Samsung HT BD1255

5.
1CH Blu-ray
Home Theater System
Model Name : HT-BD1255
Model Code : HT-BD1255R/EDC
Speaker
PS-BD1255
Front
PS-FBD1255
Center
PS-CBD1255
Rear
PS-RBD1255
Subwoofer
PS-WBD1255
SERVICE
5.1CH Blu-ray Home Theater System
Manual
CONTENTS
1. Precaution
2. Product Specification
3. Disassembly & Reassembly
4. Troubleshooting
5. Exploded View & Part List
6. PCB Diagram
7. Schematic Diagram
HT-BD1255
Refer to the service manual in the GSPN (see the rear cover) for the more information.
GSPN (Global Service Partner Network)

Area
Web Site
North America
service.samsungportal.com
Latin America
latin.samsungportal.com
CIS
cis.samsungportal.com
Europe
europe.samsungportal.com
China
china.samsungportal.com
Asia
asia.samsungportal.com
Mideast & Africa
mea.samsungportal.com
This Service Manual is a property of Samsung Electronics

Co.,Ltd. Any unauthorized use of Manual can be punished
under applicable International and/or domestic law.
Samsung Electronics Co.,Ltd. Apr. 2009

Printed in Korea
Contents
1. Precaution
1-1 Safety Precautions............................................................................................ 1-1
1-2 Servicing Precautions.......................................................................................1-3
1-3 Precautions for Electrostatically Sensitive Devices (ESDs)..............................1-4
2-1
2-2
2-3
2-4
Product Feature................................................................................................ 2-1

Specifications....................................................................................................2-2
Specifications Analysis......................................................................................2-8
Accessories.......................................................................................................2-10
3. Disassembly & Reassembly

3-1 Overall Disassembly & Reassembly.................................................................3-1
3-2 DECK Disassembly & Reassembly..................................................................3-4
4. Troubleshooting
4-1 Checkpoints by Error Mode..............................................................................4-2
4-2 Initialization & Upgrade Methods......................................................................4-34
4-3 Buyer-Region Code Setting Method.................................................................4-38

5-1
5-2
5-3
5-4
Product Exploded View.....................................................................................5-2

DECK Exploded View.......................................................................................5-4
Speaker System................................................................................................ 5-6
Electrical Part List............................................................................................. 5-7
Contents
6. PCB Diagram
6-1 Wiring Diagram................................................................................................. 6-2
6-2 FRONT PCB Top............................................................................................... 6-3
6-3 FRONT PCB Bottom.........................................................................................6-5
6-4 KEY PCB Top....................................................................................................6-6
6-5 KEY PCB Bottom.............................................................................................. 6-8
6-6 AMP PCB Top................................................................................................... 6-9
6-7 AMP PCB Bottom.............................................................................................. 6-11
6-8 MAIN PCB Top.................................................................................................. 6-13
6-9 MAIN PCB Bottom............................................................................................ 6-16
6-10 SMPS PCB Top................................................................................................. 6-18
6-11 SMPS PCB Bottom........................................................................................... 6-19
7-1 Overall Block Diagram......................................................................................7-2
7-2 FRONT..............................................................................................................7-3
7-3 KEY...................................................................................................................7-4
7-4 AMP..................................................................................................................7-5
7-5 AUDIO / VIDEO (COMPONENT, COMPOSITE)...............................................7-6
7-6 HDMI CEC / TX (SIL9134)................................................................................7-7
7-7 Boot Strap Option............................................................................................. 7-8
7-8 EBI ADDR, EBI DATA........................................................................................7-9
7-9 CLOCK, BBS....................................................................................................7-10
7-10 BCM7440 POWER........................................................................................... 7-11
7-11 DDR2 BANK0, BANK1......................................................................................7-12
7-12 SYSTEM MICOM / TUNER / SRC / WIRELESS..............................................7-13
7-13 EXTERNAL IN & AUDIO FLOW........................................................................7-14
7-14 Ethernet, S-ATA, USB.......................................................................................7-15
7-15 GPIO / IPOD / BT.............................................................................................. 7-16
7-16 NAND, FlexOneNand........................................................................................7-17
7-17 MAIN POWER..................................................................................................7-18
7-18 DSP SDRAM / FLASH......................................................................................7-19
7-19 BCM7620 (F/E)................................................................................................. 7-20
7-20 SMPS (110V)....................................................................................................7-21
7-21 SMPS (220V).................................................................................................... 7-22
Precaution
1. Precaution
Follow these safety, servicing and ESD precautions to prevent damage and protect against potential hazards such
as electrical shock and X-rays.
1-1 Safety Precautions

1. Be sure that all of the built-in protective devices are replaced.
2. When reinstalling the chassis and its assemblies, be sure to restore all protective devices, including control
knobs and compartment covers.
3. Make sure that there are no cabinet openings through which people--particularly children--might insert fingers
and contact dangerous voltages. Such openings include the spacing between the picture tube and the cabinet
mask, excessively wide cabinet ventilation slots, and improperly fitted back covers.
4. Design Alteration Warning:
Never alter or add to the mechanical or electrical design of the unit.
Example: Do not add auxiliary audio or video connectors. Such alterations might create a safety hazard.
Also, any design changes or additions will void the manufacturers warranty.
5. Leakage Current Hot Check (Fig. 1-1):
Warning: Do not use an isolation transformer during this
test. Use a leakage-current tester or a metering system
that complies with American National Standards Institute
(ANSI C101.1, Leakage Current for Appliances), and
Underwriters Laboratories (UL Publication UL1410,
59.7).

LEAKAGE (READING
CURRENT SHOULD NOT BE
TESTER ABOVE 0.5mA)
DEVICE
UNDER
TEST
TEST ALL
EXPOSED METAL
SURFACES
2-WIRE CORD
ALSO TEST WITH
PLUG REVERSED
With the unit completely reassembled, plug the AC line
(USING AC
EARTH
cord directly into a 120V AC outlet. With the units AC
ADAPTER PLUG
GROUND
AS REQUIRED)
switch first in the ON position and then OFF, measure
<Fig. 1-1 AC Leakage Test>
the current between a known earth ground (metal water
pipe, etc.) and all exposed metal parts. Examples:
Handle brackets, metal cabinets, screwheads and control shafts. The current measured should not exceed 0.5
milliamp. Reverse the powerplug prongs in the AC outlet and repeat.
6. Insulation Resistance Cold Check:

(1) With the units AC plug disconnected from the AC
source, connect an electrical jumper across the two AC
prongs. (2) Set the power switch to ON. (3) Measure
the resistance between the shorted AC plug and any
exposed metallic parts.
Example: Screwheads, antenna, control shafts or handle
brackets.

Antenna
Terminal
Exposed
Metal Part
ohm
Ohmmeter
<Fig. 1-2 Insulation Resistance Test>
If any of the exposed metallic parts has a return path

to the chassis, the measured resistance should be between 1 and 5.2 megohms. If there is no return path, the
measured resistance should be infinite. If the resistance is outside these limits, a shock hazard might exist.
See Fig. 1-2
Samsung Electronics
1-1
Precaution
7. Components, parts and wiring that appear to have overheated or that are otherwise damaged should be
replaced with parts that meet the original specifications. Always determine the cause of damage or overheating,
and correct any potential hazards
8. Observe the original lead dress, especially near the following areas: Antenna wiring, sharp edges, and
especially the AC and high voltage power supplies. Always inspect for pinched, out-of-place, or frayed wiring.
Do not change the spacing between components and the printed circuit board. Check the AC power cord for
damage. Make sure that no wires or components touch thermally hot parts.
9. Product Safety Notice:
Some electrical and mechanical parts have special safety-related characteristics which might not be obvious
from visual inspection. These safety features and the protection they give might be lost if the replacement
component differs from the original--even if the replacement is rated for higher voltage, wattage, etc.
or . Use
10. Components that are critical for safety are indicated in the circuit diagram by shading,
replacement components that have the same ratings, especially for flame resistance and dielectric strength
specifications. A replacement part that does not have the same safety characteristics as the original might
create shock, fire or other hazards.
1-2
Samsung Electronics
Precaution
1-2 Servicing Precautions

1. Servicing precautions are printed on the cabinet. Follow them.
2. Always unplug the units AC power cord from the AC power source before attempting to: (a) Remove or reinstall
any component or assembly, (b) Disconnect an electrical plug or connector, (c) Connect a test component in
parallel with an electrolytic capacitor.
3. Some components are raised above the printed circuit board for safety. An insulation tube or tape is sometimes
used. The internal wiring may be clamped to prevent contact with thermally hot components. Reinstall all such
elements to their original position.
4. After servicing, always check that the screws, components and wiring have been correctly reinstalled.
Make sure that the portion around the serviced part has not been damaged.
5. Check the insulation between the blades of the AC plug and accessible conductive parts (examples: metal
panels, input terminals and earphone jacks).
6. Insulation Checking Procedure: Disconnect the power cord from the AC source and turn the power switch ON.
Connect an insulation resistance meter (500V) to the blades of the AC plug.

The insulation resistance between each blade of the AC plug and accessible conductive parts (see above)
should be greater than 1 megohm.
7. Never defeat any of the B+ voltage interlocks. Do not apply AC power to the unit (or any of its assemblies)
unless all solid-state heat sinks are correctly installed.
8. Always connect a test instruments ground lead to the instrument chassis ground before connecting the positive
lead; always remove the instruments ground lead last.
First read the Safety Precautions section of this manual. If some unforeseen circumstance
creates a conflict between the servicing and safety precautions, always follow the safety
precautions.
Samsung Electronics
1-3
Precaution
1-3 Precautions for Electrostatically Sensitive Devices (ESDs)

1. Some semiconductor (solid state) devices are easily damaged by static electricity.
Such components are called Electrostatically Sensitive Devices (ESDs). Examples include integrated circuits
and some field-effect transistors. The following techniques will reduce the occurrence of component damage
caused by static electricity.
2. Immediately before handling any semiconductor components or assemblies, drain the electrostatic charge from
your body by touching a known earth ground. Alternatively, wear a discharging wrist-strap device. (Be sure to
remove it prior to applying power--this is an electric shock precaution.)
3. After removing an ESD-equipped assembly, place it on a conductive surface such as aluminum foil to prevent
accumulation of electrostatic charge.
4. Do not use freon-propelled chemicals. These can generate electrical charges that damage ESDs.
5. Use only a grounded-tip soldering iron when soldering or unsoldering ESDs.
6. Use only an anti-static solder removal device. Many solder removal devices are not rated as anti-static (these
can accumulate sufficient electrical charge to damage ESDs).
7. Do not remove a replacement ESD from its protective package until you are ready to install it.
Most replacement ESDs are packaged with leads that are electrically shorted together by conductive foam,
aluminum foil or other conductive materials.
8. Immediately before removing the protective material from the leads of a replacement ESD, touch the protective
material to the chassis or circuit assembly into which the device will be installed.
9. Minimize body motions when handing unpackaged replacement ESDs. Motions such as brushing clothes
together, or lifting a foot from a carpeted floor can generate enough static electricity to damage an ESD.
1-4
Samsung Electronics
Product Specification
2-1 Product Feature
New features for both HT-BD1250
- BD-LIVE from the beginning of the Mass Production
- DTS-HD Master Audio decoding from the beginning of the Mass Production
- Wireless Network
Bundle Wireless LAN adapter not included for HT-BD1250
- MP3, JPG
- 2 USB port (Not only on rear, but also on front)
- I-POD Docking (Only USA)
- Various Video Setups
Progressive Mode
Still Mode
BD Wise
Picture Control
HT-BD2 HT-BD1250
- DivX (Only EU)
- PC Connected
- USB HOST
- Profile 2.0 Ready
- Netflix, Pandora
- I-POD Docking (Only USA)
- Wireless Rear Speaker
Samsung Electronics
2-1
2-2 Specifications
2-2-1 HT-BD1250 / HT-BD1252 / HT-BD1255 Specifications
Basic Specification
GENERAL
Power Consumption
85 W
Weight
4.4 Kg
Dimensions
440 (W) x 345 (D) x 63 (H) mm
Operating Temperature Range
+5C ~ +35C
Operating Humidity Range
10% to 75%
BD (Blu-ray Disc)
Reading Speed: 4.917m/sec

Reading Speed: 3.49 ~ 4.06 m/sec.
DISC
DVD (Digital Versatile Disc)
Approx. Play Time (Single Sided, Single Layer Disc):

135 min.
CD: 12 cm
(COMPACT DISC)
CD: 8 cm
(COMPACT DISC)
Maximum Play Time: 74 min.

