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DATA SHEET
TEA5767HL
Low-power FM stereo radio for
handheld applications
Preliminary specification 2002 Mar 12
Philips Semiconductors Preliminary specification
ORDERING INFORMATION
TYPE PACKAGE
NUMBER NAME DESCRIPTION VERSION
TEA5767HL LQFP32 plastic low profile quad flat package; 32 leads; body 7 × 7 × 1.4 mm SOT358-1
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Philips Semiconductors Preliminary specification
Note
1. LOW side and HIGH side selectivity can be switched by changing the mixer from HIGH side to LOW side LO injection.
2002 Mar 12 3
MPXO VAFR
47 33
47 nF 47 nF nF nF 33 nF VAFL
24 23 22 21 20 19 18 17
2002 Mar 12
R1 25
26 GAIN POWER
STABILISATOR SUPPLY
BLOCK DIAGRAM
4.7 Ω 22 µF
27
Philips Semiconductors
VCCA
DEMODULATOR
22 nF RESONANCE SOFT
AMPLIFIER LIMITER MUTE
SDS
FM antenna
LEVEL
ADC IF COUNTER
I/Q-MIXER
1st FM :2
100 pF N1 1 nF
IF CENTRE 16
Iref MPX
FREQUENCY DECODER
27 pF 28 ADJUST 22 nF
29 15
L1 AGC
30 33 kΩ 22 nF
47 pF TEA5767HL
14 Ccomp(1)
31 CRYSTAL
(1)
OSCILLATOR 13 Cpull 32.768 kHz
4.7 nF or
4
13 MHz
programmable divider output 12 10 kΩ
32 SOFTWARE
TUNING SYSTEM reference frequency divider output MUX PROGRAMMABLE 11
PORT VCCA
10 kΩ
pilot
mono
10
BUSENABLE
VCO 3-WIRE BUS 9
WRITE/READ
Low-power FM stereo radio for handheld applications
1 2 3 4 5 6 7 8
39 nF
VCCD CLOCK
10
10 nF kΩ DATA
12 Ω
D1 D2 22 nF
100
kΩ L3 L2
47 Ω 22 nF
VCC(VCO)
PINNING
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Philips Semiconductors Preliminary specification
32 LOOPSW
29 RFGND
26 AGND
31 TAGC
27 VCCA
30 RFI2
28 RFI1
25 Igain
handbook, full pagewidth
CPOUT 1 24 LIMDEC2
VCOTANK1 2 23 LIMDEC1
VCOTANK2 3 22 TIFC
VCC(VCO) 4 21 Vref
TEA5767HL
DGND 5 20 MPXO
VCCD 6 19 TMUTE
DATA 7 18 VAFR
CLOCK 8 17 VAFL
BUSENABLE 10
SWPORT1 11
SWPORT2 12
XTAL1 13
XTAL2 14
PHASEFIL 15
PILFIL 16
9
MXXxxx
WRITE/READ
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Philips Semiconductors Preliminary specification
The PLL synthesizer tuning system is suitable to operate With decreasing RF input level the audio bandwidth is
with a 32.768 kHz or a 13 MHz reference frequency reduced. The function can also be switched off via bus.
generated by the crystal oscillator or fed into the IC. The
synthesizer can also be clocked via pin XTAL2 with Software programmable ports
6.5 MHz. The PLL tuning system can perform an Two software programmable ports (open-collector) can be
autonomous search tuning function. addressed via bus.
RF AGC With write data byte 4 bit 0 the port 1 (pin SWPORT1)
function can be changed (see Table 11). Pin SWPORT1 is
The RF AGC prevents overloading and limits the amount then output for the ready flag of read byte 1.
of intermodulation products created by strong adjacent
channels.
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Philips Semiconductors Preliminary specification
3-WIRE BUS AND BUS CONTROLLED FUNCTIONS pin WRITE/READ the MSB of the first byte occurs at
pin DATA. The bits are shifted with the negative clock
3-wire bus specification
edge to pin DATA and can be read with the positive edge.
3-wire bus with write/read, clock and data line.
To do two consecutive read or write actions,
The bus operates at a maximum clock frequency of 1 MHz. pin WRITE/READ has to be toggled for at least one clock
period. Was a search tuning request sent, the IC
Hint: With the standby bit the IC can be switched in a low
autonomously starts searching the FM band. Search
current standby mode. The bus is then still active. The
direction and search stop level can be chosen. Was a
standby current can be reduced by deactivation of the bus
station with a field-strength equal to or higher than this stop
interface (pin BUSENABLE LOW). Is the bus interface
level found, the tuning system stops and the ready flag bit
deactivated (pin BUSENABLE LOW) without programmed
is set to HIGH. Was during search a band limit reached,
standby mode, the IC keeps its normal operation, but is
the tuning system stops at the band limit and the band limit
isolated from the clock and data line.
flag bit is set to HIGH. Also the ready flag is set to HIGH in
this case.
