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Features
For surface mounted application Easy pick and place Metal to silicon rectifier, majority carrier conduction Low power loss, high efficiency High current capability, low VF High surge current capability Plastic material used carriers Underwriters Laboratory Classification 94V-0 Epitaxial construction High temperature soldering: 260oC / 10 seconds at terminals
.280(7.11) .260(6.60) .012(.31) .006(.15)
.103(2.62) .079(2.00)
.063(1.6) .039(1.0)
Mechanical Data
Case: JEDEC DO-214AB Molded plastic Terminals: Pure tin plated, lead free Polarity: Indicated by cathode band Packaging: 16mm tape per EIA STD RS-481 Weight: 0.21 gram
32 20 14 20
33 30 21 30
34 40 28 40
35 50 35 50
SS 36 60 42 60
SS 39 90 63 90
3.0 100 70
A V mA mA
o
0.75 0.65 5 17 55
R JL R JA Operating Temperature Range TJ -55 to +125 Storage Temperature Range TSTG Notes: 1. Pulse Test with PW=300 usec, 1% Duty Cycle
C/W
o o
C C
- 46 -
Version: B07
80
SS35-SS315
SS32-SS34
60
40
20
PCB MOUNTED ON 0.6X0.6" (16X16mm) COPPER PAD AREAS 0 50 60 70 80 90 100 110 120
o
130
140
150
160
01
LEAD TEMPERATURE. ( C)
100
SS35-SS36
INSTANTANEOUS FORWARD CURRENT. (A) INSTANTANEOUS REVERSE CURRENT. (mA) 10
SS32-SS34
0 TJ=75C
0.1
SS39-SS310
0.1
0.01
SS315
PULSE WIDTH=300 S 1% DUTY CYCLE
TJ=25 0C
SS32-SS34 SS35-SS315
0.01 0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.001 0
20
40
60
80
100
120
140
1000
JUNCTION CAPACITANCE.(pF)
10
100
0.1 0.01
0.1
10
100
Version: B07