Philips Semiconductors

Product specification

Thyristors

BT300X series

GENERAL DESCRIPTION
Glass passivated thyristors in a full pack, plastic envelope, intended for use in applications requiring high bidirectional blocking voltage capability and high thermal cycling performance. Typical applications include motor control, industrial and domestic lighting, heating and static switching.

QUICK REFERENCE DATA

SYMBOL VDRM, VRRM IT(AV) IT(RMS) ITSM PARAMETER BT300XRepetitive peak off-state voltages Average on-state current RMS on-state current Non-repetitive peak on-state current MAX. MAX. MAX. UNIT 500R 500 5 8 65 600R 600 5 8 65 800R 800 5 8 65 V A A A

PINNING - SOT186A
PIN 1 2 3 DESCRIPTION cathode anode gate

PIN CONFIGURATION
case

SYMBOL

case isolated

1 2 3

LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER CONDITIONS MIN. half sine wave; Ths 79 C all conduction angles half sine wave; Tj = 25 C prior to surge t = 10 ms t = 8.3 ms t = 10 ms ITM = 10 A; IG = 50 mA; dIG/dt = 50 mA/s -40 MAX. -500R -600R -800R 5001 6001 800 5 8 65 71 21 50 2 5 5 5 0.5 150 125 UNIT V A A A A A2s A/s A V V W W C C

VDRM, VRRM Repetitive peak off-state voltages IT(AV) IT(RMS) ITSM Average on-state current RMS on-state current Non-repetitive peak on-state current

I2t dIT/dt IGM VGM VRGM PGM PG(AV) Tstg Tj

I2t for fusing Repetitive rate of rise of on-state current after triggering Peak gate current Peak gate voltage Peak reverse gate voltage Peak gate power Average gate power over any 20 ms period Storage temperature Operating junction temperature

1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the thyristor may switch to the on-state. The rate of rise of current should not exceed 15 A/s. September 1997 1 Rev 1.100

Philips Semiconductors

Product specification

Thyristors

BT300X series

ISOLATION LIMITING VALUE & CHARACTERISTIC

Ths = 25 C unless otherwise specified SYMBOL Visol PARAMETER R.M.S. isolation voltage from all three terminals to external heatsink CONDITIONS f = 50-60 Hz; sinusoidal waveform; R.H. 65% ; clean and dustfree MIN. TYP. MAX. 2500 UNIT V

Cisol

Capacitance from T2 to external f = 1 MHz heatsink

10

pF

THERMAL RESISTANCES
SYMBOL Rth j-hs Rth j-a PARAMETER Thermal resistance junction to heatsink Thermal resistance junction to ambient CONDITIONS with heatsink compound without heat sink compound in free air MIN. TYP. 55 MAX. 5.7 9.3 UNIT K/W K/W K/W

STATIC CHARACTERISTICS
Tj = 25 C unless otherwise stated SYMBOL IGT IL IH VT VGT ID, IR PARAMETER Gate trigger current Latching current Holding current On-state voltage Gate trigger voltage Off-state leakage current CONDITIONS VD = 12 V; IT = 0.1 A VD = 12 V; IGT = 0.1 A VD = 12 V; IGT = 0.1 A IT = 12 A VD = 12 V; IT = 0.1 A VD = VDRM(max); IT = 0.1 A; Tj = 125 C VD = VDRM(max); VR = VRRM(max); Tj = 125 C MIN. 0.25 TYP. 2 10 10 1.35 0.6 0.4 0.1 MAX. 15 40 20 1.6 1.5 0.5 UNIT mA mA mA V V V mA

DYNAMIC CHARACTERISTICS
Tj = 25 C unless otherwise stated SYMBOL dVD/dt PARAMETER Critical rate of rise of off-state voltage Gate controlled turn-on time Circuit commutated turn-off time CONDITIONS VDM = 67% VDRM(max); Tj = 125 C; exponential waveform. Gate open circuit RGK = 100 ITM = 10 A; VD = VDRM(max); IG = 0.1 A; dIG/dt = 5 A/s VD = 67% VDRM(max); Tj = 125 C; ITM = 12 A; VR = 25 V; dITM/dt = 30 A/s; dVD/dt = 50 V/s; RGK = 100 MIN. TYP. MAX. UNIT V/s V/s s s

tgt tq

50 200 -

100 1000 2 70

September 1997

Rev 1.100

Philips Semiconductors

Product specification

Thyristors

BT300X series

Ptot / W
8
conduction form angle factor degrees a 30 4 60 2.8 90 2.2 120 1.9 180 1.57

