BGA725L6

Silicon Germanium Low Noise Amplifier for Global Navigation Satellite Systems (GNSS) in ultra small package with 0.77mm footprint

Data Sheet
Revision 2.0, 2012-03-09 Preliminary

RF & Protection Devices

Edition 2012-03-09 Published by Infineon Technologies AG 81726 Munich, Germany 2012 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

BGA725L6

Revision History Page or Item all 7 7, 10, 11 all Subjects (major changes since previous revision) Target status changed to Preliminary Marking code changed: C Electrical Characteristics adjusted Initial version Revision 2.0, 2012-03-09

Revision 1.0, 2011-07-05

Trademarks of Infineon Technologies AG AURIX, C166, CanPAK, CIPOS, CIPURSE, EconoPACK, CoolMOS, CoolSET, CORECONTROL, CROSSAVE, DAVE, DI-POL, EasyPIM, EconoBRIDGE, EconoDUAL, EconoPIM, EconoPACK, EiceDRIVER, eupec, FCOS, HITFET, HybridPACK, IRF, ISOFACE, IsoPACK, MIPAQ, ModSTACK, my-d, NovalithIC, OptiMOS, ORIGA, POWERCODE; PRIMARION, PrimePACK, PrimeSTACK, PRO-SIL, PROFET, RASIC, ReverSave, SatRIC, SIEGET, SINDRION, SIPMOS, SmartLEWIS, SOLID FLASH, TEMPFET, thinQ!, TRENCHSTOP, TriCore. Other Trademarks Advance Design System (ADS) of Agilent Technologies, AMBA, ARM, MULTI-ICE, KEIL, PRIMECELL, REALVIEW, THUMB, Vision of ARM Limited, UK. AUTOSAR is licensed by AUTOSAR development partnership. Bluetooth of Bluetooth SIG Inc. CAT-iq of DECT Forum. COLOSSUS, FirstGPS of Trimble Navigation Ltd. EMV of EMVCo, LLC (Visa Holdings Inc.). EPCOS of Epcos AG. FLEXGO of Microsoft Corporation. FlexRay is licensed by FlexRay Consortium. HYPERTERMINAL of Hilgraeve Incorporated. IEC of Commission Electrotechnique Internationale. IrDA of Infrared Data Association Corporation. ISO of INTERNATIONAL ORGANI ZATION FOR STANDARDIZATION. MATLAB of MathWorks, Inc. MAXIM of Maxim Integrated Products, Inc. MICROTEC, NUCLEUS of Mentor Graphics Corporation. MIPI of MIPI Alliance, Inc. MIPS of MIPS Technologies, Inc., USA. muRata of MURATA MANUFACTURING CO., MICROWAVE OFFICE (MWO) of Applied Wave Research Inc., OmniVision of OmniVision Technologies, Inc. Openwave Openwave Systems Inc. RED HAT Red Hat, Inc. RFMD RF Micro Devices, Inc. SIRIUS of Sirius Satellite Radio Inc. SOLARIS of Sun Microsystems, Inc. SPANSION of Spansion LLC Ltd. Symbian of Symbian Software Limited. TAIYO YUDEN of Taiyo Yuden Co. TEAKLITE of CEVA, Inc. TEKTRONIX of Tektronix Inc. TOKO of TOKO KABUSHIKI KAISHA TA. UNIX of X/Open Company Limited. VERILOG, PALLADIUM of Cadence Design Systems, Inc. VLYNQ of Texas Instruments Incorporated. VXWORKS, WIND RIVER of WIND RIVER SYSTEMS, INC. ZETEX of Diodes Zetex Limited. Last Trademarks Update 2011-11-11

Preliminary Data Sheet

Revision 2.0, 2012-03-09

BGA725L6
Table of Contents

Table of Contents
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 List of Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 List of Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 1 2 3 4 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Application Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Preliminary Data Sheet

Revision 2.0, 2012-03-09

BGA725L6
List of Figures

List of Figures
Figure 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Application Schematic BGA725L6 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Drawing of Application Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Application Board Cross-Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 TSLP-6-2 Package Outline (top, side and bottom views) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Footprint TSLP-6-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Marking Layout (top view). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Tape & Reel Dimensions (reel diameter 180 mm, pieces/reel 15000) . . . . . . . . . . . . . . . . . . . . . . 15

Preliminary Data Sheet

Revision 2.0, 2012-03-09

BGA725L6
List of Tables

List of Tables
Table 1 Table 2 Table 3 Table 4 Table 5 Table 6 Pin Definition and Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Electrical Characteristics: TA = 25 C, VCC = 1.8 V, VPON,ON = 1.8 V, VPON,OFF = 0 V, f = 1550 - 1615 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electrical Characteristics: TA = 25 C, VCC = 2.8 V, VPON,ON = 2.8 V, VPON,OFF = 0 V, f = 1550 - 1615 MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Preliminary Data Sheet