DATA TRANSFER FOR THE TEA5767HL
The software programmable output (SWPORT1) can be
Data sequence: byte 1, byte 2, byte 3, byte 4, and byte 5.
programmed to operate as a tuning indicator output. As
The data transfer has to be in this order.
long as the IC has not completed a tuning action
A positive edge at pin WRITE/READ enables the data pin SWPORT1 is LOW. The pin becomes HIGH, when a
transfer into the IC. Data have to be stable at the positive preset or search tuning was completed or when a band
edge of the clock. Data may change while clock is LOW limit was reached. With the MSB in byte 5 set to logic 1 the
and is written with the positive edge of the clock into the IC. reference frequency divider of the synthesizer PLL is
Data transfer can be stopped after the transmission of a changed. The tuning system can then be clocked via
new tuning information with the first two bytes or after each pin XTAL2 with 6.5 MHz.
following byte.
POWER-ON RESET
A negative edge at pin WRITE/READ enables the data
transfer out of the IC. The WRITE/READ pin changes The mute is set, all other bits are random. To initialize the
while the clock is LOW. With the negative edge of IC all bytes have to be transferred.
Writing data
tW(write)
WRITE/READ 50%
tsu(clk)
CLOCK th(write)
50% 50%
tsu(write)
valid
DATA 50% data
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Philips Semiconductors Preliminary specification
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Philips Semiconductors Preliminary specification
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Philips Semiconductors Preliminary specification
Reading data
WRITE/READ 50%
tW(read)
tHIGH
tsu(clk)
CLOCK 50%
50%
tLOW
th(out) td(out)
BIT 7 (MSB) BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 (LSB)
RF BLF PLL13 PLL12 PLL11 PLL10 PLL9 PLL8
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Philips Semiconductors Preliminary specification
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Philips Semiconductors Preliminary specification
Bus timing
Table 25 Digital levels and timing
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Digital inputs
VIH HIGH-level input voltage 0.45VCCD − V
VIL LOW-level input voltage − 0.2VCCD V
Digital outputs
Isink(L) LOW-level sink current 500 − µA
VOL LOW-level output voltage IOL = 500 µA − 450 mV
Timing (3-wire bus enabled)
fclk clock input − 1 MHz
tHIGH clock HIGH time 300 − ns
tLOW clock LOW time 300 − ns
tW(write) pulse width for write enable 1 − µs
tW(read) pulse width for read enable 1 − µs
tsu(clk) clock set-up time 300 − ns
th(out) read mode data output hold time 10 − ns
td(out) read mode output delay time − 100 ns
tsu(write) write mode set-up time 100 − ns
th(write) write mode hold time 100 − ns
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Philips Semiconductors Preliminary specification
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VVCOTANK1 VCO tuned circuit output voltage 1 −0.3 +8 V
VVCOTANK2 VCO tuned circuit output voltage 2 −0.3 +8 V
VCCD digital supply voltage −0.3 +5 V
VCCA analog supply voltage −0.3 +8 V
Tstg storage temperature −55 +150 °C
Tamb ambient temperature −40 +85 °C
Ves electrostatic handling voltage
for all pins except pin DATA note 1 −200 +200 V
note 2 −2000 +2000 V
for pin DATA note 1 −150 +200 V
note 2 −2000 +2000 V
Notes
1. Machine model (R = 0 Ω, C = 200 pF).
2. Human body model (R = 1.5 kΩ, C = 100 pF).
THERMAL CHARACTERISTICS
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Philips Semiconductors Preliminary specification
DC CHARACTERISTICS
VCCA = VVCOTANK1 = VVCOTANK2 = VCCD = 2.7 V; Tamb = 25 °C; unless otherwise specified.
