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AD9648
FEATURES
1.8 V analog supply operation 1.8 V CMOS or LVDS outputs SNR = 74.5 dBFS @ 70 MHz SFDR = 91 dBc @ 70 MHz Low power: 78 mW/channel ADC core @ 125 MSPS Differential analog input with 650 MHz bandwidth IF sampling frequencies to 200 MHz On-chip voltage reference and sample-and-hold circuit 2 V p-p differential analog input DNL = 0.35 LSB Serial port control options Offset binary, gray code, or twos complement data format Optional clock duty cycle stabilizer Integer 1-to-8 input clock divider Data output multiplex option Built-in selectable digital test pattern generation Energy-saving power-down modes Data clock out with programmable clock and data alignment
SPI
CMOS/LVDS OUTPUT BUFFER
PROGRAMMING DATA
MUX OPTION
AD9648
DRVDD
DIVIDE 1 TO 8
MODE CONTROLS
CLK+ CLK
SYNC
DCS
APPLICATIONS
Communications Diversity radio systems Multimode digital receivers GSM, EDGE, W-CDMA, LTE, CDMA2000, WiMAX, TD-SCDMA I/Q demodulation systems Smart antenna systems Broadband data applications Battery-powered instruments Hand held scope meters Portable medical imaging Ultrasound Radar/LIDAR
NOTES 1. PIN NAMES ARE FOR THE CMOS PIN CONFIGURATION ONLY; SEE FIGURE 7 FOR LVDS PIN NAMES.
Figure 1.
PRODUCT HIGHLIGHTS
1. The AD96481 operates from a single 1.8 V analog power supply and features a separate digital output driver supply to accommodate 1.8 V CMOS or LVDS logic families. The patented sample-and-hold circuit maintains excellent performance for input frequencies up to 200 MHz and is designed for low cost, low power, and ease of use. A standard serial port interface supports various product features and functions, such as data output formatting, internal clock divider, power-down, DCO/data timing and offset adjustments. The AD9648 is packaged in a 64-lead RoHS compliant LFCSP that is pin compatible with the AD9650/ AD9269/AD9268 16-bit ADC, the AD9258 14-bit ADC, the AD9628/AD9231 12-bit ADCs, and the AD9608/AD9204 10-bit ADCs, enabling a simple migration path between 10-bit and 16-bit converters sampling from 20 MSPS to 125 MSPS.
2.
3.
4.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. www.analog.com Tel: 781.329.4700 Fax: 781.461.3113 2011 Analog Devices, Inc. All rights reserved.
REVISION HISTORY
7/11Revision 0: Initial Version
Rev. 0 | Page 2 of 44
Rev. 0 | Page 3 of 44
AD9648 SPECIFICATIONS
DC SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = 1.0 dBFS differential input, 1.0 V internal reference, DCS enabled, unless otherwise noted. Table 1.
Parameter RESOLUTION ACCURACY No Missing Codes Offset Error Gain Error Differential Nonlinearity (DNL) 1 Integral Nonlinearity (INL)1 MATCHING CHARACTERISTIC Offset Error Gain Error TEMPERATURE DRIFT Offset Error Gain Error INTERNAL VOLTAGE REFERENCE Output Voltage (1 V Mode) Load Regulation Error at 1.0 mA INPUT REFERRED NOISE VREF = 1.0 V ANALOG INPUT Input Span, VREF = 1.0 V Input Capacitance2 Input Resistance (Differential) Input Common-Mode Voltage Input Common-Mode Range POWER SUPPLIES Supply Voltage AVDD DRVDD Supply Current IAVDD1 IDRVDD (1.8 V CMOS)1 IDRVDD(1.8 V LVDS)1 Temp Full Full Full Full Full 25C Full 25C Full Full Full Full Full Full 25C Full Full Full Full Full 0.98 Min 14 AD9648-105 Typ Max Min 14 AD9648-125 Typ Max Unit Bits
1.0 0.01 0.5 2 50 1.00 2 0.98 2 5 7.5 0.9 0.5 1.3 0.5 1.02 0.98
0.58
1.0 0.01 0.5 2 50 1.00 2 0.98 2 5 7.5 0.9 1.3 1.02 0.58 4.0
% FSR % FSR LSB LSB LSB LSB % FSR % FSR ppm/C ppm/C V mV LSB rms V p-p pF k V V
4.0
1.7 1.7
1.9 1.9 86
1.7 1.7
V V mA mA mA
Rev. 0 | Page 4 of 44
AD9648
Parameter POWER CONSUMPTION DC Input Sine Wave Input (DRVDD = 1.8 V CMOS Output Mode) Sine Wave Input (DRVDD = 1.8 V LVDS Output Mode) Standby Power3 Power-Down Power
1 2 3
Min
Max
Min
Max
Unit mW mW mW mW mW
181.3 189.4
211.5 220.5
Measure with a low input frequency, full-scale sine wave, with approximately 5 pF loading on each output bit. Input capacitance refers to the effective capacitance between one differential input pin and AGND. Standby power is measured with a dc input and with the CLK pins active (1.8 V CMOS mode).
AC SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = 1.0 dBFS differential input, 1.0 V internal reference, DCS enabled, unless otherwise noted. Table 2.
Parameter1 SIGNAL-TO-NOISE-RATIO (SNR) fIN = 9.7 MHz fIN = 30.5 MHz fIN = 70 MHz fIN = 100 MHz fIN = 200 MHz SIGNAL-TO-NOISE AND DISTORTION (SINAD) fIN = 9.7 MHz fIN = 30.5 MHz fIN = 70 MHz fIN = 100 MHz fIN = 200 MHz EFFECTIVE NUMBER OF BITS (ENOB) fIN = 9.7 MHz fIN = 30.5 MHz fIN = 70 MHz fIN = 100 MHz fIN = 200 MHz WORST SECOND OR THIRD HARMONIC fIN = 9.7 MHz fIN = 30.5 MHz fIN = 70 MHz fIN = 100 MHz fIN = 200 MHz Temp 25C 25C 25C Full 25C 25C 25C 25C 25C Full 25C 25C 25C 25C 25C 25C 25C 25C 25C 25C Full 25C 25C Min AD9648-105 Typ Max 75.4 75.2 74.8 73.8 73.8 71.0 74.3 74.0 73.4 73.0 72.8 69.6 12.0 12.0 11.8 11.8 11.3 98 90 93 86 92 81 90 84 72.8 72.8 70.3 11.9 11.9 11.8 11.8 11.4 96 90 91 82 73.0 73.9 71.5 73.9 73.4 73.3 Min AD9648-125 Typ Max 75.0 74.7 74.5 Unit dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS dBFS Bits Bits Bits Bits Bits dBc dBc dBc dBc dBc dBc
Rev. 0 | Page 5 of 44
AD9648
Parameter1 SPURIOUS-FREE DYNAMIC RANGE (SFDR) fIN = 9.7 MHz fIN = 30.5 MHz fIN = 70 MHz fIN = 100 MHz fIN = 200 MHz WORST OTHER (HARMONIC OR SPUR) fIN = 9.7 MHz fIN = 30.5 MHz fIN = 70 MHz fIN = 100 MHz fIN = 200 MHz TWO-TONE SFDR fIN = 29 MHz (7 dBFS ), 32 MHz (7 dBFS ) CROSSTALK2 ANALOG INPUT BANDWIDTH
1 2
Temp 25C 25C 25C Full 25C 25C 25C 25C 25C Full 25C 25C 25C Full 25C
Min
Min
Unit dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dBc dB MHz
86 92 81 98 96 96 91 92 90 84 95 650
82 90 84 97 97 97 90 92 90 84 95 650
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions. Crosstalk is measured at 100 MHz with 1.0 dBFS on one channel and no input on the alternate channel.
