Xavier Institute of Engineering

Mahim Causeway, Opp.Raheja Hospital, Mahim (West), Mumbai 400016

MUMBAI UNIVERSITY, MAHIM, MUMBAI 2011-2012

ECONOMICAL PUMP CONTROLLER Risburt Fernandes (15)

Department of Electronics & Telecommunication, Mumbai University Mumbai, Maharashtra, India.

Under the Guidance of Prof. Smitha Powar

CERTIFICATE

This is to certify that the following student RISBURT FERNANDES (15)

Completed the project entitled as

ECONOMICAL PUMP CONTROLLER

A partial fulfilment of the requirement of Third Year Degree in EXTC Engineering afflicted to Maharashtra State Board of Technical Education, Mumbai for the academic year 2011-2012

Internal Examiner

External Examiner

Smitha Powar (Guide)

Dr.Y.D.Venkatesh

Prof. Nithin Ahire (Head of Department)

ECONOMICAL PUMP CONTROLLER

Risburt Fernandes Electronics and Telecommunication risburtfernandes@hotmail.co.in Xavier Institute of Engineering Mahim, Mumbai

Abstractthis document presents the construction of an economical pump controller which makes uses of logic processing through the use of the digital IC CD4001. This circuit makes use of only one IC for getting the desired logic to control the pump. Using the concept of latches of SR flip flop this circuit stores one bit data when water level reaches certain extreme levels or mid level in the tanks. For specific logic levels of the input the pump starts and stops. This circuit uses the basic NOR gate digital IC. The probes are placed at appropriate levels in the tank and the reservoir. Appropriate logic drives the transistor which energises the relay connected. This starts the pump for certain logic whereas it switches off the pump for certain logic. Keywordsflip flop, Relay 1. INTRODUCTION This document presents the construction, operation, and the testing of an economical pump controller. This pump controller prevents the manual switching (ON and OFF) of the water pump. Using simple devices such as Zener Diode, Relay and NOR gate IC power supply to the pump is regulated. The pump used here is a simple 12 volt water pump for low power application. Logic processing takes place through use of only a single IC. Thus this circuit is not only simple but also economical. Also its power consumption level is very small thus allowing its large scale application. This document contains the circuit operation, testing results, and the observations that were made during the experiment. 2. GENERAL DESCRIPTION This is a standard circuit which can be used to control a pump he automatic pump controller eliminates the need for any manual switching of pumps installed for the purpose of pumping water from a reservoir to an overhead tank. It automatically switches on the pump when the water level in the tank falls below a certain low level (say L), provided the water level in the reservoir is above a certain level (say R). Subsequently, as the water level in the tank

rises to an upper level (say M), the pump is switched off automatically. The pump is turned on again only when the water level again falls below level L in the tank, provided the level in the reservoir is above R. This automated action continues. Caution: This circuit is associated with pumping of water hence precaution should be taken to see that it does not get wet as it will lead to fault in the equipment and cause the circuit to malfunction. To prevent this the circuit must be enclosed in a air tight box and kept far away from any water. EAGLE version 5.11 was used to design the schematic and the board. Tracks were created from the schematic using the auto function.

ASSEMBLY INSTRUCTIONS

It is generally best to add the lowest height components to the board first; the resistors. Next we should place the capacitors on the board. The pin configuration of the IC should be properly referred to before making the connection. Also care should be taken to see that the transistor and the diode are placed properly on the board. Care should be taken while connecting the relay on the board as the following circuit requires it to be in the normally open configuration. The diode should be placed in the right manner on the PCB. This is decided by a silver circle around one end of the diode indicating that the end is the cathode.

3. CIRCUIT DESCRIPTION

This is a standard textbook circuit. Circuit is arranged as shown in the circuit diagram shown below: The circuit is designed to overlook the transient oscillations of the water level which would otherwise cause the logic to change its state rapidly and unnecessarily. The circuit uses a single CMOS chip (CD4001) for logic processing. IC CD4001 is a chip of NOR gates. No use of any moving electromechanical parts in the water-level sensor has been made. The circuit operates as follows. A standard 12 volt power supply is used for the operation of the circuit. This 12 volt supply is needed to power up the water pump. The same 12 volt supply is given to the IC CD4001 for logic processing. However this high voltage can cause the IC to burn out. For this purpose a standard 9.1 volt zener diode is connected. This zener diode not only provides a 9.1 volt voltage level for the nor gates but also allows a constant non varying voltage level to be maintained throughout.

Zener diodes are widely used as voltage references and as shunt regulators to regulate the voltage across small circuits. When connected in parallel with a variable voltage source so that it is reverse biased, a Zener diode conducts when the voltage reaches the diode's reverse breakdown voltage. From that point on, the relatively low impedance of the diode keeps the voltage across the diode at that value.

