Internal Use Only

North/Latin America http://aic.lgservice.com

Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com

LED LCD TV
SERVICE MANUAL
CHASSIS : LJ03D

MODEL : 32LE5500 32LE5500-SA

CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

/I
P OK MENU INPUT

P/NO : MFL63261812 (1004-REV00) Printed in Korea

 CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ................................................................................. 3

SPECIFICATION ....................................................................................... 6

ADJUSTMENT INSTRUCTION .............................................................. 12

EXPLODED VIEW .................................................................................. 20

SVC. SHEET ...............................................................................................

Copyright LG Electronics. Inc. All right reserved. -2- LGE Internal Use Only
Only for training and service purposes
 SAFETY PRECAUTIONS

IMPORTANT SAFETY NOTICE

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

General Guidance Leakage Current Hot Check (See below Figure)

An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1 W), keep the resistor 10 mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5 mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit

Before returning the receiver to the customer, AC Volt-meter

always perform an AC leakage current check on the exposed

metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical Good Earth Ground
shock. such as WATER PIPE,
To Instrument’s CONDUIT etc.
0.15 uF
Leakage Current Cold Check(Antenna Cold Check) exposed
With the instrument AC plug removed from AC source, connect an METALLIC PARTS
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC 1.5 Kohm/10W
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc. When 25A is impressed between Earth and 2nd Ground
If the exposed metallic part has a return path to the chassis, the for 1 second, Resistance must be less than 0.1 Ω
measured resistance should be between 1 MΩ and 5.2 MΩ.
*Base on Adjustment standard
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.

Copyright LG Electronics. Inc. All right reserved. -3- LGE Internal Use Only
Only for training and service purposes
 SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10 % (by volume) Acetone and 90 %
(by volume) isopropyl alcohol (90 % - 99 % strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
Copyright LG Electronics. Inc. All right reserved. -4-
Only for training and service purposes
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 °F to 600 °F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25 cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 °F to 600 °F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 °F to 600 °F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
LGE Internal Use Only
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor

Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.

Copyright LG Electronics. Inc. All right reserved. -5- LGE Internal Use Only
Only for training and service purposes
 SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.

1. Application range
This specification is applied to the LCD TV used LJ03B/D/E/F chassis.

2. Requirement for Test

Each part is tested as below without special appointment.

1) Temperature
: 25 ºC ± 5 ºC (77 ºF ± 9 ºF), CST : 40 ºC ± 5 ºC
2) Relative Humidity : 65 % ± 10 %
3) Power Voltage
: Standard input voltage (AC 100-240 V~ 50 / 60 Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed each drawing and specification by part number in accordance with
BOM.
5) The receiver must be operated for about 20 minutes prior to the adjustment.

3. Test method
1) Performance: LGE TV test method followed
2) Demanded other specification
- Safety: CE, IEC specification
- EMC:CE, IEC

Copyright LG Electronics. Inc. All right reserved. -6- LGE Internal Use Only
Only for training and service purposes
4. General Specification(TV)
No Item Specification Remark
1 Receivable System 1) SBTVD / NTSC / PAL-M / PAL-N
2 Available Channel VHF : 02 ~ 13
UHF : 14 ~ 69
DTV : 07 ~ 69
CATV : 01 ~ 135
3 Input Voltage 1) AC 100 ~ 240V 50/60Hz
4 Market Central and South AMERICA
5 Screen Size 32 inch Wide (1920 x 1080) 32LE7500,32LD650,32LE5500
42 inch Wide (1920 x 1080) 42LE7500,42LD650,42LE5500,42LE8500
47 inch Wide (1920 x 1080) 47LE7500,47LD650,47LE5500,
55 inch Wide (1920 x 1080) 55LE7500,55LD650
60 inch Wide (1920 x 1080) 60LE5500
6 Aspect Ratio 16:9
7 Tuning System FS
8 LCD Module LC320EUH-SCA4 (Vitiaz 5) 32LE7500-SA
LC420EUH-SCA2 (Vitiaz 5) 42LE7500-SA
LC470EUH-SCA2 (Vitiaz 5) 47LE7500-SA
LC550EUB-SCA2 (Vitiaz 5) 55LE7500-SA
LC320WUH-SCA1(Vitiaz 5) 32LD650-SA
LC420WUH-SCA1(Vitiaz 5) 42LD650-SA
LC470WUH-SCA1(Vitiaz 5) 47LD650-SA
LC550WUB-SCA1(Vitiaz 5) 55LD650-SA
LC320EUH-SCA1(Vitiaz 5) 32LE5500-SA
LC420EUH-SCA1(Vitiaz 5) 42LE5500-SA
LC470EUH-SCA1(Vitiaz 5) 47LE5500-SA
Sharp 60 FHD T240 IOP LED 60LE5500-SA
LC420MUK-SCA1 (Vitiaz 5) 42LE8500-SA
9 Operating Environment Temp : 0 ~ 40 deg
Humidity : ~ 80 %
10 Storage Environment Temp : -20 ~ 60 deg
Humidity : -85 %

Copyright LG Electronics. Inc. All right reserved. -7- LGE Internal Use Only
Only for training and service purposes
5. Chrominance & Luminance Specification
1) LJ03D/E (LE5500,LE7500,42LE8500)
No Item Min Typ Max Unit Remark
1. Max Luminance Module 360 450 cd/m 2
32/42/47/55LE7(5)500
(Center 1-point / Full White Pattern) 450 500 42LE8500
Set 300 450 cd/m2 32/42/47/55LE7(5)500
400 500 42LE8500
2. Luminance uniformity 77 % Full white
3. Color coordinate RED X Typ. 0.651 Typ. 32LE7(5)500
-0.03 0.647 +0.03 42/55LE7(5)500
0.645 47LE7(5)500
(TBD) (42LE8500)
Y 0.332
0.332
0.333
(TBD)
GREEN X 0.308
0.309
0.310
(TBD)
Y 0.597
0.601
0.593
(TBD)
BLUE X 0.149
0.149
0.152
(TBD)
Y 0.059
0.059
0.057
(TBD)
WHITE X 0.279
(0.280)
Y 0.292
(0.290)
4. Color coordinate uniformity N/A
5. Contrast ratio 900:1 1300:1 32LE7(5)500 NORMAL
1000:1 1400:1 42/47/55, 42LE85
3,000,000:1 5,000,000:1 LE7(5)500 DCR
5,000,000:1 7,000,000:1 42LE8500
6. Color Temperature Cool 0.267 0.269 0.271 <Test Condition>
0.271 0.273 0.275 85% Full white pattern
Standard 0.283 0.285 0.287 ** The W/B Tolerance is
0.291 0.293 0.295 ±0.015 Adjustment
Warm 0.311 0.313 0.315
0.327 0.329 0.331
7. Color Distortion, DG 10.0 %
8. Color Distortion, DP 10.0 deg
9. Color S/N, AM/FM 43.0 dB
10. Color Killer Sensitivity -80 dBm

Copyright LG Electronics. Inc. All right reserved. -8- LGE Internal Use Only
Only for training and service purposes
 2) LJ03B (32/42/47/55LD650-SA)
No Item Min Typ Max Unit Remark
1. Max Luminance Module 400 500 cd/m2 32/42/47/55LD650
(Center 1-point / Full White Pattern)
Set 400 500 cd/m2 32/42/47/55LD650

2. Luminance uniformity 77 % Full white

3. Color coordinate RED X Typ. 0.642 Typ. 32LD650
-0.03 0.636 +0.03 42LD650
0.639 47LD650
(TBD) 55LD650
Y 0.334
0.335
0.334
(TBD)
GREEN X 0.292
0.291
0.290
(TBD)
Y 0.607
0.603
0.606
(TBD)
BLUE X 0.146
0.146
0.146
(TBD)
Y 0.056
0.061
0.058
(TBD)
WHITE X 0.279

Y 0.292

4. Color coordinate uniformity N/A

5. Contrast ratio 1000:1 1400:1 32LD650 NORMAL
1100:1 1500:1 42/55LD650
1200:1 1500:1 47LD650 DCR
50,000:1 70,000:1
6. Color Temperature Cool 0.267 0.269 0.271 <Test Condition>
0.271 0.273 0.275 85% Full white pattern
Standard 0.283 0.285 0.287 ** The W/B Tolerance is
0.291 0.293 0.295 ±0.015 Adjustment
Warm 0.311 0.313 0.315
0.327 0.329 0.331
7. Color Distortion, DG 10.0 %
8. Color Distortion, DP 10.0 deg
9. Color S/N, AM/FM 43.0 dB
10. Color Killer Sensitivity -80 dBm

Copyright LG Electronics. Inc. All right reserved. -9- LGE Internal Use Only
Only for training and service purposes
6. Component Video Input (Y, CB/PB, CR/PR)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
1. 720*480 15.73 60 13.5135 SDTV ,DVD 480I
2. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I
3. 720*480 31.50 60 27.027 SDTV 480P
4. 720*480 31.47 59.94 27.00 SDTV 480P
5. 720*576 15.625 50* 13.5 SDTV 576I
6. 720*576 31.25 50* 13.5 SDTV 576P
7. 1280*720 37.5 50* 74.25 HDTV 720P
8. 1280*720 45.00 60.00 74.25 HDTV 720P
9. 1280*720 44.96 59.94 74.176 HDTV 720P
10. 1929*1080 28.125 50* 74.25 HDTV 1080I
11. 1920*1080 33.75 60.00 74.25 HDTV 1080I
12. 1920*1080 33.72 59.94 74.176 HDTV 1080I
13. 1920*1080 56.25 50* 148.5 HDTV 1080P
14. 1920*1080 67.50 60 148.50 HDTV 1080P
15. 1920*1080 67.432 59.94 148.352 HDTV 1080P
16. 1920*1080 27.00 24.00 74.25 HDTV 1080P
17. 1920*1080 26.97 23.976 74.176 HDTV 1080P
18. 1920*1080 33.75 30.00 74.25 HDTV 1080P
19. 1920*1080 33.71 29.97 74.176 HDTV 1080P

8. RGB Input (PC)

No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
PC DDC
1. 640*350 31.468 70.09 25.17 EGA X
2. 720*400 31.469 70.08 28.32 DOS O
3. 640*480 31.469 59.94 25.17 VESA(VGA) O
4. 800*600 37.879 60.31 40.00 VESA(SVGA) O
5. 1024*768 48.363 60.00 65.00 VESA(XGA) O
6. 1280*768 47.776 59.87 79.50 CVT(WXGA) O
7. 1360*768 47.712 60.015 85.50 VESA(WXGA) O
8. 1280*1024 63.981 60.020 108.00 VESA(SXGA) O
9. 1600*1200 75.00 60.00 162 VESA(UXGA) O
10. 1920*1080 67.50 60 148.5 HDTV 1080P O

• RGB PC Monitor Range Limits

Min Vertical Freq - 56 Hz
Max Vertical Freq - 62 Hz
Min Horiz. Freq - 30 kHz
Max Horiz. Freq - 80 kHz
Pixel Clock - 170 MHz

