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General Description
The DS8500 evaluation kit (EV kit) provides a convenient platform to evaluate the DS8500 HART modem.
It allows quick evaluation through a demonstration mode
and in-depth evaluation using HART Communication
Foundation (a part of FieldComm Group) tools.
EV Kit Contents
Evaluates: DS8500
Evaluates: DS8500
Quick Start
Power Supply
Users must also use the DS8500 IC data sheet in conjunction with this EV kit data sheet.
The EV kit uses USB power for all on-board devices.
The current loop is isolated from board ground and
power allowing communications between Master and
Field Device, both implemented by serial ports on the
MAXQ622. This common connection necessitates use
of a fully isolated 420mA loop, which is very sensitive
to ground loops, thus direct probing of the on-board loop
is strongly discouraged and could damage the EV kit.
Note that this is a nontypical configuration specifically
designed for demonstration purposes. In typical installations, Master and Field Device are separately located,
with the Field Device floating, often powered by loop
current.
www.maximintegrated.com
Maxim Integrated 2
Evaluates: DS8500
Interface Ports
Jumper Functions
External Connectors
Advanced Evaluation
PIN NAME
PIN TYPE
DESCRIPTION
JP2
HRXD_M
Output
JP3
HOCD_M
Output
JP4
HTXD_M
Input
JP5
HRTS_M
Input
JP8
HRXD_F
Output
JP9
HOCD_F
Output
JP10
HTXD_F
Input
JP11
HRTS_F
Input
NAME
TYPE
JP6
FSK_IN_M
Input
JP7
RAW_FSK_M
Output
JP12
FSK_IN_F
Input
JP13
RAW_FSK_F
Output
www.maximintegrated.com
DESCRIPTION
Maxim Integrated 3
Evaluates: DS8500
SETTING
EFFECT
Closed*
Open
Closed
Open*
Closed*
Open
Closed*
Open
Closed*
Open
Closed*
Open
Closed*
Open
*Default position.
PURPOSE
J2
Power the 420mA loop from an external galvanic isolated supply or battery
J5
J8
www.maximintegrated.com
Maxim Integrated 4
Evaluates: DS8500
USB
JP2
RXD M
RXD F
JP8
JP3
OCD M
OCD F
JP9
JP4
TXD M
TXD F
JP10
JP5
RTS M
RTS F
JP11
PC/LAPTOP
RS232
LEVEL
SHIFTER
FIELD DEVICE
XMTR MV
HCF_TOOL-039
FIELD
DEVICE
MASTER
J4
J9
250
J6
J7
REFERENCE
MODEM
HCF_TOOL-35
PC/LAPTOP
MASTER
HCF_KIT_180
www.maximintegrated.com
Maxim Integrated 5
Evaluates: DS8500
USB
PC/LAPTOP
MASTER
HCF_KIT_180
RS232
LEVEL
SHIFTER
JP2
RXD M
RXD F
JP8
JP3
OCD M
OCD F
JP9
JP4
TXD M
TXD F
JP10
JP5
RTS M
RTS F
JP11
FIELD
DEVICE
MASTER
J4
PC/LAPTOP
FIELD DEVICE
XMTR MV
HCF_TOOL-039
REFERENCE
MODEM
HCF_TOOL-35
J9
250
J6
J7
www.maximintegrated.com
Maxim Integrated 6
Evaluates: DS8500
www.maximintegrated.com
Ordering Information
PART
DS8500-KIT#
TYPE
EV Kit
Maxim Integrated 7
Evaluates: DS8500
Revision History
REVISION
NUMBER
REVISION
DATE
PAGES
CHANGED
11/10
Initial release
9/15
Rewrote data sheet to include GUI and jumper descriptions and settings
DESCRIPTION
18
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim Integrateds website at www.maximintegrated.com.
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses
are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
