R3.0 Product Overview Student Handout 6-12-2007

DIGITAL OPTICAL NETWORK
PRODUCT OVERVIEW
Revision June 2007 Revision A Software Release: 3.0
Infinera Corporation 169 Java Drive Sunnyvale, CA. 94089 www.infinera.com + 1-408-572-5200
Copyright
2007 Infinera Corporation. All rights reserved. This Manual is the property of Infinera Corporation and is confidential. No part of this Manual may be reproduced for any purposes or transmitted in any form to any third party without the express written consent of Infinera. Infinera makes no warranties or representations, expressed or implied, of any kind relative to the information or any portion thereof contained in this Manual or its adaptation or use, and assumes no responsibility or liability of any kind, including, but not limited to, indirect, special, consequential or incidental damages, (1) for any errors or inaccuracies contained in the information or (2) arising from the adaptation or use of the information or any portion thereof including any application of software referenced or utilized in the Manual. The information in this Manual is subject to change without notice.
Trademarks
Infinera and Infinera Digital Optical Network are trademarks of Infinera Corporation. GoAhead is a trademark of GoAhead Software, Inc. All other trademarks in this Manual are the property of their respective owners.
Infinera DTN and Infinera Optical Line Amplifier Regulatory Compliance

FCC Class A
This device complies with Part 15 of the FCC rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. Modifying the equipment without Infinera's written authorization may result in the equipment no longer complying with FCC requirements for Class A digital devices. In that event, your right to use the equipment may be limited by FCC regulations, and you may be required to correct any interference to radio or television communications at your own expense.
DOC Class A
This digital apparatus does not exceed the Class A limits for radio noise emissions from digital apparatus as set out in the interference-causing equipment standard titled "Digital Apparatus," ICES-003 of the Department of Communications. Cet appareil numrique respecte les limites de bruits radiolectriques applicables aux appareils numriques de Classe A prescrites dans la norme sur le matriel brouilleur: "Appareils Numriques," NMB-003 dicte par le Ministre des Communications.
Warning
This is a class A product. In a domestic environment this product may cause radio interference in which case the user may be required to take adequate measures.
FDA
This product complies with the DHHS Rules 21 CFR Subchapter J, Section 1040.10, Applicable at date of manufacture.
Page ii-i
DIGITAL OPTICAL NETWORK

PRODUCT OVERVIEW
COURSE OUTLINE
June 2007 Revision A Software Release: 3.0 COURSE DESCRIPTION
This training course is designed for the student who needs an introduction into the capabilities of the Infinera Digital Optical Network. Students are provided detailed information on the following topics: System Architecture Chassis Capabilities Hardware functions and features Theory of Operations Software functions and features
LEARNING OBJECTIVES
Upon successful completion of this course, the student should be able to: Describe the functions of Infineras PIC List the capabilities of the DTN and the Optical Line Amplifier Describe the network applications and topologies supported by the DTN/Optical Line Amplifier List the capabilities of the DTC/OTC Describe the functions and features of the hardware modules for the DTC/OTC Describe the power feeds for the DTC Describe the vertical cooling method used in the DTC Describe the functions of the DTC/OTC control plane
Infinera Corporation
Infinera Proprietary and Confidential
Product Overview
Release 3.0
Page ii-ii
List the components of the control plane for the DTC and the OTC List the components of the data plane for the DTC Describe the system architecture for the DTN and the Optical Line Amplifier List the functions and features of the software available for the DTN/Optical Line Amplifier
COURSE CONDITIONS
There are a maximum of 12 students Students are issued training texts Lectures are presented with projector displays This course is 100% lecture
PREREQUISITES
To be successful in this course, students should have the following skills and knowledge: An understanding of fiber optics and digital communications technology Experience with telecommunications systems Experience with a graphical user interface such as a browser Knowledge of Dense Wavelength Division Multiplexing (DWDM), Synchronous Optical Network (SONET), Synchronous Digital Hierarchy (SDH), and Gigabit Ethernet (GbE)
TIME
The average time for this training course is 1 day.
COURSE OUTLINE
1. Introduction and Administration
a. b. c. a. b. c.

Class Introductions Safety Administrative paperwork Functions of the PIC Infinera Digital Optical Network DTN Capabilities 800Gbps capacity GMPLS G.709 Digital Wrapper
2. System Architecture
Product Overview
Release 3.0
Page ii-iii
Client signal transport transparency Multiple client signal support O-E-O regeneration Multiple configuration support Add/Drop capabilities Multi-chassis capabilities Digital link reach Topology support Protection capabilities Restoration capabilities Enhanced troubleshooting capabilities Redundant control plane Optical Line Amplifier Capabilities Chapter Review DTN chassis overview Components of the DTC
d. e. a. b.

3. Hardware Overview
Rack mount ears Grounding Power Entry Module(s) (PEM) Input Output (I/O) Panel Timing and Alarm Panel (TAP) Fan Trays Air Filter Card cage DTC Modules Management Control Modules (MCM) Tributary Optical Modules (TOMs) Tributary Adapter Modules (TAMs) Digital Line Module (DLM) TAM Extender Module (TEM) Bandwidth Multiplexing Modules (BMM) Optical Line Amplifier chassis overview Components of the OTC
c.

d. e.

Rack mount ears Grounding Power Entry Module(s) (PEM)
Product Overview
Release 3.0
Page ii-iv
Input/Alarm Panel Fan Trays Air Filter Card cage OTC Modules Optical Management Module (OMM) Optical Amplifier Modules (OAM) Dispersion Management Chassis Dispersion Compensation Module Chapter Review DTN Power and Cooling Control Plane
f.

g.
h. a. b.

4. Theory of Operations
Network Level DTN Control Plane Components DTN Control Plane DTN Redundant Control Plane NCT cable configurations Optical Line Amplifier Control Plane Components Optical Line Amplifier Control Plane Optical Line Amplifier Redundant Control Plane Data Plane System data plane architecture Digital Terminal Configuration Digital Repeater Configuration Digital Add/Drop Configuration Multi-Chassis Configuration Optical Line Amplifier Signal Flow Chapter Review
c.

d. e. f.
5. Software Overview
a. b. c. d.
Infinera Graphical Node Manager (GNM) Infinera Digital Network Administrator (DNA) TL-1 Chapter Review
Product Overview
Release 3.0
Page ii-v
6. Course Review
Product Overview
Release 3.0
Page ii-vi
Product Overview
Release 3.0
Page 1-1
Section 1 Section 2 Section 3 Section 4
System Architecture Hardware Overview Theory of Operations Software Overview
Product Overview
Release 3.0
Page 1-2
Slide-6 System Architecture - Chapter Learning Objectives
Slide-7 Infineras Breakthrough Technology
Product Overview
Release 3.0
System Architecture
Page 1-3
System Architecture
CHAPTER LEARNING OBJECTIVES
Upon successful completion of this chapter, the student should be able to: Describe the functions of Infineras Photonic Integrated Circuit (PIC) List the capabilities of the DTN and the Optical Line Amplifier. Describe the network topologies that the DTN and the Optical Line Amplifier can be deployed in.
NOTES:
INFINERAS BREAKTHROUGH TECHNOLOGY

Infinera has introduced the first optical platform based on Photonic Integrated Circuits combines DWDM scalability, digital bandwidth management, and the network intelligence of Generalized Multi-Protocol Label Switching (GMPLS). Integration of >50 discrete optical components on ONE chip set. Lasers Modulators Wavelength Multiplexers Demultiplexers Photo detectors Dramatic Capital Expenditure (CapEx) reduction Simplify Network Operations, Engineering, and Operations 100Gbps Dense Wavelength Division Multiplexer on one chip set 8 versions of PIC chip sets provide up to 80 channels of 10Gbs Enables ultra low cost Optical-Electrical-Optical (OEO) conversion
Product Overview
Release 3.0
Page 1-4
System Architecture
Slide-8 PIC Chip Set Features - Transmit PIC
Slide-9 PIC Chip Set Features - Receive PIC
Product Overview
Release 3.0
System Architecture
Page 1-5
EACH PIC CHIP SET FEATURES A TRANSMIT (TX) AND RECEIVE (RCV) PIC PIC CHIP SET FEATURES - TRANSMIT PIC
Infinera currently produces eight different TX PICs. Each TX PIC creates 10 separate 10G wavelengths, then multiplexes the 10 wavelengths into one 100Gbps signal. With just 8 chips, Infinera provides the user 80 individual 10G channels! Each Transmit PIC chip features: 10 x DWDM lasers 10 x 10G DWDM modulators 10 x lambda DWDM multiplexer
NOTES:
PIC CHIP SET FEATURES - RECEIVE PIC

Infinera currently produces eight different RCV PICs. Each RCV PIC receives the signal from a TX PIC and demultiplexes the 100G signal into 10 individual 10G wavelengths. Each Receive PIC chip features: 10 x 10G receivers 10 lambda DWDM de-multiplexer
Product Overview
Release 3.0
Page 1-6
System Architecture
Slide-10 PIC Chip Set Facts
Slide-11 Infineras Digital Optical Network
Product Overview
Release 3.0
System Architecture
Page 1-7
PIC CHIP SET FACTS

Each PIC chip set provides 100Gbps DWDM 10 separate channels at 10Gbps per channel There are 8 separate PIC chip sets Each PIC chip set is installed in one circuit pack With just 8 circuit packs (each including a PIC chip set) Infinera provides the user with 800Gbps DWDM capability that fits in just one rack.
NOTES:
INFINERA DIGITAL OPTICAL NETWORK CAPABILITIES

Infinera offers Digital Optical Networking Systems which help carriers build Digital Optical Networks. The Infinera DTN is the first Digital Optical Networking System which provides digital add/drop and bandwidth management capabilities. In addition, Infinera Optical Line Amplifiers are provided to extend the optical reach between the DTNs. The DTN and Optical Line Amplifier network elements provide similar system interfaces, data plane and control plane functions providing ease of use and deployment. The Infinera Digital Optical Network allows the construction of a single unified optical transport network that scales from metro to long haul applications.
Product Overview
Release 3.0
Page 1-8
System Architecture
Slide-12 DTN Capabilities Overview
Slide-13 DTN 800Gbps Capacity
Product Overview
Release 3.0
System Architecture
Page 1-9
DTN CAPABILITIES OVERVIEW

800Gbps capacity GMPLS G.709 digital wrapper Client signal transport transparency Multiple client signal support O-E-O regeneration Multiple configuration support Add/Drop capabilities Multi-chassis capabilities Digital link reach Topology support Protection capabilities Restoration capabilities Enhanced troubleshooting capabilities Redundant control plane
NOTES:
DTN 800GBPS CAPACITY

400 Gbps per chassis Deployed in 100Gbps Optical Carrier Group (OCG) increments Up to 80 channels 10Gbps per channel Multiplexed into 800Gbps Optical Transport Signal (OTS) per fiber pair
Product Overview
Release 3.0
Page 1-10
System Architecture
Slide-14 GMPLS
Slide-15 G.709 Digital Wrapper
Product Overview
Release 3.0
System Architecture
Page 1-11
GMPLS
Multi-protocol Label Switching (MPLS) is utilized to speed up packet forwarding and provide for traffic engineering in Internet Protocol (IP) networks. Generalized MPLS (GMPLS) extends MPLS to provide the control plane (signaling and routing) for devices that switch in any of these domains: packet; time; wavelength; fiber. This common control plane promises to simplify network operation and management by automating end-to-end provisioning of connections, managing network resources, and providing the level of Quality of Service (QoS) that is expected in the new, sophisticated applications.
NOTES:
G.709 DIGITAL WRAPPER

The digital wrapper universally encapsulates client signals for transport across the Digital Optical Network The Digital Transport Frame (DTF) is based on G.709 Optical Transport Unit (OTU) format that includes: Trib DTF Facilitates SONET and SDH like maintenance operations Forward Error Correction (FEC) overhead Facilitates SONET and SDH like maintenance operations
Line DTF
Product Overview
Release 3.0
Page 1-12
System Architecture
Slide-16 Transport Transparency
Slide-17 Client Signal Support
Product Overview
Release 3.0
System Architecture
Page 1-13
CLIENT SIGNAL TRANSPORT TRANSPARENCY

Native client signals are carried through the multiple transport layers of the Digital Transport Network with complete service transparency.
NOTES:
DTN CLIENT SIGNAL SUPPORT

The DTN provides client (tributary) signal support for most common signal rates and types including: Synchronous Optical Networks (SONET) OC-192 Synchronous Digital Hierarchy (SDH) STM-64 10 Gigabit Ethernet (GbE) LAN 10 Gigabit Ethernet (GbE) WAN 10 Gigabit Clear Channel 2.5 (2.488) Gigabit Clear Channel SONET OC-48. SDH STM-16 SONET OC-12 SDH STM-4 SONET OC-3 SDH STM-1 1Gigabit Ethernet
Product Overview
Release 3.0
Page 1-14
System Architecture
Slide-18 O-E-O Regeneration
Slide-19 DTN Configurations
Product Overview
Release 3.0
System Architecture
Page 1-15
O-E-O REGENERATION
Full Optical-Electrical-Optical (O-E-O) 4R regeneration of every channel at every DTN 4R Re-amplify Reshape Retime Re-FEC
NOTES:
The 4R is performed at the DTF level
DTN CONFIGURATIONS
Supported configurations include: Digital Terminal (DT) Add-Drop (AD) Digital repeater (DR) Note: The default configuration for a newly commissioned DTN will be Digital Optical Node (DON). Configuration support is based on equipment installed in the DTN, not software Equipment can be added in-service to change functionality and capability All configurations are supported using the same software load.
Product Overview
Release 3.0
Page 1-16
System Architecture
Slide-20 Add/Drop Capabilities
Slide-21 Multi-Chassis Capabilities
Product Overview
Release 3.0
System Architecture
Page 1-17
ADD/DROP CAPABILITIES
The DTN provides a means for direct access to client data at wavelength (10Gbps, 2.5Gbps, and 1Gbps) granularity at any site, allowing flexible selection of whether to multiplex, add/drop, amplify, groom, or wavelength interchange individual channels. The Infinera DTN is the first Digital Optical Networking System which provides 0 to 100 percent digital add/drop and bandwidth management capabilities at every DTN.
NOTES:
MULTI-CHASSIS CAPABILITIES
No matter the number of individual chassis interconnected, the DTN functions, reports, and is managed as a single Network Element (NE). The DTN supports numerous multi-chassis configurations 2 to 10 chassis configurations are supported
Product Overview
Release 3.0
Page 1-18
System Architecture
Slide-22 DTN Digital Link
Digital Link defined as DTN to DTN

