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Stencil Aperture Diameter is 20% smaller than the PCB Pad dimensions. In other words, if solder paste is printed using this stencil, there will be a 10% clearance between the solder paste and edge of the pad. By giving such a good clearance, one can prevent the occurrence of solder balls around the component.
Stencil Aperture Diameter is 20% smaller than the PCB Pad dimensions. In other words, if solder paste is printed using this stencil, there will be a 10% clearance between the solder paste and edge of the pad. By giving such a good clearance, one can prevent the occurrence of solder balls around the component.
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Stencil Aperture Diameter is 20% smaller than the PCB Pad dimensions. In other words, if solder paste is printed using this stencil, there will be a 10% clearance between the solder paste and edge of the pad. By giving such a good clearance, one can prevent the occurrence of solder balls around the component.
Авторское право:
Attribution Non-Commercial (BY-NC)
Доступные форматы
Скачайте в формате PPT, PDF, TXT или читайте онлайн в Scribd