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FOR PHYSICS-BASED, PRODUCT AND PACKAGE PURPOSE-BUILD TEST HARDWARE ENGINEERING, THERE ARE FEW ENGINEERING FIRMS IN THE WORLD THAT CAN COMPETE WITH SES.
q Product Design & Development q Package Design & Development q Predictive Simulation & Analysis q Electronics Design and Evaluation q Cost Savings Programs
Actuation force vs. ow rate Package drop simulation Full pallet unit load test
q Project Management & Oversight q Failure Analysis q Material Selection q Material Testing & Characterization
Injection molding simulation
q Product Testing q Processing Analysis & Support q Economic Analysis & Cost Modeling q Custom Test Machine Development q Prototyping
Custom product testing Instrumented bottle drop test Injection molding and mold lling analysis Noise assessment in semi-anechoic chamber Injection mold lling simulation
q Life-cycle Testing
Transient pressure prole of bottle drop Toothbrush lifecycle testing Blow molding simulation
m at e r i a l s & m e ta l l u r gy
u n i q u e data co l l ect i o n c a pa b i l i t i es
Cryogenic tensile testing MicroDAQ installations used to measure force, temperature, acceleration and battery usage Non-contact optical strain measurement
Impact testing