74HC193 74HCT193: 1. General Description

74HC193; 74HCT193
Presettable synchronous 4-bit binary up/down counter

Rev. 03 23 May 2007 Product data sheet
1. General description
The 74HC193 and 74HCT193 are high-speed Si-gate CMOS devices and are pin compatible with Low power Schottky TTL (LSTTL). They are specied in compliance with JEDEC standard no. 7A. The 74HC193 and 74HCT193 are 4-bit synchronous binary up/down counters. Separate up/down clocks, CPU and CPD respectively, simplify operation. The outputs change state synchronously with the LOW-to-HIGH transition of either clock input. If the CPU clock is pulsed while CPD is held HIGH, the device will count up. If the CPD clock is pulsed while CPU is held HIGH, the device will count down. Only one clock input can be held HIGH at any time, or erroneous operation will result. The device can be cleared at any time by the asynchronous master reset input (MR); it may also be loaded in parallel by activating the asynchronous parallel load input (PL). The 74HC193 and 74HCT193 each contain four master-slave JK ip-ops with the necessary steering logic to provide the asynchronous reset, load, and synchronous count up and count down functions. Each ip-op contains JK feedback from slave to master, such that a LOW-to-HIGH transition on the CPD input will decrease the count by one, while a similar transition on the CPU input will advance the count by one. One clock should be held HIGH while counting with the other, otherwise the circuit will either count by twos or not at all, depending on the state of the rst ip-op, which cannot toggle as long as either clock input is LOW. Applications requiring reversible operation must make the reversing decision while the activating clock is HIGH to avoid erroneous counts. The terminal count up (TCU) and terminal count down (TCD) outputs are normally HIGH. When the circuit has reached the maximum count state of 15, the next HIGH-to-LOW transition of CPU will cause TCU to go LOW. TCU will stay LOW until CPU goes HIGH again, duplicating the count up clock. Likewise, the TCD output will go LOW when the circuit is in the zero state and the CPD goes LOW. The terminal count outputs can be used as the clock input signals to the next higher order circuit in a multistage counter, since they duplicate the clock waveforms. Multistage counters will not be fully synchronous, since there is a slight delay time difference added for each stage that is added. The counter may be preset by the asynchronous parallel load capability of the circuit. Information present on the parallel data inputs (D0 to D3) is loaded into the counter and appears on the outputs (Q0 to Q3) regardless of the conditions of the clock inputs when the parallel load (PL) input is LOW. A HIGH level on the master reset (MR) input will disable the parallel load gates, override both clock inputs and set all outputs (Q0 to
NXP Semiconductors
74HC193; 74HCT193
Q3) LOW. If one of the clock inputs is LOW during and after a reset or load operation, the next LOW-to-HIGH transition of that clock will be interpreted as a legitimate signal and will be counted.
2. Features
I I I I Synchronous reversible 4-bit binary counting Asynchronous parallel load Asynchronous reset Expandable without external logic
3. Ordering information
Table 1. Ordering information Package Temperature range 74HC193D 74HC193DB 74HC193N 74HC193PW 74HCT193D 74HCT193DB 74HCT193N 74HCT193PW 40 C to +125 C 40 C to +125 C 40 C to +125 C 40 C to +125 C 40 C to +125 C 40 C to +125 C 40 C to +125 C 40 C to +125 C Name SO16 SSOP16 DIP16 TSSOP16 SO16 SSOP16 DIP16 TSSOP16 Description plastic small outline package; 16 leads; body width 3.9 mm plastic shrink small outline package; 16 leads; body width 5.3 mm plastic dual in-line package; 16 leads (300 mil) plastic thin shrink small outline package; 16 leads; body width 4.4 mm plastic small outline package; 16 leads; body width 3.9 mm plastic shrink small outline package; 16 leads; body width 5.3 mm plastic dual in-line package; 16 leads (300 mil) plastic thin shrink small outline package; 16 leads; body width 4.4 mm Version SOT109-1 SOT338-1 SOT38-4 SOT403-1 SOT109-1 SOT338-1 SOT38-4 SOT403-1 Type number
4. Functional diagram
15 D0 1 D1 10 D2 9 D3 TCU COUNTER TCD 12 13 CPU 14 MR FLIP-FLOPS Q0 3 2 Q1 6 Q2 7 Q3
001aag405
11 5 4
PL CPU CPD
PL 11 5 4 14 MR
D0 15
D1 1
D2 10
D3 9 12 13 TCU TCD
CPD
3 Q0
2 Q1
6 Q2
7 Q3
001aag409
Fig 1. Functional diagram