Copyright LG Electronics. Inc. All right reserved. - 10 - LGE Internal Use Only
Only for training and service purposes
9. HDMI input (PC/DTV)
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock Proposed
PC DDC
1. 640*350 31.468 70.09 25.17 EGA X
2. 720*400 31.469 70.08 28.32 DOS O
3. 640*480 31.469 59.94 25.17 VESA(VGA) O
4. 800*600 37.879 60.31 40.00 VESA(SVGA) O
5. 1024*768 48.363 60.00 65.00 VESA(XGA) O
6. 1280*768 47.776 59.870 79.50 CVT(WXGA) X
7. 1360*768 47.712 60.015 85.50 VESA(WXGA) X
8. 1280*1024 63.981 60.020 108.00 VESA(SXGA) O
9. 1600*1200 75.00 60.00 162 VESA(UXGA) O
10. 1920*1080 67.5 60 148.5 HDTV 1080P O
DTV
1. 720*480 31.50 60 27.027 SDTV 480P
2. 720*480 31.47 59.94 27.00 SDTV 480P
3. 720*576 31.25 50* 13.5 SDTV 576P
4. 1280*720 37.5 50* 74.25 HDTV 720P
5. 1280*720 45.00 60.00 74.25 HDTV 720P
6. 1280*720 44.96 59.94 74.176 HDTV 720P
7. 1929*1080 28.125 50* 74.25 HDTV 1080I
8. 1920*1080 33.75 60.00 74.25 HDTV 1080I
9. 1920*1080 33.72 59.94 74.176 HDTV 1080I
10. 1920*1080 56.25 50* 148.5 HDTV 1080P
11. 1920*1080 67.50 60 148.50 HDTV 1080P
12. 1920*1080 67.432 59.94 148.352 HDTV 1080P
13. 1920*1080 27.00 24.00 74.25 HDTV 1080P
14. 1920*1080 26.97 23.976 74.176 HDTV 1080P
15. 1920*1080 33.75 30.00 74.25 HDTV 1080P
16. 1920*1080 33.71 29.97 74.176 HDTV 1080P

• HDMI Monitor Range Limits

Min Vertical Freq - 56 Hz Max Vertical Freq - 62 Hz
Min Horiz. Freq - 30 kHz Max Horiz. Freq - 80 kHz
Pixel Clock - 170 MHz

Copyright LG Electronics. Inc. All right reserved. - 11 - LGE Internal Use Only
Only for training and service purposes
 ADJUSTMENT INSTRUCTION
1. Application Range 4. PCB Assembly Adjustment
This specification sheet is applied all of the LJ03D/E LCD TV 4.1. MAC Address
models, which produced in manufacture department or similar
LG TV factory
4.1.1. Equipment & Condition
• Play file: Serial.exe
• MAC Address edit
• Input Start / End MAC address
2. Notice
(1) Because this is not a hot chassis, it is not necessary to use 4.1.2 Download method
an isolation transformer. However, the use of isolation 4.1.2.1 Communication Prot connection
transformer will help protect test instrument.
(2) Adjustment must be done in the correct order.
(3) The adjustment must be performed in the circumstance of PCBA PC(RS-232C)
25 ºC ± 5 ºC of temperature and 65 % ± 10 % of relative
humidity if there is no specific designation.
(4) The input voltage of the receiver must keep AC 100-220
V~ 50 / 60Hz. RS-232C Po rt
(5) Before adjustment, execute Heat-Run for 5 minutes.
Connect: PCBA Jig-> RS-232C Port== PC-> RS-232C Port
A After Receive 100% Full white pattern (06CH) then
process Heat-run 4.1.2.2 MAC Address Download
(or “8. Test pattern” condition of Ez-Adjust status) • Com 1,2,3,4 and 115200(Baudrate)
A How to make set white pattern • Port connection button click(1)
1) Press Power ON button of Service Remocon
2) Press ADJ button of Service remocon. Select “8. Test
pattern” and, after select “White” using navigation
button, and then you can see 100% Full White pattern.

* In this status you can maintain Heat-Run useless any

pattern generator
* Notice: if you maintain one picture over 20 minutes
(Especially sharp distinction black with white
pattern – 13Ch, or Cross hatch pattern – 09Ch)
then it can appear image stick near black level.

3. Adjustment Items
3.1. PCB Assembly Adjustment • Load button click(2) for MAC Address write.
A MAC Address Download • Start MAC Address write button(3)
• Check the OK Or NG
A Adjust 480i Comp1
A Adjust 1080p Comp1/RGB 4.1.3 Equipment & Condition
• If it is necessary, it can adjustment at Manufacture Line • Each other connection to LAN Port of IP Hub and Jig
• You can see set adjustment status at “1. ADJUST
CHECK” of the “In-start menu”
A EDID (The Extended Display Identification Data)/DDC

(Display Data Channel) download

3.2. Set Assembly Adjustment

A Color Temperature (White Balance) Adjustment
A Using RS-232C
A PING Test
A Selection Factory output option

Copyright LG Electronics. Inc. All right reserved. - 12 - LGE Internal Use Only
Only for training and service purposes
4.1.4 LAN inspection solution
• LAN Port connection with PCB
• Network setting at MENU Mode of TV
• Setting automatic IP
• Setting state confirmation
- If automatic setting is finished, you confirm IP and MAC
Address.
4.1.5 LAN Port Inspection (PING Test)
4.1.5.1 Equipment setting
1) Play the LAN Port Test PROGRAM.
2) Input IP set up for an inspection to Test Program.
*IP Number : 12.12.2.2
4.1.6 LAN Port Inspection (PING Test)
1) Play the LAN Port Test Program.
2) connect each other LAN Port Jack.
3) Play Test (F9) button and confirm OK Message.
4) remove LAN CABLE
Copyright LG Electronics. Inc. All right reserved.
Only for training and service purposes
4.2. Using RS-232C
Adjust 3 items at 3.1 PCB assembly adjustments “adjustment
sequence” one after the order.
A Adjustment protocol
See ADC Adjustment RS232C Protocol_Ver1.0
A Necessary items before Adjustment items
• Pattern Generator : (MSPG-925FA)
•Adjust 480i Comp1 (MSPG-925FA:model :209 , pattern
:65) – Comp1 Mode
• Adjust 1080p Comp1 (MSPG-925FA:model :225 ,
pattern :65) – Comp1 Mode
• Adjust RGB (MSPG-925FA:model :225 , Pattern :65) –
RGB-PC Mode
* If you want more information then see the below
Adjustment method (Factory Adjustment)
A Adjustment sequence
• aa 00 00: Enter the ADC Adjustment mode.
• xb 00 40: Change the mode to Component1 (No actions)
• ad 00 10: Adjust 480i Comp
• ad 00 10: Adjust 1080p Comp
• xb 00 60: Change to RGB-PC mode(No action)
• ad 00 10: Adjust 1080p RGB
• xb 00 90: Endo of Adjustmennt
- 13 - LGE Internal Use Only
5 Factory Adjustment 5.2 EDID (The Extended Display
5.1 Manual Adjust Component 480i/1080p Identification Data) / DDC (Display Data
RGB 1080p Channel) Download.

A Summary : Adjustment component 480i/1080i and RGB A Summary

1080p is Gain and Black level setting at Analog to Digital
converter, and compensate the RGB deviation
A Using instrument
• Adjustment remocon, 801GF(802B, 802F, 802R) or
MSPG925FA pattern generator (It can output 480i/1080i
horizontal 100% color bar pattern signal, and its output
level must setting 0.7V±0.1V p-p correctly)
• It is established in VESA, for communication between PC
and Monitor without order from user for building user
condition. It helps to make easily use realize “Plug and
Play” function.
• For EDID data write, we use DDC2B protocol.
A Auto Download
• After enter Service Mode by pushing “ADJ” key,
• Enter EDID D/L mode.
• Enter “START” by pushing “OK” key.

=> Caution : - Never connect HDMI & D-sub Cable when

the user downloading .
- Use the proper cables below for EDID
Writing.

<Pic.4 Adjustment pattern : 480i / 1080p 60Hz Pattern >

A You must make it sure its resolution and pattern cause

every instrument can have different setting

A Adjustment method 480i Comp1, Adjust 1080p Comp1/RGB

(Factory adjustment)
• ADC 480i Component1 adjustment
- Check connection of Component1
- MSPG-925FA -> Model: 209, Pattern 65
• Set Component 480i mode and 100% Horizontal Color
Bar Pattern(HozTV31Bar), then set TV set to
Component1 mode and its screen to “NORMAL”
• ADC 1080p Component1 / RGB adjustment
- Check connection both of Component1 and RGB
- MSPG-925FA -> Model: 225, Pattern 65
• Set Component 1080p mode and 100% Horizontal Color
Bar Pattern(HozTV31Bar), then set TV set to
Component1 mode and its screen to “NORMAL” § Edid data and Model option download (RS232)
• After get each the signal, wait more a second and enter
the “IN-START” with press IN-START key of Service
remocon. After then select “7. External ADC” with
navigator button and press “Enter”.
• After Then Press key of Service remocon “Right
Arrow(VOL+)”
• You can see “ADC Component1 Success”
• Component1 1080p, RGB 1080p Adjust is same method.
• Component 1080p Adjustment in Component1 input
mode
• RGB 1080p adjustment in RGB input mode
• If you success RGB 1080p Adjust. You can see “ADC
RGB-DTV Success”

Copyright LG Electronics. Inc. All right reserved. - 14 - LGE Internal Use Only
Only for training and service purposes
5.2.1 Manual Download - HDMI-3 EDID table (0x04, 0x3A)
A Write HDMI EDID data
• Using instruments
- Jig. (PC Serial to D-Sub connection) for PC, DDC
adjustment.
- S/W for DDC recording (EDID data write and read)
- D-sub jack
- Additional HDMI cable connection Jig.

• Preparing and setting.

- Set instruments and Jig. Like pic.5), then turn on PC and
Jig.
- Operate DDC write S/W (EDID write & read)
- It will operate in the DOS mode.

- HDMI-4 EDID table (0x04, 0x2A)

VSC
PC
B/D

Pic.3) For write EDID data, setting Jig and another instruments.

• EDID data for LJ03B/D/E/R Chassis (Model name = LG TV)

- HDMI-1 EDID table (0x04, 0x5A)

- Analog (RGB) EDID table (0x1D)

- HDMI-2 EDID table (0x04, 0x4A)

See Working Guide if you want more information about EDID

communication.

