4-Ampere Dual Low-Side Ultrafast MOSFET Drivers

Features
4A Peak Source/Sink Drive Current Wide Operating Voltage Range: 4.5V to 35V -40C to +125C Extended Operating Temperature Range Logic Input Withstands Negative Swing of up to 5V Matched Rise and Fall Times Low Propagation Delay Time Low, 10A Supply Current Low Output Impedance

IXD_604

Description
The IXDD604/IXDF604/IXDI604/IXDN604 dual high-speed gate drivers are especially well suited for driving the latest IXYS MOSFETs and IGBTs. Each of the two outputs can source and sink 4A of peak current while producing voltage rise and fall times of less than 10ns. The input of each driver is virtually immune to latch up, and proprietary circuitry eliminates cross conduction and current shoot-through. Low propagation delay and fast, matched rise and fall times make the IXD_604 family ideal for high-frequency and high-power applications. The IXDD604 is a dual non-inverting driver with an enable. The IXDN604 is a dual non-inverting driver, the IXDI604 is a dual inverting driver, and the IXDF604 has one inverting driver and one non-inverting driver. The IXD_604 family is available in a standard 8-pin DIP (PI), 8-pin SOIC (SIA), 8-pin Power SOIC with an exposed metal back (SI), and an 8-pin DFN (D2) package.

Applications
Efficient Power MOSFET and IGBT Switching Switch Mode Power Supplies Motor Controls DC to DC Converters Class-D Switching Amplifiers Pulse Transformer Driver

Pb
Part Number
IXDD604D2TR IXDD604PI IXDD604SI IXDD604SITR IXDD604SIA IXDD604SIATR IXDF604PI IXDF604SI IXDF604SITR IXDF604SIA IXDF604SIATR IXDI604PI IXDI604SI IXDI604SITR IXDI604SIA IXDI604SIATR IXDN604PI IXDN604SI IXDN604SITR IXDN604SIA IXDN604SIATR

RoHS
2002/95/EC

e3

Ordering Information
Logic Configuration
ENA INA ENB INB

Package Type
8-Pin DFN 8-Pin DIP 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 8-Pin SOIC 8-Pin SOIC 8-Pin DIP 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 8-Pin SOIC 8-Pin SOIC 8-Pin DIP 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 8-Pin SOIC 8-Pin SOIC 8-Pin DIP 8-Pin Power SOIC with Exposed Metal Back 8-Pin Power SOIC with Exposed Metal Back 8-Pin SOIC 8-Pin SOIC

Packing Method
Tape & Reel Tube Tube Tape & Reel Tube Tape & Reel Tube Tube Tape & Reel Tube Tape & Reel Tube Tube Tape & Reel Tube Tape & Reel Tube Tube Tape & Reel Tube Tape & Reel

Quantity
2000 50 100 2000 100 2000 50 100 2000 100 2000 50 100 2000 100 2000 50 100 2000 100 2000

OUTA

OUTB

INA

OUTA

INB

OUTB

INA

OUTA

INB

OUTB

INA

OUTA

INB

OUTB

DS-IXD_604 - R02

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IXD_604

1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 Electrical Characteristics: TA = 25C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Electrical Characteristics: - 40C TA +125C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.7 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3 3 3 3 3 4 4 5

2. IXD_604 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 IXDD604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 IXDI604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 IXDF604. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.4 IXDN604 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 6 6 6 6

4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 10 10 10 11

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IXD_604
1 Specifications
1.1 Pin Configurations
IXDD604PI/SI/SIA
ENA INA GND INB 1 2 3 4 8 ENB OUTA VCC OUTB ENA INA INB ENB 1 2 3 4

1.2 Pin Definitions

IXDD604D2
8 OUTA GND VCC OUTB

Pin Name INA INB ENA

Description Channel A Logic Input Channel B Logic Input Channel A Enable Input Drive pin low to disable Channel A and force Channel A Output to a high impedance state Channel B Enable Input Drive pin low to disable Channel A and force Channel A Output to a high impedance state Channel A Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT Channel B Output - Sources or sinks current to turn-on or turn-off a discrete MOSFET or IGBT Supply Voltage - Provides power to the device Ground - Common ground reference for the device

7 6

A B

7 6 5

IXDI604PI/SI/SIA
NC INA GND INB 1 2 3 4 8 NC OUTA VCC OUTB NC INA GND INB

IXDF604PI/SI/SIA
1 2 3 4 8 NC OUTA VCC OUTB

7 6

7 6

ENB OUTA OUTA OUTB OUTB VCC GND

IXDN604PI/SI/SIA
NC INA GND INB 1 2 3 4 8 NC OUTA VCC OUTB

7 6

1.3 Absolute Maximum Ratings Parameter Supply Voltage Input Voltage Output Current Junction Temperature Storage Temperature Symbol VCC VINx , VENx IOUT TJ TSTG Minimum
-0.3 -5 -55 -65

Maximum
40 VCC+0.3 4 +150 +150

Units
V V A C C

Absolute maximum electrical ratings are at 25C

Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied.

