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Service Manual

Service Manual U250/KU250

Model : U250/KU250

Date: June, 2007 / Issue 1.0

Table Of Contents
1. INTRODUCTION .............................. 5
1.1 Purpose................................................... 5 1.2 Regulatory Information............................ 5 4.16 Receiver Path ....................................107 4.17 Headset path......................................109 4.18 Speaker phone path...........................111 4.19 Main microphone ...............................113 4.20 Headset microphone..........................115 4.21 Vibrator ..............................................117

2. PERFORMANCE...............................7
2.1 System Overview .....................................7 2.2 Usable environment .................................8 2.3 Radio Performance ..................................8 2.4 Current Consumption.............................14 2.5 RSSI BAR ..............................................14 2.6 Battery BAR ...........................................15 2.7 Sound Pressure Level............................16 2.8 Charging ................................................16

5. DOWNLOAD..................................119
5.1 U250/KU250 DOWNLOAD ..................119 5.1.1 Introduction ...................................119 5.1.2 Downloading Procedure ...............119 5.1.3 Troubleshooting Download Errors 129 5.1.4 Caution .........................................133

3. TECHNICAL BRIEF ........................17


3.1 General Description ...............................17 3.2 GSM Mode.............................................19 3.3 UMTS Mode...........................................23 3.4 LO generation and distribution circuits...25 3.5 Off-chip RF Components .......................25 3.6 Digital Baseband(DBB/MSM6245).........34 3.7 Block Diagram(MSM6245).....................36 3.8 Subsystem(MSM6245) ..........................37 3.9 Power Block ...........................................45 3.10 External memory interface ...................50 3.11 H/W Sub System..................................52 3.12 Main Features ......................................68

6. BLOCK DIAGRAM ........................134


6.1 GSM & UMTS RF Block.......................134 6.2 Interface Diagram ................................136

7. Circuit Diagram ............................143 8. pcb layout .....................................147 9. Calibration & RF Auto Test Program (Hot Kimchi)..................149
9.1 Configuration of HOT KIMCHI .............149 9.2 How to use HOT KIMCHI.....................152

10. Factory Test Mode .....................154 4. TROUBLE SHOOTING ...................73


4.1 RF Component.......................................73 4.2 SIGNAL PATH_UMTS RF .....................75 4.3 SIGNAL PATH_GSM RF .......................76 4.4 Checking VC-TCXO Block .....................77 4.5 Checking Front-End Module Block ........79 4.6 Checking UMTS Block ...........................81 4.7 Checking GSM Block .............................86 4.8 Checking Bluetooth Block ......................92 4.9 Power ON Troubleshooting....................94 4.10 Charger Troubleshooting .....................96 4.11 USB Troubleshooting...........................99 4.12 SIM Detect Troubleshooting ..............100 4.13 Camera Troubleshooting ...................102 4.14 Keypad Backlight Troubleshooting ....105 4.15 Main LCD Troubleshooting ................106 10.1. Test Program Setting ........................154 10.2. WCDMA Test Mode ..........................155 10.3. GSM Test Mode................................156

11. EXPLODED VIEW & REPLACEMENT PART LIST ..... 157


11.1 EXPLODED VIEW ............................ 157 11.2 Replacement Parts <Mechanic component>.................... 159 <Main component> ........................... 161 11.3 Accessory ......................................... 174

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1. INTRODUCTION

1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the features of this model.

1.2 Regulatory Information


A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example, persons other than your companys employees, agents, subcontractors, or person working on your companys behalf) can result in substantial additional charges for your telecommunications services. System users are responsible for the security of own system. There are may be risks of toll fraud associated with your telecommunications system. System users are responsible for programming and configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the above case but will prevent unauthorized use of commoncarrier telecommunication service of facilities accessed through or connected to it. The manufacturer will not be responsible for any charges that resultfrom such unauthorized use.

B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing harm or interruption in service to the telephone network, it should disconnect telephone service until repair can be done. A telephone company may temporarily disconnect service as long as repair is not done.

C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these changes could reasonably be expected to affect the use of the phones or compatibility with the net work, the telephone company is required to give advanced written notice to the user, allowing the user to take appropriate steps to maintain telephone service.

D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized agent. The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system and may void any remaining warranty.

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1. INTRODUCTION

E. Notice of Radiated Emissions


This model complies with rules regarding radiation and radio frequency emission as defined by local regulatory agencies. In accordance with these agencies, you may be required to provide information such as the following to the end user.

F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly different.

G. Interference and Attenuation


A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from unsuppressed engines or electric motors may cause problems.

H. Electrostatic Sensitive Devices ATTENTION


Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the Following information is ESD handling: sign.

Service personnel should ground themselves by using a wrist strap when exchange system boards. When repairs are made to a system board, they should spread the floor with anti-static mat which is also grounded. Use a suitable, grounded soldering iron. Keep sensitive parts in these protective packages until these are used. When returning system boards or parts like EEPROM to the factory, use the protective package as described.

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2. PERFORMANCE

2. PERFORMANCE
2.1 System Overview
Item Shape Size Weight Power Talk Time (with 950mAh) Standby Time (with 950mAh) Antenna LCD LCD Backlight Camera Vibrator LED Indicator MIC Receiver Earphone Jack Connectivity External Memory I/O Connect Specification GSM900/1800/1900 and WCDMA2100 - Bar type Handset 110.9 X 46.7 X 15.6 mm Under 83 g (with 950mAh Battery) 3.7 V normal, 950 mAh Li-Ion Over 200 min (WCDMA, Tx=12 dBm, Voice) Over 180 min (GSM, Max Tx Power, Voice) Over 350 Hrs (WCDMA, DRX=1.28) Over 450 Hrs (GSM, Paging period=9) Internal type Main 1.76 TFT, QCIF, 262K White LED Back Light 1.3 Mega pixel + VGA Video Call Camera Yes ( Cylinder Type) No Yes Yes Yes (18 pin) Bluetooth, USB Yes(Micro SD) 18 Pin

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2. PERFORMANCE

2.2 Usable environment


1) Environment
Item Voltage Operation Temp Storage Temp Humidity Specification 3.7 V(Typ), 3.2 V(Min), [Shut Down : 3.2 V] -20 ~ +60C -20 ~ +70C 85 % (Max)

2) Environment (Accessory)
Reference TA Power * CLA : 12 ~ 24 V(DC) Spec. Available power Min 100 Typ. 220 Max 240 Unit Vac

2.3 Radio Performance


1) Transmitter - GSM Mode
No Item 100k~1GHz MS allocated Channel 1G~12.75GHz Conducted 1 Spurious Emission Idle Mode 1G~[A]MHz [A]M~[B]MHz [B]M~12.5GHz
* In case of DCS : [A] -> 1710, [B] -> 1785

GSM -39dBm

DCS & PCS 9k ~ 1GHz 1G~[A]MHz [A]M~[B]MHz -33dBm [B]M~12.75GHz -33dBm -60dBm -62dBm -60dBm -50dBm -56dBm -50dBm -60dBm -62dBm -60dBm -50dBm -56dBm -50dBm 100k~880MHz 880M~915MHz 915M~1GHz 1G~[A]MHz [A]M~[B]MHz [B]M~12.5GHz -39dBm -33dBm -39dBm

100k~880MHz 880M~915MHz 915M~1GHz

* In case of PCS : [A] -> 1850, [B] -> 1910

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2. PERFORMANCE

No

Item 30M ~ 1GHz MS allocated Channel 1G ~ 4GHz Radiated

GSM -36dBm

DCS & PCS 30M~1GHz 1G~[A]MHz [A]M~[B]MHz -30dBm [B]M~4GHz -30dBm -57dBm -59dBm -57dBm -47dBm -53dBm -47dBm -57dBm -59dBm -57dBm -47dBm -53dBm -47dBm 30M~880MHz 880M~915MHz 915M~1GHz 1G~[A]MHz [A]M~[B]MHz [B]M~4GHz 0.1ppm 5(RMS) 20(PEAK) -36dBm -30dBm -36dBm

Spurious Emission Idle Mode

30M ~ 880MHz 880M ~ 915MHz 915M~1GHz 1G~[A]MHz [A]M~[B]MHz [B]M~4GHz

3 4

Frequency Error Phase Error

0.1ppm 5(RMS) 20(PEAK)

3dB below reference sensitivity 3dB below reference sensitivity Frequency Error 5 Under Multipath and Interference Condition RA250 : 200Hz HT100 : 100Hz TU50 : 100Hz TU3 : 150Hz 0 ~ 100kHz 200kHz 250kHz Due to modulation Output RF 6 Spectrum 3000 ~ 6000kHz 6000kHz 400kHz Due to 600kHz Switching 1200kHz transient 1800kHz
* In case of DCS : [A] -> 1710, [B] -> 1785

RA250: 250Hz HT100: 250Hz TU50: 150Hz TU1.5: 200Hz +0.5dB -30dB -33dB -60dB -66dB -69dB -71dB -77dB -19dB -21dB -21dB -24dB 400kHz 600kHz 1200kHz 1800kHz -22dB -24dB -24dB -27dB 0 ~ 100kHz 200kHz 250kHz 400kHz 600 ~ 1800kHz 1800 ~ 6000kHz 6000kHz +0.5dB -30dB -33dB -60dB -60dB -65dB -73dB

400kHz 600 ~ 1800kHz 1800 ~ 3000kHz

* In case of PCS : [A] -> 1850, [B] -> 1910

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2. PERFORMANCE

No

Item

GSM

DCS & PCS Frequency offset 800kHz

Intermodulation product should 7 Intermodulation attenuation be Less than 55dB below the level of Wanted signal Power control Power Tolerance Power control Power Tolerance Level 5 6 7 8 9 10 8 Transmitter Output Power 11 12 13 14 15 16 17 18 19 (dBm) 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 (dB) 3 3 3 3 3 3 3 3 3 3 3 5 5 5 5 Level 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 9 Burst timing Mask IN (dBm) 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 Mask IN (dB) 3 3 3 3 3 3 3 3 3 4 4 4 4 4 5 5

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2. PERFORMANCE

2) Transmitter - WCDMA Mode

No 1 2 3

Item Maximum Output Power Frequency Error Open Loop Power control in uplink

Specification Class 3 : +24dBm(+1/-3dB) 0.1ppm 9dB@normal, 12dB@extreme Adjust output(TPC command) cmd +1 1dB +0.5/1.5 2dB +1/3 3dB +1.5/4.5

Inner Loop Power control in uplink

0 -1

-0.5/+0.5 -0.5/+0.5 -0.5/+0.5 -0.5/-1.5 -1/-3 -1.5/-4.5

Group (10 equel command group) +1 5 Minimum Output Power +8/+12 +16/+24

-50dBm(3.84MHz) Qin/Qout : PCCH quality levels

Out-of-synchronization handling of output power Toff@DPCCH/Ior : -22 -> -28dB Ton@DPCCH/Ior : -24 -> -18dB

7 8

Transmit OFF Power Transmit ON/OFF Time Mask

-56dBm(3.84MHz) 25us PRACH,CPCH,uplinlk compressed mode 25us Power varies according to the data rate

Change of TFC DTX : DPCH off (minimize interference between UE)

10 11

Power setting in uplink compressed Occupied Bandwidth(OBW)

3dB(after 14slots transmission gap) 5MHz(99%) -35-15*(f-2.5)dBc@f=2.5~3.5MHz,30k -35-1*(f-3.5)dBc@f=3.5~7.5MHz,1M

12

Spectrum emission Mask -39-10*(f-7.5)dBc@f=7.5~8.5MHz,1M -49dBc@f=8.5~12.5MHz,1M

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2. PERFORMANCE

No 13

Item Adjacent Channel Leakage Ratio(ACLR)

Specification 33dB@5MHz, ACP>-50dBm 43dB@10MHz, ACP>-50dBm -36dBm@f=9~150KHz, 1K BW -36dBm@f=50KHz~30MHz, 10K BW -36dBm@f=30MHz~1000MHz, 100K BW

Spurious Emissions 14 (*: additional requirement)

-30dBm@f=1~12.5GHz, 1M BW (*)-41dBm@f=1893.5~1919.6MHz, 300K (*)-67dBm@f=925~935MHz, 100K BW (*)-79dBm@f=935~960MHz, 100K BW (*)-71dBm@f=1805~1880MHz, 100K BW -31dBc@5MHz,Interferer -40dBc

15

Transmit Intermodulation -41dBc@10MHz, Interferer -40dBc 17.5%(>-20dBm)

16

Error Vector Magnitude (EVM) (@12.2K, 1DPDCH+1DPCCH) -15dB@SF=4.768Kbps, Multi-code

17

Transmit OFF Power transmission

3)Receiver - GSM Mode


No 1 2 (TCH/FS Class II, RBER, TU high/FH) 3 Adjacent Channel Rejection 200kHz 400kHz C/Ia1=-12dB C/Ia2=-44dB Wanted Signal :-98dBm 1st 4 Intermodulation Rejection interferer:-44dBm 2nd interferer:-45dBm Blocking Response 5 (TCH/FS Class II, RBER) Unwanted : Depend on Frequency Unwanted : Depend on Frequency Wanted Signal :-101dBm C/Ia1=-12dB C/Ia2=-44dB Wanted Signal :-96dBm 1st interferer:-44dBm 2nd interferer:-44dBm Wanted Signal :-101dBm Item Sensitivity (TCH/FS Class II) Co-Channel Rejection C/Ic=7dB Storage -30 ~ +85 GSM -105dBm DCS & PCS -105dBm

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2. PERFORMANCE

4) Receiver - WCDMA Mode


No 1 Item Reference Sensitivity Level Specification -106.7 dBm(3.84 MHz) -25dBm(3.84MHz) 2 Maximum Input Level -44dBm/3.84MHz(DPCH_Ec) UE@+20dBm output power(Class3) 33dB 3 Adjacent Channel Selectivity (ACS) UE@+20dBm output power(Class3) -56dBm/3.84MHz@10MHz 4 In-band Blocking UE@+20dBm output power(Class3) -44dBm/3.84MHz@15MHz UE@+20dBm output power(Class3) -44dBm/3.84MHz@f=2050~2095 and 2185~2230MHz UE@+20dBm output power(Class3) -30dBm/3.84MHz@f=2025~2050 and 5 Out-band Blocking 2230~2255MHz UE@+20dBm output power(Class3) -15dBm/3.84MHz@f=1~2025 and 2255~12500MHz UE@+20dBm output power(Class3) -44dBm CW 6 Spurious Response UE@+20dBm output power(Class3) -46dBm CW@10MHz 7 Intermodulation Characteristic -46dBm/3.84MHz@20MHz UE@+20dBm output power(Class3) -57dBm@f=9KHz~1GHz, 100K BW 8 Spurious Emissions -47dBm@f=1~12.5GHz, 1M BW -60dBm@f=1920MHz~1980MHz, 3.84M BW -60dBm@f=2110MHz~2170MHz, 3.84M BW

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2. PERFORMANCE

2.4 Current Consumption


1) U250/KU250 Current Consumption
Stand by Under 2.80 mA WCDMA (DRX=1.28) Under 2.12 mA GSM Paging=9 period Voice Call Under 290 mA (Tx=12dBm) Under 320 mA (Max Tx Power) VT Under 410mA (Tx=12dBm)

(Stand by and Voice Call Test Condition : Bluetooth off, LCD backlight off,Neighbor Cell off) (VT Test Condition : Speaker off, LCD backlight On)

2.5 RSSI BAR


Level Change BAR 4 3 BAR 3 2 BAR 2 1 BAR 1 0 WCDMA -85 2 dBm -95 2 dBm -106 2 dBm -111 2 dBm GSM -90 2 dBm -95 2 dBm -100 2 dBm -106 2 dBm

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2. PERFORMANCE

2.6 Battery BAR


Indication Bar 4 Bar 4 3 Bar 3 2 Bar 2 1 Bar 1 Empty Low Voltage, Warning message+ Blinking Power Off Standby Over 3.83 0.05V 3.82 0.05V 3.73 0.05V 3.68 0.05V 3.58 0.05V 3.58 0.05V (Stand-by) / 3.58 0.05V (Talk) [Interval : 3min(Stand-by) / 1min(Talk)] 3.20 0.05V

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2. PERFORMANCE

2.7 Sound Pressure Level


No 1 2 3 4 5 6 7 8 9 10 11 12 Test Item Sending Loudness Rating (SLR) Receiving Loudness Rating (RLR) Side Tone Masking Rating (STMR) Echo Loss (EL) Idle Noise-Sending (INS) Idle Noise-Receiving (INR) Sending Loudness Rating (SLR) Receiving Loudness Rating (RLR) Side Tone Masking Rating (STMR) Echo Loss (EL) Idle Noise-Sending (INS) Idle Noise-Receiving (INR) TDMA Noise -. GSM : Power Level : 5 DCS/PCS : Power Level : 0 (Cell Power : -90 ~ -105 dBm) 13 -. Acoustic (Max Vol.) MS/Headset SLR : 8 3dB MS/Headset RLR : -15 3dB/-12 (SLR/RLR : Mid-value setting) MS and Headset Max Under -62 dBm Headset Nor Max Min Min Max Nor Max MS Nor Max Min Min Max Nor Max Specification 8 3 dB -4 3 dB -15 3 dB 17 dB 40 dB -64 dBm0p Under -47 dBPA Under -36 dBPA 83dB -1 3 dB -12 3 dB 25 dB 40 dB -55 dBm0p Under -45 dBPA Under -40 dBPA

2.8 Charging
Charging Method : CC & CV (Constant Current and Constant Voltage) Maximum Charging Voltage : 4.2 V Maximum Charging Current : 700 mA Normal Battery Capacity : 950 mAh Charging Time : Max 3 hours (except for trickle charging time) Full charging indication current (charging icon stop current) : 80 mA Cut-off voltage : 3.20 V

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3. TECHNICAL BRIEF

3. TECHNICAL BRIEF
3.1 General Description
The U250/KU250 supports UMTS-2100, GSM-900, DCS-1800, and PCS-1900 based GSM/GPRS/UMTS. All receivers and the UMTS transmitter use the radio One1Zero-IF architecture to eliminate intermediate frequencies, directly converting signals between RF and baseband. The quadband GSM transmitters use a baseband-to-IF upconversion followed by an offset phase-locked loop that translates the GMSK-modulated signal to RF.

UMTS (2100) GSM (900, 1800, 1900) Bluetooth 1. RTR6275 for GSM Tx and WCDMA Tx 2. RTR6275 for GSM Rx and WCDMA Rx 3. Bluetooth RF module 4. PM6650 for power management

[Fig 1.1] Block diagram of RF part

QUALCOMMs branded chipset that implements a Zero-IF radio architecture.

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3. TECHNICAL BRIEF

A generic, high-level functional block diagram of U250/KU250 is shown in Figure 1-1. One antenna collects base station forward link signals and radiates handset reverse link signals. The antenna connects with receive and transmit paths through a FEM(Front End Module). The UMTS receive path each include a LNA, a RF band-pass filter, and a downconverter that translate the signal directly from RF-to-baseband using radioOne ZIF technique. The RFIC Rx analog baseband outputs, for the receive chains, connect to the MSM IC. The UMTS and GSM Rx baseband outputs share the same inputs to the MSM IC. For the transmit chains, the RTR6275 IC directly translates the Tx baseband signals (from the MSM device) to an RF signal using an internal LO generated by integrated on-chip PLL and VCO. The RTR6275 IC outputs deliver fairly high-level RF signals that are first filtered by Tx SAWs and then amplified by their respective UMTS PA. The high- and low-band UMTS RF transmit signals emerge from the RTR6275 transceiver. In the GSM receive paths, the received RF signals are applied through their band-pass filters and down-converted directly to baseband in the RTR6275 transceiver IC. These baseband outputs are shared with the UMTS receiver and routed to the MSM IC for further signal processing. The GSM transmit paths employ one stage of up-conversion and, in order to improve efficiency. 1. The on-chip quadrature up-converter translates the GMSK-modulated signal to a constant envelope phase signal at RF; 2. The amplitude-modulated (AM) component is applied to the ramping control pin of power amplifier from a DAC within the MSM U250/KU250 power supply voltages are managed and regulated by the PM6650 Power Management IC. This versatile device integrates all wireless handset power management, general housekeeping, and user interface support functions into a single mixed signal IC. It monitors and controls the external power source and coordinates battery recharging while maintaining the handset supply voltages using low dropout, programmable regulators. The devices general housekeeping functions include an ADC and analog multiplexer circuit for monitoring on-chip voltage sources, charging status, and current flow, as well as userdefined off-chip variables such as temperature, RF output power, and battery ID. Various oscillator, clock, and counter circuits support IC and higher-level handset functions. Key parameters such as under-voltage lockout and crystal oscillator signal presence are monitored to protect against detrimental conditions.

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3. TECHNICAL BRIEF

3.2 GSM Mode


3.2.1 GSM Receiver
The Dual-mode U250/KU250s receiver functions are split among the three RFICs as follows: GSM-900, DCS-1800, and PCS-1900 UMTS-2100 modes use the RTR6275 IC only. Each mode has independent front-end circuits and down-converters, but they share common baseband circuits (with only one mode active at a time). All receiver control functions are beginning with SBI2-controlled parameters. RF Front end consists of antenna, antenna switch module(D5011) which includes three RX saw filters(GSM900, DCS and PCS). The antenna switch module allows multiple operating bands and modes to share the same antenna. In U250/KU250, a common antenna connects to one of six paths: 1) UMTS-2100 Rx/Tx, 2) GSM-900 Rx, 3) GSM-900 Tx, 4) DCS-1800 Rx, and 5) DCS-1800 Tx, PCS1900 Tx(High Band Txs share the same path), 6) PCS-1900 Rx. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. The GSM900, DCS, and PCS operation is time division duplexed, so only the receiver or transmitter is active at any time and a frequency duplexer is not required.

GSM 1800 / GSM1900 RX GSM 900 RX GSM 900 TX / WCDMA GSM 1800 / GSM 1900 TX

[Table 1.1] Antenna Switch Module Control logic

The RFIC operating modes and circuit parameters are MSM-controlled through the proprietary 3-line Serial Bus Interface (SBI). The Application Programming Interface (API) is used to implement SBI commands. The API is documented in AMSS Software - please see applicable AMSS Software documentation for details.

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3. TECHNICAL BRIEF

The GSM900, DCS, and PCS receiver inputs of RTR6275 are connected directly to the transceiver front-end circuits(filters and antenna switch module). The GSM900, DCS, and PCS receiver inputs use differential configurations to improve common-mode rejection and second-order non-linearity performance. The balance between the complementary signals is critical and must be maintained from the RF filter outputs all the way into the IC pins Since GSM900, DCS, and PCS signals are time-division duplex (the handset can only receive or transmit at one time), switches are used to separate Rx and Tx signals in place of frequency duplexers this is accomplished in the switch module. The GSM900, DCS, and PCS receive signals are routed to the RTR6275 through band selection filters and matching networks that transform single-ended 50- sources to differential impedances optimized for gain and noise figure. The RTR input uses a differential configuration to improve second-order intermodulation and common mode rejection performance. The RTR6275 input stages include MSMcontrolled gain adjustments that maximize receiver dynamic range. The amplifier outputs drive the RF ports of the quadrature RF-to-baseband downconverters. The downconverted baseband outputs are multiplexed and routed to lowpass filters (one I and one Q) having passband and stopband characteristics suitable for GMSK processing. These filter circuits include DC offset corrections. The filter outputs are buffered and passed on to the MSM6245 IC for further processing (an interface shared with the RFR6275 UMTS receiver outputs).

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3. TECHNICAL BRIEF

[Fig 1.2] RTR6275 RX feature

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3. TECHNICAL BRIEF

3.2.2 GSM Transmitter


The RTR6275 transmitter outputs(DA_HB2_OUT and DA_LB1_OUT)include on-chip output matching inductors. The 50ohm output impedance is achieved by adding a series capacitor at the output pins. The capacitor value may be optimized for specific applications and PCB characteristics based on passband symmetry about the band center frequency, the suggested starting value is shown in Figure1.3.

6pF

51

91 12pF 39

91

100

100

[Fig 1.3] GSM Transmitter matching

The RTR6275 IC is able to support GSM 900 and GSM 1800/1900 mode transmitting. This design guideline shows a tri-band GSM application. Both high-band and low band outputs are followed by resistive pads to ensure that the load presented to the outputs remains close to 50ohm. The low-band GSM Tx path also includes a Tx-band SAW filter to remove noise-spurious components and noise that would be amplified by the PA and appear in the GSM Rx band

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3. TECHNICAL BRIEF

3.3 UMTS Mode


3.3.1 Receiver
The UMTS duplexer receiver output is routed to LNA circuits within the RTR6275 device. The UMTS Rx input is provided with an on-chip LNA that amplifies the signal before a second stage filter that provides differential downconverter. This second stage input is configured differentially to optimize second-order intermodulation and common mode rejection performance. The gain of the UMTS frontend amplifier and the UMTS second stage differential amplifier are adjustable, under MSM control, to extend the dynamic range of the receivers. The second stage UMTS Rx amplifiers drive the RF ports of the quadrature RFtobaseband downconverters. The downconverted UMTS Rx baseband outputs are routed to lowpass filters having passband and stopband characteristics suitable for UMTS Rx processing. These filter circuits allow DC offset corrections, and their differential outputs are buffered to interface shared with GSM Rx to the MSM IC. The UMTS baseband outputs are turned off when the RTR6275 is downconverting GSM signals and on when the UMTS is operating.