1 channel: 1.0 Vp-p (75 load)
Composite Video
Blu-ray Disc: 576i (480i)

DVD: 576i (480i)
Y: 1.0 Vp-p (75 load)
VIDEO
OUTPUT
Pr: 0.70 Vp-p (75 load)

Component Video
Pb: 0.70 Vp-p (75 load)

Blu-ray Disc: 1080i, 720p, 576p (480p), 576i (480i)
DVD: 576p (480p), 480i
VIDEO/
AUDIO
AMPLIFIER
2-2
HDMI
1080p, 1080i, 720p, 576p (480p)

PCM multi channel audio, Bit stream audio, PCM audio
Front speaker output
165W x 2 (3)
Center speaker output
170W (3)
Surround speaker output
165W x 2 (3)
Subwoofer speaker output
170W (3)
Frequency range
Analog input: 20Hz ~ 20kHz (3dB)

Digital input: 20Hz ~ 44kHz (3dB)
S/N Ratio
70dB
Channel separation
60dB
Input sensitivity
(AUX) 500mV
Samsung Electronics
HT-BD1250 Speaker Specification

Speaker system
Front
Surround
Center
Subwoofer
140Hz ~
50KHz
140Hz ~
20KHz
140Hz ~
20KHz
40Hz ~
160Hz
87dB/W/M
87dB/W/M
87dB/W/M
90dB/W/M
Rated input
165W
165W
170W
170W
Maximum input
330W
330W
340W
340W
Impedance
Frequency range
Output sound pressure level
SPEAKER
5.1ch Speaker System
Dimensions (W x H x D)
Front/Surround: 100.5 x 210 x 99 mm

Centre: 300 x 59 x 50 mm
Subwoofer: 201 x 403 x 410 mm
Weights
Front/Surround: 0.70 Kg, Centre: 0.33 Kg

Subwoofer: 5.39 Kg

Speaker system
Front
Surround
Center
Subwoofer
140Hz ~
20KHz
140Hz ~
20KHz
140Hz ~
20KHz
40Hz ~
160Hz
87dB/W/M
87dB/W/M
87dB/W/M
88dB/W/M
Rated input
165W
165W
170W
170W
Maximum input
330W
330W
340W
340W
Impedance
Frequency range
SPEAKER
Front : 260 x 1120x 260 mm

Surround : 100 x 151 x 89 mm
Centre : 300 x 59 x 50 mm
Subwoofer : 201 x 403 x 410 mm
Weights
Front: 2.18 Kg, Surround: 0.42 Kg

Centre: 0.32 Kg, Subwoofer: 5.39 Kg
Samsung Electronics
2-3

Speaker system
Front
Surround
Center
Subwoofer
140Hz ~
50KHz
140Hz ~
20KHz
140Hz ~
20KHz
40Hz ~
160Hz
87dB/W/M
87dB/W/M
87dB/W/M
88dB/W/M
Rated input
165W
165W
170W
170W
Maximum input
330W
330W
340W
340W
Impedance
Frequency range
SPEAKER
2-4
Front/Surround: 260 x 1202 x 260 mm

Centre: 300 x 59 x 50 mm
Weights
Front/Surround: 2.88 Kg,

Centre: 0.34 Kg, Subwoofer: 5.39 Kg
Samsung Electronics
2-2-2 HT-BD1220 Specifications

Basic Specification
GENERAL
FM TUNER
Power Consumption
85 W
Weight
4.4 Kg
Dimensions
440 (W) x 345 (D) x 63 (H) mm
Operating Temperature Range
+5C ~ +35C
Operating Humidity Range
10% to 75%
FM Frequency Range
87.5 ~ 108.0 MHz
Signal / noise ratio
60 dB
Usable sensitivity
10 dB
Total harmonic distortion
1%
BD (Blu-ray Disc)
Reading Speed: 4.917m/sec

DISC
DVD (Digital Versatile Disc)
Approx. Play Time (Single Sided, Single Layer Disc):

135 min.
CD: 12 cm
(COMPACT DISC)
CD: 8 cm
(COMPACT DISC)

1 channel: 1.0 Vp-p (75 load)
Composite Video
Blu-ray Disc: 576i/480i

DVD: 576i/480i
Y: 1.0 Vp-p (75 load)
VIDEO
OUTPUT
Pr: 0.70 Vp-p (75 load)

Component Video
Pb: 0.70 Vp-p (75 load)

Blu-ray Disc: 1080i, 720p, 576p/480p, 576i/480i
DVD: 576p/480p, 576i/480i
VIDEO/
AUDIO
AMPLIFIER
HDMI
1080p, 1080i, 720p, 576p/480p

PCM multi channel audio, Bit stream audio, PCM audio
Front speaker output
165W x 2 (3)
Center speaker output
170W (3)
Frequency range
Analog input: 20Hz ~ 20kHz (3dB)

Digital input: 20Hz ~ 44kHz (3dB)
S/N Ratio
70dB
Channel separation
60dB
Input sensitivity
(AUX) 500mV
Samsung Electronics
2-5

Speaker system
Front
Subwoofer
140Hz ~ 50KHz
40Hz ~ 160Hz
87dB/W/M
90dB/W/M
Rated input
165W
170W
Maximum input
330W
340W
Impedance
Frequency range
SPEAKER
2-6
Front: 100.5 x 210 x 99 mm

Weights
Front: 0.70 Kg
Subwoofer: 5.39 Kg
Samsung Electronics
2-2-3 Video Output SPEC

BD playback
Output
Setup
1080P@60F
HDMI Output
Component
[HDMI
Connected]
Component
[HDMI not
Connected]
CVBS Output
1080P@60F
480i
1080i
480i
1080P@24F
1080P@24F
480i
1080i
480i
1080i
1080i
1080i
1080i
480i
720P
720P
720P
720P
480i
480P
480P
480P
480P
480i
480i
480P
480i
480i
480i
HDMI Output
Component
[HDMI
Connected]
Component
[HDMI not
Connected]
CVBS Output
1080P@60F
1080P@60F
480i
480P
480i
1080i
1080i
480i
480P
480i
720P
720P
480i
480P
480i
480P
480P
480i
480P
480i
480i
480P
480i
480i
480i
Remark
Only when
source is
1080P@24F
DVD playback
Output
Setup
Samsung Electronics
Remark
2-7
2-3 Specifications Analysis

Model Name
HT-BD1250
HT-BD2
Profile
Blu-ray 2.0 from the beginning
Blu-ray 1.0
DVD, CD
MP3, JPG
USB HOST
I-POD
(only USA)
Wireless LAN
DivX (SD)
(only EU)
Wireless Rear
Memory Slot
X (External USB support)
BD-RE support
Support 1.0
Does not support 1.0
Update Method
CD, Network, USB
CD, Network
Required time for update
3~4min
10~12 min
Remote
long
long
HDMI
1.3
1.3
1080p 24frame
CEC (Anynet+)
X (8bit)
X (8bit)
xvYCC
HD Audio Transmission
Picture Quality control
(Progressive Mode, Still Mode,
Photo
Deep Color
HDMI
BD Wise, Picture Control)

Video Processor
Video
Main SOC Internal Scaler
Main SOC Internal Scaler
1080p 60frame
1080i 60frame
1080p 24frame
480i/p video output for

Blu-ray
Simultaneous Video
Output between HDMI/
Component/CVBS
: application, X: non-application
2-8
Samsung Electronics
Model Name
HT-BD1250
HT-BD2
480p
480p
Maximum resolution for TV input
Maximum resolution for TV input
480p
480p
HT-BD1250 can also output 480i/480p
HT-BD2 can also output 480i/480p
resolution with Blu-ray Disc
resolution with Blu-ray Disc
DD Plus decoding
Dolby TrueHD decoding
dts HD HRA decoding
dts-HD MA decoding
(dts-HD Master Audio essential)
(into dts)
Photo
Factory Default
When connected the TV
Video
Resolution
Default
which has correct EDID

When connected the
TV which has incorrect
EDID
Remark
Audio
H/W
Re-encoding
dts-HD MA Essential
dts-HD MA
HD audio bit stream
dts-HD HRA
dts-HD HRA
output on HDMI 1.3
TrueHD
TrueHD
DD+
DD+
SMPS
2 trans
2 trans
Deck
Draw type Plastic Cover
Slot-In
5G VE Pickup
4G VE Pickup
SANYO
SANYO
One Board
P-ATA
Pick Up
Front Micom
Main Loader
: application, X: non-application
Samsung Electronics
2-9
2-4 Accessories
2-4-1 Supplied Accessories
Accessories
Item
Item code
Remote Control
Battery
AH59-02144L
4301-000116
HDMI Cable
AH39-00923A
Audio Cable
AH39-40001V
Remark
Samsung Service Center
2-10
FM Antenna
AH42-00021A
Users Manual
AH68-02178F
AH68-02178G
AH68-02178H
Cloth Clean
AH81-02286C
Samsung Electronics
Troubleshooting
4. Troubleshooting
4-1 Checkpoints by Error Mode.................................................................4-2
4-2 Initialization & Upgrade Methods.........................................................4-34
4-3 Buyer-Region Code Setting Method....................................................4-38
Samsung Electronics
4-1
Troubleshooting
4-1 Checkpoints by Error Mode

Oscilloscope Setting Values
Voltage/DIV
1V/div
TIME/DIV
500ms/div
4-1-1 NO POWER
No Power Detected
(Stand by LED OFF)
FL1 (250V/10A) is normal?
No
Change FL1
Test SMPS PCB
No
Change BDL1
Test SMPS PCB
No
Change IC2
Test SMPS PCB
No
Change PCA3
Test SMPS PCB
Yes
BDL1 (TPS10P05G) is normal?
Yes
IC2 (ICE3B0365J) is normal?
Yes
PCA3 (PC817) is normal?
Yes
Change the SMPS PCB
4-2
Samsung Electronics
Troubleshooting
4-1-2 AMP NO POWER
AMP No Power
(Stand by LED ON)
IC1 (MR4040) is normal?
No
Change IC1
Test SMPS PCB
No
Change PCA3
Test SMPS PCB
Yes
PCA1, 2 (PC817) is normal?
Yes
Change the SMPS PCB
Samsung Electronics
4-3
Troubleshooting
4-1-3 NO SOUND-1
There is no audio sound from speaker.
Check CON1 pin 17~21 of AMP PCB?

; I2S DATA/CLK must be inputed
Yes
Change MAIN PCB
Refer to image of
Fig. 4-1.
Check AL01~06 of AMP PCB?

; Output Check
Yes
No
No
Change AMP PCB
Refer to image of
Fig. 4-2-1 and Fig.
4-2-2.
Check the signal from jack and if

not, change AMP PCB.
4-4
Samsung Electronics
Troubleshooting
CON1
AMP, page 7-5
AMP PCB Top, page 6-9

<Fig. 4-1>
Samsung Electronics
4-5
Troubleshooting
AMP, page 7-5

<Fig. 4-2-1>
4-6
Samsung Electronics
Troubleshooting
J3
AIC5
AIC6
AIC3
AIC4
AIC1
AIC2
UPIC1
AIC11

<Fig. 4-2-2>
Samsung Electronics
4-7
Troubleshooting
4-1-4 NO SOUND-2 (waveform when 1KHz, -20dB signal is input)
No Sound
CHECK POWER
No
CN2: +12V
Check
Replace SMPS
Yes
PWM INPUT CHECK
UPIC1 (PS9830B)
Pin 15, 16, 17 Check
No
Check UPIC1 Data Line

Pattern
Yes
PWM OUTPUT CHECK
Check UPIC1 Power pin
pattern.
UPIC1 (PS9830B)
Pin 48, 49, 51, 52, 54, 55, 61,
62, 67, 68 Check
No
UPIC1 (PS9830B)
POWER (3.3V) Pin 4, 10, 22,
29, 39, 47, 56, 65, 72, 84,
87, 94 Check
Yes
No
Replace UPIC1.
Yes
Refer to wave pattern

image of Fig. 4-3.
OP AMP IC OUTPUT
CHECK
AIC7, 8, 9 (4560)
Pin 1, 7 Check
Yes
No

image of Fig. 4-4-1
and Fig. 4-4-2.
AIC7, 8, 9 (4560)
POWER (+5V, -5V)
Pin 8, 4 Check
No
Replace AIC7, 8, 9.
4-8
Samsung Electronics
Troubleshooting
AIC1, 2, 3, 4,
5, 6 (IRS2092S)
Pin 11, 14 Check
Yes
No

image of Fig. 4-5-1
and Fig. 4-5-2.
AIC1, 2, 3, 4, 5, 6 (IRS2092S)
POWER (+5V, -5V)
Pin 1, 6 Check
No
Replace AIC1, 2, 3, 4, 5, 6.
SOUND OUTPUT OK
Samsung Electronics
4-9
Troubleshooting
AIC3
AIC4
AMP, page 7-5
1
1
UPIC1

<Fig. 4-3>
4-10
Samsung Electronics
Troubleshooting
AMP, page 7-5

<Fig. 4-4-1>
Samsung Electronics
4-11
J3
Troubleshooting
AIC7
AIC8
AIC9
AMP PCB Bottom, page 6-11
<Fig. 4-4-2>
4-12
Samsung Electronics
Troubleshooting
3
AMP, page 7-5
<Fig. 4-5-1>
Samsung Electronics
4-13
J3
Troubleshooting
AIC5
AIC6
AIC3
AIC4
AIC1
AIC2
UPIC1
AIC11
<Fig. 4-5-2>
4-14
Samsung Electronics
Troubleshooting
4-1-5 DISC LOADING ERROR
Disc Ioading error
Check the
FEU1, IC23 8V, 5V
PiC1 3.3V
No
Check the Power
Yes
PICKUP cable and

Motor cable inserted correctly?
No
Reinsert cables again
Yes
Check the clock at X1 25MHz
No
Change the MAIN PCB
Yes
Change the DECK
Samsung Electronics
4-15
Troubleshooting
4-1-6 REMOTE DOEST WORK
Remote control does not work
No
Remote Battery OK?
Check the Battery
Yes
Is the FFC cable

(between Front panel & Main) OK?
No
Re-insert FFC cable correctly
Yes
REYE Pin 1 Signal OK?
Yes
No
Check REYE or change the

FRONT PCB

image of Fig. 4-6.
Change MAIN PCB FMIC1 Pin 47 or

change the MAIN PCB
4-16
Samsung Electronics
Troubleshooting
1
1
<Remote Eye Data>
FRONT, page 7-3
PCON1
IC1
TCON1
UIC2
FCON1
FRONT PCB Top, page 6-3

J
Samsung Electronics
<Fig. 4-6>
4-17
Troubleshooting
4-1-7 NO PICTURE
No Picture
Logo screen is OK?
No
Yes
BD/DVD Playback is OK?
Yes
Change the MAIN PCB
4-18
HDMI?
Yes
No
Component?
Yes
No
NO LOGO HDMI
No
NO LOGO COMPONENT
NO LOGO CVBS
Samsung Electronics
Troubleshooting
4-1-8 NO LOGO HDMI
No Logo HDMI
Video selection
accords with cable connection and
TV mode?
No
Check the Video select, cable

connection, TV mode
No
Check U1 Power Input,

Y1 Oscillation, Memory interface
Yes
Clock, Data and Sync from

Pin 56~94 from IC18.
Yes

image of Fig. 4-7.
Pin 51 of IC18 is High?

(2V ~ 5V)

image of Fig. 4-8.
No
Check IC18 connector and HDMI

cable connection
No
Check IC18 power input and

peripheral devices
Yes
Data output from IC18?

