ANSYS Solution to the Electronics Industry

Fadi Ben Achour ANSYS Inc Director of Electronics Industry Marketing

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Presentation Outline ANSYS Multiphysics solutions

Electronics cooling solutions Structural mechanical solutions Electromagnetic solutions (Ansoft)

New ANSYS R12 and WB 2.0 capabilities New Icepak 12.0 capabilities

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ANSYS Solutions to the Electronics Industry

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ANSYS and the Electronics Design Flow

IC Design (EDA industry) IC Manufacturing Package

Metal Chemical Vapor Deposition Courtesy Novellus systems

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ANSYS and the Electronics Design Flow

Printed Circuit Board (PCB) End Product

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Thermal Management with Icepak

Semiconductors: Ball Grid Array (BGA)

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Thermal Management with Icepak

Communication : Server and Routers

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Advanced CFD and Multiphysics Simulation

Micro channels

Blower and fan modeling

Piezoelectric fan
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Thermo-Electric cooler
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Thermal mechanical Stress:

BGA Solder and Lead frame
Exaggerated deformation due to the CTE mismatch between the different materials

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Moisture Induced Stress

Uses Ficks Law of Diffusion to simulate moisture content and resultant hygroscopic strain
Moisture content

Symmetry model

Moisture swelling - displacements

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Random Vibration
Deformation

PSD vibration excitation plane Fixed support Equivalent stress Acceleration

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Drop Test Simulation with ANSYS Explicit STR: Cell Phone Example
Absolute displacement Von Mises stress

After 6ms
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Ansoft Simulation Solutions

Signal & power integrity IC design & verification

RF & Microwave

10.00
ICA:

Electromechanical systems
LL:=922u LDUM:=10m
7.80 0 LA.I [A] LB.I [A] LC.I [A]

Torque Output

RA:=2.991

PWM_T:=60

PWM_PER:=180 I_TARG:=9

-10.30

-14.50

20.00m

30.00m

I_HYST:=0.2

20.00m

30.00m

1500 rpm

+
sourceA1 Magnet01

Q1

Q3

Q5

RA Ohm

LL H
sourceA2 Magnet02

sourceB1

sourceB2

400 V
sourceC1

Q4

Q6

Q2

sourceC2
FEA

THRES := PWM_T QS1

VAL[0] := mod( INPUT[0] ,INPUT[1] ) INPUT[1] := PWM_PER

GAIN

ANGRAD

LA.I

QS2

EQUBL

57.3
CONST

-30+PWM_PER

-LC.I

EQUBL

QS3
CONST

-60+PWM_PER

LB.I
FEA1.WIRE FEA1.CORE FEA1.Isourc FEA1.Vsour FEA1.EIsou FEA1.FLUX FEA1.Isourc FEA1.Vsour FEA1.EIsou FEA1.FLUX FEA1.Isourc FEA1.Vsour FEA1.EIsou FEA1.FLUX FEA1.PHI FEA1.OMEG 8.50 5.00

EQUBL

QS4
CONST

-90+PWM_PER

FEA Outputs 302.00k 200.00k

-LA.I

EQUBL

QS5
CONST

-120+PWM_PER

LC.I

QS6

EQUBL

CONST

-150+PWM_PER

-30.00k 0 20.00m 30.00m

INPUT := -LB.I THRES1 := I_TARG - I_HYST THRES2 := I_TARG + I_HYST Y0 := 1

EQUBL

VAL1 := 1 VAL2 := 0
Q1.CTRL + Q2.CTRL + Q3.CTRL + Q4.CTRL + Q5.CTRL + Q6.CTRL

8.50 QS1.VAL + QS2.VAL + QS3.VAL + QS4.VAL + QS5.VAL + QS6.VAL 0 20.00m 30.00m

5.00

Name FEA1.FEA_STEPS SIMPARAM1.RunTime [s] SIMPARAM1.TotalIterations SIMPARAM1.TotalSteps

Value 26.41k 34.51k 6.00k

0 0 20.00m 30.00m

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Evolution of Multiphysics Engineering Simulation

11.0 12.0 13.0

CFX Setup Geometry Modeler CAD Interface Workbench Meshing FLUENT Setup Structural Setup Struct Fluids Post Structural Post Data & Process Mgmt

FLUENT CFX Therm Emag

Geometry

Meshing

Modeling

Multiphysics Solvers

Post Processing

Add-ins

Scripting Data Integration

Optimization Optimization Parameterization Parameterization

New Workbench 2.0 Architecture! Scalable & Adaptable Workbench Supports All Simulation Services Common CFD Postprocessor FLUENT Integrated IntoFramework
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Evolution of Multiphysics Engineering Simulation

11.0 12.0 13.0

Project Management
Struct CAD Interface Workbench Meshing Structural Setup

Simulation Workflow
FLUENT CFX Therm Emag Structural Post Data & Process Mgmt

Geometry

Meshing

Modeling

Multiphysics Solvers

Post Processing

Add-ins

Scripting Data Integration

Optimization Parameterization

Innovative Workflow System Accelerates Innovation

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Evolution of Multiphysics Engineering Simulation

11.0 Electronics Polymers Offshore 12.0 13.0

Turbo

Project Management
Struct CAD Interface Workbench Meshing Structural Setup

Simulation Workflow
FLUENT CFX Therm Emag Structural Post Data & Process Mgmt

Geometry

Meshing

Modeling

Multiphysics Solvers

Post Processing

Add-ins

Scripting Data Integration

Optimization Parameterization

Vertical Products Designed to Address Industry Needs

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Evolution of Multiphysics Engineering Simulation