Copyright LG Electronics. Inc. All right reserved. - 15 - LGE Internal Use Only
Only for training and service purposes
5.3 Adjustment Color Temperature (White A White Balance Adjustment
If you can’t adjust with inner pattern, then you can adjust it
balance) using HDMI pattern. You can select option at “Ez-Adjust
Menu – 7. White Balance” there items “NONE, INNER,
A Using Instruments HDMI”. It is normally setting at inner basically. If you can’t
• Color Analyzer: CA-210 (CH 9) adjust using inner pattern you can select HDMI item, and
- Using LCD color temperature, Color Analyzer (CA-210) you can adjust.
must use CH 9, which Matrix compensated (White, Red,
Green, Blue compensation) with CS-2100. See the In manual Adjust case, if you press ADJ button of service
Coordination bellowed one. remocon, and enter “Ez-Adjust Menu – 7. White Balance”,
• Auto-adjustment Equipment (It needs when Auto- then automatically inner pattern operates. (In case of
adjustment – It is availed communicate with RS-232C : “Inner” originally “Test-Pattern. On” will be selected in The
Baud rate: 115200) “Test-Pattern. On/Off”.
• Video Signal Generator MSPG-925F 720p, 216Gray
(Model: 217, Pattern 78) • Connect all cables and equipments like Pic.5)
• Set Baud Rate of RS-232C to 115200. It may set 115200
A Connection Diagram (Auto Adjustment) orignally.
• Using Inner Pattern • Connect RS-232C cable to set
• Connect HDMI cable to set

F u l l W h i t e P at t er n C A -100+

COL OR
A NA L Y ZER
T Y PE ; C A -100+

R S-232C

• Using HDMI input

A RS-232C Command (Commonly apply)

<Pic.5 Connection Diagram for Adjustment White balance>

• “wb 00 00”: Start Auto-adjustment of white balance.
• “wb 00 10”: Start Gain Adjustment (Inner pattern)
• “jb 00 c0” :
•…
• “wb 00 1f”: End of Adjustment
* If it needs, offset adjustment (wb 00 20-start, wb 00 2f-
end)
• “wb 00 ff”: End of white balance adjustment (inner pattern
disappear)

Copyright LG Electronics. Inc. All right reserved. - 16 - LGE Internal Use Only
Only for training and service purposes
O Notice) Adjustment Mapping information • Using CA-210 Equipment. (9 CH)
- Contrast value: 216 Gray

- White Balance adjustment coordination and color

temperature for Edge(IOP) LED (LJ03D/E)
• When Color temperature (White balance) Adjustment
(Automatically)
- Press “Power only key” of service remocon and operate
automatically adjustment.
- Set BaudRate to 115200.

• If it needs, then adjustment “Offset”.

A White Balance Adjustment (Manual adjustment)

• Test Equipment: CA-210
- Using LCD color temperature, Color Analyzer (CA-210)
must use CH 9, which Matrix compensated (White, Red,
Green, Blue compensation) with CS-2100. See the
Coordination bellowed one.
-White Balance adjustment table for Edge (IOP) LED
(LJ03D/E)
• Manual adjustment sequence is like bellowed one.
- Turn to “Ez-Adjust” mode with press ADJ button of
service remocon.
- Select “10.Test Pattern” with CH+/- button and press
enter. Then set will go on Heat-run mode. Over 30
minutes set let on Heat-run mode.
- Let CA-210 to zero calibration and must has gap more
10cm from center of LCD module when adjustment.
- Press “ADJ” button of service remocon and select
“7.White-Balance” in “Ez-Adjust” then press “ G ” button
of navigation key.
(When press “ G ” button then set will go to full white
mode)
- Adjust at three mode (Cool, Medium, Warm)
- If “cool” mode
Let B-Gain to 192 and R, G, B-Cut to 64 and then
control R, G gain adjustment High Light adjustment.
- If “Medium” and “Warm” mode
Let R-Gain to 192 and R, G, B-Cut to 64 and then
control G, B gain adjustment High Light adjustment.
- All of the three mode
Let R-Gain to 192 and R, G, B-Cut to 64 and then
control G, B gain adjustment High Light adjustment.
- With volume button (+/-) you can adjust.
- After all adjustment finished, with Enter (A key) turn to
Ez-Adjust mode. Then with ADJ button, exit from
adjustment mode

Attachment: White Balance adjustment coordination and

color temperature.

• Using CS-1000 Equipment.

- COOL : T=11000K, ∆uv=0.000, x=0.276 y=0.283
- MEDIUM : T=9300K, ∆uv=0.000, x=0.285 y=0.293
- WARM : T=6500K, ∆uv=0.000, x=0.313 y=0.329

Copyright LG Electronics. Inc. All right reserved. - 17 - LGE Internal Use Only
Only for training and service purposes
5.4 EYE-Q function check 6. GND and ESD Testing
6.1 Prepare GND and ESD Testing.
1) Turn on TV
A Check the connection between set and power cord
2) Press EYE key of Adj. R/C
3) Cover the Eye Q II sensor on the front of the using your
hand and wait for 6 seconds
4) Confirm that R/G/B value is lower than 10 of the “Raw Data 6.2 Operate GND and ESD auto-test.
(Sensor data, Back lignt )” . If after 6 seconds, R/G/B value A Fully connected (Between set and power cord) set enter the
is not lower than 10, replace Eye Q II sensor Auto-test sequence.
5) Remove your hand from the Eye Q II sensor and wait for 6 A Connect D-Jack AV jack test equipment.
seconds A Turn on Auto-controller(GWS103-4)
6) Confirm that “ok” pop up. A Start Auto GND test.
If change is not seen, replace Eye Q II sensor A If its result is NG, then notice with buzzer.
A If its result is OK, then automatically it turns to ESD Test.
A Operate ESD test
A If its result is NG, then notice with buzzer.
A If its result is OK, then process next steps. Notice it with
Good lamp and STOPER Down.Check Items.
A Test Voltage
• GND: 1.5KV/min at 100mA
• Signal: 3KV/min at 100mA
A Test time: just 1 second.
A Test point
• GND test: Test between Power cord GND and Signal
cable metal GND.
• ESD test: Test between Power cord GND and Live and
neutral.
A Leakage current: Set to 0.5mA(rms)

5.5 HDCP (High-Bandwidth Digital

Contents Protection) Setting 7. Preset Ch information.
• No Need.

5.6 Test of RS-232C control.

Press In-Start button of Service Remocon then set the
“4.Baud Rate” to 115200. Then check RS-232C control and

5.7 Selection of Country option.

Selection of country option is allowed only North American
model (Not allowed Korean model). It is selection of Country
about Rating and Time Zone. In case of POWER ONLY, System color is operated multi
• Models: All models which use LJ03X Chassis (See the first system
page.) In case of IN STOP, System color is operated default system
• Press “In-Start” button of Service Remocon, then enter the (PAN-M)
“Option” Menu with “PIP CH-“ Button
• Select one of these three (USA, CANADA, MEXICO)
defends on its market using “Vol. +/-“button.

* Caution : Don’t push The INSTOP KEY after completing

the function inspection.

Copyright LG Electronics. Inc. All right reserved. - 18 - LGE Internal Use Only
Only for training and service purposes
8. Default Service option. 9. USB DOWNLOAD (*.epk file
download)

9.1 Put the USB Stick to the USB socket

9.2 Press Menu key, and move OPTION

8.1 ADC-Set.
A R-Gain adjustment Value (default 128)
A G-Gain adjustment Value (default 128)
9.3 Press “FAV” Press 7 times.
A B-Gain adjustment Value (default 128)
A R-Offset adjustment Value (default 128)
A G-Offset adjustment Value (default 128)
A B-Offset adjustment Value (default 128)

8.2 White balance. Value.

9.4 Select download file (epk file)

9.5 After download is finished, remove the

USB stick.

9.6 Press “IN-START” key of ADJ remote

control, check the S/W version.

Copyright LG Electronics. Inc. All right reserved. - 19 - LGE Internal Use Only
Only for training and service purposes
 EXPLODED VIEW
IMPORTANT SAFETY NOTICE
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These
parts are identified by in the Schematic Diagram and EXPLODED VIEW.
It is essential that these special safety parts should be replaced with the same components as
recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.
Do not modify the original design without permission of manufacturer.

300 800 400

200
540
530 521

880
820
830

810
120
500
910
920

900

A2 A5 A10

Copyright LG Electronics. Inc. All right reserved. - 20 - LGE Internal Use Only
Only for training and service purposes
 EXT IRQ
SMD GASKET GPIO_00, GPIO_01, GPIO_02,
RESET GPIO_11, GPIO_11, GPIO_39

MDS62110206

MDS62110206

MDS62110206

MDS62110206

MDS62110206
MDS62110206

MDS62110206
MDS62110206

MDS62110206

6.5T_GAS
6.5T_GAS

6.5T_GAS

6.5T_GAS
6.5T_GAS

6.5T_GAS

6.5T_GAS
IC100 IR_INT : GPIO_23

GAS4

GAS5

GAS6

GAS8

GAS9
GAS3

GAS7
GAS1

GAS2
LGE3556C (C0 VERSION) IR1_IN : GPIO_25
CI_A[0-13] IR2_IN : GPIO_29
IR_OUT : GPIO_26
J23 N26 OPT R1047
CI_A[3] 0
EBI_ADDR3 GPIO_00 POWER_DET INTERRUPT PIN PWM0 : GPIO_24
CI_A[4] J24 L26 0 R192
EBI_ADDR4 GPIO_01 DC INTERRUPT PIN DC 17page : Motion Remocon
PWM1 : GPIO_09

OPT
+3.3V_NORMAL

OPT
CI_A[2] H25 N25 INTERRUPT PIN
EBI_ADDR2 GPIO_02 ERROR_OUT
+3.3V_NORMAL CI_A[1] H24 L25

R1027
EBI_ADDR1 GPIO_03 MODEL_OPT_4
CI_A[0] H23 K27

10K
EBI_ADDR0 GPIO_04 MODEL_OPT_5
CI_A[5] J25 K28
R1045 EBI_ADDR5 GPIO_05 SIDE_AV_DET
CI_A[6] F26 K24
EBI_ADDR6 GPIO_06 CI_5V_CTL For CI

MDS62110204

MDS62110204
4.7K

MDS62110204

MDS62110204
MDS62110204

MDS62110204

MDS62110204
CI_A[8] H28 K26 1K R114

5.5T_GAS

5.5T_GAS
R1030 0

5.5T_GAS

5.5T_GAS

5.5T_GAS
GAS2-*1

GAS4-*1
HDMI_HPD_4

5.5T_GAS
EBI_ADDR8 GPIO_07

GAS8-*1

GAS9-*1
5.5T_GAS

GAS1-*1

GAS6-*1

GAS7-*1
SOC_RESET SYS_RESETb CI_A[9] J26 K25 22 R113
EBI_ADDR9 GPIO_08 DEMOD_RESET 28page : ISDB Demod 17page:M_RFMODULE_RESET
EBI_CS CI_A[13] H27 AA27 DEMOD_RESET
EBI_ADDR13 GPIO_09 PWM_DIM
CI_A[12] G26 AA28 R1029 1K R1042 22
EBI_ADDR12 GPIO_10 HDMI_HPD_3 R1053 2.7K +3.3V_NORMAL
CI_A[11] J27 AA26
EBI_ADDR11 GPIO_11 MODEL_OPT_1
CI_A[10] J28 L1
EBI_ADDR10 GPIO_12 DSUB_DET
CI_A[7] F27 L3
EBI_ADDR7 GPIO_13 BT_RESET BT_RESET 43page : Bluetooth
22 R116 G24 L2
/CI_WAIT EBI_TAB GPIO_14 /RST_HUB
22 R122 H26 Y25
EBI_WE EBI_WE1B GPIO_15 BCM_RX
R117 G27 Y26
33 EBI_CLK_IN GPIO_16 BCM_TX
G28 M27

