INPLANT TRAINING REPORT

ITI Bhavan Doorvaninagar Bangalore : 560016 Karnataka ,India .

SUBMITTED TO : Mr.Ronny S Estibeiro Asst Officer-HR-ED ITI Limited, Dooravaninagar Bangalore-560016

SUBMITTED BY: Arpita Saha( ID no-4222) B.Tech (ECE) 7TH Semester Institute of Technology Guru Ghasidas Vishwavidyalaya

Acknowledgement
I am highly indebted to Indian Telephone Industries Limited team for their guidance and constant supervision as well as for providing necessary information regarding the project on transformers & also for their support in completing the project and learning outcome.

My special thanks and regards also goes to my supervisors and engineers in developing the project and people who have willingly helped me out and motivated me with their abilities throughout.

INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

preface
At very outset of the prologue it becomes imperative to insist that vocational training is an integral part of engineering curriculum. Training allows us to gain an insight into the practical aspects of the various topics, with which we come across while pursuing our B.Tech i.e. vocational training gives us practical implementation of various topics we already have learned and will learn in near future.Vocational training always emphasizes on logic and common sense instead of theoretical aspects of subject.On my part, I pursued four weeks training at I.T.I Limited, Bangalore. The training involved a study of various departments of the organization as per the time logically scheduled and well planned given to us.
Arpita Saha

Id no -4222

INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

cmpany Profile
COMPANY PROFILE: Indias first Public Sector Unit (PSU) - ITI Ltd was established in 1948. Ever since, as a pioneering venture in the field of telecommunications, it has contributed to 50% of the present national telecom network. With state-of-the-art manufacturing facilities spread across six locations and a countrywide network of marketing/service outlets, the company offers a complete range of telecom products and total solutions covering the whole spectrum of Switching, Transmission, Access and Subscriber Premises equipment.

ITI joined the league of world class vendors of Global System for Mobile (GSM) technology with the inauguration of mobile equipment manufacturing facilities at its Mankapur and Rae Bareli Plants in 200506. This ushered in a new era of indigenous mobile equipment production in the country. These two facilities supply more than nine million lines per annum to both domestic as well as export markets.

The company is consolidating its diversification into Information and Communication Technology (ICT) to hone its competitive edge in the convergence market by deploying its rich telecom expertise and vast infrastructure. Network Management Systems, Encryption and Networking Solutions for Internet Connectivity are some of the major initiatives taken by the company.

Secure communications is the company's forte with a proven record of engineering strategic communication networks for India's Defence forces. Extensive in-house R&D work is devoted towards specialized areas of Encryption, NMS, IT and Access products to provide complete customized solutions to various customers.

INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

Unit Profile

UNIT PROFILE Bangalore Unit is the first Plant of ITI set up in 1948. With its, vertically integrated, state-of-the-art infrastructure a vast range of telecom products are manufactured. They include digital switches (large, medium, small), Digital Microwave equipment, optic fibre equipments, satellite communication equipment, access products, terminal equipments. Areas of business Telecom Equipment applications Manufacture for Defence and Civilians

Installation & Communication Turnkey Solutions IT Networks Diversified Products

Products Switching: CSN-MM,C-DOT,ISDN and PABX Access: WLL/CDMA INFRA, Broadband CorDECT(EDWAS),Antenna GSM/CDMA Transmission: IDR SATCOM Microwave

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Terminal Equipments:Caller ID Phones Defence Equipments: ORDERWIRE SECRECY(OWS) , ANADA MK II BEU, MIL PCM SECRECY , L VSAT 5B/5C TELEPHONES, PRIMARY MUX ASCON EPBT ADSL-CPEs, Secrecy Equipments INFO KIOSKS and Desktop Computers

Facilities

SMT Line
Consists of Screen Printer,Glue Dispenser,Chip Shooter,Fine Placer and Reflow Oven Capability : 40000 components / hr. Chip shooter : Placement minimum size 0603 (1.5mm x 0.75mm) components to max. size 55mm x 55 mm ICs. Fine placement upto 0.5mm Pitch & Accuracy of 25 microns Capacity : 150 million components per annum

Mechanical Fabricaton and Assembly

Machines available: CNC Turret Punch Press (30 tons), NC Pressbrakes (upto 120 tons), CNC Shearing (2.5 mtrs) and General purpose machines Capability: Handling sheet metal work of 2mm thickness of stainless steel, 2.5mm MS
INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

& 3.2mm Aluminium Capacity: Process about 100 tons of Sheet Metal per month

Plastic Injection Technology

Capability: 25 to 300 Capacity: 0.5 million shots per annum tons

Through-Hole Component Assembly

Capability :Dual wave and Nitrogen atmosphere wave soldering Capacity : 36 million components per annum

PCB Manufacturing
Capability :Single Layer to 4 Layer Capacity : 3000 Sq.Metres per annum

Wave Soldering machine

INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

Testing Facilities
In-Circuit Testers (upto 2000 nodes) Capability :Detects open, short, continuity, correctness of the components with respect to Orientation, Value, etc Capacity : 1,50,000 cards per year (average) Functional testing for cards System Testing

Tool Room
Capability:Manufacture and maintenance of moulding tools, press tools, jigs & fixtures Capacity:Supporting in-house requirements

Finishing
Capability: Electroplating and Powder Capacity: Supporting in-house fabrication coating facilities

Nickel plating

Non-cyanide plating

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Upgraded Zinc Phosphating plant

Other Support Facilities

EMI Shielded Electrical Test Mechanical Test Chemical Test Environmental Testing Facility Chamber Lab. Lab. Lab

Total Turnkey Solutions

CDMA Network : 4.4 Million Lines - Supply, Installation and Commissioning for BSNL Army Static Communication Network (ASCON) for Defence Forces (Covering entire country) CIVICON PROJECT for Ministry of Home Affairs (Turn-key Network Implementation) CARNATION Project for Indian ARMY (Wide Area Strategic Network) IDR Project for BSNL MCPC VSAT for BSNL Point to Point Satellite based Links for RCPO LICO VSAT for Indian ARMY SCPC DAMA Equipment

INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

Table of Contents
company Profile .................................................................................................................................. 4 TELEPHONE AND DEFENCE PRODUCTSTELEPHONE MAGNETO ........................................................... 12 TELEPHONE MAGNETO ......................................................................................................................... 13 THE AUTOMATIC TELEPHONE ........................................................................................................... 14 DTMF (Dual Tone Multi Frequency).................................................................................................. 17 PCB MANUFACTURING ..................................................................................................................... 19 RESEARCH AND DEVELOPMENT ........................................................................................................... 25 SCADA ............................................................................................................................................... 26 POWER SUPPLY UNIT ........................................................................................................................ 31 Linear power supplies: .................................................................................................................. 31 Switched Mode Power Supply ...................................................................................................... 32 WIRELESS LAB ................................................................................................................................... 34 MODEM................................................................................................................................. 34 WIRELESS ISM TRANSMITTER ............................................................................................... 34

CAD(Computer Aided Design) ........................................................................................................... 35 PCB Basics ..................................................................................................................................... 35 Device Mounting ........................................................................................................................... 35 Traces ............................................................................................................................................ 36 Decoupling Capacitors .................................................................................................................. 37 Measurements .............................................................................................................................. 37 INFORMATION TECHNOLOGY ............................................................................................................... 38 IVRS( Interactive Voice Response System Software) ........................................................................ 39 SWITCHING AND ACCESS PRODUCTS ................................................................................................... 44 SMT (Surface mount technology) ..................................................................................................... 45 What are SMT components? ............................................................................................................ 45 STENCIL PRINTER REFLOW OVEN GLUE DISPENSER OPTICAL INSEPCTION CHIP SHOOTER ...................... 48 FINE PLACER ........ 48

