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Gas discharge plasma and their applications

MYEONG YEOL CHOI (Sam Choi) Electrical Engineering Ph.D. student


Advisor: Dr. George J. Collins, Supervisor: Dr. Il Gyo Koo

11/29/2010

Introduction to Sam
Born in South Korea in 1981 Bachelors degree(2007):
Electrical Engineering at Ajou University in South Korea

Republic Of Korea Marine Corps (2001-2003) Masters degree(2009):


Chemistry at Ajou University in South Korea

Ph.D. student(2009-present):
Electrical Engineering at Colorado State University

Contents
1. 2. 3. 4. 5. 6. 7. 8. 9. 10. Plasma definition Introduction to variety of plasma applications Why variety? How to generate plasma? What kind of parameters do we have? How to control the parameters to optimize plasmas? Conventional plasma applications Emerging field - Plasma health care Sams preliminary work conclusion

Plasma the 4th state of matter

http://www.nasa.gov/mission_pages/themis/auroras/sun_earth_connect.html

Variety of plasma applications


http://tv-plasma-reviews.blogspot.com/2009_02_01_archive.html

Ozone generator

Laser

http://compucentro.info/blog /tmp/ozone-generator.html

http://medgadget.com/archives/2009/12/frikkin_lasers.html

Plasma display panel

Plasma arc welding


http://www.flickr.com/photos/rmstringer/2911413043/sizes/l/in/photostream/

Fluorescent light

http://www.walyou.c om/blog/2009/08/25/ plasma-lamp-design/

Microelectronics
http://www3.ntu.edu.sg/mae/research/programmes/th infilms/tfresearch.asp

Wide Range of Temperature


Thermal-equilibrium Te=Tg
<Arc welding>

Non-thermal equilibrium Te>>Tg


<Skin sterilization>

http://www.svarka-rezka.com.ua/eng/documents/about.html

Blood Coagulation and Living Tissue Sterilization by Floating-Electrode Dielectric Barrier Discharge in Air

10,000oC-100,000oC

Tg 25-1000oC Te 10,000-100,000oC

Complexity of plasma reaction

Baldur Eliasson, Senior Member, IEEE, and Ulrich Kogelschatz, IEEE TRANSACTIONS ON PLASMA SCIENCE, VOL. 19, NO. 6, DECEMBER 1991

Electrical generation of plasmas


<Deposition of SiH4 on solar cell, flat panel, or micro electronics>
<Conditions> 1. Capacitively coupled plasma

10-3m < d < 10m


2. RF voltage source
3. SiH4 + H2 gas 4. Total gas flow rate: 50sccm 5. 0.5torr pressure
J. Jolly and J.-P. Booth, J. Appl. Phys. 97, 103305 (2005)

H atom density vs. voltage, frequency, and pressure

J. Jolly and J.-P. Booth, J. Appl. Phys. 97, 103305 (2005)

Electrical voltage, frequency and chamber pressure are important to plasma characteristic.

Chemicals
<Deposition of SiH4 on silicon substrate>

Adding chemicals can improve desired chemical reactions.

A. Hammad, E. Amanatides, D. Mataras*, D. Rapakoulias, Thin Solid Films 451 452 (2004) 255258

How to design plasma?


Plasma electrode type
Capacitively coupled plasma: voltage source Inductively coupled plasma: current source

Frequency: DC to microwave(GHz) Working gas and pressure: paschen curve

Plasma types
C
Capacitively Coupled Plasma

L
Inductively Coupled Plasma

(/) =

(/) =

Claire Tendero a,*, Christelle Tixier a, Pascal Tristant a, Jean Desmaison a, Philippe Leprince b, Spectrochimica Acta Part B 61 (2006) 2 30

Frequency

Claire Tendero a,*, Christelle Tixier a, Pascal Tristant a, Jean Desmaison a, Philippe Leprince b, Spectrochimica Acta Part B 61 (2006) 2 30

Operating gas and its pressure


< Paschen curve >

The amplitude of breakdown voltage depends on operating gas and its pressure. = F ,

http://en.wikipedia.org/wiki/Paschen_curve

Control of discharge parameters to optimize plasmas


Voltage & current
Impedance matching

Addition of chemicals Operating gas and pressure


vacuum plasma system for low pressure plasma

Control of voltage & current


<Example of RF capacitively coupled plasma system>

50 or 75 Industry standard Impedance matching for maximum power delivery = +

Addition of Chemicals
Gas inlet Target electrode Substrate <Diamond Like Carbon deposition> 1. Gas phase precursor organic gas : CH4, C5H12, C3H6O H2, Ar 2. Liquid phase precursor gas and vapor mixture: CH3OH, C2H5OH, CH3COOCH3, etc 3. Solid phase precursor Target material: graphite Target electrodes works as a carbon source for diamond like carbon deposition.