1
1
3
2
2
1
1
1
1
1
1
1
3
C59
D1
D2 D3 D5
D4 D6
D7 D9
D8
F1
H1
H2
H3
H4
J1
J2 J5 J8
1 J3
J4 J6 J7 J9 JP2 JP3 JP4 JP5 JP6 JP7 JP8
17 JP9 JP10 JP11 JP12 JP13 JP14
1 JP1
2 L1 L5
2 L2 L3
1 L4
1 PCB1
1 Q1
1 Q2
1 Q3
1 Q4
Value
Bumper
10uF
1uF
BOM_Description
BUMPER CYLIN 0.375" DIA BLK
CAP CER 10uF 10V 10% X7R 0805
CAP CER 1uF 10V 20% X5R 0603
Manufacturer_PN
SJ61A4
GRM21BR71A106KE51L
GRM188R61A105MA61D
Vendor_PN
SJ5750-0-ND
490-3905-1-ND
490-1544-1-ND
Vendor
Digi-Key
Digi-Key
Digi-Key
PKG_Size
0.375" Dia x 0.311" H
0805
0603
100nF
18pF
2.2nF
10nF
1uF
15pF
33nF
2.2uF
2.2uF
1nF
22uF
1uF
100nF
C0603C104K4RACTU
GRM1555C1H180JA01D
GRM2165C1H222JA01D
GRM2195C1H103JA01D
GCM188R71C105KA64D
GRM1885C1H150JA01D
C0603C333K8RACTU
C0603C225K8PACTU
GRM31CR71H225KA88L
GRM1885C1H102JA01D
RPS1H220MCN1GS
C3216X7R1H105K160AB
C0603C104K5RACTU
399-1096-1-ND
490-5858-1-ND
490-1628-1-ND
490-1642-1-ND
490-5241-1-ND
490-1407-1-ND
399-9070-1-ND
399-4911-1-ND
490-3367-1-ND
490-1451-1-ND
493-6648-1-ND
445-1423-1-ND
399-5089-1-ND
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
0603
0402
0805
0805
0603
0603
0603
0603
1206
0603
Alum 8mm Dia (Case E)
1206
0603
47uF
SMF5.0A-TP
GRN
YEL
SMCJ36CA
1N5819HW-7-F
350mA
DNI
DNI
DNI
DNI
MICRO USB AB RCPT RA
2P 3.5mm
PCS0J470MCL1GS
SMF5.0A-TP
SML-LX1206GC-TR
SML-LX1206SYC-TR
SMCJ36CA
1N5819HW-7-F
MF-FSMF035X-2
493-3966-1-ND
SMF5.0A-TPMSCT-ND
67-1357-1-ND
67-1699-1-ND
SMCJ36CALFCT-ND
1N5819HW-FDICT-ND
MF-FSMF035X-2CT-ND
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
47589-0001
OSTTE020161
WM17143CT-ND
ED2635-ND
TC2050-IDC-NL
TC2050-IDC-NL-ND
Digi-Key TC2050-IDC-NL
PEC02SAAN
PEC03SAAN
HZ1206C202R-10
82104C
82682C
S1012E-02-ND
S1012E-03-ND
240-2413-1-ND
811-2479-1-ND
811-2472-1-ND
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
FDV304P
TLP3545(F)
NDT014L
MMBT3904
FDV304PCT-ND
TLP3545(F)-ND
NDT014LCT-ND
MMBT3904FSCT-ND
Digi-Key
Digi-Key
Digi-Key
Digi-Key
SOT-23 3P
6P DIP
SOT-223
SOT-23-3
DNI
JUMPER
3P JUMPER
HZ1206C202R-10
100uH
6.8uH
PCB
FDV304P
TLP3545(F)
NDT014L
MMBT3904
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
1
4
4
2
2
2
1
2
1
1
1
4
5
2
1
1
1
1
1
1
17
1
1
3
6
1
1
1
1
2
1
1
1
1
2
R1
R2 R3 R4 R5
R6 R13 R18 R20
R7 R21
R8 R23
R9 R22
R10
R11 R15
R12
R14
R16
R17 R19 R24 R32
R25 R26 R27 R28 R29
R30 R33
R31
R34
R35
R36
R37
R38
681
150
100K
1.58K
221K
301K
49.9
10K
12.4K
249
10
1K
1.24M
300
511K
24.3
100
20K
10
10K
ERJ-3EKF6810V
ERJ-3EKF1500V
ERJ-3EKF1003V
ERJ-3EKF1581V
ERJ-3EKF2213V
ERJ-3EKF3013V
ERJ-3EKF49R9V
ERJ-3EKF1002V
ERJ-3EKF1242V
MCR100JZHF2490
ERJ-3EKF10R0V
ERJ-3EKF1001V
CRCW06031M24FKEA
ERJ-3EKF3000V
ERJ-3EKF5113V
ERJ-3EKF24R3V
ERJ-3EKF1000V
ERA-3AEB203V
CRT1206-BY-10R0ELF
ERJ-8ENF1002V
P681HCT-ND
P150HCT-ND
P100KHCT-ND
P1.58KHCT-ND
P221KHCT-ND
P301KHCT-ND
P49.9HCT-ND
P10.0KHCT-ND
P12.4KHCT-ND
RHM249BBCT-ND
P10.0HCT-ND
P1.00KHCT-ND
541-1.24MHCT-ND
P300HCT-ND
P511KHCT-ND
P24.3HCT-ND
P100HCT-ND
P20KDBCT-ND
CRT1206-BY-10R0ELFCT-ND
P10.0KFCT-ND
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
0603
0603
0603
