S. E.

PROJECT REPORT ON

SMOKE DETECTOR (Analog Project)

SUBMITTED BY ASHWINI NAYAK DIKSHA RAUT TANVI REVANDKAR

ELECTRONICS ENGINEERING

ATHARVA COLLEGE OF ENGINEERING, MUMBAI University of Mumbai 2009-2010

CERTIFICATE
This is to certify that the Project SMOKE DETECTOR has been carried out by ASHWINI NAYAK, DIKSHA RAUT,TANVI REVANDKAR who are bonafide students of ATHARVA COLLEGE OF ENGINEERING, Mumbai, in partial fulfillment of the requirement of S. E. Degree in Electronics Engineering of Mumbai University. The work has not been presented anywhere else for award of any other degree or diploma prior to this.

Internal Examiner _________________________ ( PRACHITI GHARAT )

External Examiner __________________________ ( )

ACKNOWLEDGEMENTS
We would like to express our sincere thanks to Ms Prachiti Gharat for taking time from her busy schedule to provide us with great deal of help, support and encouraged us to work diligently at every aspects of our project. Her views have always been equitable striking perfect balance between encouragement and constructive criticism. Her constructive tips and suggestions helped us to successfully do the project. We have benefited a lot from her immense knowledge and experience. We are thankful to our college director, Principal Dr.Anupama Deshpande, ELEX HOD Prof.Archana Chaudhari and all staff members of Electronics and Telecommunications department who have provided us various facilities and have guided us whenever required. . Our project at various stages has entailed us to seek help from variety of individuals we would like to thank each one of them for their forbiddance and guidance. Finally we would like to thank our parents and our friends for constantly supporting and encouraging our efforts. We would like to thank Microsoft Word & Microsoft Paint for providing us various Fonts to represent our project report more effectively & in an impressive way.

ASHWINI NAYAK DIKSHA RAUT TANVI REVANDKAR

II

CONTENTS

Abstract........................................................................................................................................1 1.Introduction..............................................................................................................................2 2.Smoke Detector Section...........................................................................................................5 2.1 Block Diagram.....................................................................................................................5 2.2 Block Diagram Explanation..................................................................................................6 2.2.1 LDR..............................................................................................................................6 2.2.2 Transistor.....................................................................................................................6 2.2.3 +5V Voltage Regulator................................................................................................7 2.3.Component Description......................................................................................................10 2.3.1 LED............................................................................................................................10 2.3.2 100k Potentiometer....................................................................................................13 2.3.3 LDR(Light Dependent Resistor)................................................................................15 2.3.4 Transistor BC107.......................................................................................................18 2.3.5 IC7805........................................................................................................................22 3.Alarm Section.........................................................................................................................24 3.1 Block Diagram...................................................................................................................24 3.2 Block Diagram Explanation...............................................................................................25 3.2.1 Melody Generator......................................................................................................25 3.2.2 Amplifier....................................................................................................................25 3.2.3 Speaker.......................................................................................................................26 3.3. Component Description....................................................................................................29 3.3.1 Diode 1N4007............................................................................................................29 3.3.2 IC UM66....................................................................................................................33 3.3.3 100k Potentiometer....................................................................................................35

III

3.3.4 IC TDA2002..............................................................................................................38 3.3.5 Resistors & Capacitors...............................................................................................42 3.3.6 Speaker......................................................................................................................42

4.Circuit Diagram Explanation...............................................................................................44 5.Printed Circuit Board ...........................................................................48 6.Softwares Used .......................................................................................................................54 6.1Keil Compiler......................................................................................................................54 6.2 Visual Basic 6....................................................................................................................58 6.3.ORCAD..............................................................................................................................67 ...................................................................................................................................................... ...................................................................................................................................................... ...................................................................................................................................................... ...................................................................................................................................................... ...................................................................................................................................................... ...................................................................................................................................................... ..................................................................................................................................................66 ..................................................................................................................................................... 7.Result And Discussion ..........................................................................68 7.1Application..........................................................................................................................68 7.2 Advantages.........................................................................................................................69 7.3 Disadvantages ...................................................................................................................70 8.Conclusion.........................................................................................72 9.References.........................................................................................73

IV

IV

LIST OF FIGURE AND TABLES

LIST OF FIGURE AND TABLES..............................................................................i

ABSTRACT

A stitch in time saves nine. Our project Smoke Detector and Fire Alarm Circuit works as a security measure. Smoke Detector helps in the early detection of fire breakout. It thus helps to prevent any potential impending threat to precious life and damage to infrastructure of property due to a major fire breakout. The detector detects the smoke emanating from fire. The inbuilt fire alarm , lets out a sound alert to warn of the fire. The early detection gives sufficient time for the inhabitants of a residential or commercial buildings to evacuate the place urgently and quickly thus saving lives.

