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L7-1
Chapter Overview
The capabilities described in this section are generally applicable to ANSYS DesignSpace licenses and above, except for an ANSYS Structural license.
Note: advanced topics including thermal transient analyses are covered in the ANSYS Thermal Analysis training course.
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For a steady-state (static) thermal analysis in Mechanical, the temperatures {T} are solved for in the matrix below:
[K (T )]{T } = {Q(T )}
Assumptions:
No transient effects are considered in a steady-state analysis [K] can be constant or a function of temperature {Q} can be constant or a function of temperature
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A. Geometry
In thermal analyses all body types are supported:
Solid, surface, and line bodies.
Line bodies cross-section and orientation is defined within DesignModeler. The Point Mass feature is not available in thermal analyses.
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Material Properties
The only required material property for steady state is thermal conductivity.
If any temperature-dependent material properties exist, this will result in a nonlinear solution. lt i li l ti
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As with structural analyses, contact regions are automatically created to enable heat transfer between parts of assemblies.
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If parts are initially in contact heat transfer can occur between them. If parts are initially out of contact no heat transfer takes place (see pinball explanation below). p ) Summary:
Heat Transfer Between Parts in Contact Region? Initially Touching Inside Pinball Region Outside Pinball Region Yes Yes No Yes Yes No Yes No No Yes No No Yes No No
The pinball region determines when contact occurs and is automatically defined and set to a relatively small value to accommodate small gaps in the model
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Pinball Radius
In this figure on the right, the gap between the two parts is bigger than the pinball region, so no heat transfer will occur between the parts
ANSYS, Inc. Proprietary 2010 ANSYS, Inc. All rights reserved. Release 13.0 November 2010
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By default, perfect thermal contact conductance between parts is assumed, meaning no temperature drop occurs at the interface. Numerous conditions can contribute to less than perfect contact conductance:
surface flatness surface finish oxides entrapped fluids contact pressure surface temperature use of conductive grease ....
T
T x
Continued . . .
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The amount of heat flow across a contact interface is defined by the contact heat flux q:
where Tcontact is the temperature of a contact node and Ttarget is the temperature of the corresponding target node node. By default, TCC is set to a relatively high value based on the largest material conductivity defined in the model KXX and the diagonal of the o e a geometry bounding bo overall geo et y bou d g box ASMDIAG. S G
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In ANSYS Professional licenses and above, the user may define a finite thermal contact conductance (TCC) for Pure Penalty or Augmented Lagrange Formulations.
TCC is input for each contact region in the Details view. If thermal contact resistance is known, invert this value and divide by the contacting area to obtain TCC value.
Thermal contact conductance can be input which is the same as including thermal contact resistance at a contact interface. interface
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Spotweld definition is done in the CAD software (currently only DesignModeler and Unigraphics).
T2
T1
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C. Heat Loads
Heat Flow:
A heat flow rate can be applied to a vertex, edge, or surface. The load is distributed for multiple selections. Heat flow has units of energy/time.
Heat Flux:
Heat flux can be applied to surfaces only (edges in 2D). Heat flux has units of energy/time/area.
A positive value for heat load will add energy to the system.
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At least one type of thermal boundary condition must be present to prevent the thermal equivalent of rigid body motion. motion Given Temperature or Convection load should not be applied on surfaces that already have another heat load or thermal boundary condition applied to it. Perfect insulation will override thermal boundary conditions.
Given Temperature:
I Imposes a temperature on vertices, edges, surfaces or bodies t t ti d f b di Temperature is the degree of freedom solved for
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Applied to surfaces only (edges in 2D analyses). Convection q is defined by a film coefficient h, the surface area A, and the y , , difference in the surface temperature Tsurface & ambient temperature Tambient
q = hA(Tsurface Tambientt ) f bi
h and Tambient are user input values. The film coefficient h can be constant or temperature dependent
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Several common convection correlations can be imported from a sample library. New correlations can be stored in libraries.
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Where:
Correlations: To ambient (form factor assumed to be 1) OR Surface to surface (view factors calculated). Stefan Boltzman constant is set automatically based on the active working unit system
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D. Solution Options
Inserting the Steady-State Thermal from the Workbench toolbox will set up a SS Thermal system in the project schematic. Analysis Settings In Mechanical the Analysis Settings can be used to set solution options for the thermal analysis. Note, the same Analysis Data Management options discussed in chapter 4 regarding static analyses are available here. here
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To perform a thermal-stress solution link a structural analysis to the thermal model at the Solution level. An imported load branch is inserted in the Static Structural branch along with any applied structural loads and supports. supports
Solve the Structural branch.
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In Mechanical, results are usually requested before solving, but they y g y can be requested afterwards, too.
A new solution is not required for retrieving output of a solved model.
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Temperature
Temperature:
Temperature is a scalar quantity and has no direction associated with it.
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Heat Flux
Heat flux contour or vector plots are available:
Heat flux q is defined as
q = KXX T
Total Heat Flux and Directional Heat Flux can be requested
The magnitude & direction can be plotted as vectors by activating vector mode
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Reaction heat flow rates are available for Given Temperature, convection or radiation boundary conditions:
Reaction heat flow rate is requested by inserting a probe - OR Alternately users can drag and drop a boundary condition onto the Solution branch to retrieve the reaction.
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Analyze the pump housing shown below for its heat transfer characteristics.
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