INTRODUCTION

A PRINTED CIRCUIT BOARD or PCB is used to mechanically support and electrically connect electronics components using conductive pathways, or traces, etched from copper sheets laminated onto a non-conductive substrate. I t is also referred to as printed wiring board (PWB) or etched wiring board. A PCB populated with electronics components is a printed circuit assembly (PCA), also known as a printed circuit board assembly (PCBA). PCBs are rugged, inexpensive, and can be highly reliable. They required much more layout effort and higher initial costs than either wire-wrapped or point-to-point constructed circuits, but are much more cheaper and faster for high volume production. Much of the electronics industry PCB design , assembly , and quality control needs are set by standard that are set by standards that are published by the IPC organizations . Single or double sided boards consist of a core dielectric material, such as FR-4 epoxy fiberglass, with copper plating on one or both sides. This copper plating is etched away to form the actual copper pads and connections traces on the boards surfaces as part of the board manufacturing process. A multilayer board consists of a number of layer dielectrics materials that has been impregnated with adhesives and these layers are used to separate the layer of copper plating.

a) Draw and explain flow for the manufacture of single layer and multilayer rigid Printed Circuit Boards.

SINGLE LAYER FLOW DIAGRAM

Testing & Inspection

PCB Data Preparation

Final Fabrication

Laminate preparation

Surface Finish Outer layer image transfer

Drilling & Cleaning

EXPLAIN FOR THE PROCESS FLOW SINGLE LAYER PCB DATA PREPARATION

Files transfer from PCB design house to PCB manufacturing #Gerber files, drill files, fabrication drawing, customer specification

File review by PCB manufacturer Creation of PCB tooling #Photo-tool for image transfer image created by PCB software is reproduced on film using laser photo plotters Drill files Profile routing files All tooling is stepped and repeated for optimum utilization of standard panel (24x18)
PHOTO PLOTTER

ARTWORK

LAMINATE PREPARATION Dielectric material : woven glass fiber or paper Material depends on the function of the PCB. Some perform better some environment than other (heat, humidity), more suitable for particular manufacturing process (hole punching). Most widely use is FR4/CEM Copper foil is rolled or electrolytic ally deposited on the base laminate Core laminate is sheared to panel size Core material is cleaned mechanically and/or chemically Removal of surface contamination required to promote subsequent adhesion of photo resist Some PCBs have trace layers inside the PCB and are called multi-layer PCBs. These are formed by bonding together separately etched thin boards. Core are pinned in a stack with sheet of prepare separating the copper layer. Outer layer are made with a foil of copper. Stack is pinned between heavy metal plates creating a book Book is put it a heated hydraulic press for about 2h Prepare is available in different styles with varying amounts of resin and glass fibers. This allow the manufacturer to control thickness between layers and thickness of the overall PCB

LAMINATION Core are pinned in a stack with sheet of prepreg separating the copper Layer. Outer layer are made with a foil of copper. Stack is pinned between heavy metal plates creating a book Book is put it a heated hydraulic press for about 2h Prepare is available in different styles with varying amounts of resin and glass fibers. This allow the manufacturer to control thickness between layers and thickness of the overall PCB

Pcb shear

DRILLING AND CLEANING

Each layer of the printed circuit board requires the ability of one layer to connect to another, this is achieved through drilling small holes called "VIAS". These drilled holes require precision placement and are most commonly done with the use of an automated drilling machine. These machines are driven by computer programs and files called numerically controlled drill or (NCD) files also referred to as excellent files. These files determine the position and size of each file in the design.

Some files require very small vias to be drilled which results in heavy wear and tear of the drill bit itself. Drilling through different substrates may require the drill bit to be made of tungsten carbide and are costlier than other materials but required to provide a proper hole.

Controlled depth drilling can be used to drill just one layer of the circuit board rather than drilling through all the layers. This can be accomplished by drilling the individual sheets or layers of the PCB prior to lamination.

Blind Vias : Is when the holes connect a layer to the outside surface Buried Vias : Is when the holes only connect interior layers and not to the outside surface.

The walls of each hole (for multi-layer boards) are copper plated to form plated-through holes that connect the conductive layers of the printed circuit board.