74HC_HCT193_3
Fig 2. Logic symbol

NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 23 May 2007
2 of 29
NXP Semiconductors
74HC193; 74HCT193
11 5 4 14 15 1 10 9
C3 2+ G1 1 G2 R 3D
CTR4
3 2 6 7 2CT = 0 1CT = 15 13 12
001aag410
Fig 3. IEC logic symbol
74HC_HCT193_3
Product data sheet
Rev. 03 23 May 2007
3 of 29
xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx
Product data sheet Rev. 03 23 May 2007
CPD MR
NXP B.V. 2007. All rights reserved. 74HC_HCT193_3
NXP Semiconductors
D0
D1
D2
D3
PL
CPU TCU
SD T
Q T
SD
Q T
SD
Q T
SD
FF1 Q RD
FF2 Q RD
FF3 Q RD
FF4 Q RD
74HC193; 74HCT193
TCD
Q0
Q1
Q2
Q3
001aag412
4 of 29
Fig 4. Logic diagram
NXP Semiconductors
74HC193; 74HCT193
5. Pinning information
5.1 Pinning
74HC193 74HCT193
D1 1 2 3 4 5 6 7 8
001aaf408
74HC193 74HCT193
D1 Q1 Q0 CPD CPU Q2 Q3 GND 1 2 3 4 5 6 7 8
001aag406
16 VCC 15 D0 14 MR 13 TCD 12 TCU 11 PL 10 D2 9 D3 D1 Q1 Q0 CPD CPU Q2 Q3 GND 1 2 3 4 5 6 7 8

001aag407
16 VCC 15 D0 14 MR 13 TCD 12 TCU 11 PL 10 D2 9 D3
74HC193 74HCT193
16 VCC 15 D0 14 MR 13 TCD 12 TCU 11 PL 10 D2 9 D3
Q1 Q0 CPD CPU Q2 Q3 GND
Fig 5. Pin conguration SO16
Fig 6. Pin conguration TSSOP16 and SSOP16
Fig 7. Pin conguration DIP16
5.2 Pin description

Table 2. Symbol D0 D1 D2 D3 Q0 Q1 Q2 Q3 CPD CPU GND PL TCU TCD MR VCC
[1]
Pin description Pin 15 1 10 9 3 2 6 7 4 5 8 11 12 13 14 16 Description data input 0 data input 1 data input 2 data input 3 ip-op output 0 ip-op output 1 ip-op output 2 ip-op output 3 count down clock input[1] count up clock input[1] ground (0 V) asynchronous parallel load input (active LOW) terminal count up (carry) output (active LOW) terminal count down (borrow) output (active LOW) asynchronous master reset input (active HIGH) supply voltage
LOW-to-HIGH, edge triggered.
74HC_HCT193_3
Product data sheet
Rev. 03 23 May 2007
5 of 29
NXP Semiconductors
74HC193; 74HCT193
6. Functional description
Table 3. Function table[1] Inputs MR Reset (clear) Parallel load H H L L L L Count up Count down
[1]
Operating mode
Outputs CPU CPD D0 X X X X L H H L H L H X X H X X L L H H X X D1 X X L L H H X X D2 X X L L H H X X D3 X X L L H H X X Q0 L L L L H H Q1 L L L L H H Q2 L L L L H H Q3 L L L L H H TCU TCD H H H H L H H[2] H L H L H H H H H[3]
PL X X L L L L H H
L L
count up count down
H = HIGH voltage level L = LOW voltage level X = dont care = LOW-to-HIGH clock transition. TCU = CPU at terminal count up (HHHH) TCD = CPD at terminal count down (LLLL).
[2] [3]
74HC_HCT193_3
Product data sheet
Rev. 03 23 May 2007
6 of 29
NXP Semiconductors
74HC193; 74HCT193
MR(1)
PL
D0
D1
D2
D3 CPU(2) CPD(2)
Q0
Q1
Q2
Q3
TCU
TCD 0 CLEAR 13 PRESET 14 15 0 COUNT UP 1 2 1 0 15 14 COUNT DOWN 13

