The SMART Group A guiding Influence in the Electronics Industry

NEPCON

Legislative Directives
Brighton 2004

1. Waste Electrical and Electronic Equipment - WEEE Directive. 2. Restriction of use of certain Hazardous Substances - RoHS Directive.
Cadmium Mercury Hexavalent Chromium

Smart GROUP Lead-free Experience 2

Compone nts in a lead-free environme nt

Lead Polybrominated Biphenyls (PBBs)

Angus Westwater

& - Polybrominated Diphenyl Ethers (PBDEs )

Notes:

Components in a Lead-Free Environment

Termination plating Lead-free Solderability Increased process temperature. - Thermo mechanical fatigue (TMF) - Moisture sensitivity level (MSL) Placement accuracy Self alignment Lead contamination Transition period Tin whiskers

Lead Free Component

1. No change to functionality specification. 2. Qualified to 260 C - 265C soldering temperatures 3. One or Two passes through the soldering process.

Notes:

Typical Termination Lead-Free Solder Plating

Tin, Silver, Copper Tin, Silver Tin, Copper Nickel, Gold (on Copper) Tin (on Nickel) Palladium, Gold Tin, Bismuth SnAgCu - SnAg - SnCu - CuNiAu - Sn - PdAu - SnBi*

Reflow Process Temperature Profiles

Component durability re -qualification i ncrease 10C
+10HC - 250HC flow/wave 67HC - 235HC - 215HC SMD reflow - 183C (eutecti c) 33HC - 235HC - 217HC (Sn3Ag0.5Cu) Possibility to reduce the superheat zone to 12HC (229C) Note: Sn2Cu for wave melting point = 227HC) - 260HC flow/wave - 240HC SMD reflow

Supe rhe at z one 32 HC

Supe rhe at z one 18 HC

Leaded (SnPb) process

* Will be come more viable when lead has been re move d from the solde ring process (PbBi low melting phase )

Lead-free process

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The SMART Group A guiding Influence in the Electronics Industry

Reflow Soldering Profiles for Leadfree Solder

Temperature
a) High peak soldering temperature - Pb free

Termination Solder Plating Processes

Marking Cropping Final test Tape& Reel
Lead-frame Die attach

260 HC 230 HC

b) Longe r above process temp. Pb free

SnAgCu melting point 217 HC

Hopper/feeder approx.
Solder Bath

10,000 pcs/lot Flux sprayer

C) Higher and longer preheating - Pb free

SnPb melting point 183 HC

Bond wires Epoxy Molding

150HC
Ty pical SnPb solde ring te mpe rature profile Ramp Soak Spike Cool

Solder print area Solder Dipping Time Electroplating solution

Increased heat Longer duration

Electroplating anode material (tin)

Barrel Electroplating

Notes:

Component Termination Solderability

Force + Strain gauge & Controller Sample
Molten Solde r pe lle t He ate d block Solde r surface (meniscus)

PCB solder pad wetting - SnPb versus Pb free

REFLO W H EAT
SnPb solder paste

Printer A D

Key parameter Wetting time A D seconds Time

REFLO W Coppe r hallow H EAT Leadfree solder paste

C Max wetting force Force Solde r we tting Upward Force Imme rsion de pth 0.1 mm Downward Force

Total pad coverage with SnPb solder Pb free higher surface tension produces slower wetting (Improvements in nitrogen gas environment)

Point C

Point B
IPC/EIA J-STD-002A

Notes:

Lead Contamination of Solder Joint.

The lead-free Solder Joint

(Thermal cycling - Increase in mechanical fatigue.) Solder joint material by volume Solder paste 70% PCB platting 25% Component plating 5% (SnPb)
Coppe r hallow

Pb free solder paste SnAgCu

SnPb platting 10 thick

Sn10Pb plating Sn37Pb solder Sn plating SnAgCu Not a solderability issue: Inspection

Pb diffusion into solder

& training

SnAgCu+Pb Melting point and solidification can be <180H C

Lead collects in last area to cool. Pb rich region with poor thermal cycling fatigue characteristics

This paper has been downloaded from SMART Group or Nepcon web sites sites www.nepcon.co.uk www.smartgroup.org Email SMART Group at info@smartgroup.org

The SMART Group A guiding Influence in the Electronics Industry

Reflow /Flow Process

(Lead contamination of PCB top side leadfree solder)
Le ad be aring te rminations (SnPb) Le adfree solde r SnAgCu (MP 217 HC)

Lead-free Introduced Tombstone Failures

He at transfe r He at transfe r

Top side solder alloy SnAgCu +Pb (MP < 180 HC)
To p side >170 HC (high risk of lifting)

Faste r solidification

Lead-Free solders
Incre ase d surface te nsion Incre ase d solidification tempe rature range Compone nt miniaturisation Solde r shrink force
Flow process

To p side max 150 HC Courtesy Seiko Epson Lifting pre ve nte d

PCB component pad dimensions/tracking and heat transfer route become critical Further reduction in the PCB assembly process window

Notes:

Tin Plating
Tin (Sn) plating has many desirable qualities.
Easily applied, non toxic Good corrosion protection (shelf life) Excellent solderability.
Sn
Sn

Chip Resistor Construction

Glass* over coating Marking Glass middle coating Inner termination Ag/Pd Top, side & bottom (10 - 30m) Glass under coating

Down Side

SMT Capacitors & Re sistors

Under certain circumstances, spontaneous growths of metallic filaments will grow on the tin termination surfaces.