INTRODUCTION

The first automatic electric fire alarm was invented in 1890 by Francis Robbins Upton. It was 30 years, however, before progress in nuclear chemistry and solid-state electronics made a cheap sensor possible. Before that, alarms were so expensive that only major businesses and theaters could afford them. The first truly affordable home smoke detectors were invented in 1965, featuring individual battery powered units that could be easily installed and replaced.

Conventional smoke detectors are so called because they are the older type of smoke detectors. The detector communicates with the fire alarm control panel simply by changing state from high impedance to low impedance when smoke is detected. The smoke is detected by an optical sensor . An optical detector is a light sensor. When used as a smoke detector, it includes a light source (incandescent bulb or infrared LED), a lens to collimate the light into a beam, and a photodiode or other photoelectric sensor at an angle to the beam as a light detector. In the absence of smoke, the light passes in front of the detector in a straight line. When smoke enters the optical chamber across the path of the light beam, some light is scattered by the smoke particles, directing it at the sensor and thus triggering the alarm. Also seen in large rooms, such as a gymnasium or an auditorium, are devices to detect a projected beam. A unit on the wall sends out a beam, which is either received by a receiver or reflected back via a mirror. When the beam is less visible to the "eye" of the sensor, it sends an alarm signal to the fire alarm control panel.

Optical smoke detectors are quick in detecting particulate (smoke) generated by smoldering (cool, smoky) fires. Many independent tests indicate that optical smoke detectors typically detect particulates (smoke) from hot, flaming fires approximately 30 seconds later than ionization smoke alarms. They are less sensitive to false alarms from steam or cooking fumes generated in kitchen or steam from the bathroom than are ionization smoke alarms.

Smoke detectors are one of those amazing inventions that, because of mass production, cost practically nothing. And while they cost very little, smoke detectors save thousands of lives each year.

2 SMOKE DETECTOR SECTION

2.1 Block Diagram LIGHT INPUT

LDR

TRANSISTOR

+5V VOLTAGE REGULATOR IC

OUTPUT TO FIRE ALARM SECTION Fig 2.1 Block diagram of smoke detector section

2.2 BLOCK DIAGRAM EXPLANATION

2.2.1 LDR

Fig 2.2 Light dependent resistance 1. A LDR or photo-resistor is an electronic component whose resistance decreases with the increasing incident light intensity. 2. It can also be referred to as a photoconductor. 3. It is made of a high-resistance semiconductor. 4. If light falling on the device is of high enough frequency, photons absorbed by the semiconductor give bound electrons enough energy to jump into the conduction band. 5. The resulting free electron (and its hole partner) conduct electricity, thereby lowering resistance. 6. If the intensity of the light incident on LDR is changed or varied, the resistance of the LDR varies. 7. According to the incident light input for the LDR, for the decrease in the intensity of the light, LDR resistance increases. 8. With the increase in the LDR resistance, voltage drop across the resistor increases & hence the Voltage at the LDR terminal connected to the transistor becomes sufficient to produce the current which can make the transistor ON.

2.2.2 TRANSISTOR

BC107 low-current NPN bipolar transistor TO18 can Collector connected to can Emitter marked with a tag on the edge of the can Ic <= 100mA; 300mW; Vceo <= 45V

Fig 2.3 Transistor BC107 1. As the Voltage at the base of the transistor becomes sufficient to bias it in work in the forward active region transistor becomes ON. 2. This provides energy to the Voltage regulator circuit. 2.2.3 +5V Voltage Regulator

Fig 2.4 +5V Voltage regulator IC 7805 1. As the transistor output becomes sufficient to supply energy to the Voltage Regulator , Voltage Regulator starts working. 2. It regulates its input voltage and gives the output of value +5V. 3. This +5V Voltage output is then given to the alarm Circuit.