1.4 Recommended Operating Conditions Parameter Supply Voltage Operating Temperature Range Symbol VCC TA Minimum
4.5 -40

Maximum
35 +125

Units
V C

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IXD_604
1.5 Electrical Characteristics: TA = 25C Test Conditions: 4.5V < VCC < 35V, one channel (unless otherwise noted).
Parameter Input Voltage, High Input Voltage, Low Input Current High EN Input Voltage Low EN Input Voltage Output Voltage, High Output Voltage, Low Output Resistance, High State Output Resistance, Low State Output Current, Continuous Rise Time Fall Time On-Time Propagation Delay Off-Time Propagation Delay Enable to Output-High Delay Time Disable to High Impedance State Delay Time Enable Pull-Up Resistor Power Supply Current Conditions 4.5V < VCC < 18V 4.5V < VCC < 18V 0V < VIN < VCC IXDD604 only IXDD604 only VCC=18V, IOUT=-10mA VCC=18V, IOUT=10mA Limited by package power dissipation VCC=18V, CLOAD=1000pF VCC=18V, CLOAD=1000pF VCC=18V, CLOAD=1000pF VCC=18V, CLOAD=1000pF IXDD604 only, VCC=18V IXDD604 only, VCC=18V VCC=18V, VIN=3.5V VCC=18V, VIN=0V VCC=18V, VIN=VCC Symbol VIH VIL IIN VENH VENL VOH VOL ROH ROL IDC tr tf tondly toffdly tENOH tDOLD REN ICC Minimum 3.0 2/3VCC VCC-0.025 Typical 1.3 1.1 9 8 29 35 35 40 200 1 <1 <1 Maximum 0.8 10 1/3VCC 0.025 2.5 2 1 16 14 50 50 55 55 3 10 10 k mA A ns A A V V Units V

1.6 Electrical Characteristics: - 40C TA +125C Test Conditions: 4.5V < VCC < 35V, one channel (unless otherwise noted).
Parameter Input Voltage, High Input Voltage, Low Input Current Output Voltage, High Output Voltage, Low Output Resistance, High State Output Resistance, Low State Output Current, Continuous Rise Time Fall Time On-Time Propagation Delay Off-Time Propagation Delay Enable to Output-High Delay Time Disable to High Impedance State Delay Time Power Supply Current Conditions 4.5V < VCC < 18V 4.5V < VCC < 18V 0V < VIN < VCC VCC=18V, IOUT=-10mA VCC=18V, IOUT=10mA Limited by package power dissipation VCC=18V, CLOAD=1000pF VCC=18V, CLOAD=1000pF VCC=18V, CLOAD=1000pF VCC=18V, CLOAD=1000pF IXDD604 only, VCC=18V IXDD604 only, VCC=18V VCC=18V, VIN=3.5V VCC=18V, VIN=0V VCC=18V, VIN=VCC Symbol VIH VIL IIN VOH VOL ROH ROL IDC tr tf tondly toffdly tENOH tDOLD ICC Minimum 3.1 -10 VCC-0.025 Maximum 0.65 10 0.025 3 2.5 1 16 14 65 65 65 65 3.5 150 150 mA A ns A A V Units V

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1.7 Thermal Characteristics Package D2 (8-Pin DFN) PI (8-Pin DIP) SI (8-Pin Power SOIC) SIA (8-Pin SOIC) SI (8-Pin Power SOIC) Thermal Resistance, Junction-to-Case JC Thermal Resistance, Junction-to-Ambient JA Parameter Symbol Rating
35 125 85 120 10 C/W C/W

Units

2 IXD_604 Performance
2.1 Timing Diagrams
VIH INx VIL toffdly tondly 90% OUTx 90% 10% tf tr tr tf OUTx 10% INx VIH VIL tondly toffdly

2.2 Characteristics Test Diagram

ENA
+

EN B OUTA VCC CLOAD OUTB Tektronix Current Probe 6302

0.1F

10F

VCC -

INA GND VIN INB

CLOAD

Tektronix Current Probe 6302

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IXD_604
3 Block Diagrams & Truth Tables
3.1 IXDD604 3.3 IXDF604

