Академический Документы
Профессиональный Документы
Культура Документы
SEMICONDUCTOR
TECHNICAL SPECIFICATION
FEATURES
* * * * * Ideal for surface mounted applications Low leakage current Metallurgically bonded construction Mounting position: Any Weight: 0.24 gram
DO-214AB
MECHANICAL DATA
* Epoxy: Device has UL flammability classification 94V-O
0.125 (3.17) 0.115 (2.92) 0.280 (7.11) 0.260 (6.60) 0.245 (6.22) 0.220 (5.59)
0.103 (2.62) 0.079 (2.06) 0.060 (1.52) 0.030 (0.76) 0.320 (8.13) 0.305 (7.75)
MAXIMUM RATINGS (At T A = 25 oC unless otherwise noted) RATINGS Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current at Derating Lead Temperature Peak Forward Surge Current 8.3 ms single half sine-wave superimposed on rated load (JEDEC method) Typical Thermal Resistance (Note 1) Typical Junction Capacitance (Note 2) Operating Temperature Range Storage Temperature Range SYMBOL VRRM VRMS VDC IO I FSM RJA CJ TJ T STG FM420 20 14 20 FM430 30 21 30 4.0 90 25 200 -55 to + 125 -55 to + 150 FM440 40 28 40 UNITS Volts Volts Volts Amps Amps
0
C/ W pF
0 0
C C
ELECTRICAL CHARACTERISTICS (At TA = 25oC unless otherwise noted) CHARACTERISTICS Maximum Instantaneous Forward Voltage at 4.0A DC Maximum Average Reverse Current at Rated DC Blocking Voltage @T A = 25 o C @T A = 100 o C SYMBOL VF IR FM420 FM430 .55 2.0 20 FM440 UNITS Volts mAmps mAmps 2002-4
NOTES : 1. Thermal Resistance (Junction to Ambient). 2. Measured at 1 MHz and applied reverse voltage of 4.0 volts. 3. P.C.B Monuted with 0.4X0.4 (10.0X10.0mm 2) copper pad area.
5.0
TJ = 125
1.0
4.0
Single Phase Half Wave 60Hz Resistive of Inductive LoadP.C.B Mounted on 0.4X0.4"(10X10mm) copper pad areas
TJ = 75
3.0
.1
2.0
TJ = 25
.01
1.0
0 0
INSTANTANEOUS FORWARD CURRENT, (A)
20
40
60
80
100
120
140
10
200 100 50 20 10 5
1.0
.1
.2
40
FIG. 5 - MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT 120 105 90 75 60 45 30 15 1 2 5 10 20 50 NUMBER OF CYCLE AT 60Hz 100
TL = 75 8.3ms Single Half Sine-Wave (JEDEC Method)
RECTRON