BTS (Base Trans-Receiver Station) .................................................................................................... 49 INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

CDMA (Code Division Multiple Access) ............................................................................................. 51 OCB (Organ do Commando B) Telephone Exchange ........................................................................ 53

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TELEPHONE AND DEFENCE PRODUCTS

INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

TELEPHONE MAGNETO
A magneto is an electrical generator that uses permanent magnets to produce alternating current. Owing to their simplicity and reliability, they were widely used in early telephone systems. Many early manual telephones had a hand cranked "magneto" generator to produce a (relatively) high voltage alternating signal to ring the bells of other telephones on the same (party) line and to alert the operator. These were usually on long rural lines served by small manual exchanges, which were not "common battery". The telephone instrument was "local battery", containing two large "No. 6" zinccarbon dry cells. By around 1900, large racks of motor-generator sets in the telephone exchange supplied this ringing current instead and the local magneto was no longer required. A gear mechanism was used to speed-up the crank rotation to the speed of the magneto armature. Telephone magnetos also incorporate a switch that only engages when rotating, so that the magneto is normally out of circuit. The last survival of ringing current magnetos in the public telephone network (PSTN) was as late as the 1980s, where they were still used with PMBX (Private Manual Branch Exchange, a small business switchboard, worked by operators). Rather than providing a motor generator set for such a small installation, along with its noise and need for mechanical maintenance, a hand magneto was used. Unlike the public telephone network and its standard ringing cadence (two pulses, then a gap, in the UK) the cadence of a manual ringer depended on the operator. When ringing local extensions, some switchboard operators used local codes of ringing to indicate internal, external or urgent calls. Around the same time, the linesman's test set still included a magneto, for use when ringing out to either the exchange or the subscriber, from anywhere along the line. These lasted into the 1980s.

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THE AUTOMATIC TELEPHONE

The term automatic telephone means a telephone system fitted with automatic electric devices such that the user, by means of a numerical dial attached to the instrument can: i) ii) iii) iv) Establish a connection in a large public exchange, in from three to five seconds Be sure that he gets the number he dialled Receive a positive signal, if the line be busy Break the connections when he desires

The transmitter, receiver, ringer, and hook switch for an automatic telephone may be of any standard type. The only part of the instrument that is peculiar to the automatic system is the calling device or dial. At the central office, the machines which make the connections between subscribers lines are divided into the following classes: 1. Line switches 2. Selector switches 3. Connector switches According to the size of the installations the automatic telephone system may be classed as: Single office exchange; Multi-office exchange; Private automatic exchange (PAX). SUBSCRIBERS DIALThe function of this device is to alter the electrical condition of line in such a way as to cause the apparatus at the central office to complete the desired connection. It consists of a dial pivoted at the centre and arranged so that it may be turned in a clockwise direction.

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SUBSCRIBERS CIRCUIT

When the subscriber dials a number, the circuit will be opened a number of times corresponding to the number called and this is the principle upon which the apparatus at the central station depends to make the connection. When the dial is moved from the initial position, the shunt springs close contact, maintaining a shunt around the transmitter and receiver until such time as the dial
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returns to its initial position. This prevents variation of resistance in the subscribers loop and irregular operation of the central office mechanism.

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DTMF (Dual Tone Multi Frequency)

The abbreviation DTMF stands for Dual Tone Multi Frequency, and is a method of representing digits with tone frequencies, in order to transmit them over an analog communications network, for example a telephone line. During development, care was taken to make use of all frequencies in the voice band, in order to reduce the demands placed on the transmission channel. In telephone networks, DTMF signals are used to encode dial trains and other information. Although the method used until now to form dial trains from a sequence of current pulses is still the standard in Germany, the transmission time is too long and places an unnecessary loading on the network. In addition, many telecommunications services are only available with the use of tone dialing. For DTMF encoding, the digits 0-9 and the characters A-D, */E and #/F are represented as a combination of two frequencies: Frequency 1209 Hz 1336 Hz 1477 Hz 1633 Hz 697 Hz 770 Hz 852 Hz 941 Hz 1 4 7 */E 2 5 8 0 3 6 9 #/F A B C D

With this system, the column is represented by a frequency from the upper frequency group (Hi-Group: 1209-1633 Hz), and the line by a frequency from the lower frequency group (Lo- Group: 697-941 Hz). The tone frequencies have been chosen such that harmonics are avoided. No frequency is the multiple of another, and in no case does the sum or difference of two frequencies result in another DTMF frequency. For the generation of a dial train in Telecom network some specifications must be met : The deviation of the actual frequencies generated from the nominal frequency must be a maximum of 1.8% during the dialling process The envelope of the dial train must conform to the waveform shown in Figure 1:

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The voltage levels must conform to the following values:

Dialing Character Time Automatic dialing, or manual dialing with automatic time limiting Manual dialing without time limiting 65mst100ms

Time Between Characters 80mst6500ms

Minimum level in dB (950mV) fu fo

Maximum level in dB (950mV) fu fo

-16

-14

-10.5

-8.5

t65ms

t80ms

-16

-14

-13

-11

INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

PCB MANUFACTURING
PURPOSE
To systematically plan and control all processes to manufacture quality PCBs which shall meet all specified quality, delivery and cost requirements.

PROCEDURE 1.MECHANICAL
CNC drilling and routing are validated on a weekly basis by the dispersion tests and the results are represented graphically and displayed on the machine. Any special instruction will be sent to maintenance which help them to know this status of machine and to carry out the necessary preventive maintenance if required. The work is carried out as called for in work instruction PCB/MEC/WI.

1.1.DRILLING
It is responsible for drawing the laminates. Cutting these sheets to the required blanks as per the cutting order and fabrication order, curing the cut blanks in the oven, stack pinning the blanks with backup sheets at the bottom and entry sheet at the top, loading the stacked blanks on the drilling machine with the drill tape given by the methods, reading in and performing the drilling operations. Drilled blanks are checked with drill check diazo ( a diazo film with all holes drilled) given by methods.

The blanks are depinned and deburred for removing the burrs formed during drilling operation and sent to electronic plating line centre. Non-plated through holes (NonPTH) Boards are sent to pumicing centre directly by passing electronless plating line.

1.2 ROUTING
The boards after Hot air leveling and legend printing if required reach routing section for contouring to its specified shape and size. The work is carried out on CNC Machine with routing programme supplied by methods. Routed boards are checked thoroughly for dimensional aspects and plated through holes to edge and non plated through holes to edge details, to the satisfaction of the routing control drawing furnished by methods. The boards which require bevelling as per F.O. will be chamfered in the bevelling machine and all the PCBs are then sent to final Quality Control inspection area after cleaning.
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2. IMAGE TRANSFER
The quality of the PCB is highly dependable on the quality of the circuits transferred on the blank. The correct circuit image transfer requires correct exposure techniques. The correct exposure and there by proper image transfer is controlled by step tablet technique. The work instructions for this area is covered under PCB/TT/WI.

2.1 PHOTO IMAGE TRANSFER

Photo image transfer section carries out the following processes by which the image of the circuit to the code is embedded to the blank.

