INTERNATIONALJOURNALOFAPPLIEDENGINEERINGRESEARCH,DINDIGUL Volume1,No 3,2010 Copyright2010AllrightsreservedIntegratedPublishingAssociation RESEARCHARTICLE ISSN 09764259

EffectofsurfaceradiationonConjugateConvectionfromanelectronic boardwithmultipleembeddeddiscreteheatsources
GururajaRao.C,NarasimhaSuri.T DepartmentofMechanicalEngineering,NationalInstituteofTechnology,[Deemed University],Warangal 506004(A.P.) cgr_gcr@yahoo.co.in ABSTRACT The present paper reports the important results of the problem of combined conduction convectionradiation from a vertical rectangular electronic board equipped with three identicaldiscreteheatsources.Theheatsourcesarelocatedalongtheverticalcentralaxisof theboard.Theheatgeneratedinthethreeheatsourcesisconductedbothalongandacrossthe board,beforesubsequently gettingdissipatedbyconvectionandradiation.Air,aradiatively transparentmedium,isconsideredtobethecoolingagent.Thegoverningpartialdifferential equations for temperature distribution in the entire computational domain are obtained by appropriate energy balance between the heat generated, conducted, convected and radiated. These equations are solved using finite difference formulation coupled with GaussSeidel iterativesolver.Acomputercodeiswrittentosolvetheproblemandexhaustiveparametric studieshavebeencarriedout.Interactiveeffectofradiationonconjugateconvectionhasbeen elucidated. Keywords: Surface radiation, Conduction, Convection, Electronic Board, Discrete Heat Sources,Interaction. 1.Introduction Literature on multimode heat transfer contains several analytical, numerical and experimentalworksinvolvinginterplaybetweentwoormorethantwomodesofheattransfer, viz.,conduction,convectionandradiation.OnesuchinitialworkiscreditedtoZinnes(1970), who presented his analytical and numerical results of laminar natural convection from a vertical, heatconducting, flat plate of finite thickness with an arbitrary heating distribution along its surface. Subsequently, several other researchers came out with their findings on problems of this kind. Specifically, if one looks into the last two decades, Lee and Yovanovich(1989)proposedaquasianalyticalconjugateheattransfermodelthataddresses a two dimensional vertical flat plate provided with arbitrarily sized discrete heat sources dissipating heat by free convection. Tewari and Jaluria (1990) performed an experimental studyonfundamentalaspectsofconjugatemixedconvectionfromtwoheatsourcesoffinite widthandnegligiblethicknesswithauniformheatfluxinputatthesurface. Anumericalcumexperimentalstudyoflaminarmixedconvectionfromaverticalcomposite plate provided with isolated, discontinuous, surface heating elements was performed by Kishinami et al. (1995). Vynnycky and Kimura (1996) solved the problem of two dimensional conjugate free convectionfrom avertical plate in communication with a semi infinite fluid region both by analytical and numerical means. Mendez and Trevino (2000) dealtwithnumericalsolutiontotheproblemofconjugatefreeconvectionfromathinvertical strip with nonuniform internal heat generation. Gururaja Rao et al. (2001) obtained

