Академический Документы
Профессиональный Документы
Культура Документы
PONDICHERRY
SUBMITTED BY
PRABAKARAN.G
2
nd
Year CSE, Department of Computer Science & Engineering,
Sri Manakula Vinayagar Engineering College, Pondicherry
JUNE 2007
PONDICHERRY
Participants:
Ritwik.M
Sinivassin.V
Elammurugu R.M
Prabakaran.G
Rajakumar.S
GovindRam.N
2
CONTENTS
INTRODUCTION
OVERVIEW
1. PRODUCT EVALUATION GROUP (PEG)
(i) Mechanical
(ii) Peripheral
(iii) Desktop
(iv) Server
(v) Notebook
(vi) Add on
(vii) Software
(viii) Certification
(ix) Benchmarking
2. QUALITY CHECK (QC)
(i) Inward Quality check (IQC)
(ii) Reliability
(iii) Test and Repair Section(T&RS)
(iv) Final Quality Check (FQC)
(v) Customer Satisfaction Cell and Customer Support
3. PRODUCT ENGINEERING (PE)
(i) Final Production Line(FPL)
(iii) Packing
4. STORES
3
CONCLUSION
ACKNOWLEDGEMENTS:
It was Mr. Gerald (H.R Executive) who got us the official permission and initiated the
formal procedure for providing us the in-plant training. I would also like to place on
record my thanks to Ms. Gayathri of the HR Department and Mr. Julius Caesar,
Apprentice in the HR Department, for arranging the schedule of the In-Plant training
We interacted with several of the Engineers there—experts in various fields-- who were
very patient with us answering our queries and providing detailed information on
various aspects of Computer Hardware. Among them I would like to mention Mr. Suresh
from the Product Engineering Group, Mr. Appandaraj (certification, PEG), Mr. Raja
extremely grateful to all of them for providing sufficient information and taking precious
My special thanks to Mr. C.S. Dwivedi, Vice President, HCL Infosystems, for giving me
the right directions and inputs and making this training possible for us.
4
INTRODUCTION
GovindRam.N who have currently completed their Second year (4th semester) in
Computer Science and Engineering. The training commenced on 20th June 2007 at 9.40
a.m. The H.C.L. plant at Sedarapet is basically a hardware assembling and packing plant
5
OVERVIEW
On entering the plant and just before the commencement of our actual training we
were informed that the plant had 3 major departments that were related to our
Though these are the more important department of the plant, we were also
taken to the yet another Department which though not related to our field, yet plays an
6
1. Product Evaluation Group (PEG):
are created according to various requirements of the Market. First of all, we were asked
to remove our footwear. Footwear, we were told, if worn inside causes Electrostatic
Disturbances (ESD) due to static electricity. All employees, we noted were wearing
special footwear which was tagged ESD safe. This ESD, we were told affects all
electronic devices, especially the RAM and ROM areas of the computer and sometimes
causes memory failure or even restarts the system if exposed to for a long time and
and Development area of the plant. PEG also has a direct interaction with Marketing
Division which provides them information on the market requirements which helps them
assembles products. Usually this department receives the sample raw materials from
sources, mainly from Taiwan and Singapore with the Head Office at Noida.
1. The idea for system configuration is proposed by PEG to the marketing division or the
higher authority division which then either accepts or rejects the proposal.
2. New products are created on the basis of the market requirement. The marketing
division contacts the peg with a specific configuration which is then produced.
7
The configuration is approved if it satisfies all criteria and then it is passed on to the
quality check team, in order to ascertain the quality level of the model, with the Supplier
Specification Sheet (which consists of model specification and the other details of the
The product evaluation group (PEG) consists of several sub departments each which
deals with specific part of the creation of the product. The various groups are:
1) Mechanical
2) Peripheral
3) Desktop
4) Server
5) Notebook
6) Add on
7) Software
8) Certification
9) Benchmarking
(i) Mechanical
Measurements and generally deals with the CPU creation, mouse pad formation and CPU
artwork. It is this mechanical division that also specifies the size of the various other
internal components.
(ii)Peripherals
8
Not many details were given about the division. All we
understood was that this division is important in the creation of peripherals such as
keyboard and mouse and other optical device drives (ODD).Other than that, the personnel
(iii)Desktop
motherboards. Mr. Raja who was working there took a few minutes from his busy
schedule in order to give a brief idea about the work done there. He told us that the
motherboard used for the various desktop systems are different in dimensions when
compared with the notebook or server motherboards. The motherboard is basically a PCB
(Printed Circuit Board having a controller, IC, ports and other such connections.
