CONFIDENTIAL

Flextronics Product Innovation Center

Product Innovation Center (PIC)

Milpitas Product Innovation Center Value Proposition

Objective
Flextronics is committed to providing our OEM customers with advanced innovative solutions and offerings that increase their competitiveness and time to market Flagship Center of Excellence Gateway Launch Center Best possible total customer experience and service level End-to-end solutions to enable full customer scalability Advanced technology with state-ofthe-art equipment to support fast product development and launch Promote a success driven environment, culture and mindset
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Milpitas Global Operations Organization

Zahid Hussain
Vice President

Rachel Ha
Administrator

Business

Supply Chain

Operations

Support Functions

Paul Henningsen
Strategy & Planning Sr. Director

Tim Griffin Sr. Material Director

Alan Cube Mechanicals General Manager

Stephen Chen Engineer & QA Director Mark Hanna Operation M4 & M6 Raymond Tran Operation Hall Mark Bernard Chan Operation M8 & M9

Micki Christensen COE Manager

Juan Barrio Controller Martin Morales HR Manager Matt Tester IT Director John Chu Facilities Manager
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Jayne Carthy
Business Development Director

Procurement / Sourcing NPI and Production Planning Process Excellence

Kesavan Srikumar
Engineering/Technology Sr. Director

Open

Open NPI & Sustaining PM Sr. Director

Logistics and Order Fulfillment

Milpitas Product Innovation Center

An ff campus Bldgs.: Logistics, Machining, Plating, Refurbishment and Repair

M9

M8

M7

M6 M5 M4 M3 M2

M1

*
SOLAR

NPI MCC8

Expansion

PCBA & System Integration

Welcome Center

System Integration

LabIX
Expansion MCC2

NPI Enclosures FA Lab AEG Lab

Inclusive ecosystem for product innovation in one campus

An average of 58k sq ft per building

Off campus Bldgs.: Logistics, Machining, Plating, Refurbishment & Repair
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Flextronics Milpitas PIC Quick Facts

Flextronics Product Innovation Center (PIC) is the gateway to Flextronics

9 85% 55k

Manufacturing buildings on campus (3 dedicated to NPI) 4 additional manufacturing buildings off campus Of lot size on campus are 100 pieces or less Active part numbers across campus

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11k+ 2 97

Failure analysis lab

Customer ECOs per year ( 300 additional ECOs on the fly Customer Confidential Centers Active customers
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Flextronics Confidential

Milpitas, CA Manufacturing Overview

Site Details | MILPITAS
Site Address Footprint
Manufacturing Offering
Design Services Engineering Services Prototypes/NPI Sheet Metal: Soft Tool Fab. Electro-mechanical Assembly Systems Integration New Product Development/DfX Complex System Integration

637 - 1177 Gibraltar Court, Milpitas, CA 95035, USA 280K sq. ft. manufacturing space 110K sq. ft. DOF, warehouse
~1200 employees

Headcount Markets

Telecom, Server, Storage, Computing, Medical

13 SMT lines, 1 backplane line, NPI, quick-turn

Site Product and Capabilities Examples

Site Capabilities

prototype, DFX, failure analysis, metal stamping, adhesive dispensing and curing, system integration, CTO/BTO, repair

Simple to Complex

BTO/CTO

Pick, Pack & Ship

Solar modules, Automated Wafer Transport System,

Product Examples

PCBA for Aerospace & Defense,, High-end servers, computing, switches/ routers, telecom amplifiers, storage, data security, machine controls, RF tags, video transmission equipment 6 mi. (10km) to San Jose Airport 35mi. (56km) to San Francisco Airport

Global Positioning Devices

Data Storage Appliances

Large System Architecture

Logistics

Certifications

ISO 9001, ISO 14001, Tl9000, AS 9100, J-STD-001, ESD 20-20, ITAR
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Milpitas Component Package Capabilities