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numerical solution to the problem of conjugate laminar mixed convection with surface radiation from a vertical plate with a flushmounted discrete heat source. They solved the governing fluid flow and heat transfer equations without boundary layer approximations using a finite volume method. Gururaja Rao et al. (2002) also tackled the geometry of a vertical channel with a discrete heat source in each wall involved in conjugate mixed convection with radiation. Subsequently, Gururaja Rao (2004) considered a traversable discrete heat source along a vertical electronic board involved in buoyancyaided conjugate mixedconvectionwithradiation. KannaandDas(2005)gaveananalyticalsolutionforconjugateforcedconvectionfromaflat plate involved in laminar flow. Gururaja Rao (2007) solved, numerically, the problem of combined conductionconvectionradiation in a vertical channel with multiple discrete heat sources in the left wall. Interplay between conduction, convection and radiation from the geometry of a rectangular cavity with a discrete heat source in its bottom wall has been exploredbyGururaja Rao etal. (2008). Conjugate mixed convection with radiation froma verticalelectronicboardwithmultipleidenticaldiscreteheatsourceshasbeenattemptedby SawantandGururajaRao(2009).Further,thegeometryofanLcornerwithadiscreteheat source in each of its legs and involved in multimode heat transfer has been explored by Gururaja Rao et al. (2009). Very recently, Sawant and Gururaja Rao (2010) solved the problem of conjugate mixed convection with surface radiation from a uniformly heated verticalplate. Areviewofliteraturepointsoutthatanexhaustiveprobeintotheproblemofinteractionof radiation with conjugate convection from a vertical twodimensional electronic board with multiple discrete heat sources has not been reported. On account of this, the present paper aimsatanumericalstudyoftheeffectofradiationoncombinedconductionandconvection fromatwodimensionalrectangularplatewiththreeidenticaldiscreteheatsources. 2.ProblemDefinitionandMathematicalFormulation Figure 1 shows the problem geometry considered in the presented study. It consists of a rectangular slab shaped electronic board of dimensions LW. There are three identical embedded discrete heat sources of dimensions LhLh in this slab. The heat sources are providedalongtheverticalcentralaxisoftheslab,asshown.Thereisoneheatsourceatthe geometriccenteroftheplate,whiletheothertwoheatsourcesaresymmetricallylocatedon eithersideofit.ThebottommostheatsourceandtopmostheatsourceareatadistanceL/8 from the corresponding horizontal boundaries of the rectangular slab. There is a uniform 3 volumetricheatgenerationattherateqv W/m ineachheatsource.Thethermalconductivity andsurfaceemissivityoftherectangularslabare,respectively,kand. The heat generated in the three heat sources is initially conducted along and across the electronic board, before getting dissipated from the boundaries of the device by combined convectionandradiation.ThecoolingmediumisairattemperatureT,whiletheconvection 2 heattransfercoefficientishW/m K.Thegoverningequationsfortemperaturedistributionin the entire computational domain are obtained by making energy balance between the heat generated,conducted,convectedandradiated.Forexample,thegoverningequationforallthe interiornodesofeachofthethreediscreteheatsources,uponenergybalance,turnsouttobe:

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2 T 2T qv + + = 0 k x2 y2

(1) Air[h,T] Lh

k T(x,y) qv Air[h,T] L Air[h,T]

qv

Lh

q v

x,i

y,j W Air[h,T]

Figure1: Schematicoftheproblemgeometrychosenforstudy.

Withregardtointeriornodesinthenonheatsourceportions,thegoverningequationwould beEq.(1)withsourcetermabsent.Foratypicalinterfaceelementbetweenthetopboundary ofthecentralheatsourceandthenonheatsourceportion,theenergybalance turnsouttobe: xy (2) q +q + qv = q + q x, cond, in y, cond, in x, cond, out y, cond, out 4 Assuming that Dx = Dy, and substituting for various terms in the above equation and simplifying,onegets: 2T 2T q + 2 + v = 0 (3) x 2 y 2 k

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For a typical corner element of any of the heat sources, the governing equation for temperaturedistributionissameasEq.(3)withthethirdtermonthelefthandsidereplaced by (q v/4k). With regard to the boundaries of the board, making energy balance on an arbitrarilychosenelementalongtheleftboundary: q =q + q +q + q x, cond, in x, cond, out y, cond, out conv rad (4) Substitution of appropriate expressions for various terms in the above equation and subsequent simplification leads to the following governing equation for temperature distributionalongtheleftboundary oftheboard: 2T 2 T q 2h 2 es 4 4 (5) + + v (T - T ) (T - T ) = 0 2 x Dy2 y k k Dy2 k D y2 With regard to the two corner elements of the left boundary, the governing equation for temperaturedistributionwouldgetmodifiedas:
T Dx2 T h Dx es Dx 4 + (1 + 2 )(T - T ) + (1 + 2 )(T 4 - T ) = 0 x Dy2 y k Dy2 k D y2