DIGITAL SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = 1.0 dBFS differential input, 1.0 V internal reference, and DCS enabled, unless otherwise noted. Table 3.
Parameter DIFFERENTIAL CLOCK INPUTS (CLK+, CLK) Logic Compliance Internal Common-Mode Bias Differential Input Voltage Input Voltage Range Input Common-Mode Range High Level Input Current Low Level Input Current Input Capacitance Input Resistance LOGIC INPUT (CSB)1 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance Temp Min AD9628-105/125 Typ Max CMOS/LVDS/LVPECL 0.9 0.3 AGND - 0.3 0.9 10 10 8 1.22 0 10 40 26 2 4 10 3.6 AVDD + 0.2 1.4 +10 +10 12 DRVDD + 0.2 0.6 +10 132 Unit
Full Full Full Full Full Full Full Full Full Full Full Full Full Full
V V p-p V V A A pF k V V A A k pF
Rev. 0 | Page 6 of 44
AD9648
Parameter LOGIC INPUT (SCLK/DFS/SYNC)2 High Level Input Voltage Low Level Input Voltage High Level Input Current (VIN = 1.8 V) Low Level Input Current Input Resistance Input Capacitance LOGIC INPUT/OUTPUT (SDIO/DCS)1 High Level Input Voltage Low Level Input Voltage High Level Input Current Low Level Input Current Input Resistance Input Capacitance LOGIC INPUTS (OEB, PDWN)2 High Level Input Voltage Low Level Input Voltage High Level Input Current (VIN = 1.8 V) Low Level Input Current Input Resistance Input Capacitance DIGITAL OUTPUTS CMOS ModeDRVDD = 1.8 V High Level Output Voltage IOH = 50 A IOH = 0.5 mA Low Level Output Voltage IOL = 1.6 mA IOL = 50 A LVDS ModeDRVDD = 1.8 V Differential Output Voltage (VOD), ANSI Mode Output Offset Voltage (VOS), ANSI Mode Differential Output Voltage (VOD), Reduced Swing Mode Output Offset Voltage (VOS), Reduced Swing Mode
1 2
Temp Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full Full
Min 1.22 0 92 10
Unit V V A A k pF V V A A k pF V V A A k pF
1.22 0 10 38 26 5 1.22 0 90 10 26 5
1.79 1.75 0.2 0.05 290 1.15 160 1.15 345 1.25 200 1.25 400 1.35 230 1.35
V V V V mV V mV V
Rev. 0 | Page 7 of 44
AD9648
SWITCHING SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = 1.0 dBFS differential input, 1.0 V internal reference, and DCS enabled, unless otherwise noted. Table 4.
Parameter CLOCK INPUT PARAMETERS Input Clock Rate Conversion Rate1 DCS Enabled DCS Disabled CLK PeriodDivide-by-1 Mode (tCLK) CLK Pulse Width High (tCH) Aperture Delay (tA) Aperture Uncertainty (Jitter, tJ) DATA OUTPUT PARAMETERS CMOS Mode (DRVDD = 1.8 V) Data Propagation Delay (tPD) DCO Propagation Delay (tDCO)2 DCO to Data Skew (tSKEW) LVDS Mode (DRVDD = 1.8 V) Data Propagation Delay (tPD) DCO Propagation Delay (tDCO)2 DCO to Data Skew (tSKEW) CMOS Mode Pipeline Delay (Latency) LVDS Mode Pipeline Delay (Latency) Channel A/Channel B Wake-Up Time (Power Down)3 Wake-Up Time (Standby) Out-of-Range Recovery Time
1 2 3
Min
Min
105 105
20 10 8 4 1.0 0.07
125 125
Full Full Full Full Full Full Full Full Full Full Full
2.9 3.1
0.1
2.9 3.1
0.1
2.4
2.4
2.4
2.4
0.20
+0.25
0.20
+0.25
Conversion rate is the clock rate after the divider. Additional DCO delay can be added by writing to Bits[2:0] in SPI Register 0x17 (see Table 18). Wake-up time is defined as the time required to return to normal operation from power-down mode.
Rev. 0 | Page 8 of 44
AD9648
TIMING SPECIFICATIONS
Table 5.
Parameter SYNC TIMING REQUIREMENTS tSSYNC tHSYNC SPI TIMING REQUIREMENTS tDS tDH tCLK tS tH tHIGH tLOW tEN_SDIO tDIS_SDIO Description Limit Unit
SYNC to rising edge of CLK+ setup time SYNC to rising edge of CLK+ hold time
0.24 0.40
ns typ ns typ
Setup time between the data and the rising edge of SCLK Hold time between the data and the rising edge of SCLK Period of the SCLK Setup time between CSB and SCLK Hold time between CSB and SCLK SCLK pulse width high SCLK pulse width low Time required for the SDIO pin to switch from an input to an output relative to the SCLK falling edge Time required for the SDIO pin to switch from an output to an input relative to the SCLK rising edge
2 2 40 2 2 10 10 10 10
Timing Diagrams
N1 N VIN N+1 N+2
tA
N+3
N+4 N+5
tCH
CLK+ CLK
tCLK
tDCO
DCOA/DCOB
tSKEW
09975-002
CH A/CH B DATA
N 17
N 16
N 15
N 14
N 13
N 12
tPD
Figure 2. CMOS Default Output Mode Data Output Timing
Rev. 0 | Page 9 of 44
AD9648
N1 N VIN N+1 N+2
tA
N+3
N+4 N+5
tCH
CLK+ CLK
tCLK
tDCO
DCOA/DCOB
tSKEW
CH A DATA CH A CH B CH A CH B CH A N 16 N 15 N 14 N 13 N 12 CH B CH A N 11 N 10 CH B N9 CH A N8
09975-003
tPD
CH B DATA CH B CH A CH B CH A CH B CH A CH B N 16 N 15 N 14 N 13 N 12 N 11 N 10 CH A N9 CH B N8
N1 N VIN
tA
N+3 N+1
N+4 N+5
N+2
tCH
CLK+ CLK
tCLK
tDCO
DCO+ DCO
tSKEW tPD
CH A N 12 CH B N 12 CH A N 11 CH B N 11 CH A N 10 CH B N 10 CH A N9 CH B N9 CH A N8
D0+ (LSB) PARALLEL INTERLEAVED MODE D0 (LSB) D13+ (MSB) D13 (MSB) D1+/0+ (LSB) CHANNEL MULTIPLEXED MODE CHANNEL A D1/D0 (LSB) D13+/D12+ (MSB) D13/D12 (MSB) D1+/D0+ (LSB) CHANNEL MULTIPLEXED MODE CHANNEL B D1/D0 (LSB) D13+/D12+ (MSB) D13/D12 (MSB)
CH A N 12
CH B N 12
CH A N 11
CH B N 11
CH A N 10
CH B N 10
CH A N9
CH B N9
CH A N8
CH A0 N 12
CH A1 N 12
CH A0 N 11
CH A1 N 11
CH A0 N 10
CH A1 N 10
CH A0 N9
CH A1 N9
CH A0 N8
CH A12 N 12
CH A13 N 12
CH A12 N 11
CH A13 N 11
CH A12 N 10
CH A13 N 10
CH A12 N9
CH A13 N9
CH A12 N8
CH B0 N 12
CH B1 N 12
CH B0 N 11
CH B1 N 11
CH B0 N 10
CH B1 N 10
CH B0 N9
CH B1 N9
CH B0 N8
CH B12 N 12
CH B13 N 12
CH B12 N 11
CH B13 N 11
CH B12 N 10
CH B13 N 10
CH A12 N9
CH A13 N9
CH A12 N8
Rev. 0 | Page 10 of 44
09975-004
AD9648
CLK+
tSSYNC
SYNC
tHSYNC
09975-005
Rev. 0 | Page 11 of 44
THERMAL CHARACTERISTICS
Rating 0.3 V to +2.0 V 0.3 V to +2.0 V 0.3 V to AVDD + 0.2 V 0.3 V to AVDD + 0.2 V 0.3 V to AVDD + 0.2 V 0.3 V to AVDD + 0.2 V 0.3 V to AVDD + 0.2 V 0.3 V to DRVDD + 0.2 V 0.3 V to DRVDD + 0.2 V 0.3 V to DRVDD + 0.2 V 0.3 V to DRVDD + 0.2 V 0.3 V to DRVDD + 0.2 V 0.3 V to DRVDD + 0.2 V 0.3 V to DRVDD + 0.2 V 40C to +85C 150C 65C to +150C
The exposed paddle must be soldered to the ground plane for the LFCSP package. Soldering the exposed paddle to the PCB increases the reliability of the solder joints and maximizes the thermal capability of the package. Table 7. Thermal Resistance
Package Type 64-Lead LFCSP 9 mm 9 mm (CP-64-4)
1 2 3
Per JEDEC 51-7, plus JEDEC 25-5 2S2P test board. Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air). Per MIL-Std 883, Method 1012.1. 4 Per JEDEC JESD51-8 (still air).