Revision 2.0, 2012-03-09

Silicon Germanium Low Noise Amplifier for Global Navigation Satellite Systems (GNSS) in ultra small package with 0.77mm footprint

BGA725L6

Features
High insertion power gain: 20.0 dB Out-of-band input 3rd order intercept point: -2 dBm Input 1 dB compression point: -15 dBm Low noise figure: 0.65 dB Low current consumption: 3.6 mA Operating frequencies: 1550 - 1615 MHz Supply voltage: 1.5 V to 3.6 V Digital on/off switch (1V logic high level) Ultra small TSLP-6-2 leadless package (footprint: 0.7 x 1.1 mm2) B7HF Silicon Germanium technology RF output internally matched to 50 Only 1 external SMD component necessary 2kV HBM ESD protection (including AI-pin) Pb-free (RoHS compliant) package

Application Ideal for all Global Navigation Satellite Systems (GNSS) like GPS, GLONASS, Beidou, Galileo and others.
VCC PON

AI
ESD

AO

GND

GNDRF
BGA 725L 6_Blockdiagram .vsd

Figure 1

Block Diagram

Product Name BGA725L6 Preliminary Data Sheet

Marking D 7

Package TSLP-6-2 Revision 2.0, 2012-03-09

BGA725L6
Features Description The BGA725L6 is a front-end low noise amplifier for Global Navigation Satellite Systems (GNSS) from 1550 MHz to 1615 MHz like GPS, GLONASS, Beidou, Galileo and others. The LNA provides 20.0 dB gain and 0.65 dB noise figure at a current consumption of 3.6 mA in the application configuration described in Chapter 3. The BGA725L6 is based upon Infineon Technologies B7HF Silicon Germanium technology. It operates from 1.5 V to 3.6 V supply voltage. Pin Definition and Function Table 1 Pin No. 1 2 3 4 5 6 Pin Definition and Function Name GND VCC AO GNDRF AI PON Function General ground DC supply LNA output LNA RF ground LNA input Power on control

Preliminary Data Sheet

Revision 2.0, 2012-03-09

BGA725L6
Maximum Ratings

Maximum Ratings

Table 2 Parameter

Maximum Ratings Symbol Min. Values Typ. Max. 3.6 0.9 V V V V V mA dBm mW C C C V -0.3 -0.3 -0.3 -0.3 -0.3 -40 -65 Unit Note / Test Condition
1)

Voltage at pin VCC Voltage at pin AI Voltage at pin AO Voltage at pin PON Voltage at pin GNDRF Current into pin VCC RF input power Total power dissipation,

VCC VAI VAO VPON VGNDRF ICC PIN Ptot TJ TA TSTG

according to JESD22A-114

VCC + 0.3 VCC + 0.3

0.3 20 0 72 150 85 150 2000

TS < 123 C2)

Junction temperature Ambient temperature range Storage temperature range ESD capability all pins

VESD_HBM

1) All voltages refer to GND-Node unless otherwise noted 2) TS is measured on the ground lead at the soldering point

Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the integrated circuit. Thermal Resistance Table 3 Parameter
1)

Thermal Resistance Symbol Value Unit K/W

Junction - soldering point RthJS 380 1) For calculation of RthJA please refer to Application Note Thermal Resistance

Preliminary Data Sheet

Revision 2.0, 2012-03-09

BGA725L6
Electrical Characteristics

Electrical Characteristics
Electrical Characteristics:1) TA = 25 C, VCC = 1.8 V, VPON,ON = 1.8 V, VPON,OFF = 0 V, f = 1550 - 1615 MHz (GPS / Glonass / Beidou / Galileo) Symbol Min. Values Typ. 3.6 0.2 5 20.0 0.65 14 20 37 5 5 -16 -6 -5 >1 Max. 3.6 3 Vcc 0.4 1 V mA A V V A A dB dB dB dB dB s s dBm dBm dBm ON-mode OFF-mode ON-mode OFF-mode ON-mode OFF-mode 1.5 1.0 0
2

Table 4 Parameter

Unit

Note / Test Condition

Supply voltage Supply current Power On voltage Power On current Insertion power gain Noise figure
2)

VCC ICC Vpon Ipon

|S21|

NF RLin RLout
1/|S12|
3)

ZS = 50
OFF- to ON-mode ON- to OFF-mode

Input return loss Output return loss Reverse isolation Power gain settling time

tS

Inband input 1dB-compression IP1dB point Inband input 3rd-order intercept IIP3 point4) Out-of-band input 3rd-order intercept point5) Stability
1) 2) 3) 4) 5)

f1 = 1575 MHz f2 = f1 +/-1 MHz f1 = 1712.7 MHz f2 = 1850 MHz f = 20 MHz ... 10 GHz