(6)

Similartreatmentisusedforobtainingthetemperatureoftheremainingboundariesaswell. 3.SolutionMethodologyandRangesofParameters The governing equations for temperature distribution in the entire computational domain derived as above are nonlinear partial differential equations. They are converted into algebraic equations using finite difference formulation. The resulting equations are later solved using GaussSeidel iterative solver. Full relaxation has been used on temperature 6 during iterations, while a convergent criterion of 10 has been imposed to terminate the ++ iterations.AcomputercodeinC hasbeenwrittentosolvetheproblem. Withregardtorangesofindependentparametersconcerningthepresentproblem,thesurface emissivity of theelectronic board() is variedbetween 0.05 and0.85.Thelower limit of correspondstoapooremitterlikepolishedaluminum,whiletheupperlimitofsignifiesa goodemitterlikeblackpaint.Thethermalconductivity(k)oftheelectronicboardisvaried between0.25W/mKand1W/mK.Thisisdonesoinviewofthefactthatelectronicdevices aretypicallymadeofmaterialsofthermalconductivityoftheorderofunity.Anexampleis glass epoxy that has k = 0.26 W/m K. For convection heat transfer coefficient (h), the 2 2 appropriate range is from 5 W/m K to 100 W/m K. The above limiting values of h, respectively, correspond to asymptotic free convection limit and asymptotic forced convectionlimit.Further,theheight(L)andwidth(W)oftheelectronicboardarefixedat20 cmand10cm,respectively.Themeantemperature(T)ofthecoolingagent(air)istakento o be25 C.

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4.ResultsandDiscussion 4.1.Gridindependencestudy
5 3 Thegridsensitivitytextiscarriedoutintwophasesforastandardinput:qv =10 W/m ,k= 2 0.25W/mK,h=25W/m Kand=0.45.InPhase1ofthestudy,thenumberofgrids(N) in the horizontal direction is arbitrarily fixed at 113. The number of grids in the vertical direction(M)isvaried.Themaximumboardtemperature(Tmax)isfoundtobechangingby 8.37% as M is increased from 171 to 191. A further increase in M brings down the percentagechangeinTmax.ItisnoticedthatTmax changesby5.09%asMincreasesfrom231 to251.AsubsequentslightincreaseinMfrom251to255bringsdownthechangeinTmax to just0.92%.SimultaneoustotheseobservationsonT max,eventheenergybalanceischecked andthebestpossibleenergybalancecheckoccursatM=259.Inviewoftheseobservations, thevalueofMisfinalizedtobe259.

In Phase 2 of the study, the value of M is taken tobe259 as finalized above, while the numberofgridsinhorizontaldirection(N)isvaried.ItisseenthatthoughthevaluesofN 111giveaconvergingTmax,thecheckforenergybalanceisatitsbestforN=113.Inviewof this,the valueofNisfinalizedtobe113.Inboththephasesabove,thenumberofgridsin eachheatsourceistakenas3030.Itisnoticedthatanyothergrid sizeinthe heatsources doesnotgivebetterresultthantheabove.Thus,alltheensuingparametricstudiesarecarried outtakingM=259,N=113andnumberofgridsperheatsource=3030. 4.2Variationoflocaltemperatureintheelectronicboardwithotherparameters Figure 2 shows the local temperature distribution along the axial direction at midplane drawn for five different values of convection heat transfer coefficient (h). The data is 5 3 obtainedforafixedinputofq v =10 W/m ,=0.45andk=0.25W/mK.Foragivenh,the temperature is increasing as one moves from the bottom of the board, reaching a local maximum alittle headof top endof the firstheat source. It isdecreasing again, reachinga local minimumbefore rising again as one reaches the second heat source. Thetemperature now reaches a second maximum exactly at the geometric centre of the board before decreasing again. After reaching a second local minimum, the temperature is shooting up again to a third maximum a little ahead of the top end of the third heat source and is decreasingagain. There is an expected symmetry in the local temperature profile with reference to the geometriccenteroftheboard.Further,thelocalmaximumnoticedatthegeometriccenterof theboardisthelargesttemperatureintheboard,whiletheothertwolocalmaximaoneither side of the above are identical but smaller than the central temperature. The figure further showsthatthetemperatureatanylocationalongtheboarddecreasesashincreasesfrom5to 2 100 W/m K. This is expected because the flow regime transits from free convection dominancetoforcedconvectiondominancewithhincreasingbetweentheabovetwolimits. Inthepresentexample,thelocaltemperatureatthegeometriccenteroftheboarddecreases 2 by24.37%ashincreasesfrom5to100W/m K.