3.3.2 Transmitter
The UMTS Tx path begins with differential baseband signals (I and Q) from the MSM device. These analog input signals are amplified, filtered, and applied to the quadrature up-converter mixers. The upconverter output is amplified by multiple variable gain stages that provide transmit AGC control. The AGC output is filtered and applied to the driver amplifier; this output stage includes an integrated matching inductor that simplifies the external matching network to a single series capacitor to achieve the desired 50- interface. The RTR6275 UMTS output is routed to its power amplifier through a bandpass filter, and delivers fairly high-level signals that are filtered and applied to the PA. Transmit power is delivered from the duplexer to the antenna through the switch module. The transceiver LO synthesizer is contained within the RTR6275 IC with the exception of the off-chip loop filter components and the VC-TCXO. This provides a simplified design for multimode applications. The PLL circuits include a reference divider, phase detector, charge pump, feedback divider, and digital logic generator. UMTS Tx using PLL1, the LO generation and distribution circuits create the necessary LO signals for different frequency converters. The UMTS transmitter also employs the ZIF architecture to translate the signal directly from baseband to RF. This requires FLO to equal FRF, and the RTR6275 IC design achieves this without allowing FVCO to equal FRF. The RTR6275 IC is able to support UMTS 2100/1900 and UMTS 850 mode transmitting. This design guideline shows only UMTS 2100 applications.

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3. TECHNICAL BRIEF

WCDMA_2100_TX

WCDMA_2100_RX

[Figure 1.4] RTR6275 IC functional block diagram

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3. TECHNICAL BRIEF

3.4 LO generation and distribution circuits


The integrated LO generation and distribution circuits are driven by internal VCOs to support various modes to yield highly flexible quadrature LO outputs that drive all GSM and UMTS band upconverters and downconverters; with the help of these LO generation and distribution circuits, zero-IF architecture is employed in all GSM and UMTS band receivers and transmitters to translate the signal directly from RF to baseband and from baseband to RF. Two fully functional fractional-N synthesizers, including VCOs and loop filters, are integrated within the RTR6275 IC. The first synthesizer (PLL1) creates the transceiver LOs that support the UMTS 2100/1900/1800 transmitter, and all four GSM band receivers and transmitters including: GSM 850, GSM 900, GSM 1800, and GSM 1900. The second synthesizer (PLL2) provides the LO for the UMTS 2100/1900/1800 receiver. An external TCXO input signal is required to provide the synthesizer frequency reference to which the PLL is phase and frequency locked. The RTR6275 IC integrates most of PLL loop filter components on-chip except two off-chip loop filter series capacitors, and significantly reduces off-chip component requirement. With the integrated fractional-N PLL synthesizers, the RTR6275 has the advantages of more flexible loop bandwidth control, fast lock time, and low-integrated phase error

3.5 Off-chip RF Components


3.5.1 WCDMA PAM (U103: WS2512-TR1G)
The UMTS PA output power is monitored by l power detector circuits(U100 : RTR6275) . This detector voltage can be used for transmitter calibration and monitor to meet RF system
WCDMA
Rev.D C154 1.5p Rev_1.0

+VPWR
L404 1.8nH C155 4.7u C158 15p WS2512_TR1G 10 VCC2 FL104 4 3 PGND ANT RX TX 1 2 C162 3.3p C164 0.5p C165 1p 7 GND3 6 GND2 11 BGND VCONT VREF 4 5 L123 1nH 9 Rev_1.0 8 GND4 RFOUT U103 VCC1 RFIN GND1 1 2 3 C159 15p

+VPWR
4

FL102 5 EFCH1950TDF1
IN

L122 NA

C157 10nH

O1 G3 G2 G1

ACMD-7602 0.5p L125

PA_R0

OUT

IN

50OHM

COUP

20dB

TR100 KRX102U
5

U102
2

51R119

CP0402A1950DNTR
4 3

PA_ON
Rev.B

VREG_TCXO_2.85V
C170 0.1u

PWR_DET R120 R121 47 130 7dB R122 130 C192 100p

[Figure 1.5] WCDMA PAM, Duplexer, Coupler

- 25 -

3. TECHNICAL BRIEF

3.5.2 VCTCXO (X100 : DSA321SCE-19.2M)


The Voltage Controlled Temperature Compensated Crystal Oscillator (VCTCXO) provides the reference frequency for all RFIC synthesizers as well as clock generation functions within the MSM6245 IC. The oscillator frequency is controlled by the MSM6245 IC. TRK_LO_ADJ pulse density modulated signal in the same manner as the transmit gain control TX_AGC_ADJ. A two-pole RC lowpass filter is recommended on this control line. The PM6650 IC controls the handset power-up sequence, including a special VCTCXO warm-up interval before other circuits are turned on. This warm-up interval (as well as other TCXO controller functions) is enabled by the MSM TCXO_EN line . The PM6650 IC VREG_TCXO regulated output voltage is used to power the VCTCXO and is enabled before most other regulated outputs. Any GSM mode power control circuits within the MSM6245 IC require a reference voltage for proper operation and sufficient accuracy. Connecting the PM6650 IC REF_OUT directly to the MSM6245 IC GSM_PA_PWR_CTL_REF provides this reference. This sensitive analog signal needs a 0.1 F low frequency filter near to MSM side, and isolate from digital logic and clock traces with ground on both sides, plus ground above and below if routed on internal layers.

3.5.3 Front-End Module (U500 : D5011)


This equipment uses a single antenna to support all handset operating modes, with an antenna switch module select the operating frequency and band. UMTS operation requires simultaneous reception and transmission, so the UMTS Rx/Tx connection is routed to a duplexer that separates receive and transmit signals. The active connection is MSM-selected by three control lines (GPIO[9], GPIO[10]). Two GPIO are programmed to be ANT_SEL0_N, ANT_SEL1_N) respectively.

GSM 1800 / GSM1900 RX GSM 900 RX GSM 900 TX / WCDMA GSM 1800 / GSM 1900 TX

[Table 1.2] Front End Module control logic

- 26 -

3. TECHNICAL BRIEF

3.5.4 PMIC Functional Block Diagram (U300 : PM6650-2M)


Input power management - Valid external supply attachment and removal detection - Supports unregulated (closed-loop) external charger supplies and USB supplies as input power sources - Supports lithium-ion main batteries - Trickle, constant current, constant voltage, and pulsed charging of the main battery - Supports coin cell backup battery (including charging) - Battery voltage detectors with programmable thresholds - VDD collapse protection - Charger current regulation and real-time monitoring for over-current protection - Charger transistor protection by power limit control - Control drivers for two external pass transistors and one external battery MOSFET - MOSFET is optional - Voltage, current, and power control loops - Automated recovery from sudden momentary power loss Output voltage regulation - One boost (step-up) switched-mode power supply (SMPS) for driving white LEDs and hosting USBOTG - Three buck (step-down) switched-mode power supplies that efficiently generate MSMC, MSME, and PA (or second MSMC) supply voltages - Supports dynamic voltage scaling (DVS) for MSMC and PA - Eleven low dropout regulator circuits with programmable output voltages, implemented using three different current ratings: 300 mA (two), 150 mA (six), and 50 mA (three). These can be used to power MSMA, MSMP, RFRX1, RFRX2, RFTX, SYNT, TCXO, WLAN, MMC, USB, and RUIM circuits. - All regulators can be individually enabled/disabled for power savings - Low power mode available on MSMA and MSMP regulators - All regulated outputs are derived from a common bandgap reference-close tracking Integrated handset-level housekeeping functions reduces external parts count, size, cost - Analog multiplexer selects from 8 internal and up to 18 external inputs - Multiplexer outputs offset and gain are adjusted, increasing the effective ADC resolution - Adjusted multiplexer output is buffered and routed to an MSM device ADC - Dual oscillators - 32.768 kHz off-chip crystal and on-chip RC assures MSM device sleep clock - Crystal oscillator detector and automated switch-over upon lost oscillation - Real time clock for tracking time and generating associated alarms - On-chip adjustments minimize crystal oscillator frequency errors - Circuits control TCXO warm-up and synchronize, deglitch, and buffer the TCXO signal - TCXO buffer control for optimal QPH/catnap timing - Three-stage over-temperature protection (smart thermal control)

- 27 -

3. TECHNICAL BRIEF

Integrated handset-level user interfaces - Four programmable current sinks recommended as keypad backlight, LCD backlight, camera flash, and general-purpose drivers - Vibration motor driver programmable from 1.2 to 3.1V in 100 mV increments - Speaker driver with programmable gain, turn-on time, and muting; differential operation (drives external 8 speakers with volume controlled 500 mW) IC-level interfaces - MSM device-compatible 3-line SBI for efficient initialization, status, and control - Supports the MSM devices interrupt processing with an internal interrupt manager - Many functions monitored and reported through real-time and interrupt status signals - Dedicated circuits for controlled power-on sequencing, including the MSM devices reset signal - Several events continuously monitored for triggering power-on/power-off sequences - Supports and orchestrates soft resets - USB-OTG transceiver for full-speed (12 Mb/s) and low speed (1.5 Mb/s) interfacing of the MSM device to computers as a USB peripheral, or connecting the MSM device to other peripherals RUIM level translators enable MSM device interfacing with external modules Twelve multi-purpose pins that can be configured as digital or analog I/Os, bi-directional I/Os, or current sinks. Default functions support the RUIM level translators, power-on circuits, analog multiplexer inputs, an LED driver, and a reference voltage buffer. Highly integrated functionality in a small package - 84-pin BCCS with a large center slug for electrical ground, mechanical stability, and thermal relief

[Figure 1.6] MSM6245 Interface

- 28 -

3. TECHNICAL BRIEF

[Figure1.7] PM6650 Block Diagram

- 29 -

3. TECHNICAL BRIEF

3.5.5 GSM PAM (U101 : SKY77318)


The SKY77318 is an extremely small (6 x 6 mm), GSM PAM for handset applications. This module has been optimized for excellent efficiency and Pout while maintaining high GSM/GPRS efficiency. The small size and high performance is achieved with high-reliability GaAs HBT technology. With 50 and output, no external matching or bias components are required. The module incorporates two highly-integrated GaAs power amplifier die with a BiCMOS controller. Each amplifier has three gain stages with on-die inter-stage matching implemented with a high Q passives technology for optimal performance. The CMOS controller implements a fully integrated power control within the module for GSM operations, and serves as the GPRS operations. This eliminates the need for any external couplers, power detectors, current sensing etc., to assure the output power level. The module has Tx enable and band select inputs. Module construction is a lowprofile overmolded land-grid array on laminate.

GSM_PA_RA

Rev.D C124 100p L115 18nH L403 1.5nH

+VPWR
C123 0.01u C121 33u

EGSM

NA

L111 5.6nH

L406

2.7nH

L116 10nH 100ohm

R107

C441 5.6p C137 NA

C438 100p C138 NA C139 68p 20 17

C134 0.01u C136 0.01u 91 R110

8.86dB Rev.1.0 R108 DCS_PCS_TX 51 91 R111 7.5dB


4 5 1
O1 G3 IN G2 G1

6 VCC1B

VBATT

VCC1A

VAPC

FL101
3 4 18 1 R113 100ohm

15 11 19 21

DCS_PCS_OUT EGSM_OUT RSVD_GND P_GND

DCS_PCS_IN EGSM_IN ENABLE

R112 GSM_TX 100ohm 100ohm 39 R115 R114 MODE GSM DCS/PCS

U101
SKY77318

GSM_PA_EN

BS

C149 15p

EFCH897MTDB1

GND9 GND8 GND7 GND6 GND5 GND4 GND3 GND2 GND1

R117 100ohm

16 14 13 12 10 9 8 7 5

GSM_PA_BAND
C153 15p

GSM_PA_BAND LOW HIGH

[Figure 1. 8] GSM PAM Schematic

- 30 -

3. TECHNICAL BRIEF

3.5.6 UMTS Duplexer(FL104:ACMD-7602)


A UMTS duplexer splits a single operating band into receive and transmit paths. Important performance requirements include; Insertion loss. this component is also in the receive and transmit paths ; In the U250/KU250 typical losses : UMTS2100_ Tx = 1.2 dB, UMTS2100_ Rx = 1.4 dB Out-of-band rejection or attenuation. the duplexer provides input selectivity for the receiver, output filtering for the transmitter, and isolation between the two. Rejection levels for both paths are specified over a number of frequency ranges. Two Tx-to-Rx isolation levels are critical to receiver performance: Rx-band isolation. the transmitter is specified for out-of-band noise falling into the Rx band. This noise leaks from the transmit path into the receive path, and must be limited to avoid degrading receiver sensitivity. The required Rx-band isolation depends on the PA out of-band noise levels and Rx-band losses between the PA and LNA. Minimum duplexer Rx band isolation value is about 51 dB. Tx-band isolation. the transmit channel power also leaks into the receiver. In this case, the leakage is outside the receiver passband but at a relatively high level. It combines with Rx band jammers to create cross-modulation products that fall in-band to desensitize the receiver. The required Tx-band isolation depends on the PA channel power and Tx-band losses between the PA and LNA. Minimum duplexer Tx-band isolation value is about 58dB. Passband ripple. the loss of this fairly narrowband device is not flat across its passband. Passband ripple increases the receive or transmit insertion loss at specific frequencies, creating performance variations across the band.s channels, and should be controlled. Return loss. minimize mismatch losses with typical return losses of 10 dB or more (VSWR <2:1). Power handling. high power levels in the transmit path must be accommodated without degraded performance. The specified level depends on the operating band class and mobile station class (per the applicable standard), as well as circuit losses and antenna EIRP. Several duplexer characteristics depend upon its source and load impedances. QUALCOMM strongly recommends an isolator be used between the UMTS PA and duplexer to assure proper performance.

- 31 -

3. TECHNICAL BRIEF

3.5.7 UMTS Rx RF filter (FL103 : EFCH2140TDE1)


Frequency range : 2110 ~ 2170MHz An RF filter is located between the UMTS LNA and mixer. Insertion loss is important, but not as critical as losses before the LNA. The most important parameters of this component include: Out-of-band rejection or attenuation levels, usually specified to meet these conditions: - FFar out-of-band signals - ranging from DC up to the first band of particular concern and from the last band of particular concern to beyond three times the highest passband frequency. - Tx-band leakage - the transmitter channel power, although attenuated by the duplexer, still presents a cross-modulation threat in combination with Rx-band jammers. The RF filter must provide rejection of this Tx-band leakage. - Other frequencies of particular concern . bands known to include other wireless transmitters that may deliver significant power levels to the receiver input.

Table 1.3 WCDMA Rx SAW Filter Specification

- 32 -

3. TECHNICAL BRIEF

3.5.8 Bluetooth (M100 : LBRQ-2B43A)


The MSM6245 includes BT baseband embedded BT 1.1 compliant baseband core, so the other bluetooth components are an bluetooth RF module and Antenna. Figure1.9 shows the bluetooth system architecture in the U250/KU250.

MSM6245

Bluetooth baseband

[Figure1.9] Bluetooth system architecture

- 33 -

3. TECHNICAL BRIEF

3. BB Technical Description
3.6 Digital Baseband(DBB/MSM6245)
3.6.1 General Description
A. Features(MSM6245)
Support for multimode operation - tri-band WCDMA (UMTS), quad-band GSM/GPRS/EDGE Support for WCDMA (UMTS) uplink data rate up to 384 kbps High-performance ARM926EJ-S running at up to 225 MHz ARM Jazelle Java hardware acceleration for faster Java-based games and other applets QDSP4000 high-performance DSP cores Integrated Bluetooth 1.2 baseband processor for wireless connectivity to peripherals Qcamera with 30 fps QCIF viewfinder resolution, and support for 2 MP camera sensors Direct interface to digital camera module with video front end (VFE) image processing True 3D graphics for advanced wireless gaming SecureMSM v2.0 includes support for Open Mobile Alliance (OMA) DRM v2.0, SIM-lock and IMEI integrity. Support for Q-fuse. Only trusted boot is supported Audio that is on par with portable music players Vocoder support (AMR, FR, EFR, HR) Advanced 14 x 14 mm, 0.5 mm pitch, 409-pin lead-free CSP packaging technology SD/SDIO hardware support

- 34 -

3. TECHNICAL BRIEF

USB

Bluetooth RF Module VCTCXO

PM6650 -2M

SPK/RCV

GSM Block
MIC GSM PAM
GSM TX SAW

GSM900 Tx

GSM1800/1900 Tx GSM900 Rx GSM1800 Rx GSM1900 Rx

GSM VCO

MAIN LCD

MSM6245
Front End Module

1.3M CAM

WCDMA Block RTR6275


COUPLER

VGA CAM

WCDMA PAM

WCDMA TX SAW U-SIM

HDET WCDMA2100 Tx Duplexer WCDMA2100 Rx WCDMA VCO


NAND, SDRAM FLASH

WCDMA RX SAW

KEYPAD

AntSW Logic

Figure 1.10 Simplified Block Diagram

- 35 -

3. TECHNICAL BRIEF

3.7 Block Diagram(MSM6245)

SDRAM 512Mbit

NAND Flash 512Mbit

LCD (1.76inch)

Camera 1.3M

CAMERA PROCESSING (Default 8bit Interface) GRAPHICS

EBI 1

EBI 2

DUAL MEMORY BUS

GSM/GPRS/EDGE processor

MSM6245
Modem QDSP 4000 PLL ARM 926ejs With Jazelle

UMTS, WCDMA

VGA camera

Open GL ES 3D, 2D VIDEO MPEG-4 H.263, H.264 QDSP 4000

BT 1.2 processor

UART2 / RUIM1

UART3 / PMIC SBI

CONNECTIVITY Keypad I/F AUDIO MP3, AAC, EVRC, QCELP AMR, CMX, MIDI

GPIO RF SBI Rx ADC Tx DAC

I/O Conn

UART1

JTAG

USB

PM6650

USIM

US B

Figure 1.11 Simplified Block Diagram of MSM6245

- 36 -

3. TECHNICAL BRIEF

3.8 Subsystem(MSM6245)
3.8.1. ARM Microprocessor Subsystem
The MSM6245 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM, including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a Generic single-wire serial bus interface (SSBI) the ARM926EJ-S configures and controls the functionality of the RTR6275, RFR6275 and PM6650 devices.

3.8.2. WCDMA R99 features


The MSM6245 device supports release 99 June 2004 of the W-CDMA FDD standard, including the following features: All modes and data rates for W-CDMA frequency division duplex (FDD), with the following restrictions: The downlink supports the following specifications: - Up to four physical channels, including the broadcast channel (BCH), if present - Up to three dedicated physical channels (DPCHs) - Spreading factor (SF) range support from 4 to 256 - The following transmit diversity modes are supported: Space time transmit diversity (STTD) Time-switched transmit diversity (TSTD) Closed-loop feedback transmit diversity (CLTD) The uplink supports the following specifications: The uplink provides the following UE support: - One physical channel, eight TrCH, and 16 TrBks starting at any frame boundary - A maximum data rate of 384 kbps Full SF range support from 4 to 256 SMS (CS and PS) PS data rate - 384 kbps DL / 384 kbps UL CS data rate - 64 kbps DL / 64 kbps UL AMR (all rates)

- 37 -

3. TECHNICAL BRIEF

3.8.3. GSM features


The following GSM modes and data rates are supported by the MSM6245 device hardware. Support modes conform to release '99 specifications of the sub-feature. Voice features FR EFR AMR HR A5/1, A5/2, and A5/3 ciphering Circuit-switched data features 9.6k 14.4k Fax Transparent and non-transparent modes for CS data and fax No sub-rates are supported.

3.8.4. GPRS features


Packet switched data (GPRS) DTM (Simple Class A) operation Multi-slot class 12 data services CS schemes: CS1, CS2, CS3, and CS4 GEA1, GEA2, and GEA3 ciphering Maximum of four Rx timeslots per frame

3.8.5. EDGE features


EDGE E2 power class for 8 PSK DTM (simple Class A), multi-slot class 12 Downlink coding schemes - CS 1-4, MCS 1-9 Uplink coding schemes - CS 1-4, MCS 1-9 BEP reporting SRB loopback and test mode B 8-bit, 11-bit RACH PBCCH support 1 phase/2 phase access procedures Link adaptation and IR NACC, extended UL TBF.

- 38 -

3. TECHNICAL BRIEF

3.8.6. MSM6245 device audio processing features


Integrated wideband stereo CODEC 16-bit DAC with typical 88 dB dynamic range Supports sampling rates up to 48 kHz on the speaker path and 16 kHz on the microphone path VR- Voice mail + voice memo Acoustic echo cancellation Audio AGC Audio Codecs: AMR-NB, AAC, AAC Plus, Enhanced AAC Plus, Windows Audio v9, Real Audio 8 (G2) Internal vocoder supporting AMR, FR, EFR, and HR

3.8.7. MSM6245 microprocessor subsystem


Industry standard ARM926EJ-S embedded microprocessor subsystem 16 kB instruction and 16 kB data cache Instruction set compatible with ARM7TDMI ARM version 5TEJ instructions Higher performance 5 stage pipeline, Harvard cached architecture Higher internal CPU clock rate with on-chip cache Java hardware acceleration Enhanced memory support 75 MHz and 90 MHz bus clock for SDRAM 32-bit SDRAM Dual memory buses separating the high-speed memory subsystem (EBI1) from low-speed peripherals (EBI2) such as LCD panels 1.8 memory interface support for EBI1 and 1.8 V or 2.6 V memory interface support EBI2 NAND FLASH memory interface - 8/16-bit data I/O width NAND flash support - 1- or 4-bit ECC - 512-byte/2KB page-size support - 2 chip selects supported for NAND Flash Boot from NAND Low-power SDRAM (LP-SDRAM) interface Internal watchdog and sleep timers

3.8.8. Supported interface features


USB On-the-Go core supports both slave and host functionality Three universal asynchronous receiver transmitter (UART) serial ports USIM controller (via UART) Integrated 4-bit secure digital (SD) controller for SD and Mini SD cards Parallel LCD interface General-purpose I/O pins External keypad interface

- 39 -

3. TECHNICAL BRIEF

3.8.9. Supported multimedia features


Provide additional general purpose MIPS by using: Two QDSP4000s Dedicated hardware accelerators and compression engines Improve Java, BREW, and game performance Integrated Java and 2D/3D graphics accelerator with Sprite engine Enable various accessories via USB host connectivity. Integrated USB host controller functionality Enable compelling visual and audio applications. QcameraTM High-quality digital camera processing, supporting CCD or CMOS image sensors up to 2MP 30 fps QCIF viewfinder QtvTM Audio and video decoder that supports VOD, MOD and Broadcast multimedia services. Audio codecs supported: AMR-NB, AMR-WB, AMR-WB+, AAC, AAC Plus, Enhanced AAC Plus, Windows Media Audio v9, RealAudio v8 Integrated stereo wideband codec for music/digital clips CMX Video codecs supported: MPEG-4, H.263, H.264, Windows Media v9 and RealNetworks v10 Video telephony services: QvideophoneTM A two-way mobile video conferencing solution that delivers 15 fps @ QCIF, 64kbps Video codecs supported: MPEG-4 and H.263 Audio codecs supported: AMR-NB. QcamcorderTM Real time mobile video encoder Video codecs supported: MPEG-4, H.263.H.264 Audio codecs supported: AMR-NB Recording performance: 15 fps @ QCIF, 192 kbps CMXTM (MIDI and still image, animation, text, LED/vibrate support) 72 simultaneous polyphonic tones 44 kHz sampling rate 512 kB wave table Support of universal file formats Standard MIDI Format (SMF) SP-MIDI SMAF Audio playback (MA-2, MA-3, MA-5) XMF/OLS MFi (requires Docomo license)

- 40 -

3. TECHNICAL BRIEF

PNG decoder Pitch bend range support LED/vibrate support Scalable Vector Graphics (SVG- Tiny 1.1 + SVG Tiny 1.2) MLZ decoder Integrated PNG/SAF A.T.

Table 1-1 Summary of MSM6245 device features Note: 1. At this time, only 32-bit SDRAM is supported on the MSM6245 device. There are potential MIPS issues when running Bluetooth and video telephony concurrently with any other memory configuration. 16-bit SDRAM and NOR FLASH are currently being evaluated and documentation will be updated accrdingly in the next revision.

- 41 -

3. TECHNICAL BRIEF

Table 1-2 Description of RF configurations

- 42 -

3. TECHNICAL BRIEF

3.8.10. Stereo Wideband CODEC


The MSM6245 device integrates a wideband voice/audio CODEC into the mobile station modem (MSM). The CODEC supports two differential microphone inputs, one differential earphone output, one single-ended earphone output, and a differential analog auxiliary interface. The CODEC integrates the microphone and earphone amplifiers into the MSM6245 device, reducing the external component count to just a few passive components. The microphone (Tx) audio path consists of a two-stage amplifier with the gain of the second stage set externally. The Rx/Tx paths are designed to meet the ITU-G.712 requirements for digital transmission systems.

3.8.11. Vocoder Subsystem


The MSM6245 devices QDSP4000 supports AMR,FR,EFR and HR. In addition, the QDSP4000 has modules to support DTMF tone generation, DTMF tone detection, Tx/Rx volume controls, Tx/Rx automatic gain control (AGC), Rx Automatic Volume Control (AVC), ear seal echo canceller (ESEC), Acoustic Echo Canceller (AEC), Noise Suppression (NS), and programmable, 13-tap, Type-I, FIR, Tx/Rx compensation filters. The MSM6245 devices integrated ARM9TDMI processor downloads the firmware into the QDSP4000 and configures QDSP4000 to support the desired functionality.

3.8.12. ARM Microprocessor subsystem


The MSM6245 device uses an embedded ARM926EJ-S microprocessor. This microprocessor, through the system software, controls most of the functionality for the MSM device, including control of the external peripherals such as the keypad, LCD, RAM, ROM, and EEPROM devices. Through a generic single serial bus interface (SSBI) the ARM926EJ-S configures and controls the functionality of the RFR6275, RTR6275, and PM6650 devices.