(Pin 30, 31, 33, 34, 36, 37,
39, 40)
Yes

image of Fig. 4-9.
HDMI Cable Error
Samsung Electronics
4-19
Troubleshooting
1
<Digital Video Signal>
CEIC1
HDMI CEC / TX (SIL9134), page 7-7
IC18
1
MAIN PCB Top, page 6-13
4-20
U1
<Fig. 4-7>
DIC1
Samsung Electronics
PIC
Troubleshooting
<54MHz Crystal>
CEIC1
CLOCK, BBS, page 7-10
IC18
EM2
DIC1
Samsung Electronics
U1
<Fig. 4-8>
4-21
Troubleshooting
<HDMI OUTPUT DATA>
HDMI CEC / TX (SIL9134), page 7-7
CEIC1
IC18
4-22
U1
<Fig. 4-9>
DIC1
Samsung Electronics
PIC
Troubleshooting
4-1-9 NO LOGO COMPONENT
No Logo Component
Video selection
TV mode?
No

connection, TV mode
No
VCN1 (VR12, VR13, VR14)

soldering error
Yes
Video output from

VCN1 (VR12, VR13, VR14)
Yes

image of Fig. 4-10.
No
Video output from

VIC1 & VC6, VC1, VC4
Yes
Check VIC1 soldering of peripheral

devices

image of Fig. 4-11.
Component Cable Error
Samsung Electronics
4-23
Troubleshooting
CEIC1
CON18
AUDIO / VIDEO (COMPONENT, COMPOSITE), page 7-6
IPIC2
IC18
1
1 VR12
1 VR13
1 VR14
DIC1
PIC6
U1
DSIC1
4-24
MEM3
MEM4
<VR12 Y Signal>
<VR13 Pb Signal>
<VR14 Pr Signal>
<Fig. 4-10>
Samsung Electronics
DSCN1
Troubleshooting
VIC1
AIC3
MAIN PCB Bottom, page 6-10
2 VC1
2 VC4
DSIC5
2 VC6
DSIC1
DBGN1
<VC6 Y Signal>
<VC1 Pb Signal>
<VC4 Pr Signal>
<Fig. 4-11>
Samsung Electronics
4-25
MUIC1
Troubleshooting
4-1-10 NO LOGO CVBS
No Logo CVBS
Video selection
TV mode?
No

connection, TV mode
Yes
No
Video output from

VCN1 (VR16)
Yes

image of Fig. 4-12.
No
Video output from

VIC1 & VC3
Yes
VCN1 (VR16) soldering error
Check VIC1 soldering of peripheral

devices

image of Fig. 4-13.
Component Cable Error
4-26
Samsung Electronics
Troubleshooting

IPCN1
CON18
1 VR16
IC18
PIC5
<Composit Output CVBS Color Bar
VR16>
DJ3
IPIC2
MUCN
DIC1
PIC6
Samsung Electronics
<Fig. 4-12>
4-27
PCN1
DSIC1
Troubleshooting
2 VC3
MUCN
AIC3
VIC1
<Composit CVBS Color Bar VC3>
DJ3
MUIC1
<Fig. 4-13>
DSIC1
Samsung Electronics
PCN1
4-28
DSIC5
Troubleshooting
4-1-11 Disc skips or freezing
Disc skips or freezing
All Media
(BD/DVD/CD) NG?
No
Yes
Check Power
PiC1 (3.3V), L1112 (1.2V),
IC23 (5V)?
SMPS Check
Yes
Check the clock at

X-TAL1 25MHz?
Yes
No
Yes
Q3 Emitter
Voltage check
Q2: DVD, Q1:CD
4V ~ 6.5?
Yes
No
Refer to image of
Fig. 4-14.
Change the MAIN PCB
Only BD NG?
No
Check U100's phreperial part

like soldering etc.
No
Refer to image of
Fig. 4-15.
Change the DECK
Only DVD NG?
No
Only CD NG?
RFIP Check?
Signal level OK?
BD: over 400mV
DVD: over 200mV
CD: over 200mV
Yes
No
Refer to image of
Fig. 4-16.
No
Change the MAIN PCB
Samsung Electronics
Change the MAIN PCB
Change the DECK
4-29
CE
USCO
IC18
J2
Troubleshooting
MEM2
U1
MEM1
MEM3
MEM4
BCM7620 (F/E), page 7-20
FEIC13
CON16
DSC
CON15

<Fig. 4-14>
4-30
Samsung Electronics
IPIC2
IC18
VIC1
PIC6
DIC1
2
DSIC1
2
DSIC5
J2
USCON1
Troubleshooting
BCM7620 (F/E), page 7-20
DBGN1
DSCN1
DSIC14
2
2
CON12
CON17
FEIC13
CON15
CON15
<Fig. 4-15>
Samsung Electronics
4-31
VIC1
Troubleshooting
DSIC5
DBGN1
FEIC13
DSIC
BCM7620 (F/E), page 7-20
CON15

<Fig. 4-16>
4-32
Samsung Electronics
Troubleshooting
4-1-12 Network Error
Network Error
Cable connection
between Set & LAN ok?
No
Connect correctly the cable or

Wireless jack
Fail
Refer User Manual's Network Setup

Part and reset-up setting of Network
Yes
Check Network connection

Test in the setup menu.
OK
Change the MAIN PCB
The connection between LAN and SET is direct. So there is no need to check H/W if there is network problem.
If it is, the problem is MAIN CHIP(U1)'s BGA soldering problem.
It must be changed to new board.
Samsung Electronics
4-33
Troubleshooting
4-2 Initialization & Upgrade Methods

4-2-1 How to check F/W version
Method 1
- Step 1: Open the tray
- Step 2: Press and hold INFO button on the
remote over 5 seconds.
- Then, you will see below screen
LDR : 02152008 / Front : 005

Software : yymmdd.xx
Region : A/1 (BD/DVD)
Macrovision : BBS41
Method 2
- Press MENU on the remote controller
- Setup System Setup System Information
Description for the meaning
- LDR: Loader F/W (Updatable)
- Front: Front Micom F/W (Not Updatable, and dont need to mostly)
- Software: Blu-ray Disc, DVD, CD, Main (Updatable)
- Region: BD region code / DVD region code
- Macrovision
4-34
Samsung Electronics
Troubleshooting
4-2-2 Update methods

There are 3 Update methods
- CD Update
- Ethernet Update
- USB Update (New Feature)
F/W Update Method by CD
1. Insert update CD and close the tray.
2. Tray will be opened.

3. Press Yes.
(If the update CD you inserted is a later one than
Current Version)
4. Get rid of update CD from the Disc Tray.

5. Wait about 2~3 minutes.
Verifying Firmware Version.
Do you want to update Firmware?

>Current Version : yymmdd.xx.XAA
>New Version : yymmdd_xx_HT-BD1250_XAA
Yes
No
Firmware Update.
Now, Processing...
Please, do not turn off the power.
6. When Finished, power automatically goes off.
Samsung Electronics
4-35
Troubleshooting
F/W Update via Network
4-36
Samsung Electronics
Troubleshooting
F/W Update by USB

1. Insert the USB on the rear panel.
Verifying Firmware Version.
2. Press Yes.
Do you want to update Firmware?
(If the USB you inserted has a later one than Current
Version)
>Current Version : yymmdd.xx.XAA

>New Version : yymmdd_xx_HT-BD1250_XAA
Yes
4. Wait about 2~3 minutes.
No
Firmware Update.
Now, Processing...
5. When Finished, power automatically goes off.
Please, do not turn off the power.
4-2-3 Cold Start Method (Initialize Setup)

1. This is useful for forgotten Parental Lock password.
2. Press | on the front panel for over 5 seconds while
no disc status.
3. Then, VFD sign: COLD START
4. System Micom Cold Start
: During Stand-By, just press on the front panel for
over 5 seconds. Then, Red LED will go out and go on.
Samsung Electronics
MENU LANGUAGE SELECTION
Press 1 for English
Pulsar 2 para Espanol
Touche 3 pour Francais
Macrovision : BBS41
4-37
Troubleshooting
4-3 Buyer-Region Code Setting Method

4-3-1 The inserting method of Region Code after replacing the Main PBA
[Reference]
- When replacing the Main PBA and System Micom (MUIC1) should be inserted the region code.
- The set is not working properly if you don't insert the region code.
- The region code is inserted by the remote control.
1. Press the AUX button on the remote control.
2. Press the "MARKER" button on the remote control during 4~5

seconds.
3. After step (2), you can see T-MODE on the VFD and press
direction button during T-MODE.
Please remind that T-MODE indicator on the VFD is appeared for
a very short time.
T-MODE
4. After step (3), you can see TEST on the VFD.

Insert number 3, 3 to select Region Code.
4-38
TEST
Samsung Electronics
Troubleshooting
5. After step (4), you can see on the VFD.

Insert the Region Code (Below table) corresponding model with
0 ~ 9 buttons on the remote control.
Option Table
Area
HT-BD1250
5.1CH
Region Code
HT-BD1220
2.1CH
Region Code
USA
00
16
Japan
01
17
Korea
02
18
Taiwan
03
19
Philippines
04
20
Mexico
05
21
Latin American
06
22
Europe
07
23
Indonesia
08
24
Australia
09
25
Russia (semi_mic)
10
26
Only models which supporting semi-karaoke

not including midi file.
Russia (full_mic)
11
27
Full karaoke models which support midi file.
Africa
12
28
China (semi_mic)
13
29
Brazil
14
30
Canada
15
31
Remark
For example, insert 00 to select USA.
Samsung Electronics
4-39
Troubleshooting
6. After step (5), you can see 00 USA on the VFD.

It means that currently System Micom (MUIC1) program is installed
by USA specification.
00 USA
7. Turn the Power off.
[Tip]
In case of System Micom (MUIC1) and EEPROM (MUIC2) problem, you can apply to this.
For example, during Updating program of System Micom, if Updating fail is happened, it is impossible to turn on
the system from stand-by status.
The system will keep the stand-by status continuously, and the touch-key function will never work.
In this case, you have to change System Micom, and set up the Buyer Region code again.
In case of EEPROM, you don't need to care about it.
After set-up the Region code, System Micom will store the information of the region code to EEPROM
automatically.
4-40
Samsung Electronics
Exploded View & Part List

5-1 Product Exploded View........................................................................5-2
5-2 DECK Exploded View............................................................................5-4
5-3 Speaker System....................................................................................5-6
5-4 Electrical Part List.................................................................................5-7
Samsung Electronics
This Document can not be used without Samsungs authorization.
5-1
5-1 Product Exploded View
T0265
W391
W275
M0014
T0076
C0104
C006
H008
AL210
FL261
W275
W392
W275
P003
W391
AD330
AM020
A4
AD150
AL180
AB501
W391
T0076
C011
T0076
C001
T0268
W275
W391
FL261
AD340
W275
AD502
AF020
AD504
P005
P007
S.N.A: Service Not Available
5-2
Samsung Electronics
Part List
Loc. No.
Code No.
AB501
AH97-03233A
AD150
Qty
SNA
ASSY-BRACKET-TOP;HT-BD1250,HT-BD1250,BAS
SNA
AH64-04906C
DECORATION-FRONT;HT-BD1250,ABS,T2.0,440,
SNA
AD330
AH64-04915A
DECORATION-SIDE-L;HT-BD1250,ABS,2.5,33,3
SA
AD340
AH64-04916A
DECORATION-SIDE-R;HT-BD1250,ABS,2.5,33,3
SA
AD502
AH64-04908B
DOOR-DVD;HT-BD1250,ABS,2.0,17.4,146.0,12
SA
AD504
AH64-04907B
DOOR-HIDDEN;HT-BD1250,ABS,2.0T,20,80,10,
SNA
AF020
AH63-01832B
FILTER-VFD;HT-BD1250,PC T0.5,16,100,VIOL
SNA
AL180
AH67-00536A
LENS-STANDBY;HT-BD1250,PMMA MILKY,MILKY,
SA
AL210
AH67-00535A
LENS-VOLUME;HT-BD1250,PMMA MILKY,MILKY,W
SA
AM020
AH31-00039B
MOTOR FAN;C151BK10A2430,RDM5015S,0.12A,1
SA
C001
AH97-03048A
ASSY CABINET-FRONT;HT-BD1250,HT-BD1250,B
SNA
C006
AH64-04913A
KNOB-VOLUME;HT-BD1250,ABS,3.0,40,40,BLAC
SA
C0104
3809-001926
CABLE-FLAT;30V,80C,60mm,28P,1.25mm,UL289
SA
C011
AH61-02527A
SPRING ETC-DOOR;HT-Z310,STS 304 WPS,0.2,
SNA
FL261
3809-002242
FFC CABLE-FLAT;30V,80C,250mm,28P,1.0mm,U
SNA
FL261
3809-002241
FFC CABLE-FLAT;30V,80C,100MM,5P,1.0mm,UL
SNA
H008
AH92-03053A
ASSY PCB AMP;BD HOME THEATER,HT-BD1250,E
SNA
M0014
AH92-03052C
ASSY PCB MAIN;-,HT-BD1250,EU(option: I-P
SNA
P003
AH44-00203A
SMPS-HP;HT-BD1250,ORTP-527,150~200W,AC17
SA
P005
AH92-03059A
ASSY PCB FRONT;BD HOME THEATER,HT-BD1250
SNA
P007
AH92-03060A
ASSY PCB KEY;BD HOME THEATER,HT-BD1250,H
SNA
T0076
AH39-01041A
WIRE HARNESS;HT-BD1250,4,210mm,BLACK,WHI
SNA
T0076
AH39-01042A
WIRE HARNESS;HT-BD1250,6pin,100mm,BLACK,
SNA
T0076
AH39-01043A
WIRE HARNESS;HT-BD1250,24pin,#1~22 WHITE
SNA
T0265
AH96-00047B
ASSY COVER P-TOP;HT-BD1255,NOEUR,ASSY,HB
SNA
T0268
3903-000403
CBF-POWER CORD;AT,EU,CP2,HOUSING(2P),250
SNA
W275
6003-001561
SCREW-TAPTYPE;BH,+,-,B,M3,L6,ZPC(WHT),SW
24
SA
W391
6003-000275
SCREW-TAPTYPE;BH,+,B,M3,L10,ZPC(BLK),SWR
12
SA
W392
6003-000282
SCREW-TAPTYPE;BH,+,-,B,M3,L8,ZPC(BLK),SW
SNA
Samsung Electronics
Description;Specification
Remark
5-3
5-2 DECK Exploded View
W901
( 2 x 7 W SCREW )
H200
H400
H401
( 1.7 x 5 W SCREW )
PICK UP
H301
W900
( 2.6 x 6 W SCREW )
H300
H301
H100
H501
H500
5-4
Samsung Electronics
Part List
Loc. No.
Code No.
H100
AK97-02460B
H200
Qty
SNA
ASSY FRAME-MAIN; ASSY,BD-P5B,-,-
SA
AK96-01014A
ASSY COVER; BD-P1600,-,-,-
SA
H300
AK96-01024A
ASSY TRAVERSE; BD-P5,-,-,-
SA
H301
AK61-00736A
BRACKET-SHAFT PU; DP-R3.5,SUS T1.0,-,
SA
H400
AK96-01025A
ASSY-HINGE PU; BD-P5,-,-,-
SA
H401
6002-001086
SCREW-TAPPING; PH,+,-,B,M1.7,L5.0,ZPC
SA
H500
AK92-01850A
ASSY PCB-RELAY; BD-P5B,BD-P1250,-,-
SA
H501
AK41-00891A
FFC-PU CABLE; BD-P1250,B TYPE,0.5 PIT
SA
PICKUP
AK96-01004A
ASSY PICK UP-BP5; SOH-BP5,BD-PLAYER,-,-
SA
W900
6003-001449
SCREW-TAPTITE; BH,+,B,M2.6,L6,NI PLT
SA
W901
6003-001199
SCREW-TAPTITE; PWH,+,-,B,M2,L7,ZPC(WH
SA
Samsung Electronics
Remark
5-5
5-3 Speaker System
Front
Speaker (R)
Front
Speaker (L)
Center Speaker
1
2
7
5
6
Subwoofer
8
3
7
5
8
6
Rear
Speaker (R)
8
Rear
Speaker (L)
Part List
Loc. No.
Code No.
Front Speaker (L)
AH81-05185C
Front Speaker (R)
Qty
SNA
SPEAKER;PS-BD1255,FRONT SPEAKER -L,5.1CH
SA
AH81-05186C
SPEAKER;PS-BD1255,FRONT SPEAKER-R,5.1CH
SA
Rear Speaker (L)
AH81-05187C
SPEAKER;PS-BD1255,REAR SPEAKER-L,5.1CH
SA
Rear Speaker (R)
AH81-05188C
SPEAKER;PS-BD1255,REAR SPEAKER-R,5.1CH
SA
AH81-05234C
SPEAKER;PS-BD1255,FRONT SPEAKER-R,TOP
SA
AH81-05233C
SPEAKER;PS-BD1255,FRONT SPEAKER -L,TOP
SA
AH81-05236C
SPEAKER;PS-BD1255,REAR SPEAKER-R,TOP
SA
AH81-05235C
SPEAKER;PS-BD1255,REAR SPEAKER-L,TOP
SA
AH81-04981A
A/S;FRONT SPK BOT ASS`Y,FOR PS-TZ522,
SA
AH81-04982A
A/S;STAND ASS`Y,FOR PS-FTZ522,UHL CO.,LTD
SA
AH81-03943A
SPEAKER-SCREW;PS-TZ215,SCREW,5*20,FOR
SA
AH81-03944A
SPEAKER-SCREW;PS-TZ215,SCREW,3.5*16,FOR
SA
Center Speaker
AH81-05189C
SPEAKER;PS-BD1255,CENTER SPEAKER,5.1CH
SA
Subwoofer
AH81-05127C
SPEAKER-SUBWOOFER;PS-BD1250,SUBWOOFER
SA
Speaker Wire
AH81-02177B
SPEAKER;PS-Q20,SPK CORD, CONNECTOR,
SA
5-6
Remark
Samsung Electronics
5-4 Electrical Part List