1) Pumicing Process of preparing the surface of the blank to hold dry film firmly on the blank during the lamination of the dry film. The processes involves the scrubbing of surface of blank by pumicing brushes with pumice powder in slurry to provide the blank surface a little roughness. 2) Lamination The technique involves the processes of covering both sides of the blank with photo sensitive dry film mounted on the hot roll laminate. 3) Registration The process of aligning the respective film (diazo) on the blank correctly and exposing under UV light using the exposure machine. This process transfers the image of the circuit on the blank. 4) Development The exposed blanks are fed to the developer units where the same are developed in potassium/sodium carbonate where aqueous base film is used. 5) Development verification The development blanks are thoroughly checked for defects and good boards are sent for Quality control. The defective boards are sent for reprocessing. The boards passed by Q.C are sent with the F.O to plating duly certified. The blanks with minor defects are repaired by the PIT Production personal and blanks having major problem are segregated and sent for rework with duplicates F.O number of the original.

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2.2 SCREEN PRINTING

In Screen Printing area there are two types of operations. Soldermasking and Legend printing Photo imageable solder mask is used. 1) Soldermasking It is during this process PCBs are scrubbed and given a coating of soldermask. The soldermask protects the areas of PCBs other than component insertion points which gets soldered during wave soldering. Next the respective film is aligned on the board, and the boards are exposed , developed and inspected. 2) Legend printing Legend printing is the operation carried out for selected PCBs, as indicated in F.O, which give the marking of various components coming over the particular PCBs for easy identification I the assembly stage of the PCB. The boards after screen printing/ PISM are cured and sent for Hot Air Levelling.

3 .PLATING
Electronics and Electroplating deposition are controlled and monitored by Chemical Laboratory. They perform various analysis like hull cell test, and regularly use glass exposure plate to find the quality and quantity of the deposition. The work instruction for this area is covered under PCB/PT/WI. ELECTRONLESS PLATING LINE OF THE PLATING AND TREATMENT SECTION This area perform the activity of providing and overall coating of copper all over the blank including inside the holes by chemical processes. Electronless plated blanks are sent for Photo image Transfer operation. PLATING AND TREATMENT AREA The blanks received from the PIT section are subjected to deposition of copper followed by tin lead Electrolytically. After electro-plating boards are taken to the treatment processes. The treatment involves the following operation: 1) Stripping: The dry film which acted as plating resist during electrolyte plating of Tin lead is removed in the process. 2) Etching: Copper is removed from the where it is not required by etching.
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TIN-LEAD STRIPPING AND HOT AIR LEVELLING 1) Tin-Lead Stripping For Solder Mask Over Bare Copper(SMOBC) Boards the Tin-Lead plating on the board is stripped prior to solder masking. 2) Hot-Air levelling The SMOBC boards after solder masking are sent for hot air levelling where the boards are dipped in molten solder bath and then withdrawn between a pair of hot air knives to remove excess solder. After HAL, boards are sent to routing/legend printing as indicated on the F.O.

4.QUALITY CONTROL
After all manufacturing operations are completed, the boards are subjected to find inspection. The work instruction of this area are covered under PCB/QC/WI. Rework data is collected at final inspection stage. MASTER FILM PREPARATION Methods department hands over the pilot blank drilled along with the validated film to the Film preparation group with necessary instruction like position of thief frame, dummy patterns for plating control and modification /corrections if any to be incorporated in the film for the prepration of manufacturing films. PLATING AREA CONTOL The copper lead area to be plated for individual codes will be computed by methods and is issued to the plating shop with necessary instructions to do the sample plating for confirmation. The plated boards are checked by Methods for correct hole diameter proper plating thickness for individual PCB codes. ROUTING TAPE PREPARATION Routing tape is prepared for the individual codes based on the routing drawing supplied. A pilot routing is done and is verified for the card dimentions. A routing control drawing is issued to the routing shop for verification by the operator. BBT JIG PREPARATION In PCB shop boards are verified for electrical continuity with the help of Bare Board Tester. The drill tape for jigs are prepared by Methods and issued to drilling shop to drill on the glass epoxy laminate which is issued to Q.C. BOM PREPARATION/CORRECTION AND PLANNING
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The quality to be processed is planned based on the consumption pattern and feed back from production. The BOM is prepared on the data available and intimated to stock control. Procurement action for Methods identified items is taken. Scrutiny is done for the technical suitability of the offers received. The consumption value of consumables in production is collected and analysed.

5. PROCESS CAPABILITY STUDY

Process capability study is done based on the the equipment available and provided Evaluation of the stability of the process to deliver the require quality of product. Fault report analysis Fault report raised by PCB production section including fina inspection are analysed and disposal/corrective action suggested. Metallography Here Metallographic cross-section is done to check whether the etching machine can be qualified. The dispersion test for qualification of Drilling and Routing machine and incoming raw material inspection is also done here. Customer Care Customer complains are analysed and disposal action is suggested. Contract review meetings are held with Marketing Dept.

6.EQUIPMENT MAINTENANCE Installation, Commissioning and subsequent maintenance of all production and
production support equipments in PCB plant is done by the equipment maintenance group in addition to this Maintenance of UPS systems is done by this group. The activties are covered under procedure EM/PCB/PRO/01.

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METHODS

CHEMICAL LAB

RAW MATERIAL CUTTING DRAWING

FO

CUTTING ORDER

RAW MATERIAL CUTTING CNC DRILLING ELECTRONLESS PLATING PHOTO IMAGE TRANSFER ELECTRO PLATING FILM STRIPPING

CUT

CUT BLANKS DRILLED BOARDS ANALYSIS REPORT

DRILL TYPE CHEMICALS DIAZO FILMS PLATING AREA CHEMICALS

ELECTRONLESS PLATING BOARDS CHEMICAL, DRY FILM IMAGE TRANSFERRED BOARDS ANALYSIS REPORT PLATED BOARDS STRIPPED BOARDS

ETCHING

CHEMICALS ETCHED BOARDS CHEMICALS ORTHO FILMS

TIN-LEAD STRIPPING

STRIPPED BOARDS
SCREEN PRINTING HOT AIR LEVELING

SOLDER MASKED BOARDS HALED BOARDS

SOLDER ROUTING TAPE

CNC ROUTING

ROUTED BOARDS
QC QA

QC CLEARED BOARDS

PCB PROCESS MAP

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RESEARCH AND DEVELOPMENT

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SCADA
INTRODUCTION
The Supervisory Control and Data Acquisition (SCADA) system plays an important role in modern system management, which provides centralized data base management of system control. The system also finds use whenever there is a requirement of data acquisition and also remote Station Monitoring. It also finds use in control and analysis of various parameters like voltage and current. Normally, the requirement is to remotely monitor analog parameters and status of various bi-state devices as in Railway Electrification Network. Tele commands can be executed for ON/OFF or open/close function of bi-state devices from the master station. The system ensures that the communication network is managed in efficient manner making optimum use of available resources. The Supervisory Control and Data Acquisition system consists of master equipments at remote control centre and remote terminal units at each of the remote stations. The Remote stations are distributed geographically at different locations. FEP to Unix Server communications is through Optical Transmitter (Fiber Optic Interface). Front End Processor will execute the Tele-commands (server of RTU messages) of Remote Terminal Units (RTU). FEP will send Tele commands received from the Server on priority basis to operate the bi-state devices like circuit breakers at RTU. In case of RTU not responded for the first call, the Front End Processor has to repeat the call three times to Remote Terminal Unit. If there is no response for third call also then Remote Terminal Unit is declared as RSD (Remote The Supervisory Control and Data Acquisition system consists of the master station equipments at the Remote Control Center and Remote Terminal Units at each of the remote stations).The Remote station defective at FEP. After that only one FEP will send the call to a Remote Terminal Unit in 3 characters, which will be received simultaneously by the RTUs. But only one RTU corresponding to the address will reply. On polling, the processor(FEP) will send analog calls to the RTU and RTU will respond with analog messages. In case of any change of status in double way status or Single way status the RTU will send that SW/DW data to FEP on priority basis. FEP has to send acknowledgement for data confirmation for SW, DW messages after receiving from the RTU. The Remote Terminal Unit has a unique address and are waiting to be addressed by the FEP. FEP to server is through Optical Transmitter. Front End Processor will execute the Telecommand (server to RTU message) on Remote Terminal Unit (RTU).

