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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

High Voltage C0G Dielectric, 500VDC-3000VDC (Commercial Grade)


Overview
KEMETs high voltage surface mount MLCCs in C0G dielectric feature a 125C maximum operating temperature and are considered stable. The Electronics Components, Assemblies & Materials Association (EIA) characterizes C0G dielectric as a Class I material. Components of this classification are temperature compensating and are suited for resonant circuit applications or those where Q and stability of capacitance characteristics are required. C0G exhibits no change in capacitance with respect to time and voltage and boasts a negligible change in capacitance with reference to ambient temperature. Capacitance change is limited to 30ppm/C from -55C to +125C. These devices exhibit low ESR at high frequencies and find conventional use as snubbers or filters in applications such as switching power supplies and lighting ballasts. Their exceptional performance at high frequencies has made them a preferred choice of design engineers worldwide. In addition to their use in power supplies, these capacitors are widely used in industries related to telecommunications, medical, military, aerospace, semiconductors and test/diagnostic equipment. Non-polar device, minimizing installation concerns 100% pure matte tin-plated end metallization allowing for excellent solderability SnPb plated end metallization option available upon request (5% min)

Benefits

-55C to +125C operating temperature range Pb-Free and RoHS compliant (excluding SnPb end metallization option) EIA 0805, 1206, 1210, 1808, 1812, 1825, 2220 and 2225 case sizes DC voltage ratings of 500V, 630V, 1 KV, 1.5KV, 2 KV, 2.5 KV and 3 KV Capacitance offerings ranging from 1pF to 0.01F Available capacitance tolerances of 0.25pF, 0.5pF, 1%, 2%, 5%, 10% and 20% No piezoelectric noise Extremely low ESR and ESL High thermal stability High ripple current capability Preferred capacitance solution at line frequencies and into the MHz range No capacitance change with respect to applied rated DC voltage Negligible capacitance change with respect to temperature No capacitance decay with time

Applications

Typical applications include switch mode power supplies (input filters, resonators, tank circuits, snubbed circuits, output filters), high voltage coupling and DC blocking, lighting ballasts, voltage multiplier circuits, DC/DC converters and coupling capacitors in uk converters. Markets include power supply, LCD fluorescent backlight ballasts, HID lighting, telecom equipment, industrial and medical equipment/control, LAN/WAN interface, analog and digital modems, and automotive.

Ordering Information
C
Ceramic

1210
Case Size (L" x W") 0805 1206 1210 1808 1812 1825 2220 2225

C
Specification/ Series C = Standard

332
Capacitance Code (pF) 2 Sig. Digits + Number of Zeros Use 9 for 1.0 - 9.9pF Use 8 for 0.5 - .99pF ex. 2.2pF = 229 ex. 0.5pF = 508

J
Capacitance Tolerance1 C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20%

C
Voltage

G
Dielectric

A
Failure Rate/ Design A = N/A

C
End Metallization (Plated)2 C = 100% Matte Sn L = SnPb (5% min)

TU
Packaging/Grade (C-Spec)3 Blank = Bulk TU = 7" Reel Unmarked

C = 500V G = C0G B = 630V D = 1000V F = 1500V G = 2000V Z = 2500V H = 3000V

Additional capacitance tolerance offerings may be available. Contact KEMET for details. Additional termination options may be available. Contact KEMET for details. 3 Additional reeling or packaging options may be available. Contact KEMET for details.
1 2

One WORLD

One Brand

One Strategy

One Focus

One Team

One KEMET
C1009-1 10/12/2010 1

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500VDC-3000VDC (Commercial Grade)

Dimensions Millimeters (Inches)


T

L B

100% Tin or SnPb Plate

Nickel Plate Electrodes Conductive Metalization

EIA Size Code


0805 1206 1210 1808 1812 1825 2220 2225

Metric Size Code


2012 3216 3225 4520 4532 4564 5650 5664

L Length
2.00 (.079) 0.20 (.008) 3.20 (.126) 0.20 (.008) 3.20 (.126) 0.20 (.008) 4.70 (.185) 0.50 (.020) 4.50 (.177) 0.30 (.012) 4.50 (.177) 0.30 (.012) 5.70 (.224) 0.40 (.016) 5.60 (.220) 0.40 (.016)

W Width
1.25 (.049) 0.20 (.008) 1.60 (.063) 0.20 (.008) 2.50 (.098) 0.20 (.008) 2.00 (.079) 0.20 (.008) 3.20 (.126) 0.30 (.012) 6.40 (.252) 0.40 (.016) 5.00 (.197) 0.40 (.016) 6.40 (.248) 0.40 (.016)

B Bandwidth
0.50 (0.02) 0.25 (.010) 0.50 (0.02) 0.25 (.010) 0.50 (0.02) 0.25 (.010) 0.60 (.024) 0.35 (.014) 0.60 (.024) 0.35 (.014) 0.60 (.024) 0.35 (.014) 0.60 (.024) 0.35 (.014) 0.60 (.024) 0.35 (.014)

T Thickness

Mounting Technique
Solder Wave or Solder Reflow

See Table 2 for Thickness

Solder Reflow Only

Qualification/Certification

Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance and Reliability.

Environmental Compliance

Devices with C end metallization option are RoHS PRC ( Peoples Republic of China) compliant. Devices with L end metallization option do no meet RoHS criteria.