Typical JA is specified for a 4-layer PCB with a solid ground plane. As shown Table 7, airflow improves heat dissipation, which reduces JA. In addition, metal in direct contact with the package leads from metal traces, through holes, ground, and power planes reduces JA.
ESD CAUTION
The inputs and outputs are rated to the supply voltage (AVDD or DRVDD) + 0.2 V but should not exceed 2.1 V.
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Rev. 0 | Page 12 of 44
CLK+ CLK SYNC NC NC D0B (LSB) D1B D2B D3B DRVDD D4B D5B D6B D7B D8B D9B
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
PIN 1 INDICATOR
AD9648
PARALLEL CMOS TOP VIEW (Not to Scale)
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
PDWN OEB CSB SCLK/DFS SDIO/DCS ORA D13A (MSB) D12A D11A D10A D9A DRVDD D8A D7A D6A D5A
NOTES 1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN. 2. THE EXPOSED THERMAL PAD ON THE BOTTOM OF THE PACKAGE PROVIDES THE ANALOG GROUND FOR THE PART. THIS EXPOSED PAD MUST BE CONNECTED TO GROUND FOR PROPER OPERATION.
D10B D11B DRVDD D12B D13B (MSB) ORB DCOB DCOA NC NC D0A (LSB) DRVDD D1A D2A D3A D4A
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Ground
VIN+A VINA VIN+B VINB VREF SENSE RBIAS VCM CLK+ CLK SYNC
Input Input Input Input Input/Output Input Input/Output Output Input Input Input
Rev. 0 | Page 13 of 44
09975-006
AD9648
Pin No. Mnemonic Digital Outputs 27 D0A (LSB) 29 D1A 30 D2A 31 D3A 32 D4A 33 D5A 34 D6A 35 D7A 36 D8A 38 D9A 39 D10A 40 D11A 41 D12A 42 D13A (MSB) 43 ORA 6 D0B (LSB) 7 D1B 8 D2B 9 D3B 11 D4B 12 D5B 13 D6B 14 D7B 15 D8B 16 D9B 17 D10B 18 D11B 20 D12B 21 D13B (MSB) 22 ORB 24 DCOA 23 DCOB SPI Control 45 SCLK/DFS 44 SDIO/DCS 46 CSB ADC Configuration 47 OEB 48 PDWN Type Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Input Input/Output Input Input Input Description Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A CMOS Output Data. Channel A Overrange Output. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B CMOS Output Data. Channel B Overrange Output Channel A Data Clock Output. Channel B Data Clock Output. SPI Serial Clock/Data Format Select Pin in External Pin Mode. SPI Serial Data I/O/Duty Cycle Stabilizer Pin in External Pin Mode. SPI Chip Select (Active Low). Output Enable Input (Active Low). Pin must be enabled via SPI. Power-Down Input in External Pin Mode. In SPI mode, this input can be configured as power-down or standby.
Rev. 0 | Page 14 of 44
AD9648
AVDD AVDD VIN+B VINB AVDD AVDD RBIAS VCM SENSE VREF AVDD AVDD VINA VIN+A AVDD AVDD
CLK+ CLK SYNC NC NC NC NC D0 (LSB) D0+ (LSB) DRVDD D1 D1+ D2 D2+ D3 D3+
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
PIN 1 INDICATOR
AD9648
INTERLEAVED PARALLEL LVDS TOP VIEW (Not to Scale)
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
PDWN OEB CSB SCLK/DFS SDIO/DCS OR+ OR D13+ (MSB) D13 (MSB) D12+ D12 DRVDD D11+ D11 D10+ D10
NOTES 1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN. 2. THE EXPOSED THERMAL PAD ON THE BOTTOM OF THE PACKAGE PROVIDES THE ANALOG GROUND FOR THE PART. THIS EXPOSED PAD MUST BE CONNECTED TO GROUND FOR PROPER OPERATION.
D4 D4+ DRVDD D5 D5+ D6 D6+ DCO DCO+ D7 D7+ DRVDD D8 D8+ D9 D9+
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Ground
Input Input Input Input Input/Output Input Input/Output Output Input Input Input Output Output Output Output
09975-007
AD9648
Pin No. Mnemonic 14 D2+ 13 D2 16 D3+ 15 D3 18 D4+ 17 D4 21 D5+ 20 D5 23 D6+ 22 D6 27 D7+ 26 D7 30 D8+ 29 D8 32 D9+ 31 D9 34 D10+ 33 D10 36 D11+ 35 D11 39 D12+ 38 D12 41 D13+ (MSB) 40 D13 (MSB) 43 OR+ 42 OR 25 DCO+ 24 DCO SPI Control 45 SCLK/DFS 44 SDIO/DCS 46 CSB ADC Configuration 47 OEB 48 PDWN Type Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Input Input/Output Input Input Input Description Channel A/Channel B LVDS Output Data 2True. Channel A/Channel B LVDS Output Data 2Complement. Channel A/Channel B LVDS Output Data 3True. Channel A/Channel B LVDS Output Data 3Complement. Channel A/Channel B LVDS Output Data 4 True. Channel A/Channel B LVDS Output Data 4Complement. Channel A/Channel B LVDS Output Data 5True. Channel A/Channel B LVDS Output Data 5Complement. Channel A/Channel B LVDS Output Data 6True. Channel A/Channel B LVDS Output Data 6Complement. Channel A/Channel B LVDS Output Data 7True. Channel A/Channel B LVDS Output Data 7Complement. Channel A/Channel B LVDS Output Data 8True. Channel A/Channel B LVDS Output Data 8Complement. Channel A/Channel B LVDS Output Data 9True. Channel A/Channel B LVDS Output Data 9Complement. Channel A/Channel B LVDS Output Data 10True. Channel A/Channel B LVDS Output Data 10Complement. Channel A/Channel B LVDS Output Data 11True. Channel A/Channel B LVDS Output Data 11Complement. Channel A/Channel B LVDS Output Data 12True. Channel A/Channel B LVDS Output Data 12Complement. Channel A/Channel B LVDS Output Data 13True. Channel A/Channel B LVDS Output Data 13Complement. Channel A/Channel B LVDS Overrange OutputTrue. Channel A/Channel B LVDS Overrange OutputComplement. Channel A/Channel B LVDS Data Clock OutputTrue. Channel A/Channel B LVDS Data Clock OutputComplement. SPI Serial Clock/Data Format Select Pin in External Pin Mode. SPI Serial Data I/O/Duty Cycle Stabilizer Pin in External Pin Mode. SPI Chip Select (Active Low). Output Enable Input (Active Low). Pin must be enabled via SPI. Power-Down Input in External Pin Mode. In SPI mode, this input can be configured as power-down or standby.
