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Silicon on insulator
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(Redirected from Silicon on Insulator) Silicon on insulator (SOI) technology refers to the use of a layered silicon-insulator-silicon substrate in place of conventional silicon substrates in semiconductor manufacturing, especially microelectronics, to reduce parasitic device capacitance, thereby improving performance.[1] SOI-based devices differ from conventional silicon-built devices in that the silicon junction is above an electrical insulator, typically silicon dioxide or sapphire (these types of devices are called silicon on sapphire, or SOS). The choice of insulator depends largely on intended application, with sapphire being used for highperformance radio frequency (RF) and radiation-sensitive applications, and silicon dioxide for diminished short channel effects in microelectronics devices.[2] The insulating layer and topmost silicon layer also vary widely with application.[3] The first industrial implementation of SOI was announced by IBM in August 1998.[4]
Contents
1 Industry need 2 Manufacture of SOI wafers 3 Use in the microelectronics industry 4 Use in high-performance Radio-Frequency (RF) applications 5 Use in photonics 6 See also 7 References 8 External links
SIMOX process
Industry need
The implementation of SOI technology is one of several manufacturing strategies employed to allow the continued miniaturization of microelectronic devices, colloquially referred to as extending Moore's Law. Reported benefits of SOI technology relative to conventional silicon (bulk CMOS) processing include:[5] Lower parasitic capacitance due to isolation from the bulk silicon, which improves power consumption at matched performance.
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Resistance to latchup due to complete isolation of the n- and p-well structures. From a manufacturing perspective, SOI substrates are compatible with most conventional fabrication processes. In general, an SOI-based process may be implemented without special equipment or significant retooling of an existing factory. Among challenges unique to SOI are novel metrology requirements to account for the buried oxide layer and concerns about differential stress in the topmost silicon layer. The primary barrier to SOI implementation is the drastic increase in substrate cost, which contributes an estimated 1015% increase to total manufacturing costs.[6]
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An exhaustive review of these various manufacturing processes may be found in reference [1]
Use in photonics
SOI wafers are widely used in silicon photonics.[22] The crystalline silicon layer on insulator can be used to fabricate optical waveguides and other passive optical devices for integrated optics. The crystalline silicon layer is sandwiched between the buried insulator (Silicon oxide, Sapphire etc.) and top cladding of air (or Silicon oxide or any other low refractive index material). This enables propagation of electromagnetic waves in the waveguides on the basis of total internal reflection.
See also
Intel TeraHertz - similar technology from Intel. Wafer (electronics) Wafer bonding Silicon on sapphire
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References
1. ^ a b Celler, G. K.; Cristoloveanu, S. (2003). "Frontiers of silicon-on-insulator". J Appl Phys 93 (9): 4955. doi:10.1063/1.1558223 (http://dx.doi.org/10.1063%2F1.1558223). 2. ^ Marshall, Andrew; Natarajan, Sreedhar (2002). SOI design: analog, memory and digital techniques. Boston: Kluwer. ISBN 0792376404. 3. ^ Colinge, Jean-Pierre (1991). Silicon-on-Insulator Technology: Materials to VLSI. Berlin: Springer Verlag. ISBN 978-0-7923-9150-0. 