Electrical Parameters/Characteristics
Item
Operating Temperature Range: Capacitance Change with Reference to +25C and 0 Vdc Applied (TCC): Aging Rate (Max % Cap Loss/Decade Hour): Dielectric Withstanding Voltage: Dissipation Factor (DF) Maximum Limit @ 25C: Insulation Resistance (IR) Limit @ 25C: Insulation Resistance (IR) Limit @ 125C: -55C to +125C 30PPM/C 0% 150% of rated voltage for voltage rating of < 1000V 120% of rated voltage for voltage rating of 1000V 0.1% 1000 megohm microfarads or 100G 100 megohm microfarads or 10G

Parameters/Characteristics

To obtain IR limit, divide M-F value by the capacitance and compare to G limit. Select the lower of the two limits. Capacitance and Dissipation Factor (DF) measured under the following conditions: 1kHz and 1 Vrms if capacitance >1000pF 1MHz and 1 Vrms if capacitance 1000pF

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

C1009-1 10/12/2010

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500VDC-3000VDC (Commercial Grade)

Table 1A (0805 - 1808 Case Sizes)


Cap Cap Code Series
Voltage Code Voltage DC Cap Tolerance 1.0-2.4 pF 109-249 C D 2.7-5.1 pF 279-519 C D 5.6-9.1 pF 569-919 C D 10 pF 100 C D 11 pF 110 C D 12 pF 120 C D 13 pF 130 C D 15 pF 150 C D 16 pF 160 C D 18 pF 180 C D 20 pF 200 C D 22 pF 220 C D 24 pF 240 C D 27 pF 270 D 30 pF 300 D 33 pF 330 D 36 pF 360 D 39 pF 390 D 43 pF 430 D 47 pF 470 D 51 pF 510 D 56 pF 560 62 pF 620 68 pF 680 75 pF 750 82 pF 820 91 pF 910 100 pF 101 110 pF 111 120 pF 121 130 pF 131 150 pF 151 160 pF 161 180 pF 181 200 pF 201 220 pF 221 240 pF 241 270 pF 271 300 pF 301 330 pF 331 360 pF 361 390 pF 391 430 pF 431 470 pF 471 510 pF 511 560 pF 561 620 pF 621 680 pF 681 750 pF 751 C 821 1210 820 pF 910 pF 911 Case Size 1,000 pF Ceramic 102 (L" x W") 1,100 pF 112 1,200 pF 122 0805 1,300 pF 132 1206 1,500 pF 152 1210 1,600 pF 162 1808 1,800 pF 182 1812 2,000 pF 202 K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M G J K M C K M G J G J K M Specification/ G J K M Series G J K M J K M CG = Standard G J K M G J K M G J K M G J K M G J K M C 500 DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG

C0805
B 630 DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG D 1000 DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG DG C 500 B 630

C1206
D F G C 500 B 630 1000 1500 2000

C1210
D F G C 500 B 630 D 1000 1500 2000

C1808
F G Z H 1000 1500 2000 2500 3000 LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB

Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions
LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LB FM FM FM LB LB LB LB LB LC FM FM FM LB LB LB LB LB LC FG FM FM LA LA LA LA LB LC FG FM FM LA LA LA LA LB LC FG FM FM LA LA LA LA LB LC FG FM FM LA LA LA LA LC LC FG FM FM LA LA LA LA LC LC FG FM FM LA LA LA LA LC LC FG FM FM LA LA LA LA LC LC FG FM FM LA LA LA LB LC LC FG FK FK LA LA LA LB LC LC FG FK FK LA LA LA LB LC LC FG FK FK LA LA LA LB LC LC FG FK FS LA LA LA LB FG FK FS LA LA LA LB FM FS FS LA LB LB LC FM FS FS LA LB LB LC FM FS LA LB LB LC FM FS LA LB LB LC FM FS LA LB LB FM FS LB LB LB FM LB LB LB TU FM A LBC LB LB FM LB LB LB Failure Rate/ End Metallization Packaging/Grade FM LB LB LB 2 Design (Plated) (C-Spec)3 FK LC LC LC FK LC Matte LC SnLC Blank = Bulk A = N/A C = 100% FS LC (5% LC L = SnPb min) LC TU = 7" Reel FS LC LC LC Unmarked FS LC LC LC FS LC LC LC LC 1000 1500 2000 D C1210 F G 500 C 630 B D F C1808 G Z

Cap

Cap Code

1825 2220 Voltage VDC 2225 Voltage Code


Series

F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F

332
Capacitance Code (pF)

EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EF EF EG EF EF EG EF EF EG EF EF EG EF EF EG EF EF EG EF EF EG EF EF EG EF EF EG EF EF EG EF EF EF EF EF EF EF EF EF EF EF EF EF EG EG EF EG EG EF EG EG EF EG EG EF EG EG EF EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG J EG EG Capacitance EG 1

EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG

EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG EG

C
Voltage

Tolerance

2 Sig. Digits + C = 0.25pF Number of Zeros D = 0.5pF Use 9 for F = 1% 1.0 - 9.9pF G = 2% Use 8 for J = 5% 0.5 - .99pF K = 10% 500 630 = 229 1000 500 630 1000 ex. 2.2pF M = 20% ex. C 0.5pF B = 508 D C B D
C0805 C1206