Loc. No. Part No.
Qty SNA Remark
P005 AH92-03059A ASSY PCB FRONT;BD HOME THEATER,HT-B 1

A0701 AH07-00245A VF DISPLAY;HNA-09SS79T,HT-Z320,88*1
1
AAC1 2203-005249 C-CER,CHIP;100nF,10%,50V,X7R,TP,160
5
AC510 3708-001666 CONNECTOR-FPC/FFC/PIC;28P,1MM,ANGLE 1
AC510 3708-001618 CONNECTOR-FPC/FFC/PIC;5P,1mm,SMD-A,
1

AD480 2203-000979 C-CER,CHIP;47nF,10%,50V,X7R,TP,2012
1
AF020 AH63-01832B FILTER-VFD;HT-BD1250,PC T0.5,16,100
1
AH410 AH61-02752A HOLDER-VFD;HT-BD1250,HIPS,1.5,104,2
1
AQ8
0504-000156 TR-DIGITAL;KSR2103,PNP,200MW,22K/22
1
AR30 2007-000074 R-CHIP;100ohm,5%,1/10W,TP,1608
3

C125 2203-006361 C-CER,CHIP;10000nF,10%,10V,X5R,TP,2
4
CN2
3722-002313 JACK-USB;4P/1C,AU30U,BLK,STRAIGHT,A
1
D0254 0404-000002 DIODE-SCHOTTKY;CMPSH-3,30V,200mA,SO
3
DR32 3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,-
2
KAR11 2007-000124 R-CHIP;2.2Kohm,5%,1/10W,TP,1608
2

KAR21 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608
2
MROP1 2007-000090 R-CHIP;10Kohm,5%,1/10W,TP,1608
4
PR6
2007-000072 R-CHIP;47ohm,5%,1/10W,TP,1608
1
R830 2007-000101 R-CHIP;82Kohm,5%,1/10W,TP,1608
1
UCN1 3711-005306 HEADER-BOARD TO CABLE;BOX,4P,1R,2MM 1

UIC2 0609-001189 MODULE REMOCON;HORIZONTAL,16.4MM,TR 1
VCN1 3711-005160 HEADER-BOARD TO CABLE;BOX,6P,1R,2mm 1

0406-001128 DIODE-TVS;MLVS-0603-E08,50V
5

1003-002176 IC-VFD;MC3401,LQFP,44P,10x10mm,-40m
1

3002-001134 BUZZER-PIEZO;85dB,12V,2K-4KHz,BK
1

3711-000471 HEADER-BOARD TO CABLE;3WALL,4P,1R,2
1

AH41-01223A PCB-FRONT;HT-BD1250,2Layer-Penol,2,
1

AH99-00377A ASSY AUTO INSERT-FRONT PCB;-,HT-BD1
1

M0045 AH98-00222B ASSY ACCESSORY;HT-BD1250,EDC,-,-
1
T0685 4301-000116 BATTERY-ALKALINE;1.5V,R03,10.5x44.5
2
PE I/B 6902-000385 BAG PE;LDPE,T0.03,W250,L350,TRP,8,1
1
M0025 AH42-00021A ANT FM T;T18011F-1,75 ohm,1800mm
1

AH68-00650L MARK RECYCLE-CARD-WARRANTY;YP-P2,EL 1

AH68-50254B LABEL-SERIAL;T0.1,L10,W45,SME/SEHZ
2
T0511 AH68-02178F MANUAL USERS;HT-BD1250,EDC,ENG/FRN/
1
C-AUDI AH39-40001V CABLE-AUDIO CABLE;-,-,1P-1P,3000mm,
1
HT004 AH81-02286C A/S-EYEGLASS CLOTH;HT-TXQ120,POLY-B
1

6801-001763 CARD-REGISTRATION;Europe Registrati
1

M0045 AH98-00222Y ASSY ACCESSORY;HT-BD1250,-,-,-
1
PE I/B 6902-000385 BAG PE;LDPE,T0.03,W250,L350,TRP,8,1
1

AH68-50254B LABEL-SERIAL;T0.1,L10,W45,SME/SEHZ
2
T0511 AH68-02178G MANUAL USERS;HT-BD1250,EDC,POL/HUN/
1
T0511 AH68-02178H MANUAL USERS;HT-BD1250,EDC,GRE/RUM/ 1

AH98-00227Y ASSY LABEL;HT-BD1250,-,-,-
1
FL261 3809-002242 FFC CABLE-FLAT;30V,80C,250mm,28P,1.
1
T0076 AH39-01041A WIRE HARNESS;HT-BD1250,4,210mm,BLAC
1
T0076 AH39-01042A WIRE HARNESS;HT-BD1250,6pin,100mm,B
1
S-SHEE AH63-01301A SHEET-SET;HT-Q40,-,-,-,-,-,-
1

L-BARC AH68-00371A LABEL-BAR CODE;DVD-611/XAA,MOJO2000
2
CCM1 AH68-01929H LABEL RATING;HT-A100,ELS,SLIVER PET
2
M-CLEA AH68-01984A MANUAL-CLEANING;HT-X200,ART PAPER
1

AH69-02490A CUSHION-SET.L;HT-BD1250,EPS,15,449,
1

AH69-02491A CUSHION-SET.R;HT-BD1250,EPS,15,449,
1

Samsung Electronics
SNA
SNA
SNA
SA
SA
SA
SNA
SNA
SA
SNA
SNA
SNA
SA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SA
SA
SA
SNA
SNA
SNA
SNA
SNA
SA
SNA
SA
SNA
SNA
SA
SA
SNA
SNA
SNA
SNA
SNA
SA
SA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SA
SNA
SNA
Loc. No. Part No.
Qty SNA Remark

AH68-02205D LABEL-TOPPER POP;HT-BD1250,EUR,ART
1

P007 AH92-03060A ASSY PCB KEY;BD HOME THEATER,HT-BD1 1
6MC22 2203-000975 C-CER,CHIP;47nF,10%,25V,X7R,TP,1608
4
6
AC14 2203-000189 C-CER,CHIP;100nF,+80-20%,25V,Y5V,16
1
AC510 3708-001618 CONNECTOR-FPC/FFC/PIC;5P,1mm,SMD-A,
1

AHR40 2007-000088 R-CHIP;7.5Kohm,5%,1/10W,TP,1608
1
AQ7
0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-
2
AS420 3406-001146 SWITCH-ROTARY;5V DC,HOLLOW-SHAFT
1
4
C3
2203-000384 C-CER,CHIP;0.015nF,5%,50V,C0G,1608
6

D1
0401-001099 DIODE-SWITCHING;1N4148WS,75V,150mA,
6
FD7
0601-001226 LED;SMD,RED,1.2x0.8mm,660nm,1.6x0.8
1
FL261 3809-002241 FFC CABLE-FLAT;30V,80C,100MM,5P,1.0
1
L0405 0601-001949 LED;SMD,BLUE,1.6x0.8x0.4mm,468nm,1.
4
MR166 2007-000119 R-CHIP;560ohm,5%,1/10W,TP,1608
4

7
ND51C2 2007-000066 R-CHIP;20Kohm,1%,1/10W,TP,1608
6
PPC2 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160
1
R329 2007-000081 R-CHIP;2.7Kohm,5%,1/10W,TP,1608
1
R512 2007-000107 R-CHIP;470Kohm,5%,1/10W,TP,1608
1

R67
2007-000065 R-CHIP;2.2Mohm,5%,1/10W,TP,1608
6
UCN1 3711-005306 HEADER-BOARD TO CABLE;BOX,4P,1R,2MM 1
VCN1 3711-005160 HEADER-BOARD TO CABLE;BOX,6P,1R,2mm 1
WL02 3301-001069 BEAD-SMD;120ohm,1.6x0.8x0.8mm,200mA
4

0403-001064 DIODE-ZENER;RLZ5.1B,4.94-5.2V,500mW
1

1209-001742 IC-SENSOR;SS02,SOT26,6P,2.9x1.6mm,P
1

1209-001851 IC-SENSOR;MST08S16,SOP,16P,9.9x3.9m
1

AH41-01224A PCB-KEY;HT-BD1250,2layer penol,2,1,
1

AH99-00378A ASSY AUTO INSERT-KEY PCB;-,HT-BD125
1

M0014 AH92-03052C ASSY PCB MAIN;-,HT-BD1250,EU(option
1
3
AC109 2203-000783 C-CER,CHIP;0.33nF,5%,50V,C0G,1608
2
AC139 2203-000491 C-CER,CHIP;2.2nF,10%,50V,X7R,1608
1
AC510 3708-001086 CONNECTOR-FPC/FFC/PIC;28P,1.25mm,ST
1

AC510 3708-001766 CONNECTOR-FPC/FFC/PIC;11P,1mm,SMD-S
1
AC510 3708-001981 CONNECTOR-FPC/FFC/PIC;28P,1mm,SMD-S 1
AC510 3708-002603 CONNECTOR-FPC/FFC/PIC;22P,1mm,SMD-S 1
AC510 3708-002619 CONNECTOR-FPC/FFC/PIC;13P,1.0MM,SMD
1
AC6
2402-001049 C-AL,SMD;10uF,20%,16V,GP,TP,3.3x3.3
2

AD480 2203-000585 C-CER,CHIP;0.22nF,10%,50V,X7R,1005
1
AD480 2203-005659 C-CER,CHIP;0.18nF,5%,50V,NP0,1005
1
AD480 2203-005968 C-CER,CHIP;4.7NF,10%,50V,X7R,TP,100
1
5
AD480 2203-006336 C-CER,CHIP;10000nF,10%,25V,X5R,3216
5

ADHESI 0201-001415 ADHESIVE-TS;7387 ,AMR,1.5,-
0.02
ADHESI 0201-001416 ADHESIVE-SIL;384,WHT,500000~2250000
0.08
AH060 AH62-00200A HEAT SINK-MAIN;HT-BD1250,AL EXTR,1.
1
AIC2 1002-001558 IC-A/D CONVERTER;AK5367,24,VSOP,30P
1
AR150 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608
1

AR164 2007-000076 R-CHIP;330ohm,5%,1/10W,TP,1608
2
AR30 2007-000074 R-CHIP;100ohm,5%,1/10W,TP,1608
1
AR30 2007-001306 R-CHIP;150ohm,5%,1/16W,TP,1005
1
AR48 2007-000431 R-CHIP;16Kohm,5%,1/10W,TP,1608
1
SNA
SNA
SNA
SNA
SNA
SA
SNA
SA
SA
SNA
SNA
SA
SNA
SNA
SNA
SNA
SNA
SA
SNA
SNA
SNA
SNA
SNA
SA
SNA
SNA
SA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SA
SNA
SNA
SNA
SNA
SA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SA
SNA
SNA
SNA
SA
SNA
5-7
Loc. No. Part No.
Qty SNA Remark
AR49 2007-000140 R-CHIP;1Kohm,5%,1/16W,TP,1005