Rev. 0 | Page 16 of 44
AD9648
AVDD AVDD VIN+B VINB AVDD AVDD RBIAS VCM SENSE VREF AVDD AVDD VINA VIN+A AVDD AVDD
CLK+ CLK SYNC NC NC NC NC B D1/D0 (LSB) B D1+/D0+ (LSB) DRVDD B D3/D2 B D3+/D2+ B D5/D4 B D5+/D4+ B D7/D6 B D7+/D6+ 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
PIN 1 INDICATOR
AD9648
CHANNEL MULTIPLEXED LVDS TOP VIEW (Not to Scale)
48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
PDWN OEB CSB SCLK/DFS SDIO/DCS OR+ OR A D13+/D12+ (MSB) A D13/D12 (MSB) A D11+/D10+ A D11/D10 DRVDD A D9+/D8+ A D9/D8 A D7+/D6+ A D7/D6
NOTES 1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN. 2. THE EXPOSED THERMAL PAD ON THE BOTTOM OF THE PACKAGE PROVIDES THE ANALOG GROUND FOR THE PART. THIS EXPOSED PAD MUST BE CONNECTED TO GROUND FOR PROPER OPERATION.
B D9/D8 B D9+/D8+ DRVDD B D11/D10 B D11+/D10+ B D13/D12 (MSB) B D13+/D12+ (MSB) DCO DCO+ A D1/D0 (LSB) A D1+/D0+ (LSB) DRVDD A D3/D2 A D3+/D2+ A D5/D4 A D5+/D4+
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Ground
VIN+A VINA VIN+B VINB VREF SENSE RBIAS VCM CLK+ CLK SYNC
Input Input Input Input Input/Output Input Input/Output Output Input Input Input
Rev. 0 | Page 17 of 44
09975-008
AD9648
Pin No. Mnemonic Digital Outputs 8 B D1/D0 (LSB) 9 B D1+/D0+ (LSB) 11 B D3/D2 12 B D3+/D2+ 13 B D5/D4 14 B D5+/D4+ 15 B D7/D6 16 B D7+/D6+ 17 B D9/D8 18 B D9+/D8+ 20 B D11/D10 21 B D11+/D10+ 22 B D13/D12 (MSB) 23 B D13+/D12+ (MSB) 26 A D1/D0 (LSB) 27 A D1+/D0+ (LSB) 29 A D3/D2 30 A D3+/D2+ 32 A D5+/D4+ 31 A D5/D4 34 A D7+/D6+ 33 A D7/D6 36 A D9+/D8+ 35 A D9/D8 39 A D11+/D10+ 38 A D11/D10 41 A D13+/D12+ (MSB) 40 A D13/D12 (MSB) 43 OR+ 42 OR 25 DCO+ 24 DCO SPI Control 45 SCLK/DFS 44 SDIO/DCS 46 CSB ADC Configuration 47 OEB 48 PDWN Type Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Output Input Input/Output Input Input Input Description Channel B LVDS Output Data 1/Data 0Complement. Channel B LVDS Output Data 1/Data 0True. Channel B LVDS Output Data 3/Data 2Complement. Channel B LVDS Output Data 3/Data 2True. Channel B LVDS Output Data 5/Data 4Complement. Channel B LVDS Output Data 5/Data 4True. Channel B LVDS Output Data 7/Data 6Complement. Channel B LVDS Output Data 7/Data 6True. Channel B LVDS Output Data 9/Data 8Complement. Channel B LVDS Output Data 9/Data 8True. Channel B LVDS Output Data 11/Data 10Complement. Channel B LVDS Output Data 11/Data 10True. Channel B LVDS Output Data 13/Data 12Complement. Channel B LVDS Output Data 13/Data 12True. Channel A LVDS Output Data 1/Data 0Complement. Channel A LVDS Output Data 1/Data 0True. Channel A LVDS Output Data 3/Data 2Complement. Channel A LVDS Output Data 3/Data 2True. Channel A LVDS Output Data 5/Data 4Complement. Channel A LVDS Output Data 5/Data 4True. Channel A LVDS Output Data 7/Data 6Complement. Channel A LVDS Output Data 7/Data 6True. Channel A LVDS Output Data 9/Data 8Complement. Channel A LVDS Output Data 9/Data 8True. Channel A LVDS Output Data 11/Data 10Complement. Channel A LVDS Output Data 11/Data 10True. Channel A LVDS Output Data 13/Data 12Complement. Channel A LVDS Output Data 13/Data 12True. Channel A/Channel B LVDS Overrange OutputTrue. Channel A/Channel B LVDS Overrange OutputComplement. Channel A/Channel B LVDS Data Clock OutputTrue. Channel A/Channel B LVDS Data Clock OutputComplement. SPI Serial Clock/Data Format Select Pin in External Pin Mode. SPI Serial Data I/O/Duty Cycle Stabilizer Pin in External Pin Mode. SPI Chip Select (Active Low). Output Enable Input (Active Low). Pin must be enabled via SPI. Power-Down Input in External Pin Mode. In SPI mode, this input can be configured as power-down or standby.
Rev. 0 | Page 18 of 44
20
20
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
40
40
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60
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80
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100
09975-014
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60
10
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FREQUENCY (MHz)
FREQUENCY (MHz)
20
AMPLITUDE (dBFS)
40
AMPLITUDE (dBFS)
40
60
60
80
80
100
100
09975-022
120
10
20
30
40
50
60
FREQUENCY (MHz)
FREQUENCY (MHz)
AMPLITUDE (dBFS)
40
60
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10
20
30
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60
FREQUENCY (MHz)
09975-023
120
09975-025
10
20
30
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09975-024
120
120
AD9648
AD9648-125
AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = 1.0 dBFS differential input, 1.0 V internal reference, and DCS enabled, unless otherwise noted.
0 15
10
SFDR (dBc)
SFDR/IMD3 (dBc/dBFS)
30
30
AMPLITUDE (Hz)
45 60 75
2F1 F2
IMD3(dBc)
50
2F2 F1 2F1 + F2
70
90
6M
12M 18M 24M 30M 36M 42M 48M 54M 60M FREQUENCY (MHz)
Figure 14. Two-Tone FFT with fIN1 = 29 MHz and fIN2 = 32 MHz
09975-067
110 90
Figure 17. Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN) with fIN1 = 29 MHz and fIN2 = 32 MHz
120
100 95
SFDR (dBc)
100
SFDR (dBc)
90
SNR/SFDR (dBFS/dBc)
85 80 75 70 65 60 55
09975-069
SNR/SFDR (dBFS/dBc)
80
SNR (dBFS)
SNR (dBFS)
60
40
20
50
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100
150
200
250
15
25
35
95
Figure 15. SNR/SFDR vs. Input Frequency (AIN) with 2 V p-p Full Scale
120 SFDRFS 100
SNR/SFDR (dBFS/dBc)
100 120
Figure 18. SNR/SFDR vs. Sample Rate with AIN = 9.7 MHz
SFDR (dBc)
SNR/SFDR (dBFS)
80
SNRFS
80
SNR (dBFS)
60 SFDR 40 SNR 20
60
40
20
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70
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50
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10
09975-068
0 90
15
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95
Figure 16. SNR/SFDR vs. Input Amplitude (AIN) with fIN = 9.7 MHz
Rev. 0 | Page 20 of 44
Figure 19. SNR/SFDR vs. Sample Rate with AIN = 70.1 MHz
09975-020
AD9648
2 1.5 1
2.0 1.5 1.0
09975-019
2000
4000
6000
8000
2000
4000
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8000
OUTPUT CODE
OUTPUT CODE
NUMBER OF HITS
N+1
N+2
N+3
N+4
N+5
N+6
N6
N5
N4
N3
N2
N1
OUTPUT CODE
Rev. 0 | Page 21 of 44
09975-074
09975-018
AD9648
AD9648-105
AVDD = 1.8 V, DRVDD = 1.8 V, maximum sample rate, VIN = 1.0 dBFS differential input, 1.0 V internal reference, and DCS enabled, unless otherwise noted.