IXDD604
VCC 200k EN A IN A OUTA VCC 200k ENB INB OUTB

IXDF604

VCC

VCC

INA

OUTA

GND VCC

VCC

INB

OUTB

GND

INA 0 INX 0 1 0 1 3.2 IXDI604 ENX 1 or open 1 or open 0 0 OUTX

0 1 Z Z

OUTA
1 0 OUTB 0 1

1 INB 0 1

3.4 IXDN604

IXDI604

VCC

IXDN604

VCC

INA

OUTA

INA

OUTA

GND VCC

GND VCC

INB

OUTB

INB

OUTB

INX 0 1

OUTX
1 0

INX 0 1

OUTX
0 1

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4 Typical Performance Characteristics
A&B Rise Times vs. Supply Voltage (Input=0-5V, f=10kHz, TA=25C)
120 100 Rise & Fall Times (ns)

120 100

A&B Fall Times vs. Supply Voltage (Input=0-5V, f=10kHz, TA=25C)

10

A&B Rise and Fall Times vs. Temperature (Input=0-5V, VCC=18V, CL=1nF)
tr tf

Rise Time (ns)

9 8 7 6 5 4 -40 -20 0

80 60 40 20 0 0 5 10 15 20 25 30 Supply Voltage (V) 35 40 CL=10nF CL=1nF CL=470pF

Fall Time (ns)

80 60 40 20 0 0 5 10 15 20 25 30 Supply Voltage (V) 35 40 CL=10nF CL=1nF CL=470pF

20 40 60 80 Temperature (C)

100 120 140

120 100 Rise Time (ns) 80 60 40 20 0

A&B Rise Time vs. Load Capacitance at Various VCC Levels

VCC=4.5V VCC=8V VCC=12V VCC=18V VCC=24V VCC=35V

120 100
Fall Time (ns)

A&B Fall Time vs. Load Capacitance at Various VCC Levels

VCC=4.5V VCC=8V VCC=12V VCC=18V VCC=24V VCC=35V

80 60 40 20 0

2000

4000 6000 8000 Load Capacitance (pF)

10000

2000 4000 6000 8000 Load Capacitance (pF)

10000

160 Propagation Delay (ns) 140 120 100 80 60 40 20

Propagation Delay vs. Supply Voltage (VIN=0-5V, CL=1nF, f=1kHz)

Propagation Delay (ns)

70 60 50 40 30

Propagation Delay vs. Input Voltage (VCC=15V, CL=1nF)

Propagation Delay (ns)

Propagation Delay vs. Temperature

50 45 40 35 30 25 20 tondly toffdly

toffdly tondly 0 5 10 15 20 25 Supply Voltage (V) 30 35

toffdly tondly

20 2 4 6 8 Input Voltage (V) 10 12

-40 -20

20 40 60 80 Temperature (C)

100 120 140

2.9 Input Threshold Voltage (V) 2.7 2.5

Input Threshold Voltage vs. Temperature (VCC=18V, CL=1nF)

Input Threshold (V)

Input Threshold vs. Supply Voltage

3.2 3.0 Enable Threshold (V) 2.8 2.6 2.4 2.2 2.0 1.8 1.6 1.4 VIH VIL
22 20 18 16 14 12 10 8 6 4 2 0

Enable Threshold vs. Supply Voltage

VENH VENL

Min VIH 2.3 2.1 Max VIL 1.9 1.7 -40 -20 0 20 40 60 80 Temperature (C) 100 120 140

10 15 20 25 Supply Voltage (V)

30

35

10 15 20 25 Supply Voltage (V)

30

35

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IXD_604

1000

Supply Current vs. Load Capacitance Both Outputs Active (VCC=35V)

Supply Current (mA) f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz f=10kHz

400 350 300 250 200 150 100 50

Supply Current vs. Load Capacitance Both Outputs Active (VCC=18V)

Supply Current (mA) f=1MHz f=500kHz f=100kHz f=50kHz f=2MHz

400 350 300 250 200 150 100 50

Supply Current vs. Load Capacitance Both Outputs Active (VCC=12V)

f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz

Supply Current (mA)

100

10

1 100

1000 Load Capacitance (pF)

10000

0 100

1000 Load Capacitance (pF)

10000

0 100

1000 Load Capacitance (pF)

10000

350
Supply Current (mA)

Supply Current vs. Load Capacitance Both Outputs Active (VCC=8V)

f=2MHz f=1MHz f=500kHz f=100kHz f=50kHz

1000

Supply Current vs. Frequency Both Outputs Active (VCC=35V)

1000
Supply Current (mA)

Supply Current vs. Frequency Both Outputs Active (VCC=18V)