26

AVC08 2203-002398 C-CER,CHIP;22nF,10%,50V,X7R,1608
1
AVR73 2007-000142 R-CHIP;2.7Kohm,5%,1/16W,TP,1005
2
C

2402-001160 C-AL,SMD;330UF,20%,16V,WT,TP,1008
3
C100 2203-005065 C-CER,CHIP;1000nF,+80-20%,10V,Y5V,1
2
C102 2203-006158 C-CER,CHIP;100nF,10%,16V,X7R,1005
184

110
C239 2203-006047 C-CER,CHIP;33nF,10%,16V,X7R,1005
6
13
C317 2203-005692 C-CER,CHIP;4700nF,+80-20%,16V,Y5V,T
9
C514 2404-001035 C-TA,CHIP;10uF,10%,25V,-,TP,6032
1

C605 2203-000476 C-CER,CHIP;1000nF,+80-20%,16V,Y5V,2
4
C637 2203-001656 C-CER,CHIP;0.47nF,5%,50V,NP0,1608
4
C711 2203-002982 C-CER,CHIP;6.8nF,10%,50V,X7R,1005
1
CE1
2404-000284 C-TA,CHIP;10uF,20%,16V,-,TP,3528
1
CEIC1 AK09-00159A IC MICOM;MC80C0316-MC015 D32,44,2.7
1

CEQ2 0505-000110 FET-SILICON;2N7002,N,60V,115mA,7.5o
2
CER07 2007-001308 R-CHIP;200ohm,5%,1/16W,TP,1005
1
CF2
2801-004655 CRYSTAL-SMD;25MHz,50ppm,SX-3,18pF,2
2
CN1
3711-005582 HEADER-BOARD TO CABLE;BOX,24P,2R,2.
1
CON2 3722-002730 JACK-MODULAR;6P/4P,USB+LAN,ANGLE,N,
1

CQ3
0501-002184 TR-SMALL SIGNAL;KTD1304,NPN,200mW,S
2
D0254 0404-000002 DIODE-SCHOTTKY;CMPSH-3,30V,200mA,SO
5
D2505 0404-001036 DIODE-SCHOTTKY;SDB30A40,40V,3000MA,
1
DC1
2203-000386 C-CER,CHIP;.015nF,5%,50V,C0G,TP,100
3
DC18 2203-005138 C-CER,CHIP;1.8nF,10%,50V,X7R,1005
1

DC87 2203-001153 C-CER,CHIP;.068nF,5%,50V,NP0,1005
1
DOIC1 AH14-10004R IC-CMOS LOGIC;74HCU04,-,SOP,14P,-,-
1
DR1
2007-000043 R-CHIP;1Kohm,1%,1/10W,TP,1608
2
DR32 3301-000314 BEAD-SMD;120ohm,1.6x0.8x0.8mm,-,-,-
2
DR37 2007-000932 R-CHIP;470ohm,5%,1/16W,TP,1005
1

DR39 2007-000162 R-CHIP;100Kohm,5%,1/16W,TP,1005
5
DR4
2007-007142 R-CHIP;10Kohm,1%,1/16W,TP,1005
3
DR8
2007-007001 R-CHIP;3.9Kohm,5%,1/16W,TP,1005
1
DU501 1203-001824 IC-VOL. DETECTOR;7042,SOT-89,3P,PLA
1
F103 2901-001302 FILTER-EMI SMD;20V,0.3A,0pF,2.0x1.2
1

FAL4 2703-000301 INDUCTOR-SMD;2.7uH,10%,1608
1
FMIC1 1103-001333 IC-EEPROM;24C08A,8Kbit,1Kx8,SOP,8P,
2
FR18 2007-000982 R-CHIP;5.6Kohm,5%,1/16W,TP,1005
1
HD9
1405-001192 VARISTOR;12Vdc,30A,1.6x0.8x0.55mm,T
10
HDDCN 3708-001935 CONNECTOR-FPC/FFC/PIC;40P,0.5mm,SMD
1

HDMI 3701-001313 CONNECTOR-HDMI;19P,2R,PLUG,ANGLE,AU 1
HDR2 2007-000151 R-CHIP;15Kohm,5%,1/16W,TP,1005
7
HDR7 2007-000139 R-CHIP;220ohm,5%,1/16W,TP,1005
2
HDR9 2007-000152 R-CHIP;20Kohm,5%,1/16W,TP,1005
1
HIC1 1205-003113 IC-TRANSMITTER;SII9134CTU,TQFP,100P
1

HR12 2007-000591 R-CHIP;22ohm,1%,1/10W,TP,1608
2
HR37 2007-008107 R-CHIP;698ohm,1%,1/10W,TP,1608
1
HR60 2007-000779 R-CHIP;33ohm,1%,1/10W,TP,1608
4
HR8
2703-000166 INDUCTOR-SMD;2.7uH,5%,3225
1
HRP2 2011-001344 R-NETWORK;100ohm,5%,1/16W,L,CHIP,8P
18

IC1
1107-001763 IC-NOR FLASH;AT26DF081A-SU,8Mbit,1M
1
IC104 0801-002518 IC-CMOS LOGIC;74LCX157,2-INPUT MULT
1
IC104 0801-002564 IC-CMOS LOGIC;74VHCT244A,BUFFER,TSS
1
IC115 1107-001505 IC-FLASH MEMORY;AT49BV163DT,16Mbit,
1
IC520 0903-001580 IC-MICROCONTROLLER;BCM7620,LQFP,216 1

IC520 0903-001565 IC-MICROCONTROLLER;LC87F5NC8AVU,QFP 1
J1002 3722-002027 JACK-PIN;6P/6C,SN,YEL/GN/WH/BL/RD,A
1
5-8
SNA
SNA
SA
SNA
SNA
SA
SNA
SA
SNA
SA
SA
SA
SNA
SA
SA
SNA
SNA
SNA
SA
SA
SA
SA
SA
SA
SA
SA
SNA
SA
SNA
SNA
SA
SNA
SA
SNA
SA
SNA
SA
SA
SNA
SA
SA
SA
SNA
SA
SNA
SNA
SNA
SA
SNA
SA
SA
SNA
SA
SA
SNA
SNA
SNA
SA
Loc. No. Part No.
Qty SNA Remark
J914 2007-000029 R-CHIP;0ohm,5%,1/8W,TP,2012

1
JC24 2203-005819 C-CER,CHIP;1000nF,+80-20%,16V,Y5V,T
3
JC31 2203-000715 C-CER,CHIP;3.3nF,10%,50V,X7R,1608
3

JP19 2007-000033 R-CHIP;0ohm,5%,1/4W,TP,3216
5
KAR21 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608
30
KOP1 1201-000163 IC-OP AMP;4560,SOP,8P,173MIL,DUAL,1
1
KR7
2007-000402 R-CHIP;150ohm,5%,1/10W,TP,1608
3
L12
3301-000353 BEAD-SMD;120ohm,2x1.25x0.9mm,-,TP,-
5

L8

2703-000402 INDUCTOR-SMD;1uH,20%,3225
1
MC2
2203-000254 C-CER,CHIP;10nF,10%,16V,X7R,TP,1005
10
MC9
2203-000627 C-CER,CHIP;.022nF,5%,50V,C0G,TP,100
8
MD1
0404-001089 DIODE-SCHOTTKY;RB551V-30,20V,500MA,
1
MIC2 1105-001573 IC-DRAM;K4S281632,-,128Mbit,8Mx16Bi
1

MR10 2007-007141 R-CHIP;240ohm,5%,1/16W,TP,1005
1
MR122 2007-000094 R-CHIP;22Kohm,5%,1/10W,TP,1608
1
MR13 2007-000157 R-CHIP;47Kohm,5%,1/16W,TP,1005
23
MR16 2007-000168 R-CHIP;470Kohm,5%,1/16W,TP,1005
2
MR306 2007-000141 R-CHIP;2.2Kohm,5%,1/16W,TP,1005
5

MR31 2007-001305 R-CHIP;120ohm,5%,1/16W,TP,1005
4
MR36 2007-000153 R-CHIP;22Kohm,5%,1/16W,TP,1005
1
MR39 2007-000242 R-CHIP;1.5Kohm,5%,1/16W,TP,1005
29
MR8
2007-000503 R-CHIP;2.2ohm,5%,1/10W,TP,1608
3
1

NDL3 3301-000317 BEAD-SMD;120ohm,2012,TP,-,-
4
OTR1 2007-001292 R-CHIP;33ohm,5%,1/16W,TP,1005
63
P003 AH44-00203A SMPS-HP;HT-BD1250,ORTP-527,150~200W
1
PC23 2203-006560 C-CER,CHIP;22000nF,10%,10V,X5R,3225
1
PC69 2203-006818 C-CER,CHIP;47000nF,20%,6.3V,X5R,321
2

PE11 2402-001276 C-AL,SMD;47uF,20%,35V,TP,6.6x6.6x5.
1
PIC2 1203-002220 IC-POSI.ADJUST REG.;LD1117,DPAK,3P,
1
PIC2 1203-005188 IC-DC/DC CONVERTER;AOZ1021AIL,SOP,8
2
PL9
2703-003248 INDUCTOR-SMD;8.2uH,20%,7272
2
PPC2 2203-005148 C-CER,CHIP;100nF,10%,16V,X7R,TP,160
2

PPD1 0402-000309 DIODE-RECTIFIER;1SR154-400,400V,1A,
4
PR24 2007-002970 R-CHIP;56ohm,5%,1/16W,TP,1005
1
PR27 2007-000144 R-CHIP;5.1Kohm,5%,1/16W,TP,1005
1
PX1
2801-004021 CRYSTAL-SMD;24.576MHz,20ppm,28-AAN,
1
Q373 0501-000546 TR-SMALL SIGNAL;KSA1298,PNP,200mW,S
1

Q375 0504-000126 TR-DIGITAL;KSR1101,NPN,200mW,4.7K/4
1
Q409 0505-001170 FET-SILICON;SI9933ADY-T1,P,-20V,3.4
1
Q409 0505-001679 FET-SILICON;FDC6301N,N,25V,0.22A,5O
1
Q409 0505-002491 FET-SILICON;AO4404BL,N,30V,8.5A,0.0
1
Q613 0501-000465 TR-SMALL SIGNAL;MMBT3904,NPN,350mW,
3

R1
2007-002425 R-CHIP;1ohm,5%,1/10W,TP,1608
4
R1035 2007-000287 R-CHIP;100ohm,1%,1/10W,TP,1608
1
R104 2007-000148 R-CHIP;10Kohm,5%,1/16W,TP,1005
64
R105 2007-000138 R-CHIP;100ohm,5%,1/16W,TP,1005
35
R111 2007-000171 R-CHIP;0ohm,5%,1/16W,TP,1005
72

R123 2007-000159 R-CHIP;56Kohm,5%,1/16W,TP,1005
2
R124 2007-000775 R-CHIP;33Kohm,5%,1/16W,TP,1005
5
R15
2007-000134 R-CHIP;33Kohm,5%,1/10W,TP,1608
1
R16
2007-001313 R-CHIP;330ohm,5%,1/16W,TP,1005
1
R227 2007-000086 R-CHIP;5.6Kohm,5%,1/10W,TP,1608
1

R307 2007-007226 R-CHIP;49.9ohm,1%,1/10W,TP,1608
4
R309 2007-007441 R-CHIP;562ohm,1%,1/10W,TP,1608
2
R319 2007-000143 R-CHIP;4.7Kohm,5%,1/16W,TP,1005
39
R320 2007-000458 R-CHIP;18Kohm,5%,1/10W,TP,1608
2
R326 2007-001325 R-CHIP;3.3Kohm,5%,1/16W,TP,1005
5

SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SA
SA
SNA
SNA
SA
SNA
SNA
SNA
SNA
SNA
SNA
SA
SA
SA
SNA
SNA
SNA
SA
SA
SA
SA
SA
SNA
SA
SNA
SNA
SNA
SNA
SA
SA
SNA
SA
SA
SNA
SA
SNA
SA
SNA
SNA
SNA
SA
SA
SNA
SNA
SNA
SA
SNA
SNA
SNA
SNA
Samsung Electronics
Loc. No. Part No.
Qty SNA Remark
R338 2007-000173 R-CHIP;22ohm,5%,1/16W,TP,1005

7
R348 2007-000502 R-CHIP;2.2ohm,5%,1/8W,TP,2012
1
R509 2007-000170 R-CHIP;1Mohm,5%,1/16W,TP,1005
6
R528 2007-000835 R-CHIP;39ohm,1%,1/10W,TP,1608
2
R54
2007-008426 R-CHIP;12.4Kohm,1%,1/10W,TP,1608
1

R726 2007-000695 R-CHIP;3.3ohm,5%,1/10W,TP,1608
9
RE6
2402-001042 C-AL,SMD;100uF,20%,16V,GP,TP,6.6x6.
1
REC3 2402-001237 C-AL,SMD;330uF,20%,6.3V,-,TP,6.3x7.
5
REG1 1203-001255 IC-POSI.FIXED REG.;7805,D-PAK,3P,PL
1
REG3 1203-002935 IC-POSI.ADJUST REG.;AIC1117AGE,TO-2
1

RR17 2007-003009 R-CHIP;16Kohm,5%,1/16W,TP,1005
1
RZ07 2007-000156 R-CHIP;30Kohm,5%,1/16W,TP,1005
1
S0F1331 2203-002717 C-CER,CHIP;10nF,+80-20%,50V,Y5V,100
1
T0052 2703-000158 INDUCTOR-SMD;1uH,10%,2012
2
T0052 2703-002804 INDUCTOR-SMD;10uH,20%,12x12mm
1

T0076 AH39-01040A WIRE HARNESS;HT-BD1250,4,640mm,Blac
1
T0087 1203-002253 IC-POSI.FIXED REG.;KIA7808AF,DPAK,3
1
T0087 1203-002842 IC-POSI.FIXED REG.;AP1117D-33A,TO-2
2
T0122 2802-001179 RESONATOR-CERAMIC;4MHZ,0.5%,BK,8X3X 1
T0568 3301-001202 BEAD-SMD;120ohm,4532,TP,167ohm/260M
11