0
20
20
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
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80
80
100
100
09975-014
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FREQUENCY (MHz)
FREQUENCY (MHz)
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40
AMPLITUDE (dBFS)
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100
100
0 10 20 30 40 50
09975-015
120
FREQUENCY (MHz)
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FREQUENCY (MHz)
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FREQUENCY (MHz)
Rev. 0 | Page 22 of 44
09975-013
120
09975-017
120
09975-016
120
120
AD9648
100 95
120
SFDR (dBc)
90
SFDRFS
100
SNR/SFDR (dBFS/dBc)
85 80 75 70 65 60
SNR/SFDR (dBFS/dBc)
80
SNRFS
SNR (dBFS)
60
SFDR
40
SNR
20
55
09975-075
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Figure 28. SNR/SFDR vs. Input Frequency (AIN) with 2 V p-p Full Scale
120
Figure 31. SNR/SFDR vs. Input Amplitude (AIN) with fIN = 9.7 MHz
120
100
SFDR (dBc)
100
SFDR (dBc)
SNR/SFDR (dBFS/dBc)
80
SNR (dBFS)
SNR/SFDR (dBFS/dBc)
80
SNR (dBFS)
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60
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09975-012
15
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95
105
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Figure 29. SNR/SFDR vs. Sample Rate with AIN = 9.7 MHz
2.0 1.5 1.0
2.0 1.5 1.0
Figure 32. SNR/SFDR vs. Sample Rate with AIN = 70.1 MHz
09975-010
2000
4000
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8000
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8000
OUTPUT CODE
OUTPUT CODE
Rev. 0 | Page 23 of 44
09975-009
09975-011
09975-077
50
0 90
VINx
350 30k
09975-045
Figure 38. Equivalent SCLK/DFS, SYNC, OEB, and PDWN Input Circuit
AVDD
CLK+
SENSE
375
DRVDD
PAD
CSB
09975-043
09975-047
AVDD
VREF
09975-048
375 7.5k
Rev. 0 | Page 24 of 44
09975-044
CPAR
VIN+x H
CSAMPLE
S S S S
CSAMPLE
VINx
ADC ARCHITECTURE
The AD9648 architecture consists of a multistage, pipelined ADC. Each stage provides sufficient overlap to correct for flash errors in the preceding stage. The quantized outputs from each stage are combined into a final 14-bit result in the digital correction logic. The pipelined architecture permits the first stage to operate with a new input sample while the remaining stages operate with preceding samples. Sampling occurs on the rising edge of the clock. Each stage of the pipeline, excluding the last, consists of a low resolution flash ADC connected to a switched-capacitor DAC and an interstage residue amplifier (for example, a multiplying digital-to-analog converter (MDAC)). The residue amplifier magnifies the difference between the reconstructed DAC output and the flash input for the next stage in the pipeline. One bit of redundancy is used in each stage to facilitate digital correction of flash errors. The last stage simply consists of a flash ADC. The output staging block aligns the data, corrects errors, and passes the data to the CMOS/LVDS output buffers. The output buffers are powered from a separate (DRVDD) supply, allowing digital output noise to be separated from the analog core. During power-down, the output buffers go into a high impedance state.
CPAR
H
H
09975-049
The clock signal alternately switches the input circuit between sample-and-hold mode (see Figure 42). When the input circuit is switched to sample mode, the signal source must be capable of charging the sample capacitors and settling within one-half of a clock cycle. A small resistor in series with each input can help reduce the peak transient current injected from the output stage of the driving source. In addition, low Q inductors or ferrite beads can be placed on each leg of the input to reduce high differential capacitance at the analog inputs and, therefore, achieve the maximum bandwidth of the ADC. Such use of low Q inductors or ferrite beads is required when driving the converter front end at high IF frequencies. Either a shunt capacitor or two single-ended capacitors can be placed on the inputs to provide a matching passive network. This ultimately creates a low-pass filter at the input to limit unwanted broadband noise. See the AN-742 Application Note, the AN-827 Application Note, and the Analog Dialogue article Transformer-Coupled Front-End for Wideband A/D Converters (Volume 39, April 2005) for more information. In general, the precise values depend on the application.
Rev. 0 | Page 25 of 44
AD9648
Input Common Mode
The analog inputs of the AD9648 are not internally dc-biased. Therefore, in ac-coupled applications, the user must provide a dc bias externally. Setting the device so that VCM = AVDD/2 is recommended for optimum performance, but the device can function over a wider range with reasonable performance, as shown in Figure 43. An on-board, common-mode voltage reference is included in the design and is available from the VCM pin. The VCM pin must be decoupled to ground by a 0.1 F capacitor, as described in the Applications Information section.
100 SFDR (dBc) 90 80 SNR (dBFS)
R 2V p-p 49.9 R VINx 0.1F C
driver can be configured in a Sallen-Key filter topology to provide band limiting of the input signal.
200 VIN 76.8 90 33 VINx AVDD
ADA4938
0.1F 120 200
10pF
ADC
VIN+x VCM
09975-050
09975-051
33
For baseband applications below ~10 MHz where SNR is a key parameter, differential transformer-coupling is the recommended input configuration. An example is shown in Figure 45. To bias the analog input, the VCM voltage can be connected to the center tap of the secondary winding of the transformer.
VIN+x
SNR/SFDR (dBFS/dBc)
70 60 50 40 30 20 10
09975-072
ADC
VCM
0 0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
The signal characteristics must be considered when selecting a transformer. Most RF transformers saturate at frequencies below a few megahertz (MHz). Excessive signal power can also cause core saturation, which leads to distortion. At input frequencies in the second Nyquist zone and above, the noise performance of most amplifiers is not adequate to achieve the true SNR performance of the AD9648. For applications above ~10 MHz where SNR is a key parameter, differential double balun coupling is the recommended input configuration (see Figure 46). An alternative to using a transformer-coupled input at frequencies in the second Nyquist zone is to use the AD8352 differential driver. An example is shown in Figure 47. See the AD8352 data sheet for more information.
R 25 VIN+x C
Figure 43. SNR/SFDR vs. Input Common-Mode Voltage, fIN = 70 MHz, fS = 125 MSPS
0.1F R VINx
ADC
VCM
09975-053
AD8352
10
ADC
AD9648
In any configuration, the value of Shunt Capacitor C is dependent on the input frequency and source impedance and may need to be reduced or removed. Table 11 displays the suggested values to set the RC network. However, these values are dependent on the input signal and should be used only as a starting guide. Table 11. Example RC Network
Frequency Range (MHz) 0 to 70 70 to 200 R Series ( Each) 33 125 C Differential (pF) 22 Open
1.0F
the reference amplifier switch is connected to the internal resistor divider (see Figure 49), setting VREF to 1.0 V.