Alumina substrate

Laser trim

Tin Whiskers

Nickel plating Ni (2 - 12m)

Resistor element RuOx

Lead-Free outer termination Sn/Pb replaced with Sn (5 -12m)

*Pb Glass replaced with resin 1206 and smaller

Notes:

Tin Whiskers
Whiskers also grow on cadmium, zinc, aluminium & lead. Growth is encouraged in tin layers under stress, i.e. electroplated layers ? Electroplated stress, is linked to high plating currents & rapid electroplating process. Electroplating processes can therefore be optimised by component manufacturers to minimise plating stress

Critical Parameters Encouraging Whisker Growth in Component Tin Plating

1. Stress in the tin coating 2. Tin purity 3. Plating thickness 1000 cyc 8.2 m All controllable during the component plating process
* 70 minutes @ 55 C - 30 minutes @ 125 C
Note: human hair approximately 50m

Sn

This paper has been downloaded from SMART Group or Nepcon web sites sites www.nepcon.co.uk www.smartgroup.org Email SMART Group at info@smartgroup.org

The SMART Group A guiding Influence in the Electronics Industry

Tin Whisker Growth Prevention

Optimise electroplating current & plating time. Electroplate Tin (Sn) on nickel (Ni). Similar CTE. During PCB reflow or flow soldering processes. 1. Diffusion of alloys (% 1%) from bulk solder. 2. Action of heating and cooling tin plating relaxes lattice structure. Solder heat

Lead-free BGA Placement, in SnPb Process

(Placement Tolerance)
215C Reflow temperature
SnAgCu Solder balls MP 217C SnPb Solder paste MP 183 C

50% placement error tolerance.

SnPb

Lead-free BGA Placement error tolerance reduced

SnAgCu

Self alignment
SnPb paste

Self alignment reduced

SnPb paste

Tin plating alloys with base SnAgCu solder

NOTE: Sn plated component terminations utilising low temperature conductive adhesive, remain a risk for whisker growth

SnAgCu solder ball will not melt, flow and create surface tension at < 217C

Notes:

Lead-free BGA Placement in SnPb Process (Coplanarity Tolerance)

SnAgCu Solder balls MP 217C SnPb Solder paste (reflow 215 C) Solder ball Coplanarity tolerances cause open solder ball connections if SnAgCu balls do not collapse during SnPb process reflow.

Component Durability to Lead-Free Soldering Temperatures

Higher Temperature

SnAgCu

Longer Duration

Coplanarity tolerance

Notes:

Moisture Sensitive Device (MSD)

Electronic devices encapsulated with plastic compounds and organic packaging materials, absorb moisture.

Impact of Moisture Ingression

Rapid heating during soldering, creates internal vapour pressure and accelerated expansion within the device.

Humidity enters the package by diffusion, collecting at dissimilar material interfaces. Device sensitivity to moisture is classified* by Moisture Sensitivity Level (MSL)

Important - Catastrophic failure or LONG TERM

RELIABILITY compromised.

* IPC/JEDEC J-STD-020B

This paper has been downloaded from SMART Group or Nepcon web sites sites www.nepcon.co.uk www.smartgroup.org Email SMART Group at info@smartgroup.org

The SMART Group A guiding Influence in the Electronics Industry

Component Moisture Ingression Induced Failures

Bond wire dama ge Popcorn effect

Impact of Lead-free Temperatures on MSL

Existing Component MSL classification Existing storage & handling procedures Increased soldering heat Longer heat duration New potential for moisture ingression / solder heat failures

Distortion / cracking

Vapo ur Delamination

Particularly where existing procedures are marginal

Notes:

Actions
1. Re-qualify component MSL. - Component manufacturer 2. Review component storage conditions. Component

Compone nt Moisture Se nsitivity Classification

Component floor life MSL
1 2 2a

Time
Unlimited 1 Year 4 weeks 168 hrs 72 hrs 48 hrs 24 hrs T ime on label (T OL)

Conditions
30C/85%RH 30C/60%RH 30C/60%RH 30C/60%RH 30C/60%RH 30C/60%RH 30C/60%RH 30C/60%RH
Infinite floor life One year One month One week Three days Two days One day Dry before use

user

Industry Standard IPC/JEDEC J-STD - 033A

Handling, Packing, Shipping and Use of Moisture / Reflow Sensitive Surface Mount Devices

3 4 5 5a 6

* IPC/JEDEC J-S TD-020B

Notes:

MSD Component Storage

Sealing Zip Dry Pack

Maintain Reliability
Lead-Free Soldering Process Moisture Ingression Electrostatic Discharge ESD*

Remove from packing at production line Return components to hermetically sealed packing during further storage Humidity ingression is cumulative.

MSL 3

If MSL violated, bake and dry as per

IPC/JEDEC J-STD - 033A

Dry Pack

MSL 6

* Ne pcon 13.00 - 27th May. ESD and how components are damage d

This paper has been downloaded from SMART Group or Nepcon web sites sites www.nepcon.co.uk www.smartgroup.org Email SMART Group at info@smartgroup.org

The SMART Group A guiding Influence in the Electronics Industry

Safe Handling and Storage

IPC/JEDEC J-STD - 033A (MSL) BS EN61340-5-1: 2001 (ESD)

Very likely to be less than the cost of component final test and field failure. Compliance Training - Education & Audit

Notes:

Notes:

This paper has been downloaded from SMART Group or Nepcon web sites sites www.nepcon.co.uk www.smartgroup.org Email SMART Group at info@smartgroup.org