C = 500V B = 630V D = 1000V F = 1500V G = 2000V Z = 2500V 1500 2000 500 H = 3000V
F G C

FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FM FG FG FG FG FG FG FG FG FG FG FG FG FG FG FG FG FG FG FG FG FG FG FG FG FG FG FG FM FG FM FG FM FG FM FG FM FG FM FG FM FG G FM FM FM Dielectric FM FM FM FK FM FK G = C0G FM FS FK FS FK FS FK FS FK 630 B

1000 1500 2000 2500 3000 H

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

C1009-1 10/12/2010

Roll Over for Order Info.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500VDC-3000VDC (Commercial Grade)

Table 1A con't (0805 - 1808 Case Sizes)


Cap
2,200 pF 2,400 pF 2,700 pF 3,000 pF 3,300 pF 3,600 pF

Cap Code
222 242 272 302 332 362

Series
Voltage Code Voltage DC Cap Tolerance F F F F F F G G G G G G J J J J J J K K K K K K M M M M M M 500 C C 500

C0805
B 630 D 1000 C 500 B 630

C1206
D F G C 500 FK FS FS FS FS B 630 1000 1500 2000

C1210
D F G C 500 LC LC LC B 630 D 1000 1500 2000

C1808
F G Z H 1000 1500 2000 2500 3000

Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions

Cap

Cap Code

Voltage VDC Voltage Code Series

630 B C0805

1000 D

500 C

630 B

1000 1500 2000 D C1206 F G

500 C

630 B

1000 1500 2000 D C1210 F G

500 C

630 B

1000 1500 2000 2500 3000 D F C1808 G Z H

Table 1B (1812 - 2225 Case Sizes)


Cap Cap Code
10 pF 100 11 pF 110 12 pF 120 13 pF 130 15 pF 150 16 pF 160 18 pF 180 20 pF 200 22 pF 220 24 pF 240 27 pF 270 30 pF 300 33 pF 330 36 pF 360 39 pF 390 43 pF 430 47 pF 470 51 pF 510 56 pF 560 62 pF 620 68 pF 680 75 pF 750 82 pF 820 91 pF 910 100 pF 101 110 pF 111 120 pF 121 130 pF 131 C 150 pF 151 160 pF Ceramic 161 180 pF 181 200 pF 201 220 pF 221 240 pF 241 270 pF 271 300 pF 301 330 pF 331 C C C C C C C C C C

Series
Voltage Code Voltage DC Cap Tolerance D D D D D D D D D D D D D D D D D D J K M GK J K M GK J K M GK J K M GK J K M GK J K M GK J K M GK J K M GK J K M GK J K M GK J K M GK J K M GK J K M GK J K M GK J K M GK J K M GK J K M GK J K M GK J K M GK J K M GK J K M GK J K M GK J K M GK J K M GK J K M GK J K M GK J K M GK J K C M GK J K M GK cation/ JSpecifi K M GK Series J K M GK J K M GH C = Standard J K M GH J K M GH J K M GH J K M GH J K M GH C C B

C1812
D F G Z H C B

C1825
D F G Z H C B

C2220
D F G Z H C B

C2225
D F G Z H

500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000

Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions
GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK 332 GK GK GK GK GK GK GK GK Capacitance GK GK GK GK GK Code GK GK GK(pF) GK GK GH GH GH GH GK 2 Sig. Digits + GH GH GH GH GK Number of Zeros GH GH GH GH GK Use 9 for GH GH GH GH GK 1.0 -GH 9.9pF GH GH GH GK Use 8 for GH GH GH GH GK GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG HG GK HG J HG GK HG HG Capacitance GK HG HG 1 Tolerance GK HG HG HE HE C = 0.25pF HE HE D = 0.5pF HE HE F = 1% HE HE G = 2% HE HE J = 5% HE HE HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG HG C HG HG HG HG HG Voltage HG HG HG HG HG HE HE HE C = 500V HE HE HE B = 630V HE HE HE D= 1000V HE HE HE F= 1500V HE HE HE G= 2000V HE HE HE D HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG HG JP JP JP JP JP JP JP KF HG G HG JP JP AJP JP JP JP C JP KF HG HG JP JP JP JP JP JP JP KF Rate/ HG HG JP Failure JP JP JP End JP Metallization JP JP KF Dielectric 2 Design HG HG JP JP JP JP JP (Plated) JP JP KF HE HG JP JP JP JP JP JP JP KF G = C0G A = N/A C = 100% Matte Sn HE HG JP JP JP JP JP JP JP KF L = SnPb (5% min) HE HG JP JP JP JP JP JP JP KE HE HG JP JP JP JP JP JP JP KE HE HG JP JP JP JP JP JP JP KE HE HG JE JE JE JE JE JP JP KE Z H C B D F C2220 G Z H C KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KFTU KF KF KF KF KF KF Packaging/Grade KF KF KF KF KF (C-Spec) KF KF 3 KF KF KF KF KF Blank = Bulk KF KF KF KF TU = 7" Reel KE KE KE KE Unmarked KE KE KE KE KE KE KE KE KE KE KE KE B D F C2225 G KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KE KE KE KE Z KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF H

G G G G G G F G F G F G F G F G F G F G F G F G F G F G F G F G F G F G F G F G F G 1210 F G Case Size F G (L" x W") F G F G 0805 F G 1206 F G 1210 F G 1808 F G 1812 F G

Cap

Cap Code

1825 Voltage DC 2220 Voltage 2225 Code


Series

500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000 H C B F G C1812 C1825