VIN+A/VIN+B VINA/VINB
ADC CORE
ADC
Figure 49. Internal Reference Configuration
VIN+x
ADC
VINx
If the internal reference of the AD9648 is used to drive multiple converters to improve gain matching, the loading of the reference by the other converters must be considered. Figure 50 shows how the internal reference voltage is affected by loading.
0
0.5
VOLTAGE REFERENCE
A stable and accurate 1.0 V voltage reference is built into the AD9648. The VREF can be configured using either the internal 1.0 V reference or an externally applied 1.0 V reference voltage. The various reference modes are summarized in the sections that follow. The Reference Decoupling section describes the best practices PCB layout of the reference.
2.0
2.5
3.0
Rev. 0 | Page 27 of 44
AD9648
External Reference Operation
The use of an external reference may be necessary to enhance the gain accuracy of the ADC or improve thermal drift characteristics. Figure 51 shows the typical drift characteristics of the internal reference in 1.0 V mode.
4 3 2 VREF ERROR (mV)
1 0 1 2 3 4 5
09975-079
6 40
20
20 40 TEMPERATURE (C)
60
80
This limit helps prevent the large voltage swings of the clock from feeding through to other portions of the AD9648 while preserving the fast rise and fall times of the signal that are critical to a low jitter performance.
Mini-Circuits ADT1-1WT, 1:1 Z 0.1F CLOCK INPUT 50 100 0.1F 0.1F SCHOTTKY DIODES: HSMS2822 XFMR 0.1F CLK+
ADC
CLK SCHOTTKY DIODES: HSMS2822
09975-060
1nF
2pF
2pF
09975-058
Rev. 0 | Page 28 of 44
09975-059
When the SENSE pin is tied to AVDD, the internal reference is disabled, allowing the use of an external reference. An internal reference buffer loads the external reference with an equivalent 7.5 k load (see Figure 41). The internal buffer generates the positive and negative full-scale references for the ADC core. Therefore, the external reference must be limited to a maximum of 1.0 V.
ADC
CLK
AD9648
If a low jitter clock source is not available, another option is to ac couple a differential PECL signal to the sample clock input pins, as shown in Figure 55. The AD9510/AD9511/AD9512/ AD9513/AD9514/AD9515/AD9516/AD9517 clock drivers offer excellent jitter performance.
0.1F CLOCK INPUT 0.1F CLOCK INPUT 50k 50k AD951x PECL DRIVER 240 240 100 0.1F CLK
09975-061
0.1F CLK+
ADC
A third option is to ac couple a differential LVDS signal to the sample clock input pins, as shown in Figure 56. The AD9510/ AD9511/AD9512/AD9513/AD9514/AD9515/AD9516/AD9517 clock drivers offer excellent jitter performance.
0.1F CLOCK INPUT 0.1F CLOCK INPUT 50k 50k AD951x LVDS DRIVER 100 0.1F CLK
09975-062
0.1F CLK+
ADC
In some applications, it may be acceptable to drive the sample clock inputs with a single-ended 1.8 V CMOS signal. In such applications, drive the CLK+ pin directly from a CMOS gate, and bypass the CLK pin to ground with a 0.1 F capacitor (see Figure 57).
VCC 0.1F CLOCK INPUT 501 1k 1k AD951x CMOS DRIVER OPTIONAL 0.1F 100 CLK+
ADC
CLK
09975-063
0.1F
150 RESISTOR IS OPTIONAL.
Figure 57. Single-Ended 1.8 V CMOS Input Clock (Up to 200 MHz)
SNR (dBFS)
40
45
50
55
60
65
Rev. 0 | Page 29 of 44
09975-076
40 35
AD9648
Jitter Considerations
High speed, high resolution ADCs are sensitive to the quality of the clock input. The degradation in SNR from the low frequency SNR (SNRLF) at a given input frequency (fINPUT) due to jitter (tJRMS) can be calculated by SNRHF = 10 log[(2 fINPUT tJRMS)2 + 10 ( SNRLF /10) ] In the previous equation, the rms aperture jitter represents the clock input jitter specification. IF undersampling applications are particularly sensitive to jitter, as illustrated in Figure 59.
80 75 0.05ps
primarily by the strength of the digital drivers and the load on each output bit. The maximum DRVDD current (IDRVDD) can be calculated as IDRVDD = VDRVDD CLOAD fCLK N where N is the number of output bits (30, in the case of the AD9648). This maximum current occurs when every output bit switches on every clock cycle, that is, a full-scale square wave at the Nyquist frequency of fCLK/2. In practice, the DRVDD current is established by the average number of output bits switching, which is determined by the sample rate and the characteristics of the analog input signal. Reducing the capacitive load presented to the output drivers can minimize digital power consumption. The data in Figure 60 was taken in CMOS mode using the same operating conditions as those used for the Power Supplies and Power Consumption specifications in Table 1, with a 5 pF load on each output driver.
100
70 0.2ps
SNR (dBFS)
65
60 55 50 3.0ps 1 10 100
0.5ps
1.0ps 1.5ps
SUPPLY CURRENT (A)
90 80 70 60
09975-080
45 FREQUENCY (MHz)
1k
140
50
TOTAL POWER
40 30 20
120 100 80
The clock input should be treated as an analog signal in cases where aperture jitter may affect the dynamic range of the AD9648. To avoid modulating the clock signal with digital noise, keep power supplies for clock drivers separate from the ADC output driver supplies. Low jitter, crystal-controlled oscillators make the best clock sources. If the clock is generated from another type of source (by gating, dividing, or another method), it should be retimed by the original clock at the last step. See the AN-501 Application Note and the AN-756 Application Note, available on www.analog.com for more information. The AD9648 has a SYNC input that offers the user flexible synchronization options for synchronizing sample clocks across multiple ADCs. The input clock divider can be enabled to synchronize on a single occurrence of the SYNC signal or on every occurrence. The SYNC input is internally synchronized to the sample clock; however, to ensure there is no timing uncertainty between multiple parts, the SYNC input signal should be externally synchronized to the input clock signal, meeting the setup and hold times shown in Table 5. Drive the SYNC input using a single-ended CMOS-type signal.
