BurrBrown Products

from Texas Instruments

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8
7
6
5
4
3
2
1 AUDIO
FSOUT0
FSOUT1
SCKO
V
DD
DGND
XTO
XTI
CLKST
LRCKO
BCKO
DOUT
PSCK0
PSCK1
21
22
23
24
25
26
27
28 CKSEL
ERROR
FMT1
FMT0
V
CC
AGND
FILT
RST
RXIN
RSV
BFRAME
EMPH
UOUT
COUT 14
13
12
11
10
9
15
16
17
18
19
20
DIR9001
(TOP VIEW)

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Clock and Data Recovery

SCKO
BCKO
LRCKO
DOUT
RXIN
Divider
FILT XTO XTI
FSOUT0
FSOUT1
RST
OSC
RESET
CLKST
EMPH
UOUT
COUT
BFRAME
VCO
CKSEL
DGND
ERROR
AUDIO
Power Supply
V
DD
DGND AGND V
CC
PSCK0
PSCK1
FMT0
RSV
PLL
Divider
Decoder
FMT1
Preamble
Detector
Charge
Pump
Sampling
Frequency
Calculator
Clock
Decoder
Biphase
Data Decoder
Serial
AudioData
Formatter
ERROR
Detector
Function
Control
AudioData
MUTE Control
Channel Status
and
UserData
Output

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f
S
Sampling Frequency kHz
6
8
10
12
14
16
18
20
30 40 50 60 70 80 90 100
I
C
C

+

I
D
D

S
u
p
p
l
y

C
u
r
r
e
n
t

m
A
G001
40C
25C
25C
0C
50C
85C
V
CC
= V
DD
= 3.3 V
SCKO = 256 f
S
f
S
Sampling Frequency kHz
6
8
10
12
14
16
18
20
30 40 50 60 70 80 90 100
I
C
C

+

I
D
D

S
u
p
p
l
y

C
u
r
r
e
n
t

m
A
G002
3 V
3.6 V
3.3 V
2.7 V
T
A
= 255C
SCKO = 256 f
S

f
S
Sampling Frequency kHz
20
40
60
80
100
120
140
160
180
200
30 40 50 60 70 80 90 100
P
e
r
i
o
d
i
c

J
i
t
t
e
r

p
s

r
m
s
G003
128 f
S
384 f
S
256 f
S
512 f
S
V
CC
= V
DD
= 3.3 V
T
A
= 255C

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V
DD
2.7 V
Min. 100 ns
Reset
RST
Operation Unknown
DIR9001
Status

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Clock and Data Recovery
SCKO
BCKO
LRCKO
DOUT
RXIN
Divider
FILT XTO XTI
FSOUT0
FSOUT1
OSC
CLKST
VCO
CKSEL
DGND
ERROR
PLL
Divider
Decoder
Preamble
Detector
Charge
Pump
Clock
Decoder
Biphase
Data Decoder
Serial
AudioData
Formatter
ERROR
Detector
AudioData
MUTE Control
Sampling
Frequency
Calculator

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AUTOMode[CKSEL =ERROR]
XTIMode[CKSEL =High]
PLL Mode[CKSEL =Low]
DIR9001Status
Note: means clock source change.
RXIN Non-Biphase Biphase Non-Biphase
Unlock Unlock
CLKST
t
CLKST
ERROR
Lock Up Time
XTO
MUTE (Low) Demodulated Data DOUT
XTI Source XTO
XTI Source
DOUT Always MUTE (Low)
XTI Source XTO
XTI Source PLL Source XTI Source
DOUT MUTE (Low)
Lock
Demodulated Data
Built-InPLL
Status
SCKO,BCKO,
LRCKO
SCKO,BCKO,
LRCKO
MUTE(Low)
MUTE(Low)
SCKO,BCKO,
LRCKO
XTISource
PLL Source
(Transition)
PLL Source
(LockFrequency)
PLL Source
(Transition)
PLL Source
(Free-Run)
t
CLKST
PLL Source
(Free-Run)

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SCKO (O)
BCKO (O)
LRCKO (O)
XTI (I)
XTO (O)
VCO
RXIN
Built-in PLL
Clock Recovery
1/N
1/N
PLL Clock Source
1/N
1/4
1/64
XTI Clock Source
CKSEL (I)
OscillationAmplifier ClockSource
Selector
[PSCK1]
[PSCK0]

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DIR9001
PLL Section
Charge
Pump
VCO
FILT AGND DGND
C2
R1
C1

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Resonator
XTI
Crystal
OSC
Circuit
24.576MHz
InternalClock
DIR9001
ResonatorConnection
XTO
C
L1
C
L2
R
d
External
Clock
MustBe
Open
XTI
XTO
Crystal
OSC
Circuit
24.576MHz
InternalClock
DIR9001
ExternalClockInputConnection

