F R A U N H O F E R - E I nr I C h T un G F R M o D u L are F e S T K r P er - Te C hno L o G I en E M F T

Annual Report

2012

Editorial notes

Published by: Fraunhofer EMFT Hansastrasse 27d 80686 Mnchen Tel.: +49 (0) 89 54759-0 Fax.: +49 (0) 89 54759-550 Director of the Institution: Prof. Dr. rer. nat. Christoph Kutter Tel.: +49 (0) 89 54759-506 Editors: Pirjo Larima-Bellinghoven Simone Brand Tina Mbius Articles were written by Fraunhofer EMFT staff. Publication of any material is subject to editorial authorization.

Layout/typesetting: Simone Brand Photography: BPhoto copyright p. 39 MEV database All other photo copyrights held by Fraunhofer EMFT and Bernd Mller Fotografie, Maximilianstrasse 56, 86150 Augsburg. Fraunhofer EMFT 2013

F raunhofer E M F T

ANNUaL REPOrT 2012

VO or W or TD // F RE W OR

FOREWORD

Dear friends and partners of the Fraunhofer Research Institution for Modular Solid State Technologies EMFT, dear readers, A lot happened at the Fraunhofer EMFT last year. I took up my position as institution director on July 1st. In August, the new division director Prof. Maurer started setting up the Circuits and Systems area. In Autumn a strategy process was initiated to sharpen the institutions profile: Fraunhofer EMFT stands for cutting-edge applied research into sensors and actuators for man and the environment. Fraunhofer EMFT bases its research initially on customer needs in the area of sensors and actuators: The technology decision, whether to fabricate the sensor in silicon of flexible technology comes second. The following core competences form the basis of the research work at Fraunhofer EMFT: silicon technology (individual processes and integration), flexible electronics, chemical sensor materials and the ability to create systems. Each of these core competences in its own right allows new kinds of sensors and actuators to be created. But the real strength of Fraunhofer EMFT lies in the interaction between these areas: after all, innovations often emerge where technologies reach their borders and begin to cross-fertilize. For example, ultrathin silicon chips can be integrated in foil to create new lab-onchip applications. Integration of chemical sensor dyes with interdigital capacitors in silicon or polymer technology enables electrical analysis of the optical signals emitted by the dyes. It is often no longer sufficient to develop a good component: the element must be capable of working within the system or application, too. This is why system expertise and the ability to integrate technologies and components are becoming increasingly important to our institution.

The well-established network with universities in Munich and Regensburg enables Fraunhofer EMFT to supplement its expertise. Dear readers, Fraunhofer EMFT is in a state of change. We are moving towards: being more closely geared to applications: research themes are derived from customer needs a clear profile: sensors and actuators for man and the environment further expansion of the core competences: sensor materials, individual silicon processes and integration, flexible technologies and the ability to integrate systems. I hope you enjoy reading our annual report and I would eagerly look forward to the opportunity to collaborate on many more joint projects next year. Yours sincerely,

Prof. Dr. Christoph Kutter

Director of the Fraunhofer Research Institution for Modular Solid State Technologies EMFT

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TaBLE Of CONTENTS

// Overview Fraunhofer EMFT Profile Fraunhofer EMFT - Division directors The institution in figures Advisory Board // Business Areas Business areas with examples of projects Sensor Materials Sensors and Actuators Microdosage Systems Flexible Systems Design and Test //Core Competences Overview of core competences Functional Molecules and Surfaces Silicon Processes, Device and 3D Integration Heterointegration and Foil Technologies Systems and Prototypes // Research fields and services Fraunhofer EMFT range of services Fraunhofer EMFT range of t echnologies

6 7 7 9 10 11 12 13 13 14 16 18 20 22 23 23 24 25 27 28 29 30

History 7 Organigram 8

// Customers an cooperation partners Technology networks Industry and project partners European community projects Visitors and delegations Bavarian Innovation Clusters // Highlights Special Events Award of honorary doctorate A scientific challenge met with excellence // Events and youth development Events and workshops Seminars and training programs Trade fairs Youth development Careers at Fraunhofer EMFT // Press and media // Academic puplications and talks // Patents // Memberships and activities