MDS62110205

MDS62110205
SC_RE1

MDS62110205

MDS62110205
EBI_CLK_OUT GPIO_17

MDS62110205

MDS62110205

MDS62110205
22 R127 K23 AA25

7.5T_GAS

7.5T_GAS
7.5T_GAS

7.5T_GAS

7.5T_GAS
GAS2-*2

GAS4-*2

7.5T_GAS

GAS8-*2

GAS9-*2
EBI_RW SC_RE2

7.5T_GAS

GAS1-*2

GAS6-*2

GAS7-*2
EBI_RWB GPIO_18
22 G25 R25 R111 22
EBI_CS EBI_CS0B GPIO_19 CI_MOD_RESET
R140 N28
GPIO_20 MODEL_OPT_0
NAND_DATA[0-7] N27 BT_MUTE
GPIO_21 DD DD 17page : Motion Remocon
+3.3V_NORMAL NAND_DATA[0] U24 AH18 R105 56
NAND_DATA0 GPIO_22 AUD_MASTER_CLK
NAND_DATA[1] T26 P23 R199 1K
NAND_DATA1 GPIO_23 HDMI_HPD_2 IR_IN
NAND_DATA[2] T27 M23
NAND_DATA2 GPIO_24 A_DIM

4.7K
4.7K
NAND_DATA[3] U26 AD19 R106 1K 12K R1041 EMI
NAND_DATA3 GPIO_25 HDMI_HPD_1 IR_IN C173
NAND_DATA[4] U27 AE19 R1048 100 C180
NAND_DATA4 GPIO_26 5V_HDMI_1 100pF 22uF
NAND_DATA[5] V26 M4 R109 100 BB Add. 16V
NAND_DATA5 GPIO_27 EPHY_ACTIVITY 50V
NAND_DATA[6] V27 M5 R110 100

R194
R193
NAND_DATA6 GPIO_28 EPHY_LINK
NAND_DATA[7] V28 L23
NAND_DATA7 GPIO_29 /CI_CD1 For CI
T24 Y28 BCM_AVC_DEBUG_TX1
NVRAM NAND_CEb
NAND_ALE
NAND_REb
R23
T23
NAND_CS0B
NAND_ALE
GPIO_30
GPIO_31
Y27
G2
BCM_AVC_DEBUG_RX1
M_REMOTE_TX
M_REMOTE_RX
M_REMOTE_TX 17page : Motion Remocon
M_REMOTE_RX 17page : Motion Remocon
NAND_REB GPIO_32 VREG_CTRL VREG_CTRL 43page : Bluetooth
NAND_CLE T25 G3
+3.3V_NORMAL NAND_CLE GPIO_33 TUNER_RESET
From wireless_I2C to micom I2C NAND_WEb R24 G5 R107 100
NAND_WEB GPIO_34 DTV_ATV_SELECT
+3.3V_NORMAL NAND_RBb U25 G6 R108 100
NAND_RBB GPIO_35 5V_HDMI_2 R115 1.8K
G4 For CI
+3.3V_NORMAL GPIO_36 AV_CVBS_DET
L24 0 R1044
GPIO_37 CI_OUTCLK
W24 P25 R1033 22
SF_MISO GPIO_38 /CI_CD2
R1025

C103
4.7K

IC102 U23 L5 R1046 22

M24M01-HRMN6TP 0.1uF SF_MOSI GPIO_39 /CI_IREQ
V23 K4
SF_SCK GPIO_40 MODEL_OPT_6

R173
V24 K1

10K
OPT
NC VCC SF_CSB GPIO_41 MODEL_OPT_3
1 8 L27
GPIO_42 WIRELESS_DL_RX
R1032 M26
0 E1 WP GPIO_43 WIRELESS_DL_TX
2 7 N23 R132 22
GPIO_44 FE_TS_VAL_ERR External Demod.
R28 R1050 100
GPIO_45 5V_HDMI_3
E2
3 A8’h 6
SCL
R1026 22
SCL3_3.3V
R27 R161 100
GPIO_46 5V_HDMI_4
R26 R133 22
VSS SDA GPIO_47 MODEL_OPT_2
4 5 R1028 22 P28
SDA3_3.3V GPIO_48 SCART1_DET

G
Q103 P27
C171 C167 FDV301N GPIO_49 SIDE_COMP_DET SIDE_COMP_DET
8pF 8pF K6 R103 0
GPIO_50 RF_SWITCH_CTL_CHB RF_SWITCH_CTL_CHB 15page : CHB_SUB_TUNER
OPT OPT WIRELESS_SDA K5 22 R129

S
SDA2_3.3V GPIO_51 RGB_DDC_SCL
P26 100 R160 R1052 +3.3V_NORMAL R187-*1 R184-*1

G
OPT FRC_RESET 4.7K +3.3V_NORMAL
Q104 GPIO_52 2.2K 2.2K
M3 22 R102
FDV301N * I2C MAP GPIO_53
M2 22 R1049
RGB_DDC_SDA
NON_EU NON_EU
WIRELESS_SCL SCL2_3.3V GPIO_54

S
M1
OPT GPIO_55 COMP2_DET
* I2C_0 :

1.2K

1.2K

1.2K

1.2K

1.2K

1.2K

1.2K

1.2K
R187

R184

R183

R180

R177

R176

R171

R170
L4 22 R1051
GPIO_56 LG5111_RESET
L6 LOCAL DIMMING
GPIO_57 HP_DET LG5111_RESET
R123 0 WIRELESS * I2C_1 : W27
SGPIO_00 SCL0_3.3V
W28
SGPIO_01 SDA0_3.3V
R124 0 WIRELESS * I2C_2 : W26
SGPIO_02 SCL1_3.3V
W25
SGPIO_03 SDA1_3.3V
* I2C_3 : J2
SGPIO_04 SCL2_3.3V
J1
SGPIO_05 SDA2_3.3V
K3
SGPIO_06 SCL3_3.3V
K2
SGPIO_07 SDA3_3.3V

Boot Strap * NAND FLASH MEMORY 4Gbit (512M for BB)

Default Res. of all NAND pin is Pull-down
+3.3V_NORMAL
+3.3V_NORMAL
NAND_DATA[0-7] R1000
2.7K
NAND_DATA[0] OPT R1008
R1036 2.7K IC101
OPT 2.7K
NAND04GW3B2DN6E
NAND_DATA[1]
R1005
R1040 2.7K
OPT 2.7K
NC_1 NC_29
NAND_DATA[2] R169 1 48
NAND FLASH
R1039 2.7K NC_2 NC_28
2.7K

2.7K

2.7K 2 47
NAND_DATA[3] OPT R1004 NC_3 NC_27
3 46
2.7K
R1037OPT NC_4 NC_26 NAND_DATA[0-7]
NAND_DATA[4]
2.7K 4 45 MODEL OPTION
R191

R1003
R134

NC_5 I/O7 NAND_DATA[7] LOW

R1002 2.7K 5 44 PIN NAME PIN NO. HIGH
OPT 2.7K
NAND_DATA[5] NC_6 I/O6 NAND_DATA[6]
R1035 6 43 MODEL_OPT_0 N28 URSA3 NON_URSA3
R1034 2.7K Open Drain RB I/O5
2.7K NAND_RBb 7 42 NAND_DATA[5] +3.3V_NORMAL
MODEL_OPT_1 AA26 MAIN_MINI_LVDS MAIN_LVDS

EXTERNEL FRC/T_CON FRC

NAND_DATA[6] R I/O4

MINI_LVDS/NO LOCAL_D
OPT R1007 NAND_DATA[4]
NAND_REb 8 41
R1006OPT 2.7K MODEL_OPT_2 R26 DDR-256M DDR-512M
2.7K E NC_25
NAND_DATA[7] NAND_CEb 9 40

1K

1K

1K

1K
1K

1K
1K

DDR_512MB
R1038 MODEL_OPT_3 K1 FHD HD
NC_7 NC_24
+3.3V_NORMAL
R158 OPT 2.7K 10 39
C116

FHD

FRC
GIP
2.7K

OLED
NAND_DATA[0-7]
4700pF NC_8 NC_23

R1017

R1022

R1011

R1020
MODEL_OPT_4 NON_FRC

R1009

R1013
11 38 C136 10uF L25 FRC

R118
R156 10V
NAND_ALE 2.7K
R157 OPT VDD_1 VDD_2 MODEL_OPT_5 NON-GIP
2.7K C114 12 37 C115 K27 GIP
0.1uF VSS_1 VSS_2 0.1uF
R1001 R1012 100
NAND_CLE 13 36 IF_AGC_SEL MODEL_OPT_0 MODEL_OPT_6 K4 OLED NON_OLED
2.7K R1019 100
NC_9 NC_22 LNA2_CTL/BOSTER_CTL MODEL_OPT_1
14 35 R1024 100
RF_SWITCH_CTL MODEL_OPT_2
NAND_IO[0] : Flash Select (1) NC_10 NC_21 R181 100
0 : Boot From Serial Flash 15 34 BT_ON/OFF MODEL_OPT_3 *MODEL_OPT_0 & MODEL_OPT_4
1 : Boot From NAND Flash BCM BT MODULE REFER TO THIS OPTION
CL NC_20 BT_ON/OFF MODEL_OPT_4 15page:TW_9910_RESET
NAND_CLE 16 33
NAND_IO[1] : NAND Block 0 Write (DNS) AL I/O3 NAND_DATA[3] 43page : Bluetooth MODEL_OPT_515page:CHB_RESET MODEL_OPT_0 MODEL_OPT_4
0 : Enable Block 0 Write NAND_ALE 17 32 R130 22

NO FRC/INTERNER FRC
/CI_SEL MODEL_OPT_6 LOW LOW NO FRC
1 : Disable Block 0 Write W I/O2 NAND_DATA[2]
NAND_WEb 18 31 HIGH LOW URSA3 Internal

LVDS/LOCAL_D
1K

1K

1K

1K

1K
1K

1K
NAND_IO[3:2] : NAND ECC (1, DNS) HIGH HIGH URSA3 External

DDR_256MB
WP I/O1 NAND_DATA[1]

NON_OLED
+3.3V_NORMAL

NON_GIP
00 : No ECC 19 30

NO_FRC
LOW HIGH PWIZ Pannel T-con
01 : 1 ECC Bit

HD
NC_11 I/O0 NAND_DATA[0] with LG FRC
10 : 4 ECC Bit 20 29

R119
R136
4.7K

R1021

R1015

R1014

R1018
R1023

R1010
11 : 8 ECC Bit NC_12 NC_19
21 28
NAND_IO[4] : CPU Endian (0) NC_13 NC_18
0 : Little Endian 22 27
1 : Big Endian NC_14 NC_17
FOR ESD 12V Pattern
C 23 26
NAND_IO[6:5] : Xtal Bias Control (1, DNS) B Q101 NC_15 NC_16
00 : 1.2mA (Fundmental Recommand) FLASH_WP 24 25 +12V
KRC103S
01 : 1.8mA
10 : 2.4mA (3rd over tune Recommand) E
11 : 3.0mA

NAND_IO[7] : MIPS Frequency (DNS)