V. L. Bukhovets and I. G. Varshavskaya, Protection of Metals and Physical Chemistry of Surfaces, 2009, Vol. 45, No. 6, pp. 645651.

Control of gas & pressure


Low pressure plasma 1. Vacuum chamber 2. Vacuum pump 3. High quality sealing

http://www.azom.com/details.asp?ArticleID=912

<Typical vacuum plasma system>

Atmospheric pressure plasma 1. No need to use expensive vacuum equipment 1. Reduce cost 2. more samples available (ex. biological samples) 2. Easy to build

Application of plasma
1. Light source
Fluorescent light, plasma display panel Thin film processing: etching, sputtering Generation of radicals: ozone water purification in Europe Bloodless surgery: tissue cutting, coagulation Sterilization on surgical tools and hands Tissue texturing: joint

2. Surface modification 3. Chemical reaction 4. Plasma health care emerging field

Light
<Fluorescent Light> <Plasma Display Panel>

Annemie Bogaertsa,*, Erik Neytsa, Renaat Gijbelsa, Joost van der Mullenb, Spectrochimica Acta Part B 57 (2002) 609658

http://escience.anu.edu.au/lecture/cg/Display/printCG.en.html

Molecular excitation in the plasma -> UV emission -> absorption in phosphor -> emission of visible light

Surface modification
<Nafion surface treatment in cc rf discharge>
(b) (a)
(b) AFM images of the surface of the Nafion membrane: Plasma treated a) For 0 min, b) For 1 min, c) For 3 min, d) For 5 min, with a 400W rf powered He/H2 plasma.

(a) Schematics of the experimental setup and the electrodes configuration


Chemical bond energy (eV)

6 4 2 0 C-F C-C S-O C-O C-S

Jong Hoon Kim, Juhee Sohn, Jin Hoon Cho, Myeong Yeol Choi, Il Gyo Koo, Woong Moo Lee*, Plasma Process. Polym. 2008, 5, 377385

Chemical reactions
Ozone water purification in Europe

in

out

M. Kogoma, S. Okazaki, Raising of ozone formation efficiency in a homogeneous glow discharge plasma at atmospheric pressure, J. Phys. D: Appl. Phys. 27 (1994) 19851987.

U. Kogelschatz, B. Eliasson, W. Egli, From ozone generators to flat television screens: history and future potential of dielectric-barrier discharges, Pure Appl. Chem. 71 (1999) 18191828

(a) Ozonizer electrode

(b) Large ozone generator producing 60 kg ozone/h (by courtesy of Ozonia Ltd).

Emerging application of plasma - Plasma Health Care


Plasma application to biomedical
1. Spatially selective: thermal spread control of electrosurgery 2. Low temperature: sterilization at low temperature 3. Reactive species: chemical coagulation for bloodless surgery

Spatially selective plasma


<Valleylab Electro-surgical system>

Vs. 10-6m2 entry area 0.5m2 exit area


http://www.valleylab.com/education/poes/index.html

Low temperature plasma


Inactivation of Bacillus subtilis Spores Using Cold Atmospheric Plasmas

Fig. 1. SEM images of the Bacillus subtilis spores (a) before plasma treatment and (b) after plasma treatment for 5 min with a ruptured spore pointed.

Fig. 2. Fluorescence images of the propidium iodide stained Bacillus subtilis spores (a) before plasma treatment and (b) after plasma treatment for 5 min. (Color version available online at http://ieeexplore.ieee.org.)
Xutao Deng, Jianjun Shi, and Michael G. Kong, IEEE TRANSACTIONS ON PLASMA SCIENCE, VOL. 34, NO. 4, AUGUST 2006

Reactive species plasma


<Chemical coagulation for bloodless surgery>

- Temperature of the cut remains at room temperature. - Wound remains wet.


