MEMS: Microelectromechanical Systems

A. D. Yarbrough, PhD
Engineering & Technology Group The Aerospace Corporation El Segundo, CA 20 March, 2001
Sponsored by IEEE Distinguished Lecturer Series & The Aerospace Corporation New Technology Overview Series

Outline
Introduction and Context MMIC and MEMS Synergy
Heritage & Definitions Processing

Structures Motivated by Space Applications Advantages and Disadvantages Summary & Conclusion References, Resources & Acknowledgments

Introduction
MEMS (MicroElectroMechanical Systems): miniature devices with elements achieved by 2and 3-dimensional silicon micromachining Identify MEMS applications relevant to satellite and mobile communication systems
Highly integrated circuits leveraging
RFIC/MMIC (RF and monolithic microwave integrated circuit) technology Mature semiconductor industry fabrication techniques developed over 30+ years

Innovative packaging Greater emphasis on reliability

Characterization of MEMS materials properties and testing
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Motivation
Leverage and combine technology strengths to synthesize high-performance, compact, cost-effective subsystems Apply MEMS technologies to achieve higher levels of integration in millimeterwave communications components miniaturization AND integration of electronic and mechanical components on same chip
leads to reduced subsystem volume, weight and cost

increase performance per mm2 of wafer surface area Develop semiconductor processes and capabilities to enable fabrication of novel MEMS structures Leverage in-house capabilities to advance the state of the art in MEMS for space applications
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The Nanosatellite Concept

From work of S. W. Janson, H. Helvajian & E. Y. Robinson, The Aerospace Corporation 5

Aerospace/DARPA MEMS PicoSat Mission

On-board MEMS switch experiments PicoSat1 Two communicating on-orbit space stations 100-ft tether Comm link between PicoSats PicoSat2 Comm link between each PicoSat & ground station
150-ft diameter Tracking Earth Station Antenna SRI, International, Palo Alto, CA
NOTES: 1. Drawing Not to Scale 2. Three-week space station battery life 3. Space stations referred to as PicoSats 4. 902-928 MHz, 100mW max transmit power

PicoSats eject from OPAL

OPAL (Orbiting PicoSat Automated Launcher)

750 km Altitude

PicoSat3

Data Acquisition & Control PC

PICOSAT Goals and Applications

PICOSAT as a Space Test Vehicle
MEMS and microsystems space technology Testing, development, demonstration, insertion

PICOSAT as part of operational architecture

MEPSI (MEMS based PICOSAT Inspector) Communications networks Remote sensing networks Cooperative constellations and phased arrays On orbit robotics developments
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Merits of PICOSATs and Nanosats

Benefits
Lower cost
Reduced fabrication and testing costs Reduced integration and launch costs

Rapid development and adaptation to payloads Easily accommodated (ride-along) on any host vehicle Frequent flights (target 2 - 3 flights per year or more)

Current Limitations
Power, downlink (trade power for large ground antenna)
Power source, data transfer rates
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First PicoSat Flight

Jan 26, 2000 OSP1/Minotaur launch from VAFB
Two Minuteman stages, two Pegasus stages (first flight)

JAWSAT
Successful deployment of OPAL, ASUSat1, FalconSAT

Feb 6 deployment of PICOSATs from OPAL

Two tethered PICOSATs: 1 x 3 x 4 in., 270 gms each Followed by STENSAT, Artemis PICOSAT deployments

PICOSAT three-day mission (Feb 6-9)

Successful tracking and acquisition strategy Successful two-way command and communications MEMS switch operation data returned to Earth
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OSP (Orbital SubOrbital Program)/ Minotaur* Launch Vehicle

JAWSAT Orion 38

Orion 50XL
MM SS SR19 MM FS M56A

*Modified Minute Man Missile

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PicoSat Mission Photos

PicoSats

PicoSats under test in anechoic chamber at Aerospace Corporation

OPAL: Orbiting PicoSat Automated Launcher under test at Stanford Universitys Space Systems Development Laboratory

PicoSats being loaded into OPAL

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PicoSat Mission Photos

PicoSat ground station: SRI (Palo Alto) 50-m diameter dish

Ground PicoSat mounted on antenna feed

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MEMS/MMIC Synergy
Silicon micromachining has emerged as an extension of IC fabrication technology 30+ years of experience and process technology to build upon Recipes highly consistent with capabilities of techniques and equipment present in a modest IC/MMIC fab facility Responds to need to integrate varied circuit topologies or interface miniaturized mechanical components with electronics

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Definitions and Terminology

MEMS (MicroElectroMechanical Systems): miniature devices with elements achieved by 2- and 3-dimensional silicon micromachining Bulk micromachining: use of wet & dry etching techniques, etch masks and etch stops to sculpt microelectromechanical devices from silicon substrate

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 Sacrificial layer: spacer layer in which structural parts of device are encased; subsequently dissolved away; used to produce released* or freestanding structures Surface micromachining: use of successive deposition and patterning of structural and sacrificial materials on a substrate to fabricate microelectromechanical components (no substrate etching)
*released: structures suspended over a substrate by etching away the intermediate supporting layer on which they rest
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 Anisotropic etch : preferential etching of single crystal silicon along specific crystal planes ODE (orientation dependent etch): same as anisotropic etch LIGA (LIthografie, Galvanik, Abformung): process by which high aspect ratio plating molds are fabricated
German words for lithography, electroforming, injection molding
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Major IC and MEMS Fabrication Steps

Wafer Masks Film Deposition Lithography
bulk etching surface micromachining release processing