32 33 34 36 41 42 44 45 45 45 46 47 48 49 50 53 54 66 72 74

Universities 39

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1 Fraunhofer EMFT
entrance

FraUNHOfEr EMFT
Fraunhof e r E MF T st a n d s fo r a p p l i e d re s e a rch i n to s ens ors and ac tuators for man and the env i ronment . History Fraunhofer EMFT originales from the Fraunhofer Institute for Solid State Technology IFT, which was founded in 1974. Here, technologies were developed for the manufacture of semiconductors. Other areas of activity were sensor technology, communication technology and microstructure technology. In 1999 the Fraunhofer IFT was dissolved and split into three independent sections. The section located in Hansastrasse, Munich - todays Fraunhofer EMFT - initially became part of the Berlin-based Fraunhofer Institute for Reliability and Microintegration IZM. Fraunhofer EMFT was founded on July 1, 2010, as an independent institution once again, created from the Fraunhofer Institute for Reliability and Microintegration IZM, Munich branch. Profile In its research and development work, Fraunhofer EMFT focuses on sensors and actuators for man and the environment. Sensors already have a key role to play in our digitized world and will become increasingly important in the years to come as a result of the interconnection of devices (Internet of Things). People may not actually notice the sensors, but they will make a significant contribution to improving the quality of living - whether in health and nutrition, mobility or material analysis. Fraunhofer EMFT actuators will be used in 9 Fraunhofer EMFTs most important asset is its highly-qualified staff. The institution trains young scientists working on bachelors, masters and doctoral assignments and attaches great importance to the ongoing professional development of its regular employees. Due to its long history, the background and experience of Fraunhofer EMFT staff is very broad, allowing the employees an excellent knowledge of the world of microelectronics and microsystem technology. Their high level of motivation and the satisfaction they derive from their work results in exceptional commitment and dedication, ultimately producing good results. micropumps and microvalves in medicine and industry, for example. In defining its research fields, Fraunhofer EMFT always attaches priority to practical application. The institution gets together with customers to assess areas which are important for the market and where Fraunhofer EMFT can make a significant contribution with its expertise. The aim of applied research is to create value for society and the German economy. This value consists of transferable work results, operational components as well as systems and qualifiable prototypes. Cutting-edge research means occupying a leading position in global competition. Fraunhofer EMFT is a sought-after guest on the relevant committees as well as at conventions and conferences and is proactively involved organizing these. The results of Fraunhofer EMFTs work appear in a wide range of academic publications and attract a high level of interest in the world of science.

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1 View of the Fraunhofer

EMFT building

Organigram

F raunhofer re S ear C h In S T I T u T I on for M o D u L ar So L I D S TaT e Te C hno L o G I e S E M F T Director: Prof. Dr. Christoph Kutter Nanomaterials, Devices and Silicon Processes Head: Prof. Dr. I. Eisele Heterogeneous System Integration Head: Dr. P. Ramm Polytronics and Multifunctional Systems Head: Prof. Dr. Dr. h.c. K. Bock Micromechanics, Actuators and Fluidics Head: Dr. M. Richter Circuits and Systems Head: Prof. Dr. L. Maurer Analysis and Test of Integrated Systems Head: Dr. H. Gieser Administration Head: G. Wrtz

Wafer Technology Head: Dr. A. Klumpp

Polytronic Technology Head: G. Klink

Electronics and Biomedical Solutions Head: F. Wenninger

PR, Marketing: Head: P. Larima-Bellinghoven

CMOS Integration Head: Dr. L. Nebrich

Substrate Preparation and Treatment Head: C. Landesberger

Circuit Design Head: N.N.

Business Development Head: Prof. Dr. P. Kcher

Multifunctional Technologies Head: A. Drost

Sensor Materials Regensburg Head: Dr. S.Trupp = Group = Department

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Fraunhofer EMFT - Division directors A defining characteristic of Fraunhofer EMFT is the close collaboration between staff, scientists and management. Professor Kutter is at the helm of Fraunhofer EMFT. The three division directors are:

Division: Nanomaterials, Devices und Silizium Prozesses Prof. Dr. Ignaz Eisele Phone: +49 89 54759-189

Division: Polytronics and Multifunctional Systems Prof. Dr.-Ing. Dr. h.c. Karlheinz Bock Phone: +49 89 54759-506

Division: Circuits und Systems Prof. Dr. Linus Maurer phone: +49 89 54759-138

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1 High-grade steel
micropump for application in medical technology and biotechnology

The institution in figures Operating budget The Fraunhofer EMFT operating budget continued to develop positively last year. It amounted to 10,631,000 euros in 2012. Industrial contracts generated a total volume of just under 2,000,000 euros. The percentage of earned revenue was therefore approximately 20%. The planned operating budget for 2013 is EUR 11,266,000, which will involve a further increase in the institutions industrial earnings. Staff development Fraunhofer EMFT currently employees a staff of 92. Of these, 68 work in the scientific area and another 24 in the areas of administration, IT and technology. On average there are over 35 students and research assistants from a wide range of institutions working on their doctoral thesis, dissertation or masters assignment at Fraunhofer EMFT at any given time and who are involved in the various research areas. Office areas and meeting rooms: (2760 m2) Offices (1520 m2) 3 seminar rooms (50 m2, 55 m2 und 80 m2) 4 meeting rooms (190 m2) 1 video conference room for 15 people (50 m2) Laboratories: (1600 m2) Polytronics, microfluidics, bioanalytics, ATIS, guest companies Cleanrooms: (640 m2) according to DIN EN ISO 14644-1, ISO class 5 (previously 100 US FED standard) and 4 (previously 10 US FED standard) 200 mm line with complete range of standard silicon CMOS equipment 150 mm line with complete range of standard silicon MEMS equipment Infrastructure In the Fraunhofer EMFT building the following infrastructure exists:

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Advisory Board Th e Adv isor y Boa rds a re e xte r n a l co n s u l ti n g b o di es attac hed to the i ns ti tutes and res earc h i ns ti tuti o ns. Th ey a re m a de up o f re p re s e n ta ti ve s fro m s c i e nc e, bus i nes s and publ i c l ife. The approx i matel y twelve memb e r s f or e a c h in s ti tu te a re a p p o i n te d b y th e F raunhofer Ex ec uti v e Board i n agreement wi th the i nst itu te m a na ge m e nt . At l east one m e m be r o f th e E xe cu ti ve B o a rd a ttends the annual meeti ngs . The A dv i s ory Boards adv i s e t he i n sti tu t ion m a na ge m e n t o n i s s u e s o f re s e a rch ori entati on and s truc tural c hange. The members of the Fraunhofer EMFT Advisory Board are as follows: Dr. Hans-Jrgen Bigus, Hirschmann Laborgerte GmbH & Co. KG Dr. Reinhard Fojt, KETEK GmbH Prof. Dr. phil. Merith Niehuss, Universitt der Bundeswehr Mnchen Prof. Dr. -Ing. habil. Dr. h. c. mult. Ulrich Rohde, Synergy Microwave Europe GmbH & Co. KG Dr. Thomas Scheiter, Siemens AG Corporate Technologies Prof. Dr. rer. nat. Doris Schmitt-Landsiedel, Technische Universitt Mnchen Dr. Peter Wawer, Infineon Technologies AG Dr. Stefan Wimbauer, Bavarian Ministry for Trade, Infrastructure, Transportation and Technology, Munich

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1 Sensor glove changes

color as a hazardous substance warning

Sensor Materials

Sensors and Actuators

Microdosage Systems

Flexible Systems

Design and Test

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BUSINESS arEaS wITH EXamPLES Of PrOJECTS

Frau nhof e r E MF T or g a n i z e s i ts re s e a rch a n d d ev el opment programs i nto fi v e bus i nes s areas . Thes e are d es cri be d be low a nd th e i r a cti vi ti e s p re s e n te d b as ed on s el ec ted pri ori ty proj ec ts . Sensor Materials Sensor materials are developed at Fraunhofer EMFT which indicate the presence of analyte molecules by means of changes in color or fluorescence. The materials are based on indicator dyes and are tailored to the application concerned by means of integration in polymers, foils, structured surfaces, microparticles or nanoparticles. For example, sensor particles are used as nanosensors for analytics in cells. They can also be applied to surfaces by means of coating or printing techniques. In the area of textiles, nanosensors can be integrated using the same techniques as those used for processing the pigments commonly applied in this field such as screen printing. One example of a textile application is sensor protective clothing: if there are toxic or corrosive substances in the ambient air, the clothing warns the wearer by changing color. Sensor materials based on a color change to show detection of an analyte can also be integrated in a range of everyday products. Food monitoring is highly topical in this connection: here, sensor packaging which changes color in response to spoilage processes or high levels of contamination in food is both highly effective and easy to handle. In the area of fluorescence analytics, Fraunhofer EMFT develops sensor systems and modules which can be used in air or water analytics - for instance by means of integration in measuring devices. In one current project (ZIM KF2833201ZG1 and E830901ZG1), Fraunhofer EMFT is collaborating with an industry partner (TriOS Messund Datentechnik GmbH, Rastede) on an O2/CO2-measuring device based on optical sensors for CO2 and O2. This system will be designed to simultaneously measure O2/CO2 in water The project specifically involves the creation of an indicator system which can be visually analyzed to detect oxidative 15 The initial aim is to demonstrate the general feasibility of such indicator systems and create a basis for developing others. The solution principle is based on the measurement of volatile aldehydes (e.g. hexanal) in the gaseous phase. The sell-by date on packaging only gives the consumer some idea of the freshness of the food contained in it. But errors in packaging, disruptions in the refrigeration chain or leaking packaging can cause foodstuffs to spoil during distribution or in households. Very often it is impossible to detect from the outside that the food has spoiled or has become inedible or even harmful to health. So to increase consumer safety, clear indicators would be useful which show the actual quality of the food. The Hexanal Sensor project at Fraunhofer EMFT is dedicated to developing intelligent packaging with color indicator systems which visibly display the freshness of food products. Project example: Hexanal sensor samples on site in real time. It is based on the development and combination of new fluorescence indicators to measure the two analytes and their integration in suitable polymers. The planned application makes high demands of the sensor system, including fast response, high sensitivity and not least a high level of stability and resilience to the impact of transportation and varying storage conditions.