CL=10nF CL=1nF CL=470pF

Supply Current (mA)

300 250 200 150 100 50 0 100

100

CL=10nF CL=1nF CL=470pF

100

10

10

0.1
1 10 100 1000 Frequency (kHz) 10000

1000 Load Capacitance (pF)

10000

10

100 1000 Frequency (kHz)

10000

1000

Supply Current vs. Frequency Both Outputs Active (VCC=12V)

CL=10nF CL=1nF CL=470pF

1000
Supply Current (mA)

Supply Current vs. Frequency Both Outputs Active (VCC=8V)

Supply Current (mA)
CL=10nF CL=1nF CL=470pF

3.0 2.5 2.0 1.5 1.0 0.5

Quiesent Supply Current vs. Temperature (VCC=18V)

VIN=3.5V VIN=5V VIN=10V

Supply Current (mA)

100 10 1 0.1 0.01 1

100 10 1 0.1 0.01

VIN=0V & 18V 0.0

10 100 Frequency (kHz)

1000

10

100 1000 Frequency (kHz)

10000

-40 -20

20 40 60 80 Temperature (C)

100 120 140

1.4

Dynamic Supply Current vs. Temperature (VCC=18V, VIN=5V, f=1khz, CL=1nF)

Output Source Current (A)

-10 -8 -6 -4 -2 0

Output Source Current vs. Supply Voltage (CL=10nF)

Output Sink Current (A)

10 8 6 4 2 0

Output Sink Current vs. Supply Voltage (CL=10nF)

Supply Current (mA)

1.2 1.0 0.8 0.6 0.4 0.2 0.0 -40 -20 0 20 40 60 80 Temperature (C) 100 120 140

10 15 20 25 Supply Voltage (V)

30

35

10 15 20 25 Supply Voltage (V)

30

35

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6 Output Source Current (A)

Output Source Current vs. Temperature (VCC=18V, CL=10nF)

Output Sink Current (A)

6.0

Output Sink Current vs. Temperature (VCC=18V, CL=10nF)

5.0

4.0

3.0

2 -40 -20 0 20 40 60 80 Temperature (C) 100 120 140

2.0 -40 -20 0 20 40 60 80 Temperature (C) 100 120 140

4.0 3.5

High State Output Resistance vs. Supply Voltage (IOUT= -10mA)

4.0 3.5
Resistance ()

Low State Output Resistance vs. Supply Voltage (IOUT= +10mA)

Resistance ()

3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 5 10 15 20 25 Supply Voltage (V) 30 35

3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 5 10 15 20 25 Supply Voltage (V) 30 35

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IXD_604
5 Manufacturing Information
5.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device IXD_604SI / IXD_604SIA / IXD_604PI IXD_604D2 Moisture Sensitivity Level (MSL) Rating MSL 1 MSL 3

5.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.

5.3 Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020 must be observed.
Device IXD_604SI / IXD_604SIA / IXD_604D2 IXD_604PI Maximum Temperature x Time 260C for 30 seconds 250C for 30 seconds

Pb

RoHS
2002/95/EC

e3

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IXD_604
5.4 Mechanical Dimensions 5.4.1 SIA (8-Pin SOIC)
0.10 / 0.25 (0.004 / 0.010) 1.27 (0.050)

5.80 / 6.20 (0.228 / 0.244)

3.80 / 4.00 (0.150 / 0.157)

0.40 / 1.27 (0.016 / 0.050)

5.40 (0.213)

1.55 (0.061)

PIN 1 0.31 / 0.51 (0.012 / 0.020) 4.80 / 5.00 (0.190 / 0.197) 0.10 / 0.25 (0.004 / 0.010) 1.30 / 1.75 (0.051 / 0.069) 1.27 BSC (0.05 BSC) 0.25 / 0.50 x45 (0.010 / 0.020 x45) 0.60 (0.024)

0 / 8

Recommended PCB Land Pattern

Dimensions mm MIN / mm MAX (inches MIN / inches MAX) NOTE: Molded package conforms to JEDEC standard configuration MS-012 variation AA.