3.8.13. Mode Select and JTAG Interfaces


The mode pins to the MSM6245 device determine the overall operating mode of the ASIC. The options under the control of the mode inputs are Native mode, which is the normal subscriber unit operation, ETM mode, which enables the built-in trace mode, and test mode for factory testing. The MSM6245 device meets the intent of the ANSI/IEEE 1149.1A-1993 feature list. The JTAG interface can be used to test digital interconnects between devices within the mobile station during manufacture.

- 43 -

3. TECHNICAL BRIEF

3.8.14. General-Purpose Input/Output Interface


The MSM62450 device has general-purpose bidirectional input/output pins. Some of the GPIO pins have alternate functions supported on them. The alternate functions include USB interface, additional RAM, ROM, general-purpose chip selects, parallel LCD interface, and a UART interface. The function of these pins is documented in the various software releases.

3.8.15. UART
The MSM6245 device employs three UARTs. UART1 has dedicated pins while UART2 and UART3 share multiplexed pins.

3.8.16. USB
The MSM6245 device integrates a universal serial bus (USB) controller that supports both unidirectional and bidirectional transceiver interfaces. The USB controller acts as a USB peripheral communicating with the USB host. MSM6245 supports the 3-wire functionality.

- 44 -

3. TECHNICAL BRIEF

3.9 Power Block


3.9.1. General
MSM6245, included RF, is fully covered by PM6650(Qualcomm PMIC). PM6650 cover the power of MSM6245, MSM memory, RF block, Bluetooth, USIM and TCXO. Major power components are :

3.9.2. PM6650
The PM6650 device (Figure 1-1) integrates all wireless handset power management. The power management portion accepts power from all the most common sources - battery, external charger, adapter, coin cell back-up - and generates all the regulated voltages needed to power the appropriate handset electronics. It monitors and controls the power sources, detecting which sources are applied, verifying that they are within acceptable operational limits, and coordinates battery and coin cell recharging while maintaining the handset electronics supply voltages. Eight programmable output voltages are generated using low dropout voltage regulators, all derived from a common trimmed voltage reference. A dedicated controller manages the TCXO warm-up and signal buffering, and key parameters (under-voltage lockout and crystal oscillator signal presence) are monitored to protect against detrimental conditions. MSM device controls and statuses the PM6650 IC using Single Serial Bus Interface (SSBI) supplemented by an Interrupt Manager for time-critical information. Another dedicated IC Interface circuit monitors multiple trigger events and controls the power-on sequence.

- 45 -

3. TECHNICAL BRIEF

Figure 1.12 PM6650 Functional Block Diagram

- 46 -

3. TECHNICAL BRIEF

3.9.3. Charging control


A programmable charging block in PM6650 is used for battery charging. It is possible to set limits for the charging current. The external supply typically connects directly to pin (VCHG). The voltage on this pin (VCHG) is monitored by detection circuitry to ascertain whether a valid external supply is applied or not. For additional accuracy or to capture variations over time, this voltage is routed internally to the housekeeping ADC via the analog multiplexer. PM6650 circuits monitor voltages at VCHARGER and ICHARGE pins to determine which supply should be used and when to switch between the two supplies. These pins are connected to the Source (or emitter) and Drain (or collector) contacts of the pass transistor respectively.

4.2V~3.82V 100~70 (%)

3.81V~3.74V 69~45 (%)

3.73V~3.69V 44~20 (%)

3.68V~3.59V 19~3 (%)

3.58V~3.20V 2~0 (%)

Figure 1.13 U250/KU250 Battery Bar Display(Stand By Condition)

- 47 -

3. TECHNICAL BRIEF

Trickle Charging
Trickle Charging of the main battery, enabled through SBI control and powered from VDD, is provided by the PM6650 IC, The trickle charger is on-chip programmable current source that supplies current from VDD to pin (VBAT). Trickle charging can be used for lithium-ion and nickelbased batteries, with its performance specified below (3.2V). The charging current is set to 80mA.

Parameter Trickle Current

Min 60

Typ 80

Max 100

Unit mA

- 48 -

3. TECHNICAL BRIEF

Constant Current Charging


The PM6650 IC supports constant current charging of the main battery by controlling the charger pass transistor and the battery transistor. The constant current charging continues until the battery reaches its target voltage, 4.2V.

Constant Voltage Charging


Constant voltage charging begins when the battery voltage reaches a target voltage, 4.2V. The end of constant voltage charging is commonly detected 10% of the full charging current. Charging Method : CC & CV (Constant Current & Constant Voltage) Maximum Charging Voltage : 4.2V Maximum Charging Current : 600mA Nominal Battery Capacity : 950mAh Charger Voltage : 5.1V Charging time : Max 3h (Except time trickle charging) Full charge indication current (icon stop current) : 100mA Low battery POP UP : Idle - 3.58V, Dedicated(GSM/WCDMA) - 3.58V Low battery alarm interval : Idle - 3 min, Dedicated - 1min Cut-off voltage : 3.20V

- 49 -

3. TECHNICAL BRIEF

3.10 External memory interface


The MSM6245 device was designed to provide two distinct memory interfaces. EBI1 was targeted for supporting high speed synchronous memory devices. EBI2 was targeted towards supporting slower asynchronous devices such as LCD, NAND flash, SDRAM, etc. EBI1 Features - 16 bit static and dynamic memory interface - 32 bit dynamic memory interface - 24 bits of address for static memory devices which can support up to 32MBytes on each chip select - Synchronous burst memories supported (burst NOR, burst PSRAM) - Synchronous DRAM memories supported - Byte addressable memory supporting 8 bit, 16 bit and 32 bit accesses - Pseudo SRAM (PSRAM) memory support EBI2 Features - Support for asynchronous FLASH and SRAM(16bit & 8bit). - Interface support for byte addressable 16bit devices (UB_N & LB_N signals). - Support for 8 bit/16bit wide NAND flash. - Support for parallel LCD interfaces, port mapped of memory mapped(18 or 16 bit). 512Mb NAND(8bit) flash memory + 512Mb SDRAM (32bit) Interface Spec Device FLASH SDRAM Part Name HYC0UEH0MF3P HYC0UEH0MF3P Maker hynix hynix Read Access Time 60 ns 7 ns Write Access Time 60 ns 7 ns

Table#1. External memory interface

- 50 -

3. TECHNICAL BRIEF

EBI1
ADDRESS[14:0] DATA[31:0]

EBI2

NAND_CS* NAND_RE*

WE*

NAND_WE* NAND_CLE

NAND 512Mb (64MB)

SDRAM 512Mb

CS* CAS* RAS* CLK_EN CLK DQM[3:0]

MSM6245

NAND_WP* NAND_ALE NAND_READY DATA[7:0]

Figure 1.14 Simplified Block Diagram of Memory Interface

- 51 -

3. TECHNICAL BRIEF

3.11 H/W Sub System


3.11.1. RF Interface
A. RTR6275(WCDMA_Tx, GSM_Tx/Rx) MSM6245 controls RF part(RTR6275) using these signals. SBST : SSBI I/F signals for control Sub-chipset PA_ON1 : Power AMP on RF part RX0_I/Q_M/P,TX_I/Q_M/P : I/Q for T/Rx of RF TX_AGC_ADJ : control the gain of the Tx signal prior to the power amplifier DAC_REF : Reference input to the MSM Tx data DACs

XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77 UART3_RFR_N_GPIO87 UART2_DP_RX_DATA_GPIO89 SYNTH0_GP_PDM0_GPIO92 SBST1_GPIO93

L25 H6 F18 H18 H13

RCV_EN_N Close to MSM LCD_IF_MODE_1 2K TCXO_EN PA_ON TX_QM TX_QP TX_IM TX_IP DAC_REF R213 C246 TX_AGC_ADJ TRK_LO_ADJ

TX_AGC_ADJ L13 TRK_LO_ADJ F19 TCXO_EN_GPIO94 F17 PA_ON0 Q_OUT_N Q_OUT I_OUT_N I_OUT DAC_REF Q_IM_CH1 Q_IP_CH1 I_IM_CH1 I_IP_CH1 Q_IM_CH0 Q_IP_CH0 I_IM_CH0 I_IP_CH0

B12 A13 B13 F12 W23 V23 V25 W25 AA25 Y25 AB25 AC25

RF
RX_QM RX_QP RX_IM RX_IP

GP_PDM2_PA_RAN_GE1 H17 GP_PDM1_PA_RAN_GE0 TRST_N TCK TMS TDI TDO RTCK AUX_PCM_CLK_GRFC14_GPIO80 AUX_PCM_DIN_GRFC13_GPIO14 AUX_PCM_DOUT_GRFC12_GPIO103 AUX_PCM_SYNC_GRFC11_GPIO102 TX_ON_GRFC10 GRFC8_GPIO11 GRFC7_GPIO10 GRFX6_GPIO9 GRFC5_AUX_SBST_GPIO8 GRFC4_AUX_SBCK_GPIO7 GRFC3_GPIO6 GRFC2_GPIO5 GRFC1_AUX_SBDT_GPIO4 GRFC0_GPIO3 BT_CLK_GPIO25 BT_SBST_GPIO24 BT_SBCK_GPIO23 BT_SBDT_GPIO22 BT_TX_RX_N_GPIO21 BT_DATA_GPIO20
H15 D16 F15 D15 A17 H16 K19 N21 G4 J8 H12 B4 T23 T19 D11 H10 F10 D9 A8 B8 G23 F23 E26 E25 H21 R19

D17

PA_R0

SPK_AMP_EN

TX_ON

ANT_SEL1 ANT_SEL0

GSM_PA_BAND GSM_PA_EN

BT_CLK BT_SBST BT_SBCK BT_SBDT BT_TX_RX_N BT_DATA

Figure 1.15 Schematic of RF Interface of MSM6245

- 52 -

33nF

A12

3. TECHNICAL BRIEF

B. the others
TRK_LO_ADJ : TCXO(19.2M) Control PA_ON : WCDMA(2100) TX Power Amp Enable ANT_SEL[0-2] : Ant Switch Module Mode Selection(WCDMA,GSM Tx/Rx,DCS-PCS Tx/Rx) GSM_PA_BAND : GSM/DCS-PCS Band Selection of Power Amp GSM_PA_RAMP : Power Amp Gain Control of APC_IC GSM_PA_EN : Power Amp Gain Control Enable of APC_IC

- 53 -

3. TECHNICAL BRIEF

3.11.2. MSM Sub System


3.11.2.1. USIM Interface SIM interface scheme is shown in Figure. And, there control signals are followed USIM_CLK : USIM Clock USIM_Reset : USIM Reset USIM_Data : USIM Data T/Rx

VREG_UIM 2.85V USIM CLK USIM Reset USIM CLK

MSM6245

PM6650

USIM Reset USIM Data

USIM

USIM Data

Figure 1.16 SIM Interface 3.11.2.2. UART Interface UART signals are connected to MSM GPIO through IO connector with 115200 bps speed. GPIO_Map GPIO_96 GPIO_95 Name UART_RXD UART_TXD Note Data_Rx Data_Tx Table. UART Interface

- 54 -

3. TECHNICAL BRIEF

3.11.2.3. USB The MSM6245 device contains a Universal Serial Bus (USB) interface to provide an efficient interconnect between the mobile phone and a personal computer (PC). The USB interface of the MSM6245 was designed to comply with the definition of a peripheral as specified in USB Specification, Revision 1.1. Therefore, by definition, the USB interface is also compliant as a peripheral with the USB Specification, Revision 2.0. The USB Specification Revision 1.1 defines two speeds of operation, namely low-speed (1.5 Mbps) and full-speed (12 Mbps), both of which are supported by the MSM6245.
Name USB_DAT USB_SE0 USB_OE_N USB_VBUS USB_D+ USB_DNote Data to/from MSM Data to/from MSM Out-Put Enable of Transceiver USB_Power From Host(PC) USB Data+ to Host USB Data- to Host

Table. USB Signal Interface

UART3_CTS_N_GPIO86 UART3_DP_RX_DATA_GPIO85 UART3_DP_TX_DATA_GPIO84 D6 GPIO40 D7 GPIO42

MMC_CMD_GPIO30 MMC_DATA_SDCC_DAT0_GPIO32 MMC_CLK_SDCC_CLK_GPIO31

UART2_RFR_N_GPIO91 UART2_CTS_N_GPIO90 UART2_DP_TX_DATA_GPIO88

12

USB_OE_N USB_CTL_N USB_VBUS USB_DAT USB_D+ USB_SE0 USB_DR309 2.2K

13 14 15 16 17 18 19 20 21

VREG_5V USB_OE_N VSW_5V USB_CTL_N USB_VBUS USB_DAT USB_D_P USB_SE0 USB_D_M GP1_DRV_N( LCD DRV N 22

M21

M19

USB_DAT_VP USB_SE0_VM USB_OE_TP_N

H14

M16

N26

N23

N25

L23

L14

G6

E4

F4

USIM_CLK USIM_RST_N USIM_DATA

USB_DAT USB_SE0 USB_OE_N

PM_INT_N PS_HOLD

Figure 1.17 Schematic of USB block(MSM6245 Side & PM6650 Side)

MMC_CMD MMC_DATA MMC_CLK

C336 4.7u 1608

- 55 -

3. TECHNICAL BRIEF

3.11.3 HKADC(House Keeping ADC)


The MSM6245 device has an on-chip 8-bit analog-to-digital converter (HKADC) which is tended to digitize DC signals corresponding to analog parameters such as battery voltage, temperature, and RF power levels. The MSM6245 device has six analog input pins which are multiplexed to the input of the internal HKADC.

Figure 1.18 MSM6245 HKADC Block diagram

Channel HKADC0 HKADC1 HKADC2 HKADC3 HKADC4 HKADC5

Signal AMUX_OUT VBATT_SENSE NC NC PCB_Rev_ADC Battery_THERM

Note RF PAM Temperature Check Battery voltage level NC NC PCB Version Check Battery Temperature Check

Table. HKADC channel table

- 56 -

3. TECHNICAL BRIEF

3.11.4. Key Pad


There are 23 main key buttons in Figure. Shows the Keypad circuit. END Key is connected to PMIC(PM6650). COL0 ROW(0) ROW(1) ROW(2) ROW(3) ROW(4) 1 4 7 * 2 5 8 0 COL1 COL2 3 6 9 # COL3 CLR LEFT OK SEND DOWN COL4 MENU UP RIGHT SEARCH BACK

Table. Key Matrix Mapping Table

VREG_MSMP_2.7V

KEY MAP
100K

R423

100K

RA400 1 3 5 7

2 4 6 8

CLR

MENU

KEY_ROW(0)

400
1 KEY_ROW(1)

401
2

402
3

LEFT

UP

403
4 KEY_ROW(2)

404
5

405
6

OK

RIGHT

406
7 KEY_ROW(3)

407
8

408
9

SND

SEARCH

HOT400
HOT4 KEY_ROW(4) KEY_COL(0) KEY_COL(1) KEY_COL(2) KEY_COL(3) KEY_COL(4)

409
0

HOT401
HOT3

DN

BACK

Figure 1.19 Main Keypad Circuit

END
PM_ON_SW_N END

Figure 1.20 END Keypad Circuit

- 57 -

3. TECHNICAL BRIEF

3.11.5 Camera Interface


U250/KU250 Installed a 1.3M Pixel and 0.3Mega Camera. Below figure shows the camera socket type connector and camera I/F signal.

CAMERA MEGA CAMERA CONNECTOR


PGND1 PGND2 PGND3 PGND4 PGND5 PGND6 PGND7 PGND8 32 31 30 29 28 27 26 25 REV_1.0 20 19 18 12 11 10 9 7 R436 0 CAM_PCLK CAM_VSYNC_OUT CAM_HSYNC_OUT MEGA_CAM_PWR_DOWN I2C_SCL I2C_SDA MEGA_CAM_RESET_N CAM_MCLK R437 20

CAM_DATA_OUT(0) CAM_DATA_OUT(1) CAM_DATA_OUT(2) CAM_DATA_OUT(3) CAM_DATA_OUT(4) CAM_DATA_OUT(5) CAM_DATA_OUT(6) CAM_DATA_OUT(7)

22 23 24 1 2 3 4 5

D0 D1 D2 D3 D4 D5 D6 D7

CN403

PCLK VSYNC HSYNC STANDBY SCK SDA RESETB MCLK

8 15 21 6 17 13 14 16

DGND1 DGND2 DGND3 AGND1 AGND2 DVDD VDDIO AVDD

C411 C412

VREG_CAM_AVDD_2.8V VREG_CAM_DVDD_1.8V C448 C414 C415 C413 10p C449 NA

0.1uF 1u

0.1u

10p

NA

REV_1.0 COMMON_CAM_MCLK

ICVE21184E150R500FR CAM_DATA(0) CAM_DATA(1) CAM_DATA(2)


1 2 3 4 INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 G1 INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 G2 9 8 7 6

ICVE21184E150R500FR CAM_DATA_OUT(0) CAM_DATA_OUT(1) CAM_DATA_OUT(2) CAM_DATA(3) CAM_DATA(4) CAM_DATA(5)


1 2 3 4 INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 G1 INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 G2 9 8 7 6

CAM_DATA_OUT(3) CAM_DATA_OUT(4) CAM_DATA_OUT(5)

10

FL406 ICVE21184E150R500FR CAM_DATA(6) CAM_DATA(7) CAM_VSYNC CAM_HSYNC


1 2 3 4 INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 G1 INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 G2 9 8 7 6

FL407

CAM_DATA_OUT(6) CAM_DATA_OUT(7) CAM_VSYNC_OUT CAM_HSYNC_OUT

FL408

VT_CAMERA_CONNECTOR
C424 VREG_CAM_AVDD_2.8V VGA_CAM_RESET_N I2C_SCL I2C_SDA 20 19 18 17 16 NA

GND8

GND7

P20 P19 P18 P17 P16

10

VREG_CAM_DVDD_1.5V COMMON_CAM_MCLK REV_1.0 CAM_PCLK CAM_DATA_OUT(0)

GND1 GND3

6 7 8 9 10

GND4

P6 P7 P8 P9 P10

GND2

CAM_DATA_OUT(1) CAM_DATA_OUT(2) CAM_DATA_OUT(3) CAM_DATA_OUT(4)

VA430

EVL14K02200

1 2 3 4 5

GND6 GND5

P1 P2 P3 P4 P5

CN404

P15 P14 P13 P12 P11

15 14 13 12 11

10

CAM_HSYNC_OUT CAM_VSYNC_OUT CAM_DATA_OUT(7) CAM_DATA_OUT(6)

CAM_DATA_OUT(5)

Figure 1.21 Camera Socket Type Connector

- 58 -

3. TECHNICAL BRIEF

The MEGA Camera module is connected to socket type connector with 24 pin (F95M08). Its interface is dedicated camera interface port in MSM6245. The camera port supply 24.576MHz master clock to camera module and receive 49.152MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from MSM6245.

No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

Name CAM_DATA_OUT(3) CAM_DATA_OUT(4) CAM_DATA_OUT(5) CAM_DATA_OUT(6) CAM_DATA_OUT(7) GND MCLK GND MEGA_CAM_RESET_N I2C_SDA I2C_SCL MEGA_CAM_PWR_DN VREG_CAM_DVDD_1.8V VREG_CAM_AVDD_2.8V GND VREG_CAM_AVDD_2.8V GND CAM_HSYNC_OUT CAM_VSYNC_OUT CAM_PCLK GND CAM_DATA_OUT(0) CAM_DATA_OUT(1) CAM_DATA_OUT(2)

Port O O O O O GND I GND I O O I I I GND I GND O O O GND O O O

Note Data Data Data Data Data GND Master Clock(24.576M) GND Camera reset signal I2C Data I2C Clock Camera power down DVDD VDDIO GND AVDD GND Horizontal Sync Vertical Sync Pixel Clock (49.152M) GND Data Data Data

Table. Interface between MEGA Camera Module and MAIN PCB (in camera module)

- 59 -

3. TECHNICAL BRIEF

The VGA Camera module is connected to socket type connector with 20 pin (CLE9120-2761E). Its interface is dedicated camera interface port in MSM6245. The camera port supply 24.576MHz master clock to camera module and receive 12.288MHz pixel clock (15fps), vertical sync signal, horizontal sync signal, reset signal and 8bits data from camera module. The camera module is controlled by I2C port from MSM6245.

No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20

Name
VREG_CAM_DVDD_1.8V

Port I I GND O O O O O O O O O O O GN D I I I I I

Note DVDD Master Clock(24.576M) GND Clock for Camera Data Out(12.288M) Data Data Data Data Data Data Data Data Vertical Sync Horizontal Sync GND I2C Data I2C Clock Camera reset signal Camera I/O Power Camera I/O Power

CAM_MCLK GND CAM_PCLK CAM_DATA(0) CAM_DATA(1) CAM_DATA(2) CAM_DATA(3) CAM_DATA(4) CAM_DATA(5) CAM_DATA(6) CAM_DATA(7) CAM_VSYNC CAM_HSYNC GND I2C_SDA I2C_SCL VGA_CAM_RESET_N VREG_AVDD_2.8V VREG_AVDD_2.8V

Table. Interface between VGA Camera Module and MAIN PCB (in camera module)

- 60 -

3. TECHNICAL BRIEF

3.11.6 Keypad Light


There are 8 Blue LEDs in Main key backlight circuit, which are driven by KYDB_BACKLIGHT line from PM6650.

KEY_BACK_LIGHT LED(8EA)
+VPWR

LD400 LD403 LD406

LEBB-S14H LEBB-S14H LEBB-S14H

R411 100ohm R414 100ohm R417 100ohm LD404 LD407 LEBB-S14H R415

LD402 LD405 LD408

LEBB-S14H LEBB-S14H LEBB-S14H R413 100ohm R416 100ohm R419 100ohm

LEBB-S14H 100ohm R418 100ohm

REV_B : EDLH0013501 --> EDLH0006001 KYBD_BACKLIGHT

Figure 1.22 Schematic of KEY back light circuit (KEY side)

- 61 -

3. TECHNICAL BRIEF

3.11.7. LCD Module (NM176CN1 : Tovis)


- The NM176CN1 model is a Color TFT Main supplied by Tovis. This LCD Module has a 1.76 inch diagonally measured active display area with 176(RGB)X220 resolution. each pixel is divided into Red, Green and Blue sub-pixels and dots which are arranged in vertical stripes. * Features - Display mode(Main LCD) : Normally White, Transmissive TN mode 265K colors. - LCD Driver IC: NT3916 (NOVATEK). - 16 bit CPU interface Parallel

3.11.8. Display & LCD FPC Interface


LCD module is connected to LCD KEY FPCB with 35 pin (XF2B-3545-31A / OMROM) The LCD module is controlled by 16-bit EBI2 in MSM6245.
LCD CONNECTOR
CN400 ICVE21184E150R500FR 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 VA410 EVL14K02200 LCD_MAKER_ID VREG_LCD_2.8V WLED_1 WLED_2 WLED_3 WLED_PWR EVL14K02200
1 2 3 4 INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 G1 INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 G2 9 8 7 6 1 2 3 4 INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 G1 INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 G2 9 8 7 6

ICVE21184E150R500FR
9

G2

3 4

10

INOUT_A4 INOUT_B4 G1 G2

G1

LCD_RESET_N LCD_IF_MODE_0 LCD_IF_MODE_1 LCD_VSYNC

INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4

INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4

1 2 3 4

1 2

INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3

9 8

LCD_CS_N LCD_ADS EBI2_WE_N EBI2_OE_N

7 6

EBI2_DATA(0) EBI2_DATA(1) EBI2_DATA(2) EBI2_DATA(3)

FL400
INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 1 2 3 4

FL401

ICVE21184E150R500FR
9 8 7 6 INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 G2

10

EBI2_DATA(4) EBI2_DATA(5) EBI2_DATA(6) EBI2_DATA(7)

10

G1

FL402
EBI2_DATA(8) EBI2_DATA(9) EBI2_DATA(10) EBI2_DATA(11)

ICVE21184E150R500FR

FL403

ICVE21184E150R500FR EBI2_DATA(12) EBI2_DATA(13) EBI2_DATA(14) EBI2_DATA(15)

10

10

FL405

VA409

PLW0501H-LF D402

0.1u

Figure 1.23 Interface between LCD Module and MAIN PCB.

- 62 -

INSTPAR

C409

3. TECHNICAL BRIEF

3.11.8.1. Audio Signal Processing & Interface


Audio signal processing is divided uplink path and downlink path. The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal and then transmits it to DBB Chip (MSM6245). This transmitted signal is reformed to fit in GSM & WCDMA frame format and delivered to RF Chipset. The downlink path amplifies the signal from DBB chip (MSM6245) and outputs it to receiver (or speaker). The receive path can be directed to either one of two earphone amplifiers or the auxiliary output. The outputs earphone1 (EAR1OP, EAR1ON) and auxiliary out (LINE_P, LINE_N) are differential outputs. Earphone2 (HPH_L, HPH_R) is a single-ended output stage designed to drive a headset speaker. The microphone interface consists of two differential microphone inputs, one differential auxiliary input and a two-stage audio amplifier.

