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August 2011
0.60 0.40
1.80
C L
1.10 0.90
Notes: 1. Dimensions for all drawings are in millimeters. 2. Tolerance of 0.15mm on all non-nominal dimensions
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0.60 0.40
1.80
C L
10.4 8.4
0~20
0~20
Notes: 1. Dimensions for all drawings are in millimeters. 2. Tolerance of 0.15mm on all non-nominal dimensions
Schematic
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Symbol
TOPR TSTG TSOL-I TSOL-F EMITTER IF VR IFP PD SENSOR VCEO VECO IC PD
Parameter
Operating Temperature Storage Temperature Soldering Temperature (Iron)(2,3,4) Soldering Temperature (Flow)(2,3)
Rating
-40 to +85 -40 to +90 240 for 5 sec 260 for 10 sec 50 5 1 75 30 5 20 50
Units
C C C C mA V A mW V V mA mW
Continuous Forward Current Reverse Voltage Peak Forward Power Current(5) Dissipation(1)
Parameter
Forward Voltage Reverse Leakage Current Peak Emission Wavelength Collector-Emitter Dark Current
Test Conditions
IF = 20mA VR = 5V IF = 20mA IF = 0mA, VCE = 20V
Min.
Typ.
1.2 940
Max.
1.6 10
Units
V A nm
INPUT DIODE
Notes: 1. Derate power dissipation linearly 1.00mW/C above 25C. 2. RMA ux is recommended. 3. Methanol or isopropyl alcohols are recommended as cleaning agents. 4. Soldering iron 1/16" (1.6mm) from housing. 5. Pulse conditions: tp = 100s; T = 10ms. 6. Measured using an aluminum alloy mirror at d = 1mm. 7. No reective surface at close proximity.
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0.8
0.8
d 0
0.6
0.6
0.4
0.2
0.0 0 1 2 3 4 5
0.0 0 4 8 12 16 20
d-DISTANCE (mm)
Fig. 1 Normalized Collector Current vs. Distance between device and reflector
2.0
100
10-1
10-2 25
40
55
70
85
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tf tr 10 tf tr
30
20
IC = 1 mA
10
0 1.0
1.1
1.2
1.3
1.4
1.5
1 0.1
10
3.0
2.5
2.0 IF = 50 mA IF = 20 mA 1.0 IF = 10 mA
1.5
0.7
0.5
0.0 -40
-20
20
40
60
80
0.6
0.4
0.2
0.2
0.4
0.6
ANGULAR DISPLACEMENT
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2.8 Dimensions in mm
2.00.05
4.0
1.5
0.25
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Reel Dimensions
60.0 0.5
13.0 0.5
Reow Prole
260C max. for 10 sec. max. 1C to 5C/sec 260C
Temperature (C)
Time (seconds)
Note: Reflow soldering should not be done more than twice.
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