OVER BARE COPPER (SMOBC)


COLOR: GREEN
SOLDERMASK SHALL CONFORM TO IPC-SM-840, CLASS H, AND CURRENT REVISION. VIAS SHALL BE TENTED OR

SOLDER MASK BOTTOM

CLEARED BY SOLDERMASK PER ARTWORK. FABRICATION VENDOR IS ALLOWED TO ADJUST SOLDERMASK FEATURES

SILKSCREEN BOTTOM

AS NEEDED AS LONG AS SOLDERMASK DAMS ARE MAINTAINED BETWEEN ALL SMD PADS.

2. SILKSCREEN BOTH SIDES USING LPI SILKSCREEN, COLOR: WHITE.


PLACE ANY VENDOR SERIAL NUMBER ASSOCIATED TO PANEL ON BOTTM SIDE OF BOARD.

4.50

DRILL CHART: TOP to BOTTOM

ALL UNITS ARE IN MILS


FIGURE

3.50

0
0

DS8500

EV

PCB-00050-2-0
DRILL

TEMPLATE

KIT
02-19-2015

SIZE

TOLERANCE

PLATED

12.0

+3.0/-3.0

PLATED

QTY
12

12.0

+3.0/-3.0

PLATED

116

32.0

+3.0/-3.0

PLATED

10

38.0

+3.0/-3.0

PLATED

14

42.0

+3.0/-3.0

PLATED

38

45.0

+3.0/-3.0

PLATED

50.0

+3.0/-3.0

PLATED

65.0

+3.0/-3.0

PLATED

125.0

+3.0/-3.0

PLATED

40.0

+3.0/-3.0

NON-PLATED

35.0x28.0

+3.0/-3.0

PLATED

52.0x25.0

+3.0/-3.0

PLATED

DS8500

EV

PCB-00050-2-0
PASTE

MASK

KIT
02-19-2015

TOP

DS8500

EV

KIT

PCB-00050-2-0
PASTE

MASK

02-19-2015
BOTTOM

MICRO USB/POWER

H4

D2

H3

POWER

J1
C12

RXD F

JP8

OCD F

JP9

TXD M

TXD F

JP10

RTS M

RTS F

JP11

JP14

MASTER
C28 DS8500

U2

D3
FSK IN M

C30

R20
FSK IN F
RAW FSK F
JP12
JP13

EXT

ALL OFF 4mA


ALL ON 20mA

LOOP

C21

POWER

J2

C22

4mA

R8

C53

C48

TP4

MUST BE GALVANICALLY

TP5

ISOLATED
R15

LOOP

POWER

LOOP

C39
C47

24V

R7

R22

R31

RETURN

SW2

R12 R11

C46
D5

U6

R13

U8

R25

C50
C51

C31

J4

T1

C33

TP9

LOOP

MASTER

LOOP

FIELD

R37

R33
R24
C49
R30

LOOP CURRENT SET


R LOAD

GND

U9

J9

R35

R16

Q2

JP1

R9
C27
C23

R10

R18

C32

TP8

JP6

JP7

R17
C36
C37
R19

READY

R23

C29

Q1

GND

ACTIVE

C38

READY

Y3

R21

LOOP PWR SEL

ACTIVE

R6

Y2

TP7
C45 DS8500
U7

D6
D4

RAW FSK M

FIELD
DEVICE

24V LOOP POWER

U5

GND

C52

TP6

TP1

TP2

C40

JP5

TP3

C16

VBUS

C44

JP4

GND

+3V3

DS8500 EV KIT

4mA

OCD M

4mA

RXD M

4mA

JP2
JP3

GND
Q4
C54

R34 R32
J5

J8

Q3

D7
R14

D9

J6
H1

J7

MASTER/FIELD LOOP

DS8500

EV

PCB-00050-2-0
SILKSCREEN

D8

FIELD/MASTER

KIT
02-19-2015

TOP

H2

SILKSCREEN

BOTTOM

PCB-00050-2-0

02-19-2015

DS8500

EV

KIT
BMP2

PCA-

SN:
BMP1

R29
R36
R28
R27
R26

C34
C35
R38

C56
R4
C43

R2
C26

C57
C7

C41

R5

R3

C42

C24
C25

L3

C59
L2
C15
C20
C19
C18
C17

L4

U1

C5

C55
Y1

C3

C2
C9 C10

C14
C13

L1
C11

L5

J3

U4

D1

F1

R1

U3
C1

BMP3

BMP4

DS8500

EV

PCB-00050-2-0
SOLDER

MASK

KIT
02-19-2015

TOP

DS8500

EV

KIT

PCB-00050-2-0
SOLDER

MASK

02-19-2015
BOTTOM

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