4. ^ IBM Advances Chip Technology With Breakthrough For Making Faster, More Efficient Semiconductors (http://www-03.ibm.com/press/us/en/pressrelease/2521.wss) 5. ^ Silicon-on-insulator - SOI technology and ecosystem - Emerging SOI applications (http://www.soiconsortium.org/pdf/Consortium_9april09_final.pdf) by Horacio Mendez, Executive Director of the SOI Industry Consortium, April 9, 2009 6. ^ IBM touts chipmaking technology (http://news.com.com/IBM+touts+chipmaking+technology/2100-1001_3254983.html) 7. ^ U.S. Patent 5,888,297 (http://www.google.com/patents?vid=5888297) Method of fabricating SOI substrate Atsushi Ogura, Issue date: Mar 30, 1999 8. ^ U.S. Patent 5,061,642 (http://www.google.com/patents?vid=5061642) Method of manufacturing semiconductor on insulator Hiroshi Fujioka, Issue date: Oct 29, 1991 9. ^ SIMOX-SOI Technology: Ibis Technology (http://www.ibis.com/simox.htm) 10. ^ "SemiConductor Wafer Bonding: Science and Technology" by Q.-Y. Tong & U. Gsele, Wiley-Interscience, 1998, ISBN 978-0-471-57481-1 11. ^ U.S. Patent 4,771,016 (http://www.google.com/patents?vid=4771016) Using a rapid thermal process for manufacturing a wafer bonded soi semiconductor, George Bajor et al., Issue date: Sep 13, 1988 12. ^ http://www.sigen.com/ 13. ^ ELTRAN - Novel SOI Wafer Technology (http://www.jsapi.jsap.or.jp/Pdf/Number04/CuttingEdge2.pdf), JSAPI vol.4 14. ^ U.S. Patent 5,417,180 (http://www.google.com/patents?vid=5417180) 15. ^ Chip Architect: Intel and Motorola/AMD's 130 nm processes to be revealed (http://chiparchitect.com/news/2000_11_07_process_130_nm.html) 16. ^ Process Technology (http://www.freescale.com/webapp/sps/site/overview.jsp?nodeId=0121000303#soi) 17. ^ Liu, Ansheng; Jones, Richard; Cohen, Oded; Hak, Dani, Nicolaescu, Remus; Fang, Alexander; Paniccia, Mario (01 2005). "Letters to Nature - An all-silicon Raman laser" (http://techresearch.intel.com/spaw2/uploads/files/R817nature03273.pdf). Nature 433: 292294. doi:10.1038/nature03723 (http://dx.doi.org/10.1038%2Fnature03723). 18. ^ http://www.eetimes.com/electronics-news/4210354/Analyst--Intel-to-endorse-SOI-at-22-nm-semiconductor 19. ^ TSMC has no customer demand for SOI technology - Fabtech - The online information source for semiconductor professionals (http://www.fabtech.org/content/view/1698/74/) 20. ^ Chartered expands foundry market access to IBM's 90nm SOI technology (http://www.charteredsemi.com/media/corp/2006n/20060420_IBM_SOI.asp) 21. ^ Madden, Joe. "Handset RFFEs: MMPAs, Envelope Tracking, Antenna Tuning, FEMs, and MIMO" (http://mobile-experts.net/manuals/mexp-rffe-12%20toc.pdf). Mobile Experts. Retrieved 2 May 2012. 22. ^ "Silicon photonics: an introduction" by Graham T. Reed, Andrew P. Knights. WIley. Page 111 (http://books.google.be/books? id=6lsVVvFCBeAC&lpg=PA57&ots=XmqaiUFliA&dq=SOI%20Wafers%20in%20Photonics&hl=en&pg=PA111#v =onepage&q=SOI%20&f=false)
External links
SOI Industry Consortium (http://www.soiconsortium.org/) - a site with extensive information and education
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for SOI technology SOI IP portal (http://www.chipestimate.com/SOI) - A search engine for SOI IP AMDboard (http://www.amdboard.com/soispecial.html) - a site with extensive information regarding SOI technology Advanced Substrate News (http://www.advancedsubstratenews.com/) - a newsletter about the SOI industry, produced by Soitec. MIGAS '04 (http://www.migas.inpg.fr/2004/index.htm) - The 7th session of MIGAS International Summer School on Advanced Microelectronics, devoted to SOI technology and devices. MIGAS '09 (http://www.migas.inpg.fr/) - 12th session of the International Summer School on Advanced Microelectronics: "Silicon on Insulator (SOI) Nanodevices" Retrieved from "http://en.wikipedia.org/w/index.php?title=Silicon_on_insulator&oldid=542576581" Categories: Semiconductor structures Semiconductor technology Microtechnology This page was last modified on 7 March 2013 at 12:50. Text is available under the Creative Commons Attribution-ShareAlike License; additional terms may apply. By using this site, you agree to the Terms of Use and Privacy Policy. Wikipedia is a registered trademark of the Wikimedia Foundation, Inc., a non-profit organization.
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