The main motherboards used by HCL are from Intel (which is green in
color), Asus (which is golden yellow) and gigabyte (blue color).How ever before he
could give us more information his workload had increased and we were forced to part.
(iv) Server
The server departments division deals with the motherboard and processor
required by the Server systems. Mr. Hariharan (an engineer in the division) gave us a
detailed view of the work done in this division. The main requirements of a server, we
understood, was to have greater speed and storage capacity as compared to the desktop
systems as it purpose is to “Serve” the various client systems. Basically the server
9
systems motherboard consists of an Intel processor and occasionally and AMD processor.
However with the arrival of core 2 duo processor and windows Vista, it is more popular
The basic and most important part of the Motherboard is the chipset. Server
systems have a large north and south bridge setting which together is called the chipset.
The north bridge controls dataflow from processor to memory and vise versa while south
bridge is the processor to I/O device controller. The PLS slot is the I/O communication
unit which controls device cards such as LAN, Graphics and VGA.
The first such peripheral control card slot used was called International Standard
replaced by Peripheral Components Interfacing (PCI) port. These 3 ports were parallel
in the favor of serial communication concept (Since Data was not corrupted as in case of
parallel lines), a new such interface port was formed called Peripheral Component
Express (PCX) which made use of serial communication concept. This is the only I/O
port connected to the north bridge. Nowadays in most systems PCX is used though in
some systems another component called Accelerated Graphics Adaptor (AGA) is used.
technology available. A heat sink is placed above the chipset and processor in order to
10
reduce the amount of heat released. The ‘coolant quiet technique’ is used by AMD and
The SCAS is a port through which up to 16 head disks can be connected at any
given time. The SATA cache is serial port which is divided into SATA power and SATA
data. The power cable has 14 pins and Data cable has 7 pins. Usually however instead of
the modern SATA the older IDE cable are used. The IDE are parallel ports. All the serial
ports of the server are controlled by the FBD (Fully Buffered Dim).This FBD is a unique
Disk drives (RAID).This concept is very useful in cases of data loss and for recovery of
the lost data. RAID 0 was the first version which did not allow data recovery.
A B
C D
E F
STRUCTURE OF RAID 0
As that did not serve the purpose of RAID 1 was developed. In this case a copy of all
11
DATA
A A
B B
C C
STRUCTURE OF RAID 1
This was a total of waste of space and so raid 3 was developed. In this case an X-OR
value of the data in Raid 0 format was stored is a separate hard disk. This Enabled easier
data recovery.
DATA
A B
A B
C D
C D
E F
E F
STRUCTURE OF RAID 3
An upgraded version of the RAID 3 Technique is Raid 5 which uses the parity of the 2
data disks to store the data. The most common type of data recovery technique is Raid 5.
However the RAID technique has upgraded and now even RAID 850 is available.
12
On the motherboard around 8 memory slots are present through on some
boards up to 16 slots are allowed. Slots for up to two processors and PC1 slots are also
(v)Notebooks
This division deals with the various notebooks and laptops available in the
market. Here they do not create any new varieties or system configuration. Only the
performance of the notebooks with the various processors is verified. Due to heavy
workload of the personnel detailed study of the division was not possible.
(vi)Add On
This division deals with the verification of various add on parts on the
personnel, Mr. Suresh (The person in charge of PEG) was able to help us and some
(vii)Software
This division evaluated the various operating systems and software that
can be uploaded onto the systems. Many operating systems are available out of which
Microsoft windows and Linux are the most common. Mr. Perumal (one of the engineers
in the division) explained this concept. He said that windows is more commonly used in
personal computers and Linux is used by professionals requiring high security .Due to the
release of windows vista, it is more popular. He said that the basic operations (After
13
installation) are verified. This division checks if the software is compatible with the
Hardware. This is checked by the score shown by the systems. Minimum acceptable
score is 1 while the maximum score possible is only around 5.5 on a scale of 1 to 10.
BIOS and OS must be in synchronization for the systems to work perfectly. The software
(viii) Certification:
This is the division of PEG that after various tests on the product get it
engineer in the division), “is to first ensure that the product is working properly and then
send the configuration with its details to the companies involved such as Microsoft ,
Intel , AMD and then get their approval.” He also said that the companies send particular
tests on this configuration. The results of these tests are sent to the company. If it satisfies
all the guidelines and the criteria, then it is approved. This approval is the certification
(ix) Benchmarking:
guidelines set by the companies involved. The main guidelines followed are:
14
These guidelines are adhered to and are verified by the benchmarking. It is
this division that also ensures that the various stickers are placed in the correct locations
For Example: One such guideline is to ensure that Microsoft and Intel Inside stickers are
no less than the second largest stickers’ pasted (H C L. sticker being the largest). This is
achieved by making sure that both the stickers have the same area.