Gregory Fridman, Marie Peddinghaus, HalimAyan, Plasma Chem Plasma Process (2006) 26:425442

Equipment and analytical tools for Sams plasma research


Plasma generation Electrical
Signal generator Amplifier

Measurement Electrical
Z-scan Oscilloscope

Gas
Mass flow meters: gas flow rate

Optical
Spectrometer ICCD camera

Sample
High speed camera FT-IR Microscope

Sams preliminary work


Plasma for tissue cutting
Contact vs. non-contact mode plasma Plasma type: atmospheric pressure plasma jet Frequency: 13.56MHz Sample: chicken breast (muscle)

Experimental Setup
He
or

MFC

Function Generator

Ar Matching Box Plasma device


Sample BNC Connector

Amplifier

Motion Controller

Motorized stage

Contact vs. non-contact Plasma for tissue cutting


Contact mode plasma Non-contact mode plasma

Result
Contact mode cut Non-contact mode cut

13.56MHz, 50W, He 1000sccm

13.56MHz, 50W, Ar 500sccm

Conclusion
Conventional plasma application Light Surface modification Chemical reaction Emerging plasma application Bloodless plasma surgery Sterilization Coagulation Sams future work Plasma application to tissue cutting Electrical and Chemical effect on tissue samples Plasma selectivity on different tissue

References
1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. Annemie Bogaerts, Erik Neyts, Renaat Gijbels, Joost van der Mullen, Spectrochimica Acta Part B 57 (2002) 609658 G E Morfill1, M G Kong2 and J L Zimmermann1, New Journal of Physics 11 (2009) 115011 Jaime Castro B.,1 Marlon H. Guerra-Mutis,1,3 and Hector Jaime Dulce M.2, Plasma Chemistry and Plasma Processing, Vol. 23, No. 2, June 2003 Joerg Liebmann a,*, Joachim Scherer b, Nikita Bibinov d, Priyadarshini Rajasekaran d, Reinhold Kovacs b, Roland Gesche c, Peter Awakowicz d, Victoria Kolb-Bachofen a , asdfasdf, Nitric Oxide xxx (2010) xxxxxx Gregory Fridman, Marie Peddinghaus, HalimAyan, Alexander Fridman, Manjula Balasubramanian, Alexander Gutsol, Ari Brooks, Gary Friedman, Plasma Chem Plasma Process (2006) 26:425442 Junhong Chen1 and Jane H. Davidson1,2, Plasma Chemistry and Plasma Processing, Vol. 22, No. 2, June 2002 Brian E. Thompson, Kenneth D. Allen, Albert D. Richards, and Herbert H. Sawin, J. Appl. Phys. 59 (6),15 March 1986 Ulrich Kogelschatz1, Plasma Chemistry and Plasma Processing, Vol. 23, No. 1, March 2003 A. Sureshkumara, R.Sankarb, MahitoshMandalb, SudarsanNeogia, , International Journal of Pharmaceutics, 396 (2010) 1722 Claire Tendero a,*, Christelle Tixier a, Pascal Tristant a, Jean Desmaison a, Philippe Leprince b, Spectrochimica Acta Part B, 61 (2006) 2 30 Magali Boutonnet Kizling *, Sven G. Jaras, Applied Catalysis A: General, 147 (1996) 1-21 L. Brdos, H. Barnkov *, Thin Solid Films, 518 (2010) 67056713 Z Hubicka1,4, M Cada1, M Sicha1,2, A Churpita1,3, P Pokorny1, L Soukup1 and L Jastrabik1, Plasma Sources Sci. Technol. 11 (2002) 195202 MYRON H. MILLER, Specmchimica Acta, vol. 39B, No. 1, 13-56, 1984 E. Stoffels, R. E. J. Sladek and I. E. Kieft, Physica Scripta. Vol. T107, 7982, 2004 Vassili Karanassios, Spectrochimica Acta Part B, 59 (2004) 909 928 M. P. BACHYNSKI, Plasma Physics-An Elementary Review*, PROCEEDINGS OF THE IRE Ladislav Bardos a,b,*, Hana Barankova a,b, Vacuum 83 (2009) 522527 E. E. Kunhardt, Member, IEEE, IEEE TRANSACTIONS ON PLASMA SCIENCE, VOL. 28, NO. 1, FEBRUARY 2000 Liqing Yang a, Jierong Chen a,b,*, Junling Gao b, Yafei Guo b , Applied Surface Science 255 (2009) 89608964 Hajime Shiki a, Yukikazu Ito a, Hirofumi Takikawa a,*, Eiji Usuki b, Takashi Okawa c, Shigenobu Yamanaka c, Yoshimi Nishimura d, Shigeji Hishida d, Vacuum 83 (2009) 2933 M.Y.A. Mollah, R. Schennach, J. Patscheider, S. Promreuk, D.L. Cocke, Journal of Hazardous Materials B79 (2000) 301320