Thus the zener diode facilitates the working of the IC CD4001. Also due to its ability to maintain a constant voltage level it prevents sharp surges in the current and voltage levels from affecting the digital IC Logic Processing takes place as follows. Inputs to the IC CD4001s NOR gates are taken from the reservoir and the overhead tank. We consider the following logic for starting and for stopping the water pump. As seen from the figure below we consider 3 logical level inputs. Level M, Level L and Level R.

4. PCB DESIGNING

Cleaning In order to proceed with others process you must clean your PCB. Dirt obstacles your work, hence, it is an absolute necessity to ensure that PCB are free from grease, oxidation and other contamination. Do not clean your board until you are ready to drill or to make other process because resist protects the board from oxidation.

Use acetone or alcohol to remove resist. Clean copper board with steel wool, S.O.S. or Brillo pads under running water. Rinse cleaned board with soap and water. Be sure to remove all soap residue. Dry thoroughly with lint-free cloth. Be sure to scrape any burrs that appear on the edge of the board that may have resulted from the cutting/shearing process.

PCB will generally oxidise after a few months, especially if it has been fingerprinted, and the copper strips can be cleaned using an abrasive rubber block, like an aggressive eraser, to reveal fresh shiny copper underneath. Also available is a fibre-glass filament brush, which is used propelling-pencil-like to remove any surface contamination. These tend to produce tiny particles which are highly irritating to skin, so avoid accidental contact with any debris. Afterwards, a wipe with a rag soaked in cleaning solvent will remove most grease marks and fingerprints. After preparing the surfaces, avoid touching the parts afterwards if at all possible.

Patterning (etching) The vast majority of printed circuit boards are made by bonding a layer of copper over the entire substrate, sometimes on both sides, (creating a blank PCB) then removing unwanted copper after applying a temporary mask (eg. By etching), leaving only the desired copper traces. A few PCBs are made by adding traces to be bare substrate (or a substrate with a very thin layer of copper) usually by a complex process of multiple electroplating steps. There are three common subtractive methods (methods that remove copper) used for the production of printed circuit boards : 1. Silk screen printing uses etch-resistant inks to protect the copper foil. Subsequent etching removes the unwanted copper. Alternatively, the ink may be conductive, printed on a blank (non-conductive) board. The latter technique is also used in the manufacture of hybrid circuits. 2. Photoengraving uses a photo mask and chemical etching to remove the copper foil from the substrate. The photo mask is usually prepared with a

photo plotter from data produced by a technician using CAM, or computeraided manufacturing software. Laser-printed transparencies are typically employed for phototools; however, direct laser imaging techniques are being employed to replace phototools for high-resolution requirements. 3. PCB milling uses a two or three-axis mechanical milling system to mill away the copper foil from the substrate. A PCB milling machine (referred to as a PCB Prototype) operates in a similar way to a plotter, receiving commands from the host software that control the position of the milling heard in the x, y and (if relevant) z axis. Data to drive the Prototype is extracted from files generated in PCB design software and stored in HPGL or Gerber file format. Additive processes also exist. The most common is the semi-additive process. In this version, the un-patterned board has a thin layer of copper already on it. A reverse mask is then applied. (Unlike a subtractive process mask, this mask exposes those parts of the substrate that will eventually become the traces.) Additional copper is then plated onto the board in the unmasked areas; copper may be plated to any desired weight. The mask is stripped away and a brief etching step removes the now-exposed original copper laminate from the board, isolating the individual traces. The additive process is commonly used for multi-layer boards as it facilitates the plating-through of the holes (to produce conductive vias) in the circuit board. 4. Photo Resistive method for Etching The photo resist board needs to be exposed to ultra-violet light through the artwork, using a UV exposure box. UV exposure units can easily be made using standard fluorescent lamp ballasts and UV tubes. For small PCBs, two or four 8 watt 12" tubes will be adequate, for larger (A3) units, four 15" 15 watt tubes are ideal. To determine the tube to glass spacing, place a sheet of tracing paper on the glass and adjust the distance to get the most even light level over the surface of the paper. Even illumination is a lot easier to obtain with 4-tube units. The UV tubes you need are those sold either as replacements for UV exposure units, insect killers or 'black light' tubes for disco lighting etc. They look white or occasionally black/blue when off, and light up with a light purple, which makes flourescent paper etc. glow brightly. DO NOT use short-