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Philips Semiconductors Preliminary specification
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Philips Semiconductors Preliminary specification
AC CHARACTERISTICS
VCCA = VVCOTANK1 = VVCOTANK2 = VCCD = 2.7 V; Tamb = 25 °C; see Fig.7; all AC values are given in RMS; unless
otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Voltage controlled oscillator
fosc oscillator frequency 150 − 217 MHz
Crystal oscillator
CIRCUIT INPUT: PIN XTAL2
Vi(osc) oscillator input voltage oscillator externally clocked 140 − 350 mV
Ri input resistance oscillator externally clocked
with 13 MHz 2 3 4 kΩ
with 32.768 kHz 230 330 430 kΩ
Ci input capacitance oscillator externally clocked
with 13 MHz 3.9 5.6 7.3 pF
with 32.768 kHz 5 6 7 pF
CRYSTAL: 32.768 kHz
fr series resonance frequency data byte 4: bit 4 = 1 − 32.768 − kHz
∆f/fr frequency deviation −20 × 10−6 − +20 × 10−6
C0 shunt capacitance − − 3.5 pF
RS series resistance − − 80 kΩ
∆fr/fr(25 °C) temperature drift −10 °C < Tamb < +60 °C −50 × 10−6 − +50 × 10−6
CRYSTAL: 13 MHz
fr series resonance frequency data byte 4: bit 4 = 0 − 13 − MHz
∆f/fr frequency deviation −30 × 10−6 − +30 × 10−6
C0 shunt capacitance − − 4.5 pF
Cmot motional capacitance 1.5 − 3.0 fF
RS series resistance − − 100 Ω
∆fr/fr(25 °C) temperature drift −40 °C < Tamb < +85 °C −30 × 10−6 − +30 × 10−6
Synthesizer
PROGRAMMABLE DIVIDER
Nprog programmable divider ratio data byte 1 = XX111111; − − 8191
data byte 2 = 11111111
data byte 1 = XX001000; 2048 − −
data byte 2 = 00000000
∆Nstep programmable divider step − 1 −
size
REFERENCE FREQUENCY DIVIDER
Nref crystal oscillator divider data byte 4: bit 4 = 0 − 260 −
ratio data byte 5: bit 7 = 1; − 130 −
data byte 4: bit 4 = 0
data byte 4: bit 4 = 1 − 1 −
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Philips Semiconductors Preliminary specification
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Philips Semiconductors Preliminary specification
IF filter
fIF IF filter centre frequency 215 225 235 kHz
BIF IF filter bandwidth 85 94 102 kHz
S+200 HIGH side 200 kHz ∆f = +200 kHz; 39 43 − dB
selectivity ftuned = 76 to 108 MHz; note 2
S−200 LOW side 200 kHz ∆f = −200 kHz; 32 36 − dB
selectivity ftuned = 76 to 108 MHz; note 2
S+100 HIGH side 100 kHz ∆f = +100 kHz; 8 12 − dB
selectivity ftuned = 76 to 108 MHz; note 2
S−100 LOW side 100 kHz ∆f = −100 kHz; 8 12 − dB
selectivity ftuned = 76 to 108 MHz; note 2
IR image rejection ftuned = 76 to 108 MHz; 24 30 − dB
VRF = 50 dBµV
FM IF level detector and mute voltage
VRF RF input voltage for start of read mode data byte 4: 2 3 5 µV
level ADC bit 4 = 1
∆Vstep level ADC step size 2 3 5 dB
PIN TMUTE
Vlevel level output DC voltage VRF = 0 µV 1.55 1.65 1.80 V
VRF = 3 µV 1.60 1.70 1.85 V
Vlevel(slope) slope of level voltage VRF = 10 to 500 µV 150 165 180 mV
---------------
20 dB
Ro output resistance 280 400 520 kΩ
2002 Mar 12 19
Philips Semiconductors Preliminary specification
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Philips Semiconductors Preliminary specification
2002 Mar 12 21
Philips Semiconductors Preliminary specification
10 THD
VAFL, VAFR
(%)
(dB)
0 4.0
(3)
−10 3.5
(1)
−20 3.0
(2)
−30 2.5
(4)
−40 2.0
(5)
−50 1.5
−60 1.0
−70 0.5
(6)
−80 0
10−3 10−2 10−1 1 10 102 103
VRF (mV)
Fig.5 FM characteristics 1.
2002 Mar 12 22
Philips Semiconductors Preliminary specification
10 VTMUTE
VAFL, VAFR (V)
(dB) (1)
0 2.2
−10 2.1
−20 2.0
(2)
−30 1.9
−40 1.8
−50 1.7
(3)
−60 1.6
−70 1.5
−80 1.4
10−3 10−2 10−1 1 10 102 103
VRF (mV)
Fig.6 FM characteristics 2.