C178 C179
0 : 405MHz
0.1uF 0.1uF
1 : 378MHz
50V 50V
NAND_ALE : I2C Level (DNS)
0 : 3.3V Switching
1 : 5V Switching

NAND_CLE
0 : Enable D2CDIFF AC (DNS)
1 : Disabe D2CDIFF AC

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS BCM (EUROBBTV) 2009.06.18
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. BCM3556 & NAND FLASH 1
 When usding FUNDMENTAl then series R = 0 ohm and CL = 8 pF
IC100 54MHz X-TAL
LGE3556C (C0 VERSION) When usding Dip-type X-tal then series R = 22 ohm and CL = 12 pF

D23 B4
FE_TS_DATA_CLK C24
PKT0_CLK LVDS_TX_0_DATA0_P
A4
LVDS_TX_1_DATA4_N013:E7;035:AK20
FE_TS_SERIAL B26
PKT0_DATA LVDS_TX_0_DATA0_N
C6
LVDS_TX_1_DATA4_P013:E7;035:AK19
FE_TS_SYNC PKT0_SYNC LVDS_TX_0_DATA1_P LVDS_TX_1_DATA3_N013:E7;035:AK19 C230
A25 B6 22
RMX0_CLK LVDS_TX_0_DATA1_N LVDS_TX_1_DATA3_P013:E7;035:AK19 12pF
TP4021 B25 B3 R212
TP4022 RMX0_DATA LVDS_TX_0_DATA2_P LVDS_TX_1_DATA2_N013:E7;035:AK17
A26 A3
TP4023 RMX0_SYNC LVDS_TX_0_DATA2_N LVDS_TX_1_DATA2_P013:E7;035:AK17
A1
CI_OUTDATA[0-7],CI_OUTSTART,CI_OUTVALID

1008LS-272XJLC 33pF
LVDS_TX_0_DATA3_P LVDS_TX_1_DATA1_N013:E7;035:AK17

C257
045:V14 A2
LVDS_TX_0_DATA3_N LVDS_TX_1_DATA1_P013:E7;035:AK16
CI_A[14] G23 D5
POD2CHIP_MCLKI LVDS_TX_0_DATA4_P LVDS_TX_1_DATA0_N013:E7;035:AK16
CI_OUTDATA[0] D25 D6

2
POD2CHIP_MDI0 LVDS_TX_0_DATA4_N LVDS_TX_1_DATA0_P013:E7;035:AK16

54MHz
CI_OUTDATA[1] D24 C5

X903

3
POD2CHIP_MDI1 LVDS_TX_0_CLK_P LVDS_TX_1_CLK_N 013:E7;035:AK18

L208
CI_OUTDATA[2] C25 B5 54MHz_XTAL_N
POD2CHIP_MDI2 LVDS_TX_0_CLK_N LVDS_TX_1_CLK_P 013:E7;035:AK18
CI_OUTDATA[3] E27 B1

1
POD2CHIP_MDI3 LVDS_TX_1_DATA0_P LVDS_TX_0_DATA4_N013:F7;035:AK15 54MHz_XTAL_P
CI_OUTDATA[4] E26 B2
POD2CHIP_MDI4 LVDS_TX_1_DATA0_N LVDS_TX_0_DATA4_P013:F7;035:AK14
CI_OUTDATA[5] D28 C2

R243
POD2CHIP_MDI5 LVDS_TX_1_DATA1_P LVDS_TX_0_DATA3_N013:F7;035:AK14

604
CI_OUTDATA[6] D27 C3
POD2CHIP_MDI6 LVDS_TX_1_DATA1_N LVDS_TX_0_DATA3_P013:F7;035:AK14
CI_OUTDATA[7] D26 D1
POD2CHIP_MDI7 LVDS_TX_1_DATA2_P LVDS_TX_0_DATA2_N013:F7;035:AK12
CI_OUTSTART E23 D2
POD2CHIP_MISTRT LVDS_TX_1_DATA2_N LVDS_TX_0_DATA2_P013:F7;035:AK12
CI_OUTVALID E24 E1
POD2CHIP_MIVAL LVDS_TX_1_DATA3_P LVDS_TX_0_DATA1_N013:E7;035:AK12
F25 E2 22
CHIP2POD_MCLKO LVDS_TX_1_DATA3_N LVDS_TX_0_DATA1_P013:E7;035:AK11 R211 12pF
C27 E3
CHIP2POD_MDO0 LVDS_TX_1_DATA4_P LVDS_TX_0_DATA0_N013:E7;035:AK11 C229
C26 E4
CHIP2POD_MDO1 LVDS_TX_1_DATA4_N LVDS_TX_0_DATA0_P013:E7;035:AK11
B28 D3 A1.2V A2.5V
CHIP2POD_MDO2 LVDS_TX_1_CLK_P LVDS_TX_0_CLK_N 013:E7;035:AK13
B27 D4
CHIP2POD_MDO3 LVDS_TX_1_CLK_N LVDS_TX_0_CLK_P 013:E7;035:AK13
A27
F24
CHIP2POD_MDO4 LVDS_PLL_VREG
F5
F1
C228
10uF
OPT
VIDEO INCM
CHIP2POD_MDO5 LVDS_TX_AVDDC1P2
F23 F4
CHIP2POD_MDO6 LVDS_TX_AVDD2P5_1
A3.3V A1.2V A2.5V E25 F2
CHIP2POD_MDO7 LVDS_TX_AVDD2P5_2
C28
A28
CHIP2POD_MOSTRT LVDS_TX_AVSS_1
C1
F3
PLACE NEAR BCM CHIP
CHIP2POD_MOVAL LVDS_TX_AVSS_2

0.1uF

0.1uF

0.1uF
4.7uF

4.7uF
C4

C2013
0

0
R236

R237

C236

C239

C242

C295
L202 LVDS_TX_AVSS_3
A5
BLM18PG121SN1D LVDS_TX_AVSS_4 C258 0.1uF
AC18 E5 Near Q1705 TU_CVBS_INCM
VDAC_AVDD2P5 LVDS_TX_AVSS_5 Run Along TUNER_CVBS_IF_P Trace
AF20 E6 003:A3
VDAC_AVDD1P2 LVDS_TX_AVSS_6
AG20 D7
VDAC_AVDD3P3_1 LVDS_TX_AVSS_7

4.7uF
AG21 E7

0.1uF

0.1uF

0.1uF
VDAC_AVDD3P3_2 LVDS_TX_AVSS_8

C214

C219

C223
C212
F7
BROAD BAND STUDIO LVDS_TX_AVSS_9
G7
C2019 0.1uF
SC1_RGB_INCM
LVDS_TX_AVSS_10 A1.2V
Near J1500 003:A4
AF19 H7 Run Along SC1_R,SC_G,SC_B Trace
VDAC_AVSS_1 LVDS_TX_AVSS_11
AD20 A2.5V
R220 : BCM recommened resistor 562 ohm VDAC_AVSS_2

0.1uF
C2012
+3.3V_NORMAL AE20
R220 560AH22 VDAC_AVSS_3
AD27

0.1uF
P200 C215 VDAC_RBIAS CLK54_AVDD1P2 C261 0.1uF

C251
AH20 AD28 REAR_AV_CVBS_INCM
TJC2508-4A 0.1uF VDAC_1 CLK54_AVDD2P5
AG19 AD26 003:A3
VDAC_2 CLK54_AVSS
C213 AC26
54MHz_XTAL_N

R244

R248

R250
0.01uF CLK54_XTAL_N 002:I1

R238
75
1%
AH21 AC27
4.7uF
C2028

R200
1.5K

34

34

34
54MHz_XTAL_P
R201
1.5K

1 VDAC_VREG CLK54_XTAL_P 002:I2

AE25
CLK54_MONITOR
DTV/MNT_V_OUT Y23
PM_OVERRIDE
2 M25
BSC_S_SCL
M24 C262 0.1uF
BSC_S_SDA
AA23
Near J1603 Run Along COMP_Y_IN,COMP_Pr_IN,COMP_Pb_IN Trace
COMP2_VID_INCM
A1.2V
3 VCXO_AGND_1
AB24
VCXO_AGND_2

R245
R6 AC24 L203
USB_AVSS_1 VCXO_AGND_3

34
T6 AF25 BLM18PG121SN1D
4 USB_AVSS_2
A3.3V VCXO_AVDD1P2
R7 AF24 C233 C235
A1.2V USB_AVSS_3 VCXO_PLL_AUDIO_TESTOUT 0.1uF 4.7uF
A2.5V T7
USB_AVSS_4
T8
USB_AVSS_5 +3.3V_NORMAL
R3 P24
USB_AVDD1P2 RESET_OUTB
U3 F6 SYS_RESETb
USB_AVDD1P2PLL RESETB 001:A6;001:B7 C2015 0.1uF
L200 T4 N24 4.7K Near P1600 R_VID_INCM
BLM18PG121SN1D USB_AVDD2P5 NMIB Run Along DSUB_R Trace 003:A5
T3 J5 R221
USB_AVDD2P5REF TMODE_0
R4 J4 A2.5V
USB_AVDD3P3 TMODE_1 C2016 0.1uF
U4 J6 L211 G_VID_INCM
USB_RREF TMODE_2 BLM18PG121SN1D Run Along DSUB_G Trace 003:A5
V1 J3
0.1uF
0.1uF
0.1uF

4.7uF
0.1uF

43page : Bluetooth BT_DM BT_DM USB_DM1 TMODE_3

V2 V25 A1.2V C264 0.1uF
Route INCM between associated 43page : Bluetooth BT_DP USB_DP1 SPI_S_MISO C231 C234 B_VID_INCM
BT_DP C201 R209 U1 AH3 10uF 0.1uF
003:A5

R246

R247
left and right signals of same channel 3.9K SIDE_USB_DM Run Along DSUB_B Trace

R251
100pF USB_DM2 POR_OTP_VDD2P5
U2 AB8

34

34

34
D3.3V SIDE_USB_DP USB_DP2 POR_VDD1P2
The INCM trace ends at the T5 +3.3V_NORMAL
C207

C208
C209
C202
C203

same point where the connector R210 USB_MONCDR

120 R5 H4
ground connects to the board ground USB_MONPLL EJTAG_TCK
R266 R1 H3
(thru-hole connector pin). OPT OPT
R235 USB_PWRFLT_1 EJTAG_TDI
2.7K R2 H2 R224 R225
Place test points, resistors USB_PWRFLT_2 EJTAG_TDO
2.7K T2 H1 2.7K 2.7K
near audio connector. USB_PWRON_1 EJTAG_TMS
T1 G1 1K R249
Connect the other side of C2011 0.1uF
USB_PWRON_2 EJTAG_TRSTB
the resistor to GND as close H6 Near J1500 SC1_CVBS_INCM 003:A3
as possible to the ground EJTAG_CE0 Run Along SC1_CVBS_IN Trace
H5
connection of the associated EJTAG_CE1
audio connector. R218 P6

