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How transistors operate and form simple switches CMOS logic gates IC technology FPGAs and other PLDs Basic characteristics of electronic circuits (partially covered) d)
Noise Margin
4
N1
N2
Electronic circuits are constantly subjected to random noise It can alter the output voltage levels produced by the gate N1 It should not cause the gate N2 to misinterpret a low logic value as a high one one, or vice versa
Noise Margin
A measure of the extent to which a logic circuit can tolerate noise or unwanted spurious signals
2009 Spring CS211 Digital Systems & Lab
Noise Margin
5
the high state noise margin is defined as VNH = VOH(min) - VIH(min) the e low ow s state a e noise o se margin a g is s VNL = VIL(max) - VOL(max)
CMOS(5V) : 4.9V CMOS(2.5V) : 2.0V CMOS(5V) : 3.85V (1.05V) CMOS(2.5V) : 1.7V (0.3V) CMOS(5V) : 0.1V 0 1V CMOS(2.5V) : 0.4V CMOS(5V) : 1.35V (1.34V) CMOS(2.5V) : 0.7V (0.3V) 2009 Spring CS211 Digital Systems & Lab
Transistor Switches
6
Full treatment is beyond the scope of this class Metal oxide semiconductor field effect transistor (MOSFET) n-channel or nMOS p-channel or pMOS
(a) A simple switch controlled by the input x Gate Source Drain Substrate (Body) (b) NMOS transistor VG VS VD
VG
NMOS transistor
Source
VD
V S = V DD
V DD
V DD
VG
VD
PMOS transistor
5V
+ -
VDD
x1 Vf Vx
1
x2
x1 x2 Vx
2
f 1 1 1 0
0 0 1 1 (a) Circuit
0 1 0 1
NMOS realization
13
VDD
VDD
VDD
Vf
Vf Vx 1 Vx
2
x1 x2 0 0 1 1 0 1 0 1
f 1 0 0 0
( ) Ci (a) Circuit it
x1 x2
x1 x2
x1 x2
x1 x2
V DD
Vf Vx Vx
1
How transistors operate and form simple switches CMOS logic gates IC technology FPGAs and other PLDs Basic characteristics of electronic circuits (partially covered) d)
CMOS realization
16
VDD
V DD
T1 Vx T2 Vf
Vx
1
T1
Vx
T4
CMOS circuits
17
DD
DD
S
D
T1 turn off
VGS=-5V<VT 0v
S
D
T1 V 1 T
turn on
5v
D
0v
T2 turn on
5v
D
T2
S
turn off
VGS=5V>VT VT1V
(a) Circuit
(a) Circuit
CMOS realization
18
VDD
V DD
V DD
Vx
T1
Vx
V f
T2 Vf T3 T4 x1 x2 0 0 1 1 0 1 0 1 T1 T2 T3 T4 on on off off on off off on off on on off off off on on f 1 0 0 0
V x
V x
(a) Circuit
f=?
2009 Spring CS211 Digital Systems & Lab
V DD
f= x1 + x2x3 f= x1(x2+x3)
Vf Vx
1
Vx Vx
no power consumption under steady state conditions still have leakage current dynamic power consumption
V DD
What is the PDN? Why do we use NMOS in the PDN? What is the PUN? Why do we use PMOS in the PUN?
duals
Vf Vx Vx
1
NMOS can only partially pass a NM high voltage signal VDD VDD VGS VT
D
PMOS can only partially pass a low voltage signal VDD VGS -VT
S
D
VA=VDD-VT
For the typical value VT =0.2VDD
VA=VDD-0.1mV
A VDD
D
VA=0.1~0.2 mV
D
A V =V A T
DD D
1.5VT S
DD D S
T1 turn on
T1
S
5V
T2
D
0V
T2
-1.5VT
Reversed connection
Reversed connection
Body effect: The substrate bias voltage increases the threshold voltage in the TR VT by a factor of about 1.5 or higher
2009 Spring CS211 Digital Systems & Lab
Reversed connection
23
Vf Vx1 VDD
Logic value x1 x2 0 0 1 1 0 1 0 1
Logic value f 0 0 0 1
Vx2
VDD
x 1x 2 f 0 0 1 0 1 1 1 0 1 1 1 0
Vf Vx
1
x1 x2
Vx Vx
1
Vf H H H L
Vx
L L H H
L H L H
(a) Circuit
(b) Voltage le
Why dont we use the mixed logic system? H How can we t treat t active ti low l signals? i l ?
2009 Spring CS211 Digital Systems & Lab
A transmission gate
25
Bidirectional Switch
NMOS passes 0 well and 1 poorly PMOS passes 1 well and 0 poorly
s x s ( ) Ci (a) Circuit i s=0 x x s=1 f=Z x f=x f s 0 1 f Z x
A2 2-to-1 to 1 multiplexer
26
x1 x2 0 0 1 1 0 1 0 1
f = x1 x2 0 1 1 0 x1 x2
x1 x2 f = x1 x2
x1 x2
f = x1 x2
TTL CMOS
(a) Dual-inline package
V DD Gnd
VDD
7404
7408
7432
x 2 x 3 x
2009 Spring CS211 Digital Systems & Lab
Buffers
31
To improve performance
V DD
Vf
+ + L L
(a) Small transistor (b) Larger transistor
W1
W2
x
(b) Graphical symbol
e= 0 e x f x x f
e= 1 f
e x f
(d) Implementation
x
(a)
x
(b)
x
(c)
x
(d)
x1 s x2
35
Pin 1 P Pin 2 P Pin 4 P Pin 6 P Pin 8 P Pin 12 2 Pin 14 4 Pin 16 6 Pin 18 8 Pin 19 9 Pin 3 P Pin 5 P Pin 7 P Pin 9 P Pin 11 Pin 13 3 Pin 15 5 Pin 17 7