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Introduction to Silvaco ATHENA Tool and Basic Concepts in Process Modeling Part - 3 Instructor: Dragica Vasileska

Department of Electrical Engineering Arizona State University

EEE 533 Semiconductor Device and Process Simulation

8. Fabrication of a MOSFET device description


In the following set of slides, a set of statements and the accompanying intermediate results are given in the process of fabrication of a MOSFET device electrical characterization is performed afterwards. MESH SETUP: go athena # line x loc=0 spac=0.1 line x loc=0.2 spac=0.006 line x loc=0.4 spac=0.006 line x loc=0.5 spac=0.01 # line y loc=0.00 spac=0.002 line y loc=0.2 spac=0.005 line y loc=0.5 spac=0.05 line y loc=0.8 spac=0.15 # initialize orientation, background doping and save results init orientation=100 c.phos=1e14 space.mul=2 structure outf=structure_1.str

EEE 533 Semiconductor Device and Process Simulation

OXIDE GROWTH AND ETCHING: #pwell formation including masking off of the nwell diffus time=30 temp=1000 dryo2 press=1.00 hcl=3 structure outf=structure_2.str # etch oxide thick=0.02 structure outf=structure_3.str

EEE 533 Semiconductor Device and Process Simulation

P-WELL FORMATION AND OXIDE GROWTH AND ETCHING: # P-well Implant implant boron dose=8e12 energy=100 pears diffus temp=950 time=100 weto2 hcl=3 structure outf=structure_4.str # # N-well implant not shown # # welldrive starts here diffus time=50 temp=1000 t.rate=4.000 dryo2 press=0.10 hcl=3 diffus time=220 temp=1200 nitro press=1 diffus time=90 temp=1200 t.rate=-4.444 nitro press=1 structure outf=structure_5.str # etch oxide all # # sacrificial "cleaning" oxide diffus time=20 temp=1000 dryo2 press=1 hcl=3 # etch oxide all #

EEE 533 Semiconductor Device and Process Simulation

EEE 533 Semiconductor Device and Process Simulation

GATE OXIDE GROWTH AND VT-ADJUST IMPLANT: # gate oxide grown here:diffus time=11 temp=925 dryo2 press=1.00 hcl=3 structure outf=structure_6.str # extract gate oxide thickness extract name="gateox" thickness oxide mat.occno=1 x.val=0.50 # # vt adjust implant implant boron dose=9.5e11 energy=10 pearson structure outf=structure_7.str

EEE 533 Semiconductor Device and Process Simulation

POLYSILICON DEPOSITION AND ETCHING: # Polysilicon deposition depo poly thick=0.2 divi=10 structure outf=structure_8.str # # from now on the situation is 2-D # etch poly left p1.x=0.35 structure outf=structure_9.str

EEE 533 Semiconductor Device and Process Simulation

N+ - REGIONS FORMATION AND FIELD OXIDE GROWTH: method fermi compress diffuse time=3 temp=900 weto2 press=1.0 # implant phosphor dose=3.0e13 energy=20 pearson structure outf=structure_10.str # depo oxide thick=0.120 divisions=8 structure outf=structure_11.str # etch oxide dry thick=0.120

EEE 533 Semiconductor Device and Process Simulation

ARSENIC IMPLANTATION AND OXIDE ETCHING: implant arsenic dose=5.0e15 energy=50 pearson # method fermi compress diffuse time=1 temp=900 nitro press=1.0 structure outf=structure_12.str # etch oxide left p1.x=0.2 structure outf=structure_13.str

EEE 533 Semiconductor Device and Process Simulation

METAL DEPOSITION AND ETCHING: deposit alumin thick=0.03 divi=2 structure outf=structure_14.str # etch alumin right p1.x=0.18 structure outf=structure_15.str

EEE 533 Semiconductor Device and Process Simulation

EXTRACTION OF DEVICE DESIGN PARAMETERS: # extract final S/D Xj... extract name="nxj" xj silicon mat.occno=1 x.val=0.1 junc.occno=1 # extract the long chan Vt... extract name="n1dvt" 1dvt ntype vb=0.0 qss=1e10 x.val=0.49 # extract a curve of conductance versus bias.... extract start material="Polysilicon" mat.occno=1 \ bias=0.0 bias.step=0.2 bias.stop=2 x.val=0.45 extract done name="sheet cond v bias" curve(bias,1dn.conduct \ material="Silicon" mat.occno=1 region.occno=1) outfile="extract.dat # extract the N++ regions sheet resistance... extract name="n++ sheet rho" sheet.res material="Silicon" mat.occno=1 \ x.val=0.05 region.occno=1 # extract the sheet rho under the spacer, of the LDD region... extract name="ldd sheet rho" sheet.res material="Silicon" mat.occno=1 \ x.val=0.3 region.occno=1 # extract the surface conc under the channel.... extract name="chan surf conc" surf.conc impurity="Net Doping" \ material="Silicon" mat.occno=1 x.val=0.45

EEE 533 Semiconductor Device and Process Simulation

ELECTRODES SPECIFICATION AND MIRROR IMAGE STRUCTURE: structure mirror right electrode name=gate x=0.5 y=0.1 electrode name=source x=0.1 electrode name=drain x=0.9 electrode name=substrate backside structure outfile=mos1ex02_0.str # plot the structure tonyplot -st mos1ex02_0.str -set mos1ex02_0.set