R260
240 1K R219 EPHY_VREF R226
P5 L204 A1.2V R227

34
EPHY_RDAC BLM18PG121SN1D 2.7K 2.7K
P3 AB26
EPHY_RDN EPHY_RDN PLL_MAIN_AVDD1P2
P2 AC25
EPHY_RDP EPHY_RDP PLL_MAIN_AGND
N3 AB27 R240
A2.5V A1.2V
EPHY_TDN EPHY_TDN PLL_MAIN_MIPS_EREF_TESTOUT
BLM18PG121SN1D N2 M6 390 L207 A1.2V C2023 0.1uF
EPHY_TDP EPHY_TDP PLL_RAP_AVD_TESTOUT Near J1501 SIDE_AV_CVBS_INCM 003:A3
P1 N6 OPT BLM18PG121SN1D
BLM18PG121SN1D L209 Run Along SC2_CVBS_IN Trace
EPHY_AVDD1P2 PLL_RAP_AVD_AVDD1P2
P4 N7

0.1uF

4.7uF
0.1uF
BLM18PG121SN1D

4.7uF

C240
C241

C237
EPHY_AVDD2P5 PLL_RAP_AVD_AGND

C238

R261
N4
L212 EPHY_PLL_VDD1P2

34
C2026 C244 N1
0.1uF

4.7uF

L210
C2020

C2021

C2018
0.1uF

4.7uF

4.7uF 0.1uF EPHY_AGND_1

C247

N5 AA24
16V EPHY_AGND_2 BYP_CPU_CLK
P7 Y24
EPHY_AGND_3 BYP_DS_CLK
AE24 1K R222
BYP_SYS216_CLK
AD25 1K R262
BYP_SYS175_CLK
041:B5 R204 51 C206 0.015uF AE6
REAR_AV_L_IN AUDMX_LEFT1 TP is Necessory
041:B5 REAR_AV_R_IN
002:J6 REAR_AV_LR_INCM
R214 51 C210 0.015uF AD7
AF6
AUDMX_RIGHT1 AUDIO INCM
AUDMX_INCM1
COMP2_L_IN R215 51 C211 0.015uF AH4
COMP2_R_IN R228 51 C232 0.015uF AG5
AUDMX_LEFT2 PLACE NEAR BCM CHIP
AUDMX_RIGHT2
002:J6 COMP2_LR_INCM
AG4
AUDMX_INCM2
PLACE NEAR Jacks
041:B5 R229 51 C220 0.015uF AG6
SC1_L_IN AUDMX_LEFT3 5.1
041:B5 R230 51 C221 0.015uF AF7
SC1_R_IN AUDMX_RIGHT3 SIDE_AV_LR_INCM
002:J7 AE7 Near J1501
SC1_LR_INCM AUDMX_INCM3 R256 002:C6
AH5 Route Between SC2_L_IN & SC2_R_IN 0.15uF
041:B5 R231 51 C224 0.015uF
SIDE_AV_L_IN AUDMX_LEFT4 C2014 0.47uF
041:B5 R232 51 C225 0.015uF AG7
SIDE_AV_R_IN AUDMX_RIGHT4 C271
AH6
002:J6 SIDE_AV_LR_INCM AUDMX_INCM4
009:I3 R233 51 C226 0.015uF AD8
PC_L_IN AUDMX_LEFT5 5.1
009:I3 R234 51 C227 0.015uF AF8
PC_R_IN AUDMX_RIGHT5 002:C6
REAR_AV_LR_INCM
002:J7
AE8 Near J1600 R258 Route Between AV1_L_IN & AV1_R_IN
PC_LR_INCM AUDMX_INCM5 0.15uF
AH7
AUDMX_LEFT6 C2024 0.47uF
AH8
AUDMX_RIGHT6 C2017
AG8
AUDMX_INCM6
AF5
AUDMX_AVSS_1
AB9
AUDMX_AVSS_2 5.1
AA10
C2027 0.047uF
0.047uF

0.047uF
0.047uF
0.047uF
0.047uF
0.047uF
0.047uF
0.047uF
0.047uF

COMP2_LR_INCM
AUDMX_AVSS_3
AB10 Near J1603 R259 Route Between COMP1_L_IN & COMP1_R_IN 0.15uF 002:C6
AUDMX_AVSS_4 C2025
0

AA11
0

C265
C222 AUDMX_AVSS_5 0.47uF
AB11
0.1uF AUDMX_AVSS_6
AC8
C277
C279
C296
C298
C299
C252
C253
C254
C256

AUDMX_LDO_CAP
R264

R265

AE5
AUDMX_AVDD2P5
5.1
SC1_LR_INCM
Near J1500 R257 Route Between SC1_L_IN & SC1_R_IN 0.15uF
002:C6
C2022 0.47uF
A2.5V C270

C217 5.1
10uF PC_LR_INCM
Near J1602 R252 Route Between PC_L_IN & PC_R_IN 0.15uF
002:C6
C269 0.47uF
C2010

Near Q1704
TU_SIF_INCM 003:A3
Route Along With TUNER_SIF_IF_N
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS BCM (EUROBBTV) 2009.06.18
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. BCM3556 AUD_IN/LVDS 2
 D1.2V
D3.3V
Place here for common circuit with ATSC D1.2V

+1.8V_AMP +1.8V_HDMI +3.3V_NORMAL A3.3V

C245 C255 C377 C375 C263 C373 C267 C289 C291
L111 C383 C246 C378 C376 C259 C374 C366 C266 C288 C290 4.7uF 1000pF 0.01uF 0.1uF 4.7uF 1000pF 0.01uF 0.1uF 10uF
BLM18PG121SN1D L112 C243 C249 C250 C382 C381 C380 C379 C286 C287 1000pF 0.01uF 0.1uF 4.7uF 1000pF 0.01uF 0.1uF 4.7uF 1000pF 0.01uF
CIC21J501NE 0.1uF 4.7uF 1000pF 0.01uF 0.1uF 10uF 10uF 33uF 100uF

C2008 FOR ESD

C2007
0.1uF 0.1uF
16V 16V

D3.3V D1.8V
IC100
26page : TUNER(HALF NIM) LGE3556C (C0 VERSION)

AG28 AE18 C216 C268 C371 C370 C369 C292 C293 C294
TU_IF_AGC_1 DS_AGCI_CTL I2S_CLK_IN C274 C272 C275 C276 C278 C280 C297
AH28 AF18 0.1uF 1000pF 0.01uF 0.1uF 4.7uF 1000pF 0.01uF 0.1uF C2004
TU_IF_AGC_2 DS_AGCT_CTL I2S_CLK_OUT AUD_SCK 0.1uF 0.1uF 0.1uF 0.1uF 4.7uF 4.7uF 4.7uF 33uF
AA21 AD17
EDSAFE_AVSS_1 I2S_DATA_IN
A2.5V AB22 AH19
TU_IF_AGC_1 EDSAFE_AVSS_2 I2S_DATA_OUT AUD_LRCH
AF26 AD18
EDSAFE_AVSS_3 I2S_LR_IN
TU_IF_AGC_2 A1.2V AF27 AG18
BLM18PG121SN1D EDSAFE_AVSS_4 I2S_LR_OUT AUD_LRCK
AF28 AG26
L102 EDSAFE_AVSS_5 AUD_LEFT0_N HP_LOUT_N A2.5V
AG27 AH26
EDSAFE_AVDD2P5 AUD_LEFT0_P HP_LOUT_P
TU_IF_N_1 AE26 AF23
EDSAFE_DVDD1P2 AUD_AVDD2P5_0
TU_IF_P_1 AE28 AA20 C147 C155 C162
C113 C172 EDSAFE_IF_N AUD_AVSS_0_1 0.01uF 0.1uF 10uF
A1.2V AE27 AB21
0.1uF 4.7uF EDSAFE_IF_P AUD_AVSS_0_2
C144 AD24 AC22
TU_IF_N_1 L103 0.1uF PLL_DS_AGND AUD_AVSS_0_3 D1.8V
AB19 AC23
PLL_DS_AVDD1P2 AUD_AVSS_0_4
TU_IF_P_1 BLM18PG121SN1D C119 C122 AB25 AD23
PLL_DS_TESTOUT AUD_AVSS_0_5 D1.8V
0.1uF 4.7uF AH25
A1.2V AUD_RIGHT0_N HP_ROUT_N
A2.5V AG25
AUD_RIGHT0_P HP_ROUT_P
AB18 AH23
BLM18PG121SN1D SD_V5_AVDD1P2 AUD_LEFT1_N BT_LOUT_N
C111 C112 AC17 AG23
SD_V5_AVDD2P5 AUD_LEFT1_P BT_LOUT_P
0.1uF 0.1uF AB17 AG24 C282 C283 C284 C285 C2005 C2006
L104 C120 C123 SD_V5_AVSS AUD_RIGHT1_N BT_ROUT_N
C248 C281 C365 C364 C363 C357 C348 C320 C319 C318 C304
1000pF 0.01uF AD14 AH24 1000pF 1000pF 1000pF 1000pF 0.01uF 0.01uF 0.01uF 0.01uF C356
0.1uF 0.1uF 0.1uF 10uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF 0.1uF
BLM18PG121SN1D SD_V1_AVDD1P2 AUD_RIGHT1_P BT_ROUT_P
AD16 AE22 16V 16V 16V 10V 16V 16V 16V 16V 16V 16V
SD_V1_AVDD2P5 AUD_AVDD2P5_1
L105 AB15 AB20 C148 C156 C163
SD_V1_AVSS_1 AUD_AVSS_1_1 0.01uF 0.1uF 10uF
C117 AC15 AC21
SD_V1_AVSS_2 AUD_AVSS_1_2
1000pF C118 AD13 AE23
0.01uF SD_V2_AVDD1P2 AUD_AVSS_1_3
AE13 AF21 SCART1_Lout_N
SD_V2_AVDD2P5 AUD_LEFT2_N
DSUB AC13 AE21 SCART1_Lout_P
SD_V2_AVSS_1 AUD_LEFT2_P
AB14 AF22
SD_V2_AVSS_2 AUD_RIGHT2_N SCART1_Rout_N
DSUB_R AC14 AG22
SD_V2_AVSS_3 AUD_RIGHT2_P SCART1_Rout_P
R_VID_INCM AC12 AD21
DSUB_G SD_V3_AVDD1P2 AUD_AVDD2P5_2
AD12 AC20 C149 C157 C164
SD_V3_AVDD2P5 AUD_AVSS_2_1 0.01uF 0.1uF 10uF
G_VID_INCM AB13 AD22
DSUB_B SD_V3_AVSS_1 AUD_AVSS_2_2
AA14 AH2
COMPONENT SD_V3_AVSS_2 AUD_SPDIF SPDIF_OUT
B_VID_INCM AC11 AC6
SD_V4_AVDD1P2 SPDIF_AVDD2P5
R195 10 AD11 AE4
COMP2_Y SD_V4_AVDD2P5 SPDIF_AVSS C150
C169 47pF

1% AB12 AF3 0.1uF

COMP2_Pr +5V_NORMAL IC100
C101 47pF

SD_V4_AVSS SPDIF_IN_N
C17047pF

C127 0.1uF AD10 AH1

COMP2_Pb
AC10
SD_R SPDIF_IN_P LGE3556C (C0 VERSION)