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BiphaseSignal(IN)
t
LATE
BFRAME(OUT)
LRCKO(OUT)
(I S)
2
LRCKO(OUT)
(ExceptI S)
2
DOUT (OUT)
B W M W 0L 0R 1L 1R
0L 0R 1L 1R
17BCK

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Right Justified (MSB First, 24-bit, 16-bit)
22 23 24 DOUT
DOUT
LRCKO
BCKO
14 15 16
R-channel L-channel
1/f
S
MSB
2 1
LSB
15 16
MSB
2 1
LSB
23 24
MSB
2 1
LSB
15 16
MSB
2 1
LSB
23 24
Left Justified (MSB First)
DOUT
LRCKO
BCKO
R-channel L-channel
1/f
S
MSB
2 1
LSB
23 24
MSB
2 1
LSB
23 24
DOUT
LRCKO
BCKO
R-channel L-channel
1/f
S
1
MSB LSB
2 1 23 24
MSB
2 1
LSB
23 24
DataLength:16-bit
DataLength:24-bit
DataLength:24-bit
DataLength:24-bit
I SFormat(MSBFirst)
2

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t
BCH
t
BCL
t
BCDO
t
BCY
BCKO
(OUT)
LRCKO
(OUT)
DOUT
(OUT)
SCKO
(OUT)
V /2
DD
t
CKLR
t
SCBC
t
SCY
V /2
DD
V /2
DD
V /2
DD

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UOUT
COUT
BFRAME
Recovered
LRCKO
(I S)
2
Recovered
LRCKO
(ExceptI S)
2
U0L U0R U191R U1L U1R U2L U2R
C0L C0R C191R C1L C1R C2L C2R
DOUT
0L 0R 191R 1L 1R 2L 2R 3L
17BCK

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LRCKO
(ExceptI S)
2
AUDIO
LRCKO
(I S)
2
DOUT 0L
Bit1ofPreviousBlock
191R 1L 1R 2L 2R 3L
EMPH
Bit 3ofPreviousBlock
0R

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ERROR Output
DIR9001
DetectedParityError
DataError

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AUDIO
InternalLOCK
L
n
LRCKO(I
2
S)
MUTE(Low)
ERROR
DOUT
ParityError
InterpolationProcessing
byPreviousData
AUDIO
InternalLOCK
LRCKO(I
2
S)
ERROR
DOUT
ParityError
[ =L] AUDIO
[ =H] AUDIO
R
n
L
n+1
R
n+1
L
n+1
R
n+2
R
n+3
L
n+3
L
n
MUTE(Low) R
n
L
n+1
R
n+1
L
n+2
R
n+2
R
n+3
L
n+3

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R
2
AUDIO
Receiver Circuit
C
5
3.3-V V
DD +
C
7
+
C
8
C
6
For Automatic Clock Source Selection
Reset (active LOW)
11
12
10
9
8
7
6
5
4
3
2
COUT
DOUT
UOUT
EMPH
BFRAME
RST
RSV
RXIN
CKSEL
FILT
DGND
PSCK1
PSCK0
FSOUT0
BCKO
LRCKO
CLKST
SCKO
FSOUT1
ERROR
1
15
16
17
18
19
20
21
22
23
24
13
14
XTI
XTO
AGND
FMT1
FMT0 25
26
27
28
To Microcontroller
R
1
C
4
Actual Sampling
Frequency Output
X
1
C
3
System Clock
FrequencySetting
384, 512f
(128, 256,
S
)
Audio Data
Processor
DecodedData Format
Setting
3.3-V V
CC
C
1
C
2
V
DD
V
CC

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PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
DIR9001PW ACTIVE TSSOP PW 28 50 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DIR9001PWG4 ACTIVE TSSOP PW 28 50 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DIR9001PWR ACTIVE TSSOP PW 28 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
DIR9001PWRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF DIR9001 :

Automotive: DIR9001-Q1
NOTE: Qualified Version Definitions:

Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
PACKAGE OPTION ADDENDUM
www.ti.com 3-Apr-2009
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)
W
(mm)
Pin1
Quadrant
DIR9001PWR TSSOP PW 28 2000 330.0 16.4 6.9 10.2 1.8 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Jul-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DIR9001PWR TSSOP PW 28 2000 346.0 346.0 33.0
PACKAGE MATERIALS INFORMATION
www.ti.com 21-Jul-2008
Pack Materials-Page 2
MECHANICAL DATA


MTSS001C JANUARY 1995 REVISED FEBRUARY 1999
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
M 0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
20 16
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
8
0,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM
PINS **
0,05
4,90
5,10
Seating Plane
08
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153