(+16.5dB)

Figure 1.24 Audio Interface Detailed Diagram(MSM6245)

- 63 -

3. TECHNICAL BRIEF

MSM6245 CODEC pins


RCVRCV+ 36

R202

AUDIO
HPH_R HPH_L 220n C200 C201 47p 47p

Near to MSM
MIC2N MIC2P MIC1N MIC1P 22n 22n C204 10p

C202

220n

C203

LINE_N LINE_P

MICBIAS

Place near C212 0.1u 10% MSM pin W18 (CODEC VSS)

C210
AC18 AC17 AA19 AC22 AC21 AC19 AC20 AA17 AE18 AA18 AE19

C211
AE20 AA20 AF22 AF20

AF18

AF19

LINE_ON LINE_OP HPH_R HPH_L EAR1ON EAR1OP MICBIAS AUXOUT HPH_VREF LINE_L_IP LINE_L_IN LINE_R_IP LINE_R_IN AUXIN AUXIP MIC2N MIC2P MIC1N MIC1P CCOMP

AF21

W17

T15

SDCC_DAT1_GPIO99 M25 SDCC_DAT2_GPIO100


M26

F25

Figure 1.25 Audio part schematics

VREG_MSMP_2.7V

2.2K MICBIAS R400 R401 5.1K

I/O CONNECTOR

C400 0.1u

R402

R403 VREG_MSMP_2.7V 51K CN401 HSEJ-18S04-25R

1M

5 HOOK_KEY 1
OUT VCC GND

10K R404 21 19 1 2 3 4 5 6 7 8 9

4 3

VIN-

100K

VIN+

U400 NCS2200SQ2T2G

MIC2N MIC2P
C401 33u R406 100ohm

R405

HPH_L HPH_R
USB_D+ USB_D-

C402

33u

R407 100ohm

EAR_SENSE_N VBATT

Figure 1.26 Audio part schematics

- 64 -

3. TECHNICAL BRIEF

AUDIO SELECT_SPK&RCV
U401 NLAS5223BMNR2G +VPWR C410 0.01u SPKSPK_RCV1 VCC 2 NO1 3 COM1 4 IN1 NC2 6 NC1 GND IN2 7 COM2 8 NO2 9 10

SPK+ SPK_RCV+ RCV_EN_N 10 R421 VA412 RCV+

VA414

RCV-

R422

10

EVL14K02200

EVL14K02200

REV_B

MIC
MICBIAS REV_B : SUMY0010301 --> SUMY0003802 R424 2.2K MIC400 OB4-15L42-C33L 1 2 INSTPAR INSTPAR C418 C419 2.2K 39p 39p 0.1u 0.1u MIC1P MIC1N C416 10u C417 47p

C420

C421

D403 PSD05-LF

PSD05-LF

REV_B : EDTY0008606 --> EDTY0008601

Figure 1.27 Audio part schematics

- 65 -

D404

R425

3. TECHNICAL BRIEF

Audio AMP
NCP2890DMR2
SPK_AMP_EN REV_C : 20K --> 3K LINE_N LINE_P R427 R429 1K 1K C4265600p C422 C423 C4275600p 0.1u 0.1u R428 5.6K R430 5.6K R431 20K C431 NA C425 10u R426 20K 1 2 _SD OUTB 8 SPK-

BYPASSU402

3 INP 4 INM

7 VM 6 VP 5 C428 1u

+VPWR SPK+ C429 C430 1000p 1000p RCVN RCVP

OUTA

L401 SPK_RCVL402 SPK_RCV+

100nH 100nH

REV_E : For Antenna Radiation

Audio part schematics

- 66 -

3. TECHNICAL BRIEF

3.11.8.2. Audio Mode


There are three audio modes (Voice call, speaker phone, MIDI/MP3).
MODE Device Receiver Mode Voice Call Loud Mode Headset Speaker phone Loud Mode Loud Mode MIDI Headset Loud Mode MP3 Headset Headset MP3 Headset MIDI Bell Speaker MP3 Description Receiver Voice Call Speaker Phone Headset Voice Call Speaker Phone Speaker MIDI Bell

Table. Audio Mode

Audio & Sound Main Component There are 6 main components in U250/KU250.
Component 1 2 3 4 5 6 MSM6245 Audio amp Analog Switch Speaker/Receiver MIC Ear jack MIC400 Design No. U201 U402 U401 Maker Part No. MSM6245 NCP2890DMR2 NLAS5223BMNR2G EMS1810TP OB4-15L42-C33L RMBLGG080STSB Note Base-Band Modem 1W Audio Amp Dual Analog Switch Speaker/Receiver -42 dB microphone Ear jack

Table. Audio main component list

- 67 -

3. TECHNICAL BRIEF

3.12 Main Features


1. LG-U250/KU250 Main features
- Bar Type - WCDMA(2100) + GSM Tri-Band (900/1800/1900) - Color LCD (Main:262K TFT, 1.76) - Dual Camera (1.3Mega + VGA(0.3M)) - 1810 speaker/receiver - Stereo Headset - Speaker phone (in GSM and WCDMA) - MP3/AAC decoder and play - MPEG4 encoder/decoder and play/save - JPEG en/decoder - Supports Bluetooth, USB - 950 mAh (Li-Ion)

- 68 -

3. TECHNICAL BRIEF

2. U250/KU250 Main Component


Logic /Audio

RF

Bluetoot h

Logic

Main board (Top)

Main board (Bottom)

- 69 -

3. TECHNICAL BRIEF

RF

SW100
U101 U500 FL101

U100 FL104

U103 X100

Reference SW100 U500 U101 FL101 U100

Description Ant. Switch module Front End module GSM PAM GSM SAW RTR6275

Reference FL104 U103 X100

Description W2100 Duplex WCDMA PAM VCTCXO BT module

- 70 -

3. TECHNICAL BRIEF

Logic / Audio

BAT300

U303 CN403

CN401

U402

Reference BAT300 U303 U402

Description Backup Battery 1.3M Cam. LDO Audio AMP

Reference CN401 CN403

Description MMI connector (18pin) 1.3M Cam. Connector

- 71 -

3. TECHNICAL BRIEF

Logic

CN400

U300
U201

U301

J300
S300

Reference U201 U301 CN400

Description MSM6245_A Memory MCP Main To LCD Connector

Reference U300 J300 S300

Description PMIC U-SIM socket T-FLASH socket

- 72 -

4. TROUBLE SHOOTING

4. TROUBLE SHOOTING
4.1 RF Component

LGMC

- 73 -

4. TROUBLE SHOOTING

Block Diagram Block

Ref. Name

Part Name

Function

Comment

UMTS

- 74 -

4. TROUBLE SHOOTING

4.2 SIGNAL PATH_UMTS RF

Common Tx/Rx UMTX 2100 Tx/Rx UMTX 2100 Tx UMTX 2100 Rx Tx I/Q LO RX I/Q

- 75 -

4. TROUBLE SHOOTING

4.3 SIGNAL PATH_GSM RF

Common Tx/Rx GSM900 Tx DCS/PCS Tx EGSM900 RX PCS Rx DCS RX Tx I/Q LO RX I/Q

- 76 -

4. TROUBLE SHOOTING

4.4 Checking VC-TCXO Block


The reference frequency (19.2MHz) from X100 (VC-TCXO) is used in UMTS TX part, GSM part and BB part.

TCXO X100
DSA321SCE-19.2M
NC3 7 NC4 8 VREG_TCXO_2.85V 3 OUTPUT VCC GND 2 100ohm 4 C182 1000p 1 19.2MHz C181 0.1u C183 VCONT R124 TRK_LO_ADJ VREG_BT_2.85V NC2 NC1 6 5

TP1

TP4
R128 C185 TCXO_PM
VCC

100K C186 1000p 4


3
GND

100p

0.01u

TP2

C187 RTR6275_TCXO

1000p

C188

0.01u

TCXO_BT

U104
TC7SH04FU

TP3

Schematic of the VC-TCXO Block

TP3

TP2

TP4

TP1

Test Point of the VC-TCXO Block

- 77 -

4. TROUBLE SHOOTING

Check C312 of PMIC (U300)

Check R213 of MSM (U201)

- 78 -

4. TROUBLE SHOOTING

4.5 Checking Front-End Module Block


TP1
11 Rev.D L108 19 15nH C117 10p U500 ANT Rev.C

VREG_RF_SMPS
Rev.B

VDD

7 8 10 12 13 15 17 20 21 23

GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 GND10

GSM900_RX1 GSM900_RX2 GSM1800_RX1 GSM1800_RX2 GSM1900_RX1 GSM1900_RX2 WCDMA2100

5 6 1 2 3 4 9 1K 1K R100 R101

D5011

18 CTRL1 22 CTRL2

ANT_SEL0 ANT_SEL1

16 GSM900_TX 14 GSM18001900_TX

C110 33p

C109 33p

Schematic of the Front-End Module Block

TP1

ANT_SEL0 ANT_SEL1

Test Point of the Front-End Module Block

- 79 -

4. TROUBLE SHOOTING

Logic Table of the FEM

GSM 1800 / GSM1900 RX GSM 900 RX GSM 900 TX / WCDMA GSM 1800 / GSM 1900 TX

TP1 VREG RF SMPS

- 80 -

4. TROUBLE SHOOTING

4.6 Checking UMTS Block


4.6.1 Checking Tx level
TP1

TP2

TP3

TP4

ANT101 ANT102

TP1
C450 22p
ANT

SW100
G2 G1 RF

C101 56p

1p C437

L101 NA

C102 NA

KMS-507 L102 100nH

TP2
11 Rev.D U500

WCDMA
Rev.D C154 1.5p

Rev_1.0

+VPWR
L404 1.8nH

+VPWR
C155 4.7u C158 15p WS2512_TR1G 10 VCC2 L123 1nH 9 Rev_1.0 8 GND4 RFOUT U103 VCC1 RFIN GND1 VCONT VREF 1 2 3 4 5 TR100 KRX102U
5

TP3
FL104 4 3 PGND ANT RX TX 1 2 C162 3.3p C164 0.5p ACMD-7602

C159 15p

FL102 5 EFCH1950TDF1
IN

L122 NA

C157 10nH

O1 G3 G2 G1

0.5p L125

50OHM

OUT

C165 1p

7 GND3 6 GND2 11 BGND

PA_R0

TP4
PA_ON
Rev.B

COUP

20dB

IN

U102 CP0402A1950DNTR
4 3 2

51R119

VREG_TCXO_2.85V
C170 0.1u

PWR_DET R121 130 R120 47 7dB R122 130 C192 100p

For testing, Max power of UMT 2100 is needed.

- 81 -

4. TROUBLE SHOOTING

- 82 -

4. TROUBLE SHOOTING

4.6.2 Checking UMTS PAM Control Block PAM control signal


1. PWR_DET : UMTS Tx Power Detected value (Check R120) 2. TX_AGC_ADJ : UMTS RTR6275 Tx Amp Gain Control 3. VREG_TCXO_2.85V : UMTS PAM enable (C170) (about 2.85V) 4. +VPWR : UMTS PAM Main Voltage ( 3V < +VPWR < 4.2V) 5. PA_ON : Turns the PA on and off 6. PA_R0 : Control signals that step the active PA mode and bias

VREG_TCXO_2.85

+VPWR

PWR_DET

- 83 -

4. TROUBLE SHOOTING

4.6.3 Checking RF Rx Level

TP1

TP2 TP4

Vbias

TP3

ANT101 ANT102

TP1
C450 22p
ANT

SW100
G2 G1 RF

C101 56p

1p C437

L101 NA

C102 NA

KMS-507 L102 100nH

U500

TP2 TP4
WCDMA
Rev.D C154 1.5p Rev_1.0 VDD_RX C156 100p

Vbias

+VPWR
L404 1.8nH C155 4.7u C158 15p WS2512_TR1G 10 VCC2 FL104 4 3 PGND ANT RX TX 1 2 C162 3.3p C164 0.5p C165 1p 7 GND3 6 GND2 11 BGND VCONT VREF 4 5 L123 1nH 9 Rev_1.0 8 GND4 RFOUT U103 VCC1 RFIN GND1 1 2 3 C159 15p

+VPWR
4

FL102 5 EFCH1950TDF1
IN

L121 1nH

L122 NA

C157 10nH

O1 G3 G2 G1

Rev.D L409 4.7nH

Rev.D C444 2.2p

C161 2.2p

ACMD-7602 0.5p L125

PA_R0

OUT

IN

50OHM

COUP

20dB

TR100 KRX102U
5 1

TP3
2

5 1
IN

G2 O2 FL103 G1 O1 EFCH2140TDE1

L411 4.7nH C445 2.2p

U102 CP0402A1950DNTR
4 3

PA_ON
Rev.B

L408 10nH

L410 4.7nH

51R119

VREG_TCXO_2.85V
C170 0.1u

PWR_DET R121 130 R120 47 7dB R122 130 C192 100p

L128 1.8nH

C174 10p Rev.D L407 2.7nH

- 84 -

4. TROUBLE SHOOTING

- 85 -

4. TROUBLE SHOOTING

4.7 Checking GSM Block

1 2 3

- 86 -

4. TROUBLE SHOOTING

4.7.1 Checking RF Tx level

TP1

TP3 TP2

4.7.2 Schematic of RF Tx level


SW100
ANT G2 G1 RF

C101 56p

TP1

C102 NA

KMS-507 L102 100nH

ANT

L108 19 15nH C117 10p VDD

11

Rev.D

U500

Rev.C

7 8 10 12 13 15 17 20 21 23

GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 GND10

GSM900_RX1 GSM900_RX2 GSM1800_RX1 GSM1800_RX2 GSM1900_RX1 GSM1900_RX2 WCDMA2100

5 6 1 2 3 4 9 1K 1K R100 R101

D5011

18 CTRL1 22 CTRL2

ANT_SEL0 ANT_SEL1

16 GSM900_TX 14 GSM18001900_TX

C110 33p

C109 33p

Rev.D C124 100p L115 18nH L403 1.5nH

GSM_PA_RAMP

C123 0.01u

C121 33u

L116 10nH 100ohm

R107

C441 5.6p C137 NA

C438 100p C138 NA C139 68p 20 17

C134 0.01u

6 VCC1B

VBATT

TP2 TP3

15 11 19 21

VCC1A

VAPC

DCS_PCS_OUT EGSM_OUT RSVD_GND P_GND

DCS_PCS_IN EGSM_IN ENABLE

3 4 18 1

U101
SKY77318

BS

- 87 -

16 14 13 12 10 9 8 7 5

GND9 GND8 GND7 GND6 GND5 GND4 GND3 GND2 GND1

4. TROUBLE SHOOTING

4.7.3 Checking RF Tx level

- 88 -

4. TROUBLE SHOOTING

4.7.4 Checking PAM Block


TP1. GSM_PA_RAMP : Power Amp Gain Control. typically, 0.2V < Vramp < 1.6V TP2. GSM_PA_EN : Power Amp Enable (Power ON : higher than 1.25V , Power OFF : lower than 0.4V) TP3. GSM_PA_BAND : Power Amp Band Selection Control (GSM Mode : -0.2V < VBS < 0.4V , DCS/PCS Mode : 1.25V < VBS < 3.0V) TP4. +VPWR : PAM Supply Voltage Vcc higher than 3.0V

TP1 TP4

TP2

TP3

TP4
GSM_PA_RAMP

Rev.D 4 p L403 1.5nH

+VPWR
C123 0.01u C121 33u

EGSM

L116 10nH 100ohm

R107

TP1
C134 0.01u C136 0.01u

C438 100p C138 NA C139 68p 20 17

TP3

6 VCC1B

VCC1A

VBATT

VAPC

FL1
3 4 18 1 R113 100ohm

15 11 19 21

DCS_PCS_OUT EGSM_OUT RSVD_GND P_GND

DCS_PCS_IN EGSM_IN ENABLE

U101
SKY77318

GSM_PA_EN EFC

BS

C149 15p

GND9 GND8 GND7 GND6 GND5 GND4 GND3 GND2 GND1

R117 100ohm

16 14 13 12 10 9 8 7 5

GSM_PA_BAND
C153 15p

TP2

Schematic of GSM PAM Block

- 89 -

4. TROUBLE SHOOTING

4.7.5 Checking RF Rx Block

TP1. DCS RX INPUT


TP1 TP3

TP2. PCS RX INPUT TP3. GSM RX INPUT

TP2

L102 100nH Rev.C U500 ANT 11 Rev.C C439 5p

19

VDD

7 8 10 12 13 15 17 20 21 23

GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 GND10

GSM900_RX1 GSM900_RX2 GSM1800_RX1 GSM1800_RX2 GSM1900_RX1 GSM1900_RX2 WCDMA2100

5 6 1 2 3 4 9 1K 1K R100 R101

TP1

DCS

C105 NA C440 5p

0.5p C190

C442 5.6p D5011 18 CTRL1 22 CTRL2

ANT_SEL0 ANT_SEL1

16 GSM900_TX 14 GSM18001900_TX

TP2
C110 33p C109 33p

PCS

C116 NA C443 5.6p

NA C191

L405

2.7nH L111 5.6nH

GSM_PA_RAMP

TP3
+VPWR
C123 0.01u C121 33u

EGSM

C120 NA

Rev.D C124 100p L115 18nH L403 1.5nH

L406

2.7nH

L116 10nH

Schematic of GSM900/DCS/PCS Rx Block

- 90 -

4. TROUBLE SHOOTING

- 91 -

4. TROUBLE SHOOTING

4.8 Checking Bluetooth Block


Test Point of the Bluetooth Block

TP2

TP1. VREG_BT_2.85V
TP1

TP2. VREG_MSMP_2.7V
TP3

TP3. TCXO_BT TP4. BT ANT Output


TP4

Test Point of the Bluetooth Block

TP4

BLUETOOTH
ACS2450HBAXX
R118
FEED NC1 NC2

TP2
M100
16

LBRQ-2B43A
C171 BT_CLK C172 C173 R123 VREG_MSMP_2.7V 0 0.1uF 2.2u 100p 100p VREG_BT_2.85V 1u 2.2u 1000p 9 3 2 10 14 CLK_REF VCC_OUT VDD_INT VDD_MSM VDD_BAT PGND4 20 PGND3 19 PGND2 18 PGND1 17

ANT

4 SBST 11 SBCK 12 SBDT 5 13 7 1000p C176

C169

NA

L126 NA

ANT103

BT_SBST BT_SBCK BT_SBDT BT_TX_RX_N BT_DATA TCXO_BT

SYNC_DET_TX_EN RX_BB_TX_BB XTAL_IN GND4 15 GND3 8 GND2 6 GND1 1

C179

C177

C180

C178

TP1

TP3

Schematic of the Bluetooth Block

- 92 -

4. TROUBLE SHOOTING

Start

TP1,TP2 Signals exits? YES TP3 Is clock ok? 19.2M

NO Change the Main board

NO Change the X100

YES NO TP4 Signals exits? YES Change the Main board Change the M100

- 93 -

4. TROUBLE SHOOTING

4.9 Power ON Troubleshooting


Power On sequence of U250/KU250 is : PWR key press PM_ON_SW_N go to low, PM6650 KPDPWR_N (pin24) PM6650 Power Up VREG_MSMC_1.2V, VREG_MSME_1.8V, VREG_MSMP_2.7V, VREG_MSMA_2.6V, VREG_TCXO_2.85V power up and system reset assert to MSM6245 Phone booting and PS_HOLD assert to PMIC

Start

NO
Battery voltage. higher than 3.20V?

Change or charging the Battery

YES NO Key press? Check the Key Dome

YES NO
VREG_MSMC_1.2V,VREG_MSMP_2.7V, VREG_MSME_1.8V, VREG_TCXO_2.85V, VREG_MSMA_2.6V power up?

Change the Main board

YES
Is clock ok? R306 : 19.2M X300 : 32.768Khz

NO Check the TXCO

YES Change the Main board

- 94 -

4. TROUBLE SHOOTING

VREG_MSMC

VREG_MSME

VREG_MSMP

X300 : 32.768Khz

VREG_MSMA

R306 : 19.2Mhz

[U250/KU250 Main PCB BOTTOM]

- 95 -

4. TROUBLE SHOOTING

4.10 Charger Troubleshooting

CHARGER
ICHARGEOUT +VPWR SI3493DV-E3 Q301 R313 USB_VBUS 0.1 6 5 4

Q300
QST4

VBATT

D3 D4

C1 1 2

C2

3 B

D1 D2

USB_CTL_N
G

+5V_PWR BATT_FET_N 6 5 4

Q302
QST4

C1 1 2

C2

3 B

CHG_CTL_N ICHARGE

Differential lines, route as equal length as possible !! --> ICHARGE , ICHARGEOUT

Charging Procedure - Connect TA or USB Cable - Control the charging current by PM6650 IC - Charging current flows into the battery Troubleshooting Setup - Connect TA and battery to the phone Check Point - Connection of TA or USB Cable - Charging current path - Battery Troubleshooting Procedure - Check the charger (TA or USB Cable) connector - Check the charging current Path - Check the battery

- 96 -

4. TROUBLE SHOOTING

Start

Check the pin and battery Connect terminals of I/O connector

NO

Connection OK?

Change I/O connector

Yes NO
Is the TA (or USB Cable) voltage 5.1V (or 5.0V)?

Change TA (or USB Cable)

Yes

Is it charging properly After turning on Q301(or Q302) , Q302?

Yes

END

NO

Change the board

[ Charger Troubleshooting Flow ]

- 97 -

4. TROUBLE SHOOTING

Q302

Q300 R313

Q301
[ Charging part ( Main PCB Front ) ]

- 98 -

4. TROUBLE SHOOTING

4. BB Trouble Shooting

4.11 USB Troubleshooting


USB Initial sequence of U250/KU250 is : USB connected to U250/KU250 power on USB_VBUS(Q300) go to 5V USB_D+ go to 3.3V USB_DAT is triggered USB work.

Start

Power is on? YES Cable is inserted? YES Q400 pin 4 is 5V? YES USB_D+ is 3.3V? YES Change the Main board

NO

Go to power on trouble shooting

NO

Insert cable

NO

Check Q300 (pin 4)

NO Check VA401

- 99 -

4. TROUBLE SHOOTING

4.12 SIM Detect Troubleshooting


USIM Initial sequence of U250/KU250 is : USIM_CLK,USIM_RST,USIM_DATA triggered VREG_UIM_2.85V go to 2.8V USIM IF work

Start

Re-insert the SIM card

Work well? No
VREG_UIM_2.85V is 2.85V? USIM_P_CLK is run?

Yes

End

NO

Check J300

YES Change SIM card

Yes Work well? No Change the Main board

End

- 100 -

4. TROUBLE SHOOTING

5 1 2 3 VREG_USIM_2.85V USIM_P_RST_N USIM_P_CLK USIM_P_DATA

USIM
USIM_P_DATA

R317

15K

EVLC18S02003 VA300

5 6 7 8 9 10

J300 HSSC-8P-18 1 GND1 VCC 2 VPP RST 3 CLK IO 4 RSV2 RSV1 11 GND2 GND5 12
GND3 GND4
smd_1005h_5_r smd_1005h_5_r

VREG_USIM_2.85V USIM_P_RST_N USIM_P_CLK

L302 56nH

Figure. USIM part schematics

- 101 -

EVL14K02200 VA301

EVLC18S02003 VA302

C352

33p

0.1u

C353

4. TROUBLE SHOOTING

4.13 Camera Troubleshooting


Camera control signals are generated by MSM6245.

4.13.1 MEGA CAMERA

Start

Check the camera connector and reconnect the camera

Yes Camera is OK? NO END

NO
Change the Main board

Yes NO Check the CAM_MCLK Yes Change the camera Yes Camera is OK NO
Change the Main board Change the Main board

END

- 102 -

4. TROUBLE SHOOTING

4.13.2 VGA CAMERA

Start

Check the camera connector and reconnect the camera

Yes Camera is OK? NO END

NO
Change the Main board

Yes NO
Check the CAM_MCLK

Change the Main board

Yes Change the camera Yes Camera is OK NO


Change the Main board

END

- 103 -

4. TROUBLE SHOOTING

C350

C447

C347

U501

U303

C348

C349

CAMERA LDO
+VPWR CAM_LDO_EN C347 1u U303 RT9011-MGPQW 1 8 VIN VOUT1 2 7 EN1 VOUT2 6 3 NC2 EN2 4 5 NC1 GND PGND 9 VREG_CAM_AVDD_2.8V VREG_CAM_DVDD_1.8V C348 1u C349 1u

+VPWR CAM_LDO_EN C447 1u

VIN VOUT 3 4 GND BGND 2 6 STBY NC 1 5 U501 BH15LB1WHFV REV_D

VREG_CAM_DVDD_1.5V

C350 1u

- 104 -

4. TROUBLE SHOOTING

4.14 Keypad Backlight Troubleshooting


Key Pad Back Light is on as below : Key pressing KYBD_BACKLIGHT go to 0V MAIN Key Backlight LED On

Start

Key press

NO
+VPWR is above 3.2V?

Check battery Yes NO Change the Main board

Yes
KYBD_BACKLIGHT is 0V ?

Yes YES
Backlight LED ON?

END

No
Change the Main board

+VPWR

KEY_BACK_LIGHT LED(8EA)
+VPWR

LD400 LD403 LD406

LEBB-S14H LEBB-S14H LEBB-S14H

R411 100ohm R414 100ohm R417 100ohm LD404 LD407 LEBB-S14H R415

LD402 LD405 LD408

LEBB-S14H LEBB-S14H LEBB-S14H R413 100ohm R416 100ohm R419 100ohm

LEBB-S14H 100ohm R418 100ohm

REV_B : EDLH0013501 --> EDLH0006001 KYBD_BACKLIGHT

Figure.Keypad backlight LED part

- 105 -

4. TROUBLE SHOOTING

4.15 Main LCD Troubleshooting


Main LCD control signals are generated by MSM6245. The signal path is : MSM6245 CN400 LCD Module

Start

Press END key

Key LED is on? Yes

NO GO to power on trouble shooting

Disconnect and reconnect The LCD connector

LCD display OK?

Yes

END

No Change the LCD module

LCD display OK? No

Yes END

Change the Main board

- 106 -

4. TROUBLE SHOOTING

4.16 Receiver Path


MSM6245 EAR1ON/EAR1OP R421,R422 Analog Switch(U401) Receiver

Start

Connect the phone to network Equipment and setup call Setup 1KHz tone out

YES
Can you hear the tone?

END

NO
The sine wave appears at L401, L402?

YES Change receiver

NO
The sine wave appears at R421, R422?