0603
0603
0603
0603
0603
0603
2512
0603
0603
0603
0603
0603
0603
0603
0603
1206
1206
SJ1 SJ2 SJ3 SJ4 SJ5 SJ6 SJ7 SJ8 SJ9 SJ10
SJ11 SJ12 SJ13 SJ14 SJ15 SJ16 SJ17
SW2
T1
TP1 TP3 TP4
TP2 TP5 TP6 TP7 TP8 TP9
U1
U2
U3
U4
U5 U7
U6
U8
U9
Y1
Y2 Y3
SHUNT
DIP SW 4POS
MET-26
RED
BLK
MAX1806EUA33+
NME0524SC
MAXQ622G-0000+
MAX3207EAUT+T
DS8500-JND+
MAX4166EUA+
MAX6133A25+
MAX9620AXK+T
12MHz
3.6864MHz
STC02SYAN
3-5435640-5
MET-26
5005
5006
MAX1806EUA33+
NME0524SC
MAXQ622G-0000+
MAX3207EAUT+T
DS8500-JND+
MAX4166EUA+
MAX6133A25+
MAX9620AXK+T
ABM3-12.000MHZ-D2Y-T
ECS-36-18-4X
S9000-ND
450-1404-ND
838-MET-26
5005K-ND
5006K-ND
MAX1806EUA33+-ND
811-1481-5-ND
MAXQ622G-0000+-ND
MAX3207EAUT+TCT-ND
DS8500-JND+-ND
MAX4166EUA+-ND
MAX6133A25+-ND
MAX9620AXK+TCT-ND
535-10634-1-ND
X1042-ND
Digi-Key
Digi-Key
Mouser
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
Digi-Key
BLK Shunt
8P DIP (0.1" LS)
MET-26
Compact
Compact
8P Power-Umax
4-SIP Module
64P LQFP
6P SOT-23
20P 5x5 TQFN
8P UMAX
8P UMAX
SC70 5P
5x3.2 ABM3
HC49/US
TP2
Black
VBUS GND
J1
TP1
RED
3V3
U1
MAX1806EUA33+
750ma trip
2 350mA
F1 1
L1
1
2
3
4
HZ1206C202R-10
C1
10uF
D1
SMF5.0A-TP
R1
681
C3
IN_1 OUT_1
IN_2 OUT_2
POK
SET
SHDN
GND
EP
TP3
RED
1
8
7
6
5
9
+3V3
C2
10uF
1uF
D2
GRN
GND_4
GND_3
GND_2
GND_1
VBUS
DM
DP
ID
GND
1
2
3
4
5
TP4
RED
POWER
9 8 7 6
+24VDC_LOOP_PWR
JP1
1
SJ17
SHUNT
J2
+24VDC 1
2
1
2
EXT
+ LOOP
POWER
LOOP_RET
U2
NME0524SC
DC-DC VIN
2
1 JP14
L4
6.8uH
C5
+ C59
47uF
100nF
C7
1
100nF
L2
+VIN
+VOUT
5V DC
24V DC
-VIN
-VOUT
100uH
L3
100uH
4
3
C57
100nF
50V
C56
1uF
50V
+ C55
22uF
50V
R38
10K
TP5
Black
LOOP_RET
U3
MAXQ622G-0000+
64
18pF
C9
18pF
Y1
12MHz
C10
15
MRST_N
L5
25
26
19
HZ1206C202R-10
18
16
MDM
MDP
C11
U4
MAX3207EAUT+T
1
6
NC6 5
2 IO1
3 GND VCC 4
NC3
IO2
100nF
ESD PROTECTION
23
22
3V3
C12
20
100nF
21
C13
1uF
C14
100nF
C15
1uF
C16
100nF
C17
1uF
C18
100nF
C19
1uF
100nF
36
46
47
8
17
24
35
63
J3
JTAG
3V3
MP24
MP27
MP26
1
2
3
4
5
TCK
GND
TDO
VREF
TMS
DNI
GND
TDI
VCC5
KEY
nRST
10
9
8
7
6
MP25
MRST_N
IRRX
HFXIN
HFXOUT
RESET
VBUS
DM
DP
REG18
VDD
VDDB
P0.0/IRTXM
P0.1/RX0
P0.2/TX0
P0.3/RX1/SDA
P0.4/TX1/SCL
P0.5/TBA0/TBA1
P0.6/TBB0
P0.7/TBB1
P1.0/INT0
P1.1/INT1
P1.2/INT2
P1.3/INT3
P1.4/INT4
P1.5/INT5
P1.6/INT6
P1.7/INT7
P2.0/MOSI0
P2.1/MISO0
P2.2/SCLK0
P2.3/SSEL0
P2.4/TCK
P2.5/TDI
P2.6/TMS
P2.7/TDO
VDDIO
C20
37
38
39
40
IRTX
N.C._1
N.C._2
N.C._3
P5.0/MOSI1
P5.1/MISO1
P5.2/SCLK1
P5.3/SSEL1
GND
GND
GND
GND
GND
P3.0/INT8
P3.1/INT9
P3.2/INT10
P3.3/INT11
P3.4/INT12
P3.5/INT13
P3.6/INT14
P3.7/INT15
P4.0
P4.1
P4.2
P4.3
P4.4
P4.5
P4.6
P4.7
2
3
4
5
6
7
9
10
45
48
49
50
51
52
53
54
HRXD_M
HTXD_M
HRXD_F
HTXD_F
HOCD_F
HRTS_F
HRTS_M
HOCD_M
H1
1
11
12
13
14
41
42
43
44
27
28
29
30
31
32
33
34
55
56
57
58
59
60
61
62
Bumper
150
MP24
MP25
MP26
MP27
D3
GRN
3V3
D4
1
DNI
BMP2
H2
Bumper
READY
R3
DNI
YEL
3V3
ACTIVE
H3
BMP3
1
Bumper
DNI
H4
BMP4
1
Bumper
DNI
150
D5
GRN
3V3
READY
Yellow - Field Activity
R5
150
D6
YEL
ACTIVE
3V3
UART INTERFACE
SJ2
SHUNT
SJ3
SHUNT
SJ4
SHUNT
JP2 1
RXD M
HOCD_M
JP3 1
OCD M
HTXD_M
JP4 1
TXD M
HRTS_M
JP5 1