2. QUALITY CHECK
introduced to next. It is in this Department that the quality of various equipments and
assembly parts are checked. The request from P.E.G. is processed and the various
particular task.
(vii) Reliability
15
(i) Inward Quality Check (IQC)
This Division deals with arrival of new materials and tests their electrical
and peripheral connections. Their objective is to inspect test quality, quantity and
materials.
START
NORMAL
INSPECTION
AN
ALL CHECKED
Y
LOTS EQUAL
OR LESS THAN REDUCED INSPECTION REJ
ECT
PRESCRIBED
ION
LIMIT
DOUBLE THE
ORDER IF
SINGLE ORDER
TIGHTENED INSPECTION
STOP
16
Here the military standard 105 is followed for instruction. The Goods Received Slip
(GRS) is obtained and contains details of the materials including item code and
Reduced – 3 pieces
Normal – 8 pieces
Tightened – 16 pieces
division) is mainly of two types. After the usual method of inspection mentioned above
the materials are again inspected according to the results of the primary inspection in two
methods.
a) Green Channel
this green channel method of testing is used. Here any 1 piece is checked out of every
box. This greatly improves production and reduces the time required for checking.
b) Red Channel
Channel checking occurs if customer satisfaction or FQC reports any problems with
any system.
three hours while the keyboard, server &other hardware would take two hours and the
17
COMPONENTS AQL
Peripheral 0.4
Mechanical 0.65
Electrical 0.1
IQC not only checks the system peripherals but also checks the packing boxes. It
checks if the box is made of the correct material or if the symbols printed on it are
Once cleared the materials are transferred to the next division where they undergo
reliability test.
18
(ii) Reliability test
.According to Mr. Johnson (an engineer in the division) the functionality test is of two
types.
a) Pre-release
Here the new parts are tested as requested by the marketing department
which performs New Batch Reliability Test (NBRT) on the basis of customer
configuration, Reason for failure, customer support. The Ongoing Reliability Test
(ORT) is also performed in order to check the material for at least three days, based
on the component.
Field escalation simulates the user usability of the system and records its
b) Post Release
In this method every part of the system is re-checked. The thermal check
ensures that the components are safe with that specification at around 40-50` C and
the cold specification about -15`C. A probe near the processor for and RAM measures
the temperature. Once everything is verified the material is released and the Material
This section tests all the failed components and finds the reason for the
failure and proposes possible solution. The supplier to plan communication is handled by
19
this division. If a product fails the defective materials are sent back to the suppliers with a
note about the reason for failure. This division also advices the procurement division on
This division checks the system after complete assembly. Each system is
tested for three to four hours based on the customer requirement and specification.
Desktop Systems and Notebooks are tested individually with various check lists.
• Security check
• OS/BIOS/Vector Speed
• Memory Capacity
• Speed(2755 RPM)
The list for Notebook check is similar to the Desktop except that it contains checks such
maintenance. User Satisfaction is the primary goal and here, as one employee equips,
20
“The Customer is the King”. The Customer Support division is the division that prepares
the warranty cards and caters to the customer or user requirements and complaints.
Periodical surveys and product analysis is conducted by this group in order to perfect any
product. It is this division that plays a very important role in customer satisfaction and
3. PRODUCTION ENGINEERING
This is the department that deals with the assembly and final production of all the
systems. Ms. Shella Jeba Kumari (the person in charge of that division) explained that it
iii) Packing
(b) Kitting
Configuration Card (MCC) which consists of the minute details such as the type of the
21
screws required. The serial number of the MCC is arranged in such a way that the first 4
digits correspond to the month and year of the production; the fifth digit refers to the unit
and the 6th digit is the material code. The next 6 digits is the actual number of the
component.
configured mother board with the operating system required. This is then copied to other
hard disks (also known as the slaves).This is the most important section and comes
directly after QC. Some of the more common software uploaded are: Word power, MS-
(b) KITTING
This is the second unit in the FPL. Here there two sections, Kitting or Sub Kitting
and Assembly. In the sub kitting section the various hardware are classified and stored
are placed first in the various compartments within the CPU cabinet reserved for it along
with the GRS and HCL logo. The battery on the motherboard is also checked before it is
sent to the next section. If any material defective then it is pasted with a yellow tag
containing details of error and continues to the Machine Release (MR) levels. This is
MR1:
Here the SMPS and external exhaust fan is fixed on to the CPU and all physical
verification is done.