001aag411
(1) Clear overrides load, data and count inputs. (2) When counting up, the count down clock input (CPD) must be HIGH, when counting down the count up clock input (CPU) must be HIGH. Sequence Clear (reset outputs to zero); load (preset) to binary thirteen; count up to fourteen, fteen, terminal count up, zero, one and two; count down to one, zero, terminal count down, fteen, fourteen and thirteen.
Fig 8. Typical clear, load and count sequence
74HC_HCT193_3
Product data sheet
Rev. 03 23 May 2007
7 of 29
NXP Semiconductors
74HC193; 74HCT193
7. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol VCC IIK IOK IO ICC IGND Tstg Ptot Parameter supply voltage input clamping current output clamping current output current supply current ground current storage temperature total power dissipation DIP16 package SO16 package SSOP16 package TSSOP16 package
[1] [2]
[2] [2] [2] [2]
Conditions VI < 0.5 V or VI > VCC + 0.5 V VO < 0.5 V or VO > VCC + 0.5 V VO = 0.5 V to VCC + 0.5 V
[1] [1]
Min 0.5 65 -
Max +7.0 20 20 25 50 50 +150 750 500 500 500
Unit V mA mA mA mA mA C mW mW mW mW
The input and output voltage ratings may be exceeded if the input and output current ratings are observed. For DIP16 packages: above 70 C the value of Ptot derates linearly at 12 mW/K. For SO16 packages: above 70 C the value of Ptot derates linearly at 8 mW/K. For SSOP16 and TSSOP16 packages: above 60 C the value of Ptot derates linearly at 5.5 mW/K.
8. Recommended operating conditions

Table 5. 74HC193 VCC VI VO Tamb tr supply voltage input voltage output voltage ambient temperature rise time inputs VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V tf fall time inputs VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V 6.0 1000 ns 500 400 ns ns 6.0 1000 ns 500 400 ns ns 2.0 0 0 40 5.0 +25 6.0 VCC VCC V V V Recommended operating conditions Conditions Min Typ Max Unit Symbol Parameter
+125 C
74HC_HCT193_3
Product data sheet
Rev. 03 23 May 2007
8 of 29
NXP Semiconductors
74HC193; 74HCT193
Table 5. 74HCT193 VCC VI VO Tamb tr tf
Recommended operating conditions continued Conditions Min 4.5 0 0 40 inputs; VCC = 4.5 V inputs; VCC = 4.5 V Typ 5.0 +25 6.0 6.0 Max 5.5 VCC VCC 500 500 Unit V V V ns ns
Symbol Parameter supply voltage input voltage output voltage ambient temperature rise time fall time
+125 C
9. Static characteristics
Table 6. Static characteristics type 74HC193 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol VIH Parameter HIGH-level input voltage Conditions VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VIL LOW-level input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VOH HIGH-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 4.0 mA; VCC = 4.5 V IO = 5.2 mA; VCC = 6.0 V VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 4.0 mA; VCC = 4.5 V IO = 5.2 mA; VCC = 6.0 V II ICC Ci VIH input leakage current supply current input capacitance HIGH-level input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VI = VCC or GND; VCC = 6.0 V VI = VCC or GND; IO = 0 A; VCC = 6.0 V 1.5 3.15 4.2 0 0 0 0.15 0.16 3.5 0.1 0.1 0.1 0.26 0.26 0.1 8.0 V V V V V A A pF V V V Min 1.5 3.15 4.2 1.9 4.4 5.9 3.98 5.48 Typ 1.2 2.4 3.2 0.8 2.1 2.8 2.0 4.5 6.0 4.32 5.81 Max 0.5 1.35 1.8 V V V V V Unit V V V V V V Tamb = 25 C
Tamb = 40 C to +85 C
74HC_HCT193_3
Product data sheet
Rev. 03 23 May 2007
9 of 29
NXP Semiconductors
74HC193; 74HCT193
Table 6. Static characteristics type 74HC193 continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol VIL Parameter LOW-level input voltage Conditions VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VOH HIGH-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 4.0 mA; VCC = 4.5 V IO = 5.2 mA; VCC = 6.0 V VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 4.0 mA; VCC = 4.5 V IO = 5.2 mA; VCC = 6.0 V II ICC input leakage current supply current VI = VCC or GND; VCC = 6.0 V VI = VCC or GND; IO = 0 A; VCC = 6.0 V VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VIL LOW-level input voltage VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V VOH HIGH-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 4.0 mA; VCC = 4.5 V IO = 5.2 mA; VCC = 6.0 V VOL LOW-level output voltage VI = VIH or VIL IO = 20 A; VCC = 2.0 V IO = 20 A; VCC = 4.5 V IO = 20 A; VCC = 6.0 V IO = 4.0 mA; VCC = 4.5 V IO = 5.2 mA; VCC = 6.0 V II ICC input leakage current supply current VI = VCC or GND; VCC = 6.0 V VI = VCC or GND; IO = 0 A; VCC = 6.0 V 0.1 0.1 0.1 0.4 0.4 1.0 160 V V V V V A A 1.9 4.4 5.9 3.7 5.2 V V V V V 0.1 0.1 0.1 0.33 0.33 1.0 80 V V V V V A A 1.9 4.4 5.9 3.84 5.34 V V V V V Min Typ Max 0.5 1.35 1.8 Unit V V V
Tamb = 40 C to +125 C VIH HIGH-level input voltage 1.5 3.15 4.2 0.5 1.35 1.8 V V V V V V
74HC_HCT193_3
Product data sheet
Rev. 03 23 May 2007
10 of 29
NXP Semiconductors
74HC193; 74HCT193
Table 7. Static characteristics type 74HCT193 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol VIH VIL VOH Parameter HIGH-level input voltage LOW-level input voltage HIGH-level output voltage Conditions VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V VI = VIH or VIL; VCC = 4.5 V IO = 20 A IO = 4.0 mA VOL LOW-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A IO = 4.0 mA II ICC ICC input leakage current supply current additional supply current VI = VCC or GND; VCC = 5.5 V VI = VCC or GND; IO = 0 A; VCC = 5.5 V per input pin; VI = VCC 2.1 V and other inputs at VCC or GND; IO = 0 A; VCC = 4.5 V to 5.5 V pin Dn pins CPU, CPD pin PL pin MR Ci VIH VIL VOH input capacitance HIGH-level input voltage LOW-level input voltage HIGH-level output voltage VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V VI = VIH or VIL; VCC = 4.5 V IO = 20 A IO = 4.0 mA VOL LOW-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A IO = 4.0 mA II ICC ICC input leakage current supply current additional supply current VI = VCC or GND; VCC = 5.5 V VI = VCC or GND; IO = 0 A; VCC = 5.5 V per input pin; VI = VCC 2.1 V and other inputs at VCC or GND; IO = 0 A; VCC = 4.5 V to 5.5 V pin Dn pins CPU, CPD pin PL pin MR Tamb = 40 C to +125 C VIH VIL
74HC_HCT193_3
Min 2.0 4.4 3.98 -
Typ 1.6 1.2 4.5 4.32 0 0.15 -
Max 0.8 0.1 0.26 0.1 8.0
Unit V V V V V V A A
Tamb = 25 C
2.0 4.4 3.84 -
35 140 65 105 3.5 -
126 504 234 378 0.8 0.1 0.33 1.0 80
A A A A pF V V V V V V A A
Tamb = 40 C to +85 C
2.0 -
157.5 630 292.5 472.5 0.8
A A A A V V
11 of 29
HIGH-level input voltage LOW-level input voltage
VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V

