3.

APPLY DRY FILM 1) Apply dry film photoresist on copper PCB board surface by using laminator. Make sure no buble exist after laminated.

Laminator

After laminated

3.6

UV EXPOSURE PROCESS 1) Place a film toner face down on a laminated PCB board, Use trans parent tape to hold the film in position. Make sure that the film is oriented correctly.

Laminated PCB with film

Vaccum exposure unit

2)

Place PCB board in a vacuum UV exposure unit and run it for 20 seconds. When UV light strikes the panels, it hardens the resist.

3)

Remove the negative film and protective film from PCB board to reveal the photoresist after exposure.

Before UV exposure (with film)

After UV expose

3.7

DEVELOPER PROCESS

Developer Machine

After developer

1) Leave exposed PCB board (with photoresist dry film on it) in developer conveyor until exit the machine. The developer removes the unexposure dry film. The areas of PCB board that have been exposed to UV light will be hardened and cannot be removed by the developing solution.

2) Take out PCB board from developer machine and wash PCB board under tap for a while.

3.8

ETCHING PROCESS

Etching Machine

After etched

1) After washed, leave PCB board into etching machine conveyor until exit the machine. The Etching machine removes the exposed copper.

2) The photoresist dry protects the copper circuitry from being etched. Take out PCB board from etching machine and wash the PCB board under tap for a while. 3.9 PHOTORESIST STRIPPER

Photoresist Stripper tank

After stripper

1) Leave PCB board into photoresist stripper tank (approximately 2-3 minutes) until all photoresist film are removed. The photoresist stripper removed all photoresist dry film on PCB board.

2) Take out PCB board and spray wash. After spray wash, wash under tap with scotch brite to remove any dirt. 3) Put PCB board through a bench top drying process.

3.10

HOT AIR PLATTING 1) 2) Put PCB board into flux tanks, make sure all board surfaces full of flux. Open PCB clamp by stepping on a switch under a machine, place the PCB board and release the switch. The PCB is connected to the vertical conveyor assembly and clamps the PCB in order to transport the PCB in and out of the solder bath. 3) Push and hold start button until window is close. Hot air platting machines consist of a transport mechanism that carries PCB board into a sump of molten solder (245 celsius), then rapidly past jets of hot air. All areas of exposed copper are coated with solder and without copper areas remain solder free. 4) Take PCB board by long-nose and put it into cooling station. Be careful because PCB board is too hot!

Hot air platting machine

After Platting

3.11

FINAL PROCESS 1) Wash PCB board under tap and put PCB board through brush cleaning machine and drying machine. 2) PCB board is ready to insert parts and solder.