YES Check the analog switch

NO Change the Main board

- 107 -

4. TROUBLE SHOOTING

R421

R422

U401

- 108 -

4. TROUBLE SHOOTING

4.17 Headset path


MSM6245 HPH_R, HPH_L C402/C401 R407/R406 CN401 (MMI Connector)

Start

Connect the phone to network equipment and setup call. Setup 1KHz tone out and insert headset.

YES Can you hear the tone? END

NO YES
Sine wave appears at R407/R406?

Change the Headset

NO Change the Main board

- 109 -

4. TROUBLE SHOOTING

CN401

R406

C401 C402

C407

- 110 -

4. TROUBLE SHOOTING

4.18 Speaker phone path


MSM6245 LINE_P,LINE_N R429/R427, C423/C422, R431/R426 Audio AMP(U402) Analog Switch(U401) Speaker

Start

Connect the phone to network equipment and setup call Setup 1KHz tone out

YES Can you hear the tone? END

NO
Sine wave appears at R429/R427 and C423/C422 And R431/R426 ?

NO Change the Main board

YES SPK_AMP_EN is2.6V? NO Change the Main board

YES NO

The sine wave appears at SPK+, SPK- ?

Change the Audio Amp

YES
The sine wave appears at SPK_RCV-,SPK_RCV+?

YES Change speaker

NO Change the Main board

- 111 -

4. TROUBLE SHOOTING

Analog Switch

SPK+ Audio Amp

- 112 -

4. TROUBLE SHOOTING

4.19 Main microphone


MIC400 MIC1P, MIC1N (MSM6245)

Start

Make a call

MIC_BIAS(C416) is 1.8V

NO

Change main board

YES Make sound to MIC

Sine wave appears at C418/C419?

NO

Change the MIC

YES Change the Main board NO Work well?

YES END

- 113 -

4. TROUBLE SHOOTING

R424

C417

MIC400

- 114 -

4. TROUBLE SHOOTING

4.20 Headset microphone


Headset C210/C211 MIC2P, MIC2N (MSM6245)

Start

Make a call

OK Change the headset and retry NO NO


HOOK_KEY is detected?

END YES Change the MAIN board

Yes NO
MICBIAS is biased by 1.8V?

Change the MAIN board

Yes NO
Sine wave appears at C210/C211 ?

Change the headset or Main board and retry.

Yes Change the Main board

- 115 -

4. TROUBLE SHOOTING

Ear_Sense_N

MIC Input

- 116 -

4. TROUBLE SHOOTING

4.21 Vibrator
The Vibrator is connected between +VPWR and VIB_DRV_N (PM6650 25 pin). The Vibrator motor driver is an SBI-programmable voltage out that is reference to +VPWR.

Start

Operate the Vibrator

Work well?
NO Change vibrator or PM6650

Yes

End

TP400 TP401 L400 56nH D400 RB521S-30

+VPWR

MOTOR_PWR-

- 117 -

4. TROUBLE SHOOTING

MOTOR_PWR-

+VPWR

- 118 -

5. DOWNLOAD

5. DOWNLOAD
5.1 U250/KU250 DOWNLOAD
5.1.1 Introduction
LGMDP is a LGE application that allow users to download images from PC to handset. LGMDP is a download tool with capabilities to upload image files to the handset. LGMDP is designed to be simple to use and easy enough for the beginner to upload executable images to the handset. LGMDP supports Windows 2000/XP where the LG (Ver 4.6 or later) USB modem driver is installed. Additionally, LGMDP allows multi downloading up to 9 handsets at the same time.

5.1.2 Downloading Procedure


Connect the phone to your desktop PC using the USB cable and run the LGMDP application. Before getting started, set up LGMDP preferences from the Preferences of the file menu the way you want. Click on the File menu and select Preferences.

Play a success sound It will be played a .wav file when the download has been completed. To enable this simply check the box. Always on Top Check if LGMDP always appears at the top of the window so that user can monitor it all the time. Automatically run Select Port When LGMDP starts When LGMDP starts, it will automatically select Select Port button to download new image file.

- 119 -

5. DOWNLOAD

5.1.2.1 Connecting to PC
Click on the Select Port and then Select Port window will be pop up. Check if state shows Enable for the port to be connected for downloading images. Then click on the Connect button. (The port number(COM7) shall be different from that of the port number in the snapshot.)

The status Ready is displayed when the application is ready for downloading. While the images are transmitted from PC to the handset, a progressive bar (Red box) indicating the degree of transmission of data is displayed.

U250/KU250

- 120 -

5. DOWNLOAD

1) Image Folder indicates loot path where all image files are placed. To change location of the default image path, select Browse button. The edit box shows the file path where images are located. Please note that all images should be located in a selected folder. 2) Click on the Browse button to select image files to be downloaded on the handset. 3) NV Backup/Restore: NV Backup/Restore always have to be done, and it is default selected option. Backup the NV data and restore the backed up NV data automatically.

U250/KU250

1) 2)

U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250

3) 5)

4)

6)

7)

4) Reset database & Contents: User related data including the setting data on the EFS is reset in the handset. The user contents in the handset will be erased. If you want to reset all the user data back to the way they were before you started downloading new images, check the option. Erase_EFS: The calibration data, user contents, media, and module are erased. Only calibration data is kept when NV backup/restore is checked. The user contents and file system physically are wiped out. Keep All Contents Maintain user data including WAP, AD, DRM, E-mail, Play lists, and images when downloading a new S/W images. User data stated above are maintained if this option is selected. 5) Additional Options: Display Information is defaultly not selected and user cannot choose. Override partition table is also also defaultly not selected and user cannot choose. 6) Clear: Clearing all directory paths of images in the dialog. 7) Start: Starting downloading the selected individual image.

- 121 -

5. DOWNLOAD

5.1.2.2 Choosing image files


Select the image folder, where all the image files are located, by clicking on the Browse. (The folder name shall be different from that of the folder name in the snapshot. The folder name indicates the path where the image files are located.)

U250/KU250

U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250

- 122 -

5. DOWNLOAD

Select the path on the Image Folder by clicking on the Browse..., then the LGMDP will automatically load images accordingly. Also you can select images by manually. For instance, select the path of AMSS Modem Image file by clicking on the Browse button. The selected AMSS image will be downloaded to the handset from the path directory in the PC. Make sure that you have chosen correct file. In case of wrong AMSS Modem file is file is selected, the phone may not work. (The file name shall be different from that of the file name in the snapshot.)
U250/KU250

U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250

- 123 -

5. DOWNLOAD

If NV restore is failed, then the NV Data(*.nv2) is erased permanently. In this case, choose the desired NV file to be downloaded on the handset. To enable this simply check the box or select the NV file from the LGMDP installation directory by clicking on the Browse button.
U250/KU250

U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250

Click on the START button to start downloading. A summary of the selected images and option information window will be displayed. Click on the No button if this is not the setting you are downloading for. Otherwise click on the Yes button to continue downloading selected image file with options.

Yes

No

- 124 -

5. DOWNLOAD

5.1.2.3 Downloading
This message box informs that a new file for
NV_U250/KU250

NV backup will be created in the displayed file name in the LGMDP installation directory.

Backing up NV data and backed up NV data


U250/KU250

will be stored in the LGMDP installation directory.

Erasing the existing directories and files


U250/KU250

before the Module image is downloaded.

Downloading the AMSS modem image


U250/KU250

- 125 -

5. DOWNLOAD

Rebooting the handset and re-establishing the connection

Restoring NV data which backed up in the


U250/KU250

Backing up process. User can also restore NV data using NV Default image selection.

Rebooting the handset and re-establishing the connection

Erasing the existing directories and files


U250/KU250

before downloading the selected Media image

- 126 -

5. DOWNLOAD

Downloading Media image in progress


U250/KU250

Downloading Module image in progress


U250/KU250

Downloading process has completed


U250/KU250

successfully

- 127 -

5. DOWNLOAD

5.1.2.4 Tools
Device Manager allows to monitor current hardware that is installed on your PC. Device Manager is designed to monitor USB connectivity and check where the COM has been installed . Select Device Manager from the Tools of the file menu.

- 128 -

5. DOWNLOAD

5.1.3 Troubleshooting Download Errors


1) When the phone does not work after downloading has been completed. 2) Media Erasing Error 3) NV Restore Error

5.1.3.1 When the phone does not work


Reboot the phone in the emergency mode (Simultaneously press 2, 5, and PWR red keys) and then try to download all the images up to AMSS. In the emergency mode, you can not download media or module image. The phone supports a special mode called emergency mode. In this mode, minimum units for downloading is running so that users can download the images again in case of emergency situation. (AMSS modem, Media, and Module images can not be running in this mode.)

- 129 -

5. DOWNLOAD

The below dialog shows parameters of Select Port when phone is booted in Emergency mode. Click on the Connect button to continue.

U250/KU250

Choose Image file after clicking on the Browse button. Make sure that you have chosen the right image file. After choosing valid images, then click on the Start button to start downloading selected images. The selected image will be downloaded to the handset from the path directory in the PC. After downloading images successfully, it will boot to normal mode.

U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250

- 130 -

5. DOWNLOAD

5.1.3.2 NV Restore Error


Snapshot showing the NV Restore error. Next slide shows the remedial procedure to adopt.

U250/KU250

Connect the handset and Press the Connect button in the Select Port window. (Enable state in the window indicates that the Phone has been detected and is ready to download.)

U250/KU250

U250/KU250

- 131 -

5. DOWNLOAD

Click on Browse . Select the LGMDP installation directory and a list of NV Backup files(*.nv2) will be shown. These nv files were saved every time NV Backup option was selected, and the name of the nv file is determined based on the time when NV Backup was done. Choose the desired NV file to be downloaded on the handset, and click on Start.

U250/KU250

U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250 U250/KU250

- 132 -

5. DOWNLOAD

5.1.4 Caution
1) Multi-downloading using the USB hub is not recommendable. 2) If you see the message cal mode after completing download, you must do NV restore and image (media and module) download. 3) The NV data saved at LGMDP folder as following format.

D:\LGMDP\004400-01-429926\_COM14_

LGMDP folder name IMEI number

Port number

4) Recommended that the Module and Media Image have to be downloaded at the same time. 5) Erase EFS option will erase everything (media, module, nv items, and user data) in the EFS area.

- 133 -

6. BLOCK DIAGRAM

6. BLOCK DIAGRAM
6.1 GSM & UMTS RF Block

[Fig 2.1] U250/KU250 RF Functional Block Diagram

- 134 -

6. BLOCK DIAGRAM

[Table 2.1] RF Block Component

- 135 -

6. BLOCK DIAGRAM

6.2 Interface Diagram


6.2.1 RTR6275 & MSM6245 Interface Diagram

[Fig 2.2] RTR6275 & MSM6245 Interface Diagram

- 136 -

6. BLOCK DIAGRAM

6.2.2 Memory Interface

ADDRESS[14:0]

[Fig 2.3] Memory Interface Diagram

- 137 -

6. BLOCK DIAGRAM

6.2.3 USB,UART,SIM,JTAG Interface

[Fig 2.4] USB, UART, SIM, JTAG Interface

- 138 -

6. BLOCK DIAGRAM

Main RF signal

Control signal
Control signal UMTS PA_CTL signal PA_R0 GSM PA_CTL signal GSM_PA_BAND GSM_PA_EN GSM_PA_RAMP DCS or PCS /GSM Mode Selection Power Amp Gain Control Enable Power Amp Gain Control UMTS, ANT_SEL 0,1 Ant Switch Module Mode Selection GSM900Tx/Rx, DCS Tx/Rx, PCS Tx/Rx UMTS Tx High/Low Power Control Description Comment

- 139 -

6. BLOCK DIAGRAM

6.2.4 Placement *Top Side

LGMC

- 140 -

6. BLOCK DIAGRAM

*Bottom Side

LGMC

- 141 -

- 142 -

7. CIRCUIT DIAGRAM

14

15

16

ANT101 ANT102 GSM 1800/GSM 1900 RX GSM 850/ GSM 900 RX C450 22p
ANT

ANT_SEL0 LOW HIGH LOW HIGH

ANT_SEL1 LOW LOW HIGH HIGH

SW100
G2 G1 RF

C101 56p

GSM 850/GSM 900 TX/ WCDMA GSM 1800/GSM 1900 TX

1p C437

L101 NA

C102 NA

KMS-507 L102 100nH

TX_IP Rev.C U500 11 ANT Rev.C C439 5p C103 180p C104 180p TX_IM GSM900_RX1 GSM900_RX2 GSM1800_RX1 GSM1800_RX2 GSM1900_RX1 GSM1900_RX2 WCDMA2100 5 6 1 2 3 4 9 1K 1K R100 R101 Rev.C 55 2 ENV_LNP 1 ENV_LNN 51 TX_IP 50 TX_IN 53 TX_QP 52 TX_QN TCXO 7 C114 1000p 3300p

Rev.D L108 19 15nH C117 10p

VREG_RF_SMPS
Rev.B

VDD

DCS

C105 NA C440 5p

ENV_OUT

TX_QP C108 180p

0.5p C190 DCS_PCS_TX GSM_TX C442 5.6p

C106 C107 C112

8.2p 6p 12p

7 8 10 12 13 15 17 20 21 23

46 HB_RF_OUT1 44 HB_RF_OUT2 43 LB_RF_OUT1 42 LB_RF_OUT2 24 56 54 RF_ON VCONTROL DAC_REF SBDT

B
C113 180p TX_QM RTR6275_TCXO C115

GND1 GND2 GND3 GND4 GND5 GND6 GND7 GND8 GND9 GND10

D5011

18 CTRL1 22 CTRL2

ANT_SEL0 ANT_SEL1

TX_ON

16 GSM900_TX 14 GSM18001900_TX

PCS
C110 33p C109 33p

C116 NA C443 5.6p

TX_AGC_ADJ NA C191 DAC_REF C118 12p R103 12K (1%)

5 VTUNE1 18 VTUNE2

VTUNE-Connected directly to GND

14

U100

12 RX_IP 13 RX_IN 10 RX_QP 11 RX_QN

RX_IP RX_IM RX_QP RX_QM PWR_DET R105 5.1 R433 R434 R106 L114 C126 C128 C129 C130 C127 C131 C132 C189 22p 2.7 2.7 5.1 47nH C122 22u Rev.D VREG_RF_SMPS Rev.B

L405

2.7nH L111 5.6nH

3 R_BIAS1 27 R_BIAS2 31 GCELL_INP 30 GCELL_INN 32 EGSM_INP 33 EGSM_INN 38 DCS_INP 39 DCS_INN 36 GPCS_INP 37 GPCS_INN

RTR6275

GSM_PA_RAMP

SSBDT_RTR

R104 680 (1%) C119 22p 40 PWD_DET_IN 21 TEST VDDA1 VDDA2 VDDA3 VDDA4 VDDA5 VDDA6 VDDA7 VDDA8 VDDA9 VDDA10 VDDA11 VDDA12 VDDA13 VDDA14 4 6 8 9 15 16 19 20 28 41 45 47 48 49 C140

C
Rev.D C124 100p L115 18nH L403 1.5nH

+VPWR
C123 0.01u C121 33u

EGSM

C120 NA

L406

2.7nH

L116 10nH 100ohm

R107

0.1u

22p

22p

0.1u

WLNA_OUT

25 GND 57 PGND

VDDM

C141

91 R110

91 R111

C142

C137 NA

C138 NA

C139 68p 20 17

C136 0.01u

34 WMIX_INP 35 WMIX_INN

C441 5.6p

C438 100p

C134 0.01u

8.86dB Rev.1.0 R108 DCS_PCS_TX 51

22 CAL_INP 23 CAL_INN 26 WLNA_IN

0.1u

22p

22p

Rev.C

L119 47nH VDD_RX C135 0.1u VREG_SYNTH_2.6V

17

29

22p

VAPC

VBATT

VCC1B

VCC1A

FL101
3
4 5

100p

22p

R109 10 L120 VREG_RF_SMPS

15 11 19 21

C147

DCS_PCS_OUT EGSM_OUT RSVD_GND P_GND

DCS_PCS_IN EGSM_IN ENABLE

7.5dB 47nH C143 0.1u


O1 G3 1 IN G2 G1

C144 22u

100ohm

R114

GSM_PA_EN

SKY77318
GND9 GND8 GND7 GND6 GND5 GND4 GND3 GND2 GND1

BS

C149 15p

R115

18

100ohm

EFCH897MTDB1

Rev.D R116 VREG_MSMP_2.7V

22p

U101

4 R113 100ohm

R112 GSM_TX 39

R117 100ohm

100ohm

16 14 13 12 10 9 8 7 5

GSM_PA_BAND
C153 15p

GSM_PA_BAND LOW HIGH

MODE GSM DCS/PCS

C150 1000p

C151 22p

C152 0.01u

Rev.D

GSM/EDGE WCDMA
Rev.D

Rev_1.0 C154 1.5p VDD_RX C156 100p L121 1nH

+VPWR
F
L404 1.8nH C155 4.7u C158 15p WS2512_TR1G 10 VCC2 FL104 4 3 PGND ANT RX TX 1 2 C162 3.3p C164 0.5p C165 1p 7 GND3 6 GND2 11 BGND VCONT VREF 4 5 L123 1nH 9 Rev_1.0 8 GND4 RFOUT U103 VCC1 RFIN GND1 1 2 3 C159 15p

+VPWR
4

FL102 5 EFCH1950TDF1
IN

L122 NA

C157 10nH

O1 G3 G2 G1

Rev.D L409 4.7nH

Rev.D C444 2.2p

C161 2.2p

ACMD-7602 0.5p L125

PA_R0
5 1
IN

OUT

IN

50OHM

COUP

20dB

TR100 KRX102U
5 1

G2 O2 FL103 G1 O1 EFCH2140TDE1

L411 4.7nH C445 2.2p

BLUETOOTH
ACS2450HBAXX
C
R118
FEED NC1 NC2

U102
2

51R119

CP0402A1950DNTR
4 3

PA_ON
Rev.B

L408 10nH

L410 4.7nH

VREG_TCXO_2.85V
C170 0.1u C171 BT_CLK C172 C173 L128 1.8nH C174 10p VREG_MSMP_2.7V Rev.D VREG_BT_2.85V L407 2.7nH 0 0.1uF 100p 2.2u 100p 1u 2.2u 1000p 9 3 2 10 14

M100
16

PWR_DET R121 130 R120 47 7dB R122 130 C192 100p

LBRQ-2B43A
CLK_REF VCC_OUT VDD_INT VDD_MSM VDD_BAT PGND4 20 PGND3 19 PGND2 18 PGND1 17

ANT

4 SBST 11 SBCK 12 SBDT 5 13 7 1000p C176

C169

NA

L126 NA

ANT103

BT_SBST BT_SBCK BT_SBDT BT_TX_RX_N

SYNC_DET_TX_EN RX_BB_TX_BB XTAL_IN GND4 15 GND3 8 GND2 6 GND1 1

R123

D
BT_DATA TCXO_BT

C179

C177

X100 DSA321SCE-19.2M
NC3 7 NC4 8 VREG_TCXO_2.85V 3 OUTPUT VCC GND 2 100ohm R124 TRK_LO_ADJ 1 C183 NC2 NC1 6 5

E
C182 1000p C181

VCONT

C180

C178

TCXO

19.2MHz 0.1u

E
VREG_BT_2.85V

0.01u

Section

Date

Sign & Name MODEL

Sheet/

Designer
C186

MAR. 07. 2007

KANG. H. S

KU250 U250/KU250 RF

Sheets

R128 C185 TCXO_PM 100p

100K 1000p 4
3
GND

1/4
DRAWING

VCC

C187 RTR6275_TCXO

1000p

C188

0.01u

Checked

TCXO_BT

U104
F
TC7SH04FU

Approved

LG Electronics Inc.
1 2 4 5 6 7 8 9

DRAWING NO.

REV_1.2
LG Electronics Inc.
LGMC

LG(42)-A-5505-10:01

- 143 -

7. CIRCUIT DIAGRAM

10

11

12

13

14

15

16

MODE
VREG_MSMP_2.7V

ADC
MODE2 MODE1 0 0 MODE0 0 ( Default Pull-Down) Native, ARM JTAG HKADC[0] - AMUX_OUT HKADC[1] - VBATT_SENSE HKADC[2] - HDET1 HKADC[3] - TTY_ADC_DET HKADC[4] - PCB_Rev_ADC HKADC[5] - VBATT_TEMP PMIC_AUXIN[1] PMIC_AUXIN[2] - PA_THERM

HKADC(4):PCB_Rev_ADC 150K : 10K : 0.016V 150K : 47K : 0.62V 150K : 68K : 0.81V 150K : 100K : 1.04V 150K : 150K : 1.30V 150K : 300K : 1.73V 150K : 470K : 1.97V 150K : 680K : 2.13V 150K : 750K : 2.17V

VREG_MSMP_2.7V

VREG_MSMP_2.7V

HKADC
R201 R202 150K 1% 36

RCVRCV+

BOOT_MODE3 BOOT_MODE2 BOOT_MODE1 0 0 1 0 1 0 1 1 1 1 1 8-bit, NAND, Normal 16-bit, NAND, Normal 8-bit, NAND, Trusted 16-bit, NAND, Trusted

RESET SDRAM
REV_B SDRAM_CLK SDRAM_CS_N(0) SDRAM_CLK_EN SDRAM_RAS_N SDRAM_CAS_N SDRAM_WE_N SDRAM_DQM(3) SDRAM_DQM(2) SDRAM_DQM(1) SDRAM_DQM(0)

AUDIO
HPH_R HPH_L 220n C200 C201 47p 47p

220n

CLOCK
R204 51K

VREG_MSME_1.8V

R435 1% 300K

Near to MSM
1005 0.1uF 16V +80/-20% MIC2N MIC2P MIC1N MIC1P 2012 10uF 6.3V +80/-20% Ceramic

C202

AMUX_OUT VBAT_SENSE

SLEEP_CLK

TCXO_MSM

RESIN_N RESOUT_N

VBAT_TEMP

C203

MICBIAS

VREG_MSMC_1.25V

VREG_MSME_1.8V

VREG_MSMP_2.7V

VREG_MSMA_2.6V

SDRAM_ADDR(0:14)

(CAD : 10uF=>Input MSMA_2.6V)


C204 10p C205 4.7u Place near C212 0.1u 10% MSM pin W18 (CODEC VSS) C206 10u C209 0.1uF

SDRAM_ADDR(0) SDRAM_ADDR(1) SDRAM_ADDR(2) SDRAM_ADDR(3) SDRAM_ADDR(4) SDRAM_ADDR(5) SDRAM_ADDR(6) SDRAM_ADDR(7) SDRAM_ADDR(8) SDRAM_ADDR(9) SDRAM_ADDR(10) SDRAM_ADDR(11) SDRAM_ADDR(12) SDRAM_ADDR(13) SDRAM_ADDR(14)

LINE_N LINE_P

R205

R208 R209

22n C210

R207

R206

NA

51K

51

51K 51K

C211

22n

AC18

AC17

AA19 AC22

AC21

AC19

AC20

AE17

AE21

AE22

AA23

AB23

AA17

AE18

AA18

AE19

AE20 AA20

AF18

AF19

AF21

AF22

AF20

W21

W17

AD1

AB1

AA2

AA4

N11

D18

U23

P8 P11

A10

B10

A16 B16

Y23

V21

V19

F13

F11

T21

Y21

TCXO USB_XTAL48_IN USB_XTAL48_OUT SLEEP_XTAL_IN SLEEP_XTAL_OUT

A1_24_GPIO79 A1_1 A1_2 A1_3 A1_4 A1_5 A1_6 A1_7 A1_8 A1_9 A1_10 A1_11 A1_12 A1_13 A1_14

BOOT_MODE BOOT_MODE2 BOOT_MODE3 HKAIN0 HKAIN1 HKAIN2 HKAIN3 HKAIN4 HKAIN5

ROM1_CLK_SDRAM1_CLK XMEM1_CS_N2_SDRAM1_CS_N0 SDRAM1_CLK_EN ROM1_ADV_N_SDRAM1_RAS_N XMEM1_LWAIT_N_SDRAM1_CAS_N XMEM1_HWAIT_N WE1_N_SDRAM1_WE_N A1_25_SDRAM1_DQM3_GPIO75 A1_23_SDRAM1_DQM2_GPIO78 UB1_N_SDRAM1_DQM1 LB1_N_SDRAM1_DQM0 OE1_N XMEM1_CS_N0

SDRAM_DATA(0:31)
C
REV_B Change 32 bit SDRAM_DATA(31) SDRAM_DATA(30) SDRAM_DATA(29) SDRAM_DATA(28) SDRAM_DATA(27) SDRAM_DATA(26) SDRAM_DATA(25) SDRAM_DATA(24) SDRAM_DATA(23) SDRAM_DATA(22) SDRAM_DATA(21) SDRAM_DATA(20) SDRAM_DATA(19) SDRAM_DATA(18) SDRAM_DATA(17) SDRAM_DATA(16) SDRAM_DATA(15) SDRAM_DATA(14) SDRAM_DATA(13) SDRAM_DATA(12) SDRAM_DATA(11) SDRAM_DATA(10) SDRAM_DATA(9) SDRAM_DATA(8) SDRAM_DATA(7) SDRAM_DATA(6) SDRAM_DATA(5) SDRAM_DATA(4) SDRAM_DATA(3) SDRAM_DATA(2) SDRAM_DATA(1) SDRAM_DATA(0)
T8 T6 T4 R8 T2 T1 R6 R4 W4 V6 Y2 Y1 E1 R11 V4 U6 L6 L8 K4 J1 K6 J2 J4 P4 H4 G2 J6 AB4 D1 AB2 D2 E2

RESIN_N RESOUT_N RESOUT_N_EBI1 WDOG_EN

LINE_ON LINE_OP HPH_R HPH_L EAR1ON EAR1OP MICBIAS AUXOUT HPH_VREF LINE_L_IP LINE_L_IN LINE_R_IP LINE_R_IN AUXIN AUXIP MIC2N MIC2P MIC1N MIC1P CCOMP