Span fiber link between NEs
Optical Line Amplifiers used to extend the Digital Link Up to 7 Optical Line Amplifiers between DTNs Infineras Digital Optical Network components can recover an average of approximately (~) 26db per span for up to 8 spans
Up to 7 Optical Line Amplifiers per Digital Link maximum
Digital Link Span

~26db drop ~26db drop ~26db drop ~26db drop ~26db drop ~26db drop
8 x 26 Digital Link
Slide-23 Optical Transport Layers
Product Overview
Release 3.0
System Architecture
Page 1-19
DTN DIGITAL LINK

Digital Link - Defined as DTN to DTN Span - fiber link between network elements Optical Line Amplifiers used to extend the digital link Up to 7 Optical Line Amplifiers between DTNs Infineras Digital Optical Network components can recover an average of approximately(~) 26db per span for up to 8 spans
NOTES:
OPTICAL TRANSPORT LAYERS

There are four Optical Transport layers employed in the Digital Optical Network: Optical Transport Section Optical Mux Section (C-band) (OMSb) Optical Mux Section (OCG) (OMSa) Optical Channel
Product Overview
Release 3.0
Page 1-20
System Architecture
Slide-24 Topology Support
Slide-25 Point-to-Point Topology T
Product Overview
Release 3.0
System Architecture
Page 1-21
TOPOLOGY SUPPORT
Point-to-Point Single Span Multiple Span Linear Add/Drop Hub and Spoke Ring Mesh
NOTES:
POINT-TO-POINT
The basic deployment is an un-protected point-to-point network. The point-to-point network consists of two DTNs, each configured as a Digital Terminal (DT), connecting two sites in the network. Depending on the distance of the route, the fiber loss and the potential for customer access at intermediate sites along the route, an optimal selection of Optical Line Amplifiers and DTNs can be included in the route.
Product Overview
Release 3.0
Page 1-22
System Architecture
Slide-26 Linear Add/Drop Topology
Slide-27 Hub and Spoke Topology
Product Overview
Release 3.0
System Architecture
Page 1-23
LINEAR ADD-DROP
A linear add/drop network is an extension of the point-to-point network configuration. Multiple point-to-point segments are concatenated and traffic is added, dropped, or passed through at the intermediate sites. A point-to-point network can be upgraded in-service to a linear add/drop network by populating the appropriate interfaces at the Digital Repeater (DR) site or at the Digital Terminal (DT) site.
NOTES:
HUB AND SPOKE

A hub and spoke network configuration is an extension of the linear add/ drop network configuration where one or more linear add/drop spokeroutes junction through a single location, with traffic switched between the spoke-routes. Each add/drop spoke-route can be at an arbitrary distance, effectively extending the reach of the add/drop to the appropriate termination location.
Product Overview
Release 3.0
Page 1-24
System Architecture
Slide-28 Ring Topology
Slide-29 Mesh Topology
Product Overview
Release 3.0
System Architecture
Page 1-25
RING
A ring network is a special case of a linear add/drop network where two Digital Terminal nodes are replaced by a single Digital Add/Drop node. So, a digital optical ring network consists of DTNs configured to perform add/drop function and interconnected in a ring topology. As with all other network configurations, a linear add/drop network is in-service upgradeable to a ring network. Infineras digital optical ring network eliminates the distance limitations on ring circumference. This allows the digital optical ring to be used in metro applications and core network applications
NOTES:
MESH
A mesh network is a special case where there are multiple paths to every destination. As with all other network configurations, a linear add/drop network is in-service upgradeable to a mesh network.
Product Overview
Release 3.0
Page 1-26
System Architecture
Slide-30 Digital SNCP Protection Capabilities
Slide-31 Dynamic GMPLS Circuit Restoration
Product Overview
Release 3.0
System Architecture
Page 1-27
PROTECTION CAPABILITIES DIGITAL SUB-NETWORK CONNECTION PROTECTION (SNCP)

Client (tributary) side protection Physical Y-cable optical splitter Functions like 1+1 User selectable Revertive / Non-revertive Provisionable Wait-to-Restore period (5--12 minutes, default 5 minutes)
NOTES:
RESTORATION CAPABILITIES DYNAMIC GMPLS CIRCUIT RESTORATION

Topologies supported Linear Ring Mesh Triggers Loss of light (LOL) Loss of signal (LOS) Equipment failure Restoration activity Determines alternate path bandwidth availability Reroutes SNCs utilizing available bandwidth Non-revertive
Product Overview
Release 3.0
Page 1-28
System Architecture
Slide-32 Enhanced Troubleshooting Capabilities
Slide-33 Performance Monitoring Checkpoints
Product Overview
Release 3.0
System Architecture
Page 1-29
ENHANCED TROUBLESHOOTING CAPABILITIES

The DTN provides industry leading troubleshooting capabilities by providing: Numerous Performance Monitoring (PM) checkpoints Multiple loopback insertion points
NOTES:
PERFORMANCE MONITORING CHECKPOINTS

Client Optical Tx - Rx Client Electrical (Digital) Tx - Rx DTF Path DTF Line Digital Channel Optical Channel OCG OSC OTS Note: The TEM does not provide PMs.
Product Overview
Release 3.0
Page 1-30
System Architecture
Slide-34 Loopback Insertion Points
Slide-35 Redundant Control Plane
Product Overview
Release 3.0
System Architecture
Page 1-31
LOOPBACK INSERTION POINTS

Infinera defines a Facility Loopback as a loopback that returns to the closest fiber, and a Terminal Loopback as a loopback that faces back across equipment. There are 4 loopback insertion points 1 - Client Tributary Facility 2 - Client Tributary Terminal 3 - DTF Path Terminal 4 - DTF Line Facility
NOTES:
REDUNDANT CONTROL PLANE

The Management Control Module (MCM-B) supports both redundant and non-redundant control plane configurations A redundant configuration provides protection for: Remote management Communications Software Database
Product Overview
Release 3.0
Page 1-32
System Architecture
Slide-36 Optical Line Amplifier Capabilities
Slide-37 Chapter Review
Product Overview
Release 3.0
System Architecture
Page 1-33
OPTICAL LINE AMPLIFIER CAPABILITIES

Amplifies the combined optical signal (bidirectional) Extends the optical reach between the DTNs Redundant control plane Deployed where client access is not anticipated
NOTES:
Product Overview
Release 3.0
Page 1-34
System Architecture
Chapter Review
Photonic Integrated Circuit (PIC): 1. Integration of ___________ discrete optical components on ONE chip set. Dramatic CapEx reductions __________________ service anywhere Simplify Network Architecture Simplify Engineering and Operations
2. __________________ Dense Wavelength Division Multiplexer on one chip set. 3. Enables ultra low cost ___________________________________ conversion 4. Two PIC chip set features: Transmit PIC _______ x DWDM lasers 10 x 10G DWDM modulators 10 x lambda DWDM multiplexer Receive PIC 10 x 10G receivers _______ lambda DWDM de-multiplexer DTN capabilities: 1. _______ Gbps capacity. 2. _______ Gbps capacity per chassis deployed in 100Gbps ___________ ____________ _________ (OCG) increments. 3. Generalized ___________________ ________________ _________________. 4. G.709 __________ ___________. 5. Client signal transport _________________________. 6. Signal support for:
a. b. c. d. e. f. g. h. i.
__________________________________________ Synchronous Digital Hierarchy (SDH) STM-64 10Gigabit Ethernet (GbE) _______ 10Gigabit Ethernet (GbE) _______ 10 Gigabit ___________ _______________ ______ (2.488) Gigabit Clear Channel SONET __________ SDH STM ________ ________ OC-12
Product Overview
Release 3.0
System Architecture
Page 1-35
j. k. l. m.
7. 8. 9. 10. 11.
_______ STM-4 SONET ______ SDH ________ 1Gigabit _____________
Optical-________________-Optical (O-_-O) regeneration on every channel. ______ channels at 10Gbps capacity per channel. __________________ capability at each DTN. Enhanced performance monitoring (PM) and troubleshooting capabilities Configurations include: Digital Terminal (DT). ______________ (AD). Digital Repeater (____). ____________ Chassis ____________ Chassis
12. Multi-Chassis Configuration
13. Network Topologies
a. b. c. d. e.
Point-to-Point _______________ Span Point-to-Point _______________ Span Linear __________________ ________________________ ________________________
Optical Line Amplifier capabilities 1. Amplifies the combined optical signal (______________) 2. Extend the ______________________between the DTNs 3. Optical Line Amplifiers are deployed where client access is ______________________________.
Product Overview
Release 3.0
Page 1-36
System Architecture
Product Overview
Release 3.0
Hardware Overview
Page 2-1
Hardware Overview
NOTES:
Product Overview
Release 3.0
Page 2-2
Hardware Overview
Slide-1 Hardware Overview Chapter Learning Objectives
Slide-2 DTN
Product Overview
Release 3.0
Hardware Overview
Page 2-3
Hardware Overview
Upon successful completion of this chapter, the student should be able to: Describe the functions and features of the hardware modules for the DTC. Describe the functions and features of the hardware modules for the OTC.
NOTES:
DIGITAL TRANSPORT CHASSIS (DTC)

1. Functional description
a. b. c.
Digital Transport Chassis (DTC) Deployed as a Main Chassis or an Expansion Chassis Functions as a: Digital Terminal (DT) Add-Drop (AD) Digital Repeater (DR)
d. e. f. g.
800Gbps bidirectional line side capacity 400Gbps tributary add/drop capacity Installed in a 23 rack or a 600mmx600mm European Telecommunication Standards Institute (ETSI) rack Seven slot card cage
Product Overview
Release 3.0
Page 2-4
Hardware Overview
Slide-3 DTC Components
Slide-4 Chassis
Product Overview
Release 3.0
Hardware Overview
Page 2-5
COMPONENTS OF THE DTC

Chassis Rack Mounting Ears Grounding Points Power Entry Modules (PEM) Input/Output (I/O) Panel Timing and Alarm Panel (TAP) Fan Trays AIr Filter Card Cage
NOTES:
CHASSIS
The DTC Chassis is: ANSI certified ETSI certified Weight - 78lbs (empty) Fans removed Door removed Top Cover removed 2 person lift 2 DTCs can be installed in standard 7 rack
Product Overview
Release 3.0
Page 2-6
Hardware Overview
Slide-5 Rack Mount Ears
Slide-6 Rack Grounding
Product Overview
Release 3.0
Hardware Overview
Page 2-7
RACK MOUNTING EARS

Each DTC includes front rack mounting ears as an integral part of the chassis. They are utilized to front mount the chassis in a 23 rack or 600mmx600mm ETSI rack. Separate mid-mount ears are provided to allow the chassis to mount 1, 2, 5, and 6 forward from the front of the 23 rack.
NOTES:
GROUNDING POINTS
There are 4 grounding points Two on the rear of the chassis One on each side of the chassis
Note: Although there are multiple grounding points, only one should be connected to achieve proper grounding of the DTC.
Product Overview
Release 3.0
Page 2-8
Hardware Overview
Slide-7 PEM
Product Overview
Release 3.0
Hardware Overview
Page 2-9
POWER ENTRY MODULES (PEM)

The DTC accommodates two Power Entry Modules PEM A on the left front PEM B on the right front The PEMs supply redundant power feeds to the DTC PEMs are configured for load sharing. Each PEM has a 70 AMP breaker for over-current protection. The PEMs have two status Light Emitting Diodes (LED)
NOTES:
a. b.
Power Input Power Fault.
The LEDs indicate whether the power levels are within specified limits.
Table 1: PEM Status LEDs
TECHNICAL SPECIFICATIONS Each PEM is dual-lugged and shielded around the faceplate permitter. Electrical Power Consumption 50 W Circuit Breaker Rating 70 A Operating Temperature range Normal 5C to 40 C Short Term -5C to 55c (134f)
Product Overview
Release 3.0
Page 2-10
Hardware Overview
Slide-8 IO Panel
Product Overview
Release 3.0
Hardware Overview
Page 2-11
INPUT OUTPUT (I/O) PANEL

The I/O panel contains the management and operations interfaces Two 10/100Mb auto-negotiating Data Communication Network (DCN) RJ-45 interfaces Two 10Mb Administrative Inter-LAN RJ-45 interfaces, labeled as AUX interface Chassis level alarm LEDs (Critical, Major, Minor, Power) Bay level alarm LEDs (Critical, Major, Minor) Four inter-chassis interconnect RJ-45 interfaces referred to as Nodal Control and Timing Lamp Test button ACO button ACO LED Craft RS232 Modem port Note: The DCN and AUX ports are not supported on an Expansion Chassis.
NOTES:
The I/O panel Bay level LEDs reflect the status of all chassis in a bay. Table 2: I/O Panel Bay Level LEDs
The I/O panel Chassis level LEDs reflect the severities of the current outstanding alarms within that chassis.
Product Overview
Release 3.0
Page 2-12
Hardware Overview
Slide-9 TAP
Product Overview
Release 3.0
Hardware Overview
Page 2-13
Table 3: I/O Panel Chassis Level LEDs
NOTES:
TIMING ALARM PANEL (TAP)

