Microchip Pb -Free Tin Pb-Free Whisker Update

iNEMI/Jedec Involvement
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Microchip Engagement
iNEMI test method team member Participated in the tin whisker test method specification JESD22A121 development Participated in face-to-face meetings Assisting team with DOE5 ambient bake reliability test Jedec JC14.3 task force team member Participated in the tin whisker qualification specification JESD201 development Participated in the JESD201 ballot vote

Pb -Free Related Controls Pb-Free

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Microchips Plating Subcontractors

Most have ISO/TS16949 certification Have a control plan Perform 150C anneal bake Perform bath impurity checks Have a minimum plating thickness of 400 micro inches Microchip measures the matte tin thickness at the thinnest location on the plating strip

Ambient bake tin whisker reliability test monitor program

Test samples from all plating subcontractors

Current Tin Whisker Reliability Test Update

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Testing performed per the June 2004 NEMI test method guidelines: Temperature cycling (T/C) (-55 to +85C), ambient bake (30C/60%

relative humidity (RH)) & high temperature/humidity (60C/93% RH) tests performed. Test matrix evaluated 2 different plating sites, plating chemistries, packages & lead frame (LF) materials. Different test samples inspected at each read point. Test matrix did not include samples from 3 different assembly lots. All inspections were performed with a SEM. Matte tin grain size 4.5 5.5 micron range. Microchip passed 2000 T/Cs, 4000 hrs ambient bake (7000 hrs with a reduced sample size) & 3000 hrs high temperature/humidity reliability testing. High temperature/humidity test was stopped after 3000 hrs due to corrosion affects confounding the data.

New Tin Whisker Reliability Test Status

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Testing to be repeated per JESD201 requirements in 2005: Temperature cycling (-55 to +85C, 1500 cycles), ambient bake (30C/60% RH, 4000 hrs) & high temperature/humidity (55C/85% RH, 4000 hrs) tests to be performed.

Precautions to minimize corrosion affects in the high temperature/humidity oven have been implemented. Each reliability test will consist of samples from 3 different assembly lots and will have 3 preconditioning groups. Test matrix will evaluate different plating lines, plating chemistries, LF materials at each plating site. Test matrix is significantly larger than the original matrix in terms of qualification samples and leads inspected for tin whiskers. All inspections to be performed using a SEM system. Test matrix initiated in early June05. Expected to finish in the August06 timeframe.