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DESIGN METHODOLOGY
REQUIREMENT ANALYSIS
The master station equipment consists of : Front End Processor (FEP main/standby arbitrator). Workstation (Computer, graphic terminals and printers) Panel Processor/mimic panels. UPS The Remote station telemetry equipment comprises of Remote terminal units Necessary transducers Modules 1) 2) 3) 4) CPU-8085 based Analog modules Status input modules Telecommand execute modules

Front End Processor

This has centralized control which performs monitoring, collection of data from remote terminals, passing it on to the server or saving the data and carrying out telecommand signals. It also accepts broadcast messages and general check call from workstations that are to be transmitted to the remote terminals.

Panel Processor
It acquires data from the Front End Processor and display or mimic panels. The communication of panel processors to Front End Processors is through serial port at 2400 baud. It is bi-directional and asynchronous.

Mimic Panel
It is used to display ac traction between station using 8 panel processors.

Remote Terminal Uniits:

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Sends data through master station on a call reply basis. There is continuous exchange of messages between Front End Processors and Remote terminal Units and the front-end Processors initiates call. The Front End Processor is connected to the Remote Terminals through a quad cable on optical/microwave channel. Here a quad cable is used. The maximum baud rate is 600 bits/second.

TOOLS USED ARE:

TIMER CREATE COMNOTIFY COMSTAT

SCADA hardware
A SCADA system consists of a number of remote terminal units (RTUs) collecting field data and sending that data back to a master station, via a communication system. The master station displays the acquired data and allows the operator to perform remote control tasks. The accurate and timely data allows for optimization of the plant operation and process. Other benefits include more efficient, reliable and most importantly, safer operations. This results in a lower cost of operation compared to earlier nonautomated systems. On a more complex SCADA system there are essentially five levels or hierarchies: Field level instrumentation and control devices Marshalling terminals and RTUs Communications system The master station(s) The commercial data processing department computer system Background to SCADA 5 The RTU provides an interface to the field analog and digital sensors situated at each remote site. The communications system provides the pathway for communication between the master station and the remote sites. This communication system can be wire, fiber optic, radio, telephone line, microwave and possibly even satellite. Specific protocols and error detection philosophies are used for efficient and optimum transfer of data. The master station (or sub-masters) gather data from the various RTUs and generally provide an operator interface for display of information and control of the remote sites. In large telemetry systems, sub-master sites gather information from remote sites and act as a relay back to the control master station.

SCADA software
SCADA software can be divided into two types, proprietary or open. Companies develop proprietary software to communicate to their hardware. These systems are
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sold as turn key solutions. The main problem with this system is the overwhelming reliance on the supplier of the system. Open software systems have gained popularity because of the interoperability they bring to the system. Interoperability is the ability to mix different manufacturers equipment on the same system. Citect and WonderWare are just two of the open software packages available in the market for SCADA systems. Some packages are now including asset management integrated within the SCADA system Key features of SCADA software are: User interface Graphics displays Alarms Trends RTU (and PLC) interface Scalability 6 Practical SCADA for Industry Access to data Database Networking Fault tolerance and redundancy Client/server distributed processing

Landlines for SCADA

Even with the reduced amount of wire when using a PC to IED system, there is usually a lot of wire in the typical SCADA system. This wire brings its own problems, with the main problem being electrical noise and interference. Interference and noise are important factors to consider when designing and installing a data communication system, with particular considerations required to avoid electrical interference. Noise can be defined as the random generated undesired signal that corrupts (or interferes with) the original (or desired) signal. This noise can get into the cable or wire in many ways. It is up to the designer to develop a system that will have a minimum of noise from the beginning. Because SCADA systems typically use small voltage they are inherently susceptible to noise. The use of twisted pair shielded cat5 wire is a requirement on most systems. Using good wire coupled with correct installation techniques ensures the system will be as noise free as possible. Fiber optic cable is gaining popularity because of its noise immunity. At the moment most installations use glass fibers, but in some industrial areas plastic fibers are increasingly used.

SCADA and local area networks

Local area networks (LAN) are all about sharing information and resources. To enable all the nodes on the SCADA network to share information, they must be connected by some transmission medium. The method of connection is known as the network topology.
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Nodes need to share this transmission medium in such a way as to allow all nodes access to the medium without disrupting an established sender. A LAN is a communication path between computers, file-servers, terminals, workstations, and various other intelligent peripheral equipments, which are generally referred to as devices or hosts. A LAN allows access for devices to be shared by several users, with full connectivity between all stations on the network. A LAN is usually owned and administered by a private owner and is located within a localized group of buildings. Ethernet is the most widely use LAN today because it is cheap and easy to use. Connection of the SCADA network to the LAN allows anyone within the company with the right software and permission, to access the system. Since the data is held in a database, the user can be limited to reading the information. Security issues are obviously a concern, but can be addressed.

INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

POWER SUPPLY UNIT

TYPES OF POWER SUPPLIES: There are two types of power supplies: 1. Linear Power Supplies 2. Switched Mode Power Supplies (SMPS)

Linear power supplies:

The linear power supply is a well known power supply since the advent of electronics.

The above circuit in fig (2.1) shows a linear power supply. Vin is the ac main voltage with 50 Hz supply frequency. A conventional transformer is used to step down the ac main to low voltage of same frequency. This secondary voltage is rectified and filtered. The resulting dc output is fed to a series pass transistor. A sample of Vout derived from the potential divider is compared with the Zener Diode produced reference voltage and the difference is amplified and used to control the power transistor to maintain constant output voltage. However this mode of operation dissipates a large amount of power in the form of heat, consequently lowering the efficiency of power to 40% or 50%. Thus, because of lower efficiency, bulky heat sinks and cooling fans, larger isolation transformers are used to step down the ac voltage. So this type of power supply is not suited for compact electronic system.

INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

Switched Mode Power Supply

The disadvantages of linear power supply are greatly reduced or eliminated by the regulated switching power supply.

The fig shows a simplified block diagram of a high frequency off the line switching power supply. In this scheme the ac line is directly rectified and filtered to produce a raw high voltage be quite small due to high operating frequency. High the combination of high frequency with the small size of the transformer, results in compact, light weight power supplies, with power densities of upto 30 Watt/Cubic in for linear. Coupled with very wide input voltage range, 90 to 260 volts ac and very good hold up time, typically 25 ms, the switch has become the choice for electronic system designers. Of course there are certain disadvantages associated with switching power supply, such as higher output noise and ripple, EMI/RFI generation and higher design complexity. However, with careful design these problems may be reduced or eliminated.