The TAP provides interfaces for external timing synchronization and environmental alarm contacts. The TAP provides Building Integrated Timing Supply (BITS) input and output timing interfaces. Note: External timing synchronization is not supported at this time. The TAP also houses 20 alarm input contact-sets. Sixteen alarm input contact sets are user configurable. The rest are reserved for Bay LED and ACO inputs from Expansion Chassis(s). The TAP houses 20 alarm output contact-sets. Each output alarm contact set consists of normally-closed, normally-open and common contacts. Ten output contacts are user configurable. The rest are reserved for office alarms and Bay alarms.
Product Overview
Release 3.0
Page 2-14
Hardware Overview
Slide-10 Fan Tray
Slide-11 Air Filter
Product Overview
Release 3.0
Hardware Overview
Page 2-15
FAN TRAY
The DTC contains two removable fan trays - 11lbs each Each fan tray consists of 3 individually controlled fans The top fan tray is Fan Shelf A The bottom fan tray is Fan Shelf B Both fan trays are required for normal operations and are not redundant Each fan tray is marked with This Side Up to ensure proper installation Power Fault Table 4: Fan Tray LEDs
NOTES:
Each Fan Tray has two LEDs
AIR FILTER
A replacable air filter is located below the bottom fan tray to filter out dust particles at the air intake of the DTC. Air is filtered at 80% dust arrestance. Depending upon the operational environment, the air filters should be replaced at regular intervals, preferably once every 6 months.
Product Overview
Release 3.0
Page 2-16
Hardware Overview
Slide-12 Card Cage
Slide-13 DTC Components
Product Overview
Release 3.0
Hardware Overview
Page 2-17
CARD CAGE
The DTC contains a single card cage with seven slots that house up to eight modules.
NOTES:
DTC COMPONENTS
Chassis Rack Mount Ears PEMs IO Panel TAP Fan Tray Air Filter Card Cage
Product Overview
Release 3.0
Page 2-18
Hardware Overview
Slide-14 DTC Modules
Slide-15 MCM-B
Product Overview
Release 3.0
Hardware Overview
Page 2-19
DTC MODULES
Management Control Module (MCM) Tributary Optical Module (TOM) Tributary Adapter Module (TAM) Digital Line Module (DLM) TAM Extender Module (TEM) Bandwidth Multiplexer Module (BMM)
NOTES:
MANAGEMENT CONTROL MODULE (MCM-B)

The MCM-B, is a half height module that slides into the chassis in slot 7A or slot 7B. The MCM-B is the shelf controller of all the modules resident within the DTC.The functions are: In a multi-chassis configuration, the MCM-B in the Main Chassis controls all the chassis within the DTN (Node Controller) In an Expansion Chassis, the MCM-B performs shelf controller functions controlling only the modules resident within that chassis (Shelf Controller) Management gateway functions to the external DCN in the Main Chassis Contains the software, and the database for the DTN Can be deployed in a non-redundant (single MCM) or redundant (Active/Standby) configuration Note: Only MCM-Bs in a Main Chassis will maintain the database. MCM-Bs housed in an Expansion Chassis will not contain a database. The MCM-Bs in the Main Chassis and Expansion Chassis are interconnected through NCT ports located on the I/O Panel. The MCM-B supports the local craft interfaces for local management access. For high-availability, redundant MCM-Bs can be deployed in a DTC. One MCM-B actively performs the node/shelf control functions while the other MCM-B is in the standby mode. In a multi-chassis configuration, the interconnected redundant MCM-Bs provide the inter-chassis redundancy.
Product Overview
Release 3.0
Page 2-20
Hardware Overview
Slide-16 MCM-B
Slide-17 MCM LEDs
Product Overview
Release 3.0
Hardware Overview
Page 2-21
Note: In a Multi-Chassis configuration, the DCN and AUX ports on the I/O panel of the Main Chassis are active. The DCN and AUX ports on the I/O panel of an Expansion Chassis are disabled. The MCM has the circuit pack status LED indicators and Craft Ethernet/ Serial port connectors on the front panel The MCM-B parameters are: 466Mhz processor 1G NVS 512 SDRAM Single Chassis Multi-Chassis Non-redundant Single MCM An MCM will be installed in both 7A and 7B Redundant
NOTES:
The MCM-B can be deployed in the below configurations
The MCM-B has four circuit pack level LEDs Power (PWR) Node Controller (NC) Active (ACT) Fault (FLT)
Product Overview
Release 3.0
Page 2-22
Hardware Overview
Slide-18 MCM Faceplate
Product Overview
Release 3.0
Hardware Overview
Page 2-23
Note: On the ACT MCM in the Main Chassis, the PWR, NC and ACT LEDs will be solid green. On the STBY MCM the PWR LED will be solid green and the ACT LED will be solid amber. On the ACT MCM in an Expansion Chassis, the PWR and ACT LEDs will be solid green. On the STBY MCM in an Expansion Chassis, the PWR LED will be green and the ACT LED will be amber.
NOTES:
Table 2-1: MCM Circuit Pack Level LEDs
The MCM has Craft Ethernet and Serial Ports for management purposes. Table 2-2: MCM Craft Connectors
Product Overview
Release 3.0
Page 2-24
Hardware Overview
Slide-19 Tributary Optical Modules
TOM-10G-SR1 TOM-10G-IR2 TOM-10G-LR2 1550nm TOM-2.5G-SR1 TOM-2.5G-IR1 TOM-2.5G-IR2 TOM-2.5G-LR2 1550nm TOM-2.5GMR-IR1 TOM-1G-ZX 1550nm TOM-1G-LX TOM-1G-SX 850nm (multimode)
All TOMs have LC connectors Provide client signal interface Client signals are fully transparent TOMs operate at 1310nm except where otherwise noted
Slide-20 TOM-10G-x
Product Overview
Release 3.0
Hardware Overview
Page 2-25
TRIBUTARY OPTICAL MODULES (TOMS)

All TOMs convert the client optical signals to and from a serial electrical signal. All TOMs have LC connectors. The TOMs supported are: TOM-10G-SR1 TOM-10G-IR2 TOM-10G-LR2A - 1550nm TOM-2.5G-SR1 TOM-2.5G-IR1 TOM-2.5G-LR2 - 1550nm TOM-2.5GMR-IR1 TOM-1G-ZX - 1550nm TOM-1G-LX TOM-1G-SX - 850nm
NOTES:
TOM-10G-X
Has signal support for: OC-192 STM64 10G Clear channel 10G LAN 10G WAN
Product Overview
Release 3.0
Page 2-26
Hardware Overview
Slide-21 TOM-2.5G-x
Slide-22 TOM-2.5GMR-x
Product Overview
Release 3.0
Hardware Overview
Page 2-27
TOM-2.5G-X
Has signal support for: OC-48 STM16 2.488G Clear Channel
NOTES:
TOM-2.5GMR-X
Has signal support for: OC-48 STM16 2.488G Clear Channel OC-12 STM4 OC-3 STM1
Product Overview
Release 3.0
Page 2-28
Hardware Overview
Slide-23 TOM-1G-x
Product Overview
Release 3.0
Hardware Overview
Page 2-29
TOM-1G-X
Has signal support for: 1G Ethernet
NOTES:
Product Overview
Release 3.0
Page 2-30
Hardware Overview
Slide-24 Tributary Adapter Module
Slide-25 TAM-4-2.5G
Product Overview
Release 3.0
Hardware Overview
Page 2-31
TRIBUTARY ADAPTER MODULES (TAMS)

There are four types of TAMs TAM-4-2.5G TAM-4-1G TAM-8-1G TAM-2-10G Create and terminate the Trib DTF, and house TOMs
NOTES:
All TAMs:
TAM-4-2.5G
The 2.5G Tributary Adapter Module, referred to as the TAM-4-2.5G, maps the client optical signals into digital signals for subsequent transmission through the DLM. Installed in any of the sub-slots in the DLM or TEM Each TAM-4-2.5G has four sub-slots for Tributary Optical Modules 2.5G (TOM-2.5G) Maps client signals into electrical signals Maximum capacity of 10Gbps per TAM-4-2.5G 2.5Gbps per TOM Four TOM-2.5Gs per TAM-4-2.5G The TAM-4-2.5G has three circuit pack level LEDs
a. b. c.
Power (PWR) Active (ACT) Fault (FLT) Table 3: TAM-4-2.5G Circuit Pack Level LEDs
In addition to TAM circuit pack status indicators, it houses the TOM-2.5G circuit pack LEDs: Table 4: TOM-2.5G Port Level LEDs
Product Overview
Release 3.0
Page 2-32
Hardware Overview
Slide-26 TAM-4-1G
An y sub -slot any D L M /TE M 4 ports S upports TO M -1G -LX TO M -1G -S X TO M -1G -ZX C ircuit pack LE D s TO M port LE D s -- O nly the faceplate labeling differentiate the T AM -4-1G from the T AM -4-2.5G .
Product Overview
Release 3.0
Hardware Overview
Page 2-33
TAM-4-1G
The Tributary Adapter Module 1G, referred to as TAM-4-1G, maps the customer client ethernet signals into internal electrical signals for subsequent transmission through the DLM. The TAM-4-1G circuit packs can be arbitrarily equipped in any of the sub-slots located on the DLM or TEM. TAM-4-1Gs provide further sub-slots to enable the insertion of TOMs. TAM-4-1G supports 1GbE client interfaces. It does not support 1GbE multiplexing, rather each 1GbE client signal is mapped into a 2.5G subchannel. The TAM-4-1G has 3 LEDs to indicate the circuit pack status. Table 5: TAM-4-1G status LED indicators
LED Indicator PWR (Power) ACT (Active) FLT (Fault) Color Green Green / Yellow Red Meaning Indicates the presence (lit) or absence (dimmed) of power supply to the TAM-4-1G circuit pack Indicates the TAM-4-1G circuit pack status: Active or Standby Indicates the presence (lit) or absence (dimmed) of an alarm on the TAM-4-1G circuit pack: Critical, Major or Minor
NOTES:
In addition to TAM circuit pack status indicators, the TAM-4-1G houses the TOM-1G circuit pack LEDs: ACT (Active), FLT (Fault) and LOS, one set for each TOM. The significance of an illuminated LED is described in the table below. Table 6: TOM-1G-LX status indicators
LED ACT (Active) FLT (Fault) LOS Color Green / Yellow Red Red Description Indicates the TOM status: Active, Standby or Not provisioned Indicates the presence (lit) or absence (dimmed) of a fault on the TOM Indicates the detection of LOS signal on the TOM
Product Overview
Release 3.0
Page 2-34
Hardware Overview
Slide-27 TAM-8-1G
Any sub-slot any DLM/TEM 8 ports 4 independent port pairs 1a, 1b 2a, 2b 3a, 3b 4a, 4b Supports TOM-1G-LX TOM-1G-SX TOM-1G-ZX Circuit pack LEDs TOM port LEDs
Product Overview
Release 3.0
Hardware Overview
Page 2-35
TRIBUTARY ADAPTER MODULE 8-1G (TAM-81G)

The Tributary Adapter Module-8-1G, referred to as TAM-8-1G, maps the customer client ethernet signals into sub-SNC internal electrical signals for subsequent transmission through the DLM. The TAM-8-1G circuit packs can be arbitrarily equipped in any of the sub-slots located on the DLM or TEM. TAM-8-1Gs provide sub-slots equipped in 4 logical port pairs to enable the insertion of TOMs. TAM-8-1G supports 1GbE client interfaces. It does not support 1GbE multiplexing, rather each 1GbE client sub-SNC signal pair (1a and 1b for example) is mapped into a channelized 2.5G sub-channel. The TAM-8-1G has 3 LEDs to indicate the circuit pack status. Table 7: TAM-4-1G status LED indicators
LED Indicator PWR (Power) ACT (Active) FLT (Fault) Color Green Green / Yellow Red Meaning Indicates the presence (lit) or absence (dimmed) of power supply to the TAM-4-1G circuit pack Indicates the TAM-4-1G circuit pack status: Active or Standby Indicates the presence (lit) or absence (dimmed) of an alarm on the TAM-4-1G circuit pack: Critical, Major or Minor
NOTES:
In addition to TAM circuit pack status indicators, the TAM-8-1G houses the TOM-1G circuit pack LEDs: ACT (Active), FLT (Fault) and LOS, one set for each TOM. The significance of an illuminated LED is described in the table below. Table 8: TOM-1G-LX status indicators
LED ACT (Active) FLT (Fault) LOS Color Green / Yellow Red Red Description Indicates the TOM status: Active, Standby or Not provisioned Indicates the presence (lit) or absence (dimmed) of a fault on the TOM Indicates the detection of LOS signal on the TOM
Product Overview
Release 3.0
Page 2-36
Hardware Overview
Slide-28 TAM-2-10G
Product Overview
Release 3.0
Hardware Overview
Page 2-37
TRIBUTARY ADAPTER MODULE 10G (TAM-210G)

a. b. c. d. e.
Installed in any of the sub-slots in the DLM or TEM Each TAM-2-10G has two sub-slots for Tributary Optical Modules 10G (TOM-10G) FRU Maps client signals into electrical signals Maximum capacity of 20Gbps per TAM-2-10G 10Gbps per TOM Two TOM-10Gs per TAM-2-10G
NOTES:
The TAM-2-10G has three circuit pack level LEDs
a. b. c.
Power (PWR) Active (ACT) Fault (FLT) Table 9: TAM-2-10G Circuit Pack Level LEDs
The TAM-2-10G has three port level indicators
a. b. c.
Active (ACT) Fault (FLT) Loss of Signal (LOS)
Table 10: TAM-2-10G Port Level LEDs
Product Overview
Release 3.0
Page 2-38
Hardware Overview
Slide-29 DLM
Product Overview
Release 3.0
Hardware Overview
Page 2-39
DIGITAL LINE MODULE (DLM)