22
MR2:
MR3:
Here the motherboard is mounted on the CPU. No external connections are given.
MR4:
Front panel connections, internal LED and speaker connection are dealt with here.
MR5:
Here the peripheral connection such as CD ROM and Floppy drive are done. The
MR6:
Since all connections are now completed, the wires are neatly arranged by routing
in this section.
MR7
This can also be called the quality check section. Here physical verification off all
components of cabinet is done. Scanning updates the serial number of each machine in
MR8
23
Display verification occurs here. All internal verification of motherboard is
checked using BIOS and checks if configuration is what is required by user and buttons
up the CPU
The safety test involves checking if leakage current is less than 1.5 and if ground
(c)RELIABILITY
system is called Reliability test. Mr. Jegan, the person in charge told us that AMIDAG
The testing makes use of the CMOS and BIOS in the hard disks to
i) With FEB
With FEB
In this case the processor is self booting and a floppy is inserted which checks all the
hardware.
Without FED
In this case a server is used to start the system before the tools are run on
the system.
24
In this case the CPU is started and the memory and batch files are also
c) Memory (RAM/ROM)
e) FED test
Any problem with CPU is checked in the repairs section. There are 2
Electrical section
are selected and checked. This is a very time consuming process. This section is
Mechanical section
25
In this section the various physical components such as sticks and screw
After verification of repairs the products are sent for the final testing. Here
all CD drives, ports and several configuration of the systems is checked. Then it is sent
The engineers test the machines from the customer point view and does
not comprise even on small matters. After it is verified it is then sent for cleaning.
Cleaning is the part where all unnecessary stickers and tags are removed.
(iii) PACKING
This is the final stage of production. Here the monitors, keyboards, mouse,
CPU are packed in ESD safe plastic foams and finally sealed in a cardboard box. The
packed systems is then taken to the stores and stored for distribution.
4. STORES
The store is the department where all the new material or rejected
materials are placed. The stores work begins with the security clearance as soon as a
charge of the division). Then the various addresses and invoices are checked and verified.
If the invoice or papers are not available, then the buyer is contacted to get a copy of the
invoice. The materials are classified according to the duty amount. If the amount is
available, then the exercise exempt form is obtained from the buyer.
26
Once goods are unloaded, they are given to IQC for accepting or rejecting.
If ok, the materials are moved to the main stack pile otherwise they are returned to the
sender without any payment and if exercise is paid the amount is returned. Once the piece
is moved to the OK store then it has an address (row no., shelf) CICP (Critical Item
Control Process) is where items of small size but high value are stored.
The MLGP takes an inventory and if materials are unavailable, orders for more. The
receipt is obtained on unlading materials and it contains all details of the consignment.
Then if all are cleared, the stock is moved to the Work In Progress (WIP) stack.
As product assembly rate increases, the contents of the WIP stock pile reduce.
The completed machines are moved into the finished goods store and transferred
according to the orders. Stores also collect defective materials and issues the Non-
Returnable Gate Pass (NRGP). If the goods are in repairable condition the Returnable
Gate Pass (RGP) is issued. In such cases the exercise duty payment is checked. If it’s
serves better than an invoice after which the GR is issued. This is then presented to the
The accepted materials are placed in the OK stores (main store) while those rejected are
placed in the rejection store from where they are shipped to the supplier.
CONCLUSION:
27
Any Computer Engineer must be familiar with all aspects of a computer—the
hardware as well as the software--in order to be effective. Usually it is seen that most
courses in Computer Science & Engineering lay more emphasis on the software part so
much so that the basic hardware part of the field is given less importance. Hence it was
The officials were kind enough to oblige me and allow me to study the functioning of an
assembling unit and I am indeed happy to report that the entire training programme has
been most illuminating. The major aim of this in-plant training program was to help us
understand the process of assembling a computer system and the various safety measures
and precautions taken in the process of building up a computer until it was delivered to
the user, and to that extent we benefited a great deal. We were able to visit the various
divisions and departments of the plant, where the various processes involved were
explained to us. We could therefore study the procedures at close quarters and have a
hands-on experience of the workings of the plant. Hence we could clearly comprehend
the complete processes that go into the working of a computer. The extensive testing
methods performed at each step of assembly, once viewed and experienced practically,
are more clearly understood than the very same methods studied as theory. Therefore the
In-Plant Training Program offered by H.C.L Infosystems Ltd., was indeed very useful in
understanding the various needs, requirements and procedure involved in the assembly of
28