wave UV lamps like EPROM eraser tubes or germicidal lamps, which have clear glass - these emit short-wave UV which can cause eye and skin damage. A timer which switches off the UV lamps automatically is essential, and should allow exposure times from 2 to 10 minutes in 15-30 second increments. It is useful if the timer has an audible indication when the timing period has completed. A timer from a scrap microwave oven would be ideal. Short-term eye exposure to the correct type of UV lamp is not harmful, but can cause discomfort, especially with bigger units. Use glass sheet rather than plastic for the top of the UV unit, as it will flex less and be less prone to scratches. If you do a lot of double-sided PCBs, it may be worth making a double-sided exposure unit, where the PCB can be sandwiched between two light sources to expose both sides simultaneously. You will need to experiment to find the required exposure time for a particular UV unit and laminate type, expose a test piece in 30 second increments from 2 to 8 minutes, develop and use the time which gave the best image. Generally speaking, overexposure is better than underexposure. For a single-sided PCB, place the artwork with toner side up on the UV box glass, peel off the protective film from the laminate and place it sensitive side down on top of the artwork. The laminate must be pressed firmly down to ensure good contact all over the artwork, and this can be done either by placing weights on the back of the laminate, or by fitting the UV box with a hinged lid lined with foam rubber, which can be used to clamp the PCB and artwork. To expose double-sided PCBs, print the solder side artwork as normal, and the component side mirrored. Place the two sheets together with the toner sides facing, and carefully line them up, checking all over the board area for correct alignment, using the holes in the pads as a guide. A light box is very handy here, but it can be done with daylight by holding the sheets on the surface of a window. If printing errors have caused slight mis-registration, align the sheets to 'avarage' the error across the whole PCB, to avoid breaking tracks when drilling. When they are correctly aligned, staple the sheets together on two opposite sides (3 sides for big PCBs), about 10mm from the edge of the board, forming a sleeve or envelope. The gap between the board edge and staples is important to stop the paper distorting at the edge. Use the smallest stapler you can find, so the thickness of the staple is not much more than that of the PCB. If you do not have a double-sided exposure unit,

expose each side in turn, covering up the top side with a reasonably light-proof soft cover when exposing the underside (rubber mouse mats are ideal for this). Be very careful when turning the board over, to avoid the laminate slipping inside the artwork envelope and ruining the alignment. After exposure, you can usually see a feint image of the pattern in the photosensitive layer. After exposure you have to remove the sensitized photoresist in order to unprotect the copper to remove. This can be done using developer solutions like sodium hydroxide or a silica based product. This process is called developing. Lamination Some PCBs have trace layers inside the PCB and are called multi-layer PCBs. These are formed by bonding together separately etched thin boards. Drilling Holes through a PCB are typically drilled with tiny drill bits made of solid tungsten carbide. The drilling is performed by automated drilling machines with placement controlled by a drill tape or drill file. These computer-generated files are also called numerically controlled drill (NCD) files or Excellon files. The file describes the location and size of each drilled hole. These holes are often filled with annular rings to create vias. Vias allow the electrical and thermal connection of conductors on opposite sides of the PCB . When very small vias are required, drilling with mechanical bits is costly because of high rates of wear and breakage. In this case, the vias may be evaporated by lasers. Laser-drilled vias typically have an inferior surface finish inside the hole. These holes are called micro vias. It is also possible with controlled-depth drilling, laser drilling, or by pre-drilling the individual sheets of the PCB before lamination, to produce holes that connect only some of the copper layers, rather than passing through the entire board. These holes are called blind vias when they connect an internal copper layer to an outer layer, or

buried vias when they connect two or more internal copper layers and no outer layers. The walls of the holes, for boards with 2 or more layers, are plated with copper to form plated-through holes that electrically connect the conducting layers of the PCB. For multilayer boards, those with 4 layers or more, drilling typically produces a smear comprised of the bonding agent in the laminate system. Before the holes can be plated through, this smear must be removed by a chemical de-smear or by plasma-etch. Exposed conductor plating and coating The places to which components will be mounted are typically plated, because bare copper oxidizes quickly, and therefore is not readily solder able. Traditionally, any exposed copper was plated with solder by hot air solder levelling (HASL). This solder was a tin-lead alloy, however new solder compounds are now used to achieve compliance with the RoHS directive in the EU, which restricts the use of lead. One of these lead-free compounds is SN 100CL, made up of 99.3% tin, 0.7% copper, 0.05% nickel, and a nominal of 60 ppm germanium. Other platings used are OSP (organic surface protectant), immersion silver (IAg), immersion tin, electro less nickel with immersion gold plating (ENIG), and direct gold. Edge connectors, placed along one edge of some boards, are often gold plated. Electrochemical migration (ECM) is the growth of conductive metal filaments on or in a printed circuit board (PCB) under the influence of DC voltage bias . Solder resist Aras that should not be soldered to may be covered with a polymer solder resist (solder mask) coating. The solder resist prevents solder from bridging between conductors and thereby creating short circuits. Solder resist also provides some protection from the environment. Solder resist is typically 20-30 microns thick.