MODE2 MODE1 MODE0

T15

W6

M8 M4

M6

G1

N8

N6

N2

N1

N4

U8

V8 U4

V1

P1

P2

P6

Y4

K8

V2

L1

L4

L2

C213 0.01u

C214 0.01u

C215 0.01u

C216 0.1uF

C217 0.01u

C218 0.01u

C219 0.1uF

C220 0.1uF

C221 0.1uF

SDRAM

(VDD_DAC_REF)

A1_22 A1_21 A1_20 A1_19 A1_18 A1_17 A1_16 A1_15 GPIO_74 GPIO_73 GPIO_72 GPIO_71 GPIO_70 GPIO_69 GPIO_68 GPIO_67 SDRAM1_D15 SDRAM1_D14 SDRAM1_D13 SDRAM1_D12 SDRAM1_D11 SDRAM1_D10 SDRAM1_D9 SDRAM1_D8 SDRAM1_D7 SDRAM1_D6 SDRAM1_D5 SDRAM1_D4 SDRAM1_D3 SDRAM1_D2 SDRAM1_D1 SDRAM1_D0

SDCC_DAT1_GPIO99 SDCC_DAT2_GPIO100 SDCC_DAT3_GPIO101 MDP_VSYNC_SECONDA_GPIO104 MDP_VSYNC_PRIMARY_GPIO105

F25 M25 M26 AE3 AD2 H25 F26 H11 D5 J21 A6 N19 W15 AA15 AE13 H9 B6 F8 AA1 Y6 L25 H6 F18 H18 H13

LCD_MAKER_ID LCD_VSYNC
TP200 WDOG monitoring

C222 1000p

C223 1000p

C225 0.01u

C226 0.01u

C227 0.01u

C228 0.01u

C229 0.1uF

C230 0.1uF

2200p cap => place between D12(VDDA1) and F12(DAC_REF)

AE16

AE11

AE15

AA26

AE23

AE24

AA16

AC2

AE8

G25 D25

AE6

R25

D12

U25

U26 Y26

B24

B14

B11

K25

B15

B18

B21

P23

T25

W2

M2

C2

H2

R2 U2

B5

K2

B9

VDD_PAD1_0 VDD_PAD1_1 VDD_PAD1_2 VDD_PAD1_3 VDD_PAD1_4

VDD_PAD3_0 VDD_PAD3_1 VDD_PAD3_2 VDD_PAD3_3

VDD_DIG_0 VDD_DIG_1 VDD_DIG_2 VDD_DIG_3 VDD_DIG_4 VDD_DIG_5 VDD_DIG_6 VDD_DIG_7 VDD_DIG_8 VDD_DIG_9 VDD_DIG_10 VDD_DIG_11 VDD_DIG_12

VDD_PAD2_0 VDD_PAD2_1 VDD_PAD2_2

2K TCXO_EN PA_ON TX_QM TX_QP TX_IM TX_IP DAC_REF

R213 C246

VDD_PAD4_0

VDD_PLL VDD_MDDI

TX_AGC_ADJ L13 TRK_LO_ADJ F19 TCXO_EN_GPIO94 F17 PA_ON0 Q_OUT_N Q_OUT I_OUT_N I_OUT DAC_REF

VDDA1 VDDA2 VDDA3 VDDA4 VDDA5 VDDA6 VDDA7 VDDA8 VDDA9 VDDA10

TX_AGC_ADJ TRK_LO_ADJ

A3

F2

LCD_IF_MODE_1

AF17

WDOG_STB_SBCK1_GPIO0 SBDT1_GPIO1 PA_ON1_GPIO2 GRFC9_GPIO12 CAMCLK_PO_GP_MN_GPIO13 GPIO28 USB_RX_DATA_GPIO29 XMEM2_CS_N2_GPIO35 XMEM2_CS_N3_GPIO36 LCD_EN_GPIO37 GPIO43 SYNTH2_GPIO65 GPIO66 XMEM1_CS_N1_GPIO76 XMEM1_CS_N3_SDRAM1_CS_N1_GPIO77 UART3_RFR_N_GPIO87 UART2_DP_RX_DATA_GPIO89 SYNTH0_GP_PDM0_GPIO92 SBST1_GPIO93

CAM_MCLK LCD_IF_MODE_0 VGA_CAM_RESET_N LCD_LDO_EN LCD_RESET_N HOOK_KEY C232 1000p C233 1000p C234 1000p C235 1000p C236 0.01u C237 1000p C238 1000p C239 1000p C240 0.1uF C242 0.1uF

C231 2200p

DAC_REF

GPIOs

Near to B18 (VDD_PLL) VREG_MSMA_2.6V

R211 0 RCV_EN_N Close to MSM C243 0.1u 10% C244 0.01u

33nF

A12 B12 A13 B13 F12 W23 V23 V25 W25 AA25 Y25 AB25 AC25

M1 R1

AC15

LCD_CS_N NAND_CLE NAND_CS_N EBI2_OE_N EBI2_WE_N NAND_ALE NAND_READY EBI2_DATA(15) EBI2_DATA(14) EBI2_DATA(13) EBI2_DATA(12) EBI2_DATA(11) EBI2_DATA(10) EBI2_DATA(9) EBI2_DATA(8) EBI2_DATA(7) EBI2_DATA(6) EBI2_DATA(5) EBI2_DATA(4) EBI2_DATA(3) EBI2_DATA(2) EBI2_DATA(1) EBI2_DATA(0)

XMEM2_CS_N1 AF14 LCD_CS_N_GPIO38


AF10

VSS_PAD1_0 VSS_PAD1_1 VSS_PAD1_2 VSS_PAD1_3 U1 VSS_PAD1_4


K1

F1

RESERVED
(PLLOUT_TEST)

C26

E
VSS_DIG_0 VSS_DIG_1 VSS_DIG_2 VSS_DIG_3 VSS_DIG_4 VSS_DIG_5 VSS_DIG_6 VSS_DIG_7 VSS_DIG_8 VSS_DIG_9 VSS_DIG_10 VSS_DIG_11 VSS_DIG_12 VSS_DIG
C1 H1 W1 AC1 AF8 AF16 T26 G26 D26 A24 A14 A11 A5 AC23

EBI2_DATA(0:15)

OE2_N WE2_N AE10 LB2_N_A2_0 T14 NAND2_FLASH_READY_GPIO33


AF4 AA10 AC9 W10 AA9 AE7 AC8 W9 AA8 AC7 AF5 AA7 AE5 AC6 AE4 AF3 AC5

W14 XMEM2_CS_N0 AF7

UB2_N

U201-1 MSM6245_A

Q_IM_CH1 Q_IP_CH1 I_IM_CH1 I_IP_CH1 Q_IM_CH0 Q_IP_CH0 I_IM_CH0 I_IP_CH0

AF6

RF
RX_QM RX_QP RX_IM RX_IP

AF11 AF15 R26

VSS_PAD2_0 VSS_PAD2_1 VSS_PAD2_2

VSS_PAD3_0 VSS_PAD3_1 A15 VSS_PAD3_2 A9 VSS_PAD3_3


B17 A18

U201-2 MSM6245_B

NAND & LCD

C
(ADS signal for LCD) LCD_ADS

AF13 AA14 T13 AC14 AE14 W13 AC13 AA13 AF12 AE12 AC12 AA12 W12 T12 AC11 AA11 AC10 W11 AF9 AE9

P21 UART1_RFR_N_PA_POWER_CTL_M_GPIO98 P16

CAMIF_DATA9_GPIO61 CAMIF_DATA8_GPIO60 CAMIF_DATA7_GPIO59 CAMIF_DATA6_AUX_TDO_GPIO58 CAMIF_DATA5_AUX_TDI_GPIO57 CAMIF_DATA4_AUX_TMS_GPIO56 CAMIF_DATA3_AUX_TCK_GPIO55 CAMIF_DATA2_AUX_TRST_N_GPIO54 CAMIF_VSYNC_GPIO16 CAMIF_HSYNC_GPIO15 CAMIF_PCLK_GPIO82 CAMIF_DATA0_GPIO83 CAMIF_DATA1_GPIO81 GPIO19 GPIO17 SYNTH1_GPIO41 RINGER_GPIO18

MMC_CMD_GPIO30 MMC_DATA_SDCC_DAT0_GPIO32 MMC_CLK_SDCC_CLK_GPIO31

UART1_CTS_N_GPIO97 UART1_DP_RX_DATA_GPIO96 L26 UART1_DP_TX_DATA_GPIO95 D8 GPIO44 F7 GPIO39 F14 GPIO64

UART3_CTS_N_GPIO86 UART3_DP_RX_DATA_GPIO85 M19 UART3_DP_TX_DATA_GPIO84 D6 GPIO40 D7 GPIO42

UART2_RFR_N_GPIO91 UART2_CTS_N_GPIO90 UART2_DP_TX_DATA_GPIO88

P19 KEYSENSE1_N_GPIO63 R21

KEYSENSE4_N_GPIO48 KEYSENSE3_N_GPIO47 KEYSENSE2_N_GPIO46

KEYSENSE0_N_GPIO62

K21 I2C_SDA_GPIO26 N16

USB_DAT_VP N23 USB_SE0_VM N25 USB_OE_TP_N

PA_POWER_CTL GSM_PA_DAC_REF

I2C_SCL_GPIO27

AD26

M23

M21

M16

G21

U21

R23

D14

D10

N26

H26

D20

D22

C25

D21 B3

H14

E23

K23

H23

MDDIH_STBN MDDIH_STBP MDDIH_DATN B20 MDDIH_DATP

GPIO45 GPIO53 GPIO52 GPIO51 B7 GPIO50 F9 GPIO49

SBST SBDT L21 SBCK

K26

P25

A19

A20

B19

F20

F16

L12

L23

L14

A4

A7

E4

J23

L15

J19

J25

J26

G6

F4

L19

R16

VDD_EF_USE

A2_20_GPIO34 A2_19 A2_18 A2_17 A2_16 A2_15 A2_14 A2_13 A2_12 A2_11 A2_10 A2_9 A2_8 A2_7 A2_6 A2_5 A2_4 A2_3 A2_2 A2_1

GRFC8_GPIO11 GRFC7_GPIO10 GRFX6_GPIO9 GRFC5_AUX_SBST_GPIO8 GRFC4_AUX_SBCK_GPIO7 GRFC3_GPIO6 GRFC2_GPIO5 GRFC1_AUX_SBDT_GPIO4 GRFC0_GPIO3 BT_CLK_GPIO25 BT_SBST_GPIO24 BT_SBCK_GPIO23 BT_SBDT_GPIO22 BT_TX_RX_N_GPIO21 BT_DATA_GPIO20

B4 T23 T19 D11 H10 F10 D9 A8 B8 G23 F23 E26 E25 H21 R19 A22

VSS1 VSS2 VSS3 VSS4 VSS5 VSS6 VSS7 VSS8 VSS9 VSS10 VSS11 VSS12 VSS13 VSS14 VSS15 VSS16 VSS17 VSS18 VSS19 VSS20 VSS21 VSS22 VSS23 VSS24 VSS25 VSS26 VSS27 VSS28 VSS29 VSS30 VSS31 VSS32 VSS33 VSS34 VSS35 VSS36 VSS37 VSS38

D2_15 D2_14 D2_13 D2_12 D2_11 D2_10 D2_9 D2_8 D2_7 D2_6 D2_5 D2_4 D2_3 D2_2 D2_1 D2_0

GP_PDM2_PA_RAN_GE1 H17 GP_PDM1_PA_RAN_GE0 TRST_N TCK TMS TDI TDO RTCK


H15 D16 F15 D15 A17 H16 K19

D17

A21

PA_R0

D13 D19 P26 U19 V26 W16 W18 W26 AB26 AC16 AC26 AD25 AF23 AF24

AUX_PCM_CLK_GRFC14_GPIO80 N21 AUX_PCM_DIN_GRFC13_GPIO14 G4 AUX_PCM_DOUT_GRFC12_GPIO103 J8 AUX_PCM_SYNC_GRFC11_GPIO102 H12 TX_ON_GRFC10

SPK_AMP_EN

TX_ON

VSSA1 VSSA2 VSSA3 VSSA4 VSSA5 VSSA6 VSSA7 VSSA8 VSSA9 VSSA10 VSSA11 VSSA12 VSSA13 VSSA14 VSSA15 VSSA16

F
AA21 AA6 AC4 AE1 AE2 AE25 AE26 AF1 AF2 AF25 AF26

NC VSS39 VSS41 VSS43 VSS44 VSS45 VSS46 VSS47 VSS48 VSS49 VSS50

MSM6280 Reference Rev.B : AA21 -> NC AC23: VSS_DIG

w18 (Analog VSS guard ring for CODEC)

ANT_SEL1 ANT_SEL0

GSM_PA_BAND GSM_PA_EN

BT_CLK BT_SBST BT_SBCK BT_SBDT BT_TX_RX_N BT_DATA

for VSS_THERMAL

W19

M12

M14

M15

D23

H19

N12

N13

N14

N15 P12

R12

R13

R14

M13

R15

A25

A26

B2 B25

B26

K10

P13

P14

P15

T11

F21

M11

T16 W8

L11 L16

F6

D4

H8

A2

A1

B1

MDDIC_DATP A23 MDDIC_DATN B22 MDDIC_STBP B23 MDDIC_STBN

Section
CAM_DATA(7) CAM_DATA(6) CAM_DATA(5) CAM_DATA(4) CAM_DATA(3) CAM_DATA(2) CAM_DATA(1) CAM_DATA(0) CAM_VSYNC CAM_HSYNC CAM_PCLK CAM_LDO_EN MEGA_CAM_PWR_DOWN LCD_BL_CTRL MEGA_CAM_RESET_N EAR_SENSE_N GSM_PA_RAMP GSM_PA_PWR_CTL_REF SSBDT_RTR SSBDT_PM C247 0.1u 10% Place near MSM pin AD26 12 11 10 9 8 7 6 5 4 3 2 1
CTS RTS DSR

Date

Sign & Name

Sheet/ MODEL

MMC_CD UART_RXD (NAND_BOOT_ERR) UART_TXD

USIM_CLK USIM_RST_N USIM_DATA

KEY_ROW(4) KEY_ROW(3) KEY_ROW(2) KEY_ROW(1) KEY_ROW(0)

KEY_COL(0) KEY_COL(1) KEY_COL(2) KEY_COL(3) KEY_COL(4)

MMC_CMD MMC_DATA MMC_CLK

PM_INT_N PS_HOLD

USB_DAT USB_SE0 USB_OE_N

Designer

MAR.07.2007

Jaykay

U250/KU250 KU250

Sheets

CAMERA
2.2K 2.2K

KEYPAD
F

USIM PMIC

USB MicroSD

R214 R215

USB_D+ USB_DUSB_VBUS VBATT REMOTE_PWR_ON UART_TXD UART_RXD

2/4

TP402 TP403 TP404 TP405 TP406

UTXD URXD PWR VBAT VBAT


NC4 NC3 NC2
ON_SW ON_SW

Checked DRAWING Approved NAME

UART

NC1 TX RX GND

VREG_CAM_AVDD_2.8V (Check CAM_DATA PINOUT !!!!)

UFLS TX RX GND

MSM
REV_1.0
LG Electronics Inc.
LGMC

I2C_SDA I2C_SCL

2.5G 3G UART

LG Electronics Inc.
7 8 9

DRAWING NO.

LG(42)-A-5505-10:01

- 144 -

7. CIRCUIT DIAGRAM

10

11

12

13

14

15

16

A
VREG_TCXO_2.85V

VREG_SYNTH_2.6V GSM_PA_PWR_CTL_REF

PMIC VPWR BYPASS


A
VDD_MSMC : 4.7uF VDD_MSM : 0.1uF VDD_ANA : 0.1uF VDD_RUIM : 0.1uF VDD_RF : 0.1uF VDD_WLAN : 0.1uF VDD_MAIN : 0.1uF VDD_SPKR : 0.1uF

U301
SDRAM_CS_N(0) SDRAM_WE_N SDRAM_RAS_N SDRAM_CAS_N SDRAM_CLK SDRAM_CLK_EN EBI2_WE_N NAND_READY NAND_ALE NAND_CLE EBI2_OE_N RESOUT_N SDRAM_ADDR(13) SDRAM_ADDR(14) EBI2_DATA(0:7)
R302 100K J2 _CS K1 _WED G2 _RAS H2 _CAS G8 CK E3 CKE B6 _CE B7 C6 C4 B4 B3 C3 _WEN R_B ALE CLE _RE _WP

HYC0UEH0MF3P-6SS0E REV_B C5 VSSN0 P6 VSSN1 J9 K10 L10 M9 N10 C10 D9 E10 F9 G10 X16 SDRAM --> X32 SDRAM

R301 100K

VREG_MSMP_2.7V
51K R300

VREG_BT_2.85V

VDD_MSME : 4.7uF

+VPWR C307 C301 C303 C304 C305 C302 C306 C308 VSSQ0 VSSQ1 VSSQ2 VSSQ3 VSSQ4 VSSQ5 VSSQ6 VSSQ7 VSSQ8 VSSQ9 REV_B C310

0.1u

0.1u

0.1u

0.1u

4.7u

0.1u

NAND_CS_N
B

0.1u

0.1u

4.7u

C446 33u

1u

C312

C311

1u

+VPWR AMUX_OUT

+VPWR

+VPWR

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

CBL0PWR_N(MPP3)

CBL1PWR_N(MPP4)

AMUX_IN2(MPP2)

VDD_RF AMUX_IN1(MPP1)

VREG_SYNT REF_OUT(MPP8)

SPKR_OUT_M

VREG_RFRX1

VREG_RFRX2

SPKR_OUT_P

SPKR_IN_P

VREG_RFTX

VREG_WLAN

SPKR_IN_M

VREG_TCXO

VDD_WLAN

VDD_SPKR

GND_SLUG

AMUX_OUT

SPKR_BYP

VDD_MAIN

EBI2_DATA(0) EBI2_DATA(1) EBI2_DATA(2) EBI2_DATA(3) EBI2_DATA(4) EBI2_DATA(5) EBI2_DATA(6) EBI2_DATA(7) SDRAM_ADDR(0) SDRAM_ADDR(1) SDRAM_ADDR(2) SDRAM_ADDR(3) SDRAM_ADDR(4) SDRAM_ADDR(5) SDRAM_ADDR(6) SDRAM_ADDR(7) SDRAM_ADDR(8) SDRAM_ADDR(9) SDRAM_ADDR(10) SDRAM_ADDR(11) SDRAM_ADDR(12)

N1 N2 N3 M5 P7 M6 N6 M8 K4 L1 L2 L3 C2 D2 E1 D3 E2 D4 K3 F2 F1

IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7 A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 A11 A12

C317

C318

C319

C320

C321

C316

J3 BA0 K2 BA1

VDDQ0 VDDQ1 VDDQ2 VDDQ3 VDDQ4 VDDQ5 VDDQ6 VDDQ7 VDDQ8 VDDQ9

J10 K9 L9 M10 N9 C9 D10 E9 F10 G9

VREG_MSME_1.8V

+VPWR

2.2u 1608

REMOTE_PWR_ON
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 85 84 83 82 81

Check if it is LOW enable.

C
REF_BYP REF_GND REF_ISET VCOIN MSM_INT_N TCXO_IN PS_HOLD 63 62 61 60 59 58 57 56 54 53 51 52 51 51K 50 49 51K 48 47 46 45 44 43 55

SDRAM_ADDR(0:12)

0.1u R303

C322 121K 1% BAT300 1u PM_INT_N TCXO_PM NBL414R-F9J C323 470K R304 PS_HOLD VREG_MSMA_2.6V

C324

10K 1005

C325

VSS0 VSS1 VSS2 VSS3 VSS4 VSS5

B9 C1 H9 J1 P9 M2

+5V_PWR ICHARGE CHG_CTL_N ICHARGEOUT VBATT BATT_FET_N RESIN_N C327 1u USB_OE_N C328 C329 C331 C330 C332 USB_CTL_N USB_VBUS USB_DAT USB_D+ USB_SE0 USB_DR309 2.2K 0.1u 12p

2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21

ADC_BYP VCHG ISNS_P CHG_CTL_N ISNS_M VBAT BAT_FET_N FLSH_DRV_N PON_RESET_N VREG_USB USB_ID VREG_5V USB_OE_N VSW_5V USB_CTL_N USB_VBUS USB_DAT USB_D_P

R305

4.7u C333 smd_1608h_9_r

RUIM_M_RST(MPP5)

RUIM_M_CLK(MPP9)

RUIM_M_IO(MPP11)

RUIM_CLK(MPP10)

C389

LCD LDO

0.1u

0.1u

SDRAM_DATA(0) SDRAM_DATA(1) SDRAM_DATA(2) SDRAM_DATA(3) SDRAM_DATA(4) SDRAM_DATA(5) SDRAM_DATA(6) SDRAM_DATA(7) SDRAM_DATA(8) SDRAM_DATA(9) SDRAM_DATA(10) SDRAM_DATA(11) SDRAM_DATA(12) SDRAM_DATA(13) SDRAM_DATA(14) SDRAM_DATA(15) SDRAM_DATA(16) SDRAM_DATA(17) SDRAM_DATA(18) SDRAM_DATA(19) SDRAM_DATA(20) SDRAM_DATA(21) SDRAM_DATA(22) SDRAM_DATA(23) SDRAM_DATA(24) SDRAM_DATA(25) SDRAM_DATA(26) SDRAM_DATA(27) SDRAM_DATA(28) SDRAM_DATA(29) SDRAM_DATA(30) SDRAM_DATA(31)

L4 L5 L6 L7 K8 L8 K7 K5 K6 G7 J6 J5 H6 H5 J4 G3 G4 F4 E4 F5 H3 H4 E6 F7 F6 D5 E8 D6 D8 D7 C8 C7

RUIM_IO(MPP12) VSW_PA

SDRAM_DQM(0) SDRAM_DQM(1) SDRAM_DQM(2) SDRAM_DQM(3) SDRAM_DATA(0:31)

0.01u

0.1u

J8 DQM0 G6 DQM1 F8 DQM2 E7 DQM3 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 DQ24 DQ25 DQ26 DQ27 DQ28 DQ29 DQ30 DQ31

VDD0 VDD1 VDD2 VDD3 VDD4 VDD5

B8 D1 H1 H10 P8 M1

TCXO_EN VDD_ANA TCXO_OUT VDD_MSM SBST VREG_MSMP SBCK VBACKUP SBDT XTAL_OUT SLEEP_CLK XTAL_IN RUIM_RST(MPP6) VREG_RUIM VDD_RUIM

0.1uF

0.1uF

0.1uF

0.1uF

0.1uF

VREG_MSME_1.8V

R306 R307 R308

TCXO_EN +VPWR TCXO_MSM +VPWR VREG_MSMP_2.7V

C326 4.7u

smd_1608h_9_r

U300 PM6650-2M

VREG_MSMA

VREG_MSMP_2.7V

X300
SSBDT_PM TP308 SLEEP_CLK C337 C338 USIM_P_RST_N 4 1 MC-146_7pF 3 2

B5 VCC0 N5 VCC1 J7 H7 H8 B1 B2 B10 E5 F3 G1 G5 M3 M4 M7 N4 N7 N8 P1 P2 P3 P4 P5 P10

VREG_MSMP_2.7V
C335

USB_SE0 USB_D_M KPD_DRV_N GP1_DRV_N(MPP7) LCD_DRV_N KPDPWR_N VIB_DRV_N

C334

VREG_MSMC

VREG_MSME VSW_MSME

VSW_MSMC

C344

C343

NC0 NC1 NC2 NC3 NC4 NC5 NC6 NC7 NC8 NC9 NC10 NC11 NC12 NC13 NC14 NC15 NC16 NC17 NC18 NC19 NC20 NC21

VREG_MMC

VDD_MSMC

VDD_MSME

VREG_PA

C336 4.7u 1608

VDD_PA

32.768KHz
REV_D

12p +VPWR USIM_RST_N USIM_P_CLK USIM_CLK USIM_DATA VREG_USIM_2.85V VREG_MMC_3.0V

22

23

24

25

26

27

28

29

30

31 32

33

34

35

36

37

40

KYBD_BACKLIGHT PM_ON_SW_N MOTOR_PWRUSIM_P_DATA

41 42

38

39

12p

smd_2520h1_6_r

L300

L305 4.7uH VREG_RF_SMPS C435 22u C436 10u C433 0.1u C434 1000p

1608

1608

REV_B

4.7uH L301 smd_2520h1_6_r

C339 2.2u

C340 2.2u

C358 22u REV_E

4.7uH

4.7u

4.7u

Power Line --> Route carefully!!!!! Draw the Artwork_line thickly !!!!! --->> USB_VBUS , FLASH_DRV_N , KPD_DRV_N , KEY_ON_SW_N , MOT_PWR-

DNU0 DNU1 DNU2 DNU3 DNU4 DNU5 DNU6

A2 A9 A10 R1 R2 R9 R10

1608

C341

1608

Artwork --> Place resistor and capacitor close to PM6650 !!