RTS M
3V3
R6
100K
EP_GND
3V3
DVDD
DVDD
OCD_M
DVDD
AGND
DVDD
FSKIN
DGND
REF
RST
FSKOUT
U5
OCD
DS8500-JND+ AVDD
C25
100nF
3V3
15
14
13
12
11
240Hz HiPass
JP6 1
FSKI_M
REF_M
FSKO_M
AVDD_M
FSK IN M
C21
R8
JP7 1
C26
100nF
C27
100nF
RAW FSK M
10.1KHz LoPass
2.2nF
NPO
R7
221K
C23
1.58K
C22
10nF
NPO
R9
301K
1uF
SJ6
SHUNT
6
7
8
9
10
C24
100nF
1
2
3
4
5
SJ5
SHUNT
DS8500
MASTER
RTS
XTAL1
XTAL2
DGND
XCEN
3V3
20
19
18
17
16
21
HRXD_M
DIN
DOUT
DGND
PIN17
DGND
SJ1
SHUNT
XMIT_ENABLE_N_M
Y2
3.6864MHz
C28
15pF
NP0
C29
15pF
NP0
INVERTING
RELAY DRIVER
TRANSMIT/RECEIVE
OPTICAL RELAY
Q1
3
R10
3V3
R15
10K
8
4
3V3
IN+
IN-
OUT
NC1
SHDN NC5
VEE
VCC
C32
33nF
3
2
LOOP POWER
T1
MET-26
U6
MAX4166EUA+
RAW_FSK_M
J4
ISOLATION TRANSFORMER
12.4K
D
C30
33nF
SJ7
SHUNT
C31
2.2uF
6
R13
1
5
3V3
100K
PRI
SEC
D7
SMCJ36CA
R16
10
C33
R14
249
J5
R LOAD
LOOP MASTER
MASTER_PLUS 1
MASTER_MINUS 2
2.2uF
7
C34
C35
100nF
1uF
SJ8
SHUNT
1
2
R12
10K
Q2
TLP3545(F)
+24VDC_LOOP_PWR
49.9
3V3
S
FDV304P
J6
R18
100K
INPUT REFERENCE
R19
1K
TP6
GND
Black
TP7
GND
Black
1
1
C36
C37
1uF
100nF
MASTER/FIELD LOOP
R17
1K
MASTER_FIELD_LOOP
+
-
UART INTERFACE
SJ9
SHUNT
SJ10
SHUNT
SJ11
SHUNT
SJ12
SHUNT
3V3
RXD F
JP9 1
OCD F
HTXD_F
JP10 1
TXD F
HRTS_F
JP11 1
RTS F
R20
100K
EP_GND
3V3
3V3
1
2
3
4
5
DVDD
DVDD
OCD_FLD
DVDD
DVDD
DGND
RST
OCD
AGND
FSKIN
U7
DS8500-JND+ REF
FSKOUT
AVDD
15
14
13
12
11
3V3
240Hz HiPass
JP12 1
FSKI_FLD
REF_FLD
FSKO_FLD
AVDD_FLD
FSK IN F
C38
R23
JP13 1
C43
RTS
XTAL1
XTAL2
DGND
XCEN
C42
100nF
SJ13
SHUNT
DS8500
FIELD
DEVICE
RAW FSK F
C40
C44
100nF 100nF
2.2nF
NPO
221K
R22
301K
10.1KHz LoPass
R21
1.58K
C39
10nF
NPO
1uF
SJ14
SHUNT
6
7
8
9
10
C41
100nF
20
19
18
17
16
21
JP8 1
DIN
DOUT
DGND
PIN17
DGND
HRXD_F
HOCD_F
XMIT_ENABLE_N_FLD
Y3
3.6864MHz
C45
15pF
NP0
C46
15pF
NP0
RAW_FSK_FLD
NC_1
NC_3
NC_7
8
5
C48
100nF
1
3
7
SW2
MASTER_FIELD_LOOP
SJ15
SHUNT
J7
R24
1K
2
C52
33nF
R26
1.24M
R27
1.24M
R28
1.24M
R29
1.24M
3
1
R31
FIELD/MASTER
CURRENT REGULATOR
ERROR AMPLIFIER
C49
1nF
3V3
U9
MAX9620AXK+T
R25
1.24M
511K
GND
VDD
INOUT
5
4
1uF
C51
100nF
R30
Q3
LOOP FIELD
FIELD_PLUS
FIELD_MINUS
D 4
D 2
1 G
300
J8
D8
1N5819HW-7-F
PASS TRANSISTOR
S
NDT014L
IN+
SJ16
SHUNT
3 C
C53
33nF
B
R33
300
R36
20K
0.1%
TP8
GND
Black
TP9
GND
Black
VREF_2V5
1
2
3
4
GND
I.C._2
I.C._1
C47
100nF
OUT
1 R32
1K
C54
2.2nF
50V
2
E
Q4
MMBT3904
LOOP CURRENT
LIMITER
R34
24.3
IN
8
7
6
5
U8
MAX6133A25+
J9
D9
SMCJ36CA
LOOP RETURN
4mA
4mA
4mA
4mA
VOLTAGE REFERENCE
3V3
R35
100
LOOP_RET
R37
10
0.1%
1
2
1
2
+
-
NOTES:
SILKSCREEN TOP
PREPREG 0.0039"
6. OVERALL BOARD THICKNESS TO BE .062 +/- 10% AND APPLIES AFTER ALL
LAYER 1 TOP
CORE 0.047"
LAYER 3 PWR PLANE
8. BOARD MUST BE ELECTRICALLY TESTED USING THE SUPPLIED IPC-D -356 NETLIST.
9. PLATE ALL EXPOSED AREAS WITH ELECTROLESS IMMERSION GOLD, NICKEL 100 MICROINCHES THK. GOLD 2-6
PREPREG 0.0039"
LAYER 4 BOTTOM
PROCESS NOTES:
CLEARED BY SOLDERMASK PER ARTWORK. FABRICATION VENDOR IS ALLOWED TO ADJUST SOLDERMASK FEATURES
SILKSCREEN BOTTOM
AS NEEDED AS LONG AS SOLDERMASK DAMS ARE MAINTAINED BETWEEN ALL SMD PADS.