0.5 - .99pF ex. 2.2pF = 229 B ex. D0.5pF F = 508 G Z

K = 10% M = 20%

Z = 2500V H = 3000V

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

C1009-1 10/12/2010

Roll Over for Order Info.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500VDC-3000VDC (Commercial Grade)

Table 1B con't (1812 - 2225 Case Sizes)


Cap
360 pF 390 pF 430 pF 470 pF 510 pF 560 pF 620 pF 680 pF 750 pF 820 pF 910 pF 1,000 pF 1,100 pF 1,200 pF 1,300 pF 1,500 pF 1,600 pF 1,800 pF 2,000 pF 2,200 pF 2,400 pF 2,700 pF 3,000 pF 3,300 pF 3,600 pF 3,900 pF 4,300 pF 4,700 pF 5,100 pF 5,600 pF 6,200 pF 6,800 pF 7,500 pF 8,200 pF 9,100 pF 10,000 pF

Cap Code
361 391 431 471 511 561 621 681 751 821 911 102 112 122 132 152 162 182 202 222 242 272 302 332 362 392 432 472 512 562 622 682 752 822 912 103

Series
Voltage Code Voltage DC Cap Tolerance F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M GK GK GK GK GH GH GH GH GH GH GH GH GH GH GH GK GK GK GK GK GK GK GK GK GK GK C B

C1812
D F G Z H C B

C1825
D F G Z H C B

C2220
D F G Z H C B

C2225
D F G Z H

500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000

Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions
GK GK GK GK GH GH GH GH GH GH GH GH GK GK GK GK GK GK GK GK GK GK GK GK GH GH GH GH GH GH GH GH GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GK GH GK GK GK GK GK GK GK HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HG HG HG HG HG HG HG HG HG HG HG HG HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HG HG HG HG HG HG HG HG HG HG HG HG HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HE HG HG HG HG HG HG HG HG HG HG HG HG HE HE HE HE HE HE HE HE HG HG HG HG HG HG HG HG HG HG HE HE HE HE HE HG HG HG HG HG HG HG HG HG HE HG JE HE HG JE HE JE HE JE HE JP HE JP HE JP HG JE HG JE HG JE HG JE HG JE JE JE JE JE JE JE JE JE JP JP JP JP JP JP JP JP JP JP JP JP JP JP JE JE JE JE JP JP JP JE JE JE JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JE JE JE JE JP JP JP JE JE JE JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JE JE JE JE JP JP JP JP JP JP JP JP JP JP JP JP JP JP JE JE JE JE JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP JP KE KE KE KF KF KF KF KF KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KF KF KF KF C KE KE KE KF KF KF KF KF KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KF KF KF KF KF KF KF KF KE KE KE KF KF KF KF KF KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KE KF KF KF KF KF KF KF KF KE KE KE KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KF KE KE KE KE KE KE KE KE KE KE KE KE KF KF KF KF KE KE KE KE KE KE KF KF KF KF KF KF KF KF KF KF KF KF KF KF

Cap

Cap Code

Voltage DC Voltage Code Series

500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000 500 630 1000 1500 2000 2500 3000 C B D F C1812 G Z H C B D F C1825 G Z H C B D F C2220 G Z H B D F C2225 G Z H

C
Ceramic

1210
Case Size (L" x W") 0805 1206 1210 1808 1812 1825 2220 2225

C
Specification/ Series C = Standard

332
Capacitance Code (pF) 2 Sig. Digits + Number of Zeros Use 9 for 1.0 - 9.9pF Use 8 for 0.5 - .99pF ex. 2.2pF = 229 ex. 0.5pF = 508

J
Capacitance Tolerance1 C = 0.25pF D = 0.5pF F = 1% G = 2% J = 5% K = 10% M = 20%

C
Voltage

G
Dielectric

A
Failure Rate/ Design A = N/A

C
End Metallization (Plated)2 C = 100% Matte Sn L = SnPb (5% min)

TU
Packaging/Grade (C-Spec)3 Blank = Bulk TU = 7" Reel Unmarked

C = 500V G = C0G B = 630V D = 1000V F = 1500V G = 2000V Z = 2500V H = 3000V

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

C1009-1 10/12/2010

Roll Over for Order Info.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500VDC-3000VDC (Commercial Grade)

Table 2 Chip Thickness / Packaging Quantities


Thickness Code
AA AB BB CB CC CD DC DD DL DE DF DG DH EB EK EC EN ED EE EF EM EG EH EJ FB FC FD FE FF FG FL FO FH FP FM FJ FN FT FK FR FS PA MA NA NA LD LA LB LC GB GC GD GE GH GF GG GK GJ GN GL GM GO HB HC HD HE HF HG JB JC JD JE JF JP JG JH JO KB KC KD KE KF

Chip Size
01005 0201 0402 0603 0603 0603 0805 0805 0805 0805 0805 0805 0805 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1220 1632 1706 1706 1808 1808 1808 1808 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1825 1825 1825 1825 1825 1825 2220 2220 2220 2220 2220 2220 2220 2220 2220 2225 2225 2225 2225 2225

Thickness Range (mm)