The Digital Line Module (DLM-n-C1-A), performs the following functions: Provides add/drop or switching of 2.5Gb/s, 10Gb/s, or 1Gb/s signals between TAMs, wavelengths on the OCG uplink, and peered DLMs, and TEMs across the backplane Contains five subslots in order to house TAMs TAM-2-10G TAM-4-2.5G TAM-4-1G TAM-8-1G Maps the client signals from the TAMs into the Line Digital Transport Frame (Line DTF) that are transmitted and received from the OCG OUT and OCG IN links on each DLM Codes and decodes the Forward Error Correction (FEC) signal for each wavelength of the OCG transmitted through the Tx and Rx Photonic Integrated Circuits (PICs) Multiplexes the 10 individual wavelengths into an OCG through the Tx PIC De-multiplexes the OCG into 10 individual wavelengths through the RX PIC Optically connects to the appropriate BMM for transmission over the facility line side Contains mechanical modifications to accommodate future double-height TAM Provides add/drop or switching of 2.5Gb/s, 10Gb/s, or 1Gb/s signals between TAMs, wavelengths on the OCG uplink, and peered DLMs, and TEMs across the backplane Contains subslots in order to house TAMs Double height TAM (future) TAM-2-10G TAM-4-2.5G TAM-4-1G TAM-8-1G Maps the client signals from the TAMs into the Digital Transport Frame (DTF) that are transmitted and received from the OCG OUT and OCG IN links on each DLM
NOTES:
The Digital Line Module (DLM-n-Cn-x), performs the following functions:
Product Overview
Release 3.0
Page 2-40
Hardware Overview
Slide-30
DLM Versions
Product Overview
Release 3.0
Hardware Overview
Page 2-41
Codes and decodes the Forward Error Correction (FEC) signal for each wavelength of the OCG transmitted through the Tx and Rx Photonic Integrated Circuits (PICs) Multiplexes the 10 individual wavelengths into an OCG through the Tx PIC De-multiplexes the OCG into 10 individual wavelengths through the RX PIC Optically connects to the appropriate BMM for transmission over the facility line side Wider dispersion in order to increase distance between regeneration
NOTES:
DLM VERSIONS
Any version of the DLM can be equipped in slots 3 through 6. Note: DLM versions must be mirrored on opposite ends of the digital link. There are sixteen versions of the DLM supporting eight OCGs. Table 11: DLM product details
Product Number DLM-1-C1-A DLM-1-C1-B DLM-1-C2-A DLM-2-C2-A DLM-3-C1-A DLM-3-C1-B DLM-3-C2-A DLM-4-C2-A DLM-5-C1-A DLM-5-C1-B DLM-5-C2-A DLM-6-C2-A DLM-7-C1-A DLM-7-C1-B DLM-7-C2-A DLM-8-C2-A Product Description DLM, OCG 1, C-Band DLM, OCG 1, C-Band DLM, OCG 1, C-Band DLM, OCG 2, C-Band DLM, OCG 3, C-Band DLM, OCG 3, C-Band DLM, OCG 3, C-Band DLM, OCG 4, C-Band DLM, OCG 5, C-Band DLM, OCG 5, C-Band DLM, OCG 5, C-Band DLM, OCG 6, C-Band DLM, OCG 7, C-Band DLM, OCG 7, C-Band DLM, OCG 7, C-Band DLM, OCG 8, C-Band
Product Overview
Release 3.0
Page 2-42
Hardware Overview
Slide-31 DLM Connectors
Slide-32 DLM LEDs
Product Overview
Release 3.0
Hardware Overview
Page 2-43
The DLM has two fiber connectors. The fiber connections are SC connectors.
NOTES:
a. a. b. c.
The DLM has Line IN and Line OUT connectors to the BMM Power (PWR) Active (ACT) Fault (FLT)
The DLM has three circuit pack level LEDs:
Table 12: DLM Circuit Pack LEDs
The DLM has two port level LEDs:
a. b.
Active (ACT) LOS (Loss of Signal)
Table 13: DLM Port LEDs
Product Overview
Release 3.0
Page 2-44
Hardware Overview
Product Overview
Release 3.0
Hardware Overview
Page 2-45
Optical Specifications for the DLM Table 14: DLM Optical Specifications
NOTES:
Type DLM-1 DLM-2 DLM-3 DLM-4 DLM-5 DLM-6 DLM-7 DLM-8
Parameter Frequency range OCG1 Output power level Frequency range OCG2 Output power level Frequency range OCG3 Output power level Frequency range OCG4 Output power level Frequency range OCG5 Output power level Frequency range OCG6 Output power level Frequency range OCG7 Output power level Frequency range OCG8 Output power level
Specification 1548.915nm - 1563.455nm -13.8dBm to -12.5dBm 1548.515nm - 1563.047nm -13.8dBm to -12.5dBm 1548.115nm - 1562.640nm -13.8dBm to -12.5dBm 1547.715nm - 1562.233nm -13.8dBm to -12.5dBm 1531.507nm - 1545.720nm -13.8dBm to -12.5dBm 1531.116nm - 1545.322nm -13.8dBm to -12.5dBm 1530.334nm - 1544.526nm -13.8dBm to -12.5dBm 1530.725nm - 1544.924nm -13.8dBm to -12.5dBm
Product Overview
Release 3.0
Page 2-46
Hardware Overview
Slide-33 TEM
Product Overview
Release 3.0
Hardware Overview
Page 2-47
TAM EXTENDER MODULE (TEM)

The TEM provides additional TAM slots for a DLM so the bandwidth of a DLM may be fully utilized. The application of a TEM is more visible for lower density TAM-4-2.5G and TAM-4-1G. A DLM populated with either TAM will not be able to utilize the complete OCG bandwidth of 100Gbs. Each TEM provides an additional five subslots for TAMs which will enable: Up to 100% add/drop of 2.5G traffic using TAM-4-2.5G per OCG Up to 50% add/drop of 1GbE traffic using TAM-4-1G per OCG Add/drop or cross-connect of 2.5Gbs, 10Gbs, or 1Gbs signals between TAMs, and corresponding DLMs across the backplane Contains subslots in order to house TAMs Double height TAM (future) TAM-2-10G TAM-4-2.5G TAM-4-1G TAM-8-1G A TEM can be equipped in slots 3 through 6. The TEM is designed to work with DLMs in corresponding slots. Valid slot combinations are listed in the table below. Table 15: TEM, DLM valid slot combinations
DLM slot 3 4 Valid TEM slot 4, 5, 6a 3, 5, 6 DLM slot 5 6 Valid TEM slot 3, 4, 6 3, 4, 5
NOTES:
Each TEM provides the following:
a. TEM slots in bold are indirect slot configurations where a cross-connect takes two hops between DLM and TEM.
Product Overview
Release 3.0
Page 2-48
Hardware Overview
Slide-34 TEM LEDs
Product Overview
Release 3.0
Hardware Overview
Page 2-49
Circuit Pack Level LEDs The TEM has 3 LEDs to indicate the circuit pack status. The significance of an illuminated LED is described in the table below.
NOTES:
Table 16: TEM status LED indicators

LED Indicator PWR (Power) Color Green Meaning Indicates the presence (lit) or absence (dimmed) of power supply to the TEM Indicates the circuit pack status: Solid green (Active), blinking amber (In maintenance state), and dimmed (Locked state) Indicates the presence (lit) or absence (dimmed) of an alarm on the circuit pack: Critical, Major or Minor
ACT (Active)
Green / Amber
FLT (Fault)
Red
Product Overview
Release 3.0
Page 2-50
Hardware Overview
Slide-35 BMM
Product Overview
Release 3.0
Hardware Overview
Page 2-51
BAND MUX MODULE (BMM)

There are 9 different BMM types that provide Optical Carrier Group (OCG) multiplexing/de-multiplexing, EDFA gain, and with/without midstage access. Which type of BMM will be deployed is dependent on the span loss on the transmit (TX) side.
NOTES:
BMM FUNCTIONAL DESCRIPTION

There is a set of BMMs that supports four OCGs in the C band with L band expansion capable. There is another set of BMMs that supports four OCGs in the C band but with no L band expansion. These are currently at the -A revision but have the same functions as the -B version of the BMM-4-Cn. A BMM performs the following functions: Optically multiplexes up to 8 10x10Gb DWDM channels from the DLMs, known as Optical Carrier Groups (OCGs), onto the line side facility OCGs 1-8can be optically multiplexed by the BMM Optically de-multiplexes the OCGs from the line side facility into 10x10Gb DWDM channels, and passes them to local DLMs OCGs 1-8 can be optically de-multiplexed by the BMM Provides optical insertion and extraction of the 1510nm Optical Supervisory Channel by using a 1510nm optical filter Optically amplifies the multiplexed transmitted and received OCG signals by using either an optical booster or a pre-amplifier Provides a C/L-band splitter to support an in-service expansion of the system to enable optical transmission in the L-band (in some versions) Provides the following Optical Spectrum Analyzer (OSA) ports for test purposes: OSA port for the aggregate line input OSA port for the receive EDFA output OSA port for the aggregate line output Provides sub-slot access for the OWM (future provision) Accommodates mid-stage access Dispersion Compensation Fiber (DCF) (in some versions)
Product Overview
Release 3.0
Page 2-52
Hardware Overview
Slide-36 BMM Versions
Product Overview
Release 3.0
Hardware Overview
Page 2-53
NOTES: Table 17: BMM Versions

Product Number BMM-4-C1-B Product Description BMM, C/L band, supports span losses from 0 to 20 dB, with VOA, without mid-stage access, supports OCGs 1,3,5,and 7 BMM, C band, supports span losses from 0 to 21 dB, with VOA, without mid-stage access, supports OCGs 1,3,5,and 7 BMM, high power, C band, supports span losses from 0 to 20 dB, with VOA, without mid-stage access, supports OCGs 1-8 BMM, C/L band, supports span losses from 19 dB to 26 dB, with mid-stage access, supports OCGs 1,3,5,and 7 BMM, C band, supports span losses from 20 dB to 27.5 dB, with mid-stage access, supports OCGs 1,3,5,and 7 BMM, high power, C band, supports span losses from 19 dB to 26.5 dB, with mid-stage access, supports OCGs 1-8 BMM, C/L band, supports span losses from 25 dB to 34 dB, with mid-stage access, supports OCGs 1,3,5,and 7 BMM, C band, supports span losses from 26 dB to 34 dB, with mid-stage access, supports OCGs 1,3,5,and 7 BMM, high power, C band, supports span losses from 25 dB to 34 dB, with mid-stage access, supports OCGs 1-8
BMM-4-CX1-A
BMM-8-CXH1-A
BMM-4-C2-MS-B
BMM-4-CX2-MS-A
BMM-8-CXH2-MS-A
BMM-4-C3-MS-B
BMM-4-CX3-MS-A
BMM-8-CXH3-MS-A
Product Overview
Release 3.0
Page 2-54
Hardware Overview
Slide-37 BMM LEDs
Product Overview
Release 3.0
Hardware Overview
Page 2-55
:The gain ranges for the different BMM types are listed below
BMM Type C1 CX1 CXH1 C2 CX2 CXH2 C3 CX3 CXH3 0-20 0-21 0-20 19-26 20-27.5 19-26.5 25-34 26-34 25-34 BMM Span Loss Range (dB)
NOTES:
BMM LEDS
The BMM has three circuit pack level LEDs to indicate the circuit pack status Power (PWR) Active (ACT) Fault (FLT)
Table 18: BMM Circuit Pack Level LEDs
The BMM has two port level LEDs to indicate the status of the combined optical signal Active (ACT) Loss of Signal (LOS) Table 19: BMM Line Connector LEDs
Product Overview
Release 3.0
Page 2-56
Hardware Overview
Slide-38 BMM Connectors
Slide-39 BMM OCG Connectors
Product Overview
Release 3.0
Hardware Overview
Page 2-57
BMM CONNECTORS
The BMM has many fiber connectors. All the fiber connections are SC connectors. Line connectors Optical Spectrum Analyzer (OSA) monitor connector for line input and output OSA monitor port for facility output L-Band connectors (not present on all BMMs) Dispersion Compensation Module (DCM) connectors (not present on all BMMs) OCG 1 connectors OCG 2 connectors OCG 3 connectors OCG 4 connectors OCG 5 connectors OCG 6 connectors OCG 7 connectors OCG 8 connectors
NOTES:
Product Overview
Release 3.0
Page 2-58
Hardware Overview
Slide-40 BMM Optical Specifications
Product Overview
Release 3.0
Hardware Overview
Page 2-59
BMM OPTICAL SPECIFICATIONS

40 Channel BMM (Cn and CXn versions) Line Side Optics Wavelength spacing 100GHZ
1530.725-1563.455nm ITU grid
NOTES:
Wavelength frequency range 80 Channel BMM (Cn and CXn versions) Line Side Optics Wavelength spacing 50GHZ
1530.334-1563.455nm ITU grid
Wavelength frequency range OSC (all versions) Optical Supervisory Channel Wavelength Format OC-3 100Mbps. Throughput 1510 nm
Blank Circuit Packs

Whenever a circuit pack is removed, the blank space must be occupied by the corresponding blank circuit pack. Blank circuit packs serve three important functions: Prevents exposure to hazardous voltage and currents inside the chassis Contains any electromagnetic interference (EMI) that might damage other equipment Directs the flow of cooling air through the chassis.
Product Overview
Release 3.0
Page 2-60
Hardware Overview
Figure 1-41. DTC and Components
Product Overview
Release 3.0
Hardware Overview
Page 2-61
DTC AND COMPONENTS

DTC Modules MCM TOM TAM DLM TEM BMM
NOTES:
Product Overview
Release 3.0
Page 2-62
Hardware Overview
Slide-42 Optical Transport Chassis
Slide-43 OTC Components
Product Overview
Release 3.0
Hardware Overview
Page 2-63
OPTICAL TRANSPORT CHASSIS

Functional Description Optical Transport Chassis (OTC) Bi-directional in-line amplifier used to extend the optical reach of the DTN Deployed where client access is not anticipated Note: The OTC does not support multi-chassis configuration(s).
NOTES:
OTC COMPONENTS
Rack Mount Grounding PEM IAP Fan Tray Air Filter Card Cage
Product Overview
Release 3.0
Page 2-64
Hardware Overview
Slide-44 OTC Chassis
Slide-45 Rack Mount
Product Overview
Release 3.0
Hardware Overview
Page 2-65
OTC CHASSIS
Weight ~ 50lbs - empty Front Cover removed Fans removed ANSI compliant ETSI compliant
NOTES:
Rack Mount
Each OTC includes front rack mounting ears as an integral part of the chassis. They are utilized to front mount the chassis in a 23 rack or 600mmx600mm ETSI rack. Separate mid-mount ears are provided to allow the chassis to mount 1, 2, 5, and 6 forward from the front of the 23 rack.
Product Overview
Release 3.0
Page 2-66
Hardware Overview
Slide-46 OTC Grounding
Four grounding points

Right rear Left rear Each Side
Although there are multiple grounding points, only one should be connected to achieve proper grounding of the OTC
Slide-47 OTC PEM
Product Overview
Release 3.0
Hardware Overview
Page 2-67
GROUNDING POINTS
There are 4 grounding points Two on the rear of the chassis One on each side of the chassis
NOTES:
Note: Although there are multiple grounding points, only one should be connected to achieve proper grounding of the OTC.
POWER ENTRY MODULE (PEM)

Each OTC is equipped with 2 PEMs PEM A is located on the front left PEM B is located on the front right PEMs supply redundant power to the OTC Note: PEMs require a third party PDU with 10 AMP fuses per PEM. PEMs are configured for load sharing
Technical Specifications Each PEM is dual-lugged and shielded around the faceplate permitter. Electrical Power Consumption 20 W Input voltage range -40 to -60 VDC Operating Temperature Range Normal 5C to 40 C Short Term -5C to 55c
PEM LEDS
The PEM has two status LEDs Power Input Power Fault
Product Overview
Release 3.0
Page 2-68
Hardware Overview
Figure 1-48. I/O Alarm Panel Face Plate
Product Overview
Release 3.0
Hardware Overview
Page 2-69
I/O Alarm Panel (IAP)