4.50
BMP4
U3
42
41
40
C1
C
C3
R20
R4
C7
1C72
1
2
C41
R3
3
1
C57
4
C56 2
R24
C38
R21
C47
C47
R21
1
2
C40
C38
1
2
C44
C40
R23
C44
C52
1
2
C52
7
8
R37
R35
4mA
R2
R33
R24
C49
R30
2
C54
C54
C25
C26
1
2
C26
C35
1
C34
1
2
C35
1
2
C34
7
BMP1
2
1
C24
1
2
C51
4mA
1
2
R29
R35
Q4
Q4
R30
1
2
R25
1
2
R33
1
2
R28
1R22
R38
1
2
R36
1
2
R27
SW2
SW2
1
2
R26
R28
R27
R26
R29
GND
R32
R34 R32
D9
J8 J8
TP9
J5 J5
R14
1
2
R34
FIELD
C51
LOOP
R37
C50
U9
MASTER
C39
U8
1
2
C50
U9
LOOP
U8
R25
1
J9
1
2
C39
1
2
C49
4mA
C48
4mA
C48
R36
R38 2
1 R32
C53
TP5
RETURN
C25
L3 2
1
2
C57
C56
1
LOOP
C55
R4
R22
R7
R20
1
2
C46
C45
L3
L2 2
C1
1
2
C2
C3
1
2
C17
1
2
C18
1
2
C19
1
2
C20
1
2
C15
C15
C20
C19
C18
C17
1
R6
C59
R6
C55
L2
C59
Y1
1
2
C24
L4 2
C10
1 2
Y1
1
2
C23
C43
C9
R5
R5
R22
R31
MUST BE GALVANICALLY
POWER
JP12
JP12
1
2
R23
R31
C42
33
C9 C10
POWER
J2
C53
R16
C42
C41
34
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
1
2
C14
ALL ON 20mA
C21
35
1
2
C13
C2
38
37
36
1
2
C27
U1
C14
C13
1
2
R16
39
16
L1
L4
2
C27
C23
7
14
C28
3
44
43
C11
J3
J3
1
2
C29
47
46
45
4
5
1
2
C30
3
15
L1
48
U3
2
13
C11
BMP4
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
1
U4
12
16
C30
F1
F1
11
17
R11
L5
10
18
R12 R11
L5
19
R12
D1
20
15
14
EXT
LOOP
D7
13
FSK IN F
R LOAD
12
C43
C33 2
11
C33
10
LOOP
C31
GND
C46
D5
24V
TP4
U7
U7
JP13
J2
1
C22
R7
U2
Y3
21
D5
D6
READY
ACTIVE
R13
R1
C45 DS8500
Y3
R13
1
TP7
FIELD
DEVICE
D6
R10
1 R1
2
JP11
T1
GND
U2
J4
JP10
C21
T1
TP8
JP14
JP14
ISOLATED
1
2
C31
Q2
R9
R15
1
2
R15
1
2
C22
U6
U6
R8
Q2
C32
JP9
TXD F
2
TP1
1R18
2
1
2
C32
R9
1
2
R19
1R82
R18
JP8
RAW FSK F
3
1
2
C36
1
2
C37
JP6
JP7
R17
OCD F
JP1
1
FSK IN M
Q1
Q1
R17
C36
C37
R19
READY
15
14
13
12
11
ACTIVE
RXD F
16
10
D4
D3
17
18
21
D3
RTS F
C5
19
RAW FSK M
C5
20
C29
TP2
D4
VBUS
TP3
6
U5
U5
H3
POWER
Y2
Y2
1
2
R10
MASTER
2
GND
RTS M
+3V3
C16
C28 DS8500
BMP3
1
2
C16
GND
1C12
2
DS8500 EV KIT
TP6
C12
JP5
BMP3
TXD M
JP4
D2
OCD M
D2
JP3
RXD M
JP2
JP2
10
J1
J1
MICRO USB/POWER
PCB-00050-2-0 [REV 2]
H4
Q3
BMP1
2
D7
Q3
R14
C
SN:
DS8500
EV
KIT
PASTE TEMPLATE
SOLDER
SILKSCREEN
ASSEMBLY
DRILL
LAYER
MASK
1MASK
4
-DRAWING
COMPONENT
SOLDER
BOTTOM
TOP
BOTTOM
TOP
BOTTOM
TOP
SIDE
SIDE
(BOTTOM)
(TOP)
02-19-2015
BMP2
FIELD/MASTER
PCB-00050-2-0
PCA-
D8
D8
MASTER/FIELD LOOP
J7
BMP2
D9
2
J6
H1
H2
3.50
NOTES:
SILKSCREEN TOP
PREPREG 0.0039"
6. OVERALL BOARD THICKNESS TO BE .062 +/- 10% AND APPLIES AFTER ALL
LAYER 1 TOP
CORE 0.047"
LAYER 3 PWR PLANE
8. BOARD MUST BE ELECTRICALLY TESTED USING THE SUPPLIED IPC-D -356 NETLIST.
9. PLATE ALL EXPOSED AREAS WITH ELECTROLESS IMMERSION GOLD, NICKEL 100 MICROINCHES THK. GOLD 2-6
PREPREG 0.0039"
LAYER 4 BOTTOM
PROCESS NOTES:
CLEARED BY SOLDERMASK PER ARTWORK. FABRICATION VENDOR IS ALLOWED TO ADJUST SOLDERMASK FEATURES
SILKSCREEN BOTTOM
AS NEEDED AS LONG AS SOLDERMASK DAMS ARE MAINTAINED BETWEEN ALL SMD PADS.