Rev. 03 23 May 2007
Product data sheet
NXP Semiconductors
74HC193; 74HCT193
Table 7. Static characteristics type 74HCT193 continued At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol VOH Parameter HIGH-level output voltage Conditions VI = VIH or VIL; VCC = 4.5 V IO = 20 A IO = 4.0 mA VOL LOW-level output voltage VI = VIH or VIL; VCC = 4.5 V IO = 20 A IO = 4.0 mA II ICC ICC input leakage current supply current additional supply current VI = VCC or GND; VCC = 5.5 V VI = VCC or GND; IO = 0 A; VCC = 5.5 V per input pin; VI = VCC 2.1 V and other inputs at VCC or GND; IO = 0 A; VCC = 4.5 V to 5.5 V pin Dn pins CPU, CPD pin PL pin MR 171.5 686 318.5 514.5 A A A A 0.1 0.4 1.0 160 V V A A 4.4 3.7 V V Min Typ Max Unit
74HC_HCT193_3
Product data sheet
Rev. 03 23 May 2007
12 of 29
NXP Semiconductors
74HC193; 74HCT193
10. Dynamic characteristics

Table 8. Symbol tpd Dynamic characteristics type 74HC193 Parameter propagation delay Conditions Min CPU, CPD to Qn; see Figure 9 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V CPU to TCU; see Figure 10 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V CPD to TCD; see Figure 10 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V PL to Qn; see Figure 11 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V MR to Qn; see Figure 12 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V Dn to Qn; see Figure 11 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V PL to TCU, PL to TCD; see Figure 14 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V MR to TCU, MR to TCD; see Figure 14 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
74HC_HCT193_3
25 C Typ Max
[1]
40 C to +85 C 40 C to +125 C Unit Min Max Min Max
63 23 18 215 43 37 270 54 46 325 65 55 ns ns ns
39 14 11
125 25 21
155 31 26
190 38 32
ns ns ns
39 14 11
125 25 21
155 31 26
190 38 32
ns ns ns
69 25 20
220 44 37
275 55 47
330 66 56
ns ns ns
58 21 17
200 40 34
250 50 43
300 60 51
ns ns ns
69 25 20
210 42 36
265 53 45
315 63 54
ns ns ns
80 29 23
290 58 49
365 73 62
435 87 74
ns ns ns
74 27 22
285 57 48
355 71 60
430 86 73
ns ns ns
Product data sheet
Rev. 03 23 May 2007
13 of 29
NXP Semiconductors
74HC193; 74HCT193
Table 8. Symbol tpd
Dynamic characteristics type 74HC193 continued Parameter propagation delay Conditions Min Dn to TCU, Dn to TCD; see Figure 14 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V 80 29 23 19 7 6 19 7 6 290 58 49 75 15 13 75 15 13 365 73 62 95 19 16 95 19 16 435 87 74 110 22 19 110 22 19 ns ns ns ns ns ns ns ns ns 25 C Typ Max 40 C to +85 C 40 C to +125 C Unit Min Max Min Max
tTHL
HIGH to LOW see Figure 12 output transition VCC = 2.0 V time VCC = 4.5 V VCC = 6.0 V LOW to HIGH see Figure 12 output transition VCC = 2.0 V time VCC = 4.5 V VCC = 6.0 V pulse width CPU, CPD (HIGH or LOW); see Figure 9 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V MR (HIGH); see Figure 12 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V PL (LOW); see Figure 11 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V
tTLH
tW
100 20 17
22 8 6
125 25 21
150 30 26
ns ns ns
100 20 17
25 9 7
125 25 21
150 30 26
ns ns ns
100 20 17
19 7 6