2002 Mar 12 23
Philips Semiconductors Preliminary specification
270 Ω
2 VCOTANK1
2 3
3 VCOTANK2
120 Ω 120 Ω
4 VCC(VCO)
5 DGND
6 VCCD
7 DATA
2002 Mar 12 24
Philips Semiconductors Preliminary specification
270 Ω
8 5
9 WRITE/READ
270 Ω
9 5
10 BUSENABLE
150 Ω
10 5
11 SWPORT1
150 Ω
11
12 SWPORT2
150 Ω
12
2002 Mar 12 25
Philips Semiconductors Preliminary specification
13 14
15 PHASEFIL
15
26
16 PILFIL
270 Ω
16
26
17 VAFL
10 Ω
17
26
2002 Mar 12 26
Philips Semiconductors Preliminary specification
10 Ω
18
26
19 TMUTE
19
1 kΩ
26
20 MPXO
150 Ω
20
26
2002 Mar 12 27
Philips Semiconductors Preliminary specification
21
26
22 TIFC
40 kΩ
22
23 LIMDEC1
270 Ω
23
24 LIMDEC2
270 Ω
24
25 Igain
25
2002 Mar 12 28
Philips Semiconductors Preliminary specification
29
31 TAGC
31
29
32 LOOPSW
4
32
2002 Mar 12 29
MPXO VAFR
47 33 VAFL
47 nF 47 nF nF nF 33 nF
24 23 22 21 20 19 18 17
2002 Mar 12
R1 25
26 GAIN POWER
STABILISATOR SUPPLY
4.7 Ω 22 µF
27
Philips Semiconductors
VCCA DEMODULATOR
22 nF RESONANCE SOFT
AMPLIFIER LIMITER MUTE
SDS
APPLICATION INFORMATION
LEVEL
ADC IF COUNTER
I/Q-MIXER
1st FM :2
100 pF N1 1 nF
IF CENTRE 16
Iref MPX
27 FREQUENCY DECODER
40 28 ADJUST
pF 22 nF
Ω 29 15
L1
47 30 AGC 33 kΩ 22 nF
100
MHz pF TEA5767HL
VRF 14 Ccomp(1)
31 CRYSTAL
(1)
OSCILLATOR 13 Cpull 32.768 kHz
4.7 nF or
30
10 kΩ 13 MHz
programmable divider output SOFTWARE 12
32 PROGRAMMABLE
TUNING SYSTEM reference frequency divider output MUX 11
PORT VCCA
10 kΩ
pilot
mono
10
VCO BUSENABLE
3-WIRE BUS 9
WRITE/READ
1 2 3 4 5 6 7 8
Low-power FM stereo radio for handheld applications
39 nF
10 CLOCK
10 nF kΩ VCCD
12 Ω DATA
D1 D2
22 nF
100
kΩ L3 L2
47 Ω 22 nF
VCC(VCO)
PACKAGE OUTLINE
LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm SOT358-1
c
y
X
24 17 A
25 16 ZE
E HE
A A2 A (A 3)
1
wM
θ
bp Lp
pin 1 index L
32 9
detail X
1 8
e ZD v M A
wM
bp
D B
HD v M B
0 2.5 5 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
99-12-27
SOT358 -1 136E03 MS-026
00-01-19
2002 Mar 12 31
Philips Semiconductors Preliminary specification
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Philips Semiconductors Preliminary specification
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE REFLOW(1)
BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS not suitable(2) suitable
PLCC(3), SO, SOJ suitable suitable
LQFP, QFP, TQFP not recommended(3)(4) suitable
SSOP, TSSOP, VSO not recommended(5) suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2002 Mar 12 33
Philips Semiconductors Preliminary specification
PRODUCT
DATA SHEET STATUS(1) DEFINITIONS
STATUS(2)
Objective data Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data Qualification This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS DISCLAIMERS
Short-form specification The data in a short-form Life support applications These products are not
specification is extracted from a full data sheet with the designed for use in life support appliances, devices, or
same type number and title. For detailed information see systems where malfunction of these products can
the relevant data sheet or data handbook. reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
Limiting values definition Limiting values given are in
for use in such applications do so at their own risk and
accordance with the Absolute Maximum Rating System
agree to fully indemnify Philips Semiconductors for any
(IEC 60134). Stress above one or more of the limiting
damages resulting from such application.
values may cause permanent damage to the device.
These are stress ratings only and operation of the device Right to make changes Philips Semiconductors
at these or at any other conditions above those given in the reserves the right to make changes, without notice, in the
Characteristics sections of the specification is not implied. products, including circuits, standard cells, and/or
Exposure to limiting values for extended periods may software, described or contained herein in order to
affect device reliability. improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
Application information Applications that are
the use of any of these products, conveys no licence or title
described herein for any of these products are for
under any patent, copyright, or mask work right to these
illustrative purposes only. Philips Semiconductors make
products, and makes no representations or warranties that
no representation or warranty that such applications will be
these products are free from patent, copyright, or mask
suitable for the specified use without further testing or
work right infringement, unless otherwise specified.
modification.
2002 Mar 12 34