R2035
COMP2_VID_INCM SD_INCM_R
C104 OPT

C128 0.1uF AE9

R312 75

R131 75

R2036
R120 82

SD_G 1K D1.2V

0
AF9 AG1 IC100
1%

SD_INCM_G HDMI_RX_0_CEC_DAT AD5 P16

C129 0.1uF AH9 AA6 LGE3556C (C0 VERSION) DVSS_1 DVSS_62
1%

1%

SD_B HDMI_RX_0_HTPLG_IN AD6 R16

R138-*1 AG9 AA5 R309 10K DVSS_2 DVSS_63
A2.5V J7 T16
C130 SD_INCM_B HDMI_RX_0_HTPLG_OUT
0.1uF AG15 AB3 0 R307 DVSS_3 DVSS_64
SC1_RGB(EU)/COMPNENT1[NON_EU] EU 0 SD_Y1 HDMI_RX_0_DDC_SCL HDMI_SCL K7 U16
C131 0.1uF AE15 Y6 0 R308 H8 DVSS_4 DVSS_65
NON_EU SD_PR1 HDMI_RX_0_DDC_SDA HDMI_SDA VDDC_1 L7 V16
COMP1_Y ==> C132 0.1uF AF15 AC4 499 R152 J8 DVSS_5 DVSS_66
SC1_G VDDC_2 M7 AA16
R138 10 SD_PB1 HDMI_RX_0_RESREF C3006 K8
COMP1_Pr ==> SC1_R AH15 AC1 DVSS_6 DVSS_67
SD_INCM_COMP1 HDMI_RX_0_CLK_N HDMI_CLK- 0.1uF VDDC_3 AB7 D17
COMP1_Pb ==> SC1_B C133 0.1uF AG16 AC2 L8 DVSS_7 DVSS_68
SD_Y2 HDMI_RX_0_CLK_P HDMI_CLK+ 16V VDDC_4 AC7 L17
C134 0.1uF AF16 AD1 M8 DVSS_8 DVSS_69
SC1_RGB_INCM VDDC_5 G8 M17
C105 OPT

HDMI_RX0-
75

75

75

SD_PR2 HDMI_RX_0_DATA0_N N8
0.1uF AH17 AD2 DVSS_9 DVSS_70
OPT 1%

C135 A3.3V VDDC_6 D9 N17

NON_EU SD_PB2 HDMI_RX_0_DATA0_P HDMI_RX0+
ONLY USE NON_EU P8 DVSS_10 DVSS_71
NON_EU

AH16 AE1
NON_EU
1%

AA9 P17
R135

1%

R135-*1 HDMI_RX1- VDDC_7

R315

R313

FOR COMP 1 SD_INCM_COMP2 HDMI_RX_0_DATA1_N R8

82 1% C174 0.1uF AG14 AE2 DVSS_11 DVSS_72
SD_Y3 HDMI_RX_0_DATA1_P HDMI_RX1+ VDDC_8 G10 R17
C175 0.1uF AE14 AF1 BLM18PG121SN1D AA8 DVSS_12 DVSS_73
SIDE COMPONENT SD_PR3 HDMI_RX_0_DATA2_N HDMI_RX2- VDDC_9 A11 T17
0.1uF AF14 AF2 L109 H9 DVSS_13 DVSS_74
R196 C176 VDDC_10 L11 U17
SD_PB3 HDMI_RX_0_DATA2_P HDMI_RX2+
10 AH14 AD3 A1.2V A2.5V H10 DVSS_14 DVSS_75
SIDE_COMP_Y SD_INCM_COMP3 HDMI_RX_0_VDD3P3 VDDC_11 M11 V17
1% AH10 AE3 H11 DVSS_15 DVSS_76
SIDE_COMP_Pr SD_L1 HDMI_RX_0_VDD1P2 VDDC_12 N11 AA17
C177 OPT

H12
R165 82

R166 75

AG10 AC3 DVSS_16 DVSS_77

R167 75

SIDE_COMP_Pb SD_C1 HDMI_RX_0_VDD2P5 VDDC_13 P11 AC19

AE10 AD4 C145 C153 C160 H13 DVSS_17 DVSS_78
1%

SIDE_COMP_INCM NON_EU_CN NON_EU_CN SD_INCM_LC1 HDMI_RX_0_AVSS_1 4.7uF 0.1uF 0.1uF VDDC_14 R11 G18
AE11 AB5 H14 DVSS_18 DVSS_79
1%

R2112-*1 R141-*1
1%

SD_L2 HDMI_RX_0_AVSS_2 BLM18PG121SN1D VDDC_15 T11 L18

SIDE_COMP_Y AF11 AB6 H15 DVSS_19 DVSS_80
5% 12 5% 62 SD_C2 HDMI_RX_0_AVSS_3 L107 VDDC_16 U11 M18
SIDE_COMP_Pr AH11 AG2 H16 DVSS_20 DVSS_81
SD_INCM_LC2 HDMI_RX_0_AVSS_4 VDDC_17 V11 N18
SIDE_COMP_Pb R100 62 AH13 AB4 H17 DVSS_21 DVSS_82
SD_L3 HDMI_RX_0_AVSS_5 VDDC_18 D12 P18
SIDE_COMP_INCM R142 OPT AE12 AA7 H18 DVSS_22 DVSS_83
CVBS R143 62 SD_C3 HDMI_RX_0_AVSS_6 VDDC_19 G12 R18
EU_CN AF12 Y8 H19 DVSS_23 DVSS_84
R2112
R141 75 1% EU_CN SD_INCM_LC3 HDMI_RX_0_PLL_AVSS C158 C151 C165 VDDC_20 L12 T18
C110 0.1uF AD9 AC5 H21 DVSS_24 DVSS_85
TU_CVBS SD_CVBS1 HDMI_RX_0_PLL_DVDD1P2 1000pF 0.01uF 10uF VDDC_21 M12 U18
1% 18 R2113 C124 0.1uF AG11 W8 J21 DVSS_25 DVSS_86
REAR_AV_CVBS SD_CVBS2 HDMI_RX_0_PLL_DVSS VDDC_22 N12 V18
12 R2114 C125 0.1uF AG12 K21 DVSS_26 DVSS_87
SC1_CVBS_IN SD_CVBS3 D3.3V VDDC_23 P12 D20
10K
10K

10K

10K
0 R2115 C100 0.1uF AF13 L21 DVSS_27 DVSS_88
R2037

SD_CVBS4 VDDC_24 R12 G20

OPT

SIDE_AV_CVBS M21 DVSS_28 DVSS_89

12 AC9 AA3
TU_CVBS_INCM SD_INCM_CVBS1 HDMI_RX_1_CEC_DAT VDDC_25 T12 H20
AF10 V4 N21 DVSS_29 DVSS_90
REAR_AV_CVBS_INCM VDDC_26 U12 A21
R310

R2039

SD_INCM_CVBS2 HDMI_RX_1_HTPLG_IN
R2038

A2.5V A2.5V AH12 U6 P21 DVSS_30 DVSS_91

SC1_CVBS_INCM SD_INCM_CVBS3 HDMI_RX_1_HTPLG_OUT VDDC_27 V12 E21
AG13 V5 R21 DVSS_31 DVSS_92
SD_INCM_CVBS4 HDMI_RX_1_DDC_SCL VDDC_28 L13 F21
SIDE_AV_CVBS_INCM AF17 V3 T21 DVSS_32 DVSS_93
SD_SIF1 HDMI_RX_1_DDC_SDA VDDC_29 M13 G21
R137 R4020 AG17 W4 499 R153 A3.3V U21 DVSS_33 DVSS_94
10K SD_INCM_SIF1 HDMI_RX_1_RESREF VDDC_30 N13 E22
10K AD15 W2 V21 DVSS_34 DVSS_95
0.1uF OPT VDDC_31 P13 F22
SD_FB HDMI_RX_1_CLK_N W21
R128 C106 A1.2V AE16 W3 DVSS_35 DVSS_96
SC1_ID SD_FS HDMI_RX_1_CLK_P R205 VDDC_32 R13 G22
0 L106 AE17 Y1 Y21 DVSS_36 DVSS_97
TU_SIF BLM18PG121SN1D SD_FS2 HDMI_RX_1_DATA0_N 20 VDDC_33 T13 H22
AB16 Y2 DVSS_37 DVSS_98
OPT

R3055 HDMI_RX_1_DATA0_P A3.3V U13 J22

R139 AA15 PLL_VAFE_AVDD1P2 AA2 DVSS_38 DVSS_99
240 C121 C140 V13 K22
12K PLL_VAFE_AVSS HDMI_RX_1_DATA1_N AH27
0.1uF 4.7uF AC16 AA1 DVSS_39 DVSS_100
HDMI_RX_1_DATA1_P AGC_VDDO G14 L22
TU_SIF_INCM AG3 PLL_VAFE_TESTOUT AB2 BLM18PG121SN1D D3.3V DVSS_40 DVSS_101
RGB_HSYNC HDMI_RX_1_DATA2_N L14 M22
R4021

AF4 AB1 L110 DVSS_41 DVSS_102

M14 N22
12K

C4020 RGB_VSYNC HDMI_RX_1_DATA2_P C2003

120
R3056

Y3 A1.2V A2.5V AA12 DVSS_42 DVSS_103

OPT

0.1uF HDMI_RX_1_VDD3P3 0.1uF VDDO_1 N14 P22

Y4 AA13 DVSS_43 DVSS_104
HDMI_RX_1_VDD1P2 VDDO_2 P14 R22
W5 AA18 DVSS_44 DVSS_105
HDMI_RX_1_VDD2P5 VDDO_3 R14 T22
W1 AA19 DVSS_45 DVSS_106
HDMI_RX_1_AVSS_1 VDDO_4 T14 U22
U5 C146 C154 C161 E28 DVSS_46 DVSS_107
RGB_HSYNC HDMI_RX_1_AVSS_2 VDDO_5 U14 V22
W6 4.7uF 0.1uF 0.1uF L28 DVSS_47 DVSS_108
RGB_VSYNC HDMI_RX_1_AVSS_3 VDDO_6 V14 W22
CONNECT NEAR BCM CHIP U7 U28 DVSS_48 DVSS_109
HDMI_RX_1_AVSS_4 FOR ESD VDDO_7 L15 Y22
V7 AB28 DVSS_49 DVSS_110
R2117 HDMI_RX_1_AVSS_5 VDDO_8 M15 AA22
0 W7 BLM18PG121SN1D D1.8V DVSS_50 DVSS_111
SC1_FB HDMI_RX_1_AVSS_6 L108 C384 N15 W23
U8 33uF DVSS_51 DVSS_112
HDMI_RX_1_AVSS_7 P15 AB23
V8 10V A9 DVSS_52 DVSS_113
HDMI_RX_1_AVSS_8 DDRV_1 R15 F28
Y5 G9 DVSS_53 DVSS_114
HDMI_RX_1_AVSS_9 DDRV_2 T15 M28
0
R2116
OPT

