Aluminium Base YGA Specification SPCB

YGA-1 series Aluminum based CCL
Advantage: High Heat dissipation, Electromagnetic ShieldingHigh Mechanical StrengthExcellent
processing performance Application: Hybrid-Power IC Audio Equipment :Input and output amplifier; A balance amplifier; Audio Amplifier; Preamplifier; Power Amplifier and so on. Power Supplier :Switch power supplier, DC/DC Converters, SW Regulator and so on Communication equipments: High-frequency increaser; Filter Circuit and Transmitter Circuit Office automation Equipment: Motor Driver and so on. Motor Car: Electronics Regulator; Ignition ; Power controller and so on. Computer: CPU Board, Floppy disk Driver, Power supplier and so on. Power Modules: Current Converter, Solid relays ; Power rectifier bridges. LED Lighting: High-power LED Lights, LED Curtain Wall and So on. Models: YGA-1-1 (Insulation layer of FR-4 UV) YGA-1-2 YGA-1-3 YGA-1-4 Specification: Metal Substrate Layer: 0.8mm1.0mm1.5mm2.0mm3.0mm Copper foil: 1oz2oz3oz4oz6oz (Insulation layer of FR-4) (Insulation layer of high Tg FR-4 ) (Insulation layer of PI)
Size: 1000x600mm; 500x600mm
http://www.standardpcb.com
The Performance 0f YGA-1 series Aluminum-based CCL
Item
Condition A
Typical Value YGA-1-1 2.0 1.8 106 105 106 105 3.0 4.7 0.03 YGA-1-2 2.0 1.8 106 105 106 105 3.0 4.7 0.03 V-0 1.5 0.3 1.5 0.3 600 130 1.4 0.35 600 170 1.3 0.4 600 250 YGA-1-3 1.5 1.5 106 105 106 105 3.0 4.6 0.03 YGA-1-4 1.7 1.7 106 105 106 105 3.0 4.4 0.03
Peel Strength (N/mm)
After Thermal Stress A C-96/35/90 A C-96/35/90 D-48/50+D-0.5/23 C-96/35/90 C-96/35/90 288 2min A Intermal TO-220 Test A A
Surface Resistance (M) Volume Resistivity Break-down Voltage (KV) Dielectric Constant (1MHZ) Dissipation Factor (1MHZ) Thermal Stress Flammability Heat Resistance (/W) Thermal conductivity(W/mK) CTI Tg (V) (DSC)
No Blistering, No Delamination
600 130
*Heat resistance of 1.6mm substrate, the thickness of the copper foil under the 1oz measurements.

Advantage: More high-conductivity and longer service time which compared to the normal and mainly be used for the high-power circuits which have high requirements of good heat dissipation. Application: Hybrid-Power IC
9/1629/16
Audio Equipment :Input and output amplifier; A balance amplifier; Audio Amplifier; Preamplifier; Power Amplifier and so on. Power Supplier: Switch power supplier, DC/DC Converters, SW Regulator and so on Communication equipments: High-frequency increaser; Filter Circuit and Transmitter Circuit Office automation Equipment: Motor Driver and so on. Motor Car: Electronics Regulator; Ignition; Power controller and so on. Computer: CPU Board, Floppy disk Driver, Power supplier and so on. Power Modules: Current Converter, Solid relays; Power rectifier bridges. LED Lighting: High-power LED Lights, LED Curtain Wall and So on. Models: YGA-2-1 YGA-2-2 YGA-2-3 YGA-2-4 YGA-2-5 YGA-2-6 Specification: Metal Substrate Layer: Copper foil: Size: 0.8mm1.0mm1.5mm2.0mm3.0mm 1oz2oz3oz4oz6oz 1000x600mm; 500x600mm ( Insulation layer of high thermal conductivity resin, Thickness 8010um) ( Insulation layer of high thermal conductivity resin, Thickness 10010um) ( Insulation layer of high thermal conductivity resin, Thickness 12010um) ( Insulation layer of high thermal conductivity resin, Thickness 15010um) ( Insulation layer of high thermal conductivity resin, Thickness 18010um) ( Insulation layer of high thermal conductivity resin, Thickness 21010um)