0.20 0.02 0.30 0.03 0.50 0.05 0.80 0.07 0.80 0.10 0.80 0.15 0.78 0.10 0.90 0.10 0.95 0.10 1.00 0.10 1.10 0.10 1.25 0.15 1.25 0.20 0.78 0.10 0.80 0.10 0.90 0.10 0.95 0.10 1.00 0.10 1.10 0.10 1.20 0.15 1.25 0.15 1.60 0.15 1.60 0.20 1.70 0.20 0.78 0.10 0.90 0.10 0.95 0.10 1.00 0.10 1.10 0.10 1.25 0.15 1.40 0.15 1.50 0.20 1.55 0.15 1.60 0.20 1.70 0.20 1.85 0.20 1.85 0.20 1.90 0.20 2.10 0.20 2.25 0.20 2.50 0.20 0.80 0.10 0.80 0.10 0.90 0.10 0.90 0.10 0.90 0.10 1.40 0.15 1.60 0.15 2.00 0.15 1.00 0.10 1.10 0.10 1.25 0.15 1.30 0.10 1.40 0.15 1.50 0.10 1.55 0.10 1.60 0.20 1.70 0.15 1.70 0.20 1.90 0.20 2.00 0.20 2.50 0.20 1.10 0.15 1.15 0.15 1.30 0.15 1.40 0.15 1.50 0.15 1.60 0.20 1.00 0.15 1.10 0.15 1.30 0.15 1.40 0.15 1.50 0.15 1.60 0.20 1.70 0.15 1.80 0.15 2.40 0.15 1.00 0.15 1.10 0.15 1.30 0.15 1.40 0.15 1.60 0.20

Qty per Reel 7" Plastic

Qty per Reel 13" Plastic

Qty per Reel 7" Paper


15000 15000 10000 4000 4000 4000 4000 4000

Qty per Reel 13" Paper


50000 10000 10000 10000 10000 10000

Qty per Bulk Cassette


50000 15000

4000 2500 2500 2500 2500 4000 2000 4000 4000 2500 2500 2500 2500 2000 2000 2000 4000 4000 4000 2500 2500 2500 2000 2000 2000 2000 2000 2000 2000 1500 2000 2000 1000 4000 4000 4000 4000 2500 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 500 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 500 1000 1000 1000 1000 1000

10000 10000 10000 10000 10000 10000 8000 10000 10000 10000 10000 10000 10000 8000 8000 8000 10000 10000 10000 10000 10000 10000 8000 8000 8000 8000 8000 8000 8000 4000 8000 8000 4000 10000 10000 10000 10000 10000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 2000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 2000 4000 4000 4000 4000 4000

4000

10000

Package Quantity Based on Finished Chip Thickness Specifications

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

C1009-1 10/12/2010

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500VDC-3000VDC (Commercial Grade)

Soldering Process

Recommended Soldering Technique: Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 All other EIA case sizes are limited to solder reflow only Recommended Soldering Profile: KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020

Table 3 Chip Capacitor Land Pattern Design Recommendations per IPC-7351


EIA Size Code
01005 0201 0402 0603 0805 1206 1210 1808 1812 1825 2220 2225

Metric Size Code


0402 0603 1005 1608 2012 3216 3225 4520 4532 4564 5650 5664

Density Level A: Maximum (Most) Land Protrusion (mm)


C 0.33 0.38 0.50 0.90 1.00 1.60 1.60 2.30 2.15 2.15 2.75 2.70 Y 0.46 0.56 0.72 1.15 1.35 1.35 1.35 1.75 1.60 1.60 1.70 1.70 X 0.43 0.52 0.72 1.10 1.55 1.90 2.80 2.30 3.60 6.90 5.50 6.90 V1 1.60 1.80 2.20 4.00 4.40 5.60 5.65 7.40 6.90 6.90 8.20 8.10 V2 0.90 1.00 1.20 2.10 2.60 2.90 3.80 3.30 4.60 7.90 6.50 7.90 C 0.28 0.33 0.45 0.80 0.90 1.50 1.50 2.20 2.05 2.05 2.65 2.60

Density Level B: Median (Nominal) Land Protrusion (mm)


Y 0.36 0.46 0.62 0.95 1.15 1.15 1.15 1.55 1.40 1.40 1.50 1.50 X 0.33 0.42 0.62 1.00 1.45 1.80 2.70 2.20 3.50 6.80 5.40 6.80 V1 1.30 1.50 1.90 3.10 3.50 4.70 4.70 6.50 6.00 6.00 7.30 7.20 V2 0.70 0.80 1.00 1.50 2.00 2.30 3.20 2.70 4.00 7.30 5.90 7.30 C 0.23 0.28 0.40 0.60 0.75 1.40 1.40 2.10 1.95 1.95 2.55 2.50

Density Level C: Minimum (Least) Land Protrusion (mm)


Y 0.26 0.36 0.52 0.75 0.95 0.95 0.95 1.35 1.20 1.20 1.30 1.30 X 0.23 0.32 0.52 0.90 1.35 1.70 2.60 2.10 3.40 6.70 5.30 6.70 V1 1.00 1.20 1.60 2.40 2.80 4.00 4.00 5.80 5.30 5.30 6.60 6.50 V2 0.50 0.60 0.80 1.20 1.70 2.00 2.90 2.40 3.70 7.00 5.60 7.00

Density Level A: For low-density Product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC standard 7351 (IPC-7351).