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Localtemperaturedistributionalong theaxialdirection,T(x),oC

2 3

2 5 1.h =5W/m K 4 2 2.h =10W/m K 2 3.h =25W/m K 2 4.h =50W/m K 5 3 qv=10 W/m , =0.45,k=0.25W/mK 2 5.h =100W/m K

Axialdistancealongtheboard,x,m Figure2: Localboardtemperatureprofilesinvariousregimesofconvection. Localtemperaturedistributionalong theaxialdirection,T(x),oC

3 1. =0.05 2. =0.45 3. =0.85

5 3 2 q v=10 W/m ,h =5W/m K,k=0.25W/mK

Axialdistancealongtheboard,x,m Figure3: Localtemperatureprofilesforvarioussurfaceemissivitiesoftheboard. Theeffectofsurfaceemissivity()onlocalaxialtemperaturedistributionatmidplanealong theelectronicboardisasshowninFig.3.Thetrendfollowedbythetemperatureprofilefora given looks similar to what has been noticed in Fig. 2. Further, at a given location, the temperature decreases with increasing owing to increased radiative heat dissipation from theboardwithotherparametersheldfixed.Thefigurefurthershowsacomparatively larger

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dropinlocaltemperaturebetween=0.05and=0.45,whilethedropbetween=0.45and =0.85islesspronounced.Inthepresentexample,thetemperatureatthegeometriccenter of the board decreases by 11.93% as increases from 0.05 to 0.45, while the drop in temperatureisonlyby6.23%assubsequentlyincreasesfrom0.45to0.85. Figure 4 describes the effect of thermal conductivity (k) on local temperature distribution alongtheaxialdirectionatmidplaneoftheelectronicboard.Sixdifferentvaluesofthermal conductivity (k)are chosen as shown. As can beseen, the general trendof the temperature profile is again the same as that seen in Figs. 2 and 3. The local temperature in the board comesdownwithincreasingkonaccountofincreasedpercolationofheatalongtheboard.In thepresentexample,thetemperatureatthegeometriccenteroftheboarddecreasesby81.3% as k increases from 0.25 W/m K to 10 W/m K. However, the temperature profile gets progressivelyflatterwithincreasingthermalconductivityoftheboard.Thismeans,towards larger valuesof k, thereishardly any temperature gradient noticed along the board and the boardalmostappearstobeisothermal. Inorder tobring out the contrast between the local axialtemperatureprofiles pertaining to cases,viz.,(1)allthreeheatsourcespresent,(2)bottomheatsourceonlypresent,(3)middle heatsourceonlypresentand(4)topheatsourceonlypresent,Fig.5hasbeendrawn.Ascan benoticed,thecurve 1resembleswhathasbeenobtainedinthelastthreefigures(Figs.24). Thisisbecausehereallthethreeheatsourcesarepresent.Curve2correspondstothecase thathasonlythebottommostheatsourceintheboard.Thus,thelocaltemperaturehere,after reaching peak somewhere near the top endofthe heat source,diminishes continuously and almostbecomesasymptotictowardsthetrailingedgeoftheboard.Curve3belongstothe casewheretheboardhasonlythecentralheatsource. Thus, the temperature is maximum at the geometric center of the board and decreases symmetrically in both the directions along the vertical axis from here. This is attributed to identicalrateofpercolationofheatoneithersideoftheheatsource.Curve4pertainstothe casethathasonlythetopmostheatsource.Therefore,thetemperatureprofileappearstobe an exact mirror image of curve 2. It can also be noticed that the maximum board temperatureisthelargestincase 1andtheleastincase3.Thisisexpectedbecauseincase 1allthethreeheatsourcesarethere.Thoughincases2to4onlyoneheatsourceistherein theboard,cases2and4havethe heatsourceeithertowardsthebottomendortowardsthe topendoftheboard.Incase3,theheatsourceiscentrallylocated.Inthepresentexample, o o o thevaluesofTmax incases1,2,3and4are,respectively,159.5 C,120.95 C,115.15 Cand o 120.95 C. 4.3Variationofmaximumboardtemperaturewithotherparameters Figure 6 describes the variation of maximum board temperature (Tmax) with surface emissivity () for various values of convection heat transfer coefficient (h). Results are obtained for fivetypical valuesof hstarting from the asymptotic free convection limit of5 2 2 W/m Ktotheasymptoticforcedconvectionlimitof100W/m K.Thereisacleareffectof 2 noticedonTmax forh=5W/m K.Here,Tmax isdecreasingverylargelyfrom=0.05to= 0.85.