Advantages of linear and switched mode power supplies:

INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

LINEAR POWER SUPPLY

Tight regulation band Very low output noise ripple Low complexity

SWITCHED MODE POWER SUPPLY

Very high overall efficiency. Lower operating temperature and relaxed heat removal problems. Small power transformer size due to high switching frequency

INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

WIRELESS LAB
MODEM
A modem is a communication device that converts binary signal into analog acoustic signals for transmission over telephone lines and converters these acoustics signals back into binary form at the receiving end. Conversion to analog signal is known as modulation, conversion back to binary signal is known as demodulation. In the terminology used in the RS-232 communication standard, modems are DCEs, which mean the connected at one end to a DTE(e.g. computer) device. Digital modem supports ASIC modem chip PVG310 user programmable spartan , FPGA & frequency sources. Analog Modem supports T*IF (350 Mhz). Suitable for narrowband and broadband wireless application. Programmable modulation, QPSK, QAM Concentrated convolution or block convolution inner code with variable rates. RS-232 interface for M&C features through NMS. Its wireless flexibility allows a single platform to add a broad range of wireless markets.

WIRELESS ISM TRANSMITTER

FEATURES: Supports license free ISM band i.e 2.4-2.48 Provides the user data interfaces 4Hz RS-232, RS-485/RS-422, Ethernet and USB. Supports PSK modulation Supports IEEE 802.15.4 MAC standard RF interface with built antenna. RF output power is 0dbm to 28dbm. Module dimension 7*5*3.5 APPLICATIONS: Wireless remote monitoring and control Wireless network management system application
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CAD(Computer Aided Design)

Computer-aided design (CAD), also known as computer-aided design and drafting (CADD), is the use of computer systems to assist in the creation, modification, analysis, or optimization of a design. Computer-aided drafting describes the process of creating a technical drawing with the use of computer software. CAD software is used to increase the productivity of the designer, improve the quality of design, improve communications through documentation, and to create a database for manufacturing. CAD output is often in the form of electronic files for print or machining operations. CAD software uses either vector based graphics to depict the objects of traditional drafting, or may also produce raster graphics showing the overall appearance of designed objects.
PCB Basics

A standard PCB consists of several layers of fibreglass pressed together, with places for chips and connections between them called traces. With a prototyping board, you will receive only the PCB from the manufacturer, and will need to mount all your components yourself. The two most common ways to mount devices to a PCB are through hole and surface mount.
Device Mounting

Through hole mounting consists of drilling holes in the PCB, allowing wires connected to the chip to pass through the holes. These wires are then soldered onto the conducting circles called pads around each hole in the PCB, forming a solid connection between the chips pin and the PCB pad. These holes come filled with conducting material (usually copper) so that traces to the top and bottom pads of the hole are connected to both the chip and each other without having to solder both sides of the board. In contrast, surface mounting consists of creating rectangular conducting pads on the PCBs surface. The chips pins are then soldered directly to these pads. Obviously, these pads only exist on one side of the PCB, unlike through-hole. Of the two methods of mounting components, through hole is much easier to solder and offers more room for error. However, since surface mount components are common for production designs while through hole is mostly used for prototyping, you will often find an abundance of components in a surface mount package. There may even be components you require that are not available in a DIP package. Try to have someone
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willing to solder surface mount components for you before you decide to use them in your PCB design, as the process is quite involved. Successful surface mount soldering will require at least a fine soldering iron as well as good technique, but these components were meant to be soldered using solder paste and oven. It is also very important that, before you start designing the PCB, you either have all the components you will be mounting in front of you, or have detailed schematics of the components and their PCB layouts if available. It is also a good idea to verify the availability of the required components. Design your PCB to allow for some margin for error and perhaps even to accept a similar component if possible. It is very important that you lay out the pads for your devices correctly.
Traces

Connections between device pads are accomplished by traces, which are lines of conducting material (usually copper) placed on the surface(s) of the PCB, acting like wires. Traces must be wide enough to support the current travelling through them and must be spaced out enough so they do not interfere with each other (more on this later). Obviously traces cannot cross or touch at any point. It is also a good practice to avoid sharp angles in traces (90 degrees or less) since this increases signal interference. One of the limitations of a fast turnaround prototyping PCB design is that you will probably have only two layers of traces (the top surface and the bottom surface) to work with. This can cause difficulties in the routing of traces in complicated designs, so special care is needed as the number of traces needed increases. Some ingenuity is often useful to manually route traces effectively but auto routing should do a good enough job in most cases. To connect a trace from one side of a PCB to the other, a VIA is used. A VIA is a small hole drilled in the PCB that is filled conductor, linking any traces connected to it on top to any traces connected to it on the bottom. VIAs are useful to alleviate routing problems by allowing signals that cannot be routed on a single side to use the other side or layers of the PCB.

INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

Decoupling Capacitors

One of the easiest things to overlook in a design, decoupling capacitors are a must for almost any high-speed digital logic chip. Decoupling capacitors are placed in between the power and ground inputs of a digital logic chip, preferably as close as possible to the chip itself. These capacitors buffer the input power voltage, preventing voltage source spikes from reaching and damaging the chip, and to reduce the effects of interference. They also provide localized current to the chip for driving output lines, making transitions smoother. Often, chip manufacturers will provide a guide describing how their chips should be decoupled and how large or small the capacitors doing it should be. This documentation is unlikely to be included in the datasheet for a chip with many different models like SRAM. In these cases, there will most likely be a single document applicable to a wide variety of models.
Measurements

One first confusing aspects of PCB design is the mixing of metric and standard units. The two most common way of specifying measurements like pin or pad spacing are in millimetres or mils. Be careful, these are not the same thing! A mil is the term coined for one thousandth of an inch, and is obviously a lot smaller than a millimetre (since an inch is much less than a meter).

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INFORMATION TECHNOLOGY

INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

IVRS( Interactive Voice Response System Software)

INTRODUCTION
In todays competitive world any business must build flexible systems that adapt easily to evolving requirements of the critical business processes. IVRS is one such system that transforms the traditional business model into customer centric model. IVRS is historically interactive speech memory driven that walk the caller through a series of prompts where they respond to questions by pressing the combination of one or more buttons of the phone keypad. The decision tree associated with the prompts and the responses will route the caller to information they desire. These IVRS systems are typically utilized to check bank account balance, buy and sell stocks, check the show times for your favorite movie. In telephony, Intelligent Voice Response, or IVR, is a phone technology that allows a computer to detect voice and touch tones using a normal phone call. The IVR system can respond with pre-recorded or dynamically generated audio to further direct callers on how to proceed. IVR systems can be used to control almost any function where the interface can be broken down into a series of simple menu choices. Once constructed IVR systems generally scale well to handle large call volumes. What are interactive voice response (IVR) systems? Interactive Voice Response (IVR) systems allow callers to interact with the communications system over the telephone. IVR is used to enable the caller to retrieve information from a database, enter information into a database, or both. IVR systems allow the user to efficiently exchange information, reducing clerical processing. How It Works? An IVR system talks to callers following a recorded script. It prompts a response to the caller and asks him to respond either verbally or by pressing a touchtone key, and supplies the caller with information based on responses made. What are important features of IVR systems? IVR system should store responses made by callers. Should be able to provide different responses to callers based on time of day called.Should be able to capture either touch-tone or voice responses by callers.

INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

PRINCIPLE OF IVRS Interactive voice response refers to technology supporting the interaction of customer with the service provider generally over the telephone lines. When a person wants to access any of the services of the Interactive Voice Response System, he presses a number through his telephone keypad. The pressed number appears across the line and the ring detector circuit senses this ring. After a specified number of rings the relay is activated through the microcontroller, which in turn connects the line to DTMF decoder. The activation of relay causes the number pressed to appear across the DTMF decoder. The decoder decodes the number pressed and then the decoder output is passed through the microcontroller to the computer. Now, when the caller presses a number, the number pressed is decoded by the DTMF decoder and passed to the computer through the microcontroller using MAX232. The computer recognizes the number and accesses the particular file from the database to output the voice message. The output voice is passed through the voice card where the digitized serial data is converted into analog voice form and passed to the line. The caller gets the information through the line. SEQUENCE FOLLOWED IN THE IVRS SERVICE Caller dials the IVRS service number. The computer waits for a specified number of ringing tones at the end of which, the connection is established. The connection is established by lifting the handset of telephone base from ONHOOK condition. Now, a pre-recorded voice greets the caller conforming that the number dialled corresponding to the particular service. Next, the menu is presented to the caller again in the voice form, giving him the various options to choose from. If the information to be relayed back is confidential, then the system may even ask the dialer, to feed in a password number. The database is accordingly referenced and the necessary information is obtained. Next, the same information is put across to the user in voice.
INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

 The caller generally given the option to : a. Repeat whatever information was voiced to him. b. Repeat the choices. c. Break the call by restarting ON-HOOK condition GENERAL DESCRIPTION ABOUT TELEPHONY Any telephone set will always be in any of the conditions mentioned below: ON-HOOK It is the state whenever telephone handset is placed on the cradle. During this state, the telephone line is open circuit with the exchange and the voltage of 48 V is available on each telephone line from the exchange. OFF-HOOK This is the state whenever telephone handset is displaced from the cradle. During this state the voltage level is between 5V to 12 V. The telephone OFF HOOK resistance is typically 600 . SIGNALING TONES Dial tone: This tone indicates that the exchange is ready to accept dialed digits from the subscriber. The subscriber should start dialing only after hearing the dial tone. Otherwise, initial dialed pulse may be missed by the exchange that may result in the call landing on the wrong number. The dialed tone is 33 Hz or 50 Hz or 400 Hz continuous tones. Ring tone: When the called party is obtained, the exchange sense out the ringing current to the telephone set of the called party. This ringing current has the familiar double ring pattern. Simultaneously, the exchange sends out the ringing tone to the calling subscriber, which has the pattern similar to that of ringing current, the two rings in the double ring pattern are separated by a time gap of 0.2s and two double rings patterns by a time gap of 2s.The burst has duration of 0.4s. The frequency of the ringing tone is 133 Hz or 400 Hz. Busy tone: Busy tone is bursty 400 Hz signal with silence period in between. The burst and silence duration has the same value of 0.75s. A busy tone is sent out to the calling subscriber whenever the switching equipment or junction line is not available to put through the call or called subscriber line is engaged.
INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

 Number unobtainable tone: The number unobtainable tone is a continuous 400 Hz signal. This tone may be sent to the calling subscriber due to a variety of reasons. In some exchanges this tone is 400 Hz intermittent with 2.5s ON period and 0.5s OFF period. Routing tone: The routing tone or call in progress tone is 400 Hz or 800 Hz intermittent patterns. In an electromechanical system it is usually 800Hz with 50% duty ratio and 0.5s ON-OFF period. In analog electronic exchange it is 400 Hz pattern with 0.5s ON period and 0.5s OFF period. In digital exchange it has 0.1s ON-OFF period at 400 Hz

ADVANTAGES AND DISADVANTAGES OF USING IVR SYSTEMS

ADVANTAGES The biggest advantage of IVR for small and large organizations is to save time and money. Answering phone calls takes a lot of time, and not every phone call deserves the attention of a trained employee. IVR systems can take care of most of the frequently asked questions that an organization receives (office hours, directions, phone directory, common tech support questions, et cetera) and allow customer service reps, salesmen and tech support specialists to concentrate on the harder stuff. If a large company is able to shave even a second off the average length of each phone call with a live operator, it can save them hundreds of thousands or even millions of dollars a year [source: Human Factors International]. IVR systems have the advantage of making callers and customers feel like they're being attended to, even if it's just by a machine. If you have a simple question, it's better to get a quick answer from a computerized operator than to wait ten minutes on hold before talking to a human being. Another advantage is that IVR systems don't sleep. They don't take lunch breaks. They don't go on vacations to the Bahamas. An IVR system can be available 24 hours a day to field questions and help customers with simple tasks. An IVR system can make a small company look bigger. Some IVR hosting plans even set you up with an 800 number to look more official. Subscription IVR hosting plans make it easier for businesses and organizations to use these automated phone services. This is a big advantage of days past, when only large companies with big telecommunications and computing budgets could afford the hardware, software and staff to run in-house IVR systems. DISADVANTAGES The greatest disadvantage of IVR systems is that many people simply dislike talking to machines. Older adults may have a hard time following telephone menus and lengthy instructions. And younger callers get
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frustrated with the slowness of multiple phone menus.

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SWITCHING AND ACCESS PRODUCTS

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SMT (Surface mount technology)

Mass produced electronic circuit boards need to be manufactured in a highly mechanised manner to ensure the lowest cost of manufacture. The traditional leaded electronic components do not lend themselves to this approach. Although some mechanisation was possible, component leads needed to be pre-formed. Also when the leads were inserted into boards automatically problems were often encountered as wires would often not fit properly slowing production rates considerably. It was reasoned that the wires that had traditionally been used for connections were not actually needed for printed circuit board construction. Rather than having leads placed through holes, the components could be soldered onto pads on the board instead. This also saved creating the lead holes in the boards which added cost to the production of the bare PCBs.
As the components were mounted on the surface of the board, rather than having connections that went through holes in the board, the new technology was called surface mount technology or SMT and the devices used were surface mount devices, SMDs. The idea for SMT was adopted very quickly because it enabled greater levels of mechanisation to be used, and it considerably saved on manufacturing costs. To accommodate surface mount technology, SMT, a completely new set of components was needed. New SMT outlines were required, and often the same components, e.g. ICs were sold in both traditional leaded packages and SMT packages. Despite this, the gains of using SMT proved to be so large that it was adopted very quickly.

What are SMT components?

Surface mount devices, SMDs by their nature are very different to the traditional leaded components. They can be split into a number of categories:

Passive SMDs: There is quite a variety of different packages used for passive SMDs. However the majority of passive SMDs are either resistors or capacitors for which the package sizes are reasonably well standardised. Other components including coils, crystals and others tend to have more individual requirements and hence their own packages.

INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

Resistors and capacitors have a variety of package sizes. These have designations that include: 1812, 1206, 0805, 0603, 0402, and 0201. The figures refer to the dimensions in hundreds of an inch. In other words the 1206 measures 12 hundreds by 6 hundreds of an inch. The larger sizes such as 1812 and 1206 were some of the first that were used. They are not in widespread use now as much smaller components are generally required. However they may find use in applications where larger power levels are needed or where other considerations require the larger size. The connections to the printed circuit board are made through metallised areas at either end of the package. Transistors and diodes: These components are often contained in a small plastic package. The connections are made via leads which emanate from the package and are bent so that they touch the board. Three leads are always used for these packages. In this way it is easy to identify which way round the device must go. Integrated circuits: There is a variety of packages which are used for integrated circuits. The package used depends upon the level of interconnectivity required. Many chips like the simple logic chips may only require 14 or 16 pins, whereas other like the VLSI processors and associated chips can require up to 200 or more. In view of the wide variation of requirements there is a number of different packages available. For the smaller chips, packages such as the SOIC (Small Outline Integrated Circuit) may be used. These are effectively the SMT version of the familiar DIL (Dual In Line) packages used for the familiar 74 series logic chips. Additionally there are smaller versions including TSOP (Thin Small Outline Package) and SSOP (Shrink Small Outline Package). The VLSI chips require a different approach. Typically a package known as a quad flat pack is used. This has a square or rectangular footprint and has pins emanating on all four sides. Pins again are bent out of the package in what is termed a gull-wing formation so that they meet the board. The spacing of the pins is dependent upon the number of pins required. For some chips it may be as
INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

close as 20 thousandths of an inch. Great care is required when packaging these chips and handling them as the pins are very easily bent. Other packages are also available. One known as a BGA (Ball Grid Array) is used in many applications. Instead of having the connections on the side of the package, they are underneath. The connection pads have balls of solder that melt during the soldering process, thereby making a good connection with the board and mechanically attaching it. As the whole of the underside of the package can be used, the pitch of the connections is wider and it is found to be much more reliable. A smaller version of the BGA, known as the microBGA is also being used for some ICs. As the name suggests it is a smaller version of the BGA.

INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

SOLDER PASTE PRINTED ON PCB

GLUE DOTS DISPENSED ON PCB BETWEEN SOLDER PADS

CHIPS COMPONETS ARE PLACED ON PCB AT SOLDER PASTE GLUE DOT LOCATION

STENCIL PRINTER

GLUE DISPENSER

CHIP SHOOTER

REFLOW SOLDERING OR GLUE CURING COMPONENTS ARE PLACED ON THE PCB DONE

AUTOMATIC OPTICAL INSPECTION OF SELECTED COMPONENT ON PCB

FINE PITCH IC LIKE QFPS, PLCCS AND COILS/ RELAYS PLACED ON PCB AT SOLDER PASTE LOCATION

REFLOW OVEN

OPTICAL INSEPCTION

FINE PLACER

PROCESS CHART

INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

BTS (Base Trans-Receiver Station)

Base Trans-Receiver Station (BTS) BTS A-9100, is radio frequency mobile communication product based on GSM technology. It is a set of equipments that facilitates wireless communication between user equipment (UE) and a network. A BTS in general consists of Trans-receiver module, Antenna Network Combiner, Controller (SUMA) & Alarm Extension System (XIBM). It is a self contained unit for transmitting / receiving signal for mobile communication.

Types of BTS 1. Indoor BTS 3. Dual Band BTS 2. Outdoor BTS 4. Twin TRX BTS

A BTS in general has the following parts: Transceiver (TRX) Quite widely referred to as the driver receiver (DRX), DRX is either in the form of single (sTRU), double (dTRU) or a composite double radio unit (DRU). It basically does transmission and reception of signals. It also does sending and reception of signals to and from higher network entities (like the base station controller in mobile telephony). Power amplifier (PA) Amplifies the signal from DRX for transmission through antenna; may be integrated with DRX. Combiner Combines feeds from several DRXs so that they could be sent out through a single antenna. This allows for a reduction in the number of antenna used. Duplexer For separating sending and receiving signals to/from antenna. Does sending and receiving signals through the same antenna ports (cables to antenna).
INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

Antenna This is the structure that lies underneath the BTS; it can be installed as it is or disguised in some way Alarm extension system Collects working status alarms of various units in the BTS and extends them to operations and maintenance (O&M) monitoring stations. Control function Controls and manages the various units of BTS, including any software. On-the-spot configurations, status changes, software upgrades, etc. are done through the control function. Baseband receiver unit (BBxx) Frequency hopping, signal DSP, etc.

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CDMA (Code Division Multiple Access)

CDMA (Code Division Multiple Access) is a digital wireless technology to provide mobile communication. CDMA works by converting speech into digital information, which is then transmitted as a radio signal over a wireless network. CDMA uses a unique code to distinguish each different call. The receiving device is instructed to decipher only the data corresponding to a particular code to reconstruct the signal. This enables many subscribers to share the same frequency band and, at the same time, without any cross talk or interference. CDMA WLL technology provides option of limited as well as full mobility to the customers. This helps to provide faster last mile connectivity, where laying of cables is difficult.

CDMA CALL PROCESSING

Begin Analog mode Operation

Analog System Acquisition & Operation

End Analog Mode Operation

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Power Up Mobile station initialization state

Mobile station Idle handoff

Acquired or reacquired system synchronization & system Overhead info Mobile station Idle state

Receives an Acknowledgement to an Access channel transmission Other than an origination Message or page response Message System Access state

Receives a paging channel message requiring an acknowledgement or response; originates a call or perform registration

Directed to a traffic Channel

Mobile Station Control on the traffic channel state

INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

OCB (Organ do Commando B) Telephone Exchange

Introduction
Telecommunication Networks Are Constantly Changing. The Rapid Growth Of The Digital Network, Mobile Network And Intelligent Network And The Proliferation Of New Services Being Constantly Offered To Subscriber Means That Equipment Must Be Continuously Adapted To New Requirements. All The New Switching Systems Are Based On Stored Program Control Concept. The Call Processing Programmes Are Distributed Over Different Control Organs Of The System And Are Stored In Rom/Ram Of The Units Processor In The Control Units By Using The Programme And Data Stored In Unit Rom/Ram Process And Handle Calls. Handling Or Processing A Call Means To Ultimately Establish A Connection In Between Incoming And Outgoing Ends. Depending On The System The Name And Architecture Of Control Units And Switch May Change But Basic Criterion For Switching More Or Less Remains Same. The Alcatel 1000E10 Exchange Also Known By Its Other Name Ocb283 Is Designed To Cater For Evolving Networks And The Need To Rationalize Equipment Operation. Its Modular Architecture Means That New Services Can Be Added And Processing Capacity Can Be Increased Without Interrupting Operation Of The Exchange. Ocb 283 Is A Digital Switching System Which Supports A Variety Of Communication Needs Like Basic Telephony, Isdn, and Interface To Mobile Communication, Data Communication Etc. This System Has Been Developed By Alcatel Of France And Therefore Has Many Similarities To Its Predecessor E-10. The First Ocb283 Exchange Of R11 Version Came To India In 1993. At Present R23 and R24 Are Also Being Supplied. The Basic Architecture Remaining Same, More Facilities To Subscriber And Administration Are Supported By Later Versions. Features of the System 1) It Is a Digital Switching System with Single T Stage Switch. A Maximum Of 2048 Pcms Can Be Connected. 2) It Supports Both Analogue And Digital Subscriber. 3) The System Supports All The Existing Signalling System Like Decadic, Mf, Cas And Also Ccitt#7 Signalling System. 4) It Provides Telephony, Isdn, Data Communication, Cellular Radio and Other Value Added Services. 5) The System Has Auto Recovery Feature. When A Serious Fault Occur In A Control Unit, It Gives A Message To Smm (Operation & Maintenance Unit). The Smm Puts This Unit Out Of Service, Loads The Software Of Faulty Unit In A Backup Unit And Bring It Into Service. Diagnostic Programmes Are Run On The Faulty System And Diagnostics Are Printed On The Terminal. 6) Ocb283 Has Double Remoting Facility. Subscriber Access Unit Csnd Can Be Placed At A INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