References
23. 24. 25. 26. 27. 28. 29. 30. 31. 32. 33. 34. 35. 36. 37. 38. 39. 40. 41. 42. 43. 44. 45. 46. 47. M G Kong1, G Kroesen2, G Morfill3,5, T Nosenko3,4, T Shimizu3, J van Dijk2 and J L Zimmermann3,4, New Journal of Physics 11 (2009) 115012 E Stoffels1, I E Kieft1, R E J Sladek1, L J M van den Bedem2, E P van der Laan2, M Steinbuch2, Plasma Sources Sci. Technol. 15 (2006) S169S1802 Gregory D. Emsellem, The 29th International Electric Propulsion Conference, Princeton University, October 31 November 4, 2005 N St J Braithwaite, Plasma Sources Sci. Technol. 9 (2000) 517527. M. Moreau, N. Orange, M.G.J. Feuilloley, Biotechnology Advances 26 (2008) 610617 J. Ehlbecka, A. Ohl, M. Maa, U. Krohmann, T. Neumann, Surface and Coatings Technology 174 175 (2003) 493497 Ulrich Kogelschatz, Baldur Eliasson and Walter Egli, Pure Appl. Chem., Vol. 71, No. 10, pp. 1819-1828, 1999. J Hopwood, Plasma Sources Sci. Technol. 1 (1992) 109-116. N St J Braithwaite, Plasma Sources Sci. Technol. 9 (2000) 517527. Robert J. Carman, Daniel J. W. Brown, and James A. Piper, IEEE JOURNAL OF QUANTUM ELECTRONICS, VOL. 30, NO. 8, AUGUST 1994 Baldur Eliasson, Senior Member, IEEE, and Ulrich Kogelschatz, IEEE TRANSACTIONS ON PLASMA SCIENCE, VOL. 19, NO. 6, DECEMBER 1991 S. Purushotham and R. V. Ramanujan, JOURNAL OF APPLIED PHYSICS 107, 114701 (2010) H. Nowakowska, V. Stranak, Z. Hubicka, M.Tichy, R. Hipper, 20th ESCAMPIG, 13-17 July 2010, Novi Sad, Serbia Zh Kissovski, M Kolev, A Ivanov, St Lishev and I Koleva, J. Phys. D: Appl. Phys. 42 (2009) 182004 (6pp) J Y Jeong, S E Babayan, V J Tu, J Park, I Henins, R F Hicks and G S Selwyn, Plasma Sources Sci. Technol. 7 (1998) 282285. THOMAS J. MANNING* AND WILLIAM R. GROW, Inductively Coupled Plasma - Atomic Emission Spectrometry R. A. Rudder, G. C. Hudson, J. B. Posthill, R. E. Thomas, R. C. Hendry, D. P. Malta, and R. J. Markunas, Appl. Phys. Lett. 60 (3), 20 January 1992. J. Esteve, M.C. Polo, G. Sanchez, Vacuum 52 (1999) 133-139. V. L. Bukhovets and I. G. Varshavskaya, Protection of Metals and Physical Chemistry of Surfaces, 2009, Vol. 45, No. 6, pp. 645-651. M. Asmann, D. Kolman, J. Heberlein, E. Pfender, Diamond and Related Materials 9 (2000) 1321. K. Bewilogua, C.V. Cooper, C. Specht, J. Schroder, R. Wittorf , M. Grischke, Surface and Coatings Technology 127 2000. 224-232. R.W. Pryor, K.R. Padmanabhan, K. Chawla, Diamond and Related Materials 4 ( 1995) 128-132. Marcus Asmann, Joachim Heberlein, and Emil Pfender1, Plasma Chemistry and Plasma Processing, Vol. 20, No. 2, 2000 SEIICHIRO MATSUMOTO, JOURNAL OF MATERIALS SCIENCE LETTERS 4 ( 1 9 8 5 ) 600-602. Yoichi HIROSE and Yuki TERASAWA, JAPANESE JOURNAL OF APPLIED PHYSICS, VOL. 25, No. 6, JUNE, 1986, pp. L519-L521