Item Condition A Peel Strength (N/mm) Surface Resistance (M) After Thermal Stress A Typical Value YGA-2-1 1.7 1.7 106 YGA-2-2 1.7 1.7 106 YGA-2-3 1.7 1.7 106 YGA-2-4 1.7 1.7 106 YGA-2-5 1.7 1.7 106 YGA-21.7 1.7 106
9/1639/16
C-96/35/90 Volume Resistivity ((M.m) Break-Down Voltage (KV) Dielectric Constant (1MHz) Dissipation Factor(1MHz) Thermal Stress Flammability Heat Resistance (/W) Thermal conductivity(W/mK) CTI Tg (V) A A (DSC) A C-96-35/90 D-48/50+D-0.5 /23 C-96/35/90+R ecovery C-96/35/90+R ecovery 288 2Min A Intermal TO-220 Test
105 106 105 5 6.5 0.02
105 106 105 6 6.5 0.02
105 106 105 7 6.5 0.02
105 106 105 10 6.5 0.02
105 106 105 12 6.5 0.02
105 106 105 15 6.5 0.02
No Blistering , No delamination V-0 0.65 1.3 600 130 0.8 1.3 600 130 0.95 1.3 600 130 1.1 1.3 600 130 1.3 1.3 600 130 1.5 1.3 600 130

Advantage: More high-conductivity and longer service time which compared to the normal and mainly be used for the high-power circuits which have high requirements of good heat dissipation. Application: Hybrid-Power IC Audio Equipment :Input and output amplifier; A balance amplifier; Audio Amplifier; Preamplifier; Power Amplifier and so on. Power Supplier: Switch power supplier, DC/DC Converters, SW Regulator and so on Communication equipments: High-frequency increaser; Filter Circuit and Transmitter Circuit Office automation Equipment: Motor Driver and so on.
9/1649/16
YGA-4-3 YGA-4-4 YGA-4-5 YGA-4-6 Specification: Metal Substrate Layer: Copper foil: 0.8mm1.0mm1.5mm2.0mm3.0mm 1oz2oz3oz4oz6oz 500x600mm
Size: 1000x600mm;

Item Condition A Peel Strength (N/mm) After Thermal Stress Surface Resistance (M) Volume Resistivity ((M.m) Break-Down Voltage (KV) Dielectric Constant (1MHz) Dissipation Factor(1MHz) Thermal Stress Flammability Heat Resistance (/W) Thermal conductivity(W/mK) CTI Tg (V) A A (DSC) A C-96/35/90 A C-96-35/90 D-48/50+D-0.5 /23 C-96/35/90+R ecovery C-96/35/90+R ecovery 288 2Min A Intermal TO-220 Test 0.45 2.2 600 130 0.60 2.2 600 130 070 2.2 600 130 Typical Value YGA-4-1 1.5 1.5 106 105 106 105 5 7 0.02 YGA-4-2 1.5 1.5 106 105 106 105 6 7 0.02 YGA-4-3 1.5 1.5 106 105 106 105 7 7 0.02 YGA-4-4 1.5 1.5 106 105 106 105 10 7 0.02 YGA-4-5 1.5 1.5 106 105 106 105 12 7 0.02 YGA-4-6 1.5 1.5 106 105 106 105 15 7 0.02
No Blistering , No delamination V-0 0.80 2.2 600 130 0.95 2.2 600 130 1.1 2.2 600 130
9/1659/16
C-96/35/90 Volume Resistivity ((M.m) Break-Down Voltage (KV) Dielectric Constant (1MHz) Dissipation Factor(1MHz) Thermal Stress Flammability Heat Resistance (/W) Thermal conductivity(W/mK) CTI Tg (V) A A (DSC) A C-96-35/90 D-48/50+D-0.5 /23 C-96/35/90+R ecovery C-96/35/90+R ecovery 288 2Min A Intermal TO-220 Test
105 106 105 5 6.5 0.02
105 106 105 6 6.5 0.02
105 106 105 7 6.5 0.02
105 106 105 10 6.5 0.02
105 106 105 12 6.5 0.02
105 106 105 15 6.5 0.02
No Blistering , No delamination V-0 0.65 1.3 600 130 0.8 1.3 600 130 0.95 1.3 600 130 1.1 1.3 600 130 1.3 1.3 600 130 1.5 1.3 600 130