EEE 533 Semiconductor Device and Process Simulation

ELECTRICAL CHARACTERIZATION:
go atlas # define the Gate workfunction contact name=gate n.poly # Define the Gate Qss interface qf=3e10 # Use the cvt mobility model for MOS models cvt srh print numcarr=2 # set gate biases with Vds=0.0 solve init solve vgate=1.1 outf=solve_tmp1 solve vgate=2.2 outf=solve_tmp2 solve vgate=3.3 outf=solve_tmp3 # load in temporary files and ramp Vds load infile=solve_tmp1 log outf=mos1ex02_1.log solve name=drain vdrain=0 vfinal=3.3 vstep=0.3 load infile=solve_tmp2 log outf=mos1ex02_2.log solve name=drain vdrain=0 vfinal=3.3 vstep=0.3 load infile=solve_tmp3 log outf=mos1ex02_3.log solve name=drain vdrain=0 vfinal=3.3 vstep=0.3 # extract max current and saturation slope extract name="nidsmax" max(i."drain") extract name="sat_slope" slope(minslope(curve(v."drain",i."drain"))) tonyplot -overlay -st mos1ex02_1.log mos1ex02_2.log mos1ex02_3.log -set mos1ex02_1.set quit

EEE 533 Semiconductor Device and Process Simulation

OBTAINED SIMULATION RESULTS:

Content of the results.final file: gateox=100.164 angstroms (0.0100164 um) X.val=0.5 nxj=0.174465 um from top of first Silicon layer X.val=0.1 n1dvt=0.59203 V X.val=0.49 n++ sheet rho=29.0223 ohm/square X.val=0.05 ldd sheet rho=2149.79 ohm/square X.val=0.3 chan surf conc=3.90871e+16 atoms/cm3 X.val=0.45 nidsmax=0.000563816 sat_slope=1.94223e-05

EEE 533 Semiconductor Device and Process Simulation

9. Additional Silvaco ATHENA examples


go athena # TITLE: Comparison of Gauss, Pearson and SVDP method line x loc = 0.0 spacing=0.25 line x loc = 0.25 spacing=0.25 line y loc = 0 spacing = 0.01 line y loc = 0.50 spacing = 0.01 #initialize the mesh init silicon # Gauss (symmetrical) implant (parameters are in std_tables) moments std_tables implant phos dose=1e14 energy=40 gauss struct outf=aniiex01_0.str line x loc = 0.0 spacing=0.25 line x loc = 0.25 spacing=0.25 line y loc = 0 spacing = 0.01 line y loc = 0.50 spacing = 0.01 # initialize the mesh init silicon # Use single Pearson (parameters are in std_tables) moments std_tables implant phos dose=1e14 energy=40 pearson print.mom struct outf=aniiex01_1.str

EEE 533 Semiconductor Device and Process Simulation

line x loc = 0.0 spacing=0.25 line x loc = 0.25 spacing=0.25 line y loc = 0 spacing = 0.01 line y loc = 0.50 spacing = 0.01 # initialize the mesh init silicon # Use SVDP method (default) moments svdp_tables implant phos dose=1e14 energy=40 print.mom struct outf=aniiex01_2.str tonyplot -overlay aniiex01_*.str -set aniiex01.set quit

EEE 533 Semiconductor Device and Process Simulation

go athena # Retrograde Well Formation Using High Energy Phosphorus Implants # the x dimension definition line x loc = 0.0 spacing=0.25 line x loc = 0.25 spacing=0.25 # the vertical definition line y loc = 0 spacing = 0.02 line y loc = 5 spacing = 0.05 # initialize the mesh init silicon c.boron=1e15 deposit oxide thick=0.01 # perform high energy phosphorus implants implant phos dose=5e13 energy=2000 print.mom implant phos dose=5e12 energy=750 print.mom # subsequent anneal diffuse time=60 temp=1100 struct outf=aniiex06_0.str tonyplot aniiex06_0.str -set aniiex06.set quit

EEE 533 Semiconductor Device and Process Simulation

go athena TITLE: Doping Dependent Oxidation Example # Create the initial mesh line x loc=-0.30 spac=0.03 line x loc=0.30 spac=0.03 line y loc=0.00 spac=0.02 line y loc=0.50 spac=0.1 init orientation=100 c.boron=1e15 # Mask part of the surface with nitride deposit nitride th=.3 div=4 # etch right nitride p1.x=0.0 # # Implant with very high dose to dope part of the silicon implant boron dose=3e15 energy=20 # etch nitride all # # Oxidize and observe thicker oxidation on doped material # Specify grid.ox to enhance the mesh in the growing oxide method fermi compress grid.ox=0.03 diff time=5 temp=1000 weto2 extract name="toxlow" thickness material="SiO~2" mat.occno=1 x.val=-0.25 extract name="toxhigh" thickness material="SiO~2" mat.occno=1 x.val=0.25 # save it and plot it structure outfile=anoxex03.str tonyplot anoxex03.str -set anoxex03.set quit

EEE 533 Semiconductor Device and Process Simulation

go athena # TITLE: Oxide Profile Evolution Example # Substrate mesh definition line y loc=0 spac=0.05 line y loc=0.6 spac=0.2 line y loc=1 line x loc=-1 spac=0.2 line x loc=-0.2 spac=0.05 line x loc=0 spac=0.05 line x loc=1 spac=0.2 init orient=100 # Anisotropic silicon etch etch silicon left p1.x=-0.218 p1.y=0.3 p2.x=0 p2.y=0 # Pad oxide and nitride mask deposit oxide thick=0.02 deposit nitride thick=0.1 etch etch nitride left p1.x=0 oxide left p1.x=0

# Field oxidation with structure file output for movie diffuse tim=90 tem=1000 weto2 dump=1 dump.prefix=anoxex01m tonyplot -st anoxex01m*.str structure outfile=anoxex01_0.str quit

EEE 533 Semiconductor Device and Process Simulation

EEE 533 Semiconductor Device and Process Simulation

EEE 533 Semiconductor Device and Process Simulation