4.50
BMP4
U3
42
41
40
C1
C
C3
R20
R4
C7
1C72
1
2
C41
R3
3
1
C57
4
C56 2
R24
C38
R21
C47
C47
R21
1
2
C40
C38
1
2
C44
C40
R23
C44
C52
1
2
C52
7
8
R37
R35
4mA
R2
R33
R24
C49
R30
2
C54
C54
C25
C26
1
2
C26
C35
1
C34
1
2
C35
1
2
C34
7
BMP1
2
1
C24
1
2
C51
4mA
1
2
R29
R35
Q4
Q4
R30
1
2
R25
1
2
R33
1
2
R28
1R22
R38
1
2
R36
1
2
R27
SW2
SW2
1
2
R26
R28
R27
R26
R29
GND
R32
R34 R32
D9
J8 J8
TP9
J5 J5
R14
1
2
R34
FIELD
C51
LOOP
R37
C50
U9
MASTER
C39
U8
1
2
C50
U9
LOOP
U8
R25
1
J9
1
2
C39
1
2
C49
4mA
C48
4mA
C48
R36
R38 2
1 R32
C53
TP5
RETURN
C25
L3 2
1
2
C57
C56
1
LOOP
C55
R4
R22
R7
R20
1
2
C46
C45
L3
L2 2
C1
1
2
C2
C3
1
2
C17
1
2
C18
1
2
C19
1
2
C20
1
2
C15
C15
C20
C19
C18
C17
1
R6
C59
R6
C55
L2
C59
Y1
1
2
C24
L4 2
C10
1 2
Y1
1
2
C23
C43
C9
R5
R5
R22
R31
MUST BE GALVANICALLY
POWER
JP12
JP12
1
2
R23
R31
C42
33
C9 C10
POWER
J2
C53
R16
C42
C41
34
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
1
2
C14
ALL ON 20mA
C21
35
1
2
C13
C2
38
37
36
1
2
C27
U1
C14
C13
1
2
R16
39
16
L1
L4
2
C27
C23
7
14
C28
3
44
43
C11
J3
J3
1
2
C29
47
46
45
4
5
1
2
C30
3
15
L1
48
U3
2
13
C11
BMP4
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
1
U4
12
16
C30
F1
F1
11
17
R11
L5
10
18
R12 R11
L5
19
R12
D1
20
15
14
EXT
LOOP
D7
13
FSK IN F
R LOAD
12
C43
C33 2
11
C33
10
LOOP
C31
GND
C46
D5
24V
TP4
U7
U7
JP13
J2
1
C22
R7
U2
Y3
21
D5
D6
READY
ACTIVE
R13
R1
C45 DS8500
Y3
R13
1
TP7
FIELD
DEVICE
D6
R10
1 R1
2
JP11
T1
GND
U2
J4
JP10
C21
T1
TP8
JP14
JP14
ISOLATED
1
2
C31
Q2
R9
R15
1
2
R15
1
2
C22
U6
U6
R8
Q2
C32
JP9
TXD F
2
TP1
1R18
2
1
2
C32
R9
1
2
R19
1R82
R18
JP8
RAW FSK F
3
1
2
C36
1
2
C37
JP6
JP7
R17
OCD F
JP1
1
FSK IN M
Q1
Q1
R17
C36
C37
R19
READY
15
14
13
12
11
ACTIVE
RXD F
16
10
D4
D3
17
18
21
D3
RTS F
C5
19
RAW FSK M
C5
20
C29
TP2
D4
VBUS
TP3
6
U5
U5
H3
POWER
Y2
Y2
1
2
R10
MASTER
2
GND
RTS M
+3V3
C16
C28 DS8500
BMP3
1
2
C16
GND
1C12
2
DS8500 EV KIT
TP6
C12
JP5
BMP3
TXD M
JP4
D2
OCD M
D2
JP3
RXD M
JP2
JP2
10
J1
J1
MICRO USB/POWER
PCB-00050-2-0 [REV 2]
H4
Q3
BMP1
2
D7
Q3
R14
C
SN:
DS8500
EV
KIT
PASTE TEMPLATE
SOLDER
SILKSCREEN
ASSEMBLY
DRILL
LAYER
MASK
1MASK
4
-DRAWING
COMPONENT
SOLDER
BOTTOM
TOP
BOTTOM
TOP
BOTTOM
TOP
SIDE
SIDE
(BOTTOM)
(TOP)
02-19-2015
BMP2
FIELD/MASTER
PCB-00050-2-0
PCA-
D8
D8
MASTER/FIELD LOOP
J7
BMP2
D9
2
J6
H1
H2
3.50
PCB-00050-2-0 [REV 2]
H4
H3
D2
J1
C12
JP8
JP2
JP3
JP9
C16
TP3
TP2
TP1
JP4
JP10
JP5
JP11
TP6
JP14
R6
R20
C28
D3
U7
C46 C45
Y3
D6
D4
C29
Y2
TP7
U5
D5
JP1
U2
Q1
JP12
JP6
R35
C33
J5
R14
D9
J8
R34
R32
C40
C38
R21
Q4
C49
C54
D7
TP9
R37
R33
J9
R24
J4
R16
C50
U9
C31
T1
C44
U8
R25
R15
TP8
C47
TP5
R22
C39
C48
R7
TP4
R23
C51
C23
C22
U6
C52
R31
SW2
R13
Q2
R12
R11
C32
R9
C21
R18
C27
C30
R19
R8
C53
R10
JP13
J2
C36
C37
R30
JP7
R17
Q3
J6
J7
D8
H1
H2
DS8500
EV
KIT
PCB-00050-2-0
LAYER 1 -DRAWING
ASSEMBLY
COMPONENT
TOP SIDE
02-19-2015
(TOP)
NOTES:
SILKSCREEN TOP
PREPREG 0.0039"
6. OVERALL BOARD THICKNESS TO BE .062 +/- 10% AND APPLIES AFTER ALL
LAYER 1 TOP
CORE 0.047"
LAYER 3 PWR PLANE
8. BOARD MUST BE ELECTRICALLY TESTED USING THE SUPPLIED IPC-D -356 NETLIST.
9. PLATE ALL EXPOSED AREAS WITH ELECTROLESS IMMERSION GOLD, NICKEL 100 MICROINCHES THK. GOLD 2-6
PREPREG 0.0039"
LAYER 4 BOTTOM
PROCESS NOTES:
CLEARED BY SOLDERMASK PER ARTWORK. FABRICATION VENDOR IS ALLOWED TO ADJUST SOLDERMASK FEATURES
SILKSCREEN BOTTOM
AS NEEDED AS LONG AS SOLDERMASK DAMS ARE MAINTAINED BETWEEN ALL SMD PADS.