Advantage: More high-conductivity and longer service time which compared to the normal and mainly be used for the high-power circuits which have high requirements of good heat dissipation. Application: Hybrid-Power IC Audio Equipment :Input and output amplifier; A balance amplifier; Audio Amplifier; Preamplifier; Power Amplifier and so on. Power Supplier: Switch power supplier, DC/DC Converters, SW Regulator and so on Communication equipments: High-frequency increaser; Filter Circuit and Transmitter Circuit Office automation Equipment: Motor Driver and so on.
9/1669/16
YGA-4-3 YGA-4-4 YGA-4-5 YGA-4-6 Specification: Metal Substrate Layer: Copper foil: 0.8mm1.0mm1.5mm2.0mm3.0mm 1oz2oz3oz4oz6oz 500x600mm
Size: 1000x600mm;

Item Condition A Peel Strength (N/mm) After Thermal Stress Surface Resistance (M) Volume Resistivity ((M.m) Break-Down Voltage (KV) Dielectric Constant (1MHz) Dissipation Factor(1MHz) Thermal Stress Flammability Heat Resistance (/W) Thermal conductivity(W/mK) CTI Tg (V) A A (DSC) A C-96/35/90 A C-96-35/90 D-48/50+D-0.5 /23 C-96/35/90+R ecovery C-96/35/90+R ecovery 288 2Min A Intermal TO-220 Test 0.45 2.2 600 130 0.60 2.2 600 130 070 2.2 600 130 Typical Value YGA-4-1 1.5 1.5 106 105 106 105 5 7 0.02 YGA-4-2 1.5 1.5 106 105 106 105 6 7 0.02 YGA-4-3 1.5 1.5 106 105 106 105 7 7 0.02 YGA-4-4 1.5 1.5 106 105 106 105 10 7 0.02 YGA-4-5 1.5 1.5 106 105 106 105 12 7 0.02 YGA-4-6 1.5 1.5 106 105 106 105 15 7 0.02
No Blistering , No delamination V-0 0.80 2.2 600 130 0.95 2.2 600 130 1.1 2.2 600 130
9/1679/16

Aluminium Base YGA Specification SPCB

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Aluminium Base YGA Specification SPCB

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YGA-1 series Aluminum based CCL

Advantage: High Heat dissipation, Electromagnetic ShieldingHigh Mechanical StrengthExcellent

Size: 1000x600mm; 500x600mm

The Performance 0f YGA-1 series Aluminum-based CCL

Peel Strength (N/mm)

YGA-2 series Aluminum based CCL

The Performance 0f YGA-2 series Aluminum-based CCL

105 106 105 5 6.5 0.02

105 106 105 6 6.5 0.02

105 106 105 7 6.5 0.02

105 106 105 10 6.5 0.02

105 106 105 12 6.5 0.02

105 106 105 15 6.5 0.02

YGA-3 series Aluminum based CCL

The Performance 0f YGA-4 series Aluminum-based CCL

105 106 105 5 6.5 0.02

105 106 105 6 6.5 0.02

105 106 105 7 6.5 0.02

105 106 105 10 6.5 0.02

105 106 105 12 6.5 0.02

105 106 105 15 6.5 0.02

YGA-3 series Aluminum based CCL

The Performance 0f YGA-4 series Aluminum-based CCL

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