VREG_LCD_2.8V C345 1u VREG_MSMC_1.25V VREG_MSME_1.8V

MCP(512Mb NAND + 512Mb 1 piece SDRAM) MEMORY


C

+VPWR

U302 R1114D281D-TR-F 3 VDD VOUT 2 GND1 5 GND2

LCD_LDO_EN C346 1u

4 NC 6 CE

CAMERA LDO
+VPWR CAM_LDO_EN C347 1u U303 RT9011-MGPQW 1 8 VIN VOUT1 2 7 EN1 VOUT2 6 3 NC2 EN2 4 5 NC1 GND PGND 9 ICHARGEOUT +VPWR SI3493DV-E3 Q301 VREG_CAM_AVDD_2.8V VREG_CAM_DVDD_1.8V C348 1u C349 1u VBATT R314 100K
D3 D4

CHARGER
R313 USB_VBUS 0.1 6 5 4

T-FLASH
D
S300 SCHA1A0100 GND
DAT2_RSV CD_DAT3_CS CMD_DI VDD CLK_SCLK VSS DAT0_DO

Q300
QST4

C1 1 2

C2

3 B

D1 D2

100K

VREG_MMC_3.0V 0

USB_CTL_N

USIM
MMC_CD MMC_CMD MMC_CLK
USIM_P_DATA

R317

15K +VPWR CAM_LDO_EN VREG_USIM_2.85V USIM_P_RST_N USIM_P_CLK C447 1u VIN VOUT 3 4 GND BGND 2 6 STBY NC 1 5 U501 BH15LB1WHFV REV_D
C1 1 smd_1005h_5_r smd_1005h_5_r 2 C2 3 B

D
+5V_PWR

VREG_CAM_DVDD_1.5V BATT_FET_N C350 1u 6 5 4

EVLC18S02003 VA300

5 6 7 8 9 10

J300 HSSC-8P-18 1 GND1 VCC 2 VPP RST 3 CLK IO 4 RSV2 RSV1 11 GND2 GND5 12
GND3 GND4

R315

R316

Q302
QST4

CHG_CTL_N EVLC18S02003 VA302 EVL14K02200 VA301 ICHARGE

470K

VA305 EVLC18S02003

VA303 EVLC18S02003

VA304 EVLC18S02003

VA306 EVLC18S02003

DAT1_RSV

MMC_DATA
C351 0.1u

C352

C353

GND R318

L302 56nH

LCD BACKLIGHT
Differential lines, route as equal length as possible !! --> ICHARGE , ICHARGEOUT U305 +VPWR REV_B C355 1u WLED_PWR 8 CP C2EN_SET 6 5 IN AAT3157ITP-T1 10 C1+ 9 C17 C2+ C354 1u

33p

0.1u

Section

Date

Sign & Name

Sheet/ MODEL

C356 1u

Designer
WLED_1 WLED_2 WLED_3

MAR.07.2007

Jaykay

KU250 U250/KU250

Sheets

LCD_BL_CTRL R380 100K REV_C REV_B C357 1u

11

GND

1 D1 2 D2 3 D3 12 NC

3/4
Checked DRAWING

OJ300

OJ301

OJ302

OJ303

Approved

NAME

MEM & POWER


REV_1.0
LG Electronics Inc.
LGMC

LG Electronics Inc.
1 2 3 4 5 6 7 8 9

DRAWING NO.

LG(42)-A-5505-10:01

- 145 -

7. CIRCUIT DIAGRAM

10

11

12

13

14

15

16

LCD CONNECTOR
CN400 ICVE21184E150R500FR
9

VREG_MSMP_2.7V

2.2K MICBIAS R400 R401

I/O CONNECTOR
A
R403

A
35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 LCD_RESET_N LCD_IF_MODE_0 LCD_IF_MODE_1 LCD_VSYNC

1 2 3 4

INOUT_A1 INOUT_B1 INOUT_A2 INOUT_B2 INOUT_A3 INOUT_B3 INOUT_A4 INOUT_B4 G1 G2

9 8 7 6

1M

10

LCD_CS_N LCD_ADS EBI2_WE_N EBI2_OE_N

7 6

INOUT_B2 INOUT_B3 INOUT_B4 G2

INOUT_A2 INOUT_A3 INOUT_A4 G1

3 4

C400 0.1u TP400 +VPWR L400 56nH D400 RB521S-30 5 MOTOR_PWRHOOK_KEY 1


OUT VCC GND

R402

ICVE21184E150R500FR

INOUT_B1

INOUT_A1

1 2

EBI2_DATA(0) EBI2_DATA(1) EBI2_DATA(2) EBI2_DATA(3)

5.1K

VREG_MSMP_2.7V 51K 10K R404 100K 4 3


VIN-

CN401 HSEJ-18S04-25R

FL400
INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 1 2 3 4

TP401 EBI2_DATA(4) EBI2_DATA(5) EBI2_DATA(6) EBI2_DATA(7)

FL401

ICVE21184E150R500FR
9 8 7 6 INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 G2

10

VIN+

U400 NCS2200SQ2T2G

MIC2N MIC2P
C401 33u R406 100ohm

G1

HPH_L HPH_R
USB_D+ USB_D-

C402

33u

R407 100ohm

FL402
R408
INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4

B
19

20 18 17 16 15 14 13 12 11 10 9 8 7 6 5

ICVE21184E150R500FR
1 2 3 4 INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 G1 9 8 7 6

EAR_SENSE_N VBATT REMOTE_PWR_ON +5V_PWR


FL404 2 4 OUT G2 IN G1 REV_B 1 3

R409

G2

FL403

47n C403

680K

EBI2_DATA(8) EBI2_DATA(9) EBI2_DATA(10) EBI2_DATA(11)

VBAT_SENSE 470K

USB_VBUS UART_TXD UART_RXD


CN402 EVLC18S02003 EVLC18S02003 EVL14K02200 EVL14K02200 EVL14K02200 1 2 3 4 C404 0.1uF VBAT

ICVE21184E150R500FR
1 2 3 4 INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 G1 INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 G2 9 8 7 6

10

NTS104B

21 19 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 20 22

10

R405

REV_B : Change Pin Description EBI2_DATA(12) EBI2_DATA(13) EBI2_DATA(14) EBI2_DATA(15) VBAT_TEMP

EVL14K02200

C1005X7R1H471KT

EVL14K02200

EVL14K02200

EVL14K02200

SD12T1G

0.01u

1u

C432 470p

C
3

4 2 1 VA410 EVL14K02200

10

R410

C406

C407

C408

VA403

VA401

VA400

VA402

VA404

VA405

LCD_MAKER_ID VREG_LCD_2.8V WLED_1 WLED_2 WLED_3 WLED_PWR

EVL14K02200

VBAT_GND

REV_1.0

VA409

PLW0501H-LF D402

0.1u

INSTPAR

C409

KEY_BACK_LIGHT LED(8EA)
+VPWR

VA490

VA407

VA408

D401

80.6K

C405

FL405

VREG_MSMP_2.7V

47p

47p

LD400 LD403 LD406

LEBB-S14H LEBB-S14H LEBB-S14H

R411 100ohm R414 100ohm R417 100ohm LD404 LD407 LEBB-S14H R415

LD402 LD405 LD408

LEBB-S14H LEBB-S14H LEBB-S14H R413 100ohm R416 100ohm R419 100ohm

LEBB-S14H 100ohm R418 100ohm

CAMERA
E

REV_B : EDLH0013501 --> EDLH0006001

AUDIO MEGA CAMERA CONNECTOR


32 31 30 29 28 27 26 25 PGND1 PGND2 PGND3 PGND4 PGND5 PGND6 PGND7 PGND8 REV_1.0 20 19 18 12 11 10 9 7 R436 0 CAM_PCLK CAM_VSYNC_OUT CAM_HSYNC_OUT MEGA_CAM_PWR_DOWN I2C_SCL I2C_SDA MEGA_CAM_RESET_N CAM_MCLK R437 20 EVL14K02200 +VPWR C410 0.01u SPKSPK_RCV-

SELECT_SPK&RCV
U401 NLAS5223BMNR2G
1 VCC 2 NO1 3 COM1 4 IN1 NC2 6 NC1 GND IN2 7 COM2 8 NO2 9 10

KYBD_BACKLIGHT

SPK+ SPK_RCV+ RCV_EN_N 10 R421 VA412 VREG_MSMP_2.7V RCV+ 2 4 6 8

VA414

R423

EVL14K02200

100K

CAM_DATA_OUT(0) CAM_DATA_OUT(1) CAM_DATA_OUT(2) CAM_DATA_OUT(3) CAM_DATA_OUT(4) CAM_DATA_OUT(5) CAM_DATA_OUT(6) CAM_DATA_OUT(7)

22 23 24 1 2 3 4 5

D0 D1 D2 D3 D4 D5 D6 D7

CN403

PCLK VSYNC HSYNC STANDBY SCK SDA RESETB MCLK

END

RCV-

R422

10

KEY MAP
100K

PM_ON_SW_N

END

F
RA400 1 3 5 7

DGND1 DGND2 DGND3 AGND1 AGND2 DVDD VDDIO AVDD

8 15 21 6 17 13 14 16

CLR

MENU

REV_B KEY_ROW(0)

C411 C412

VREG_CAM_AVDD_2.8V VREG_CAM_DVDD_1.8V C414 C415 C448 C413 C449

400

401
2

402
3

LEFT

UP

0.1uF 1u

MIC
MICBIAS REV_B : SUMY0010301 --> SUMY0003802 REV_1.0 COMMON_CAM_MCLK MIC400 OB4-15L42-C33L 1 2 INSTPAR INSTPAR CAM_DATA_OUT(3) CAM_DATA_OUT(4) CAM_DATA_OUT(5) C418 C419 2.2K 39p 39p 0.1u 0.1u MIC1P MIC1N R424 2.2K C416 10u C417 47p

10p

0.1u

10p

NA

NA

1 KEY_ROW(1)

403
4 KEY_ROW(2)

404
5

405
6

OK

RIGHT
C

406
7 KEY_ROW(3)

407
8

408
9

SND

SEARCH

ICVE21184E150R500FR CAM_DATA(0) CAM_DATA(1) CAM_DATA(2)


1 2 3 4 INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 G1 INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 G2 9 8 7 6

ICVE21184E150R500FR CAM_DATA_OUT(0) CAM_DATA_OUT(1) CAM_DATA_OUT(2) CAM_DATA(3) CAM_DATA(4) CAM_DATA(5)


1 2 3 4 INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 G1 INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 G2 9 8 7 6

HOT400
HOT4 KEY_ROW(4) KEY_COL(0) KEY_COL(1) KEY_COL(2) KEY_COL(3) KEY_COL(4)

409
0

HOT401
HOT3

DN

BACK

C420

C421

10

10

FL406

FL407 ICVE21184E150R500FR CAM_DATA(6) CAM_DATA(7) CAM_VSYNC CAM_HSYNC


1 2 3 4 INOUT_A1 INOUT_A2 INOUT_A3 INOUT_A4 G1 INOUT_B1 INOUT_B2 INOUT_B3 INOUT_B4 G2 9 8 7 6

D403 PSD05-LF

PSD05-LF

R425

CAM_DATA_OUT(6) CAM_DATA_OUT(7) CAM_VSYNC_OUT CAM_HSYNC_OUT

REV_B : EDTY0008606 --> EDTY0008601

D404

Audio AMP
NCP2890DMR2
SPK_AMP_EN 1 REV_C : 20K --> 3K VGA_CAM_RESET_N I2C_SCL I2C_SDA LINE_N LINE_P R427 R429 1K 1K C4265600p C422 C423 C4275600p 0.1u 0.1u R428 5.6K R430 5.6K R431 20K C431 NA C425 10u R426 20K 2 _SD OUTB 8 SPK-

KEYS

FL408

VT_CAMERA_CONNECTOR
C424

10

VREG_CAM_AVDD_2.8V

3 INP 4 INM

7 BYPASSU402 VM 6 VP OUTA 5 C428 1u

+VPWR

E
SPK+ C429 C430

20 19 18 17 16

NA

GND8

GND7

P20 P19 P18 P17 P16

Section

Date MAR.07.2007

Sign & Name

Sheet/ MODEL

1000p 1000p

VREG_CAM_DVDD_1.5V COMMON_CAM_MCLK REV_1.0 CAM_PCLK CAM_DATA_OUT(0)

EVL14K02200

1 P1 2 P2 3 P3 4 P4 5 P5
GND1

GND6 GND5

CN404

15 P15 14 P14 13 P13 12 P12 11 P11


GND3 GND4

Designer

Jaykay

KU250 U250/KU250
KEY / MMI LCD/CAMERA REV_1.2

Sheets

CAM_HSYNC_OUT CAM_VSYNC_OUT CAM_DATA_OUT(7) CAM_DATA_OUT(6)

4/4
Checked DRAWING

6 P6 7 P7 8 P8 9 P9 10 P10

GND2

VA430

F
CAM_DATA_OUT(1) CAM_DATA_OUT(2) CAM_DATA_OUT(3) CAM_DATA_OUT(4)

L401 SPK_RCVL402 SPK_RCV+ CAM_DATA_OUT(5)

100nH 100nH

RCVN

Approved
RCVP

NAME

REV_E : For Antenna Radiation

LG Electronics Inc.
1 2 3 4 5 6 7 8 9

DRAWING NO.

LG(42)-A-5505-10:01
LGMC

LG Electronics Inc.

- 146 -

8. PCB LAYOUT

LGMC

- 147 -

U250/KU250

8. PCB LAYOUT

LGMC

- 148 -

U250/KU250

9. Calibration & RF Auto Test Program (Hot Kimchi)

9. Calibration & RF Auto Test Program (Hot Kimchi)


9.1 Configuration of HOT KIMCHI
9.1.1 Configuration of directory
C: Cm_Grut Common dll_serialat Log At_Serial_Cmd.xml Diag_NV6250_RevB.dll Diag_NV6275.dll Diag_NV.dll DLL_E5515CD.DLL DLL_PwrControlD.dll Dll_SerialATD.dll LG_CL_011.dll PwrSupply_Cmd.xml LG_CL_009.dll

Debug

Auto Cal

KU250 KU250 KU250

: Directory : File

CalAuto

- 149 -

9. Calibration & RF Auto Test Program (Hot Kimchi)

Hot_Kimchi

Debug image Log ComLMPLib_11.dll Dll_EzLooksMQ_004.dll GuiTk115d.dll HK_25.exe ijl11.dll SBCmd.xml ShieldBox_DllD.dll

Model

KU250 LG_RfTest_E5515C_211.dll QMSL_MSVC6R.dll

Log AutoSetup_110.xml Cal_Setup_Test.xml Ezlooks.xml


LG_RfCal_Q3G6280N_Polar_006.dll

Procedure_KU250_103.xml script_auto_001.xml : Directory : File script_cal_003.xml Spec_3GPP_030.xml

- 150 -

9. Calibration & RF Auto Test Program (Hot Kimchi)

dll,ocx

(Win98)MFCD DLL COPY.bat (Win2000)MFCD DLL COPY.bat (WinXP)MFCD DLL COPY.bat MFC42D.DLL MFCD42D.DLL MFCN42D.DLL MFCO42D.DLL MSVCP60D.DLL MSVCRTD.DLL Vsflex7L.ocx vsflex7l_ocx_regist.bat

Result

Auto Cal CalAuto

KU250 KU250 KU250 result.bmp

UI

image LG_UI_Ad6500_002.dll LG_UI_EmKU250_001.dll

: Directory LG_UI_Qu6250_003.dll : File 1. _New_HK_0808.reg LG_UI_Qu6275_004.dll

- 151 -

9. Calibration & RF Auto Test Program (Hot Kimchi)

9.2 How to use HOT KIMCHI

* Procedure 1. Click Logic Operation of SETTING menu bar 2. Select UART Port that PC can communicate with the phone 3. Select LOGIC MODE that you want - Logic Mode -> 1: Calibration Only

- 152 -

9. Calibration & RF Auto Test Program (Hot Kimchi)

KU250

Click "Start"
Select "U250/KU250"

* Procedure 4. Select the model name U250/KU250 5. Click Start button

- 153 -

10. Factory Test Mode

10. Factory Test Mode


10.1. Test Program Setting
1) Open LG FTM GUI 2) Click Options >> Port Settings 3) Select Com Port and click OK

- 154 -

10. Factory Test Mode

10.2. WCDMA Test Mode


1) Click Tools >> FTM GUI WCDMA 2) Select FTM Mode 3) Select RF Frequencies, insert 9750 in Uplink chan and push Enter. Then 2140 is written at Rx UHF automatically. 4) For Deciding to TX AGC, insert 380 as a maximum value . And then WCDMA Power is decided. 5) To set PA Range, select ON in R1 for High power mode or select ON in R0 for Low power mode. 6) Depending on a situation, Click Tx On or Tx Off.

Channel Select

Tx Control

Rx Control

7) Set Rx mode. Click LNA Range, 0~4. 8) Click Get IM2 and Get Rx AGC. Confirm the value.

- 155 -

10. Factory Test Mode

10.3. GSM Test Mode


1) To switch GSM Mode, Select Mode -> GSM mode at menu commands 2) Select RF Mode, Click GSM or GSM1800 or GSM1900 3) Write wanted channel. We usually set 1 4) For Deciding to PA DAC Value, insert 14300 as a maximum value 5) Click Tx On or Tx Off. 6) SET RX mode. Click LNA Range, 0~4. 7) Click RX ON

Channel Control

Tx Power Control

Rx Gain Control

- 156 -

11. EXPLODED VIEW & REPLACEMENT PART LIST


11.1 EXPLODED VIEW
32 31 28 29 30 35

20 19 17 15 16 13 12 8 5 4 3 2 1 6 7 18

22

36

34

33

24 25 23

26

27

37 14

10

11

- 157 -

- 158 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

11.2 Replacement Parts <Mechanic component>


Level 1 2 3 2 3 2 3 4 4 4 5 5 4 4 4 4 4 4 4 4 4 4 3 4 4 4 4 4 4 4 4 4 4 AAAY00 MCJA00 APAY00 BSEA00 APEY00 ACGK00 MCCC00 MCCG00 MCJK00 MICE00 MICE01 MFBC00 MFBZ00 MHGJ00 MKAZ00 MPBG00 MPBT00 MTAB00 MTAB01 MTAD00 Location No. Description IMT,BAR/FLIP ADDITION COVER,BATTERY PACKAGE SUPPLEMENTARY PART PHONE COVER ASSY,FRONT CAP,EARPHONE JACK CAP,MULTIMEDIA CARD COVER,FRONT INSERT,NUT INSERT,NUT FILTER,SPEAKER FILTER HOLDER,SPEAKER KEYPAD PAD,LCD PAD,CAMERA TAPE,PROTECTION TAPE,PROTECTION TAPE,WINDOW Part Number TIMT0000614 AAAY0219401 MCJA0040601 APAY0095904 BSEA0003901 APEY0394202 ACGK0085601 MCCC0043601 MCCG0007601 MCJK0069301 MICE0000601 MICE0000701 MFBC0029401 MFBZ0002801 MHGJ0001701 MKAZ0035901 MPBG0058301 MPBT0039101 MTAB0160501 MTAB0160601 MTAD0065801 MWAC0077201 ACGM0087501 ENZY0019701 MCCF0042501 MCJN0065501 MHGZ0028701 MLAB0001102 MLAN0000603 MPBH0029101 MPBN0039001 MPBZ0186001 MPBZ0186801

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Spec

Color Black Black

Remark

MOLD, PC LUPOY SC-1004A, , , , , U250 HIT Packing(P/Label66-Angle-9501) PACKING-LIST ENVELOPE

Without Color Without Color

36

Black Without Color COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , MOLD, PC LUPOY SC-1004A, , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), 1.2, , , , COMPLEX, (empty), 1.2, , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), 0.2, , , , COMPLEX, (empty), 1.0, , , , Without Color Without Color Without Color Without Color Without Color Without Color Without Color Black Without Color Without Color Without Color Without Color Without Color Without Color Without Color Without Color 4 PIN,3.0 mm,ETC , ,H=5.8 COMPLEX, (empty), , , , , MOLD, PC LUPOY SC-1004A, , , , , COMPLEX, (empty), , , , , C2000 USASV DIA 4.0 White,95C COMPLEX, (empty), , , , , CUTTING, NS, , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , Black Without Color Black White Transparent Black Black Without Color Without Color 26 18 19 25 24 29 28 22 27 6 9 7 11 12 8 1 13 3 2 10 4 5

MWAC00 WINDOW,LCD ACGM00 ENZY00 MCCF00 MCJN00 MHGZ00 MLAB00 MLAN00 MPBH00 MPBN00 MPBZ00 MPBZ01 COVER ASSY,REAR CONNECTOR,ETC CAP,MOBILE SWITCH COVER,REAR HOLDER LABEL,A/S LABEL,QUALCOMM PAD,MIKE PAD,SPEAKER PAD PAD

- 159 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 4 4 4 4

Location No. MTAB01 MTAD00

Description TAPE,PROTECTION TAPE,WINDOW

Part Number MTAB0178301 MTAD0065901 MWAE0024501 SJMY0007903 COMPLEX, (empty), , , , ,

Spec

Color Without Color Without Color Without Color

Remark 32 30 31 23

COMPLEX, (empty), 0.2, , , , COMPLEX, (empty), 1.0, , , , 3 V,0.85 A,4*8 ,Height 5.8T Cylinder ,; ,3V , , ,11000 , , , , 3.0 ,-2 dBd, ,EGSM+DCS+PCS+W-BAND I, INTERNAL ,; ,QUAD ,-2.0 ,50 ,3.0 COMPLEX, (empty), , , , , COMPLEX, (empty), , , , , COMPLEX, (empty), 0.6t, , , ,

MWAE00 WINDOW,CAMERA SJMY00 VIBRATOR,MOTOR

4 3 6 6 5 5 5

SNGF00 MLAA00 MCBA00 MPBZ00 ADCA00 MTAZ00 MLAZ00

ANTENNA,GSM,FIXED LABEL,APPROVAL CAN,SHIELD PAD DOME ASSY,METAL TAPE LABEL

SNGF0023102 MLAA0042001 MCBA0017101 MPBZ0179301 ADCA0064001 MTAZ0186301 MLAZ0038301

20 Without Color Without Color Without Color Without Color 16 14 34

COMPLEX, (empty), 0.1, , , , PID Label 4 Array

Without Color Without Color

- 160 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

11.2 Replacement Parts <Main component>


Level 3 3 4 5 5 5 Location No. GMEY00 SAFY00 SAFB00 ACKA00 SUMY00 SUSY00 Description SCREW MACHINE,BIND PCB ASSY,MAIN PCB ASSY,MAIN,INSERT CAN ASSY,SHIELD MICROPHONE SPEAKER Part Number GMEY0011201 SAFY0196602 SAFB0072901 ACKA0002101 SUMY0010301 SUSY0026801

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Spec 1.4 mm,3 mm,MSWR3(BK) ,N ,+ ,NYLOK

Color Without Color

Remark 33 15

Without Color FPCB ,-42 dB,4*1.5T ,Standard Holder ASSY ,8 ohm,88 dB, mm,wire 15mm ,; , , , , , ,18*10*3T ,WIRE CMOS ,MEGA ,1.3M, Magnachip(1/4"), 8x8x5t, Socket Type CMOS ,VGA ,Socket type MAIN ,176*220 (1.76") ,34*46.7*2.5(T) ,262k ,TFT ,TM ,NT3916(Novatek) ,NTSC:60%

17

5 5 5 4 5

SVCY00 SVCY01 SVLM00 SAFF00 SAFC00

CAMERA CAMERA LCD MODULE PCB ASSY,MAIN,SMT PCB ASSY,MAIN,SMT BOTTOM ANTENNA,GSM,FIXED

SVCY0014401 SVCY0014301 SVLM0025001 SAFF0117802 SAFC0088501

ANT103

SNGF0026001

3.0 ,-2.0 dBd, ,Bluetooth, SMD, 8.0*2.0*1.2 ,; ,SINGLE ,2.0 ,50 ,3.0 2 V,0.5 mAh,CYLINDER ,Reflow type BB, Max T 1.67, phi 4.8, Pb-Free 56 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 8.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 6 pF,50V,D,NP0,TC,1005,R/TP 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 180 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 3.3 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 33 uF,10V ,M ,L_ESR ,2125 ,R/TP ,; , ,[empty] ,[empty] , ,[empty] , ,[empty] ,[empty] ,[empty] ,[empty] 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP

6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

BAT300 C101 C103 C104 C106 C107 C108 C109 C110 C112 C113 C114 C115 C117 C118 C119 C121 C122

BATTERY,CELL,LITHIUM CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,TANTAL,CHIP,MAKER CAP,CERAMIC,CHIP

SBCL0001701 ECZH0000841 ECCH0001002 ECCH0001002 ECZH0000846 ECCH0000107 ECCH0001002 ECZH0000830 ECZH0000830 ECZH0000816 ECCH0001002 ECCH0000149 ECCH0000143 ECCH0000110 ECZH0000816 ECCH0000115 ECTZ0005603 ECCH0000393

- 161 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. C123 C124 C126 C127 C128 C129 C130 C131 C132 C134 C135 C136 C139 C140 C141 C142 C143 C144 C147 C149 C150 C151 C152 C153 C154 C155 C156 C157 C158 C159 C161 C162 C164 C165 C170 C171 C172

Description CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,TANTAL,CHIP CAP,CHIP,MAKER INDUCTOR,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP

Part Number ECCH0000155 ECZH0000813 ECCH0000115 ECCH0000182 ECCH0000115 ECCH0000182 ECCH0000115 ECCH0000182 ECCH0000115 ECCH0000155 ECCH0000182 ECCH0000155 ECZH0000844 ECCH0000115 ECCH0000115 ECZH0000813 ECCH0000182 ECCH0000393 ECCH0000115 ECCH0000112 ECCH0000143 ECCH0000115 ECCH0000155 ECCH0000112 ECZH0000802 ECTH0002202 ECZH0000813 ELCH0001427 ECCH0000112 ECCH0000112 ECCH0000901 ECCH0000180 ECCH0000101 ECCH0000101 ECCH0000182 ECCH0000143 ECCH0004904

Spec 10 nF,16V,K,X7R,HD,1005,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 68 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 15 pF,50V,J,NP0,TC,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 15 pF,50V,J,NP0,TC,1005,R/TP 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 4.7 uF,10V ,M ,STD ,1608 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 2.2 nH,S ,1005 ,R/TP ,Pb Free 15 pF,50V,J,NP0,TC,1005,R/TP 15 pF,50V,J,NP0,TC,1005,R/TP 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 3.3 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