The I/O Alarm panel contains the management and operations interfaces plus environmental alarm input/output contacts Two 10/100Mb auto-negotiating Data Communication Network (DCN) RJ-45 interfaces Two 10Mb Administrative Inter-LAN RJ-45 interfaces, labeled as AUX interface. Chassis level alarm LEDs (Critical, Major, Minor, Power) Bay level alarm LEDs (Critical, Major, Minor) Four inter-chassis interconnect RJ-45 interfaces referred to as Nodal Control and Timing Lamp Test button ACO button ACO LED Craft RS232 Modem port
NOTES:
Note: The OTC does not support multi-chassis configuration(s). The Nodal Control and Timing RJ-45 ports are disabled on all OTCs. The I/O Alarm panel Chassis level LEDs reflect the severities of the current outstanding alarms within the chassis.
ALARM INPUT CONTACTS There are 20 alarm input contacts. One Alarm contact is pre-defined and the nineteen other are user configurable alarm contacts. The user configurable alarm contacts are useful for generation of customized alarms which can be triggered remotely through the network management system. ALARM OUTPUT CONTACTS There are 20 alarm output contacts. Ten alarm contacts are pre-defined in the system and the ten other contacts user configurable. The ten user configurable contacts can be used to monitor the environmental alarms.
Product Overview
Release 3.0
Page 2-70
Hardware Overview
Slide-49 Fan Trays
Slide-50 Air Filter
Product Overview
Release 3.0
Hardware Overview
Page 2-71
Fan Tray
The OTC contains two removable fan trays, one on the left and one on the right. Each fan tray consists of an individually controlled fan. The left fan tray is Fan Shelf A The right fan tray is Fan Shelf B. Both fan trays are required for normal operations and are not redundant. Each Fan Tray has two LEDs
NOTES:
a. b.
Power Fault
Air Filter
An air filter is located beside the right fan tray (Fan B) to filter out dust particles at the air intake of the OTC. Air is filtered at 80% dust arrestance. Depending upon the operational environment, the air filter should be replaced at regular intervals, preferably once every 6 months.
Card Cage
The OTC contains a single card cage that has three slots.
Product Overview
Release 3.0
Page 2-72
Hardware Overview
Figure 1-51. OTC and Components
Slide-52 OTC Modules
Product Overview
Release 3.0
Hardware Overview
Page 2-73
OTC Components
Rack Mounting Ears IAP PEMs Fan Trays Air Filter Card Cage
NOTES:
OTC Modules
1. Optical Management Module (OMM) 2. Optical Amplifier Module (OAM)
Product Overview
Release 3.0
Page 2-74
Hardware Overview
Slide-53 OMM
Slide-54 OMM LEDs
Product Overview
Release 3.0
Hardware Overview
Page 2-75
Optical Management Module (OMM)

a. b. c. d. e. f. g. h.
Installed in slot 1A or 1B Half height module Shelf controller for all modules in the OTC Each OTC must have one OMM Supports redundant and non-redundant configurations Contains the network element software and database OMM supports the local craft interfaces for local management access May be deployed in a redundant or non-redundant configuration
NOTES:
The OMM has four circuit pack level LEDs
a. b. c. d.
Power (PWR) Node Controller (NC) Active (ACT) Fault (FLT)
Note: The OTC does not support multi-chassis configuration(s). Thus, the Node Controller LED should be green (lit).
The OMM has Craft Ethernet and Craft Serial Ports for management purposes.
Product Overview
Release 3.0
Page 2-76
Hardware Overview
Slide-55 OMM Faceplate
Slide-56 OAM
Product Overview
Release 3.0
Hardware Overview
Page 2-77
OMM Faceplate
Ejector RS232 Serial port Ethernet port LEDs
NOTES:
Optical Amplifier Module (OAM)

There are 9 different OAM types providing different EDFA gain and with/ without mid-stage access. Which OAM will be deployed is dependent on the span loss on the transmit (TX) side.
OAM Functional Description

The OAM can be equipped in slot 2 and/or 3 of the OTC. Note: Two OAMs are required in an OTC to perform bi-directional optical amplification. There is a set of OAMs that amplifies in the C band with L band expansion capable. There is another set of OAMs that amplifies in the C band but with no L band expansion. These are currently at the -A revision but have the same functions as the -B version of the OAM-Cn. An OAM performs the following functions: Provides optical insertion and extraction of the 1510nm Optical Supervisory Channel by using a 1510nm optical filter Optically amplifies the multiplexed transmitted and received signals by using either an optical booster or a pre-amplifier Provides a C/L-band splitter to support an in-service expansion of the system to enable optical transmission in the L-band (in some versions) Provides Optical Spectrum Analyzer (OSA) ports for test purposes: Provides sub-slot access for the OWM (future provision) Accommodates mid-stage access Dispersion Compensation Fiber (DCF) (in some versions)
Product Overview
Release 3.0
Page 2-78
Hardware Overview
Slide-57 OAM Versions
Product Overview
Release 3.0
Hardware Overview
Page 2-79
The gain ranges for the different OAM types are listed below:
OAM Type C1 C2 CX2, CXH2 C3 CX3, CXH3 OAM Module Gain Range (dB) 0-20 19-26 19-26.5 25-30 25-30.5
NOTES:
Product Overview
Release 3.0
Page 2-80
Hardware Overview
Slide-58 OAM LEDs
Slide-59 OAM Port LEDs
Product Overview
Release 3.0
Hardware Overview
Page 2-81
Circuit Pack Level LEDs

The OAM has three LEDs to indicate the circuit pack status. PWR ACT FLT
NOTES:
Port Indicators
There are two LEDs: ACTIVE and LOS to indicate the line port status LOS to indicate the OSC port status
Product Overview
Release 3.0
Page 2-82
Hardware Overview
Slide-60 OAM Connectors
Slide-61 Optical Line Amplifier and Components
Product Overview
Release 3.0
Hardware Overview
Page 2-83
OAM Connectors
Line DCM (some versions) -L-Band (Cn versions only) OSC OSA monitor ports
NOTES:
Optical Line Amplifier and Components

Rack Mounting Ears PEMs IAP Fan Trays Air filter OMM OAM
Product Overview
Release 3.0
Page 2-84
Hardware Overview
Slide-62 Dispersion Management Chassis
Slide-63 Dispersion Compensation Modules
Product Overview
Release 3.0
Hardware Overview
Page 2-85
NOTES:
Dispersion Management Chassis (DMC)

FUNCTIONAL DESCRIPTION The DMC comprises of a chassis and Dispersion Compensation Modules (DCM) It can be installed in a 23 rack as front mount and 1, 2, 5 and 6 mid-mount or 600mmx600mm ETSI rack. It accommodates up to 2 DCMs
Dispersion Compensation Module (DCM)

The Dispersion Compensation Module, referred to as DCM, is a pluggable module that slides into the Dispersion Management Chassis. It houses Dispersion Compensation Fiber. Supports 19 types of negative DCMs, ranging from 100 ps/nm to 1900 ps/nm in 100 ps/nm increments Supports three types of positive DCMs, ranging from 100 ps/nm to 300 ps/nm.
Product Overview
Release 3.0
Page 2-86
Hardware Overview
Slide-64 DTC Review
Slide-65 OTC Review
Product Overview
Release 3.0
Hardware Overview
Page 2-87
DTC Review
DTC HARDWARE
Rack Mounting Ears PEMs I/O panel Fan Trays Air Filter Card cage
NOTES:
DTC MODULES
MCM TOM TAM DLM TEM BMM
Product Overview
Release 3.0
Page 2-88
Hardware Overview
Chapter Review
DTN CHASSIS
1. Functional description
a. b. c.
Digital Transport Chassis (DTC) Deployed as a _____________ Chassis or an __________________ chassis Functions as a: Digital ____________(___) __________________(___) Digital ________________(DR)
d. e. f. g.
____________ bidirectional line side capacity _________________________ drop capacity Installed in a 23 rack or a 600mmx600mm European Telecommunication Standards Institute (ETSI) rack _____________slot card cage
COMPONENTS OF THE DTC 1. Rack Mounting Ears 2. _____________ grounding points 3. Two ____________________________(___) 4. Input Output (I/O) Panel The I/O panel contains the ____________________________and operations interfaces _______ 10/100Mb auto-negotiating Data Communication Network (DCN) RJ-45 interfaces Two 10Mb Administrative Inter-LAN RJ-45 interfaces, labeled as ________ interface. Chassis level alarm LEDs (_____________________________________________) Bay level alarm LEDs (Critical, Major, Minor) Four inter-chassis interconnect RJ-45 interfaces referred to as Nodal Control and Timing Lamp Test button ACO button ACO LED Craft RS232 Modem port
5. Timing Alarm Panel (TAP) The TAP provides interfaces for __________________________synchronization and __________________________________________ alarm contacts. The TAP provides ___________________________________ timing interfaces. ___________________________________ is not supported in Release 1.0.LT
Product Overview
Release 3.0
Hardware Overview
Page 2-89
6. Fan Tray The DTC contains ____________ removable fan trays. Each fan tray consists of ________________ individually controlled fans. The top fan tray is Fan Shelf A The bottom tray is Fan Shelf B. Both fan trays are ______________________for normal operations and are not redundant. Each Fan Tray has two LEDs
NOTES:
a. b.
7. Air Filter
Power _________________________
8. Card Cage The DTC contains a single card cage that has ______________________slots.
MANAGEMENT CONTROL MODULE (MCM)

a. b. c. d. e. f. g.
Installed in slot ________________________________________ Half height module Field Replaceable Unit (FRU) Shelf controller for all modules in the DTC Each DTC __________________________________________ MCM Contains the _________________________ and ___________________ MCM supports the local craft interfaces for local management access.
BAND MULTIPLEXING MODULE (BMM)

a. b. c.
Installed in slot ______________________________ FRU Optically multiplexes the 10x10Gb DWDM channels, known as __________________________________(_____), onto the line side facility
Product Overview
Release 3.0
Page 2-90
Hardware Overview
d. e. f. g. h. i.
Optically _________________________ the ____________into 10x10Gb DWDM channels. Provides optical insertion and extraction of the 1510nm ________________________________________ Provides optical access points for power monitors or optical spectrum analyzers. Accommodates mid-stage access_________________________________ in 9 versions of BMM Provides sub-slot access for the Order Wire Module (OWM) circuit pack There are _____ different BMM types providing different ______ gain and with/without _________________________________________ (for DCM)
DIGITAL LINE MODULE (DLM)

a. b. c. d. e. f. g. h. i.
Up to _____________________DLMs can be in one DTC Installed in slot _______________________and or _____________ FRU Provides _____________ or ______________________ of client signals Slots for up to _________Tributary Adapter Modules (TAM) or TAM blanks Codes and Decodes the ______________________________________ for each lambda of the OCG Maps and multiplexes the client signals from the TAM into the ______________________________________ Optically connects to the __________for transmitting the OCG on the facility line side There are _____________versions of DLMs
TRIBUTARY ADAPTER MODULE 10G (TAM-10G)

a. b. c. d. e.
Installed in any of the sub-slots in the DLM/TEM Each TAM has __________sub-slots for TOM)-10G FRU Maps client signals into __________________signals Maximum capacity of _______________________ _______________ per TOM-10G _____________ TOMs per TAM
Product Overview
Release 3.0
Hardware Overview
Page 2-91
TAM-4-2.5G
a. b. c. d.
Installed in any of the sub-slots in the DLM/_____ Each TAM has __________sub-slots for TOM-2.5G FRU Maximum capacity of _______________________ _______________ per TOM _____________ TOMs per TAM
NOTES:
TAM-4-1G
a. b. c. d.
Installed in any of the sub-slots in the _____/______ Each TAM has __________sub-slots for TOM-1G-LX FRU Maximum capacity of _______________________ _______________ per TOM _____________ TOMs per TAM
TOM-10G
a.
List two versions of the TOM-10G ________________ ________________
b. c. d. e.
Hot-pluggable into any TAM_______ sub-slot _____________ connectors Converts client signals to and from a _________________________ signal FRU
The TOM-10G tributary interface supports
a. b. c. d. e.
SONET OC-192 ______________________________ 10G _________________ ___________________ 10GbE LAN ____________________________________
Product Overview
Release 3.0
Page 2-92
Hardware Overview
TOM-2.5G
a.
List two versions of the TOM-2.5G ________________ ________________
b. c. d. e.
The TOM-2.5G tributary interface supports
a. b.
SONET OC-______ ______________________________
TOM-1G-X
a. b. c. d.
The TOM-1G-x tributary interface supports
a.
______
OPTICAL TRANSPORT CHASSIS

1. Functional Description
a. b. c. d.
Optical Transport Chassis (OTC) Bidirectional in-line amplifier used to _______________________________of the DTN Deployed where client access is _________________________________ Installed in a 23 rack or a 600mmx600mm European Telecommunication Standards Institute (ETSI) rack
Components of the OTC