IDRVDD
10 0
60
09975-070
25
45
65
85
105
40 125
Figure 60. AD9648-125 Power and Current vs. Clock Rate (1.8 V CMOS Output Mode)
90 80 70
CHANNEL/CHIP SYNCHRONIZATION
60
IAVDD
50
120
40 30 20 10 0
TOTAL POWER
100 80
IDRVDD
60 40
25
45
65
85
105
Figure 61. AD9648-105 Power and Current vs. Clock Rate (1.8 V CMOS Output Mode)
Rev. 0 | Page 30 of 44
09975-066
POWER (mW)
140
POWER (mW)
2.0ps 2.5ps
160
AD9648
The AD9648 is placed in power-down mode either by the SPI port or by asserting the PDWN pin high. In this state, the ADC typically dissipates less than 2 mW. During power-down, the output drivers are placed in a high impedance state. Asserting the PDWN pin low returns the AD9648 to its normal operating mode. Note that PDWN is referenced to the digital output driver supply (DRVDD) and should not exceed that supply voltage. Low power dissipation in power-down mode is achieved by shutting down the reference, reference buffer, biasing networks, and clock. Internal capacitors are discharged when entering powerdown mode and then must be recharged when returning to normal operation. As a result, wake-up time is related to the time spent in power-down mode, and shorter power-down cycles result in proportionally shorter wake-up times. When using the SPI port interface, the user can place the ADC in power-down mode or standby mode. Standby mode allows the user to keep the internal reference circuitry powered when faster wake-up times are required. See the Memory Map section for more details. As detailed in the AN-877 Application Note, Interfacing to High Speed ADCs via SPI, the data format can be selected for offset binary, twos complement, or gray code when using the SPI control. Table 13. SCLK/DFS Mode Selection (External Pin Mode)
Voltage at Pin AGND DRVDD SCLK/DFS Offset binary (default) Twos complement SDIO/DCS DCS disabled DCS enabled (default)
DIGITAL OUTPUTS
The AD9648 output drivers can be configured to interface with either 1.8 V CMOS or 1.8 V LVDS logic families. The default output mode is CMOS, with each channel output on separate busses as shown in Figure 2. In CMOS output mode, the CMOS output drivers are sized to provide sufficient output current to drive a wide variety of logic families. However, large drive currents tend to cause current glitches on the supplies and may affect converter performance. Applications requiring the ADC to drive large capacitive loads or large fanouts may require external buffers or latches. The CMOS output can also be configured for interleaved CMOS output mode via the SPI port. In interleaved CMOS mode, the data for both channels is output onto a single output bus to reduce the total number of traces required. The timing diagram for interleaved CMOS output mode is shown in Figure 3. The interleaved CMOS output mode is enabled globally onto both output channels via Bit 5 in Register 0x14. The unused channel output can be disabled by selecting the appropriate Device Index (Bit 1 or Bit 0) in Register 0x05, then writing a 1 to local (channel specific) output port disable bit in Register 0x14. The output data format can be selected to be either offset binary or twos complement by setting the SCLK/DFS pin when operating in the external pin mode (see Table 13). Table 14. Output Data Format
Input (V) VIN+ VIN VIN+ VIN VIN+ VIN VIN+ VIN VIN+ VIN Condition (V) < VREF 0.5 LSB = VREF =0 = +VREF 1.0 LSB > +VREF 0.5 LSB
TIMING
The AD9648 provides latched data with a pipeline delay of 16 clock cycles. Data outputs are available one propagation delay (tPD) after the rising edge of the clock signal. Minimize the length of the output data lines and loads placed on them to reduce transients within the AD9648. These transients can degrade converter dynamic performance. The lowest typical conversion rate of the AD9648 is 10 MSPS. At clock rates below 10 MSPS, dynamic performance can degrade.
Offset Binary Output Mode 00 0000 0000 0000 00 0000 0000 0000 10 0000 0000 0000 11 1111 1111 1111 11 1111 1111 1111
Rev. 0 | Page 31 of 44
Twos Complement Mode 10 0000 0000 0000 10 0000 0000 0000 00 0000 0000 0000 01 1111 1111 1111 01 1111 1111 1111
OR 1 0 0 0 1
Rev. 0 | Page 32 of 44
CSB
tDS tS
CSB
tCLK
tH
DONT CARE
R/W
W1
W0
A12
A11
A10
A9
A8
A7
D5
D4
D3
D2
D1
D0
DONT CARE
Rev. 0 | Page 33 of 44
09975-046
AD9648
HARDWARE INTERFACE
The pins described in Table 15 comprise the physical interface between the user programming device and the serial port of the AD9648. The SCLK pin and the CSB pin function as inputs when using the SPI interface. The SDIO pin is bidirectional, functioning as an input during write phases and as an output during readback. The SPI interface is flexible enough to be controlled by either FPGAs or microcontrollers. One method for SPI configuration is described in detail in the AN-812 Application Note, Microcontroller-Based Serial Port Interface (SPI) Boot Circuit. The SPI port should not be active during periods when the full dynamic performance of the converter is required. Because the SCLK signal, the CSB signal, and the SDIO signal are typically asynchronous to the ADC clock, noise from these signals can degrade converter performance. If the on-board SPI bus is used for other devices, it may be necessary to provide buffers between this bus and the AD9648 to prevent these signals from transitioning at the converter inputs during critical sampling periods. Some pins serve a dual function when the SPI interface is not being used. When the pins are strapped to DRVDD or ground during device power-on, they are associated with a specific function. Table 16 describes the strappable functions supported on the AD9648. When the device is in SPI mode, the PDWN and OEB Pins (if enabled) remain active. For SPI control of output enable and power-down, the OEB and PDWN pins should be set to their default states. Table 16. Mode Selection
Pin SDIO/DCS SCLK/DFS OEB PDWN External Voltage DRVDD (default) AGND DRVDD AGND (default) DRVDD AGND (default) DRVDD AGND (default) Configuration Duty cycle stabilizer enabled Duty cycle stabilizer disabled Twos complement enabled Offset binary enabled Outputs in high impedance Outputs enabled Chip in power-down or standby Normal operation
Rev. 0 | Page 34 of 44
Default Values
After the AD9648 is reset, critical registers are loaded with default values. The default values for the registers are given in the memory map register table, Table 18.
Logic Levels
An explanation of logic level terminology follows: Bit is set is synonymous with bit is set to Logic 1 or writing Logic 1 for the bit. Clear a bit is synonymous with bit is set to Logic 0 or writing Logic 0 for the bit.
Channel-Specific Registers
Some channel setup functions, such as the signal monitor thresholds, can be programmed differently for each channel. In these cases, channel address locations are internally duplicated for each channel. These registers and bits are designated in Table 18 as local. These local registers and bits can be accessed by setting the appropriate Channel A or Channel B bits in Register 0x05. If both bits are set, the subsequent write affects the registers of both channels. In a read cycle, only Channel A or Channel B should be set to read one of the two registers. If both bits are set during an SPI read cycle, the part returns the value for Channel A. Registers and bits designated as global in Table 18 affect the entire part or the channel features for which independent settings are not allowed between channels.