Color

Remark

- 162 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. C173 C174 C176 C177 C178 C179 C180 C181 C182 C183 C185 C186 C187 C188 C189 C190 C192 C200 C201 C202 C203 C204 C205 C206 C209 C210 C211 C212 C213 C214 C215 C216 C217 C218 C219 C220 C221

Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,TANTAL,CHIP,MAKER CAP,TANTAL,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER

Part Number ECCH0000198 ECCH0000110 ECCH0000143 ECZH0004402 ECZH0000813 ECZH0000813 ECCH0005602 ECCH0000182 ECCH0000143 ECCH0000155 ECZH0000813 ECCH0000143 ECCH0000143 ECCH0000155 ECCH0000115 ECCH0000101 ECZH0000813 ECCH0000122 ECCH0000122 ECZH0001211 ECZH0001211 ECCH0000110 ECTZ0004701 ECTH0003701 ECZH0004402 ECCH0000179 ECCH0000179 ECCH0000182 ECCH0000155 ECCH0000155 ECCH0000155 ECZH0004402 ECCH0000155 ECCH0000155 ECZH0004402 ECZH0004402 ECZH0004402

Spec 2.2 uF,6.3V ,M ,X5R ,TC ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP .5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP 220 nF,10V ,Z ,Y5V ,HD ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 4.7 uF,6.3V ,M ,STD ,1608 ,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

Color

Remark

- 163 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. C222 C223 C225 C226 C227 C228 C229 C230 C231 C232 C233 C234 C235 C236 C237 C238 C239 C240 C242 C243 C244 C246 C247 C301 C302 C303 C304 C305 C306 C307 C308 C310 C311 C312 C316 C317 C318

Description CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER

Part Number ECCH0000143 ECCH0000143 ECCH0000155 ECCH0000155 ECCH0000155 ECCH0000155 ECZH0004402 ECZH0004402 ECCH0000147 ECCH0000143 ECCH0000143 ECCH0000143 ECCH0000143 ECCH0000155 ECCH0000143 ECCH0000143 ECCH0000143 ECZH0004402 ECZH0004402 ECCH0000182 ECCH0000155 ECCH0000161 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0000182 ECCH0007801 ECCH0007801 ECCH0004904 ECCH0004904 ECCH0005602 ECZH0004402 ECZH0004402

Spec 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 2.2 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 33 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP

Color

Remark

- 164 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. C319 C320 C321 C322 C323 C324 C325 C326 C327 C328 C329 C330 C331 C332 C333 C334 C335 C336 C337 C338 C339 C340 C341 C343 C344 C345 C346 C347 C348 C349 C350 C351 C352 C353 C354 C355 C356

Description CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP

Part Number ECZH0004402 ECZH0004402 ECZH0004402 ECCH0000182 ECCH0004904 ECZH0000816 ECCH0000182 ECCH0006201 ECCH0004904 ECZH0004402 ECZH0004402 ECZH0004402 ECZH0004402 ECZH0004402 ECCH0006201 ECCH0000155 ECCH0000182 ECCH0007801 ECZH0000816 ECZH0000816 ECCH0005602 ECCH0005602 ECCH0006201 ECCH0000182 ECCH0000182 ECCH0004904 ECZH0001215 ECZH0001215 ECCH0004904 ECCH0004904 ECCH0004904 ECCH0000182 ECZH0000830 ECCH0000182 ECCH0004904 ECZH0001215 ECCH0004904

Spec 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 4.7 uF,10V ,Z ,Y5V ,HD ,1608 ,R/TP 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 12 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP 2.2 uF,16V ,K ,X5R ,HD ,1608 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP

Color

Remark

- 165 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. C357 C358 C389 C400 C401 C402 C403 C404 C405 C406 C407 C408 C409 C410 C411 C412 C413 C414 C415 C416 C417 C418 C419 C420 C421 C422 C423 C425 C426 C427 C428 C429 C430 C432 C433 C434 C435

Description CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP

Part Number ECZH0001215 ECCH0000393 ECCH0006201 ECCH0000182 ECTH0004402 ECTH0004402 ECCH0002002 ECZH0004402 ECCH0000155 ECZH0001215 ECCH0000122 ECCH0000122 ECCH0000182 ECCH0000155 ECZH0004402 ECCH0004904 ECCH0000110 ECCH0000182 ECCH0000110 ECTH0003701 ECCH0000122 ECCH0000182 ECCH0000182 ECCH0000120 ECCH0000120 ECCH0000182 ECCH0000182 ECTH0001902 ECCH0000152 ECCH0000152 ECZH0001215 ECCH0000143 ECCH0000143 ECZH0001121 ECCH0000182 ECCH0000143 ECTH0001903

Spec 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 22 uF,6.3V ,M ,X5R ,HD ,2012 ,R/TP 4.7 uF,6.3V ,K ,X5R ,TC ,1608 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP 33 uF,6.3V ,M ,L_ESR ,2012 ,R/TP 47000 pF,10V ,K ,B ,HD ,1005 ,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 nF,16V,K,X7R,HD,1005,R/TP 0.1 uF,16V ,Z ,NP0 ,TC ,1005 ,R/TP 1 uF,6.3V ,K ,X5R ,TC ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 pF,50V,D,NP0,TC,1005,R/TP 10 uF,6.3V ,M ,L_ESR ,1608 ,R/TP 47 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 39 pF,50V,J,NP0,TC,1005,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 10 uF,10V ,M ,L_ESR ,1608 ,R/TP 5.6 nF,25V,K,X7R,HD,1005,R/TP 5.6 nF,25V,K,X7R,HD,1005,R/TP 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 470 pF,50V ,K ,X7R ,HD ,1005 ,R/TP 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP 1 nF,50V,K,X7R,HD,1005,R/TP 22 uF,6.3V ,M ,L_ESR ,1608 ,R/TP

Color

Remark

- 166 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. C436 C437 C438 C439 C440 C441 C442 C443 C444 C445 C446 C447 C450 CN400 CN401 CN403 D400 D401 D402 D403 D404 FL101

Description CAP,CERAMIC,CHIP CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,CERAMIC,CHIP CAP,TANTAL,CHIP,MAKER CAP,CHIP,MAKER CAP,CERAMIC,CHIP CONNECTOR,FFC/FPC CONNECTOR,I/O CONN,SOCKET DIODE,SWITCHING DIODE,TVS DIODE,TVS DIODE,TVS DIODE,TVS FILTER,SAW

Part Number ECCH0005604 ECZH0000802 ECZH0000813 ECZH0000806 ECZH0000806 ECCH0000185 ECCH0000185 ECCH0000185 ECCH0000901 ECCH0000901 ECTZ0005603 ECZH0001215 ECCH0000115 ENQY0010901 ENRY0006401 ENSY0020101 EDSY0011901 EDTY0007401 EDTY0008610 EDTY0008601 EDTY0008601 SFSY0030201

Spec 10 uF,6.3V ,M ,X5R ,TC ,1608 ,R/TP 1 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 100 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 5 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 5.6 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 2.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP 33 uF,10V ,M ,L_ESR ,2125 ,R/TP ,; , ,[empty] ,[empty] , ,[empty] , ,[empty] ,[empty] ,[empty] ,[empty] 1 uF,10V ,K ,X5R ,TC ,1005 ,R/TP 22 pF,50V,J,NP0,TC,1005,R/TP 35 PIN,0.3 mm,ETC , ,H=1.2 18 PIN,0.4 mm,ANGLE , ,H=2.5, Reverse Type 24 PIN,ETC , ,0.9 mm, EMD2 ,30 V,1 A,R/TP ,VF=1.5V(IF=200mA) , IR=30uA(VR=10V) SMD ,12 V,350 W,R/TP , SOD-523 ,5 V,250 W,R/TP ,PB-FREE SOD-323 ,6 V,400 W,R/TP ,PB-FREE SOD-323 ,6 V,400 W,R/TP ,PB-FREE 897.5 MHz,1.4*1.1*0.6 ,SMD ,Pbfree_SAW_GSM900_Tx 1950 MHz,1.4*1.1*0.62 ,SMD ,RF Filter for WCDMA 2Ghz ,; ,1950 ,1.4*1.1*0.62 ,SMD ,P/TR 2140 MHz,1.4*1.1*0.62 ,SMD ,2110M~2170M, IL 2.0, 5pin, U-B, 50-100_10, WCDMA BAND I Rx ,; ,2140 ,1.4*1.1*0.62 ,SMD ,R/TP 1950 MHz,2140 MHz,1.6 dB,2.0 dB,53 dB,44 dB,3.0*2.5*1.2 ,SMD ,FBAR, WCDMA duplexer ,; ,2140 ,44 ,1950 ,53 ,2.0 ,1.6 ,3.0X2.5X1.2 ,DUAL ,SMD ,R/TP SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free SMD ,

Color

Remark

FL102

FILTER,SAW

SFSY0031101

FL103

FILTER,SAW

SFSY0031201

FL104

DUPLEXER,IMT

SDMY0001301

FL400

FILTER,EMI/POWER

SFEY0007103

FL401

FILTER,EMI/POWER

SFEY0007103

FL402

FILTER,EMI/POWER

SFEY0007103

6 6

FL403 FL404

FILTER,EMI/POWER FILTER,EMI/POWER

SFEY0007103 SFEY0006001

- 167 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6

Location No. FL405

Description FILTER,EMI/POWER

Part Number SFEY0007103

Spec SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free SMD ,18 V, ,SMD ,4ch. R-Varistor Array(50Ohm,15pF), Pb-free 8 PIN,ETC ,8Pin ,2.54 mm,Korean 8Pin Stopper UIM 100 nH,J ,1005 ,R/TP , 15 nH,J ,1005 ,R/TP ,PBFREE 5.6 nH,S ,1005 ,R/TP , 47 nH,J ,1005 ,R/TP ,COIL TYPE 18 nH,J ,1005 ,R/TP ,PBFREE 10 nH,S ,1005 ,R/TP ,PBFREE 47 nH,J ,1005 ,R/TP ,COIL TYPE 47 nH,J ,1005 ,R/TP ,COIL TYPE 1 nH,S ,1005 ,R/TP , 1 nH,S ,1005 ,R/TP , 12 nH,J ,1005 ,R/TP ,Pb Free 1.8 nH,S ,1005 ,R/TP , 4.7 uH,M ,2.5*2.0*1.0 ,R/TP , 4.7 uH,M ,2.5*2.0*1.0 ,R/TP , 56 nH,J ,1608 ,R/TP , 4.7 uH,M ,2.5*2.0*1.0 ,R/TP , 56 nH,J ,1005 ,R/TP ,chip inductor,PBFREE 100 nH,J ,1005 ,R/TP , 100 nH,J ,1005 ,R/TP , 1.5 nH,S ,1005 ,R/TP ,PBFREE 1.8 nH,S ,1005 ,R/TP , 2.7 nH,S ,1005 ,R/TP , 2.7 nH,S ,1005 ,R/TP , 2.7 nH,S ,1005 ,R/TP , 10 nH,S ,1005 ,R/TP ,PBFREE 4.7 nH,S ,1005 ,R/TP ,PBFREE 4.7 nH,S ,1005 ,R/TP ,PBFREE 4.7 nH,S ,1005 ,R/TP ,PBFREE 4.5x3.2x1.2 Bluetooth RF Module TSMT6 ,0.5 W,R/TP ,Vceo=-12V, Ic=-3A, hFE=270~680

Color

Remark

FL406

FILTER,EMI/POWER

SFEY0007103

FL407

FILTER,EMI/POWER

SFEY0007103

6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

FL408 J300 L102 L108 L111 L114 L115 L116 L119 L120 L121 L123 L125 L128 L300 L301 L302 L305 L400 L401 L402 L403 L404 L405 L406 L407 L408 L409 L410 L411 M100 Q300

FILTER,EMI/POWER CONN,SOCKET INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,SMD,POWER INDUCTOR,SMD,POWER INDUCTOR,CHIP INDUCTOR,SMD,POWER INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP INDUCTOR,CHIP MODULE,ETC TR,BJT,PNP

SFEY0007103 ENSY0019201 ELCH0005009 ELCH0001031 ELCH0004718 ELCH0003813 ELCH0001032 ELCH0001041 ELCH0003813 ELCH0003813 ELCH0005020 ELCH0005020 ELCH0001410 ELCH0005010 ELCP0008001 ELCP0008001 ELCH0001550 ELCP0008001 ELCH0003825 ELCH0005009 ELCH0005009 ELCH0001033 ELCH0005010 ELCH0005002 ELCH0005002 ELCH0005002 ELCH0001041 ELCH0001035 ELCH0001035 ELCH0001035 SMZY0012601 EQBP0009901

- 168 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. Q301 Q302 R100 R101 R103 R104 R105 R106 R107 R108 R109 R110 R111 R112 R113 R114 R115 R116 R117 R118 R119 R120 R121 R122 R123 R124 R128 R201 R202 R204 R205 R207 R208 R209 R211 R213

Description TR,FET,P-CHANNEL TR,BJT,PNP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER

Part Number EQFP0004701 EQBP0009901 ERHZ0000404 ERHZ0000404 ERHZ0000212 ERHZ0000310 ERHZ0003801 ERHZ0003801 ERHY0003301 ERHZ0000490 ERHZ0000402 ERHZ0000517 ERHZ0000517 ERHZ0000473 ERHY0003301 ERHY0003301 ERHY0003301 ERHY0003301 ERHY0003301 ERHZ0000401 ERHZ0000490 ERHZ0000483 ERHZ0000415 ERHZ0000415 ERHZ0000401 ERHY0003301 ERHZ0000406 ERHZ0000222 ERHZ0000469 ERHZ0000493 ERHZ0000493 ERHZ0000490 ERHZ0000493 ERHZ0000493 ERHZ0000401 ERHZ0000437

Spec TSOP6 ,1.5 W,20 V,-5 A,R/TP ,P-CHANNEL 20-V(D-S) MOSFET, Pb free TSMT6 ,0.5 W,R/TP ,Vceo=-12V, Ic=-3A, hFE=270~680 1 Kohm,1/16W ,J ,1005 ,R/TP 1 Kohm,1/16W ,J ,1005 ,R/TP 12 Kohm,1/16W ,F ,1005 ,R/TP 680 ohm,1/16W ,F ,1005 ,R/TP 5.1 ohm,1/16W ,J ,1005 ,R/TP 5.1 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP 91 ohm,1/16W ,J ,1005 ,R/TP 91 ohm,1/16W ,J ,1005 ,R/TP 39 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 47 ohm,1/16W ,J ,1005 ,R/TP 130 ohm,1/16W ,J ,1005 ,R/TP 130 ohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 150 Kohm,1/16W ,F ,1005 ,R/TP 36 ohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 2 Kohm,1/16W ,J ,1005 ,R/TP

Color

Remark

- 169 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. R214 R215 R300 R301 R302 R303 R304 R305 R306 R307 R308 R309 R313 R314 R315 R316 R317 R318 R380 R400 R401 R402 R403 R404 R405 R406 R407 R408 R409 R410 R421 R422 R424 R425 R426 R427 R428

Description RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER

Part Number ERHZ0000443 ERHZ0000443 ERHZ0000493 ERHZ0000406 ERHZ0000406 ERHZ0004201 ERHZ0000487 ERHZ0000405 ERHZ0000490 ERHZ0000493 ERHZ0000493 ERHZ0000443 ERHY0008602 ERHZ0000401 ERHZ0000406 ERHZ0000406 ERHZ0000422 ERHZ0000487 ERHZ0000406 ERHZ0000443 ERHZ0000530 ERHZ0000407 ERHZ0000493 ERHZ0000405 ERHZ0000406 ERHY0003301 ERHY0003301 ERHZ0000288 ERHZ0000537 ERHZ0000318 ERHZ0000402 ERHZ0000402 ERHZ0000443 ERHZ0000443 ERHZ0000438 ERHZ0000404 ERHZ0000499

Spec 2200 ohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 121000 ohm,1/16W ,F ,1005 ,R/TP 470 Kohm,1/16W ,J ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP 51 ohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 0.1 ohm,1/4W ,J ,2012 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 15 Kohm,1/16W ,J ,1005 ,R/TP 470 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 5.1 Kohm,1/16W ,J ,1005 ,R/TP 1000 Kohm,1/16W ,J ,1005 ,R/TP 51 Kohm,1/16W ,J ,1005 ,R/TP 10 Kohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 470 Kohm,1/16W ,F ,1005 ,R/TP 680000 ohm,1/16W ,F ,1005 ,R/TP 80.6 Kohm,1/16W ,F ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP 10 ohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 2200 ohm,1/16W ,J ,1005 ,R/TP 20 Kohm,1/16W ,J ,1005 ,R/TP 1 Kohm,1/16W ,J ,1005 ,R/TP 5600 ohm,1/16W ,J ,1005 ,R/TP

Color

Remark

- 170 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6

Location No. R429 R430 R431 R433 R434 R435 R436 R437 RA400

Description RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP RES,CHIP RES,CHIP,MAKER RES,CHIP,MAKER RES,CHIP,MAKER RES,ARRAY,R

Part Number ERHZ0000404 ERHZ0000499 ERHZ0000438 ERHY0013101 ERHY0013101 ERHZ0000487 ERHZ0000401 ERHZ0000435 ERNR0000404

Spec 1 Kohm,1/16W ,J ,1005 ,R/TP 5600 ohm,1/16W ,J ,1005 ,R/TP 20 Kohm,1/16W ,J ,1005 ,R/TP 2.7 ohm,1/16W ,J ,1005 ,R/TP 2.7 ohm,1/16W ,J ,1005 ,R/TP 470 Kohm,1/16W ,J ,1005 ,R/TP 0 ohm,1/16W ,J ,1005 ,R/TP 20 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,100 Kohm,8 PIN,J ,1/16W ,SMD ,R/TP 8 PIN,ETC ,PUSH-PUSH TYPE / RECTANGULAR ,1.1 mm,TRANS FLASH SOCKET / EXTERNAL MEMORY CARD SOCKET ,SMD ,0.4 dB, UMT5 ,.2 W,R/TP , QFN ,56 PIN,R/TP ,GSM, WCDMA Single RF Transceiver, 8X8X0.9 QFN ,56 PIN,R/TP ,chartered,GSM, WCDMA Single RF Transceiver, 8X8X0.9 ,; ,IC,Tx/Rx 35.5 dBm,56 %, A, dBc, dB,6x6x1.15 ,SMD ,Tri Band -18 dB,-.25 dB,-33 dB,1.0*0.58*0.35 ,SMD ,1920M ~ 1980M, 4pin, Pb Free , ,[empty] , , ,SMD ,R/TP 28 dBm,40 %,465 mA,-44 dBc,26.5 dB,4x4x1.1 ,SMD , SSOP5-P-0.65A ,5 PIN,R/TP ,INVERTER, Pb Free CSP ,409 PIN,R/TP ,WEDGE Baseband Platform BCCS ,84 PIN,R/TP ,7x7, MSMC(1.2V), pbfree FBGA ,137 PIN,ETC ,512M(64Mx8) NAND+512M(16Mx32) SDRAM , ,IC,MCP SON1612-6 ,6 PIN,R/TP ,2.8V, 150mA LDO WDFN-8L ,8 PIN,R/TP ,300mA/300mA 2.8V/1.8V Dual LDO TSOPJW-12 ,12 PIN,R/TP ,3PORT Charge Pump(AAT2154 Low cost version) SC70 ,5 PIN,R/TP ,Comparator, pin compatible to EUSY0077701 WQFN ,10 PIN,R/TP ,Small package Dual SPDT analog Switch, PB-Free MICRO8 ,8 PIN,R/TP ,1W AUDIO AMPLIFIER 900.1800 ,1900.2100 , dB, dB, dB, dB,ETC ,1800GSM Quad, WCDMA2100 FEM, 5.4X4.0X1.2, Improved D5006 HVSOF5 ,5 PIN,R/TP ,150mA CMOS LDO WITH OUTPUT CONTROL / 1.5V 18 V, ,SMD ,3pF, 1005 14 V, ,SMD ,120pF, 1005

Color

Remark

S300

CONN,SOCKET

ENSY0013501

6 6 6

SW100 TR100 U100

CONN,RF SWITCH TR,BJT,ARRAY IC

ENWY0003301 EQBA0000601 EUSY0300501

IC 6 6 6 6 6 6 6 6 6 U101 U102 U103 U104 U201 U300 U301 U302 U303 PAM COUPLER,RF DIRECTIONAL PAM IC IC IC IC IC IC

EUSY0300502 SMPY0014001 SCDY0003403 SMPY0014201 EUSY0073401 EUSY0318401 EUSY0306302 EUSY0332001 EUSY0232812 EUSY0319001

U305

IC

EUSY0238702

U400

IC

EUSY0250501

6 6 6

U401 U402 U500

IC IC FILTER,SEPERATOR

EUSY0300101 EUSY0176401 SFAY0007402

6 6 6

U501 VA300 VA301

IC VARISTOR VARISTOR

EUSY0223001 SEVY0004001 SEVY0004201

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11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6 6

Location No. VA302 VA303 VA304 VA305 VA306 VA400 VA401 VA402 VA403 VA404 VA405 VA407 VA408 VA409 VA410 VA412 VA414 VA430 VA490 X100

Description VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VARISTOR VCTCXO

Part Number SEVY0004001 SEVY0004001 SEVY0004001 SEVY0004001 SEVY0004001 SEVY0004001 SEVY0004001 SEVY0004201 SEVY0004201 SEVY0004201 SEVY0004201 SEVY0004201 SEVY0004201 SEVY0004201 SEVY0004201 SEVY0004201 SEVY0004201 SEVY0004201 SEVY0004201 EXSK0005703 18 V, ,SMD ,3pF, 1005 18 V, ,SMD ,3pF, 1005 18 V, ,SMD ,3pF, 1005 18 V, ,SMD ,3pF, 1005 18 V, ,SMD ,3pF, 1005 18 V, ,SMD ,3pF, 1005 18 V, ,SMD ,3pF, 1005 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,120pF, 1005 14 V, ,SMD ,120pF, 1005

Spec

Color

Remark

19.2 MHz,1.5 PPM,40 pF,SMD ,3.2*2.5*0.9 , ,; , ,1.5PPM ,2.8V ,3.2 ,2.5 ,0.9 , ,SMD ,P/TP .032768 MHz,20 PPM,7 pF,65000 ohm,SMD ,6.9*1.4*1.3 ,

6 5 6 6 6 6 6 6 6 6 6 6 6 6 6 6

X300 SAFD00 CN404 LD400 LD402 LD403 LD404 LD405 LD406 LD407 LD408 R411 R413 R414 R415 R416

X-TAL PCB ASSY,MAIN,SMT TOP CONN,SOCKET DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP DIODE,LED,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP RES,CHIP

EXXY0004601 SAFD0087801 ENSY0020001 EDLH0006001 EDLH0006001 EDLH0006001 EDLH0006001 EDLH0006001 EDLH0006001 EDLH0006001 EDLH0006001 ERHY0003301 ERHY0003301 ERHY0003301 ERHY0003301 ERHY0003301

Blue ,1608 ,R/TP ,Blue SMD LED Blue ,1608 ,R/TP ,Blue SMD LED Blue ,1608 ,R/TP ,Blue SMD LED Blue ,1608 ,R/TP ,Blue SMD LED Blue ,1608 ,R/TP ,Blue SMD LED Blue ,1608 ,R/TP ,Blue SMD LED Blue ,1608 ,R/TP ,Blue SMD LED Blue ,1608 ,R/TP ,Blue SMD LED 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP

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11. EXPLODED VIEW & REPLACEMENT PART LIST

Level 6 6 6 6 6

Location No. R417 R418 R419 R423 SPFY00

Description RES,CHIP RES,CHIP RES,CHIP RES,CHIP,MAKER PCB,MAIN

Part Number ERHY0003301 ERHY0003301 ERHY0003301 ERHZ0000406 SPFY0147601

Spec 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 ohm,1/16W ,J ,1005 ,R/TP 100 Kohm,1/16W ,J ,1005 ,R/TP FR-4 ,1.0 mm,BUILD-UP 8 ,

Color

Remark

- 173 -

11. EXPLODED VIEW & REPLACEMENT PART LIST

11.3 Accessory

Note: This Chapter is used for reference, Part order is ordered by SBOM standard on GCSC

Level

Location No. SBPL00

Description

Part Number

Spec 3.7 V,950 mAh,1 CELL,PRISMATIC ,KU250 Europe BATT, IP, Pb-Free ,; ,3.7 ,950 ,0.2C ,PRISMATIC ,50x34x55 , ,BLACK ,Innerpack ,Europe Label 100-240V ,5060 Hz,5.1 V,.7 A,CE ,AC-DC ADAPTOR ,; ,85Vac~264Vac ,5.1V +0.15V, -0.2V ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR , 100-240V ,5060 Hz,5.1 V,0.7 A,CE ,AC-DC ADAPTOR ,; ,5.1V +0.15V, -0.2V ,5.1V ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR , 100-240V ,5060 Hz,5.2 V,0.7 A,CE ,AC-DC ADAPTOR ,; ,85Vac~264Vac ,5.20.3V ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR , 100-240V ,5060 Hz,5.1 V,.7 A,CE ,AC-DC ADAPTOR ,; ,85Vac~264Vac ,5.1V(+0.15V, -0.2V) ,700mA ,5060 , ,WALL 2P ,I/O CONNECTOR ,

Color

Remark

BATTERY PACK,LI-ION

SBPL0090501

Black

35

SSAD00

ADAPTOR,AC-DC

SSAD0024501

ADAPTOR,AC-DC

SSAD0024502

ADAPTOR,AC-DC

SSAD0024503

ADAPTOR,AC-DC

SSAD0024504

- 174 -

Note

Note