5.4.2 SI (8-Pin Power SOIC with Exposed Metal Back)

0.10 / 0.25 (0.004 / 0.010) 3.80 (0.150)

5.80 / 6.20 (0.228 / 0.244)

3.80 / 4.00 (0.150 / 0.157)

0.40 / 1.27 (0.016 / 0.050)

5.40 2.75 (0.209) (0.108)

1.55 (0.061)

PIN 1 0.31 / 0.51 (0.012 / 0.020) 4.80 / 5.00 (0.190 / 0.197) 0.03 / 0.10 (0.001 / 0.004) 1.30 / 1.75 (0.051 / 0.069) 1.27 BSC (0.05 BSC) 0.25 / 0.50 x45 (0.010 / 0.020 x45) 1.27 (0.050) 0.60 (0.024)

0 / 8

Recommended PCB Land Pattern

Dimensions mm MIN / mm MAX (inches MIN / inches MAX)

2.29 / 2.79 (0.090 / 0.110)

NOTES: 1. Molded package conforms to JEDEC standard configuration MS-012 variation BA. 2. The exposed metal pad on the back of the SI package may be left floating or connected to GND. It is not suitable for carrying current.

3.30 / 3.81 (0.130 / 0.150)

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IXD_604
5.4.3 Tape & Reel Information for SI and SIA Packages
330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 4.00 0.10 See Note #2 2.00 0.10 1.55 0.05 1.75 0.10

0.30 0.05

R0.50 TYP

5.50 0.10 (3.40)

B0=5.20 0.10 A A 12.00 0.30

Embossed Carrier

1.80 0.10 K0=2.30 0.10 SECTION B-B Embossment A0=6.40 0.10 (1.20)

8.00 0.10

1.50 (MIN)

(4.70) (70) NOTES: 1. A0 & B0 measured at 0.3mm above base of pocket. 2. 10 pitches cumulative tol. 0.2mm 3. ( ) Reference dimensions only. 4. Unless otherwise specified, all dimensions in millimeters.

SECTION A-A

5.4.4 PI (8-Pin DIP)

9.02 / 10.16 (0.355 / 0.400) 8-0.900 DIA. (8-0.035 DIA.) 2.540 (0.100)

0.20 / 0.38 (0.008 / 0.015)

6.10 / 6.86 (0.240 / 0.270)

7.62 BSC (0.300 BSC)

1.40 (0.055)

7.50 (0.295)

2.540 BSC (0.100 BSC) 3.05 / 3.81 (0.120 / 0.150)

7.37 / 8.26 (0.290 / 0.325)

7.62 / 10.92 (0.300 / 0.430)

PC Board Pattern

0.38 / 1.02 (0.015 / 0.040)

3.43 / 4.70 (0.135 / 0.185) Dimensions mm MIN / mm MAX (inches MIN / inches MAX)

1.14 / 1.65 (0.045 / 0.065) 0.38 / 0.58 (0.015 / 0.023)

3.18 / 3.81 (0.125 / 0.150) NOTE: Molded package conforms to JEDEC standard configuration MS-001 variation BA.

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IXD_604
5.4.5 D2 (8-Pin DFN)
5.00 BSC (0.197 BSC) Pin 1 4.00 BSC (0.158 BSC) 0.80 / 1.00 (0.031 / 0.039) 0.35 x 45 (0.014 x 45) 0.95 (0.037) 4.50 (0.177)

0.20 REF (0.008 REF)

0.45 (0.018)

3.05 (0.120)

0.00 / 0.05 (0.000 / 0.002) 0.76 / 0.81 (0.030 / 0.032)

1.20 (0.047)

2.55 (0.100)

Recommended PCB Land Pattern

3.04 / 3.09 (0.120 / 0.122) 0.95 BSC (0.037 BSC) Pin 1 0.35 / 0.45 x 45 (0.014 / 0.018 x 45) 0.30 / 0.45 (0.012 / 0.018) Pin 8 2.54 / 2.59 (0.100 / 0.102) NOTE: The exposed metal pad on the back of the D2 package may be left floating or connected to ground. It is not suitable for carrying current. Dimensions mm MIN / mm MAX (inches MIN / inches MAX)

5.4.6 Tape & Reel Information for D2 Package

1.55 0.05 1.75 0.10

330.2 DIA. (13.00 DIA.) Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.)

R0.75 TYP

4.00 0.10 See Note #2 2.00 0.05

5 MAX (0.05) B0=5.40 0.10

(0.05) 5.50 0.05

12.00 0.30

Embossed Carrier

K0=1.90 0.10 5 MAX Embossment 0.30 0.05 A0=4.25 0.10

8.00 0.10

1.50 (MIN)

NOTES: 1. A0 & B0 measured at 0.3mm above base of pocket. 2. 10 pitches cumulative tol. 0.2mm 3. ( ) Reference dimensions only. 4. Unless otherwise specified, all dimensions in millimeters.

For additional information please visit our website at: www.clare.com

Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clares Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clares product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.

Specification: DS-IXD_604-R02 Copyright 2010, Clare, Inc. All rights reserved. Printed in USA. 12/3/2010

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