Screen printing Line art and text may be printed onto the outer surfaces of a PCB by screen printing. When space permits, the screen print text can indicate component designators, switch setting requirements, test points, and other features helpful in assembling, testing, and servicing the circuit board. Screen print is also known as the silk screen, or, in one sided PCBs, the red print. Lately some digital printing solutions have been developed to substitute the traditional screen printing process. This technology allows printing variable data onto the PCB, including serialization and barcode information for traceability purposes. Also some manufacturers tend to coat their boards in a thin layer of micro-film used to keep electricity from escaping the conductivity of the wire-strips. Test Unpopulated boards may be subjected to a bare-board test where each circuit connection (as defined in a net list) is verified as correct on the finished board. For high-volume production, a Bed of nails tester, a fixture or a Rigid needle adapter is used to make contact with copper lands or holes on one or both sides of the board to facilitate testing. A computer will instruct the electrical test unit to apply a small voltage to each contact point on the bed-of-nails as required, and verify that such voltage appears at other appropriate contact points. A short on a board would be a connection where there should not be one; an open is between two points that should be connected but are not. For small or medium-volume boards, flying-probe and flying-grid testers use moving test heads to make contact with the copper/silver/gold/solder lands or holes to verify the electrical connectivity of the board under test. Printed circuit assembly After the printed circuit board (PCB) is completed, electronic components must be attached to form a functional printed circuit assembly, or PCA (sometimes called a

printed circuit board assembly PCBA). In through-hole construction, component leads are inserted in holes. In surface-mount construction, the components are placed on pads or lands on the outer surfaces of the PCB. In both kinds of construction, component leads are electrically and mechanically fixed to the board with a molten metal solder. There are a variety of soldering techniques used to attach components to a PCB. High volume production is usually done with machine placement and bulk wave soldering or reflow ovens, but skilled technicians are able to solder very tiny parts (for instance 0201 packages which are 0.02 by 0.01) by hand under a microscope, using tweezers and a fine tip soldering iron for small volume prototypes. Some parts are impossible to solder by hand, such a ball grid array (BGA) packages. Often, through-hole and surface mount construction must be combined in a single PCA because some required components are available only in surface-mount packages, while others are available only in through-hole packages. Another reason to use both methods is that through-hole mounting can provide needed strength for components likely to endure physical stress, while components that are expected to go untouched will take up less space using surface-mount techniques. After the board has been populated it may be tested in a variety of ways : While the power is off, visual inspection, automated optical inspection. JEDEC guidelines for PCB component placement, soldering, and inspection are commonly used to maintain quality control in this stage of PCB manufacturing. While the power is off, analog signature analysis, power-off testing. While the power is on, functional test, just checking if the PCB does what it had been designed for. To facilitate these tests, PCBs may be designed with extra pads to make temporary connections. Sometimes these pads must be isolated with resistors. The in-circuit test may also exercise boundary scan test features of some components. In-circuit test systems may also be used to program non-volatile memory components on the board.

In boundary scan testing, test circuits integrated into various ICs on the board form temporary connections between the PCB traces to test that the ICs are mounted correctly. Boundary scan testing requires that all the ICs to be tested use a standard test configuration procedure, the most common one being the Joint Test Action Group (JTAG) standard. When the boards fail the test, technicians may desolder and replace failed components, a task known as rework.

Protection and packaging PCBs intended for extreme environments often have a conformal coating, which is applied by dipping or spraying after the components have been soldered. The coat prevents corrosion and leakage currents or shorting due to condensation. The earliest conformal coats were wax; modern conformal coats are usually dips of dilute solutions of silicone rubber, polyurethane, acrylic, or epoxy. Another technique for applying a conformal coating is for plastic to be sputtered onto the PCB in a vacuum chamber. The chief disadvantage of conformal coatings is that servicing of the board is rendered extremely difficult. Many assembled PCBs are static sensitive, and therefore must be placed in antistatic bags during transport. When handling these boards, the user must be grounded (earthed). Improper handling techniques might transmit an accumulated static charge through the board, damaging or destroying components. Even bare boards are sometimes static sensitive. Traces have become so fine that it's quite possible to blow an etch off the board (or change its characteristics) with a static charge. This is especially true on non-traditional PCBs such as MCMs and microwave PCBs. 5. APPLICATION Water tanks in Buildings and factories 6. CONCLUSION Hence we have designed a very compact and efficient design of a magnetic proximity switch. Through the design of this circuit we have also learnt about an important component such as the reed switch, its functioning, and its applications. ACKNOWLEDGEMENT

Any attempt at any level cannot be satisfactorily completed without the support of learned people. We would like to express our humble Gratitude towards our teachers Mrs. Smita Pawar, Mrs. Leena Patil, Mr. Adesh and lab Asst. Stevenson Kshirsagar, Rajendra , and Stallon for their constant support and guidance to come up with our project. We would also thank our family and friends for their motivation REFERENCES a. http://www.electro-tech-online.com b. http://en.wikipedia.org c. http://www.scienceprog.com d. http://www.electronicsforu.com e. http://www.google.co.in/