125 25 21
150 30 26
ns ns ns
trec
recovery time
PL to CPU, CPD; see Figure 11 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V MR to CPU, CPD; see Figure 12 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V 50 10 9 0 0 0 65 13 11 75 15 13 ns ns ns 50 10 9 8 3 2 65 13 11 75 15 13 ns ns ns
74HC_HCT193_3
Product data sheet
Rev. 03 23 May 2007
14 of 29
NXP Semiconductors
74HC193; 74HCT193
Table 8. Symbol tsu
Dynamic characteristics type 74HC193 continued Parameter set-up time Conditions Min Dn to PL; see Figure 13; note: CPU = CPD = HIGH VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V 80 16 14 22 8 6 100 20 17 120 24 20 ns ns ns 25 C Typ Max 40 C to +85 C 40 C to +125 C Unit Min Max Min Max
th
hold time
Dn to PL; see Figure 13 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V CPU to CPD, CPD to CPU; see Figure 15 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V 80 16 8 22 8 6 100 20 17 120 24 20 ns ns ns 0 0 0 14 5 4 0 0 0 0 0 0 ns ns ns
fmax
maximum frequency
CPU, CPD; see Figure 9 VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V 4.0 20 24
[2]
13.5 41 49 24
3.2 16 19 -
2.6 13 15 -
MHz MHz MHz pF
CPD
power dissipation capacitance
VI = GND to VCC; VCC = 5 V; fi = 1 MHz
[1] [2]
tpd is the same as tPHL and tPLH. CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of outputs.
74HC_HCT193_3
Product data sheet
Rev. 03 23 May 2007
15 of 29
NXP Semiconductors
74HC193; 74HCT193
Table 9. Symbol tpd
Dynamic characteristics type 74HCT193 Parameter propagation delay Conditions Min CPU, CPD to Qn; see Figure 9 VCC = 4.5 V CPU to TCU; see Figure 10 VCC = 4.5 V CPD to TCD; see Figure 10 VCC = 4.5 V PL to Qn; see Figure 11 VCC = 4.5 V MR to Qn; see Figure 12 VCC = 4.5 V Dn to Qn; see Figure 11 VCC = 4.5 V PL to TCU, PL to TCD; see Figure 14 VCC = 4.5 V MR to TCU, MR to TCD; see Figure 14 VCC = 4.5 V Dn to TCU, Dn to TCD; see Figure 14 VCC = 4.5 V 32 7 58 15 73 19 87 22 ns ns 29 55 69 83 ns 31 55 69 83 ns 27 46 58 69 ns 22 40 50 60 ns 26 46 58 69 ns 15 27 34 41 ns 15 27 34 41 ns
[1]
25 C Typ Max
40 C to +85 C 40 C to +125 C Unit Min Max Min Max
23
43
54
65
ns
tTHL
HIGH to LOW see Figure 12 output transition VCC = 4.5 V time LOW to HIGH see Figure 12 output transition VCC = 4.5 V time pulse width CPU, CPD (HIGH or LOW); see Figure 9 VCC = 4.5 V MR (HIGH); see Figure 12 VCC = 4.5 V PL (LOW); see Figure 11 VCC = 4.5 V
tTLH
15
19
22
ns
tW
25
11
31
38
ns
20
25
30
ns
20
25
30
ns
74HC_HCT193_3
Product data sheet
Rev. 03 23 May 2007
16 of 29
NXP Semiconductors
74HC193; 74HCT193
Table 9. Symbol trec
Dynamic characteristics type 74HCT193 continued Parameter recovery time Conditions Min PL to CPU, CPD; see Figure 11 VCC = 4.5 V MR to CPU, CPD; see Figure 12 VCC = 4.5 V 10 0 13 15 ns 10 2 13 15 ns 25 C Typ Max 40 C to +85 C 40 C to +125 C Unit Min Max Min Max
tsu
set-up time
Dn to PL; see Figure 13; note: CPU = CPD = HIGH VCC = 4.5 V 16 8 20 24 ns Dn to PL; see Figure 13 VCC = 4.5 V CPU to CPD, CPD to CPU; see Figure 15 VCC = 4.5 V 16 7 20 24 ns 0 6 0 0 ns
th
hold time
fmax
maximum frequency power dissipation capacitance
CPU, CPD; see Figure 9 VCC = 4.5 V 20