2.3 COMPONENT DESCRIPTION

2.3.1 LED

Fig 2.5 Light Emitting Diode (LED) Data Specifications

A light-emitting diode (LED) is a semiconductor light source. LEDs are used as indicator lamps in many devices, and are increasingly used for lighting. Introduced as a practical electronic component in 1962,[2] early LEDs emitted low-intensity red light, but modern versions are available across the visible, ultraviolet and infrared wavelengths, with very high brightness. The LED is based on the semiconductor diode. When a diode is forward biased (switched on), electrons are able to recombine with holes within the device, releasing energy in the form of photons. This effect is called electroluminescence and the color of the light (corresponding to the energy of the photon) is determined by the energy gap of the semiconductor. An LED is usually small in area (less than 1 mm2), and integrated optical components are used to shape its radiation pattern and assist in reflection.[3] LEDs present many advantages over incandescent light sources including lower energy consumption, longer lifetime, improved robustness, smaller size, faster switching, and greater durability and reliability. However, they are relatively expensive and require more precise current and V

heat management than traditional light sources. Current LED products for general lighting are more expensive to buy than fluorescent lamp sources of comparable output. They also enjoy use in applications as diverse as replacements for traditional light sources in automotive lighting (particularly indicators) and in traffic signals. Airbus uses LED lighting in their A320 Enhanced since 2007, and Boeing plans its use in the 787. The compact size of LEDs has allowed new text and video displays and sensors to be developed, while their high switching rates are useful in advanced communications technology.

2.3.2 100k Potentiometer

Fig 2.6 100K Potentiometer

Specification Family Minimum Operating Temperature Mounting Value RV4 -55C Panel Mount

Shaft Diameter Product Length Product Diameter Product Type

6.35mm 36.52mm 27.78mm Resistor Trimmers, Potentiometer and Rheostat

Resistance Value Power Rating Tolerance Termination Style Maximum Operating Temperature

100KOhm 2W 10% Solder Lug 120C

2.3.3

LDR

Fig.2.7 Light dependent resistance FEATURES: Epoxy Encapsulated Small size Reliable performance Quick response High sensitivity Good characteristic of spectrum APPLICATIONS: Auto flash for cameras Industrial control Photoelectric control Photo switch Room light control Photo lamp Electronic toys Photomusical IC

DIAMETER: 4mm 5mm 7mm 12mm 20mm 2.3.4 Transistor BC107

BC107 VCEO Collector Emitter Continuous Voltage With Zero Base Current VCES Collector Emitter Continuous Voltage With Base Shortcircuited to Emitter VEBO Emitter Base Continuous Voltage Reverse Voltage IC Continuous Collector Current ICM Peak Collector Current Ptot Power Dissipation @ Tamb = 25C Tamb Ambient Operating Temperature Range Tstg Storage Temperature Range Noise Factor Output Admittance Input Impedance

BC107 BC107

30 V 45 V

BC107

20 V

BC107 BC107 BC107 BC107 BC107 VCE = 5V IC = 0.2mA R = 2k f =1kHz F=200Hz

BC 107

100mA 200mA 300mW -65 to +175C -65 to +175C

Max 10 dB Min 1.6k ax 4.5 k Max 30 S

VCE = 5V IC = 2mA f = 1kHz Group A BC107 VCE = 5V IC = 2mA f = 1kHz Group A BC107 BC 107

Thermal Resistance: Junction to Ambient

Max 500 C/W

2.3.5 IC 7805

Fig.2.8 Internal Block Diagram of POWER SUPPLY

2.3.5.1 Features Output current in excess of 1A Internal thermal overload protection No external components required Output transistor safe area protection Internal short circuit current limit Available in the aluminum TO-3 package

2.3.5.2 Pin Diagram

Fig 2.9 Pin diagram of IC 7805

3 ALARM SECTION Block Diagram

INPUT FROM SMOKEDETECTOR

MELODY GENERATOR IC

AMPLIFIER IC

AMPLIFIED SIGNAL

SPEAKER

BLOCK DIAGRAM OFALARM

Fig 3.1 Block diagram of alarm section

3.2 Block Diagram Explanation

3.2.1 Melody Generator

Fig 3.2 Melody generator IC UM66 1. Output from +5V Voltage Regulator is given to the Melody Generator which generates an Audible frequency output. 2. This output is then given to the amplifier circuit for the amplification. 3.2.2 Amplifier

Fig 3.3 Amplifier IC TDA2002 1.Amplifier amplifies the signal and its output is then given to the speaker. 3.2.2 Speaker

Fig 3.4 Speaker 1. Output of the amplifier is given to the speaker. 2. Speaker converts the output in the form of voltage to the output in the form of Audible signal.