BGA Smallest Pitch (0.3mm) Highest Pin Count (3000) Largest Package size 59.5 x 51 mm 1.27mm <=500 I/O to 1500<=2000 I/O to >2500 I/O 1mm <=300 I/O to 1500 <= 2000 I/O to >2500 I/O Pitch =0.80mm, <=0.75mm Pitch <=0.75mm HyperBGA <=42.5mm to 52.5mm < =55.5mm Flip Chip Mirrored BGAs BGA Replacement Double Sided BGA Replacement Double Sided Mirrored HiCTE Non-symmetrical BGA, pitch - 1mm, I/O - 1944 CCGA 1.27mm >=500 I/O to >=1657 I/O 1mm >=300 I/O to >=1657 I/O Smallest Pitch (0.8mm) Highest Pin Count (2092) LGA Smallest Pitch (0.4mm) Highest Pin Count (1156) POP POP (0.5mm + 0.65mm) POP (0.4mm + 0.65mm) Micro BGA/CSP Pitch - 0.4 mm to 0.8mm Rnet High Density Rnet Smallest Pitch (0.635mm) Highest Pin Count (10) MLF/QFN MLF/QFN 0.5mm >=68 I/O>=100 I/O MLF/QFN 0.4mm >=8 I/O Smallest Pitch Highest Pin Count

Chip Packages 0805, 0603,0402,0201,01005 SIP R2D2 (Under AEG) QFP/TSOP/QSOP QFP/TSOP Smallest Pitch (0.3 mm, Pin count 240) QSOP Smallest Pitch (0.5mm, Pin Count-28) Stacked Packages Stacked Devices Stack Die Connectors Straddle Mount Hirose IT2, IT3 NexLev Connector 23.5 mm,15.5 mm,10.5 mm Mictor <=200 pin; >200 pim Pressfit VHDM <200pins Pressfit VHDM 200 <=400pins Pressfit VHDM 401 <=800pins Pressfit VHDM 801 <=1200pins Pressfit VHDM >=1201pins Pressfit VHDM - PCB Thickness <0.093mils Pressfit VHDM - PCB Thickness 0.093<=0.110mils Pressfit VHDM - PCB Thickness 0.111<=0.118mils Pressfit VHDM - PCB Thickness 0.119<=0.126mils Pressfit VHDM - PCB Thickness >=0.127mils Pressfit GBX - PCB Thickness <0.093mils Pressfit GBX - PCB Thickness 0.093<=0.110mils Pressfit GBX - PCB Thickness 0.111<=0.118mils Pressfit GBX - PCB Thickness 0.119<=0.126mils Pressfit GBX - PCB Thickness >=0.127mils BGA MegArray <=300 I/O BGA MegArray >=300 I/O Double Sided Pressfit PCB Largest PCBA 24"W x 36" L Thickness >0.126 Micro Visa, Burried/Blin Vias Ceramic, Meg3/4/5, Aluminium, Halogen Free
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New Product Introduction Services

Full Scale Manufacturing Full Test suite

PCBA, Backplane, Enclosure, System Integration, SPI, AOI, 5DX, Flying probe, ICT, Boundary scan, Direct fulfillment, CTO,RMA and Repair services FCT, UTS, Hipot (Replace, Re-ball, Rework /Jumpers, others) Special Process

Manufacturing Engineering Support Early engagement

DFM (Valor Trilogy), DFA (Boothroyd Dewhurst),DFT, DFSC

Heat-sink assembly, Edge bonding, RTV, Conformal Coating, Underfill

Reliability Test
ESS, HALT/HASS, ORT

Technology and Process Qualification

01005,0201,0.3mm CSP, Pb/HF free, fiber splicing/routing, RF

ROHS, WEEE, REACH, EuP*

Product Concept

Design & Engineering

Rapid Prototyping

Product Stabilization

Volume Production

Repair & Refurbish

*Restriction of hazardous substances ,Waste Electrical and Electronic Equipment, Registration, Evaluation, Authorization and Restriction of Chemical substances ,Energy Using Product,,

Flextronics DFX Toolbox

DFM
BOM: AVL/ AML Analysis. Fabrication. PCBA.
eFDa Geometric Package library eFlex Design Automation GUI eFDa PCB Viewer

DFA
Mechanical Tolerance Stack up Analysis. Mechanical Assembly.
eFDa Yield Prediction Tool
Flex DFM Sheet Metal Analysis Tool eFDA Results Viewer