Remote Place And Connected To The Main Exchange Through Pcm Links. Further Line Concentrators Are Placed At A Remote Location And Connected To The Csnl Or Csnd Through Pcms. This Special Feature Can Meet Entire Range Of Necessities Like Urban, Semi-Urban And Rural. 7) Various Units Of Ocb283 System Are Connected Over Token Rings. This Enables Fast Exchange Of Information And Avoid Complicated Links And Wiring Between Various Units. 8) The Charge Accounts Of The Subscribers Are Automatically Saved On The Disc, Once In A Day. This Avoids Loss Of Revenue In Case Of Total Power Supply/ Battery Failure Or Any Other Type Of Exchange Failure. 9) Traffic Handling Capacity Of The System Is Very Huge. It Can Handle 8,00,000 Bhca And 25,000 Erlangs Of Traffic. Depending On The Traffic, A Maximum Of 2,00,000 Subscribers Or 60,000 Circuits Can Be Connected. 10) The Exchange Can Be Managed Either Locally Or Through Nmc Of 64Kbps Link. 11) The Ocb283 System Is Made Up Of Only 35 Different Type Of Cards. This Excludes Cards Required For Csn. Because Of This The Number Of Spare Cards Required For Maintenance Purpose, Are Drastically Reduced. 12) All The Control Units Are Implemented Are Implemented On The Same Type Of Hardware. This Is Called A Station. Depending On The Requirement Of Processing Capacity, Software Of Either One Or Several Control Units Can Be Located On The Same Station. For All These Control Units, Only One Backup Station Is Provided, Enabling Automatic Recovery In Case Of Fault. 13) The System Has Very Modular Structure. The Expansion Can Be Carried Out Very Easily By Adding Necessary Hardware & Software. 14). The Smm(O&M Units) Are Duplicated, With One Active And Other Hot Standby. In Case Of Faults, The Switchover Takes Place Automatically. Moreover, Discs Are Also Connected To Both The Smms, There Is No Necessity Of Changing Of Cables From One To Another. 15) The Hard Disc Is Very Small In Size, Compact And Maintenance Free. It Has A Very Huge Memory Capacity Of 1.2Gb. The Detail Billing Data Are Regularly Saved In These Discs Itself, From There It Can Be Transferred To The Magnetic Tapes For The Purpose Of Processing. 16) There Is No Fixed Rack And Rigid Suite Configuration In This System. It Provides Greater Flexibility And Adjustment In The Available Space. 17) This System Can Work At A Temperature 5C To 45C, Though The Optimum Temperature To Work Is 22C.

INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

Subscriber Facilities Provided By Ocb

It Provides A Large Number Of Subscriber Facilities. Some Facilities Are Available To Only Digital Subscriber And As Such They Can Not Be Availed By Analogue Subscribers. To Avail These Facilities Subscriber Number Are Given Special Categories By Man Machine Commands. I. A Line Can Be Made Only Outgoing And Incoming. Ii. Immediate Hotline Facility The Subscriber Is Connected To Another Predetermined Subscriber On Lifting The Handset, Without Dialing Any Number. Iii. Delay Hotline Facility When Subscriber Lifts The Handset, Dial Tone Is Provided, He Can Dial Any Number. If He Does Not Dial A Number, Within A Predetermined Time, He Is Connected To Predetermined Number. Iv. Abbreviated Dialing The Subscriber Can Record A Short Code And Its Corresponding Full Number In The Memory. Later To Dial This Number He Has To Dial Only Short Code Of That Number. V. Call Waiting Indication When A Subscriber Is Engaged In Conversation And If Getting An Incoming Call, An Indication Is Given In The Form Of A Tone. Hearing This, The Subscriber Has Option, Either To Hold The Subscriber In Conversation And Attend The Waiting Call Or To Disconnect This Subscriber And Attend To The Waiting Call. In The Former Case He Can Revert Back To The Earlier Subscriber. Vi. Call Forwarding When Provided, Incoming Calls To The Subscriber Gets Transferred To The Number Mentioned By The Subscriber While Activating The Facility. This Facility Is Especially Very Useful For Those Person Who Are Always On Move. Vii. Conference Between 4 Subscribers The Subscriber A & B While In Conversation, Can Include Two More Subscriber By Pressing * Button And Dialing Their Numbers. Viii. Automatic Call Back On Busy If This Facility Is Activated And If The Called Subscriber Is Found Busy, The Calling Subscriber Simply Replaces The Receiver. The System Keeps Watch On The Called Subscriber And When It Becomes Free, A Ring Is Given To Both The Subscribers. On Lifting They Can Talk To Each Other. Ix. Priority Lines Calls From These Lines Are Processed And Put Through Even When The Number Of Free Channels Are Within A Threshold Or When The System Is Operating In Catastrophic Mode. X. Malicious Call Identification When This Category Is Given To A Subscriber, The Number Of Calling Subscriber, The Number Of Calling Subscriber To This Number Is Printed On The Terminal Or Displayed On The Caller Identification Instrument. INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

Xi. 12 Or 16Khz Meter Pulses The System Can Send 12 Or 16Khz Meter Pulses On The Subscriber Line For The Operating Of The Home Meter. Xii. Battery Reversal The System Extends Battery Reversal When Called Subscriber Answers. This Is Useful In Case Of Ccbs( Coin Collection Box ). Xiii. Detailed Billing The System Provides Detail Bills Given Details Of Date, Time, Metered Units Etc. Xiv. Absent Subscriber Service When Activated, The Incoming Calls Are Diverted To Absent Subscriber Service For Suitable Instruction Or Information. Xv. It Provides 64 Kb/S Digital Connectivity Between Two Subscribers For Data Communication. Xvi. This System Provides Facsimile (Fax) Services And Videotext Services Also. Xvii. This System Also Provides The Facility For Restriction Of The Display Of Calling Subscriber Number On Called SubscriberS Telephone Terminal Or Caller Id Set. To Avail This Facility The Subscriber Has To Be Given A Category Like Some Vvips Or Some Beurocrats. Xviii. User To User Signaling The System Permits Of Mini Messages Between Calling And Called Subscribers During Call Setup And Ringing Phase. Xix. Terminal Portability During The Call A Subscriber (Calling Subscriber As Well As Called Subscriber) Can Unplug Telephone Instrument, Carry It To Some Other Place Or Room And Resume The Call Within 3 Minutes Xx. Listing Of Unanswered Calls The Number Of Calling Subscribers, Who Calls During The Absence Of Called Subscriber, Are Recorded In Called SubscriberS Terminal. The Called Subscriber Than Check Up These Numbers And Call Them Back, If He So Wishes. Xxi. This System Provides Two Type Of Isdn Connections To The Digital Subscriber, One Is Of 2 B + D Line (2 Voice Channels Of 64Kbps & I Data Channel Of 16Kbps) Type And Other Is Of 30 B + D Line (30 Voice Channels Of 64Kbps & 1 Data Channel Of 16Kbps) Type.

INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |

Subscriber Access Unit

Subscriber access unit (CSN) is so designed that they can be equipped with analog or digital subscriber or both. The cards for both are different but they can be equipped in any slot of the shelf. CSN can be placed either in EXCHNAGE switch room or at a remote location. CSN is known as CSNL or CSND. Architecture OF CSN: The CSN have one BASIC RACK and up to 3 Extension Racks. The architecture can be divided into parts: DIGITAL CONTROL UNIT(UCN):1: Control & connection unit (UCX) 2: Auxiliary equipment processing group (GTA) Function Of Control Units: Multi resister (MR):- Call handler setup and release of call. Translator (TR):- Translation of digits, databanks of subscriber & circuits in files. Marker (MQ):- Message distribution between common control & connection units. Charger (TX):- Computing the charges of a call, keeping meter. Matrix System Handler (GX):- Process & make connection in switching matrix on the order from MR or MQ. Common Channel signaling Network Controller:Manage the CCS#7 network for signaling.

INSTITUTE OF TECHNOLOGY , GURU GHASIDAS VISHWAVIDYALAYA, BILASPUR, (C.G) |