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Localtemperaturedistribution alongtheaxialdirection,T(x),oC

5 3 1.k =0.25W/mK, 2. k =0.5W/mK,3.k =0.75W/mK qv=10 W/m 4.k =1W/mK, 5. k =5W/mK, 6.k =10W/mK =0.05 2 h=5W/m K 1

2 4

5 6

Axialdistancealongtheboard,x,m Figure4: Localtemperatureprofilesforvariousthermalconductivitiesoftheboard.

Localtemperaturedistribution alongtheaxialdirection,T(x),oC

1.Threeheatsources,2.Bottomheatsource 3.Middleheatsource,4.Topheatsource

5 3, qv =10 W/m =0.45 2 h=5W/m K k=0.25W/mK

2 3

1 4

Axialdistancealongtheboard,x,m Figure5: Comparisonoflocaltemperatureprofileswithvariousheatsource configurations. ThoughsimilarkindofdecrementinTmax withisnoticedforallothervaluesofhtoo,the degree of decrement is found tobe coming down as one moves towards forced convection limitofh.Thisisattributedtoincreasingdominanceofconvectionoverradiationforlarger values of h. The figure also shows that, for a given surface emissivity, the peak board temperature decreases with increasing h on account of reasons already explained. In the present example, Tmax is decreasing by 17.41% as increases from 0.05 to 0.85, while it 2 decreasesonlyby0.15%betweenthesamelimitsofforh=100W/m K.Likewise,for=

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2 0.05,Tmax isdecreasingbya huge33.34%ashincreases from5to100W/m K,whilethe decreaseinT max isjustby19.4%for=0.85betweenthesamelimitsofh.

Thevariationofmaximumboardtemperature(Tmax)withconvectionheattransfercoefficient (h)fordifferentthermalconductivities(k)oftheboardisshowninFig.7.Sevenvaluesofh andthreevaluesofkareconsideredforstudyasdepictedinthefigure.Foragivenk,Tmax 2 2 decreasessharplyashincreasesfrom5W/m Kand25W/m K,whilethedecreaseinT max is less pronounced towards larger values of h. This implies that the optimum value of h lies 2 somewherearound25W/m Kinthepresentproblem.ThefigurefurthershowsthatTmax,for a given h, decreases with increase ink. Here again the decrease is quitelargebetweenk = 0.25and0.5W/mK,whileasubsequentincreaseinkfrom0.5to1W/mKbringsalesser pronounced drop in Tmax. In the present example, for k = 0.25 W/m K, Tmax decreases by 2 27.4% as h increases from5to25 W/m K, while Tmax is decreasing by just8.18% dueto 2 2 subsequentincreaseofhto100W/m K.Likewise,forh=5W/m K,forexample,Tmax is comingdownby27.48%askincreasesfrom0.25to0.5W/mK.Incontrast,thedecreasein Tmax islesserbetweenk=0.5and1W/mKandisby21.04%.