V6 G11 DVSS_54 DVSS_115

HDMI_RX_1_PLL_AVSS DDRV_3 U15 T28
AA4 G13 DVSS_55 DVSS_116
HDMI_RX_1_PLL_DVDD1P2 DDRV_4 V15 AC28
Y7 C159 C152 C166 A14 DVSS_56 DVSS_117
HDMI_RX_1_PLL_DVSS DDRV_5 A16
1000pF 0.01uF 10uF G15 DVSS_57
DDRV_6 G16
G17 DVSS_58
DDRV_7 L16
A19 DVSS_59
DDRV_8 M16
G19 DVSS_60
DDRV_9 N16
DVSS_61

THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES

SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS EUROBBTV 2009.06.18
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. BCM3556 VIDEO IN 3
 D1.8V
A1.2V
IC100
LGE3556C (C0 VERSION) D1.8V

A6 0.1uF C403

0.047uF
0.047uF
DDR_BVDD0

0.047uF

0.047uF

0.047uF
C451

C454

C455

C456

C457

C458

C459

C460

C461
C441
0.047uF

C442
0.1uF

C443

C444

C445

C446

C447

C448

470pF

470pF

0.047uF

0.047uF
A24

C440
470pF

0.1uF

0.1uF

C469
10uF

C470

C471

C472

C473

C474

C475

C476

C477

C478

C479

C480

C481

C482

C495
0.1uF C404

10uF

10uF

C462

C465

C468
0.1uF

470pF

470pF
10uF

470pF

0.1uF

10uF

22uF

0.1uF

0.1uF
470pF

0.1uF

470pF

10uF

10uF

10uF
22uF
DDR_BVDD1

10uF
10uF
B7
DDR_BVSS0
B24
DDR_BVSS1
F20
DDR_PLL_TEST
B23 R411 0
DDR_PLL_LDO
B17 OPT DDR01_CKE
DDR01_CKE
C22
DDR_VTT
R412 240
DDR_COMP
E16
IC400 IC402
1% DDR01_ODT DDR1_DQ[0-7]
DDR01_ODT NT5TU128M8DE_BD NT5TU128M8DE_BD
C23 DDR0_DQ[0-7] 004:B6 004:B5
DDR_EXT_CLK
DDR0_CLK
B12 DDR0_CLK 004:C7;004:C4 004:A7;004:C4 DDR0_CLK 004:A7;004:F4 DDR1_CLK DDR01_A[0-3,7-13] SI
C12 R406 R407
DDR0_CLKb 004:C7;004:C4 E8 C8 DDR0_DQ[0] E8 C8 DDR1_DQ[0] DDR01_RASb
DDR0_CLKB 100 CK DQ0 100 CK DQ0
A13 DDR1_CLK 004:F7;004:F4 1% F8 C2 DDR0_DQ[1] F8 C2
DDR1_CLK 004:A7;004:C4 DDR0_CLKb 004:A7;004:F4 DDR1_CLKb 1% DDR1_DQ[1] DDR01_A[2] C485
A12 CK DQ1 CK DQ1
DDR1_CLKb 004:F7;004:F4 DDR01_CKE F2 D7 DDR0_DQ[2] DDR01_CKE F2 D7 DDR1_DQ[5] DDR1_A[4-6] DDR01_A[0] 0.1uF
DDR1_CLKB CKE DQ2 CKE DQ2
B15 DDR01_A[0] D3 DDR0_DQ[3] D3
DDR01_A00 DDR1_DQ[3] DDR1_A[6] 75
E14 DDR01_A[1] DQ3 DQ3 AR400
DDR01_A[0-3] D1 DDR0_DQ[4] D1 DDR1_DQ[4] DDR0_A[4-6] DDR01_CASb
DDR01_A01 DQ4 DQ4 C486
A15 DDR01_A[2] F7 D9 DDR0_DQ[5] F7 D9 R408 75 0.1uF
DDR01_A02 DDR01_RASb DDR01_RASb DDR1_DQ[2]
D15 DDR01_A[3] RAS DQ5 RAS DQ5
DDR01_A03 DDR01_CASb G7 B1 DDR0_DQ[6] DDR01_CASb G7 B1 DDR1_DQ[6] DDR01_A[12] R409 75
E13 DDR0_A[4] CAS DQ6 CAS DQ6
DDR0_A[4-6] DDR01_WEb F3 B9 DDR0_DQ[7] DDR01_WEb F3 B9 DDR1_DQ[7] DDR01_A[9]
DDR0_A04 WE DQ7 WE DQ7 C487
E12 DDR0_A[5] G8 G8 0.1uF
DDR0_A05 DDR01_A[7]
F13 DDR0_A[6] CS CS
DDR0_A06 DDR01_BA0 DDR01_BA0 DDR1_A[5] 75
C14 DDR01_A[7] B7 B7 AR401
DDR01_A07 DDR01_BA1 DDR0_DQS0 004:A4 DDR01_BA1 DDR1_DQS0 004:A4 DDR1_A[4] C488
F14 DDR01_A[8] DQS DQS
DDR01_A08 G2 A8 DDR0_DQS0b 004:A4 G2 A8 DDR1_DQS0b 004:A3 DDR01_A[11] 75 0.1uF
B14 DDR01_A[9] BA0 DQS BA0 DQS
DDR01_A[7-13] G3 B3 DDR0_DM0 G3 B3 DDR1_DM0 004:A4 DDR01_A[8]
DDR01_A09 BA1 DM/RDQS 004:A4 BA1 DM/RDQS
D14 DDR01_A[10] G1 A2 G1 A2
DDR01_A10 DDR01_BA2 DDR01_BA2 DDR01_A[13] C489
C13 DDR01_A[11] NC_1/BA2 NU/RDQS NC_1/BA2 NU/RDQS
DDR01_A11 DDR01_A[0-3,7-13] DDR01_A[0-3,7-13] DDR01_A[3] AR402 0.1uF
D13 DDR01_A[12] D1.8V D1.8V
DDR01_A12 DDR01_A[1]
B13 DDR01_A[13] H8 A9 H8 A9
DDR0_A[4-6] DDR01_A[0] DDR01_A[0] DDR01_A[10]
DDR01_A13
F15 DDR1_A[4] A0 VDDQ_1 004:B6;004:F3;004:I7 DDR1_A[4-6] A0 VDDQ_1 C490
DDR1_A[4-6] DDR01_A[1] H3 C1 DDR01_A[1] H3 C1 DDR01_BA1 75 0.1uF
DDR1_A04 A1 VDDQ_2 A1 VDDQ_2
C15 DDR1_A[5] H7 C3 H7 C3 AR403
DDR1_A05 DDR01_A[2] DDR01_A[2] DDR01_BA0
D16 DDR1_A[6] A2 VDDQ_3 A2 VDDQ_3
DDR1_A06 DDR01_A[3] J2 C7 DDR01_A[3] J2 C7 DDR01_BA2
F16 A3 VDDQ_4 A3 VDDQ_4
DDR01_BA0 DDR01_BA0 DDR0_A[4] J8 C9 DDR1_A[4] J8 C9 DDR01_WEb
B16 A4 VDDQ_5 A4 VDDQ_5
DDR01_BA1 DDR0_A[5] J3 A1 DDR1_A[5] J3 A1 75
DDR01_BA1 A5 VDD_1 A5 VDD_1 DDR01_CKE C499
E15 DDR01_BA2 DDR0_A[6] J7 L1 DDR1_A[6] J7 L1 AR404 0.1uF
DDR01_BA2 A6 VDD_2 A6 VDD_2 DDR01_ODT
A17 DDR01_CASb K2 E9 K2 E9
DDR01_CASB DDR01_A[7] DDR01_A[7] R410 75
A8 A7 VDD_3 A7 VDD_3 C421
DDR0_DQ[0] DDR0_DQ[0-7] DDR01_A[8] K8 H9 DDR01_A[8] K8 H9 0.1uF
DDR0_DQ00 A8 VDD_4 A8 VDD_4
B11 DDR0_DQ[1] K3 K3
DDR0_DQ01 DDR01_A[9] DDR01_A[9]
B8 A9 A9 DDR_VTT
DDR0_DQ02
D11
DDR0_DQ[2]
DDR0_DQ[3]
DDR01_A[10] H2
K7
A10/AP VSSQ_1
A7
B2
DDR01_A[10] H2
K7
A10/AP VSSQ_1
A7
B2
PI
DDR0_DQ03 DDR01_A[11] DDR01_A[11]
E11 DDR0_DQ[4] A11 VSSQ_2 A11 VSSQ_2
DDR01_A[12] L2 B8 DDR01_A[12] L2 B8
DDR0_DQ04 A12 VSSQ_3 A12 VSSQ_3
C8 DDR0_DQ[5] DDR01_A[13] L8 D2 L8 D2
DDR0_DQ05 DDR01_A[13]
C11 DDR0_DQ[6] A13 VSSQ_4 A13 VSSQ_4
DDR0_DQ06 D8 D8 DDR01_RASb
C9 DDR0_DQ[8-15] VSSQ_5 VSSQ_5
DDR0_DQ[7] A3 A3 DDR01_A[2]
DDR0_DQ07 VSS_1 VSS_1 C491
D8 DDR0_DQ[8] E3 E3 0.1uF
DDR0_DQ08 DDR01_A[0]
E10 L3 VSS_2 L3 VSS_2
DDR0_DQ[9] NC_2/A14 J1 NC_2/A14 J1 DDR0_A[6] 75
DDR0_DQ09 L7 VSS_3 DDR0_VREF0 L7 VSS_3 DDR1_VREF0
E9 DDR0_DQ[10] K9 K9 AR405
DDR0_DQ10 NC_3/A15 NC_3/A15 DDR01_A[3]
F11 DDR0_DQ[11] VSS_4 VSS_4
DDR0_DQ11 DDR01_A[1] C483
F12 004:A7;004:C5;004:C2;004:F2;004:I4;004:I6
DDR0_DQ[12] F9 E2 F9 E2 DDR01_A[10] 0.1uF
DDR0_DQ12 DDR01_ODT DDR01_ODT
E8 DDR0_DQ[13] ODT VREF ODT VREF
DDR0_DQ13 E1 E1 C463 C466 DDR01_BA1 75
D10 VDDL C449 C452 VDDL
DDR0_DQ[14] E7 E7 DDR01_A[12] AR406
DDR0_DQ14 VSSDL VSSDL
F8 DDR0_DQ[15] DDR1_DQ[0-7] 0.1uF 470pF 470pF 0.1uF
DDR0_DQ15 DDR01_A[9] C484
C18 DDR1_DQ[0] 0.1uF
DDR1_DQ00 DDR01_A[7]
C20 DDR1_DQ[1]
DDR1_DQ01 DDR0_A[5] 75
A18 DDR1_DQ[2] AR407
DDR1_DQ02 DDR0_A[4]
B21 DDR1_DQ[3]
DDR1_DQ03 DDR01_A[11] C492
DDR1_DQ04
C21 DDR1_DQ[4] DDR1_DQ[8-15]
Close to IC Close to IC DDR01_A[8] 0.1uF
B18 DDR1_DQ[5]
DDR1_DQ05 DDR01_A[13] 75
B20 DDR1_DQ[6] AR408
DDR1_DQ06 DDR01_BA0
D18 DDR1_DQ[7]
DDR1_DQ07 DDR01_BA2 C493
E18 DDR1_DQ[8]