T0568 3301-001655 BEAD-SMD;33ohm,3216,3000mA,TP,16ohm
9
TR100B 2007-000598 R-CHIP;22ohm,5%,1/4W,TP,3216
1
U1
1204-002900 IC-VIDEO DECODER;BCM7440PYKFEBG,FCB 1
U303 1001-001482 IC-ANALOG SWITCH;MAX4610CUD,SPST CM 2
U309 1201-000166 IC-OP AMP;LM358,SOP,ST,8P,150MIL,DU
1

U504 1203-002425 IC-POSI.FIXED REG.;1117,SOT-223,3P,
1
U600 1105-001397 IC-DRAM;K4S641632,SDR,64Mbit,4Mx16,
1
U603 0802-001007 IC-CMOS LOGIC;74LCX244,BUFFER/LINE
1
UCW0 3708-000448 CONNECTOR-FPC/FFC/PIC;6P,1.25mm,STR
1
USC4 2203-002605 C-CER,CHIP;0.008nF,0.25pF,50V,NP0,T
2

UX2
2802-001174 RESONATOR-CERAMIC;10MHZ,0.5%,BK,8X3 1
VC37 2203-006048 C-CER,CHIP;100nF,10%,10V,X7R,TP,100
56
VC40 2203-001405 C-CER,CHIP;22nF,+80-20%,25V,Y5V,100
2
VIC1 1201-002707 IC-VIDEO AMP;MM1757CHBE,HSOP-36A,36
1
VL6
2703-000398 INDUCTOR-SMD;10uH,10%,3225
2

VR37 2007-001014 R-CHIP;51ohm,5%,1/10W,TP,1608
1
5
WR15B 2007-001044 R-CHIP;56ohm,5%,1/10W,TP,1608
4
X202 2801-004371 CRYSTAL-SMD;12.288MHz,50ppm,SX-1,18
1
ZC4
2203-000332 C-CER,CHIP;0.012nF,5%,50V,C0G,1608
2

ZR10 2007-001164 R-CHIP;75ohm,1%,1/10W,TP,1608
12
ZRN10 2011-001261 R-NETWORK;33ohm,5%,1/16W,L,CHIP,8P,
12
ZVL3 3301-001495 BEAD-SMD;120ohm,2012,2500mA,TP,115o
10

0403-001203 DIODE-ZENER;5245B,14.25-15.75V,225m
1

0603-001164 OPTIC TRANSMITTER;5V,16Mb/s,0m,0dBm
2

0904-002352 IC-DSP;TMS320DA788B,TQFP,144P,20.2x
1

1001-001298 IC-ANALOG SWITCH;L10X,10P,2.1x1.6,1
1

1003-002187 IC-MOTOR DRIVER;AM9268,SOP,42P,18x7
1

1003-002188 IC-MOTOR DRIVER;AM9858,SOP,28P,18x7
1

1006-001438 IC-BUS DRIVER;R5H30201NA04NQ08,QFN,
1

1009-001042 IC-SAMPLE&HOLD;CS8421-CZZR,TSSOP,20
1

1105-001931 IC-DDR2 SDRAM;K4T51163Q,DDR2-800,51
2

1105-001942 IC-DDR2 SDRAM;K4T1G164Q,DDR2,1Gbit,
2

1107-001805 IC-NAND FLASH;NAND512W3A-2CN6,512Mb 1

1203-005469 IC-POWER SUPERVISOR;MIC2009YM6,SOT- 1

1203-005526 IC-DC/DC CONVERTER;AOZ1025DIL,DFN,1
1

1205-003160 IC-CODEC;AK4113VF,VSOP,30P,9.7x5.6m
1

2007-000146 R-CHIP;6.8Kohm,5%,1/16W,TP,1005
1

2007-001319 R-CHIP;1.2Kohm,5%,1/16W,TP,1005
1
Samsung Electronics
SNA
SC
SNA
SNA
SNA
SNA
SNA
SA
SA
SA
SA
SA
SA
SNA
SNA
SNA
SNA
SA
SA
SA
SA
SNA
SA
SNA
SA
SA
SNA
SNA
SA
SNA
SA
SA
SA
SA
SNA
SNA
SNA
SNA
SNA
SNA
SA
SA
SA
SA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SA
Loc. No. Part No.
Qty SNA Remark

2007-007008 R-CHIP;300ohm,5%,1/16W,TP,1005
4

2007-007132 R-CHIP;15Kohm,1%,1/16W,TP,1005
1

2007-007136 R-CHIP;4.7Kohm,1%,1/16W,TP,1005
1

2007-007138 R-CHIP;27Kohm,1%,1/16W,TP,1005
1

2007-007310 R-CHIP;8.2Kohm,1%,1/16W,TP,1005
1

2007-007334 R-CHIP;200Kohm,1%,1/16W,TP,1005
1

2007-007528 R-CHIP;1.5Kohm,1%,1/16W,TP,1005
1

2007-007698 R-CHIP;5.1Kohm,1%,1/16W,TP,1005
1

2007-008275 R-CHIP;30Kohm,1%,1/16W,TP,1005
1

2007-008297 R-CHIP;33.2Kohm,1%,1/16W,TP,1005
1

2011-001345 R-NETWORK;10Kohm,5%,1/16W,L,CHIP,8P
3

2402-000125 C-AL,SMD;1uF,20%,50V,GP,TP,3.3x3.3x
1

2402-000130 C-AL,SMD;2.2uF,20%,50V,GP,TP,4.3x4.
1

2404-001474 C-TA,CHIP;47uF,20%,10V,TP,2.2X1.25X
5

2801-004641 CRYSTAL-UNIT;54MHz,20ppm,HC-49/U,10
1

3709-001287 CONNECTOR-CARD SLOT;10P,1.5mm,SMD-A 1

3710-002628 SOCKET-INTERFACE;18P,1R,0.5mm,SMD-A
1

AH40-00152A TUNER-MODULE;KST-MW104FV1-S58,MAX-D 1

AH41-01218B PCB-MAIN;HT-BD1250,FR-4,4,00,T1.6,1
1

AH69-02426B PAD-THERMAL.B;HT-BD1250,OTHER,T2.0,
1

AH94-02237F ASSY-NOR FLASH;HT-Z320,MX25L1605A,M
1

AH99-00452A ASSY AUTO INSERT-MAIN CPB;-,HT-BD12
1

H008 AH92-03053A ASSY PCB AMP;BD HOME THEATER,HT-BD1 1
6MC22 2203-000975 C-CER,CHIP;47nF,10%,25V,X7R,TP,1608
1
85
AAR11 2007-000312 R-CHIP;10ohm,5%,1/4W,TP,3216
12
12

6
AC14 2203-000189 C-CER,CHIP;100nF,+80-20%,25V,Y5V,16
2
AC510 3708-001086 CONNECTOR-FPC/FFC/PIC;28P,1.25mm,ST
1
AC6
2402-001049 C-AL,SMD;10uF,20%,16V,GP,TP,3.3x3.3
6
6

AD480 2203-005886 C-CER,CHIP;0.15NF,5%,200V,C0G,TP,20
6
5
12
18
1

AH025 AH62-00199A HEAT SINK-AMP;HT-BD1250,AL EXTR,1.6
1
AH260 AH61-02854A HOLDER-HEATSINK;HT-BD1250,HIPS V0,2
3
AQ7
0504-000128 TR-DIGITAL;-,NPN,200MW,22K/22K,SOT-
4
AQ8
0504-000156 TR-DIGITAL;KSR2103,PNP,200MW,22K/22
1
AR108 2007-000097 R-CHIP;47Kohm,5%,1/10W,TP,1608
12

AR150 2007-000078 R-CHIP;1Kohm,5%,1/10W,TP,1608
14
AR28 2007-000683 R-CHIP;3.3Kohm,1%,1/10W,TP,1608
6
AR30 2007-000074 R-CHIP;100ohm,5%,1/10W,TP,1608
4
AR42 2007-000939 R-CHIP;47Kohm,1%,1/10W,TP,1608
6
ARR2 2007-000102 R-CHIP;100Kohm,5%,1/10W,TP,1608
2

C

2401-004106 C-AL;680uF,20%,50V,-,BK,12.5 x 35,5
6
11
18
C212 2203-000440 C-CER,CHIP;1nF,10%,50V,X7R,1608
1
C24
2203-005565 C-CER,CHIP;1nF,5%,50V,NP0,TP,1608
18

C4N08 2203-000140 C-CER,CHIP;1.5nF,10%,50V,X7R,1608
6
CCW1 3711-000658 HEADER-BOARD TO CABLE;BOX,12P,1R,2.
1
CER04 2007-000084 R-CHIP;4.7Kohm,5%,1/10W,TP,1608
7
D1
0401-001099 DIODE-SWITCHING;1N4148WS,75V,150mA,
7
DR1
2007-000043 R-CHIP;1Kohm,1%,1/10W,TP,1608
6
SNA
SNA
SA
SNA
SA
SNA
SNA
SNA
SNA
SNA
SA
SNA
SNA
SNA
SNA
SA
SNA
SA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SA
SA
SNA
SNA
SNA
SNA
SA
SNA
SNA
SNA
SA
SA
SNA
SNA
SA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SA
SNA
SNA
SNA
SA
SNA
5-9
Loc. No. Part No.
Qty SNA Remark

ER19 2007-002899 R-CHIP;10ohm,1%,1/10W,TP,1608
6
FAN1 3711-000820 HEADER-BOARD TO CABLE;BOX,2P,1R,2.5
1
FAR22 2007-000082 R-CHIP;3.3Kohm,5%,1/10W,TP,1608
3
FD7
0601-001226 LED;SMD,RED,1.2x0.8mm,660nm,1.6x0.8
6
FMR4 2007-000080 R-CHIP;2Kohm,5%,1/10W,TP,1608
12

HDC24 2402-000008 C-AL,SMD;47uF,20%,16V,GP,TP,6.6x6.6
2
IDR23 2007-000116 R-CHIP;120ohm,5%,1/10W,TP,1608
1
JP19 2007-000033 R-CHIP;0ohm,5%,1/4W,TP,3216
10
KAC5 2203-001126 C-CER,CHIP;0.68nF,10%,50V,X7R,1608
12
KAR21 2007-000070 R-CHIP;0ohm,5%,1/10W,TP,1608
3

KAR7 2007-000120 R-CHIP;680ohm,5%,1/10W,TP,1608
12
KOP1 1201-000163 IC-OP AMP;4560,SOP,8P,173MIL,DUAL,1
3
KQ1
0501-000279 TR-SMALL SIGNAL;KSA1182-Y,PNP,150mW
2
KQ6
0501-000341 TR-SMALL SIGNAL;KSC1623-L,NPN,200mW
1
MC111 2203-000646 C-CER,CHIP;0.024NF,5%,50V,C0G,TP,16
2

MPIC1 AH14-10003E IC;KIA7812PI,,TO-220
1
MR112 2007-000309 R-CHIP;10ohm,5%,1/10W,TP,1608
18
MR122 2007-000094 R-CHIP;22Kohm,5%,1/10W,TP,1608
2
MR19 2007-000087 R-CHIP;6.8Kohm,5%,1/10W,TP,1608
9
23

P803T 1404-001483 THERMISTOR-PTC;470ohm,50%,32V,TP
1
PPD1 0402-000309 DIODE-RECTIFIER;1SR154-400,400V,1A,
2
PR4
2007-000265 R-CHIP;1.8Kohm,1%,1/10W,TP,1608
6
PR6
2007-000072 R-CHIP;47ohm,5%,1/10W,TP,1608
18
Q1
0501-000479 TR-SMALL SIGNAL;KST42,NPN,350mW,SOT
2

Q409 0505-002365 FET-SILICON;IRF6645,N,100V,5.7A,0.0
12
R1
2007-002425 R-CHIP;1ohm,5%,1/10W,TP,1608
12
R15
2007-000134 R-CHIP;33Kohm,5%,1/10W,TP,1608
19
R331 2007-000079 R-CHIP;1.8Kohm,5%,1/10W,TP,1608
1
R3A08 2007-000091 R-CHIP;12Kohm,5%,1/10W,TP,1608
1

R3A13 2007-000100 R-CHIP;68Kohm,5%,1/10W,TP,1608
6
R419 2007-000882 R-CHIP;4.7ohm,5%,1/10W,TP,1608
12
R505 2007-000496 R-CHIP;2.2Kohm,5%,1/4W,TP,3216
6
R509 2007-001179 R-CHIP;8.2Kohm,5%,1/10W,TP,1608
6
R830 2007-000101 R-CHIP;82Kohm,5%,1/10W,TP,1608
1

R893B 2007-000122 R-CHIP;1.2Kohm,5%,1/10W,TP,1608
17
RE6
2402-001042 C-AL,SMD;100uF,20%,16V,GP,TP,6.6x6.
2
REG1 1203-001255 IC-POSI.FIXED REG.;7805,D-PAK,3P,PL
1
RR2
2007-000075 R-CHIP;220ohm,5%,1/10W,TP,1608
6
S1G0843 2203-000989 C-CER,CHIP;47nF,10%,50V,X7R,2012
1

S1H0220 2402-000120 C-AL,SMD;10UF,20%,50V,GP,TP,6.6X6.6
3
T0415 3716-001243 TERMINAL-BLOCK;WIRE TYPE,12P,14mm,0
1
U1502 1203-001212 IC-VOL. DETECTOR;7029,SOT-89,3P,-,P
1
W390 6003-000276 SCREW-TAPTYPE;BH,+,-,B,M3,L10,ZPC(W
3
WC31 2305-000407 C-FILM,LEAD-PEF;470nF,5%,100V,TP,10
6

4
X202 2801-004371 CRYSTAL-SMD;12.288MHz,50ppm,SX-1,18
1
ZPD2 0401-001090 DIODE-SWITCHING;1SS355,80V,100MA,SO
7
ZR24 2007-000109 R-CHIP;1Mohm,5%,1/10W,TP,1608
1
ZVL3 3301-001495 BEAD-SMD;120ohm,2012,2500mA,TP,115o
2