[2]
43 26
16 -
13 -
MHz pF
CPD
VI = GND to VCC 1.5 V; VCC = 5 V; fi = 1 MHz
[1] [2]
tpd is the same as tPHL and tPLH. CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD VCC2 fi N + (CL VCC2 fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in V; N = number of inputs switching; (CL VCC2 fo) = sum of outputs.
74HC_HCT193_3
Product data sheet
Rev. 03 23 May 2007
17 of 29
NXP Semiconductors
74HC193; 74HCT193
11. Waveforms
1/fmax VI CPU, CPD input GND tW t PHL VOH Qn output VOL VM
001aag413
VM
t PLH
Measurement points are given in Table 10. tPLH and tPHL are the same as tpd. Logic levels VOL and VOH are typical output voltage drops that occur with the output load.
Fig 9. The clock (CPU, CPD) to output (Qn) propagation delays, the clock pulse width, and the maximum clock pulse frequency
VI CPU, CPD input GND tPHL VOH TCU, TCD output VOL VM
001aag414
VM
tPLH
Fig 10. The clock (CPU, CPD) to terminal count output (TCU, TCD) propagation delays
74HC_HCT193_3
Product data sheet
Rev. 03 23 May 2007
18 of 29
NXP Semiconductors
74HC193; 74HCT193
VI Dn input GND VI PL input GND tW VI CPU, CPD input GND t PLH VOH Qn output VOL
001aag415
VM
VM t rec VM
t PHL
VM
Fig 11. The parallel load input (PL) and data (Dn) to Qn output propagation delays and PL removal time to clock input (CPU, CPD)
VI MR input GND tW VI CPU, CPD input GND t PHL VOH Qn output VOL 90 % VM 10 % t THL t TLH
001aag416
VM
t rec VM
Fig 12. The master reset input (MR) pulse width, MR to Qn propagation delays, MR to CPU, CPD removal time and output transition times
74HC_HCT193_3
Product data sheet
Rev. 03 23 May 2007
19 of 29
NXP Semiconductors
74HC193; 74HCT193
VI Dn input GND VI PL input GND VOH Qn output VOL

001aag417
VM tsu th VM tsu th
The shaded areas indicate when the input is permitted to change for predictable output performance. Measurement points are given in Table 10. Logic levels VOL and VOH are typical output voltage drops that occur with the output load.
Fig 13. The data input (Dn) to parallel load input (PL) set-up and hold times
VI PL, MR, Dn input GND tPLH VOH TCU, TCD output VOL
001aag418
VM
tPHL
VM
Fig 14. The data input (Dn), parallel load input (PL) and the master reset input (MR) to the terminal count outputs (TCU, TCD) propagation delays
VI CPU or CPD input GND th VI CPD or CPU input GND VM