4.50
BMP3
9
D2
H3
POWER
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
F1
48
U3
1
2
U4
L5
47
44
43
RXD F
JP8
OCD F
JP9
TXD F
JP10
JP11
42
41
40
10
1
2
C2
1
2
C17
C9
2
2
C10
1 2
Y1
L4 2
1
2
C18
U1
1
2
C19
1
2
C14
1
2
C20
C3
33
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
1
2
C13
1
2
C15
35
34
16
L1
36
14
15
37
13
38
12
2
TP1
39
11
TP2
RTS M
C11
J3
46
45
4
5
VBUS
TP3
6
JP5
GND
TXD M
1
2
C16
JP4
+3V3
DS8500 EV KIT
OCD M
JP3
1C12
2
RXD M
JP2
D1
C1
10
1 R1
2
J1
BMP4
MICRO USB/POWER
PCB-00050-2-0 [REV 2]
H4
RTS F
2
C5
R4
1C72
1
1
2
C57
C56 2
4mA
4mA
4mA
4mA
R38 2
1
2
C41
1
2
C40
1R22
1
5
C53
R22
3.50
C25
1
2
C26
C47
7
8
1
2
C51
R30
1
2
C49
3
6
4
5
R37
R35
1
2
R16
R24
1
2
R33
R32
Q4
C54
D9
J8
1
2
R34
J5
R14
GND
2
FIELD
LOOP
D7
TP9
MASTER
LOOP
R LOAD
R21
C48
1
2
R25
1
2
C50
1
2
R36
1
2
R29
1
2
R28
3
J9
J4
C33 2
U8
1
2
C31
U9
1
2
C34
1
2
R27
SW2
1
2
R26
1
2
C35
R7
TP5
RETURN
LOOP
MUST BE GALVANICALLY
POWER
LOOP
TP4
1
2
C39
1
C38
1 R32
R31
C21
JP12
1
2
R23
POWER
1
2
C44
1
2
C52
ALL ON 20mA
L3 2
C55
R6
R20
1
2
C46
C45
1
2
C24
L2 2
C28
C59
1
R5
1
2
C23
1
2
C27
1
2
C29
16
1
2
C30
17
EXT
LOOP
R11
18
13
12
11
R12
19
10
ISOLATED
R13
15
20
14
FSK IN F
24V
1
2
R15
T1
C43
U2
JP13
J2
1
1
2
C22
U6
TP8
GND
21
Q2
Y3
1
2
C32
1R18
2
R9
D5
1
2
R19
1
2
R10
1R82
D6
RAW FSK F
3
1
2
C36
1
2
C37
GND
JP6
JP7
JP1
U7
FSK IN M
READY
ACTIVE
15
14
13
12
11
READY
16
10
ACTIVE
17
D4
D3
18
21
19
Q1
R17
DS8500
5
20
RAW FSK M
TP7
FIELD
DEVICE
Y2
JP14
U5
MASTER
DS8500
GND
C42
TP6
BMP1
2
PCA-
FIELD/MASTER
SN:
DS8500
EV
KIT
PCB-00050-2-0
PASTE TEMPLATE
SOLDER
SILKSCREEN
ASSEMBLY
DRILL
LAYER
MASK
1MASK
4
-DRAWING
COMPONENT
SOLDER
BOTTOM
TOP
BOTTOM
TOP
BOTTOM
TOP
SIDE
SIDE
(BOTTOM)
(TOP)
02-19-2015
BMP2
MASTER/FIELD LOOP
D8
J7
H1
J6
Q3
1
H2
DS8500
EV
KIT
PCB-00050-2-0
LAYER
GND
02-19-2015
PLANE
DS8500
EV
KIT
PCB-00050-2-0
LAYER
PWR
02-19-2015
PLANE
ASSEMBLY
LAYER
4 -DRAWING
SOLDER BOTTOM
SIDE (BOTTOM)
PCB-00050-2-0
DS8500
EV
02-19-2015
KIT
BMP2
BMP1
R36
R29
R28
R27
R26
C34
C35
R38
C56
R4
C43
R2
C26
C7
C57
R5
R3
C41
C24
C55
C42
L2
C25
L3
C59
C5
L4
Y1
C17
C18
C19
C20
C15
U1
C3
C2
L1
C9
C10
C14
C13
C11
L5
C1
D1
U4
J3
U3
F1
R1
BMP3
BMP4
MICRO USB/POWER
H4
D2
H3
POWER
J1
C12
RXD F
JP8
OCD F
JP9
TXD M
TXD F
JP10
RTS M
RTS F
JP11
VBUS
TP1
JP14
FSK IN F
JP12
ALL OFF 4mA
ALL ON 20mA
R31
R7
24V
TP4
TP5
MUST BE GALVANICALLY
ISOLATED
R15
LOOP
POWER
LOOP
RETURN
U8
LOOP
MASTER
J5
LOOP
FIELD
R14
D9
J8
GND
R34
R32
Q4
C54
D7
TP9
R37
T1
R LOAD
R35
GND
R16
C49
J9
R24
J4
R22
C50
U9
C31
TP8
R23
C39
C48
POWER
C40
JP13
EXT
LOOP
C38
J2
R9
C22
U6
GND
RAW FSK F
R33
R13
Q2
R12
R11
C32
Y3
U2
4mA
R18
C23
R19
R8
JP1
C21
R10
C27
C30
C36
C37
D5
R21
JP6
JP7
R17
D6
READY
C44
FSK IN M
RAW FSK M
Q1
ACTIVE
C47
READY
U7
C52
ACTIVE
R6
D4
D3
DS8500
SW2
C28
C29
Y2
TP7
FIELD
DEVICE
U5
R20
MASTER
DS8500
GND
C51
TP6
TP2
C46 C45
TP3
R30
JP5
GND
C16
4mA
JP4
DS8500 EV KIT
R25
OCD M
4mA
JP3
+3V3
4mA
RXD M
C53
JP2
Q3
J6
H1
MASTER/FIELD LOOP
DS8500
EV
FIELD/MASTER
KIT
PCB-00050-2-0
ASSEMBLY
DRAWING
D8
J7
02-19-2015
TOP
H2
ASSEMBLY
DRAWING
BOTTOM
PCB-00050-2-0
DS8500
EV
02-19-2015
KIT
BMP2
PCA-
SN:
BMP1
R36
R29
R28
R27
R26
C34
C35
R38
C56
R4
C43
R2
C26
C7
C57
R5
R3
C41
C24
C55
C42
L2
C25
L3
C59
C5
L4
Y1
C17
C18
C19
C20
C15
U1
C3
C2
L1
C9
C10
C14
C13
C11
L5
C1
D1
U4
J3
U3
F1
R1
BMP3
BMP4
NOTES:
SILKSCREEN TOP
PREPREG 0.0039"
6. OVERALL BOARD THICKNESS TO BE .062 +/- 10% AND APPLIES AFTER ALL
LAYER 1 TOP
CORE 0.047"