Maximumtemperature,Tmax,oC

5 3 q v=10 W/m k=0.25W/mK

2 2 1.h=5W/m K,2.h=10W/m K 2 2 3.h=20W/m K,4.h=25W/m K 2 5.h=100W/m K

2 3 4

0.05

0.25

0.45 Emissivity,

0.65

0.85

Figure6:Variationofmaximumboardtemperaturewithemissivityinvarious convectionregimes.

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Maximumtemperature,Tmax,oC

1.k=0.25W/mK 2.k=0.5W/mK 3.k=1W/mK

5 3 qv=10 W/m , =0.05

2 3 100 50 75 2 Convectionheattransfercoefficient,h,W/m K Figure7: Variationofmaximumboardtemperaturewithconvectionheattransfer coefficientfordifferentthermalconductivitiesoftheboard. 5 10 20 25

Variation of maximum board temperature (Tmax) with surface emissivity () is probed for threedifferentthermalconductivitiesoftheboardasshowninFig.8.Thereisahugedropin Tmax, for a given , as k increases from 0.25 to 0.5 W/m K. However, for a subsequent increase in k to 1 W/m K, the drop in Tmax is not that pronounced. In this example, Tmax decreasesby30.29%askincreasesfrom0.25to0.5W/mKfor=0.45.Againstthis,T max furtherdropsonlyby23.61%askincreasesto1W/mKfrom0.5W/mKforthesame.The figurealsoshowsanexpectedprogressivedecreaseinTmax,foragivenk,asincreasesfrom 0.05to0.85.ThereismoreorlessanidenticaldropinTmax betweenthetwolimitingvalues offorallthethreevaluesofkchosen. Maximumtemperature,Tmax,oC 1.k=0.25W/mK,2.k=0.5W/mK 3.k=1W/mK 1 q v=10 W/m , h=5W/m K 2 3
5 3 2

0.6 0.4 0.8 5 5 5 Surfaceemissivity, Figure8: Maximumboardtemperaturewithemissivityfordifferentthermal conductivities. 0.2 5 570

0.0 5

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4.4Relativecontributionsofconvectionandradiationinheatdissipation Figure 9 shows the nature of variation of the relative contributions of convection and radiation in heat dissipation from the board with emissivity () for three typical values of convection heat transfer coefficient. For a given h, thepercentage convective dissipation is progressively decreasing with increasing . The above is accompanied by a corresponding progressive increase in the percentage radiative dissipation. This kind of variation, though noticed with all values of h, is less pronounced for larger values of h. This is because a smallervalueofhimpliesfreeconvection,whichnaturallyresultsinsmallerconvectiveheat dissipation. Thus, increasing here would obviously enhance the rate of radiation heat 2 transferbyalargerextent.Inthepresentexample,forh=5W/m K,anincreaseinfrom 0.05to0.85isincreasingtherelativecontributionofradiationfrom6.71%to52.2%.Ascan beseen,thecurvesbelongingtoconvectiveandradiativedissipationforthisparticularvalue ofharecrossingeachotherfor @0.7745.Further,foragiven,theroleofconvection is increasing with a corresponding decrease in the role of radiation as one transits from free convectiontoforcedconvectiondominantregime,i.e.,smallerhtolargerh.
Relativecontributionsofconvectionandradiation,(%age)

3,a 2,a
5 3 q v=10 W/m , k=0.25W/mK 2 1.h=5W/m K a.Convection 2 2.h=10W/m K b.Radiation 2 3.h=25W/m K

1,a 1,b 2,b 3,b

0.05

0.25

0.45 0.65 Surfaceemissivity,

0.85

Figure9:Relativecontributionsofconvectionandradiationwithemissivityin variousconvectionregimes. 5.ConcludingRemarks The problem of combined conductionconvectionradiation from a vertical rectangular electronic board possessing three identical embeddeddiscrete heat sources has been solved numerically. A computer code making use of finite difference method of solution in conjunction with GaussSeidel solver is written for the purpose. A grid sensitivity test has beencarriedoutandthebestpossiblegridsystemthatgivestheoptimumsolutionvisvis peak board temperature as well as energy balance has been evolved. A detailed probe into local temperature distribution in the board and maximum board temperature is made with 571