001aag419
VM
Measurement points are given in Table 10.
Fig 15. The CPU to CPD or CPD to CPU hold times
74HC_HCT193_3
Product data sheet
Rev. 03 23 May 2007
20 of 29
NXP Semiconductors
74HC193; 74HCT193
Table 10. Type 74HC193 74HCT193
Measurement points Input VM 0.5 VCC 1.3 V VI GND to VCC GND to 3 V Output VM 0.5 VCC 1.3 V
VI negative pulse 0V
tW 90 % VM 10 % tf tr tr tf 90 % VM 10 % tW VM VM
VI positive pulse 0V
VCC
VCC
PULSE GENERATOR
VI
VO
RL
S1
DUT
RT CL
open
001aad983
Test data is given in Table 11. Denitions test circuit: RT = Termination resistance should be equal to output impedance Zo of the pulse generator CL = Load capacitance including jig and probe capacitance RL = Load resistor S1 = Test selection switch
Fig 16. Load circuitry for measuring switching times Table 11. Type 74HC193 74HCT193 Test data Input VI VCC 3V tr, tf 6 ns 6 ns Load CL 15 pF, 50 pF 15 pF, 50 pF RL 1 k 1 k S1 position tPHL, tPLH open open
74HC_HCT193_3
Product data sheet
Rev. 03 23 May 2007
21 of 29
NXP Semiconductors
74HC193; 74HCT193
12. Application information

data input D0 D1 D2 D3 up clock down clock CPU CPD PL asynchronous parallel load reset data output
001aag420
D0 D1 D2 D3 CPU CPD PL TCU carry borrow
TCU
IC1 TCD
MR
IC2 TCD
MR
Q0 Q1 Q2 Q3
Q0 Q1 Q2 Q3
Fig 17. Application for cascaded up/down counter with parallel load
74HC_HCT193_3
Product data sheet
Rev. 03 23 May 2007
22 of 29
NXP Semiconductors
74HC193; 74HCT193
13. Package outline

SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
A X
c y HE v M A
Z 16 9
Q A2 pin 1 index Lp 1 e bp 8 w M L detail X A1 (A 3) A
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07 JEDEC MS-012 JEITA EUROPEAN PROJECTION A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.05 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3
0.010 0.057 0.069 0.004 0.049
0.019 0.0100 0.39 0.014 0.0075 0.38
0.244 0.041 0.228
0.028 0.004 0.012
8 o 0
ISSUE DATE 99-12-27 03-02-19
Fig 18. Package outline SOT109-1 (SO16)

74HC_HCT193_3 NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 03 23 May 2007
23 of 29
NXP Semiconductors
74HC193; 74HCT193
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
SOT338-1
A X
c y HE v M A
Z 16 9
Q A2 A1 pin 1 index Lp L 1 bp 8 w M detail X (A 3) A
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 6.4 6.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 1.00 0.55 8 o 0
o
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT338-1 REFERENCES IEC JEDEC MO-150 JEITA EUROPEAN PROJECTION
ISSUE DATE 99-12-27 03-02-19
Fig 19. Package outline SOT338-1 (SSOP16)

Product data sheet
Rev. 03 23 May 2007
24 of 29
NXP Semiconductors
74HC193; 74HCT193
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
D seating plane
ME
A2
A1
c Z e b1 b 16 9 b2 MH w M (e 1)
pin 1 index E
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.02 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 b2 1.25 0.85 0.049 0.033 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 0.76 0.03
Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT38-4 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
ISSUE DATE 95-01-14 03-02-13
Fig 20. Package outline SOT38-4 (DIP16)

Product data sheet
Rev. 03 23 May 2007
25 of 29
NXP Semiconductors
74HC193; 74HCT193
TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm
SOT403-1
c y HE v M A
16
Q A2 pin 1 index A1 Lp L (A 3) A
1
e bp
8
w M detail X
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.05 A2 0.95 0.80 A3 0.25 bp 0.30 0.19 c 0.2 0.1 D (1) 5.1 4.9 E (2) 4.5 4.3 e 0.65 HE 6.6 6.2 L 1 Lp 0.75 0.50 Q 0.4 0.3 v 0.2 w 0.13 y 0.1 Z (1) 0.40 0.06 8 o 0
o
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT403-1 REFERENCES IEC JEDEC MO-153 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-18
Fig 21. Package outline SOT403-1 (TSSOP16)

Product data sheet
Rev. 03 23 May 2007
26 of 29
NXP Semiconductors
74HC193; 74HCT193
14. Revision history

Table 12. Revision history Release date 20070523 Data sheet status Product data sheet Change notice Supersedes 74HC_HCT193_CNV_2 Document ID 74HC_HCT193_3 Modications:
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Family specication included Product specication -
74HC_HCT193_CNV_2
19970828
74HC_HCT193_3
Product data sheet
Rev. 03 23 May 2007
27 of 29
NXP Semiconductors
74HC193; 74HCT193
15. Legal information 16. Data sheet status

Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualication Production
Denition This document contains data from the objective specication for product development. This document contains data from the preliminary specication. This document contains the product specication.
Please consult the most recently issued document before initiating or completing a design. The term short data sheet is explained in section Denitions. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
16.1 Denitions
Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales ofce. In case of any inconsistency or conict with the short data sheet, the full data sheet shall prevail.
malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customers own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specied use without further testing or modication. Limiting values Stress above one or more limiting values (as dened in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/prole/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
16.2 Disclaimers
General Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
16.3 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
17. Contact information

For additional information, please visit: http://www.nxp.com For sales ofce addresses, send an email to: salesaddresses@nxp.com
74HC_HCT193_3
Product data sheet
Rev. 03 23 May 2007
28 of 29
NXP Semiconductors
74HC193; 74HCT193
18. Contents
1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 16 16.1 16.2 16.3 17 18 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 5 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8 Recommended operating conditions. . . . . . . . 8 Static characteristics. . . . . . . . . . . . . . . . . . . . . 9 Dynamic characteristics . . . . . . . . . . . . . . . . . 13 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Application information. . . . . . . . . . . . . . . . . . 22 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 23 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 27 Legal information. . . . . . . . . . . . . . . . . . . . . . . 28 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 28 Denitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Contact information. . . . . . . . . . . . . . . . . . . . . 28 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information.
NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 23 May 2007 Document identifier: 74HC_HCT193_3

74HC193 74HCT193: 1. General Description

Загружено:

Сведения о документе

Исходное описание:

Оригинальное название

Авторское право

Доступные форматы

Поделиться этим документом

Поделиться или встроить документ

Параметры публикации

Этот документ был вам полезен?

Это неприемлемый материал?

Авторское право:

Доступные форматы

74HC193 74HCT193: 1. General Description

Загружено:

Авторское право:

Доступные форматы

74HC193; 74HCT193

Presettable synchronous 4-bit binary up/down counter

Fig 1. Functional diagram

Fig 2. Logic symbol

Product data sheet

Rev. 03 23 May 2007

Fig 3. IEC logic symbol

NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 03 23 May 2007

Presettable synchronous 4-bit binary up/down counter

Fig 4. Logic diagram

16 VCC 15 D0 14 MR 13 TCD 12 TCU 11 PL 10 D2 9 D3 D1 Q1 Q0 CPD CPU Q2 Q3 GND 1 2 3 4 5 6 7 8

16 VCC 15 D0 14 MR 13 TCD 12 TCU 11 PL 10 D2 9 D3

Q1 Q0 CPD CPU Q2 Q3 GND

Fig 5. Pin conguration SO16

Fig 6. Pin conguration TSSOP16 and SSOP16

Fig 7. Pin conguration DIP16

5.2 Pin description

LOW-to-HIGH, edge triggered.

NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 03 23 May 2007

Outputs CPU CPD D0 X X X X L H H L H L H X X H X X L L H H X X D1 X X L L H H X X D2 X X L L H H X X D3 X X L L H H X X Q0 L L L L H H Q1 L L L L H H Q2 L L L L H H Q3 L L L L H H TCU TCD H H H H L H H[2] H L H L H H H H H[3]

count up count down

NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 03 23 May 2007

TCD 0 CLEAR 13 PRESET 14 15 0 COUNT UP 1 2 1 0 15 14 COUNT DOWN 13

Fig 8. Typical clear, load and count sequence

NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 03 23 May 2007

Max +7.0 20 20 25 50 50 +150 750 500 500 500

8. Recommended operating conditions

NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 03 23 May 2007

Table 5. 74HCT193 VCC VI VO Tamb tr tf

NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 03 23 May 2007

NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 03 23 May 2007

Min 2.0 4.4 3.98 -

Typ 1.6 1.2 4.5 4.32 0 0.15 -

Max 0.8 0.1 0.26 0.1 8.0

2.0 4.4 3.84 -

35 140 65 105 3.5 -

126 504 234 378 0.8 0.1 0.33 1.0 80

157.5 630 292.5 472.5 0.8

HIGH-level input voltage LOW-level input voltage

VCC = 4.5 V to 5.5 V VCC = 4.5 V to 5.5 V

NXP B.V. 2007. All rights reserved.

Product data sheet

NXP B.V. 2007. All rights reserved.

Product data sheet

Rev. 03 23 May 2007

10. Dynamic characteristics

40 C to +85 C 40 C to +125 C Unit Min Max Min Max

63 23 18 215 43 37 270 54 46 325 65 55 ns ns ns