3.3 Component Description

3.3.1 Diode 1N4007
Maximum Recurrent Peak Reverse Voltage Maximum RMS Voltage Maximum DC Blocking Voltage Peak Forward Surge Current 8.3ms single half sine-wave superimposed on rated load Maximum Forward Voltage at 1.0A DC Maximum Reverse Current at TA=25 J At Rated DC Blocking Voltage TA=100 J Typical Junction capacitance Typical Thermal Resistance Typical Thermal resistance Operating and Storage Temperature Range

1000V 700V 1000V 30A 1.1V 5.0A 500A 15pF 50J /W 25J /W -55 to +125 J

3.3.2 UM66

3.3.3 100K potentiometer

Category Potentiometers Resistance In Ohms 100K Power (Watts) 0.75W, 3/4W Number of Turns Single Package / Case Round - 0.531" Dia x 0.268" H (13.50mm x 6.80mm) Adjustment Type Top Adjustment Tolerance 10% Mounting Type Through Hole Temperature Coefficient 50ppm/C Resistive Material Wire wound

3.3.4 IC TDA 2002

4. CIRCUIT DIAGRAM EXPLANATION

Description. Here is a simple fire alarm circuit based on a LDR and lamp pair for sensing the fire.The alarm works by sensing the smoke produced during fire.The circuit produces an audible alarm when the fire breaks out with smoke. When there is no smoke the light from the bulb will be directly falling on the LDR.The LDR resistance will be low and so the voltage across it (below .6V).The transistor will be OFF and nothing happens.When there is sufficient smoke to mask the light from falling on LDR, the LDR resistance increases and so do the voltage across it.Now the transistor will switch to ON.This gives power to the IC1 and it outputs 5V.This powers the tone generator IC UM66 (IC2) to play a music.This music will be amplified by IC3 (TDA 2002) to drive the speaker. The diode D1 and D2 in combination drops 1.4 V to give the rated voltage (3.5V ) to UM66 .UM 66 cannot withstand more than 4V.

Circuit diagram with Parts list.

Fig 4.1 Circuit diagram of smoke detector circuit Notes.

The speaker can be a 8 tweeter. POT R4 can be used to adjust the sensitivity of the alarm. POT R3 can be used for varying the volume of the alarm. Any general purpose NPN transistor(like BC548,BC148,2N222) can be used for Q1. The circuit can be powered from a 9V battery or a 9V DC power supply. Instead of bulb you can use a bright LED with a 1K resistor series to it.

5. PRINTED CIRCUIT BOARD

P.C.B. Construction A Printed Circuit Board (P.C.B.) can be defined as an insulating base material to which is permanently attached a flat metallic network of conducting paths whose dimension depends upon the current that can be handled by them. The P.C.B. may be either single sided or double sided. The P.C.B. used for this project is single sided one. The basic material used may be resin coated papers, fiber glass, ceramic and the flat board configuration however is most widely used and it may be of the nature of the single Mother Board into which smaller boards are plugged by the especially designed connectors which ensures adequate and permanent low resistance coupling.

Board Design: PCB designing is the most important and requires great care during work. In this case great care must be taken while tracing the circuit or layout on the board. Because once PCB is designed, it is virtually impossible to alter it. While designing a circuit, designer should take care to avoid crossing of conducting paths (tracks) as possible. Crossovers are unavoidable then only of the jumper can be used. A circuit board carrying copper on both sides can also help to solve this problem when circuit is complicated.

The Master Diagram The next stage lies in proportion to designing i.e. to prepare Master Diagram, which is commonly made twice as the finished circuit, since this makes the working on that much easier, especially when circuit is complicated photography eventually reduces the size of diagram to that of the circuit, before proceeding we must know some rules regarding the designing:1) The space between the conductors must be strictly controlled to avoid the possibility of

electrical discharge or unwanted capacitance. The amount by which the master diagram is to reduce in size is thus a critical design feature. 2) The conductor must be wider in those parts of the circuits that are going to handle large

currents must be handle without undue temperature of conductors. V

3)

The minimum width of copper should not generally be less than about 1.5mm. This is

related to mechanical strength rather than electrical properties and it also ensures that strips remains securely bounded to the base material. 4) The points where the component holes for component lead wire occurs must be sited to

suit the dimensions of the component and dimensions between lead-out wires, so that, the components can be situated correctly on finished board. The conductor is also large at the point of holes.