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reference to pertinent independent parameters, viz., number of heat sources, thermal conductivity,surfaceemissivityandconvectionheattransfercoefficient.Further,therelative roles played by convection and radiation in carrying the mandated heat load have been studiedwithregardtosurfaceemissivityoftheboardindifferentregimesofconvection. 6.References 1. Gururaja Rao, C., Balaji, C., and Venkateshan, S. P., 2001, Conjugate mixed convectionwithsurfaceradiationfromaverticalplatewithadiscreteheatsource, ASMEJournalofHeatTransfer,123,pp698702. 2. Gururaja Rao, C., Balaji, C., and Venkateshan, S. P., 2002, Effect of surface radiationonconjugatemixedconvectioninaverticalchannelwithadiscreteheat source in each wall, International Journal of Heat and Mass Transfer, 45, pp 33313347. 3. GururajaRao,C.,2004,Buoyancyaidedmixedconvectionwithconductionand surfaceradiationfromaverticalelectronicboardwithatraversablediscrete heat source,NumericalHeatTransfer,PartA:Applications,45,pp935956. 4. Gururaja Rao, C., 2007, Interaction of surface radiation with conduction and convection fromaverticalchannelwithmultiple discreteheatsourcesintheleft wall,NumericalHeatTransfer,PartA:Applications,52,pp831848. 5. GururajaRao,C.,NagabhushanaRao,V.,andKrishnaDas,C.,2008,Simulation studies on multi mode heat transfer from an open cavity with a flush mounted discreteheatsource,HeatandMassTransfer,44,pp727737. 6. Gururaja Rao, C., Santhosh, D., and Vijay Chandra, P.,2009, Multimode heat transferstudiesonLcornerwithmultiplediscreteheatsources,HeatandMass Transfer,45,pp12931302. 7. Kishinami,K.,Saito,H.,andSuzuki,J.,1995,Combinedforcedandfreelaminar convective heat transfer from a vertical plate with coupling of discontinuous surfaceheating,InternationalJournalofNumericalMethodsforHeatandFluid flow,5,pp839851. 8. Kanna, P. R., andDas,M. K.,2005, Conjugate forced convection heat transfer fromaflatplatebylaminarplanewalljetflow,InternationalJournalofHeatand MassTransfer,48,pp28962910. 9. Lee, S., and Yovanovich, M. M.,1989,Conjugate heat transfer from a vertical plate with discrete heat sources under natural convection, ASME Journal of ElectronicPackaging,111,pp261267. 10.Mendez, F., and Trevino, C., 2000, The conjugate conduction natural convectionheattransferalongathinverticalplatewithnonuniforminternalheat generation,InternationalJournalofHeatandMassTransfer,43,pp27392748.

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11.Sawant,S.M.,andGururajaRao,C.,2009,Fluidflowandheattransferstudies and correlations for mixed convection with conduction and radiation from a discretely heated vertical plate, International Journal of Fluid Mechanics Research,36,pp255271. 12.Sawant, S. M., and Gururaja Rao, C., 2010, Combined conductionmixed convectionsurface radiation from a uniformly heated vertical plate, Chemical EngineeringCommunications,197,pp 881899. 13.Tewari,S.S.,andJaluria,Y.,1990,Mixedconvectionheattransferfromthermal sources mounted on horizontal and vertical sources, ASME Journal of Heat Transfer,112,pp975987. 14.Vynnycky,M.,andKimura,S.,1996,Conjugatefreeconvectionduetoaheated verticalplate,InternationalJournalofHeatandMassTransfer,39,pp10671080. 15.Zinnes,A.E,1970,Thecouplingofconductionwithlaminarnaturalconvection from a vertical flat plate with arbitrarysurface heating, ASME Journalof Heat Transfer,92,pp528534.

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