1. Rack Mounting Ears 2. __________ grounding points
Product Overview
Release 3.0
Hardware Overview
Page 2-93
3. Two ____________________________(___) 4. I/O Alarm Panel The I/O Alarm panel contains the ________________________ and operations interfaces and _______________________________ alarm input and output contacts ________ 10/100Mb auto-negotiating Data Communication Network (DCN) RJ-45 interfaces Two 10Mb Administrative Inter-LAN RJ-45 interfaces, labeled as _____ interface. Chassis level alarm LEDs (Critical, Major, Minor, Power) Bay level alarm LEDs (Critical, Major, Minor) _________ inter-chassis interconnect RJ-45 interfaces referred to as Nodal Control and Timing Lamp Test button ACO button ACO LED Craft RS232 Modem port
NOTES:
5. Fan Tray The OTC contains ______ removable fan trays, one on the left and one on the right. Each fan tray consists of an __________________________________ controlled fan. The __________________________ fan tray is Fan Shelf A The ______________________________________ tray is Fan Shelf B. Both fan trays are _______________________ for normal operations and are not redundant. Each Fan Tray has two LEDs
a. b.
6. Air Filter
Power Fault
7. Card Cage The OTC contains a single card cage that has three slots.
Product Overview
Release 3.0
Page 2-94
Hardware Overview
OPTICAL MANAGEMENT MODULE (OMM)

a. b. c. d. e. f.
Installed in slot _____or _____ Half height module Shelf ________________________________ for all modules in the OTC Each OTC _______________________________ one OMM Contains the ____________________________ and database OMM supports the local craft interfaces for local management access.
OPTICAL AMPLIFIER MODULE (OAM)

a. b. c. d. e. f. g. h.
Performs ____________________ in-line optical amplification of the incoming signal Provides optical insertion and extraction of the 1510nm Optical Service Channel using a 1510nm optical filter Optically __________________ the multiplexed transmitted and received OCG signals by using either an optical booster or a pre-amplifier Provides a C/L-band splitter to enable an in-service expansion of the system to enable optical transmission in the L-band Provides optical access points for power monitors or optical spectrum analyzers. Accommodates ____________________________ Dispersion Compensation Fiber (DCF) in 6 versions of OAM Provides sub-slot access for the Order Wire Module (OWM) circuit pack ______ OAMs are required in a OTC to perform optical amplification in both directions.
DISPERSION MANAGEMENT CHASSIS (DMC)

FUNCTIONAL DESCRIPTION The DMC comprises of a chassis and _______________________________________ It can be installed in a 23 rack as front mount and 1, 2, 5 and 6 mid-mount or 600mmx600mm ETSI rack. It accommodates up to _____ DCMs
DISPERSION COMPENSATION MODULE (DCM)

The Dispersion Compensation Module, referred to as DCM, is a pluggable module that slides into the Dispersion Management Chassis.
Product Overview
Release 3.0
Hardware Overview
Page 2-95
It houses Dispersion Compensation Fiber. Supports ________ types of negative DCMs, ranging from 100 ps/nm to 1900 ps/nm in 100 ps/nm increments Supports ________ types of positive DCMs, ranging from 100 ps/nm to 300 ps/nm.
NOTES:
Product Overview
Release 3.0
Page 2-96
Hardware Overview
Product Overview
Release 3.0
Theory Of Operations
Page 3-1
Upon successful completion of this chapter, the student should be able to: Describe the power feeds for the Infinera DTN Describe the vertical cooling method used in the Infinera DTN Describe the functions of the control plane List the components of the control plane for the DTC and the OTC List the components of the data plane for the DTC. Describe the system architectures for the DTC and the OTC
NOTES:
Product Overview
Release 3.0
Page 3-2
Slide-105 Power and Cooling
Slide-106 Control Plane Network Level
Product Overview
Release 3.0
Page 3-3
Power
-48V dual feeds Automated power shutdown for under voltage condition The DTN will attempt an automatic restart when voltage goes above -40V The DTN breakers will trip when the applied power exceeds 72V or 70A requiring a manual reset of the breakers
NOTES:
Cooling
The DTN implements a vertical push pull cooling method
Control Plane
The Control Plane is a logical partition of the DTN system at both the network and node level. At a very broad level, the control plane provides: The ability to locally or remotely provision (configure) the network element in accordance with a specific customer application Performance and fault monitoring, the ability to accumulate performance statistics, and the ability to locally or remotely access the collected information
Control Plane Network Level

The Optical Supervisory Channel (OSC) provides inter-node connectivity within the network. The OSC occupies a dedicated OC3 1510NM wavelength for each span between network elements. Each network element, consisting of any combination of DTCs or an OTC is required to terminate the OSC. Management access to network elements from external systems may be provided by direct connection to those systems or through an external switched or routed Data Communications Network (DCN) infrastructure. External access is provided using the DCN ports on the network element. Additional Auxiliary ports (AUX) are provided for communications between customer end-systems. From a hardware standpoint, the AUX and DCN ports simply provide external access to the inter-network element and intra-network element Ethernet/IP infrastructure.
Product Overview
Release 3.0
Page 3-4
Slide-107 Components of the DTN Control Plane
Slide-108 Functions of the DTN Control Plane
Product Overview
Release 3.0
Page 3-5
Components of the DTC Control Plane

The DTN Control Plane is made up of the MCM, TEM, DLM, and BMM modules along with the backplane All of the connections are provided by fixed backplane interconnect. There are Ethernet switches located on each MCM and each BMM. The MCM switch provides both layer 2 switching (including address learning) and layer 3 forwarding. The layer 3 forwarding tables must be explicitly configured by the MCM processor. The switch is capable of switching and layer 3 forwarding between any combination of attached interfaces. The switch located on the BMM provides only switching (including address learning) at layer 2. Its function is to allow access to the MCM switch for the OSC. VLAN tags are passed transparently by this switch. All of the intra-chassis links shown are full-duplex, 100 Mbps Ethernet The Control Plane links performance monitoring, provisioning, and alarm monitoring signals between the modules in slots 1-6 and the MCM
NOTES:
Functions of the DTC Control Plane

Is the internal communications bus within the DTN Operates on an internal LAN within the DTN Carries IP messaging traffic across the backplane between the MCM(s) and line modules including OSC Provides a path for module software downloads Provides a path for PM and Alarm retrieval and reporting Provides a path for provisioning commands
Product Overview
Release 3.0
Page 3-6
Slide-109 DTN Control Plane Block Diagram
Slide-110 DTN Redundant Control PLane
Product Overview
Release 3.0
Page 3-7
DTN Control Plane Block Diagram

The MCM switch/router is responsible for routing all internal and external communications The BMM switch forwards communications sent and received over the OSC Multi-Chassis Interconnect Interfaces
NOTES:
DTN Redundant Control Pane

The DTN redundant control plane employs an active and standby MCM In the event the active MCM fails, the standby MCM will reboot and reestablish internal and external communications
Product Overview
Release 3.0
Page 3-8
Slide-111 Redundant Main Non-redundant Expansion
Slide-112 Redundant Main and Redundant Expansion
Product Overview
Release 3.0
Page 3-9
Redundant Main and Non-redundant on the Expansion

The MCM in an Expansion Chassis communicates with the active MCM in the Main Chassis through the Nodal Control and Timing (NCT) Ethernet cables The MCM in an Expansion Chassis does not maintain a copy of the database Note: The DCN and AUX ports on an Expansion Chassis are disabled.
NOTES:
Redundant Main and Redundant on the Expansion

The active MCM in an Expansion Chassis communicates with the active MCM in the Main Chassis through the Nodal Control and Timing (NCT) Ethernet cables.
Product Overview
Release 3.0
Page 3-10
Slide-113 NCT Cable Configurations
Slide-114 3 Chassis NCT Configuration
Product Overview
Release 3.0
Page 3-11
NCT Cable Configurations

For 3 to10 Chassis configurations with Main Chassis Redundancy, and non-redundant on all Expansion Chassis. The recommended NCT port connections for a DTC system with control redundancy only at the Main Chassis. This mixed-redundancy configuration exhibits the following failure impacts: If the active MCM fails on the Main Chassis, an activity switch to the standby MCM occurs. In this case, all other chassis are still available and reachable from the Main Chassis. A MCM fault of the Expansion Chassis isolates that chassis from the rest of the node and it will be unreachable.
NOTES:
3 Chassis NCT Configuration / Redundant Main Non-Redundant Expansion Chassis

Chassis 1 NCT2B to Chassis 2 NCT1A Chassis 2 NCT2A to Chassis 3 NCT1A Chassis 3 NCT2A to Chassis 1 NCT1A
Product Overview
Release 3.0
Page 3-12
Slide-115 4-10 Chassis NCT Configuration
Slide-116 Optical Line Amplifier Control Plane Components
Product Overview
Release 3.0
Page 3-13
4-10 Chassis NCT Configuration / Redundant Main Non-Redundant Expansion Chassis

Chassis 1 NCT2B to Chassis 2 NCT1A Chassis 2 NCT2A to Chassis 3 NCT1A Chassis 3 NCT2A to Chassis 4 NCT1A Chassis 4 NCT2A to Chassis 1 NCT1A Note: Continue the Daisy Chain connections for up to 10 chassis.
NOTES:
Optical Line Amplifier Control Plane Components

The Optical Line Amplifier Control Plane is made up of the OMM and OAM modules along with the backplane The Control Plane links performance monitoring, provisioning, and alarm monitoring signals between the OAMs in slots 2-3 and the OMM
Product Overview
Release 3.0
Page 3-14
Slide-117 Functions of the Optical Line Amplifier Control Plane
Slide-118 Optical Line Amplifier Control Plane
Product Overview
Release 3.0
Page 3-15
Functions of the Optical Line Amplifier Control Plane

Is the internal communications bus within the OTC Operates on an internal LAN within the OTC Carries IP messaging traffic across the backplane between the OMM(s) and line modules including OSC Provides a path for module software downloads Provides a path for PM and Alarm retrieval and reporting
NOTES:
Optical Line Amplifier Control Plane

The OMM switch/router is responsible for routing all internal and external communications The OAM switch forwards communications sent and received over the OSC
Product Overview
Release 3.0
Page 3-16
Slide-119 Optical Line Amplifier Redundant Control PLane
Product Overview
Release 3.0
Page 3-17
Optical Line Amplifier Redundant Control Plane

The Optical Line Amplifier redundant control plane employs an active and standby OMM In the event the active OMM fails, the standby OMM will reboot and reestablish internal and external communications
NOTES:
Product Overview
Release 3.0
Page 3-18
Slide-120 DTN Data Plane
Slide-121 DTN System Data Plane TOM
Product Overview
Release 3.0
Page 3-19
DTN Data Plane

The DTN Data Plane is utilized to route Digital Transport Frames (DTFs) across the backplane between DLM/TEM Crosspoints. The backplane pins for the data plane are located in slots 3, 4, 5, and 6 where cross-connects can be provisioned.
NOTES:
DTN System Data Plane Architecture TOM

Tributary Optical Module TOM Receive The incoming signal is converted from optical to electrical Transmit -The outgoing signal is converted from electrical to optical Note: Both digital and optical performance monitoring statistics are collected.
Product Overview
Release 3.0
Page 3-20
Slide-122 DTN System Data Plane Architecture TAM
Slide-123 DTN System Data Plane Architecture Crosspoint
Product Overview
Release 3.0
Page 3-21
DTN System data Plane Architecture TAM

The incoming signal from the TOM is wrapped in the Trib DTF and performance data is collected. The outgoing signal to the TOM is stripped of the Trib DTF and performance data is collected.
NOTES:
DTN System data Plane Architecture Crosspoint

A Local DLM Route DTF will pass straight through to the Crosspoint to the Mapper or TAM in 2.5G segments. A DTF to or from an alternate DLM or TEM will be routed across the backplane to the appropriate DLM/TEM Crosspoint and forwarded to the Mapper or TAM in 2.5G segments.
Product Overview
Release 3.0
Page 3-22
Slide-124 DLM Mapper
Slide-125 DLM Photonic Integrated Chip (PIC) Transmit
Product Overview
Release 3.0
Page 3-23
DLM Mapper
The DLM Mapper codes, decodes, and applies the Forward Error Correction algorithm at the DTF level The DTF is then forwarded to the PIC or Crosspoint DTF and FEC performance monitoring statistics are collected
NOTES:
DLM PIC Transmit

The DLM PIC converts the 10G Digital Channel signal from the Mapper from electrical (digital) to a ITU DWDM optical wavelength channel The ten 10G wavelength channels are multiplexed onto a common optical path as a 100G Optical Carrier Group (OCG) Both digital and optical performance monitoring statistics are collected
Product Overview
Release 3.0
Page 3-24
Slide-126 DLM PIC Receive
Slide-127 BMM Transmit
Product Overview
Release 3.0
Page 3-25
DLM PIC Receive

The DLM PIC demultiplexes the 100G OCG into ten 10G Optical Channels (OCh). Each OCh is applied to the appropriate receiver that converts the OCh to a 10G Digital Channel. Both digital and optical performance monitoring statistics are collected.
NOTES:
BMM Transmit
The BMM combines the eight OCGs onto a common optical path creating a 800G C Band signal. The C Band signal is amplified by an Erbium Doped Fiber Amplifier (EDFA), the OC3 Optical Supervisory Channel (OSC) is added creating the Optical Transport Signal (OTS), performance monitoring statistics are collected, and the signal is sent to the Line Out. Both optical and digital OSC performance monitoring statistics are collected.
Product Overview
Release 3.0
Page 3-26
Slide-128 BMM Receive
Slide-129 Add Drop Connection
Product Overview
Release 3.0
Page 3-27
NOTES:
BMM Receive
The 800G OTS is received at the Line In, the OC3 Optical Supervisory Channel (OSC) is removed, dispersion compensation may be applied, and the C Band signal is amplified by an Erbium Doped Fiber Amplifier (EDFA). The BMM then demultiplexes the C Band signal into eight 100G OCGs and each is sent to the appropriate OCG connector.Both optical and digital OSC performance monitoring statistics are collected.
Add Drop Connection

Add/Drop Connection Drop Direction The 800G OTS is received at the Line In, the OSC is stripped and sent to the MCM for processing, the C Band signal is amplified by EDFA, the BMM then demultiplexes the C Band signal into eight 100G OCGs and each is sent through the appropriate OCG connector to the DLM On the DLM, the PIC converts the signal from optical to electrical, the Mapper decodes and applies FEC, and then the signal is routed by the Crosspoint to the provisioned outbound DLM/TEM where the signal from the Crosspoint is sent to the provisioned TAM On the TAM the DTF is stripped and the signal is routed to the appropriate TOM On the TOM the signal is converted from electrical to optical and sent to the client. Note: Add/Drop Connection Add Direction- The flow described above is reversed
Product Overview
Release 3.0
Page 3-28
Slide-130 Express Connection
Slide-131 Hairpin Connection
Product Overview
Release 3.0
Page 3-29
Express Connection
The 800G OTS is received at the Line In, the C Band is amplified by EDFA, the BMM then demultiplexes the eight 100G OCGs and each is sent to the appropriate OCG connector. On the DLM, the PIC converts the signal from optical to electrical, the Mapper decodes and applies FEC, and then the signal is routed by the Crosspoint to the outbound DLM On the outbound DLM the signal comes in from the Crosspoint to the Mapper, new FEC is coded and read into the DTF, then the PIC converts the signal from electrical to optical and multiplexes the OChs into the OCG The BMM combines the eight OCGs onto a common optical path creating the 800G C Band signal The C Band signal is amplified by the EDFA, the OSC is added, and the OTS is sent to the Line Out
NOTES:
Hairpin Connection
On the TOM the signal from the client is converted from optical to electrical and sent to the TAM On the TAM the client signal is wrapped in the DTF and sent to the DLM/TEM On the DLM/TEM, the signal is routed by the Crosspoint to the provisioned outbound DLM/TEM where the signal from the Crosspoint is sent to the provisioned TAM On the TAM the DTF is stripped and the signal is routed to the appropriate TOM On the TOM the signal is converted from electrical to optical and sent to the client
Product Overview
Release 3.0
Page 3-30
Slide-132
Channelized SNC
Slide-133 Digital Terminal
Product Overview
Release 3.0
Page 3-31
Channelized SNC
Channelized cross-connects, and channelized SNCs, associations, and sub-SNCs supported by the TAM-8-1G, which maps two 1GbE circuits to a single 2.5G DTF
NOTES:
Digital Terminal Configuration

