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case lip
'`
]'1 Infl Conf. on Recent Advances in Information Technology I RAIT-20121
. .
'Cg
`!Tg
0
Fig. 3 Block diagram of SRF method
Fig. 3 shows the block diagram SRF
method. Under balanced and sinusoidal voltage
conditions angle f is a uniformly increasing
function of time. This transformation angle is
sensitive to voltage harmonics and un balance;
therefore d f / dt may not be constant over a
mains period. With transformation given below
the direct voltage component is
[ld]
llq
[CF [:;]
D. Cascaded H-Bridge Multilevel Inverter
S3..
Vdc
+- Vout --
S2..
(6)
(8)
Figure-4 Circuit of the single cascaded H-Bridge Inverter
FigA shows the circuit model of a single eRB inverter
configuration. By using single R-Bridge we can get 3
voltage levels. The number of output voltage levels of eRB
is given by 2n+l and voltage step of each level is given by
Vdcl2n, where n is number of R-bridges connected in
cascaded. The switching table is given in Table l.
Table-l Switching table of single CHB inverter
Switches Turn ON Voltage Level
SI,S2 Vdc
S3,S4 -Vdc
S4,D2 0
c
Vl<
Fig. 5 Block diagram of 5-level CHB inverter model
The switching mechanism for 5-level eRB inverter is
shown in table-2.
Table 2 Switching table for 5-level CHB Inverter
Switches Turn On
Sl, S2
SI,S2,S5,S6
S4,D2,S8,D6
S3,S4
S3,S4,S7,S8
E Design of Single H-Bridge Cell
1. Device Current
Voltage Level
Vdc
2Vdc
0
-Vdc
-2Vdc
The IGBT and DIODE curents can be obtained
from the load current by multiplying with the corresponding
duty cycles. Duty cycle, d Yz(l +KmsinCt), Where, m
modulation index K + 1 for IGBT, -1 for Diode. For a load
current given by
Iph .v2 I sin (wt - ) (9)
Then the device current can be written as follows.
:. i
d
evice
lsin(wt
- 0)x(1+ kmsinwt)
(10)
The average value of the device current over a cycle is
calculated as
H
1 f v
l sin(wt-
2r 2
v[2.+
k m
ccsc]
H
o)x(1+kmsinwt)awt
(11)
The device RMS current can be written as
]'1 Infl Conf. on Recent Advances in Information Technology I RAIT-20121
irms
#
-(vIsin(wt 0))2 A ((1 + kmsinwt) dwt)
J
1 1
2u 2
M
k
m
2I -+ -cosq
3L
(12)
2. fGET Loss Calculation
IGBT loss can be calculated by the sum of switching loss
and conduction loss. The conduction loss can be calculated
by,
P
- V * I 1
2
*
on (IGBT) - c
e
o avg (igbt) +
U (igbt) rc
e
o
p on (IGBT)
V
0cO Iavg (igbt) + e H8 (igbt) 0cO
lavg (igbt) -![; +
cos
q]
Ir
m
s (igbt) -! [
2 + cos
q]
7
(13)
(14)
(15)
Values of V
c
e
o
and f
c
e
o
at any junction temperature can be
obtained from the output characteristics (Ic vs. Vce) of the
IGBT as shown in Figure-6.
mL
uO
1 4OO
2DO
C
Cci1c:cr CLIFI1 M. CciiecIcr-ErlTXf X@
\CC=f / cII
IJ=25C
/
/TJ
/
- <oo
/
O
Cc|ietc-L|tte v:g<. <e p
Fig. 6 IGBT output characteristics
The switching losses are the sum of all tum-on and tum-of
energies at the switching events
E
sw E
on + E
o[ a + bl + el
2
(16)
Assuming the linear dependence, switching energy
E
sw (a + bl + d) * (17)
Here V
D
C is the actual DC-Link voltage and V
no
I is the DC
Link Voltage at which E
sw
is given. Switching losses are
calculated by summing up the switching energies.
Here 'n' depends on the switching frequency.
. . .
(18)
p 2 L (a+ hI + cl
-
) 2 [+ !!+ CJ2]
>Y
1
D
1
-
R 9
(19)
After considering the DC-Link voltage variations, switching
losses of the IGBT can be written as follows.
[a bJ CJ
2
]
V
DC
P
sw
(
IGBT) f
sw
1
V
nor
(20)
So, the sum of conduction and switching losses is the total
losses given by
PT(IGBT) Pon(IGBT)
+
Psw(IGBT)
(21)
3. Diode Loss Calculation
The DIODE switching losses consist of its reverse
recovery losses; the tum-on losses are negligible.