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

C1009-1 10/12/2010

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500VDC-3000VDC (Commercial Grade)

Table 4 Performance & Reliability: Test Methods and Conditions


Stress
Ripple Current Terminal Strength Board Flex

Reference
Heat Generation T : 20C max. JIS-C-6429 JIS-C-6429

Test or Inspection Method


Reflow solder the capacitor onto a PC board and apply voltage with 10kHz~1Mhz sine curve. (Ripple voltage must be < rated voltage) Appendix 1, Note: Force of 1.8kg for 60 seconds. Appendix 2, Note: 2mm (min) for all except 3mm for C0G. Magnification 50X. Conditions:

Solderability

J-STD-002

a) Method B, 4 hrs @ 155C, dry heat @ 235C b) Method B @ 215C category 3 c) Method D, category 3 @ 260C

Temperature Cycling Biased Humidity Moisture Resistance Thermal Shock High Temperature Life Storage Life Mechanical Shock Resistance to Solvents

JESD22 Method JA-104 MIL-STD-202 Method 103 MIL-STD-202 Method 106 MIL-STD-202 Method 107 MIL-STD-202 Method 108 MIL-STD-202 Method 108 MIL-STD-202 Method 213 MIL-STD-202 Method 215

1000 Cycles (-55C to +125C), Measurement at 24 hrs. +/- 2 hrs after test conclusion. Load Humidity: 1000 hours 85C/85%RH and 300VDC Max. Add 100K ohm resistor. Measurement at 24 hrs. +/- 2 hrs after test conclusion. Low Volt Humidity: 1000 hours 85C/85%RH and 1.5V. Add 100K ohm resistor. Measurement at 24 hrs. +/- 2 hrs after test conclusion. t = 24 hours/cycle. Steps 7a & 7b not required. Unpowered. Measurement at 24 hrs. +/- 2 hrs after test conclusion. -55C/+125C. Note: Number of cycles required-300, Maximum transfer time-20 seconds, Dwell time-15 minutes. Air-Air. 1000 hours at 125C (85C for X5R, Z5U and Y5V) with rated voltage applied. 150C, 0VDC, for 1000 Hours. Figure 1 of Method 213, Condition F. Add Aqueous wash chemical - OKEM Clean or equivalent.

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

C1009-1 10/12/2010

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500VDC-3000VDC (Commercial Grade)

Tape & Reel Packaging Information

KEMET offers Multilayer Ceramic Chip Capacitors packaged in 8mm, 12mm and 16mm tape on 7" and 13" reels in accordance with EIA standard 481. This packaging system is compatible with all tape fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips.

Bar Code Label

Anti-Static Reel

KE

ME

Embossed Plastic* or Punched Paper Carrier.

Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 & 2225 Military)

Sprocket Holes
Embossment or Punched Cavity 8mm, 12mm or 16mm Carrier Tape

178mm (7.00") or 330mm (13.00")

Anti-Static Cover Tape (.10mm (.004") Max Thickness)

*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.

Table 5 Carrier Tape Configuration (mm)


EIA Case Size
01005 - 0402 0603 - 1210 1805 - 1808 1812 KPS 1210 KPS 1812 & 2220 Array 0508 & 0612

Tape size (W)*


8 8 12 12 12 16 8

Pitch (P1)*
2 4 4 8 8 12 4

*Refer to Figure 1 for W and P1 carrier tape reference locations. *Refer to Table 6 for tolerance specifications. KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com C1009-1 10/12/2010 9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500VDC-3000VDC (Commercial Grade)

Figure 1 Embossed (Plastic) Carrier Tape Dimensions


T T2 P2 Do Po
[10 pitches cumulative tolerance on tape 0.2 mm]

E1

Ao F Ko B1 Bo E2 W

S1 T1
Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o. Center Lines of Cavity

P1 D 1
Embossment For cavity size, see Note 1 Table 5

User Direction of Unreeling

Table 6 Embossed (Plastic) Carrier Tape Dimensions


Metric will govern Constant Dimensions Millimeters (Inches)
Tape Size 8mm 12mm 16mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) D0 D1 Min. Note 1 1.0 (0.039) 1.5 (0.059) E1 P0 P2 R Ref. Note 2 25.0 (0.984) 30 (1.181) S1 Min. Note 3 0.600 (0.024) T Max. T1 Max.

1.75 0.10 (0.069 0.004)

4.0 0.10 (0.157 0.004)

2.0 0.05 (0.079 0.002)

0.600 (0.024)

0.100 (0.004)

Variable Dimensions Millimeters (Inches)


Tape Size 8mm 12mm 16mm Pitch Single (4mm) Single (4mm) & Double (8mm) Triple (12mm) B1 Max. Note 4 4.35 (0.171) 8.2 (0.323) 12.1 (0.476) E2 Min. 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) F 3.5 0.05 (0.138 0.002) 5.5 0.05 (0.217 0.002) 5.5 0.05 (0.217 0.002) P1 4.0 0.10 (0.157 0.004) 8.0 0.10 (0.315 0.004) 8.0 0.10 (0.315 0.004) T2 Max 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) W Max 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) A0,B0 & K0

Note 5

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 5). 3. If S1<1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20 maximum for 8 and 12mm tapes and 10 maximum for 16mm tapes (see Figure 3). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8mm and 12mm wide tape and to 1.0mm maximum for 16mm tape (see Figure 4). (e) for KPS Series product A0 and B0 are measured on a plane 0.3mm above the bottom of the pocket. (f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.