Optical transport capacity deployable in OCG increments Client access capacity deployed using individually pluggable TEMs, TAMs and subtending TOMs There is no Express Traffic at a Terminal configuration A Digital Terminal configuration terminates the incoming line side traffic and hands off the traffic to the customer equipment. The DTN can terminate up to 400Gbps per chassis by populating the client side interfaces as and when needed, using TAMs and TOMs.
Product Overview
Release 3.0
Page 3-32
Slide-134 Digital Repeater
Slide-135 Digital Add Drop
Product Overview
Release 3.0
Page 3-33
Digital Repeater
Digital Repeater function deployed in OCG increments Up to 200Gbps in each fiber direction per chassis Paired DLMs with expressed backplane capacity Per-channel PM & fault monitoring There is no Add/Drop traffic at a Repeater configuration
NOTES:
Digital Add Drop

Add/Drop function provides per-channel manageability Full per-channel O-E-O function with PM & fault monitoring Deployed as DLM/TEMs with dynamically configurable switching Adjacent slot grooming prevents channel blocking DLM/TEM to TOM(s) provide service termination & payload monitoring Add/Drop, Hairpin, and Express connection capability
Product Overview
Release 3.0
Page 3-34
Slide-136 System Data Pane Architecture
Slide-137 Multi-Chassis Configurations
Product Overview
Release 3.0
Page 3-35
System Data Plane Architecture

Hairpin Express Add Drop
NOTES:
Multi-Chassis Configurations
Combining up to 24 DLMs and 6 BMMs across 10 chassis provides the user with virtually limitless possible configuration variations and directional support.
Product Overview
Release 3.0
Page 3-36
Slide-138 Optical Line Amplifier Signal Flow
Slide-139 Optical Line Amplifier Configuration
Product Overview
Release 3.0
Page 3-37
NOTES:
Optical Line Amplifier Signal Flow

Each Optical Amplifier Module (OAM) is a unidirectional amplifier One OAM amplifies the Eastbound OTS signal One OAM amplifies the Westbound OTS signal The combined effect is bi-directional amplification of both East and Westbound OTS signals Note: Signal flow through an Optical Line Amplifier is unidirectional.
Optical Line Amplifier Configuration

The Eastbound OTS signal arrives at the IN port, the OSC is stripped off and sent to the OMM for processing, the C Band signal is amplified by the EDFA, then new OSC is coupled onto the C Band, and the combined OTS signal is sent out Eastbound through the Out port. The Westbound OTS signal arrives at the IN port, the OSC is stripped off and sent to the OMM for processing, the C Band signal is amplified by the EDFA, then new OSC is coupled onto the C Band, and the combined OTS signal is sent out Westbound through the Out port.
Product Overview
Release 3.0
Page 3-38
Slide-140 Review
Product Overview
Release 3.0
Page 3-39
Chapter Review
Theory of Operations Power and Cooling Control Plane Data Plane Architecture System Configurations
NOTES:
Product Overview
Release 3.0
Page 3-40
Chapter Review
1. Power: ______________ redundant feeds 2. Cooling: Vertical ____________ _________________ cooling 3. Control Plane
a.
Functions: The ability to locally or remotely ________________ (configure) the NE in accordance with a specific customer application _____________________ and ________________ monitoring, the ability to accumulate _________________________ statistics, and the ability to locally or remotely access the collected information DTC: _________, BMM, __________ OTC: _____________, ______________
b.
Components
4. System Data Plane Architecture components
a. a. b. c. d.
DTC: ___________, TAM, __________, ________________, ______________________ Digital _______________________ Digital Repeater Digital ______________________________ Optical Line Amplifier
5. System Configuration
Product Overview
Release 3.0
Software Overview
Page 4-1
Software Overview
Chapter Learning Objectives
Upon successful completion of this chapter, the student should be able to: List the functions and features of the software available for the DTN/Optical Line Amplifier
NOTES:
Product Overview
Release 3.0
Page 4-2
Software Overview
Slide-142 Graphical Node Manager
G ra p h ic a l N o d e M a n a g e r
B ro w s e r la u n c h e d J a va a p p lic a tio n (c a c h e m a n a g e r)
F a u lt M a n a g e m e n t C o n fig u ra tio n M a n a g e m e n t S e rv ic e P ro v is io n in g P e rfo rm a n c e M o n ito rin g S e c u rity M a n a g e m e n t
Slide-143 Accessing graphical Node Manager
Product Overview
Release 3.0
Software Overview
Page 4-3
Infinera Graphical Node Manager (GNM)

Infinera GNM is a node-level element management application that provides users with on-site access and control of Infinera DTNs and Infinera Optical Line Amplifiers. GNM provides browser-based Java application (cache manager): Fault Management Configuration Management Service Provisioning Performance Management Security Management
NOTES:
Accessing Graphical Node Manager

Open a supported browser Internet Explorer Netscape Mozilla
Type the target network element DCN or craft IP address in the address bar Note: The craft port may require the use of a crossover cable. The Java applet initiates and JAR files are downloaded The following Java 2 Runtime Environments are supported JRE 1.4.2_04 JRE 1.4.2_06 JRE 1.4.2_09 JRE 1.4.2_10 JRE 1.5.0_04 JRE 1.5.0_05 JRE 1.5.0_06
Login screen will appear
Product Overview
Release 3.0
Page 4-4
Software Overview
Slide-144 Login Screens
Product Overview
Release 3.0
Software Overview
Page 4-5
Initial Login Default Username - secadmin Default password - Infinera1 Click Login
NOTES:
Note: Usernames and passwords are case sensitive. Security message is displayed Click OK to continue
Product Overview
Release 3.0
Page 4-6
Software Overview
Slide-145 Change Password
Slide-146 GNM Main View
Product Overview
Release 3.0
Software Overview
Page 4-7
Changing Passwords
Change password on initial login or if password expires: Type current password Type new password Confirm new password Click Apply
NOTES:
Note: Password must be alphanumeric and 6 to 10 characters long.
GNM Main View

On a successful login to the target network element, the GNM Main View is displayed. The GNM Main View provides access to:
a. b. c. d.
Equipment Facilities Tools used to control and monitor the target network element Graphical representation of the network element
GNM Main View

a. b. c. d. e. f. g.
Main Menu Equipment Tree Equipment View Workspace Area Quick View Browser Alarm Manager Status Bar
Product Overview
Release 3.0
Page 4-8
Software Overview
Slide-147 File and Fault management Menus
Slide-148 Configuration Menu
Product Overview
Release 3.0
Software Overview
Page 4-9
Infinera GNM Interface Components File Menu

Contains the drop-down menus.
NOTES:
a.
Exit
Fault management
a. b. c. d. e. f. g.
Alarm Manager Event Log Export all Alarms to file Export all Events to file Export Current View of Alarms to File Export Current View of Events to File Alarm Severity Profile Settings
Configuration
a. b. c. d. e. f. g. h. i. j.
Network Element Create Chassis Create Protection group Equipment Manager Facility Manager Protection Group Manager Link Manager Back Plane Link Manager Static Route Manager Default Templates
Product Overview
Release 3.0
Page 4-10
Software Overview
Slide-149 Provisioning
Slide-150 Security
Product Overview
Release 3.0
Software Overview
Page 4-11
Provisioning
NOTES:
a. b. c. d.
Cross-Connect Manager Circuit Manager Create Cross-Connect Create Circuit
Security
a. b. c. d.
Change Password NE Security Administration Active User Sessions NE-Wide Security Settings
Product Overview
Release 3.0
Page 4-12
Software Overview
Slide-151 Tools Window and Help Menus
Product Overview
Release 3.0
Software Overview
Page 4-13
Tools
Contains the following drop down menus
NOTES:
a. b. c. d. e. f.
SW-DB Manager SW-DB Upload Download Manager PM Upload Scheduler Connectivity Verification Tools TL-1 Session View
Window
a. b.
Cascade Node
Help
a. b. c.
Contents Technical Support About
Product Overview
Release 3.0
Page 4-14
Software Overview
Slide-152 BMM Drop Down Menu
Slide-153
Product Overview
Release 3.0
Software Overview
Page 4-15
The user can right click on any module to access associated drop down menus BMM Menu
a. b. c. d. e. f. g. h. i. j. k. l.
Properties Show Alarms Show Facilities Admin State Alarm Reporting Delete Reset GMPLS Link OSC Span Optical Carrier Group Connectivity Verification Tools
NOTES:
DLM Menu
a. b. c. d. e. f. g. h. i. j. k. l.
Properties Show Alarms Show Facilities Protection Group Manager Admin State Alarm Reporting Delete Reset Provisioning Optical Carrier Group Optical Channels Line DTF Path
Product Overview
Release 3.0
Page 4-16
Software Overview
Slide-154 MCM Menu
Slide-155 TOM Menu
Product Overview
Release 3.0
Software Overview
Page 4-17
MCM Menu
a. b. c. d. e. f. g. h.
Properties Show Alarms Admin State Alarm Reporting Delete Reset Switch over Make Standby
NOTES:
TOM Menu
a. b. c. d. e. f. g. h. i. j. k. l.
Properties Show Alarms Show Facilities Protection Group Manager Admin State Alarm Reporting Delete Provisioning Trib DTF Path Trib Port Client trib termination point Create Protection group
Product Overview
Release 3.0
Page 4-18
Software Overview
Slide-156 Quick View Browser
Slide-157 Equipment Tree
Product Overview
Release 3.0
Software Overview
Page 4-19
Quick View Browser

The Quick View Browser provides summary information about the equipment last selected in the Equipment Tree or the Equipment View.
NOTES:
Equipment Tree
The Equipment Tree provides a hierarchical view of all the equipment contained within the target network element. The Equipment Tree also lists all other nodes in the same signaling domain through the Network Neighborhood. The Equipment Tree displays a tree structure of the following:
a.
Current Network Element View The Current Network Element View displays the target network element and its subequipment. It lists the network elements chassis and other contained equipment in hierarchical format. The Network Neighborhood View lists the network elements within the same signaling domain of the target network element.
b.
Network Neighborhood View
When the user selects an item in the Equipment Tree, it is highlighted in the Equipment View by a black outline. Right-clicking an item displays a shortcut menu.
Product Overview
Release 3.0
Page 4-20
Software Overview
Slide-158 GNM Help
Slide-159 Online Troubleshooting Assistance
Product Overview
Release 3.0
Software Overview
Page 4-21
GNM Help
Context sensitive Search Capable Print capable GNM User Guide and Maintenance and Troubleshooting Guide Access from any screen
NOTES:
GNM Online Troubleshooting Assistance

Double click an alarm or right click and alarm and select Details Click Troubleshoot Associated alarm clearing procedure is displayed
Product Overview
Release 3.0
Page 4-22
Software Overview
Slide-160
Infinera DNA
Browser launched Java application (cache manager)

Fault Management Equipment Configuration Service Provisioning Performance Monitoring Security Administration
Slide-161 DNA Components
Product Overview
Release 3.0
Software Overview
Page 4-23
Infinera Digital Network Administrator (DNA)

The Infinera DNA is a scalable, robust, carrier class element management application based on ITU-T TMN and Telcordia standards. Infinera DNA provides browser based Java application (cache manager):
NOTES:
a. b. c. d. e. a. b. c. d. e.
Fault Management Configuration Management Service Provisioning Performance Management Security Management Network wide real-time fault management and monitoring, including current alarm summary, historical event logs, and threshold crossing alerts Physical and Provisioning topological views, topology updates, auto-discovery and network synchronization Network equipment inventory reporting with comprehensive manufacturing information Scheduling network element configuration backup and manual restoration Historical performance monitoring collection, archiving and viewing
DNA provides advanced features:
The DNA has the following two main components:

a. b.
DNA Server DNA Client
DNA supports Operations, Administration, Maintenance and Provisioning (OAM&P) functions.
Product Overview
Release 3.0
Page 4-24
Software Overview
Slide-162 DNA Main View
Slide-163 DNA Views
Product Overview
Release 3.0
Software Overview
Page 4-25
DNA Main View

On a successful login to the DNA Client, the DNA Main View is displayed. The DNA Main View displays a graphical representation of the network and provides a access to the following:
NOTES:
a. b. c. d. e. f.
Main Menu Equipment Tree Workspace Area Quick View Browser Alarm Manager Status Bar
DNA Views
Topographical View Provisioning View Physical View Quick View Browser Equipment Tree
Product Overview
Release 3.0
Page 4-26
Software Overview
Slide-164 Digital Link and Channel Map Viewers
Slide-165 TL1 Interface
Product Overview
Release 3.0
Software Overview
Page 4-27
Channel Map and Digital Link Viewer

DNA provides exceptional span analysis and performance monitoring tools with the Channel Map Viewer and Digital Link Viewer.
NOTES:
TL1 Interface
Transaction Language 1 (TL1) is an industry-recognized common language protocol for messages exchanged between network elements and an Operating System (OS). The TL1 Interface uses the common language protocol to eliminate the need to support vendor-specific interfaces. The TL1 Interface on the network element allows an operations system to perform the following functions:
a. b. c. d. e.
Fault Management Equipment Configuration Service Provisioning Performance Monitoring Security Administration
Product Overview
Release 3.0
Page 4-28
Software Overview
Chapter Review
INFINERA GRAPHICAL NODE MANAGER (GNM) OVERVIEW
Infinera GNM is a ____________________element management application that provides users with onsite access and control of Infinera DTN Digital Nodes (DTN) and Infinera Optical Line Amplifiers (Optical Line Amplifier).
GNM INTERFACE COMPONENTS