11.0 Electronics Polymers Offshore 12.0 13.0

Turbo

CFX Setup

3rd Party 3rd Party Fatigue Tool Workflow Data & Process Mgmt

Geometry Project Modeler CAD Interface

FLUENT Setup Management Workbench Meshing Multiphysics Structural Setup

3rd Party Meshing

Struct

Simulation

Fluids Post

FLUENT CFX

ANSYS

Structural Multiphysics Post

Therm Emag

Geometry

Meshing

Modeling

Multiphysics Solvers

Post Processing

Add-ins

Scripting Data Integration

Optimization Parameterization

Fully Integrated Multiphysics Simulation Environment

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Complete Analysis Systems

The Analysis Systems group contains a set of pre-defined systems listed by analysis type (and solver)

Drag the desired analysis type onto the Project Schematic

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Using ANSYS Workbench 2.0 Editors

Edit operation launches the application associated with the cell to define details.
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Using ANSYS Workbench 2.0 Editors

Smart Engineering Simulation

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Process Compression
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Post-Processing Results

All cells are now up to date. The simulation is complete.

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Adding to Your Project

Smart Engineering Simulation

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Now, lets add Structural. Select Static a Structural simulation with loads Drag it into your project. transferred from CFD.

Virtual Prototyping
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Consider a More Complex Project

Smart Engineering Simulation

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Engineered Scalability
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New in 12.0 Random Vibration

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New in 12.0 Introduce ANSYS Explicit STR

New Product at ANSYS 12.0 ANSYS Explicit STR WB product integrated into simulation ANSYS AUTODYN solver Benefits First explicit capabilities native to WB Include CAD connectivity, WB meshing tools, contact detection Post process in WB and Data sharing with DM, DX applications Applications Drop tests of consumer electronics On board electronics in projectiles Electronics in automotive crash
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ANSYS Icepak
ANSYS Icepak is robust and powerful computational fluid dynamics (CFD) software for electronics thermal management of packages, boards and systems. Steady State and Transient Conjugate Heat Transfer Conduction Convection Radiation Package, Board, and System Level Analysis
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ANSYS Icepak 12.0: Overview of Major Enhancements

GUI enhancements with ANSYS WB graphics options Meshing enhancements Multi-level meshing Modeling enhancements Multiple Reference Frame (MRF) modeling of fans ANSYS Iceboard integration Trace Joule heating and SIwave import of powermaps ANSYS Icechip Integration ECAD import of various packages with detailed component modeling ANSYS Workbench integration CFD Post as an additional post-processing option
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Meshing:

Mesher-HD - Uniform Params

Mesher-HD for ANSYS Icepak 12.0: New feature Uniform Params effectively blocks interactions between sub-blocking meshes Non-conformal mesh in subblocks Uniform mesh sizes Lower mesh count Improved quality

Mesh Count ~ 20k Lowest quality= 0.026

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Multi-level Meshing: An Example

No Multi-level Mesh Mesh size = 0.4 mm; Count = 931k

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Multi-level Mesh Mesh size = 2 mm; Count = 343k

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Meshing:

Multi-level meshing - Global Controls

Setting number of meshing levels Automatically Per-object basis Automatic levels Proximity Curvature Per-object levels Can set levels for every object independently

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Advanced in PCB Design Electrical power distribution engineering using SIwave Thermal Management & Engineering using Icepak With component layout from IDF format neutral file. With Accurate Board Conductivity distribution from metal layers imported from Cadence .brd file Joule heat distribution of the metal layers imported from ANSYS SIwave
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Advanced PCB Model: First layer with the thermal map

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ANSYS Icepak 12.0: Board design

New options
Import TCB file Resize PCB block based on information in ECAD file Trace heating

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Trace Heating
Trace heating panel
Display list of traces on each layer in order of areas (descending) Filtering based on area (default 20% of max area) Selecting trace in list highlights trace in GDA Creation of trace block based on geometry criteria
Trace angle Trace arm length

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Trace Heating Boundary Conditions

Set current/voltage for atleast two sides of poly block Create sources (2D) at any location on block surface New current/voltage spec for source object If sources used to specify current /voltage Ensure current flow is conserved

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Meshing of Trace Blocks

HD Mesher recommended body fitted mesh necessary Enclose trace block in non-conformal assembly Use appropriate mesh sizes and minimum gap values

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Trace Heating - Example

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Package Object : MCM import

Enhanced Package Object Import trace and via geometry, wirebonds, solder ball, solder bumps, etc from MCM database Control package location Component visibility

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Package Object: Solder Ball and Solder Bump Array Import

Import of solder ball and solder bump arrays Location and number User can specify height and diameter Cylindrical or prismatic geometry

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Package Object: Die and Wirebonds

Wirebond import Geometry approximated as polygonal thin plates Die location and dimensions imported For MCM, can be modified for each die
Wirebonds

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ANSYS Provides the Industry with Unmatched Breadth and Depth

Comprehensive multiphysics and multi-scale simulation capabilities
Only company offers complete structural, fluids and Electromagnetic simulation capabilities Multiscal package, board and system level simulation capabilities

Tools that enables innovation, speed and accuracy

DesignXplorer offers comprehensive optimization, design of experiment and design for six sigma capabilities Continues improvements in solvers speed and accuracy and in HPC Vertical application focused products like: ANSYS Icepak, SIwave

Integrated EDA and CAE platforms

WB 2.0 provides a platform for integrating ANSYS and third party EDA and CAE tools Simplorer provides a multi-domain system level simulation tool for the design of high-performance electromechanical systems
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