Purpose : holes are drilled through PCB to interconnect layer (vias) allow the insertion of PTH components

Drilling is performed with CNC equipment Using drill files. Alternative method use punching or laser

Multiple panels can be drilled together Drilling of complex boards can take several hours per load

Desmear remove the melted resin smear Panels are debarred /scrubbed after drilling PCB substrate is not conductive. Therefore a non-electrolytic deposition method is required

Process : electro less copper

DRILLING AND CLEANING BRUSH CLEANING MACHINE

OUTER LAYER IMAGE Most common process : print, pattern plate and etch Coat copper foils with photo resist Place photo tool and expose to light Outer layer photo tools are positive image of the circuit. Circuit image is developed away exposing the copper. PR remaining on the panel will act as plating resist Etching

SURFACE FINISH Purpose : prevent copper oxidation Most popular surface finish process : SMOBC/HASL SMOBC = Solder-mask-over-bare-copper HASL = Hot-air-solder-leveling

Purpose of solder mask : insulate those portions where no solder is required HASL Panels are dipped into molten solder (237^C). Exposed copper is coated with solder. Masks areas remain solder-free. Panels are the cleaned in hot water.

FINAL FABRICATION Routing done through CNC machines De-penalization Most of the circuit is routed out of the panel, but tabs remains to hold the circuit in place. This allow machine to populate boards at once. Afterwards, the circuit can be broken out of the panel. Such panel are called array, breakaway. Alternative de-penalization is to have the panel v-scored. It done through a thin rotating scoring blade that will route across the top & bottom of the panel with about 30% of the thickness. V-scoring allows more circuits per panel. (no spacing is required for router bits)

TESTING & INSPECTION PCB inspection is an essential element in any electronics manufacturing process. The PCB inspection enables faults to be detected as soon after the manufacture process as possible . As such the PCB inspection process is an essential element of any PCB manufacturing process. AAOI - Automatic Optical Inspection, state of the art system capable of in depth analysis of final build compatibility detecting a multitude of faults. Functional Testing. Automated optical inspection (AOI) Inspection inner layer circuit before lamination X-ray & Scanning laser system Monitor registration accuracy and pinpoint defects after lamination Final inspection (manual ,automated) Manual-operator visually inspecting the boards via optics and making judgments. Automated-employs computer added image analysis for determining defects . When pcb inspected and tested-evaluate the cost effectiveness of repairing the board . Re paired/rework is not allowed in high reliability and military application . Only for commercial application is allowed . Repaired must meet the original design requirement , reliability and quality standards .

There are 3 method of testing : AUTOMATIC TEST EQUIPMENT Any automated devices that use to quickly test like PCB , IC ,or any other electronics component . ATE devices always controlled by computer . System simple as digital multi-meter . All the operating , measurements is controlled and analyses by computer . Example , flying probe tester PCB bed of nails . Are used to test a wide range of electronics devices & system . ATE system typically interface with handler , physically places the devices so that it can be measured .

BOUNDARY SCANNING Boundary scanning is a method for testing interconnections (wire line) on printed circuit boards or sub blocks inside an integrated circuit. Test interconnections and clusters of logic , memories without using physical test probes .

BURN IN TEST EQUIPMENT Burn in test equipment uses elevated voltages , temperatures and power cycling to evaluate high power chips , boards or products . The burn in process tests the quality of semiconductor devices before it is incorporated into a finished devices . Burn in test equipment accelerates any potential failures in substandard products , known as the infant mortality .Devices that survive a burn-in period are usually free of early failures and other operational problems

There are two main uses for a PCB inspection system:

High light manufacturing defects: The obvious function of a PCB inspection system is to highlight any defects so that they can be corrected before they are passed on to the next stage in the production process. Finding faults as early as possible in the production process is essential because fault finding and fixing costs rise by approximately a factor of ten as each stage in the production process is passed.

Provide process feedback: An equally important function of a PCB inspection system is to provide feedback into the manufacturing process. Using a PCB inspection system on the output of the soldering process can enable any pattern faults to be seen and the process corrected almost immediately to reduce or eliminate the occurrence of a given problem.

MULTILAYER FLOW DIAGRAM

PCB Data Preparation

Laminate preparation

inner layer image transfer

plate through holes

Drilling & Cleaning

Lamination

Outer layer image transfer

Surface Finish

Final Fabrication

Testing & Inspection

b) Draw the building concepts of multilayer rigid Printed Circuit Board that consist of: i) 16 LAYER BOARD

ii)

BURRIED VIA BETWEEN LAYER 2 to 7 and 6 to 12

BURRIED VIA 2 to 7

BURRIED VIA 6 to 12

iii)

Blind via between layer 4 to 10

BLIND VIA 10 -16

c) By choosing any circuits , design the circuit for single layer of printed circuit board (PCB)
SCHEMATIC

This circuit consists of 3 IC, the Ic that I used is, IC 555 and 2 IC 4026. This circuit using less than 20 component. This circuits count using 2 7-segments.

LAYOUT USING PROTEUS

PCB WILL BE LIMITED TO: SINGLE LAYER

This is a single layer printed circuit board

So this is a normal shape of pcb

ROUND HOLES

ROUND HOLE

Round - Round holes are the default hole shapes and can define their hole sizes.