Open Locations
All address and bit locations that are not included in Table 18 are not currently supported for this device. Unused bits of a valid address location should be written with 0s. Writing to these locations is required only when part of an address location is open (for example, Address 0x05). If the entire address location
Rev. 0 | Page 35 of 44
AD9648
MEMORY MAP REGISTER TABLE
All address and bit locations that are not included in Table 18 are not currently supported for this device. Table 18. Memory Map Registers
Addr Register Bit 7 (Hex) Name (MSB) Chip Configuration Registers 0x00 SPI port Open config (global) Bit 6 LSB first Bit 5 Soft reset Bit 4 1 Bit 3 1 Bit 2 Soft reset Bit 1 LSB first Bit 0 (LSB) Open Default Value (Hex) 0x18 Comments The nibbles are mirrored so LSB-first mode or MSB-first mode registers correctly, regardless of shift mode Unique chip ID used to differentiate devices; read only Unique speed grade ID used to differentiate devices; read only Bits are set to determine which device on the chip receives the next write command; applies to local registers only Synchronously transfers data from the master shift register to the slave Determines various generic modes of chip operation
0x01
Chip ID (global)
Read only
0x02
Open
Open
Read only
Channel Index and Transfer Registers 0x05 Device Open Open index (global)
Open
Open
Open
Open
Data Channel B
Data Channel A
0x03
0xFF
Transfer (global)
Open
Open
Open
Open
Open
Open
Open
Transfer
0x00
Open
Open
Open
Open
Open
0x09
Open
Open
Open
Open
Open
Internal power-down mode 00 = normal operation 01 = full power-down 10 = standby 11 = digital reset Open Duty cycle stabilizer 0= Disabled 1= enabled
0x00
0x01
Rev. 0 | Page 36 of 44
AD9648
Addr (Hex) 0x0B Register Name Clock divide (global) Bit 7 (MSB) Open Bit 6 Open Bit 5 Open Bit 4 Open Bit 3 Open Bit 2 Bit 1 Clock divide ratio 000 = divide by 1 001 = divide by 2 010 = divide by 3 011 = divide by 4 100 = divide by 5 101 = divide by 6 110 = divide by 7 111 = divide by 8 Chop Open Open 0= disabled 1= enabled Bit 0 (LSB) Default Value (Hex) 0x00 Comments The divide ratio is value plus 1
0x0C
Open
Open
Open
Open
Open
0x00
0x0D
User test mode control 00 = single pattern mode 01 = alternate continuous/repeat pattern mode 10 = single once pattern mode 11 = alternate once pattern mode
0x0E
0x10
0x14
Open
Open
Open
Open
Open
Output test mode 0000 = off (default) 0001 = midscale short 0010 = positive FS 0011 = negative FS 0100 = alternating checkerboard 0101 = PN long sequence 0110 = PN short sequence 0111 = one/zero word toggle 1000 = user test mode 1111 = ramp output Initialize Open BIST enable BIST sequence
0x00
When this register is set, the test data is placed on the output pins in place of normal data
0x00
0x00
0x15
Output adjust
Output port logic type (global) 00 = CMOS, 1.8 V 10 = LVDS, ANSI 11 = LVDS, reduced range Open Open
Open (global)
0x00
Configures the outputs and the format of the data Determines CMOS output drive strength properties Allows selection of clock delays into the input clock divider
0x16
Open
Open
Open
Open
0x17
Open
Open
Open
CMOS 1.8 V data drive strength 00 = 1 01 = 2 10 = 3 11 = 4 Input clock divider phase adjust relative to the encode clock 000 = no delay 001 = one input clock cycle 010 = two input clock cycles 011 = three input clock cycles 100 = four input clock cycles 101 = five input clock cycles 110 = six input clock cycles 111 = seven input clock cycles Delay selection 000 = 0.56 ns 001 = 1.12 ns 010 = 1.68 ns 011 = 2.24 ns 100 = 2.80 ns 101 = 3.36 ns 110 = 3.92 ns 111 = 4.48 ns
0x00
0x00
0x00
This sets the fine output delay of the output clock but does not change internal timing
Rev. 0 | Page 37 of 44
AD9648
Addr (Hex) 0x18 Register Name VREF select (global) Bit 7 (MSB) Open Bit 6 Open Bit 5 Open Bit 4 Open Bit 3 Open Bit 0 Bit 2 Bit 1 (LSB) Internal VREF digital adjustment 000 = 1.0 V p-p 001 = 1.14 V p-p 010 = 1.33 V p-p 011 = 1.6 V p-p 100 = 2.0 V p-p B2 B1 B0 Default Value (Hex) 0x04 Comments Select and/ or adjust VREF
0x19
0x1A
0x1B
0x1C
User Pattern 1 LSB (global) User Pattern 1 MSB (global) User Pattern 2 LSB (global) User Pattern 2 MSB MISR LSB MISR MSB Overrange control (global)
B7
B6
B5
B4
B3
0x00
B15
B14
B13
B12
B11
B10
B9
B8
0x00
B7
B6
B5
B4
B3
B2
B1
B0
0x00
B15
B14
B13
B12
B11
B10
B9
B8
0x00
Open
Open
Open
Open
Open
0x2E
Output assign (local) Sync control (global) Sample rate override User I/O Control Register 2
Open
Open
Open
Open
Open
Open
Open
Userdefined Pattern 1 LSB Userdefined Pattern, 1 MSB Userdefined Pattern 2 LSB Userdefined Pattern, 2 MSB Read only Read only Overrange control settings
0x3A
Open
Open
Open
Open
Open
Sync enable
0x100
Open
0x101
0x102
Open
Open
Sample rate 011 = 80 MSPS 100 = 105 MSPS 101 = 125 MSPS Open Disable SDIO pulldown
0x00
0x00
Open
Open
Open
VCM powerdown
Open
0x00
Rev. 0 | Page 38 of 44
AD9648
MEMORY MAP REGISTER DESCRIPTIONS
For additional information about functions controlled in Register 0x00 to Register 0xFF, see the AN-877 Application Note, Interfacing to High Speed ADCs via SPI. interleaving feature. Channel A is sent on least significant bits (LSBs), and Channel B is sent on most significant bits (MSBs). The even bits are sent coincident with a high DCO clock, and the odd bits are sent coincident with a low DCO clock. For CMOS outputs, setting Bit 5 enables interleaving in CMOS DDR mode. On ADC Output Port A, Channel A is sent coincident with a low DCO clock, and Channel B is coincident with a high DCO clock. On ADC Output Port B, Channel B is sent coincident with a low DCO clock, and Channel A is coincident with a high DCO clock. Clearing Bit 5 disables the interleaving feature, and data is output in CMOS SDR mode. Channel A is sent to Port A, and Channel B is sent to Port B.
Sync Control (Register 0x3A) Bits[7:3]Open Bit 2Clock Divider Next Sync Only
If the clock divider sync enable bit (Address 0x3A, Bit 1) is high, Bit 2 allows the clock divider to sync to the first sync pulse it receives and to ignore the rest. The clock divider sync enable bit resets after it syncs.
Rev. 0 | Page 39 of 44
AD9648
User I/O Control 2 (Register 0x101) Bit 7OEB Pin Enable
If the OEB pin enable bit (Bit 7) is set, the OEB pin is enabled. If Bit 7 is clear, the OEB pin is disabled (default).
Bits[2:0]Open
Rev. 0 | Page 40 of 44
VCM
The VCM pin should be decoupled to ground with a 0.1 F capacitor.
LVDS Operation
The AD9648 defaults to CMOS output mode on power-up. If LVDS operation is desired, this mode must be programmed, using the SPI configuration registers after power-up. When the AD9648 powers up in CMOS mode with LVDS termination resistors (100 ) on the outputs, the DRVDD current can be higher than the typical value until the part is placed in LVDS mode. This additional DRVDD current does not cause damage to the AD9648, but it should be taken into account when considering the maximum DRVDD current for the part. To avoid this additional DRVDD current, the AD9648 outputs can be disabled at power-up by taking the PDWN pin high. After the part is placed into LVDS mode via the SPI port, the PDWN pin can be taken low to enable the outputs.
Reference Decoupling
The VREF pin should be externally decoupled to ground with a low ESR, 1.0 F capacitor in parallel with a low ESR, 0.1 F ceramic capacitor.
SPI Port
The SPI port should not be active during periods when the full dynamic performance of the converter is required. Because the SCLK, CSB, and SDIO signals are typically asynchronous to the ADC clock, noise from these signals can degrade converter performance. If the on-board SPI bus is used for other devices, it may be necessary to provide buffers between this bus and the AD9648 to keep these signals from transitioning at the converter inputs during critical sampling periods.
Rev. 0 | Page 41 of 44
PIN 1 INDICATOR
PIN 1 INDICATOR TOP VIEW 8.75 BSC SQ 0.50 BSC EXPOSED PAD
(BOTTOM VIEW)
33 32
16 17
12 MAX
0.80 MAX 0.65 TYP 0.05 MAX 0.02 NOM 0.30 0.23 0.18 0.20 REF
SEATING PLANE
FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET.
Figure 63. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 9 mm 9 mm Body, Very Thin Quad (CP-64-4) Dimensions shown in millimeters
ORDERING GUIDE
Model1 AD9648BCPZ-105 AD9648BCPZ-125 AD9648BCPZRL7-105 AD9648BCPZRL7-125 AD9648-125EBZ
1
Temperature Range 40C to +85C 40C to +85C 40C to +85C 40C to +85C
Package Description 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] Evaluation Board
Rev. 0 | Page 42 of 44
091707-C
AD9648 NOTES
Rev. 0 | Page 43 of 44
AD9648 NOTES
2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D09975-0-7/11(0)
Rev. 0 | Page 44 of 44