LAYER 3 PWR PLANE
8. BOARD MUST BE ELECTRICALLY TESTED USING THE SUPPLIED IPC-D -356 NETLIST.
9. PLATE ALL EXPOSED AREAS WITH ELECTROLESS IMMERSION GOLD, NICKEL 100 MICROINCHES THK. GOLD 2-6
PREPREG 0.0039"
LAYER 4 BOTTOM
PROCESS NOTES:
CLEARED BY SOLDERMASK PER ARTWORK. FABRICATION VENDOR IS ALLOWED TO ADJUST SOLDERMASK FEATURES
SILKSCREEN BOTTOM
AS NEEDED AS LONG AS SOLDERMASK DAMS ARE MAINTAINED BETWEEN ALL SMD PADS.
4.50
3.50
0
0
DS8500
EV
PCB-00050-2-0
DRILL
TEMPLATE
KIT
02-19-2015
SIZE
TOLERANCE
PLATED
12.0
+3.0/-3.0
PLATED
QTY
12
12.0
+3.0/-3.0
PLATED
116
32.0
+3.0/-3.0
PLATED
10
38.0
+3.0/-3.0
PLATED
14
42.0
+3.0/-3.0
PLATED
38
45.0
+3.0/-3.0
PLATED
50.0
+3.0/-3.0
PLATED
65.0
+3.0/-3.0
PLATED
125.0
+3.0/-3.0
PLATED
40.0
+3.0/-3.0
NON-PLATED
35.0x28.0
+3.0/-3.0
PLATED
52.0x25.0
+3.0/-3.0
PLATED
DS8500
EV
PCB-00050-2-0
PASTE
MASK
KIT
02-19-2015
TOP
DS8500
EV
KIT
PCB-00050-2-0
PASTE
MASK
02-19-2015
BOTTOM
MICRO USB/POWER
H4
D2
H3
POWER
J1
C12
RXD F
JP8
OCD F
JP9
TXD M
TXD F
JP10
RTS M
RTS F
JP11
JP14
MASTER
C28 DS8500
U2
D3
FSK IN M
C30
R20
FSK IN F
RAW FSK F
JP12
JP13
EXT
LOOP
C21
POWER
J2
C22
4mA
R8
C53
C48
TP4
MUST BE GALVANICALLY
TP5
ISOLATED
R15
LOOP
POWER
LOOP
C39
C47
24V
R7
R22
R31
RETURN
SW2
R12 R11
C46
D5
U6
R13
U8
R25
C50
C51
C31
J4
T1
C33
TP9
LOOP
MASTER
LOOP
FIELD
R37
R33
R24
C49
R30
GND
U9
J9
R35
R16
Q2
JP1
R9
C27
C23
R10
R18
C32
TP8
JP6
JP7
R17
C36
C37
R19
READY
R23
C29
Q1
GND
ACTIVE
C38
READY
Y3
R21
ACTIVE
R6
Y2
TP7
C45 DS8500
U7
D6
D4
RAW FSK M
FIELD
DEVICE
U5
GND
C52
TP6
TP1
TP2
C40
JP5
TP3
C16
VBUS
C44
JP4
GND
+3V3
DS8500 EV KIT
4mA
OCD M
4mA
RXD M
4mA
JP2
JP3
GND
Q4
C54
R34 R32
J5
J8
Q3
D7
R14
D9
J6
H1
J7
MASTER/FIELD LOOP
DS8500
EV
PCB-00050-2-0
SILKSCREEN
D8
FIELD/MASTER
KIT
02-19-2015
TOP
H2
SILKSCREEN
BOTTOM
PCB-00050-2-0
02-19-2015
DS8500
EV
KIT
BMP2
PCA-
SN:
BMP1
R29
R36
R28
R27
R26
C34
C35
R38
C56
R4
C43
R2
C26
C57
C7
C41
R5
R3
C42
C24
C25
L3
C59
L2
C15
C20
C19
C18
C17
L4
U1
C5
C55
Y1
C3
C2
C9 C10
C14
C13
L1
C11
L5
J3
U4
D1
F1
R1
U3
C1
BMP3
BMP4
DS8500
EV
PCB-00050-2-0
SOLDER
MASK
KIT
02-19-2015
TOP
DS8500
EV
KIT
PCB-00050-2-0
SOLDER
MASK
02-19-2015
BOTTOM