FABRICATION PROCESS FIND THE SUITABLE CIRCUIT

circuit can be found everywhere, for example in a hobby kit or on the internet, but make sure it has a 3 ic to complete the specification given. And not using ball grid array IC.
THEN TRY TO MAKE A CIRCUIT USING SOFTWARE MULTISIM OR PCB DESIGNER

DRAW THE CIRCUIT USING MULTISIM

USING SOFTWARE PCB DESIGNER

PRINTED THE CIRCUIT LAYOUT

This is machine Photostat that will print the layout The layout will be print using the machine Photostat

They are so cheap its certainly worth a try, and with this as many different media types as will people find, but dont expect the same quality can get from lasers . The main problem will be getting an opaque enough back. It may also be worth trying an inkjet print onto paper which can be photocopied onto tracing paper with a good quality copier. This process above show , for the first step draw the schematics , it is depend to make a circuit using a multisim or using pcb designer software , Both of this is a software that always people use and easy to find that .

-Easily the best all round solution. Very affordable, fast and good quality. The printer used must have at least 600dpi resolution for all but the simplest PCBs, as you will usually be working in multiples of 0.025 (40 tracks per inch). 300dpi does not divide into 40; 600DPI does, so people can get consistent spacing and line width. It is very important that the printer produces a good solid black with no pinholes
LASER PRINTER

THEN CHOOSE A BOARD TYPE AND DEMENSION

USING SINGLE LAYER PCB

-A functional PCB is not a finished products. It will always require connections the

outside world to get power, exchange information, or display results. It will need to fit into a case or slide into a rack to perform its function.

PLACE THE LAYOUT TO THE PCB BOARD

This is a circuit that has been made in multisim and was later transferred to ultiboard then be like this. But if wish for simple connection might try to use other software such as software pcb designer, design can be made in accordance with their respective tastes. And below is a picture using software pcb layout designer to create. But before that should be used transparently to stick it in the pcb board layout. IRON THE TRANSPARENT CIRCUIT ON THE PCB BOARD

No need to iron that is too long for fear the circuit will be expanded.

This is an increase in the need to know the layout of all the iron. Layout made would have been transferred to the pcb with on its own. If you do not iron it will not be the desired circuit, when the iron layout onto the whole surface of the pcb should iron this board because they want to stick all of the layout that is transparent to the board. Do not need a long time when iron is sufficient if it knew it was stuck, if too long then the permanent layout of flowers, and this will be difficult to go to the next process. Photos above are part of the sample is done to complete the circuit. ETCHING PROCESS -Etching is probably the easiest and most cost effective .It is the process of chemically removing copper from a plated board you must put a mask or resist on the portions of the copper that you want remain after the etch these portions that remain on the board are traces that carry electrical current between devices .

Clean the pcb using water

Etching process

If etching is added to boiling water it will be easier for cooper off.

This is an etching process to be aware, this process will be made to the circuit 12 led sign board lights . If you want a fast etching may use means such as manual and if you want to update and want to just use energy-saving auto ways of using etching machines. Etching is a process that is very simple and everyone can do it. Small board will make it easier again to etching when using a large board may cause a waste of time and wastage in the use of etching. Photo above shows examples of etching processes. This machine etching do the package etching then clean the board.

 DRILL THE PCB BOARD PROCESS This is a mild increase in the process to complete each circuit, the following process is concerned with the process of drilling pcb board it really looks easy, but if not done so will not prepare the required by the circuit. Each pad is round or square pads, which have previously have designed the layout using the software updates should be at the drill with the drill because the process is still there the following process is necessary soldering each component. Drilling is very important it is intended to include all components of the foot. When drilling pcb board should be cautious and careful because like neatness in making things

PLACE AND SOLDER THE COMPONENT ON THE PCB BOARD This is a process in all components has been compiled and placed on the pcb and the most important thing is process soldering all component at the pcb, the process requires a soldering iron and tin components then be attached to the layout.

TEST FUNCTIONALITY CIRCUIT

Test counter circuit after complete soldering iron the all component at layout.

COMPLETE PCB CIRCUIT WITH WIRING

Put all the circuits in the casing after the circuit has function.

Describe the different in designing and simulation between single and double layer of PCB . Give your comment . SINGLE SIDED Wiring is available only 1 slide Difficult to design layout if circuit is complicated Component in the layout cannot arrange in sequences. When etching it need more time. Easy to transfer the layout to the PCB board. Single sided board are cheaper. Save time when etching. Difficult to transfer the layout to the PCB board. Double sided board are more expensive . Component can arrange in sequences. DOUBLE SIDED Wiring is available on both side Easy to design layout if circuit is complicated

Single layer Single sided Printed circuit board has copper tracks/circuit only on one side of the board and are often referred as Print and etch board . These are without plated through holes and can have component on one sided as well as on both sided (in case of SMD) . Single side PCB are most commonly used in consumer electronics

DOUBLE LAYER Double layer Printed circuit board has copper tracks/circuit on both side of a PCB and may or may not be connected . Both sides can be connected together by depositing copper inside the holes (plated through holes ) . In terms of assembling a double sided PCB can have components on one side as well as on both sides . Double sided PCB are commonly used in industrial .