0401-001166 DIODE-SWITCHING;BAV20WS-V,150V,250m
7

0402-001427 DIODE-RECTIFIER;ES1D,200V,1A,DO-214
6

0403-001398 DIODE-ZENER;UDZ2.4B,2.43-2.63V,200M
1

0403-001483 DIODE-ZENER;UDZS18B,17.56-18.35V,20
1

0501-000150 TR-SMALL SIGNAL;2SA1037,PNP,200mW,S
4

0502-001053 TR-POWER;MMSTA06,NPN,-,SOT-23,TP,10
2

0502-001176 TR-POWER;KTC2026,NPN,2000mW,TO-220I
1

1003-002143 IC-GATE DRIVER;IRS2092STRPBF,SOP,16
6
5-10
SA
SA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SA
SNA
SNA
SA
SA
SA
SA
SA
SNA
SNA
SC
SNA
SA
SNA
SA
SNA
SNA
SA
SA
SA
SNA
Loc. No. Part No.
Qty SNA Remark

1204-002968 IC-MODULATOR;PS9830B,TQFP,100P,14x1
1

2007-000039 R-CHIP;0ohm,1%,1/10W,TP,1608
17

2007-000253 R-CHIP;1.5ohm,5%,1/4W,TP,3216
2

2007-000285 R-CHIP;100Kohm,5%,1/4W,TP,3216
2

2007-000303 R-CHIP;10Kohm,5%,1/4W,TP,3216
1

2007-000464 R-CHIP;18ohm,5%,1/4W,TP,3216
1

2007-001300 R-CHIP;56ohm,5%,1/2W,TP,5025
1

2007-007065 R-CHIP;10ohm,5%,1W,TP,6432
6

2007-007750 R-CHIP;39ohm,1%,1W,TP,6432
1

2007-007790 R-CHIP;20ohm,1%,1W,TP,6432
4

2301-001760 C-FILM,MPEF;100nF,10%,250V,TP,B5xH1
6

AH27-00070A COIL FILTER;8019P-51-150L,15uH,0.1o
6

AH41-01217A PCB-AMP;HT-BD1250,EPOXY,2,1,T1.6,20
1

AH69-02426C PAD-THERMAL.B;HT-BD1250,OTHER,T2.0,
2

AH99-00359A ASSY AUTO INSERT-AMP PCB;-,HT-BD125
1

M0238 AH59-02211C SPEAKER SYSTEM;HT-BD1255,SATELLITE
1

AH69-02560A CUSHION EPS-CUSHION;BD1255 SATELLIT
1
C455 AH81-02177B SPEAKER;PS-Q20,SPK CORD# CONNECTOR, 1
T0082 AH81-05185C SPEAKER;PS-BD1255,FRONT SPEAKER -L,
1

AH81-04981A A/S;FRONT SPK BOT ASS`Y,FOR PS-TZ52
1

AH61-02702A CASE-REAR_BTM;PS-TZ525,ABS,2.7t
1

AH64-04834A PANEL-FRONT_BTM;PS-TZ525,HIPS,2.5t
1

AH81-04982A A/S;STAND ASS`Y,FOR PS-FTZ522,UHL C
1
M0111 AH63-01809A COVER-STAND;PS-TZ525,ABS+PMMA,2.5t
1
T0082 AH81-04680A SPEAKER;STAND STEEL,FOR PS-TZ525,BL
1

T0082 AH81-05233C SPEAKER;PS-BD1255,FRONT SPEAKER -L,
1

AH61-02701A CASE-REAR_TOP;PS-TZ525,ABS,2.7t
1

AH64-04833A PANEL-FRONT_TOP;PS-TZ525,HIPS,2.5t
1
T0082 AH81-04668A SPEAKER;GRILLE_F,80*9*160,STEEL, SP
1
T0082 AH81-04684B SPEAKER;HT-BD1250,TWEETER BH
1

AH81-04919B SPEAKER-UNIT;WOOFER UNIT-FRONT,FOR
1
T0527 AH81-05198C LABEL;PS-BD1255,BACK LABEL,FRONT-L,
1
T0082 AH81-05186C SPEAKER;PS-BD1255,FRONT SPEAKER-R,5 1

1

1

1

1
1
1
T0082 AH81-05234C SPEAKER;PS-BD1255,FRONT SPEAKER-R,T 1

1

1
1
1

1

T0527 AH81-05199C LABEL;PS-BD1255,BACK LABEL,FRONT-R,
1
T0082 AH81-05187C SPEAKER;PS-BD1255,REAR SPEAKER-L,5.
1

1

1

1

1
1
1
T0082 AH81-05235C SPEAKER;PS-BD1255,REAR SPEAKER-L,TO 1

1

1
1
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SA
SA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SA
Samsung Electronics
Loc. No. Part No.
Qty SNA Remark

1

1
T0527 AH81-05200C LABEL;PS-BD1255,BACK LABEL,REAR-L,U
1

T0082 AH81-05188C SPEAKER;PS-BD1255,REAR SPEAKER-R,5.
1

1

1

1

1

1
1
T0082 AH81-05236C SPEAKER;PS-BD1255,REAR SPEAKER-R,TO 1

1

1

1
1

1
T0527 AH81-05201C LABEL;PS-BD1255,BACK LABEL,REAR-R,U
1
T0082 AH81-05189C SPEAKER;PS-BD1255,CENTER SPEAKER,5.
1

T0082 AH81-04662A SPEAKER;NET FRAME_C,250*10*55,ABS,
1
T0082 AH81-04669A SPEAKER;GRILLE_C,220*9*45,STEEL, SP
1
T0082 AH81-04725A SPEAKER;REAR CASE_C,300*55*50,PART
1

AH81-04920A SPEAKER-A/S PART;WOOFER UNIT-CENTER 1
T0527 AH81-05202C LABEL;PS-BD1255,BACK LABEL CENTER,U
1

AH69-02713A CUSHION;PS-BD1255 STAND& CENTER CUS 1

AH81-03943A SPEAKER-SCREW;PS-TZ215,SCREW,#5*20,
4

AH81-03944A SPEAKER-SCREW;PS-TZ215,SCREW,#3.5*1
20

M0238 AH59-02203C SPEAKER SYSTEM;HT-BD1250,ELS 5.1CH,
1

AH81-05121A CUSHION-SUBWOOFER;PS-BD1250,SUBWOOF 1

AH81-05127C SPEAKER-SUBWOOFER;PS-BD1250,SUBWOOF 1
T0082 AH81-04675A SPEAKER;FRONT PANEL-SW,FOR PS-Z520,
1

AH81-04922A SPEAKER-A/S PART;CABINET SUBWOOFER, 1

AH81-04971A A/S;SUBWOOFER UNIT,FOR PS-WZ520,165
1
T0527 AH81-05119C LABEL;PS-BD1250,SUBWOOFER LABEL,ELS 1

T0268 3903-000403 CBF-POWER CORD;AT,EU,CP2,HOUSING(2P 1
A001 AH59-02144L REMOCON-ASSY;HT-BD1250-EUR,SAMSUNG, 1

AH69-02494J MASTER CARTON;PPR-OTH,7,440,370,450
2

AH96-00051A ASSY MISC P-IPOD CRADLE;HT-Z520,XAA
1
Samsung Electronics
Loc. No. Part No.
Qty SNA Remark
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SA
SNA
SNA
SNA
SNA
SA
SA
SA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SNA
SA
5-11
MEMO
5-12
Samsung Electronics
PCB Diagram
6. PCB Diagram
6-1 Wiring Diagram................................................................................................. 6-2
6-2 FRONT PCB Top................................................................................................ 6-3
6-3 FRONT PCB Bottom......................................................................................... 6-5
6-4 KEY PCB Top..................................................................................................... 6-6
6-5 KEY PCB Bottom............................................................................................... 6-8
6-6 AMP PCB Top.................................................................................................... 6-9
6-7 AMP PCB Bottom.............................................................................................. 6-11
6-8 MAIN PCB Top................................................................................................... 6-13
6-9 MAIN PCB Bottom............................................................................................. 6-16
6-10 SMPS PCB Top.................................................................................................. 6-18
6-11 SMPS PCB Bottom............................................................................................ 6-19
Samsung Electronics
6-1
PCB Diagram
6-1 Wiring Diagram
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
DECK ASSY
6-2
(CON12)
SW3
LDO+
LDOCLOSE
OPEN
GND
W
V
U
GND
H+
HU+
HUHW+
HWHHVHV+
SLD2+
SLD2SLD1+
SLD1-
LOADER1
1 5V
2 SA_INT
3 SAOUT2+
4 SAOUT1+
5 SAOUT16 SAOUT27 GND
8 CDLD
9 CDVR
10 DVDCDMPD
11 DVDVR
12 DVDLD
13 TEMP
14 VDMPD
15 GND
16 BDSLEEP
17 GAINSW
18 VREFB
19 VREFB
20 5V
21 RFID
22 RFIN
23 GG
24 HH
25 EE
26 FF
27 DD
28 CC
29 BB
30 AA
31 GND
32 TD33 FD34 TILT35 TILT+
36 FD+
37 TD+
38 GND
39 BDLD
40 BDHFM
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
(PCN1)
ST 5.4V
ST 5.4V
ST 5.4V
GND
GND
GND
D5.4V
D5.4V
D5.4V
GND
GND
GND
FE 12V
FE 12V
FE GND
FE GND
NC
POWER_ON
NC
DGND
VFD +4.6V
VFD -4.6V
-34V
DGND
SMPS
POWER(J3)
1
2
3
4
5
6
7
8
9
10
11
12
(DJ3)
MAIN
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
AVGND
MIC_PDN
SD(POWER)
RESET(POWER)
AUOUT3
AUOUT2
AUOUT1
LRCKOUT
BCLKOUT
GND
GND
AV 3.3V
DS 5V
EXT_MUTE(PWM)
RESET(PWM)
SO(PWM)
CS(PWM)
SCK(PWM)
SI(PWM)
SW_MUTE
FAN_PWR
FAN_SEN
MIC
AL 5.4V
AVGND
AGND
+12V
AGND
-5V
+35V
+35V
+35V
GND
GND
-35V
-35V
-35V
AMP
(SCN2)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
UART_BT_RX
UART_BT_TX
MIC_SENSE
VFD_FU_CLK
VFD_FU_DATA
VFD_CE
GND
SMPS_VFD(+4.6V)
VFD 4.6V(-)
SMPS_VFD -34V
GND
AL 5.4V
MIC_DATA
POWER_LED
MIC_CLK
POWER_TOUCH_1KEY
BTRST
BUZZER
GND
VOL_DOWN
VOL_UP
TC_SDA
TOUCH_CLK
TOUCHRST
TOUCH_INT
GND
FRONT
1
2
3
4
(PCON1)
POWER_ON
DGND
KEY
+ 5.6V
POWER
1
2
3
4
5
6
(TCON1)
5V
KEY_INT
KEY_SDA
KEY_SCL
KEY_RESET
D_GND
FUNTION
Samsung Electronics
PCB Diagram
6-2 FRONT PCB Top
PCON1
VCON1
IC1
TCON1
BCON1
UIC2
MMIC1
FCON1
UCON1
TP4
Samsung Electronics
6-3
PCB Diagram
6-2-1 Pin Connection

1 FCON1
VFD & Function Key Control Signal
6-2-2 Test Point Wave Form

2 IC1
VFD Control Signal
TP4
Pin No.
Signal
Pin No.
Signal
Pin No.
Signal
UART_BT_RX
F-_1
24
p14
UART_BT_TX
F-_2
25
p15
MIC_SENSE
26
VFD_FU_CLK
27
p16
VFD_FU_DATA
p1
28
p17
VFD_CE
p2
29
GND
SMPS_VFD(+4.6V)
VFD 4.6V(-)
10
SMPS_VFD -34V
10
11
GND
11
12
AL 5.4V
13
14
p18
p3
31
p19
p4
32
33
9G
p5
34
8G
12
p6
35
7G
MIC_DATA
13
p7
36
6G
POWER_LED
14
p8
37
5G
38
4G
15
15
16
MIC_CLK
16
p9
39
3G
17
POWER_TOUCH_1KEY
17
p10
40
2G
41
1G
18
6-4
30
18
19
BTRST
19
p11
42
20
BUZZER
20
p12
43
21
GND
21
22
VOL_DOWN
22
23
VOL_UP
23
24
TC_SDA
25
TOUCH_CLK
26
TOUCHRST
27
TOUCH_INT
28
GND
p13
44
F+_44
45
F+_45
Samsung Electronics
PCB Diagram
6-3 FRONT PCB Bottom
PCON1
IC1
TCON1
VCON1
BCON1
UIC2
MMIC1
FCON1
UCON1
Samsung Electronics
6-5
PCB Diagram
6-4 KEY PCB Top
TCON
PCON2
6-6
VCON2
TIC1
Samsung Electronics
PCB Diagram

1 TCON
FRONT FUNCTION KEY
2 PCON2
FRONT POWER KEY
Pin No.
Signal
Pin No.
Signal
5V
POWER_ON
KEY_INT
DGND
KEY_SDA
KEY
KEY_SCL
+ 5.6V
KEY_RESET
D_GND
Samsung Electronics
6-7
PCB Diagram
6-5 KEY PCB Bottom
6-8
Samsung Electronics
PCB Diagram
CON1
6-6 AMP PCB Top
J3
TP3
AIC5
AIC6
AIC3
AIC4
AIC1
AIC2
TP1
UPIC1
AIC11
Samsung Electronics
6-9
PCB Diagram

1 CON1
MAIN AMP (DATA LINE)
Pin No.
Signal
2 J3
SMPS AMP (POWER LINE)
Pin No.
Signal
AGND
+12V
AVGND
AGND
MIC_PDN
-5V
SD(POWER)
+35V
RESET(POWER)
+35V
+35V
6-10
AUOUT3
GND
AUOUT2
GND
10
AUOUT1
10
-35V
11
LRCKOUT
11
-35V
12
BCLKOUT
12
-35V
13
GND
14
GND
15
AV 3.3V
16
DS 5V
17
EXT_MUTE(PWM)
18
RESET(PWM)
19
SO(PWM)
20
CS(PWM)
21
SCK(PWM)
22
SI(PWM)
23
SW_MUTE
24
FAN_PWR
25
FAN_SEN
26
MIC
27
AL 5.4V
28
AVGND
TP1
TP3
Samsung Electronics
PCB Diagram
J3
CON1
6-7 AMP PCB Bottom
Samsung Electronics
AIC7
AIC8
AIC9
TP2
6-11
PCB Diagram