References
48. 49. 50. 51. 52. 53. 54. 55. 56. 57. 58. 59. 60. 61. 62. 63. 64. 65. 66. 67. 68. 69. 70. 71. 72. Sanjiv Kapoor, Michael A. Kelly, and Stig B. Hagstrom, J. appl. Phys. 77 (12), 15 June 1995 E.A.G. Hamers, W.G.J.H.M. van Sark, J. Bezemer, H. Meiling, W.F. van der Weg, Journal of Non-Crystalline Solids 226 (1998) 205-216. M Moravej, S E Babayan, G R Nowling, X Yang and R F Hicks, Plasma Sources Sci. Technol. 13 (2004) 814. A. Hammad, E. Amanatides, D. Mataras*, D. Rapakoulias, Thin Solid Films 451 452 (2004) 255258 Anatoly L. Vikharev, Oleg A. Ivanov, and Alexander G. Litvak, IEEE TRANSACTIONS ON PLASMA SCIENCE, VOL. 24, NO. 2, APRIL 1996 Kazuo Sugiyama, Kazutoshi Kiyokawa, Hiroyuki Matsuoka, Akihiko Itou, Kazunori Hasegawa, Kazuyoshi Tsutsumi, Thin Solid Films 316 1998. 117-122. R. Foest, M. Schmidt, K. Becker, International Journal of Mass Spectrometry 248 (2006) 87102. U. Konelschatz, B. Eliasson and W. Egli, J. PHYS IV FRANCE 7 (1997) T Yokoyama, M Kogoma, T Moriwaki and S Okazak, J. Phys. D: Appl. Phys. 23 (1990) 1125-1 128. Han S. Uhm, Journal of the Korean Physical Society, Vol. 42, February 2003, pp. S775-S781. Baldur Eliasson, Senior Member, IEEE, and Ulrich Kogelschatz, IEEE TRANSACTIONS ON PLASMA SCIENCE, VOL. 19, NO. 6, DECEMBER 1991 K H Becker, K H Schoenbach and J G Eden, J. Phys. D: Appl. Phys. 39 (2006) R55R70. C.H. Yi, Y.H. Lee, G.Y. Yeom, Surface and Coatings Technology 171 (2003) 237240. Oleg Baranov, Maxim Romanov, Matthias Wolter, Shailesh Kumar, Xiaoxia Zhong, and Kostya (Ken) Ostrikov, PHYSICS OF PLASMAS 17, 053509 (2010) B. Window and G. L. Harding, J. Vac. Sci. Technol. A 8 (3), May/Jun 1990 T. Novikova, B. Kalache, and P. Bulkin, JOURNAL OF APPLIED PHYSICS VOLUME 93, NUMBER 6 Mark A. Sobolewski, Jung-Hyung Kim, JOURNAL OF APPLIED PHYSICS 102, 113302 (2007) Kallol Bera, Shahid Rauf, Kartik Ramaswamy, and Ken Collins, JOURNAL OF APPLIED PHYSICS 106, 033301 (2009) L. Wilken, V. Hoffmann, and K. Wetzig, JOURNAL OF APPLIED PHYSICS 99, 063305 (2006) J. J. Shi and X. T. Deng, JOURNAL OF APPLIED PHYSICS VOLUME 94, NUMBER 10 15 NOVEMBER 2003 F J Gordillo-Vazquez, C Gomez-Aleixandre and J M Albella, Plasma Sources Sci. Technol. 10 (2001) 99116. J. Jollya! and J.-P. Booth, JOURNAL OF APPLIED PHYSICS 97, 103305 (2005) H. Curtins, N. Wyrsch, M. Favre, and A. V. Shah, Plasma Chemistry and Plasma Processing, VoL 7, No. 3, 1987 JULIE A. HORNER, PENGYUAN YANG, and GARY M. HIEFTJE, Applied Spectroscopy, Volume 54, Number 12, (2000) L. Marques, J. Jolly, L. L. Alves, JOURNAL OF APPLIED PHYSICS 102, 063305 (2007)

References
73. 74. 75. 76. 77. 78. 79. 80. 81. Michael Hertl and Jacques Jolly, J. Phys. D: Appl. Phys. 33 (2000) 381388. Zhigang Chen, Shahid Rauf, and Ken Collins, JOURNAL OF APPLIED PHYSICS 108, 073301 (2010) Jong Hoon Kim, Juhee Sohn, Jin Hoon Cho, Myeong Yeol Choi, Il Gyo Koo, Woong Moo Lee, Plasma Process. Polym. 2008, 5, 377385 Fukusaburou Itou, Akio Kitaya, Norikazu Okamoto, Plasma Addressed Liquid Crystal Display Ulrich Kogelschatz, Baldur Eliasson and Walter Egli, Pure Appl. Chem., Vol. 71, No. 10, pp. 1819-1828, 1999. Masuhiro Kogoma and Satiko Okazaki, J Phys. D Appl. Phys. 27 (1994) 1985-1987. EDWARD W.HAGLEY, LU DENG,WILLIAM D. PHILLIPS, KEITH BURNETT, and CHARLES W.CLARK, The atom laser X. T. Deng and J. J. Shi, APPLIED PHYSICS LETTERS 87, 153901 (2005) Xutao Deng, Jianjun Shi, and Michael G. Kong, IEEE TRANSACTIONS ON PLASMA SCIENCE, VOL. 34, NO. 4, AUGUST 2006

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