DFT
Test Strategy. Yield Prediction. ICT Fixture Stress Analysis.
Test Way DFT Analysis Tool

EMS / ODM Products

Boothroyd & Dewhurst DfA Flex Tolerance Stack-up Analysis Tool

Flex FEA Analysis- PCBA Tool

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Did You Know

Flextronics PIC Product Development

Concept through production Quick turn procurement & assembly Supply chain strategy Virtual manufacturing floor Test strategy & development Transfer to production

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Did You Know

Customer
Customer Portal

Suppliers

Automated Platform
Global platform

PC/Clients D. S. S. EDI/XML Web Methods Customers ERP Web-FC Supplier ERP/MRP FSP

Automation speed

Supply chain responsiveness

Consistency 2,000 customers and over 20,000 suppliers

EDI/XML

Web

FlexFlow web access

PC/Clients SFC-System Q-System

Milpitas Flextronics sets the global standards

Other 3PL

Logistics tracking Web Shipment Tracking EDI/XML FMS

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Did You Know

Customer Confidential Centers

Private manufacturing centers State of the art manufacturing equipment Airport type security NDA access only Metal detectors Stealth stock room 3D plastic printer 2 break-out labs

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Did You Know 3D Plastic Print Capability

No tooling required Size 19.7 x 15.7 x 7.9 inches 8 material types in one sample Most of the samples run in 24 hours CAD data of sample is required

Samples of Objet Connex Parts

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Did You Know 3D Metal Print Capability

No tooling required Size 9 x 9 x 12 inches Material types:
Aluminum/Cobalt & Alloy Chrome Steel/Nickel & Alloy Titanium

Most of the samples run in 24 hours CAD data of sample is required Samples of EOS M280 3D Metal Printer

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Did You Know

Samples of 3D Metal Printer

Skull plate printed in 3D metal

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Did You Know Robotics

Deploying robots Objective is to remove non value add activities from employees Increase productivity and lower cost New robots are human looking and user friendly - Baxter

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Did You Know

Prototype Sheet Metal Manufacturing

Prototype facility Quick turn, soft tooling DFx Manufacturing Engineering support Changes on the floor

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Did You Know

Failure Analysis Laboratory

Mechanical Tests: shear & pull, dye & pry Metallurgical Analysis: cross-sectioning, SEM/EDX, photomicrography, EDXRF for RoHS compliance Chemical Analysis: FTIR, ion chromatography Non-Destructive Test & Inspection: x-ray laminograph; radiograph, OGP, C-SAM Reliability Test: HALT/HASS, ATC Drop testing

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Did You Know Advanced Engineering Laboratory

The objective of this lab is to have dedicated team and space to keep Flextronics ahead of new technologies entering the industry. To support our advanced technology roadmap Milpitas, California Dedicated SMT line and equipment Robotics laboratory

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Advanced Engineering Laboratory

Aerosol jet printing for 10 micron lines with nano silver Printable Batteriesbendable, safe and rechargeable. Reel to Reel capabilities for HVM Low temperature interconnect with nano copper (75C to 180 C nano copper pillar technology) High Thermal Conductivity epoxies ( >150W/mK) Thermal Distribution Sheets (TDS) ( > 800W/mK, twice better than copper) Indestructible glob tops for IP protection Strong IP portfolio... essentially defensive patents to be shared with our preferred customers . Close collaboration with Consortiums like iNEMI, IMAPS, HDP & Universities like HKUST, Georgia Tech, UNC, USC and Berkeley

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End-to-End Supply Chain Management

Supplier Managed Inventory

Hubbing and Distribution

Worldwide Direct Fulfillment

Repair / Service Parts Logistics

70% of spend on SMI

Pick-pack-ship Finished goods hubbing

70% of shipments to end customer

Test, repair and refurbishment Service parts distribution

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In Closing

Well positioned with scale, capabilities and cost structure

Balanced customer and product portfolio

Well positioned for eco-system shifts

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Thank you for your time today. If you have any further questions please do not hesitate to contact me or a member of our Flextronics team. www.flextronics.com

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