COMMENT When designing single layer and double layer , get learn more about this process , also get knowledge about Printed Circuit Board (PCB) . When designing single layer it is very easy to transfer the layout to the PCB board because only one layer use to transfer. But sometimes when using double layer , it seem difficult to transfer the layout to the PCB board . The conclusion that can make is , both of the single layer and double layer have an advantage and disadvantage when using . So from that try to use the design circuit .

TASK 4 DESIGN CONSIDERATIONS

FABRICATION PROCESS a) Provide the aluminum board and measure Measure each part to be cut, this process is necessary if the accuracy of every detail to get right in the measure so that the results will look good and not have a defect that occurs when making the casing. Measured using tools such as rulers .

b) Then cut the aluminium board with follow the measurements

Next picture shows how to cut aluminium, the aluminium after the measure is the process to cut further Top, in college there was a large aluminium tool and it is only used to cut the aluminium. How to wear it is to be put aluminium the above place the cutter and close aluminium and finally step foot in the cutting of aluminium, then after that will be Truncated.

c) Drilling the aluminium

Once bend the aluminium, then it is time to drill a hole casing, it seeks to put the nail in the casing. Prior to that mark holes in areas where it is due to be in the drill because it is feared there will be miss-drill and a defect in your aluminium casing. Use a large drill point if you want a big hole and use a small drill point to drill small holes for the screws.

d) Bend the aluminium Aluminium has been cut should be bent to create a casing in the shape of a rectangle, using the stick method is only by raising the rod bend tool that has been provided. Lift the metal bars on the Bend will be down to create the form.

e) The aluminium board after bend

This next picture shows how the appearance of the aluminium after it is bent according to their tastes. When bending aluminium to be careful it because aluminium is sharp and can make the hand would be injured if exposed to the fragments.

e) The next process is leveling the surface of the aluminum in drill.

Smooth out any part of the casing in bend. it is also to smooth casing back.

iv)

FINISHING PROCESS a) Spray the casing This is a finishing process where the casing has been spray to look more attractive. It can also be covered from any scratches

b) Into the circuit in the casing After try the functionality of circuit , try to into the circuit in the casing . making it the casing should be neat to see the looks beautiful on the outside.

Front View

Side View

Back View

b) What skills would you need in the development aluminium casing and what resources would you look for in the formation of a project team.
In the group must have the tasks distributed to make a project:

Designing
This is where we should make a sketch of the casing before cutting. This facilitates all the work done, and will look more neat and orderly.

Technician This part where we assemble component and solder component on PCB. This part very important because to make sure the project can function properly. Manufacture After settle everything, this part we call finishing project, where we put the circuit on the casing properly.

c) Explain the main purposes for producing models representatives of the final form of a product. Process mapping approaches such as value stream mapping have several disadvantages over good system modelling. First, by definition, they map processes or process flows, and not systems. Second, they assume that there is only one point of contact with the customers- the final or services that is produced or delivered information flows for a single product (of group of product) and as such it maps only the flow of process interactions for the product out of the finals customer. In reality, organizations do not have a single point of contact with customers, customers make many different types of request product and services upon an organizations and the demand for the final product is only one of many such requests. Accordingly, achieving true excellence in performance means achieving excellence in customer satisfactions across the full spectrum of these interactions and bot just in the final product or services provided to customers. For example, beyond for the final product or services customers may require an organizations to satisfy a range of diverse requests and demands, including those for quotes and pricing, warranty support and services call, sales order processing and acknowledgement, supplier purchases, product information, product and process design, payment processing, delivery logistics, etc. A viable system model takes into account all of these interactions, defines the needed core and support processes along with their sequence and interactions and determines the needs to be filled and the outputs to be provided. Most important, the risks associated with achieving customer satisfaction through fitness for purpose in each of the customer interactions must be identified, assessed and managed.

CONCLUSION
The conclusion that can make from this assignment is can learn more about the electronics component design parameters & PRINTED CIRCUIT BOARD. Beside that also get many knowledge about many process in printed circuit board. Printed circuit board also referred as printed wiring board @ etched wiring board. it is use to mechanically support & electrically connect electronics components using pathway or traces . Also can be divided into 2 types rigid and flexible.