P.C.B. Making: When the master diagram probable twice the size of real PCB has been evolved, the text major step consists of etching or dissolving the unwanted metal from copper claded board to create the circuit as depicted by master diagram. It must be stressed that very accurate checking of master is essential at this stage. Then, the master point is mounted on a special frame on easy facing of a larger camera and with the aid of the very powerful illumination a master diagram is clearly photographed on a glass sensitive plate. This is developed to give photographic negative. Next so called step and repeat camera is brought into operation. This comprises the camera body mounted so that side ways after each exposure. In this way number of copies of the original master diagram is set out exactly to cover standard sheet of copper clad laminate laboratory method of making PCB. In case of simple and need of number of less PCBs, it is economic and advisable to use the following lab method of PCB making:-

Planning the circuit: Though this is not particularly difficult, there are several important factors that need not be taken into account. If the finished device is to work properly we must consider gain factor and ensure that the input and output parts are sufficiently well isolated to avoid the possibility. We must also ensure that conductors and components carrying high frequency current are well separated from these parts of the circuits. We are also to make sure that all components need to return to earth are properly connected and that possibility of common impedance arising in earth returned. Circuit is totally eliminated by making all earth as substantial as possible consistent with nature of design. Other factors that have to successfully studied include

availability of adequate return points on board and its mounting from accessibility of switch connections made for mechanical fixing ventilation effect of vibration.

Cleaning the board: The copper side of the board must be thoroughly cleaned before Circuit plan is transferred to it. This is very important because even slightest trace of graze (from figure of instance) will impure the etching process and when the circuit plan has been neatly transferred to copper in this manner the board is held under, running tap and the allowed to dry before resist is applied.

Transforming the plan: Now, once cleaning is done plan has to transfer on copper surface of PCB material.A convenient way to do this is simply put a carbon paper between a copper surface of the board and working plan and carefully trace the lines of original plan with a ball pen.

Resist: Resist is nothing more than a substrate that is unaffected by presence etching chemicals. It is usually colored so that, it can be easily seen the copper surface. When plan is clearly worked on clean copper the a that are to be left in fact as the copper conductors must be covered when resists the leaguer type of paints possess good resist properties but disadvantages of relatively long time taken for drying. It is essential to resist through hardening before etching is started. Nail polished are better as they quickly and are less difficult to remove. To overcome this drying effect and to achieve the sharp edges of the trace on PCB. Now a days etching taps along with IC pads are commonly used. To this, chances of short circulating due to paints are completely the avoid etching tapes and pads are available in different sizes.

Correcting errors: When a result has been thoroughly hardened any errors that have been made can usually be corrected by gently scratching away with knife. To ensure clear out lines round edges of copper conductors on board the resist must be applied with steady band.

Etching: Next comes etching of unwanted copper and whether a small single is all that is required as quantity of board to be produce certain precautions must be taken before operation is commenced the most used etch ant I ferric chloride and to this is added small quantity of HCL to accelerate. But it is not as critical as lab construction is concerned. Mixing 10 grams of ferric chloride and 25 grams of HCL with 15 grams of water can produce a good etchant.

Agitation: Small plastic bath is ideal for storing the etchant process. The Depth of liquid must be sufficient to completely cover laminate, the laminated board carrying the resist pattern circuit is then dropped into etchant bath and the gentle agitation takes 5 to 20 minutes to complete depending on the strength of the enchant temperature and thickness of copper foil.

Finishing off: When all unwanted copper is dissolved from areas between conductors, board should be taken from an etchant and washed in water. The resist must be removed using proper solvent. After this the copper surface must be polished with any kind of cleaner. It should be seen that there is no slight incomplete etching between the conducting paths of the PCB. The PCBs are coated coating material for protection in lab coating material itself is a soldier. This process is called Tinning. This process of coating involves tracks with solder. Advantage of tinning the effect of environment of conductors, then PCB is drilled i.e. holes for filling and mounting the components on PCB are drilled with suitable drill bit. Assembling of PCB: After the holes are drilled, the components have to be assembled On PCB before assembling the components it is necessary to clean soldering iron in order to get easy and accurate soldering. Removing impurity particles that are gathered on iron bit due to repetitive use cleans soldering iron.

6. SOFTWARES USED

Here are the steps for PCB design [19] 1. Make schematic diagram using PCB Artist. 2. Once you finish schematic design translate it to PCB by using

Fig. 6.1 Translate Schematic to PCB 3. This will display new PCB wizard. Board parameter is set by default use the same one or

change as per requirement. 4. You will see the board outline ready to place the components in. We previously chose to leave the components unplaced and the nets unrouted. 5. The board outline is displayed with the components stacked neatly at the top edge ready for placing.

Fig.6.2 Screen with unplaced components

6. Now place component as per requirement, place is simple case of picking and dragging the selected component. 7. After placing components pour copper by selecting Pour copper option. This will help to get the tracks.

7. RESULT & DISCUSSION

8.CONCLUSION

9.REFERENCES