TP2
6-12
Samsung Electronics
PCB Diagram
6-8 MAIN PCB Top
TP7
TP8
TP9
CON18
IPCN1
TP10
IC18
IPIC2
USCON1
MUCN2
PIC5
DJ3
J2
CEIC1
TP5
TP6
MEM2
DIC1
PIC6
U1
MEM1
MEM3
MEM4
PCN1
DSIC1
DSIC14
CON16
DSCN1
FEIC13
SCN2
CON17
CON12
CON15
Samsung Electronics
6-13
PCB Diagram

1 USCN1
MAIN USB (USB Connect Line)
2 CON17
MAIN Loader (Loader Data Line)
3 CON12
MAIN Loader (Loader Power Line)
4 PCN1
MAIN SMPS(Power Supply Line)
5 IPCN1
MAIN iPod Cradle
(iPod Power/Audio/Video Line)
Pin No.
Signal
Pin No.
Signal
Pin No.
Signal
Pin No.
Signal
Pin No.
Signal
D5V
5V
21
RFID
SW3
ST 5.4V
Pin No.
Signal
DN1
SA_INT
22
RFIN
LDO+
ST 5.4V
Reserved
DP1
SAOUT2+
23
GG
LDO-
ST 5.4V
DGND
GND
SAOUT1+
24
HH
CLOSE
GND
USB Vbus(D5V)
SAOUT1-
25
EE
OPEN
GND
ACC_POWER
SAOUT2-
26
FF
GND
GND
DGND
GND
27
DD
D 5.4V
reserved
CDLD
28
CC
D 5.4V
DGND
CDVR
29
BB
D 5.4V
iPod_UART_RX
10
DVDCDMPD
30
AA
10
GND
10
GND
iPod_UART_TX
11
DVDVR
31
GND
11
H+
11
GND
10
DGND
12
DVDLD
32
TD-
12
HU+
12
GND
11
Reserved
13
TEMP
33
FD-
13
HU-
13
FE 12V
12
iPod C
14
VDMPD
34
TILT-
14
HW+
14
FE 12V
13
iPod COMPOSIT
15
GND
35
TILT+
15
HW-
15
FE GND
14
VGND
16
BDSLEEP
36
FD+
16
H-
16
FE GND
15
AN_LCH
17
GAINSW
37
TD+
17
HV-
17
NC
16
AGND
18
VREFB
38
GND
18
HV+
18
POWER_ON
17
AN_RCH
19
VREFB
39
BDLD
19
SLD2+
19
NC
18
iPod_DET
20
5V
40
BDHFM
20
SLD2-
20
DGND
21
SLD1+
21
VFD +4.6V
22
SLD1-
22
VFD -4.6V
23
-34 V
24
DGND
6-14
Samsung Electronics
PCB Diagram

TP5
TP10
TP6
TP7
TP8
TP9
Samsung Electronics
6-15
PCB Diagram
6-9 MAIN PCB Bottom
MUCN2
USCON1
TP10
AIC3
DJ3
J2
VIC1
TP8
TP7
MUIC1
DSIC1
PCN1
DSIC5
TP9
DBGN1
FEIC13
CON15
6-16
Samsung Electronics
PCB Diagram

TP7
TP8
TP9
TP10
Samsung Electronics
6-17
PCB Diagram
6-10 SMPS PCB Top
CN3
CN2
6-18
Samsung Electronics
PCB Diagram
6-11 SMPS PCB Bottom
CN3
CN2
Samsung Electronics
6-19
MEMO
6-20
Samsung Electronics
Schematic Diagram
7-1 Overall Block Diagram...................................................................................... 7-2
7-2 FRONT................................................................................................................ 7-3
7-3 KEY..................................................................................................................... 7-4
7-4 AMP.................................................................................................................... 7-5
7-5 AUDIO / VIDEO (COMPONENT, COMPOSITE)................................................ 7-6
7-6 HDMI CEC / TX (SIL9134).................................................................................. 7-7
7-7 Boot Strap Option............................................................................................. 7-8
7-8 EBI ADDR, EBI DATA........................................................................................ 7-9
7-9 CLOCK, BBS...................................................................................................... 7-10
7-10 BCM7440 POWER............................................................................................. 7-11
7-11 DDR2 BANK0, BANK1...................................................................................... 7-12
7-12 SYSTEM MICOM / TUNER / SRC / WIRELESS................................................ 7-13
7-13 EXTERNAL IN & AUDIO FLOW........................................................................ 7-14
7-14 Ethernet, S-ATA, USB....................................................................................... 7-15
7-15 GPIO / IPOD / BT............................................................................................... 7-16
7-16 NAND, FlexOneNand........................................................................................ 7-17
7-17 MAIN POWER.................................................................................................... 7-18
7-18 DSP SDRAM / FLASH........................................................................................ 7-19
7-19 BCM7620 (F/E)................................................................................................... 7-20
7-20 SMPS (110V)...................................................................................................... 7-21
7-21 SMPS (220V)...................................................................................................... 7-22
Samsung Electronics
7-1
Schematic Diagram
7-1 Overall Block Diagram

I-Pod
Externel
DOCKING
Pick-up / Loader
IPOD Y/C VIDEO

ANALOG AUDIO
INPUT ADC
Y/C
MIXER
VIDEO
FILTER
MM1757
CVBS
CVBS
YPbPr
Y/Pb/Pr
Serial
Flash
SDRAM
NAND
FLASH
64MB
I-Pod
CP CHIP
Bluetooth
TX Module
UART
UART
F/E
BCM7620
Motor
Driver
USB1
For wireless LAN

For Local Storage & USB Host
USB2
CEC
UART
SATA
USB1/2
B/E
BCM7440P
MEM0
DDR2
IPOD ANALOG
AUDIO L/R
128MB (32M x 16b x 2ea)
ADC
AK5367
AUX
7-2
DIR
AK4113
DDR2
64M
SDRAM
I2S
MAIN SYSTEM MICOM control BCM7440P, AUDIO DSP MICOM, CEC. He gets all information from BCM7440P, and
then transfer the information to AUDIO DSP MICOM. They have a communication among them with HOST SLAVE
Interface. And MAIN SYSTEM MICOM gets the information from Users remote control. So whenever he get the
information, he displays it on the VFD.
UART
D/M 2ch
Flash
ROM
SYSTEM
U-com
Power
Stage
PWM
DDR2
256MB (64M x 16 x 2ea)
AUDIO DSP (TM320D788) is connected to MAIN SYSTEM. They get the DIGITAL audio signal from main system with
bit stream status. And after decoding the signal, they send the digital signal, which is already decoded, to DIGITAL AMP
PWM driver IC.
I2S
Lo, Ro
I2S 5.1ch PCM
Audio
DSP
TMP320D788
Power
Stage
I2S
5.1ch
The loader transfer the source audio, video data to BCM7440P.
PWM
DRIVER
PS9830B
Power
Stage
Both of USB are available, but front USB is for LOCAL STORAGE of PROFILE 1.1/2.0 and USB HOST function, whire
I2S Rear 2ch
Sampling
Rate
Converter
CS8421
48KHz
SPI I/F
Tuner
Optical In
CEC MICOM
MC80C0316
Digital
Video
MEM1
DDR2
HDMI TX
HDMI TX
SIL9134
24Bit
I2C
Audio
Decoder
SPI I/F
DISPLAY
CVBS/YPbPr
Video
Decoder
ETHER
MAC
Ethernet
System
U-com
LC87F5NC8A
UART
MAIN SYSTEM (BCM7440P) is connected to whole HT-BD1250 function IC. For HDMI 1080P, BCM7440P transfer the
digital video signal with 24bit to HDMI TX chip SIL9134. BCM7440P doesnt need external up scaling IC because it has a
own internal scalar. About it has internal video DAC, so it transfer the analog signal to MM1757, BCM7440P.
MM1757 are video filter and amp.
SMPS
POWER
Rear USB is for wireless LAN Dongle.

Wireless
TX Module
DIGITAL IN 1, 2 (SPDIF IN), AUX IN and Tuner IN are each connected to DIR and ADC IC. And then after transforming
DIGITAL SIGNAL (SPDIF IN is DIGITAL signal), the audio signal transfers to AUDIO DSP.
Wireless
RX Module
Samsung Electronics
Schematic Diagram
7-2 FRONT
TP4
TP4
Samsung Electronics
7-3
Schematic Diagram
7-3 KEY
7-4
Samsung Electronics
Schematic Diagram
7-4 AMP
TP2
TP3
TP3
TP2
TP1
TP3
TP3
TP2
TP3
TP3
TP1
Samsung Electronics
TP2
TP3
7-5
Schematic Diagram
7-5 AUDIO / VIDEO (COMPONENT, COMPOSITE)

POWER
AUDIO
VIDEO
TP10
TP10
TP7
TP8
TP7
TP8
TP9
TP9
7-6
TP7
TP9
TP8
TP10
Samsung Electronics
Schematic Diagram
7-6 HDMI CEC / TX (SIL9134)

TP5
POWER
AUDIO
VIDEO
TP5
TP5
Samsung Electronics
7-7
Schematic Diagram
7-7 Boot Strap Option

POWER
7-8
Samsung Electronics
Schematic Diagram
7-8 EBI ADDR, EBI DATA

POWER
Samsung Electronics
7-9
Schematic Diagram
7-9 CLOCK, BBS

TP6
POWER
TP6
7-10
Samsung Electronics
Schematic Diagram
7-10 BCM7440 POWER

POWER
Samsung Electronics
7-11
Schematic Diagram
7-11 DDR2 BANK0, BANK1

POWER
7-12
Samsung Electronics
Schematic Diagram
7-12 SYSTEM MICOM / TUNER / SRC / WIRELESS

POWER
AUDIO
Samsung Electronics
7-13
Schematic Diagram
7-13 EXTERNAL IN & AUDIO FLOW

POWER
AUDIO
7-14
Samsung Electronics
Schematic Diagram
7-14 Ethernet, S-ATA, USB

POWER
Samsung Electronics
7-15
Schematic Diagram
7-15 GPIO / IPOD / BT

POWER
AUDIO
VIDEO
7-16
Samsung Electronics
Schematic Diagram
7-16 NAND, FlexOneNand

POWER
Samsung Electronics
7-17
Schematic Diagram
7-17 MAIN POWER

POWER
7-18
Samsung Electronics
Schematic Diagram
7-18 DSP SDRAM / FLASH

POWER
AUDIO
Samsung Electronics
7-19
Schematic Diagram
7-19 BCM7620 (F/E)

POWER
7-20
Samsung Electronics
Schematic Diagram
7-20 SMPS (110V)

L51
2.9uH(BAR TYPE)
ORTP-527
T1
L52
2.9uH(BAR TYPE)
L61
33uH(5A)
L71
33uH(3A)
ORTP-527
T2
(SOD-123)
L62
15uH
Samsung Electronics
7-21
Schematic Diagram
7-21 SMPS (220V)

L51
2.9uH(BAR TYPE)
ORTP-527
T1
L52
2.9uH(BAR TYPE)
L61
33uH(5A)
L71
33uH(3A)
ORTP-527
T2
(SOD-123)
L62
15uH
7-22
Samsung Electronics

Samsung HT BD1255

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5.

GSPN (Global Service Partner Network)

Mideast & Africa

This Service Manual is a property of Samsung Electronics

Samsung Electronics Co.,Ltd. Apr. 2009

Product Feature................................................................................................ 2-1

3. Disassembly & Reassembly

5. Exploded View & Part List

Product Exploded View.....................................................................................5-2

1-1 Safety Precautions

6. Insulation Resistance Cold Check:

<Fig. 1-2 Insulation Resistance Test>

If any of the exposed metallic parts has a return path

1-2 Servicing Precautions

1-3 Precautions for Electrostatically Sensitive Devices (ESDs)

440 (W) x 345 (D) x 63 (H) mm

Operating Temperature Range

Operating Humidity Range

Reading Speed: 4.917m/sec

DVD (Digital Versatile Disc)

Approx. Play Time (Single Sided, Single Layer Disc):

Reading Speed: 4.8 ~ 5.6 m/sec.

Reading Speed: 4.8 ~ 5.6 m/sec.

Maximum Play Time: 74 min.

Maximum Play Time: 20 min.

Blu-ray Disc: 576i (480i)

Pr: 0.70 Vp-p (75 load)

Pb: 0.70 Vp-p (75 load)

1080p, 1080i, 720p, 576p (480p)

Front speaker output

Center speaker output

Surround speaker output

Subwoofer speaker output

Analog input: 20Hz ~ 20kHz (3dB)

HT-BD1250 Speaker Specification

5.1ch Speaker System

Front/Surround: 100.5 x 210 x 99 mm

Front/Surround: 0.70 Kg, Centre: 0.33 Kg

HT-BD1252 Speaker Specification

5.1ch Speaker System

Front : 260 x 1120x 260 mm

Front: 2.18 Kg, Surround: 0.42 Kg

HT-BD1255 Speaker Specification

5.1ch Speaker System

Front/Surround: 260 x 1202 x 260 mm

Front/Surround: 2.88 Kg,

2-2-2 HT-BD1220 Specifications

440 (W) x 345 (D) x 63 (H) mm

Operating Temperature Range

Operating Humidity Range

87.5 ~ 108.0 MHz

Signal / noise ratio

Total harmonic distortion

Reading Speed: 4.917m/sec

DVD (Digital Versatile Disc)

Approx. Play Time (Single Sided, Single Layer Disc):

Reading Speed: 4.8 ~ 5.6 m/sec.

Reading Speed: 4.8 ~ 5.6 m/sec.

Maximum Play Time: 74 min.

Maximum Play Time: 20 min.

Blu-ray Disc: 576i/480i

Pr: 0.70 Vp-p (75 load)

Pb: 0.70 Vp-p (75 load)