Ere
c a + bl + el
2
(22)
[a bJ CJ
2
] Psw
(
DIODE) fsw + - +-
2 H 4
VDC
*'
Vnor (23)
So, the sum of conduction and switching losses gives the
total DIODE looses.
PT (DIODE) P on (DIODE)
+
P sw (DIODE)
(24)
The total loss per one switch (IGBT +DIODE) is the sum of
one IGBT and DIODE loss.
PT PT (IGBT) + Psw (DIODE)
4. Thermal Calculations
(25)
The junction temperatures of the IGBT and DIODE are
calculated based on the device power losses and thermal
resistances. The thermal resistance equivalent circuit for a
module is shown in Fig 5. In this design the thermal
calculations are stated with heat sink temperature as the
reference temperature. So, the case temperature from the
model can be written as follows.
T
c PT Rth (c.h)
+ Th (26)
Here
Rth(c-
h) Thermal resistance between case and heat
sink
PT Total Power Loss (IGBT + DIODE) (27)
IGBT junction temperature is the sum of the case
temperature and temperature raise due to the power losses in
the IGBT.
T
j (IGBT) PT (IGBT) Rth G-c) IGBT
+ T
c
(28)
The DIODE junction temperature is the sum of the case
temperature and temperature raise due to the power losses in
the DIODE.
T
j (DIODE) PT (DIODE) Rth U-c) DIODE
+
Tc
(29)
The above calculations are done based on the average power
losses computed over a cycle. So, the corresponding thermal
calculation gives the average junction temperature. In order
to make the calculated values close to the actual values,
transient temperature values are to be added to the average
junction temperatures.
]'1 Infl Conf. on Recent Advances in Information Technology I RAIT-20121
tnc)tGOY
\IQUJ
|1 LLt
mQc1CICCE
LOGO
Fig. 7 Thermal resistance equivalent circuit
F. DC-Capacitor Selection
The required capacitance for each cell depends on the
allowable ripple voltage and the load current. The rms
ripple curent fowing into the capacitor can be written as
follows and the ripple current frequency is double the load
current frequency.
S3..
Vdc
VOLt --
S2
..
Fig.8 H-Bridge converter
(30)
Since the value of 'L' is very small, the above equation can
be simplified to
J
'!,,!
-k)sin(2wt)
"0C
_
k
''--'
- s
n(
wt) ~ksin(2wt)
V
0C
.
J
vc:
l
g
Fig. 10 Level shifted carrier PWM
Figure-IO shows the Level shifted carrier
pulse width modulation. Each cell is modulated
independently using sinusoidal unipolar
width modulation and bipolar pulse
pulse
width
modulation respectively, providing an even power
distri bution among the cells. A carrier Level
shift by 11m (No. of levels) for cascaded
inverter i` introduced across the cells to
generate the stepped multilevel output waveform
with lower distortion.
IV MATLAB/SIMULINK MODELING AND SIMULATION
RESULTS
Figure- I I shows the Matab/Simulink power circuit
model of DSTATCOM. It consists of five blocks named as
source block, non linear load block, control block, APF
block and measurements block. The system parameters for
simulation study are source voltage of llkv, SO hz AC
supply, DC bus capacitance ISSOe-6 F, Inverter series
inductance 10 mH, Source resistance of 0.1 ohm and
inductance of 0.9 mHo Load resistance and inductance are
chosen as 30mH and 60 ohms respectively.
]'1 Infl Conf. on Recent Advances in Information Technology I RAIT-20121
Fig. 11 Matlab/Simulink power circuit model of DSTATCOM
Figure-12 shows the phase- A voltage of five
level output of phase shifted carrier PWM
inverter.
Fig. 12 five level PSCPWM output
Figure-13 shows the three phase source voltages,
three phase source currents and load currents
respectively without DST ATCOM. It is clear that
without DST ATCOM load current and source
currents are same.
Fig. 13 Source voltage, current and load current without
DSTATCOM
Figure-13 shows the three phase source
vol tages, three phase source currents and load
currents respectively with DST ATCOM. It is clear
that with DST ATCOM even though load current i`
non sinusoidal source currents are sinusoidal.
current and load current with
Figure-14 shows the DC bus voltage. The DC
bus voltage is regulated to llkv by using PI
regulator.
Fig. 14 DC Bus Vool tage
Figure-15 shows the phase- A source voltage
and current, even though the load is non linear
RL load the source power factor is unit
Fig. 15 Phase-A source voltage and current
Figure-16 shows the harmonic spectrum of
Phase - A Source current without DST ATCOM. The
THD of source current without DST ACOM is 36.89%.
:.