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C1009-1 10/12/2010

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500VDC-3000VDC (Commercial Grade)

Figure 2 Punched (Paper) Carrier Tape Dimensions


T Do P2 Po
[10 pitches cumulative tolerance on tape 0.2 mm]

E1

A0

F E2 W

Bottom Cover Tape

B0

T1

P1
Top Cover Tape

T1

Center Lines of Cavity

Cavity Size, See Note 1, Table 7 Bottom Cover Tape

User Direction of Unreeling

Table 7 Punched (Paper) Carrier Tape Dimensions


Metric will govern Constant Dimensions Millimeters (Inches)
Tape Size 8mm D0 1.5 +0.10-0.0 (0.059 +0.004, -0.0) E1 1.75 0.10 (0.069 0.004) P0 4.0 0.10 (0.157 0.004) P2 2.0 0.05 (0.079 0.002) T1Max 0.10 (.004) Max. G Min 0.75 (.030) R Ref. Note 2 25 (.984)

Variable Dimensions Millimeters (Inches)


Tape Size 8mm 8mm Pitch Half (2mm) Single (4mm) E2 Min 6.25 (0.246) F 3.5 0.05 (0.138 0.002) 2.0 0.05 (0.079 0.002) 4.0 0.10 (0.157 0.004) P1 T Max 1.1 (0.098) W Max 8.3 (0.327) 8.3 (0.327) A0 B 0 Note 5

1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that: a) the component does not protrude beyond either surface of the carrier tape. b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4). e) see Addendum in EIA Document 481 for standards relating to more precise taping requirements. 2. The tape with or without components shall pass around R without damage (see Figure 5).

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

C1009-1 10/12/2010

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500VDC-3000VDC (Commercial Grade)

Packaging Information Performance Notes


Tape Width
8mm 12mm & 16mm

1. Cover Tape Break Force: 1.0 Kg Minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Peel Strength
0.1 Newton to 1.0 Newton (10gf to 100gf) 0.1 Newton to 1.3 Newton (10gf to 130gf)

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 30010 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA-556 and EIA-624.

Figure 3 Maximum Component Rotation


T

Maximum Component Rotation Top View


Typical Pocket Centerline

Maximum Component Rotation Side View


s

Bo

Tape Width (mm) 8,12 16-200

Maximum Rotation ( 20 10

T)

Typical Component Centerline

Ao

Tape Width (mm) 8,12 16-56 72-200

Maximum Rotation ( 20 10 5

S)

Figure 4 Maximum Lateral Movement


8mm & 12mm Tape
0.5 mm maximum 0.5 mm maximum

16mm Tape
1.0 mm maximum 1.0 mm maximum

Figure 5 Bending Radius


Embossed Carrier Punched Carrier

Bending Radius

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

C1009-1 10/12/2010

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500VDC-3000VDC (Commercial Grade)

Figure 6 Reel Dimensions


Full Radius, See Note Access Hole at Slot Location ( 40 mm min.)

W3 (Includes

flange distortion at outer edge)

W2 (Measured at hub) A D
(See Note)

C
(Arbor hole diameter) If present, tape slot in core for tape start: 2.5 mm min. width x 10.0 mm min. depth

N W1 (Measured at hub)

(see Note)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

Table 8 Reel Dimensions


Metric will govern Constant Dimensions Millimeters (Inches)
Tape Size 8mm 12mm 16mm A 178 0.20 (7.008 0.008) or 330 0.20 (13.000 0.008) B Min 1.5 (0.059) C 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) D Min 20.2 (0.795)

Variable Dimensions Millimeters (Inches)


Tape Size 8mm 12mm 16mm 50 (1.969) N Min 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) W1 W2 Max 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) W3 Shall accommodate tape width without interference

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

C1009-1 10/12/2010

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500VDC-3000VDC (Commercial Grade)

Figure 7 Tape Leader & Trailer Dimensions


Embossed Carrier Punched Carrier 8 mm & 12 mm only Carrier Tape Round Sprocket Holes

END

START
Top Cover Tape

Elongated Sprocket Holes (32 mm tape and wider)

Trailer 160 mm minimum,


Top Cover Tape

Components

100 mm Min. Leader 400 mm Minimum,

Figure 8 Maximum Camber


Elongated sprocket holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes

1 mm maximum, either direction

Straight Edge
250 mm

KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com

C1009-1 10/12/2010

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500VDC-3000VDC (Commercial Grade)

Figure 9 Bulk Cassette Packaging (Ceramic Chips Only)


Meets Dimensional Requirements IEC-286 and EIAJ 7201
Unit mm *Reference
6 8 0.1 8 8 0.1 12.0 0.1
1.5 2.0 3.0
0.1 0 0 0.1 0.2 0

53 3* 31.5 0.2 0 36 0 0.2 19.0*

10*

110 0.7

5 0*

Table 9 Capacitor Dimensions for Bulk Cassette


Cassette Packaging Millimeters EIA Size Metric Size L Length Code Code
0402 0603 1005 1608 1.0 0.05 1.6 0.07

W Width
0.5 0.05 0.8 0.07

B Bandwidth
0.2 to 0.4 0.2 to 0.5

S Separation minimum
0.3 0.7

T Thickness
0.5 .05 0.8 .07

Number of Pcs/Cassette
50,000 15,000

Table 10 Capacitor Marking

Laser marking is available as an extra-cost option for most KEMET ceramic chips. Such marking is two sided, and includes a K to identify KEMET, followed by two characters (per EIA-198) to identify the capacitance value. Note that marking is not available for any Y5V chip. ln addition, the 0603 marking option is limited to the K only. (Marking Optional Not Available for 0402 Size)
Numeral Alpha Character
A B C D E F G H J K L M N P Q R S T U V W X Y Z a b d e f m n t y