IIP3oob k

Based on the application described in chapter 3 PCB losses are subtracted To be within 1 dB of the final gain OFF- to ON-mode; to be within 3 dB of the final gain ON- to OFF-mode Input power = -30 dBm for each tone Input power = -20 dBm for each tone

Preliminary Data Sheet

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BGA725L6
Electrical Characteristics

Table 5 Parameter

Electrical Characteristics:1) TA = 25 C, VCC = 2.8 V, VPON,ON = 2.8 V, VPON,OFF = 0 V, f = 1550 - 1615 MHz (GPS / Glonass / Beidou / Galileo) Symbol Min. Values Typ. 3.6 0.2 5 20.0 0.65 14 20 37 5 5 -15 -5 -2 >1 Max. 3.6 3 Vcc 0.4 1 V mA A V V A A dB dB dB dB dB s s dBm dBm dBm ON-mode OFF-mode ON-mode OFF-mode ON-mode OFF-mode 1.5 1.0 0
2

Unit

Note / Test Condition

Supply voltage Supply current Power On voltage Power On current Insertion power gain Noise figure
2)

VCC ICC Vpon Ipon

|S21|

NF RLin RLout
1/|S12|2
3)

ZS = 50
OFF- to ON-mode ON- to OFF-mode

Input return loss Output return loss Reverse isolation Power gain settling time

tS

Inband input 1dB-compression IP1dB point Inband input 3rd-order intercept IIP3 point4) Out-of-band input 3rd-order intercept point5) Stability
1) 2) 3) 4) 5)

f1 = 1575 MHz f2 = f1 +/-1 MHz f1 = 1712.7 MHz f2 = 1850 MHz f = 20 MHz ... 10 GHz

IIP3oob k

Based on the application described in chapter 3 PCB losses are subtracted To be within 1 dB of the final gain OFF- to ON-mode; to be within 3 dB of the final gain ON- to OFF-mode Input power = -30 dBm for each tone Input power = -20 dBm for each tone

Preliminary Data Sheet

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BGA725L6
Application Information

Application Information

Application Board Configuration

N1

BGA725L6
AO, 3

GNDRF, 4 C1 (optional) L1 AI, 5

RFout

RFin

VCC, 2

VCC
C2 (optional)

PON

PON, 6

GND, 1

BGA 725L 6_Schematic.vsd

Figure 2 Table 6 Name

Application Schematic BGA725L6 Bill of Materials Value 1nF > 10nF2) 7.5nH BGA725L6 Package 0402 0402 0402 TSLP-6-2 Manufacturer Various Various Murata LQW type Infineon Function DC block 1) RF bypass 3) Input matching SiGe LNA

C1 (optional) C2 (optional) L1 N1

1) DC block might be realized with pre-filter in GNSS applications 2) For data sheet characteristics 1F used 3) RF bypass recommended to mitigate power supply noise

A list of all application notes is available at http://www.infineon.com/gpslna.appnotes.

Preliminary Data Sheet

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BGA725L6
Application Information

BGA 725 L6_Application _Board .vsd

Figure 3

Drawing of Application Board

Vias Copper 35m Vias Ro4003, 0.2mm FR4,0.8mm
BGA 725L6_application _board _sideview.vsd

Figure 4

Application Board Cross-Section

Preliminary Data Sheet

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BGA725L6
Package Information

Package Information
Top view
+0.01

Bottom view
0.7 0.05 0.2
0.035 1)

0.2 0.05

2 1

5 6

Pin 1 marking

0.2 0.05

1) Dimension applies to plated terminals

Figure 5

TSLP-6-2 Package Outline (top, side and bottom views)

N SMD
0.4 0.25 0.25 0.4 0.25 0.25

0.4

0.4

(stencil thickness 100 m) Copper Solder mask Stencil apertures

TSLP-6-2-FP V01

Figure 6

Footprint TSLP-6-2

D
Figure 7 Marking Layout (top view)

Type code Pin 1 marking

TS LP-6-2-MK B GA 725

Preliminary Data Sheet

14

(0.05)

TSLP-6-2-PO V01

Revision 2.0, 2012-03-09

1.1 0.05

(0.05)

0.05 MAX.

(0.05)

(0.05)

0.2 0.035 1)

0.39 -0.03

BGA725L6
Package Information

0.5

1.25

Pin 1 marking

2 0.85
TSLP-6-2-TP V01

Figure 8

Tape & Reel Dimensions (reel diameter 180 mm, pieces/reel 15000)

Preliminary Data Sheet

15

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