1. 2. 3. 4. 5. 6. 7. Main Menu Equipment Tree ______________________________ View Workplace Area __________________________ Browser Alarm Manager ____________________________________
INFINERA DNA INTERFACE COMPONENTS

1. 2. 3. 4. 5. Main Menu Equipment Tree _______________________________________________ Quickview Browser Status Bar
TL1 INTERFACE
The TL1 Interface on the network element allows operations system to perform the following functions:
a. b. c. d. e.
Fault Management ________________________ Configuration Service Provisioning ____________________________ Monitoring Security Administration
Product Overview
Release 3.0
Appendix A
Acronyms
Table A-1 List of Acronyms
Abbreviation Description
A
ACLI ACO ACT AD ADM ADPCM AGC AID AINS AIS ALS AMP ANSI AO APD API APS ARC ARP application command line interface alarm cutoff active add/drop add/drop multiplexer adaptive differential pulse code modulation automatic gain control access identifier administrative inservice alarm indication signal automatic laser shutdown amplifier American National Standards Institute autonomous output avalanche photo diode application programming interface automatic protection switching alarm reporting control address resolution protocol
Infinera Proprietary and Confidential Release 3.0 Product Overview
Page A-2

Abbreviation ASAP ASE ASIC ATM AU AUX AWG AWG alarm severity assignment profile amplified spontaneous emission application-specific integrated circuit asynchronous transfer mode administrative unit auxiliary port array waveguide gating american wire gauge Description
B
BDFB BDI BDI BEI BER BERT BGA BIP-8 BITS BLSR BMM-C BNC BOL BOM BOOTP bps BPV battery distribution fuse bay backward defect indication backward defect indication backward error indication bit error rate bit error rate testing ball grid array bit interleaved parity building-integrated timing supply bi-directional line switched ring Band Mux Module - C band Bayonet Niell-Concelman; British Naval Connector beginning of life bill of material bootstrap protocol bits per second bipolar violations
C
C CCITT CCLI CDE CDR CDRH Celsius Consultative Committee on International Telegraph and Telephone commissioning command line interface chromatic dispersion equalizer clock and data recovery Center for Devices and Radiological Health
Release 3.0 Product Overview Infinera Proprietary and Confidential
Page A-3

Abbreviation CFR CH/Ch/ch CID CIT CLEI CLI CO CODEC COM CORBA CPC CPE CPLD CPU CRC CSPF CSV CTAG CTP CTTP CTS CV CV-L CV-P CV-S code for federal regulations channel circuit identifier craft interface terminal common language equipment identifier command line interface central office coder and decoder communication common object request broker architecture common processor complex customer premises equipment complex programmable logic device central processing unit cyclic redundancy check constraint-based shortest path first algorithm comma separated value correlation tag channel termination point client tributary termination point clear to send coding violation coding violation-line coding violation-path coding violation-section Description
D
DA DAWN dB DB DCC DCE DCF DCM digital amplifier Digital Amplified Wavelength Network decibel database data communications channel data communications equipment dispersion compensation fiber dispersion compensation module
Page A-4

Abbreviation DCN DEMUX DFB DFE DGE DHCP DLM DMC DPG DR DSF DT DTC DTE DTF DTL DTMF DTP DTS DWDM data communication network de-multiplexing distributed feedback decision feedback equalizer dynamic gain equalization dynamic host configuration protocol digital line module dispersion management chassis datapath protection group digital repeater dispersion shifted fiber digital terminal digital transport chassis data terminal equipment digital transport frame digital transport line dual tone multi frequency digital transport path digital transport section dense wavelength division multiplexing Description
E
EDFA EEPROM EMC EMI EMS EOL ESD ES-L ES-P ES-S ETS ETSI erbium doped fiber amplifier electrically-erasable programmable read only memory electromagnetic compatibility electro-magnetic interference element management system end-of-life electrostatic discharge; electrostatic-sensitive device line-errored seconds path-errored seconds section-errored seconds IEEE european test symposium European Telecommunications Standards Institute
Page A-5

F
F FA FAS FC FCAPS FCC FDA FDI FEC FIFO FIT FLT FPGA FRU FTP fahrenheit frame alignment frame alignment signal fiber channel; failure count fault management, configuration management, accounting, performance monitoring, and security administration Federal Communications Commission (USA) Food and Drug Administration forward defect indication forward error correction first-in-first-out failure in time fault field programmable gate array field replaceable unit file transfer protocol
G
GbE Gbps GCC GFP GHz GMPLS GNE GNM GUI gigabit ethernet gigabits per second general communication channel general framing protocol gigahertz generalized multi protocol label switching gateway network element graphical node manager graphical user interface
H/I
HTML HTTP IAP ICG ID hypertext markup language hypertext transfer protocol input, output and alarm panel invalid code group identification
Page A-6

Abbreviation IDF IEC I/O IOP IP IQ IQ NOS IR IS ITU-T invalid data flag International Electrical Commission Input/Output input output panel Internet protocol see IQ NOS Infinera IQ network operating system intermediate reach in-service International Telecommunications Union - Telecommunications Description
J/K/L
Jabber JDK JRE JS LAN LBC LC LCK LED Linear ADM LOF LOL LOP LOS LR LSB LTE LVDS Jabber is the transmission of a packet on a computer network that is larger than the network's MTU Java Development Kit Java Runtime Environment jabber seconds local area network laser bias current fiber optic cable connector type locked light-emitting diode linear add/drop multiplexer loss of frame loss of light loss of pointer loss of signal long reach least significant bit line-terminating equipment low voltage differential signaling
M
MA MAC MB monitoring access media access control megabyte
Page A-7

Abbreviation Mb/s MIB MCM MEMS MFAS MIB MMF MS MSA MSB MSOH MTBF MTU MX megabits per second management information base management and control module micro electro mechanical systems multi frame alignment signal management information base multimode fiber multiplex section multi source agreement most significant bit multiplex section overhead mean time between failure maximum transmission unit multiplex, multiplexer, multiplexing Description
N
NA NAND NC NCC NCT NDSF NE NEBS NECG NEPA NJO nm NML NMS NNI NO NSA NTP NVRAM network administrator flash type normally closed; node controller node controller chassis nodal control and timing non zero dispersion shifted fiber network engineer network equipment building system net electrical coding gain national fire protection association negative justification opportunity nanometer network management layer network management system network-to-network interface normally open non-service affecting network time protocol nonvolatile random access memory
Page A-8

O
OAM OAM&P OC-12 OC-192 OC-3 OC-48 OCG Och OCI ODU OEO OFC OH OIF OLA OMM OMS OOS OOS-MT OPR OPT OPU ORL OS OSA OSC OSNR OSPF OSS OTC OTDR OTN OTS optical amplification module operation, administration, maintenance and provisioning optical carrier signal at 622.08 mb/s optical carrier signal at 9.95328 gb/s optical carrier signal at 155.52 mb/s optical carrier signal at 2.48832 gb/s optical carrier group Optical channel open connection indication optical channel data unit optical-electrical-optical conversion open fiber control overhead optical internetworking forum optical line amplifier optical management module optical multiplex section out-of-service out-of-service maintenance optical power received optical power transmitted optical channel payload unit optical return loss operating system optical spectrum analyzer optical supervisory channel optical signal-to-noise ratio open shortest path first operations support system optical transport chassis optical time domain reflectometer optical transport network optical transport section
Page A-9

Abbreviation OTU OW OWM optical channel transport unit orderwire orderwire module Description
P/Q
PC PCPM PDU PEM PF PG PHY PIC PID PIN PJO PLD PLL PM PMD POH POP PPM PPP PR PRBS ps PSC PSD PSTN PT PTP PWR QOS personal computer per channel power monitoring protocol data unit; power distribution unit power entry module partial failure protection group physical photonic integrated circuit protocol identifier positive-intrinsic negative positive justification opportunity programmable logic device phase locked loop performance monitoring polarization mode dispersion path overhead point-of-presence part per million point-to-point protocol provisioning pseudo random binary sequence pico second (unit of measure for dispersion) protection switch completion; protection switch count protection switch duration public switched telephone network parallel telemetry physical termination point; point-to-point power quality of service
Page A-10

R
RAM RDI REI-L REI-P RFI ROM RS RSOH RTC RTN RTS RU Rx Rx Q random access memory remote defect indication remote error indication-line remote error indication-path remote failure indication read-only memory regenerator section; reed solomon regenerator section overhead real time clock return lead ready to send rack unit receiver; receive receiver quality
S
SA SAPI SC SD SDH SDRAM SEF SEFS SELV SERDES SES SF SFP SID SMF SML SNC service affecting; security administrator source access point identifier square shaped fiber optic cable connector signal degrade synchronous digital hierarchy synchronized dynamic random access memory severely errored frame severely errored frame second safety extra low voltage serializer and deserializer severely errored seconds signal fail small form factor plug source identifier; system identifier single-mode fiber service management layer subnetwork connection
Page A-11

Abbreviation SNCP SNE SNMP SNR SOH SOL SONET SPE SQ SR SSH SSHv2 SSL STE STM STM-1 STM-16 STM-4 STM-64 STM-n STS STS-n SW subnetwork connection protection subtending network element simple network management protocol signal-to-noise ratio section overhead start of life synchronous optical network synchronous payload envelope signal quality short reach Secure Shell Secure Shell version 2 secure sockets layer section terminating equipment synchronous transfer mode SDH signal at 155.52 Mb/s SDH signal at 2.48832 Gb/s SDH signal at 622.08 Mb/s SDH signal at 10 Gb/s synchronous transport module of level n (for example, STM-64, STM-16) synchronous transport signal synchronous transport signal of level n (for example, STS-12, STS-48) software Description
T/U/V
TAM TAP TCA TCP TE TEC TEM TERM TFTP TID tributary adapter module timing and alarm panel Threshold Crossing Alert transmission control protocol traffic engineering thermo-electric cooler TAM Extender Module terminal trivial file transfer protocol target identifier
Page A-12

Abbreviation TIM TL1 TMN TOM TP TR TT TTI Tx UA UART UAS UAS-L UAS-P UDP UPSR URL UTC V VGA VLAN VOA VPN VSR trace identifier mismatch transaction language 1 telecommunications management network tributary optical module termination point transceiver test and turn-up trail trace identifier Transmitter; Transmit unavailable seconds universal asynchronous receiver transmitter unavailable seconds unavailable seconds, near-end line unavailable seconds, near-end STS path user datagram protocol unidirectional path switched ring universal resource locator Coordinated Universal Time volt variable gain amplifier virtual local area network variable optical attenuator virtual private network very short reach Description
W/X/Y/Z
WAN WDM XC XFP XML wide area network wavelength division multiplexing cross-connect name of a small form factor 10 Gbps optical transceiver extensible markup language
MISC
1R 2R re-amplification re-amplification, re-shape
Page A-13

Abbreviation 3R 4R re-amplification, re-shape, re-time re-amplification, re-shape, re-time, re-code Description
Page A-14

R3.0 Product Overview Student Handout 6-12-2007

Загружено:

Сведения о документе

Исходное описание:

Авторское право

Доступные форматы

Поделиться этим документом

Поделиться или встроить документ

Параметры публикации

Этот документ был вам полезен?

Это неприемлемый материал?

Авторское право:

Доступные форматы

R3.0 Product Overview Student Handout 6-12-2007

Загружено:

Авторское право:

Доступные форматы

DIGITAL OPTICAL NETWORK

Infinera DTN and Infinera Optical Line Amplifier Regulatory Compliance

DIGITAL OPTICAL NETWORK

Infinera Proprietary and Confidential

Infinera Proprietary and Confidential

Rack mount ears Grounding Power Entry Module(s) (PEM)

Infinera Proprietary and Confidential

Infinera Proprietary and Confidential

Infinera Proprietary and Confidential

Infinera Proprietary and Confidential

Section 1 Section 2 Section 3 Section 4

System Architecture Hardware Overview Theory of Operations Software Overview

Infinera Proprietary and Confidential

Slide-6 System Architecture - Chapter Learning Objectives

Slide-7 Infineras Breakthrough Technology

Infinera Proprietary and Confidential

INFINERAS BREAKTHROUGH TECHNOLOGY

Infinera Proprietary and Confidential

Slide-8 PIC Chip Set Features - Transmit PIC

Slide-9 PIC Chip Set Features - Receive PIC

Infinera Proprietary and Confidential

PIC CHIP SET FEATURES - RECEIVE PIC

Infinera Proprietary and Confidential

Slide-10 PIC Chip Set Facts

Slide-11 Infineras Digital Optical Network

Infinera Proprietary and Confidential

PIC CHIP SET FACTS

INFINERA DIGITAL OPTICAL NETWORK CAPABILITIES

Infinera Proprietary and Confidential

Slide-12 DTN Capabilities Overview

Slide-13 DTN 800Gbps Capacity

Infinera Proprietary and Confidential

DTN CAPABILITIES OVERVIEW

DTN 800GBPS CAPACITY

Infinera Proprietary and Confidential

Slide-15 G.709 Digital Wrapper

Infinera Proprietary and Confidential

G.709 DIGITAL WRAPPER

Infinera Proprietary and Confidential

Slide-16 Transport Transparency

Slide-17 Client Signal Support

Infinera Proprietary and Confidential

CLIENT SIGNAL TRANSPORT TRANSPARENCY

DTN CLIENT SIGNAL SUPPORT

Infinera Proprietary and Confidential

Slide-18 O-E-O Regeneration

Slide-19 DTN Configurations

Infinera Proprietary and Confidential

The 4R is performed at the DTF level

Infinera Proprietary and Confidential

Slide-20 Add/Drop Capabilities

Slide-21 Multi-Chassis Capabilities

Infinera Proprietary and Confidential

Infinera Proprietary and Confidential

Slide-22 DTN Digital Link

Digital Link defined as DTN to DTN

Digital Link Span

Slide-23 Optical Transport Layers

Infinera Proprietary and Confidential

DTN DIGITAL LINK

OPTICAL TRANSPORT LAYERS

Infinera Proprietary and Confidential

Slide-24 Topology Support

_ STM-4 SONET SDH 1Gigabit _________