Capacitance (pF) For Various Numeral Identifiers


9 0.1 0.11 0.12 0.13 0.15 0.16 0.18 0.2 0.22 0.24 0.27 0.3 0.33 0.36 0.39 0.43 0.47 0.51 0.56 0.62 0.68 0.75 0.82 0.91 0.25 0.35 0.4 0.45 0.5 0.6 0.7 0.8 0.9 0 1 1.1 1.2 1.3 1.5 1.6 1.8 2 2.2 2.4 2.7 3 3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 2.5 3.5 4 4.5 5 6 7 8 9 1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62 68 75 82 91 25 35 40 45 50 60 70 80 90 2 100 110 120 130 150 160 180 200 220 240 270 300 330 360 390 430 470 510 560 620 680 750 820 910 250 350 400 450 500 600 700 800 900 3 1000 1100 1200 1300 1500 1600 1800 2000 2200 2400 2700 3000 3300 3600 3900 4300 4700 5100 5600 6200 6800 7500 8200 9100 2500 3500 4000 4500 5000 6000 7000 8000 9000 4 10000 11000 12000 13000 15000 16000 18000 20000 22000 24000 27000 30000 33000 36000 39000 43000 47000 51000 56000 62000 68000 75000 82000 91000 25000 35000 40000 45000 50000 60000 70000 80000 90000 5 100000 110000 120000 130000 150000 160000 180000 200000 220000 240000 270000 300000 330000 360000 390000 430000 470000 510000 560000 620000 680000 750000 820000 910000 250000 350000 400000 450000 500000 600000 700000 800000 900000 6 1000000 1100000 1200000 1300000 1500000 1600000 1800000 2000000 2200000 2400000 2700000 3000000 3300000 3600000 3900000 4300000 4700000 5100000 5600000 6200000 6800000 7500000 8200000 9100000 2500000 3500000 4000000 4500000 5000000 6000000 7000000 8000000 9000000 7 10000000 11000000 12000000 13000000 15000000 16000000 18000000 20000000 22000000 24000000 27000000 30000000 33000000 36000000 39000000 43000000 47000000 51000000 56000000 62000000 68000000 75000000 82000000 91000000 25000000 35000000 40000000 45000000 50000000 60000000 70000000 80000000 90000000

Example shown is 1,000 pF capacitor

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500VDC-3000VDC (Commercial Grade)

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Disclaimer

All product specifications, statements, information and data (collectively, the Information) are subject to change without notice. All Information given herein is believed to be accurate and reliable, but is presented without guarantee, warranty, or responsibility of any kind, expressed or implied. Statements of suitability for certain applications are based on our knowledge of typical operating conditions for such applications, but are not intended to constitute and we specifically disclaim any warranty concerning suitability for a specific customer application or use. This Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise provided by us with reference to the use of our products is given gratis, and we assume no obligation or liability for the advice given or results obtained. Although we design and manufacture our products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage. Although all product-related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicated or that other measures may not be required.

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C1009-1 10/12/2010

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) High Voltage C0G Dielectric, 500VDC-3000VDC (Commercial Grade)

KEMET Corporation World Headquarters


2835 KEMET Way Simpsonville, SC 29681 Mailing Address: P.O. Box 5928 Greenville, SC 29606 www.kemet.com Tel: 864-963-6300 Fax: 864-963-6521

Europe
Southern Europe
Geneva, Switzerland Tel: 41-22-715-0100 Paris, France Tel: 33-1-4646-1009 Sasso Marconi, Italy Tel: 39-051-939111 Milan, Italy Tel: 39-02-57518176 Rome, Italy Tel: 39-06-23231718 Madrid, Spain Tel: 34-91-804-4303

Asia
Northeast Asia
Hong Kong Tel: 852-2305-1168 Shenzhen, China Tel: 86-755-2518-1306 Beijing, China Tel: 86-10-5829-1711 Shanghai, China Tel: 86-21-6447-0707 Taipei, Taiwan Tel: 886-2-27528585

Corporate Offices
Fort Lauderdale, FL Tel: 954-766-2800

North America
Southeast
Lake Mary, FL Tel: 407-855-8886

Southeast Asia

Central Europe

Singapore Tel: 65-6586-1900 Penang, Malaysia Tel: 60-4-6430200 Bangalore, India Tel: 91-806-53-76817

Northeast

Landsberg, Germany Tel: 49-8191-3350800 Dortmund, Germany Tel: 49-2307-3619672 Kwidzyn, Poland Tel: 48-55-279-7025

Wilmington, MA Tel: 978-658-1663 West Chester, PA Tel: 610-692-4642

Central

Schaumburg, IL Tel: 847-882-3590 Carmel, IN Tel: 317-706-6742

Northern Europe

Bishops Stortford, United Kingdom Tel: 44-1279-757201 Weymouth, United Kingdom Tel: 44-1305-830747 Coatbridge, Scotland Tel: 44-1236-434455 Frjestaden, Sweden Tel: 46-485-563934 Espoo, Finland Tel: 358-9-5406-5000

West

Milpitas, CA Tel: 408-433-9950

Mexico

Zapopan, Jalisco Tel: 52-33-3123-2141

Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of KEMET Electronics Corporation. KEMET Electronics Corporation P.O. Box 5928 Greenville, SC 29606 (864) 963-6300 www.kemet.com C1009-1 10/12/2010 17

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