Doping

alter conductivity etch stop

Etching

Dicing & Packaging

Testing

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Foundry Services
Available for shared, low-cost micromachining projects
MUMPS = Multi-User MEMS Process (Cronos) MOSIS = Metal Oxide Silicon Implementation Service (Information Sciences Institute-USC) Sandia National Laboratories SUMMiT Process Advanced Micro Devices

Aerospace resources
Extensive diagnostic tools Center for Microtechnology
Silicon Etcher laser processing
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Sample applications for satellite and mobile communication systems: Device & Process Development

Millimeterwave antenna array concept

Array to be combined with feed line structure as part of an integrated receiver on a chip front end concept
Combine MEMS and MMIC technologies
Integrated feed network Mixer LNA Antennas BPF RF LO BPF BPF IF Embedded Interconnects

Embedded Interconnects

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Aerospace Corporation Patent: MICROMACHINED REFLECTOR ANTENNA SYSTEM AND METHOD U.S. 6,008,776 (December 28, 1999) & U.S. 6,045,712 (April 4, 2000)

Begin development of constituent elements for integrated receiver front end

Form antenna reflector surface in thick oxide or SOG (spin on glass) film Metallize surface Form deployed, hinged beam for antenna feed and support

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Aerospace Corporation Patent: MICROMACHINED ROTATING INTEGRATED SWITCH U.S. 6,072,686 (June 6, 2000)

Eventual component for integrated receiver front end

Electrostatically-driven, micromachined switch mechanism combined with filter When actuated, one arm of rotating switch contacts input feed for one of two nearby filter structures

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Aerospace Corporation Patent : METHOD OF HF VAPOR RELEASE OF MICROSTRUCTURES* Notice of Allowance January 23, 2001

Build capabilities for the design, fabrication and testing of MEMS structures
Explore bulk & surface silicon micromachining techniques * Develop release processes not vulnerable to stiction Characterize process for deposition of thick films Establish repeatability of wafer bonding process

Explore stress, strain and fatigue mechanisms of films and materials used in MEMS structures
Polysilicon Oxide Substrate

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Sample Aerospace MEMS Structures

Suspended polysilicon bridge test structure ~20 m l x 2.5 m w x 1500 A t Confirms complete removal of sacrificial oxide layer

Released polysilicon cantilever beams ~40 m l x 2 m w x 1500 A t No stiction Anchors (supports) visible
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Sample Aerospace MEMS Structures

Irregularly shaped released beams ~1500 A thick Simulates meandering transmission lines and circuit interconnects

Close-up view of released beams Smooth sidewalls and completely clean substrate below

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Sample Aerospace MEMS Structures

Silicon Micromotor

Lateral resonant microactuator

Vibrometer

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 Material is abundant, inexpensive, now can be produced and processed controllably to unparalleled standards of purity and perfection Silicon processing based on thin deposited films and shapes highly amenable to miniaturization Circuits are batch fabricated, making them viable from a practical and commercial point of view Feature sizes readily achievable with modest processing capabilities Expanded data gathering and sensing Reduced weight and volume
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Advantages of MEMS Si Processing

Disadvantages of MEMS Si Processing

IC processing considerations restrict design geometries in direction normal to wafer surface Understanding film mechanical properties Component reliability Compatibility of surface and bulk micromachining processes, which differ significantly Translate achievements in Silicon to Gallium Arsenide environment No widely accepted space qualification plan New paradigm; need to overcome perception as risky technology
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Aerospace Future Plans

Develop capability for metal deposition on vertical-walled structures (planetary evaporation) Enhance techniques for reliable deposition of films thicker than 1 mm and processing thick wafers Produce electrostatically-driven cantilever beams
switches, millimeterwave component structures

Evaluate strengths and areas of application for LIGA (LIthografie, Galvanik, Abformung) process by which high aspect ratio plating molds are fabricated Use MEMS to add capability to existing systems Combine MEMS and MMIC technologies Demonstrate components for receiver-on-a- chip Characterize film properties: stress, strain & fatigue mechanisms Develop novel MEMS for new space communications concepts

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Technology challenges
IC processing considerations restrict design geometries in direction normal to wafer surface Issues of pattern definition and mechanical properties Compatibility of materials for processing Surface and bulk micromachining processing significantly differ Wafer bonding and handling Resistance to new technology and paradigm
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 For many electromechanical systems, miniaturization is neither practical, nor desirable Nonetheless, micromechanical structures for novel millimeterwave components, sensing and actuation can often improve the overall performance of the macroscopic system Be prepared to evaluate and support its integration into customers space systems at the appropriate time Need for compact, highly-capable, cost-effective subsystems for mobile and satellite communications can be met by the fusion of MEMS and microwave integrated circuit technologies Novel millimeterwave concepts emerging include:
integrated receivers micromachined antenna arrays and switches embedded interconnects and waveguides
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Conclusions

References, Resources &Acknowledgements

Electronic Systems Division, Microelectronics Technology Department, Center for Microtechnology, The Aerospace Corporation National Nanofabrication Facility, Cornell University Berkeley Sensor and Actuation Center, UC-Berkeley Jet Propulsion Laboratory and Cal Tech Case Western Reserve University Center for Integrated Sensors and Circuits, University of Michigan Sandia National Laboratory Microelectronics Center of North Carolina (MCNC)-Cronos Air Force Research Lab Rockwell Science Center Stanford University SMC/TE Space Test Program Space Command Space Surveillance Network (SSN)

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