BT300X

Tmb(max) / C a = 1.57 1.9

79

70 60 50

ITSM / A

BT300 IT T ITSM time

2.2
90.5

Tj initial = 25 C max

2.8 4
102

40 30 20

113.5
10

3 IF(AV) / A

125

10 100 Number of half cycles at 50Hz

1000

Fig.1. Maximum on-state dissipation, Ptot, versus average on-state current, IT(AV), where a = form factor = IT(RMS)/ IT(AV).
ITSM / A BT300

Fig.4. Maximum permissible non-repetitive peak on-state current ITSM, versus number of cycles, for sinusoidal currents, f = 50 Hz.

1000

24 20 16

IT(RMS) / A

BT150

dI T /dt limit 100 I TSM T time

12
IT

8 4 0 0.01

Tj initial = 25 C max 10 10us 100us T/s 1ms 10ms

0.1 1 surge duration / s

10

Fig.2. Maximum permissible non-repetitive peak on-state current ITSM, versus pulse width tp, for sinusoidal currents, tp 10ms.
IT(RMS) / A BT258 79 C 8 7 6 5 4 3 2 1 0 -50 0 50 Tmb / C 100 150

Fig.5. Maximum permissible repetitive rms on-state current IT(RMS), versus surge duration, for sinusoidal currents, f = 50 Hz; Ths 79C.
VGT(Tj) VGT(25 C)

1.6 1.4 1.2 1 0.8 0.6

BT151

0.4 -50

50 Tj / C

100

150

Fig.3. Maximum permissible rms current IT(RMS) , versus mounting base temperature Ths.

Fig.6. Normalised gate trigger voltage VGT(Tj)/ VGT(25C), versus junction temperature Tj.

September 1997

Rev 1.100

Philips Semiconductors

Product specification

Thyristors

BT300X series

3 2.5 2 1.5 1 0.5

IGT(Tj) IGT(25 C)

BT150

30 25

IT / A Tj = 125 C Tj = 25 C
Vo = 1.21 V Rs = 0.0313 ohms

BT300

20 15

typ

max 10 5 0

0 -50

50 Tj / C

100

150

0.5

1 VT / V

1.5

Fig.7. Normalised gate trigger current IGT(Tj)/ IGT(25C), versus junction temperature Tj.
IL(Tj) IL(25 C)

Fig.10. Typical and maximum on-state characteristic.

3 2.5

BT150

10

Zth j-mb (K/W)

BT150
without heatsink compound

with heatsink compound

2 1.5 1 0.5 0 -50

0.01 10us 0.1ms 1ms 10ms tp / s 0.1s 1s 0.1
P D tp

50 Tj / C

100

150

10s

Fig.8. Normalised latching current IL(Tj)/ IL(25C), versus junction temperature Tj.
IH(Tj) IH(25 C)

Fig.11. Transient thermal impedance Zth j-hs, versus pulse width tp.
dVD/dt (V/us)

3 2.5 2 1.5 1 0.5

BT150

10000

1000
RGK = 100 Ohms

100

gate open circuit

0 -50

50 Tj / C

100

150

10

50 Tj / C

100

150

Fig.9. Normalised holding current IH(Tj)/ IH(25C), versus junction temperature Tj.

Fig.12. Typical, critical rate of rise of off-state voltage, dVD/dt versus junction temperature Tj.

September 1997

Rev 1.100

Philips Semiconductors

Product specification

Thyristors

BT300X series

MECHANICAL DATA
Dimensions in mm Net Mass: 2 g
10.3 max 3.2 3.0

4.6 max 2.9 max

Recesses (2x) 2.5 0.8 max. depth

2.8 6.4 15.8 19 max. max. seating plane 15.8 max

3 max. not tinned 3 2.5 13.5 min. 1 0.4

M

3 1.0 (2x) 0.6 2.54 0.5 2.5 1.3 0.9 0.7

5.08

Fig.13. SOT186A; The seating plane is electrically isolated from all terminals.
Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8".

September 1997

Rev 1.100

Philips Semiconductors

Product specification

Thyristors

BT300X series

DEFINITIONS
Data sheet status Objective specification Product specification Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 1997 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

September 1997

Rev 1.100