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1 CO2- sensor chip on a

circuit board

quality changes - for example in packaged (and opened) cooking oils and roasted nuts. The aim will then be to integrate this indicator system in packaging foils or in closure seals for bottles. The developments are of particular relevance to manufacturers of products containing oil and fat which spoil as a result of oxidation (e.g. oil mills, the confectionery industry, manufacturers of baked goods). Additionally, they are of great interest to end consumers. The insights gained from this project will also be used as a basis on which to develop indicator systems for other foodstuffs (e.g. meat, fish, ready-made products) and will be fed into the area of sensor technology.

Sensors and Actuators The Sensors and Actuators business area includes the areas of Services and Process and component development. Services provided include process development and small series production of silicon-based sensors as well as the qualification of process media. The aim is to establish close collaboration with companies and ultimately benefit customers: their own staff can make use of Fraunhofer EMFTs cleanroom infrastructure as well as drawing on the expertise of experienced Fraunhofer EMFT staff. Small series production at Fraunhofer EMFT makes sense

This project is run jointly with Fraunhofer IVV and is sponsored as internal research geared towards small and medium-sized companies (project no. 825 352) Concrete project outcomes are expected in June 2014.

wherever small volumes are not available on the global market. A 200 mm CMOS line is available for this purpose, supplemented by a 150 mm backend line. Close collaboration also allows typical customer problems to be solved such as increasing yield and throughput in small series production. It is possible to jointly analyze the impact of critical factors on the application so as to enhance performance. In terms of product development, Fraunhofer EMFT is currently involved in creating detectors for material analysis by means of EDX and XRF analysis (Si-drift detector). Another example is that of single X-ray photon detectors for medical technology applications which take the form of silicon photomultipliers and are based on the avalanche diode principle. The spectral range can be covered by the properties of the pure silicon material. For example, Fraunhofer researchers are developing silicon photomultipliers (SiPM) in 200 mm technology in collaboration with Ketek GmbH. Initial results have been highly promising. Ketek GmbH is now seeking

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to develop the jointly created SiPM to product maturity. Fraunhofer EMFT is also evaluating use of the components in other applications such as detection of weak light signals in the field of analytics. In the area of process media qualification, customers have the opportunity to test silicon-based primary substances (gaseous) or etching and cleaning gases on production-type equipment. This makes it possible to analyze the purity of supplied material in the target processes and potentially discover any extraneous matter which may be present. Any undesirable impact on production equipment can be tested and proposals developed for the application. The support from experienced Fraunhofer EMFT personnel is a key benefit here. In developing processes and components, the focus is on components which are distinct from those generally available on the market due to their special parameters: through-flow sensors for liquids, low-noise single transistors such as JFETs and buried-channel HRFETs, gas concentrators and electrochemical sensors, just to mention a few. In combination with device and process simulation and using special processes in the front-end area of the technology line, concepts for novel components with improved properties are created which are adapted to industry specification profiles

Project example: Components for high-frequency applications The fundamental idea of the MST Bayern project HRFET - lownoise field-effect transistors with high-frequency capability is to develop FET transistors which can be used in the GHz range and are extremely low-noise. Existing transistor concepts are not capable of meeting both these specifications. The project is pursuing two concepts: Firstly, the refinement of so-called JFETs (Junction FETs) - here the HESDEK project already achieved excellent results in the MHz frequency range; secondly a new type of CMOS concept with buried-channel MOS transistors for applications running into the GHz range.

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1 Microdosage system
for microlubrication of precision bearings in highperformance spindles

Microdosage Systems The handling and dosage of tiny quantities of liquids or gases is crucial to a wide array of applications nowadays. Fraunhofer EMFT offers its customers individually tailored microdosage solutions, giving rise to new products and applications in the following areas: Lubrication dosage Laboratory technology Medical technology Fuel cells Micro-cooling systems Scent dosage systems Analysis systems

patients. All these applications require exact dosage of the very tiniest amounts. At the same time, the dosage components must be disposable and therefore very low-priced. This is achieved by making microdosage systems out of plastic or metal. Micropumps can be of valuable assistance in treating chronic wounds: one example here is the use of innovative and miniaturized plasters in vacuum therapy. Extremely miniaturized dosage systems made of silicon are ideal for implantable applications. For example, micropumps implanted behind the eye could be used to reduce eye pressure and treat glaucoma. The same method could help those suffering from phthisis by preventing them from going blind. Somewhat larger micropumps made of high-grade steel might replace the sphincter muscle in the bowel or bladder by means of a so-called cuff where a saline solution is pumped in (to close it) or out (to open it).

For example, microlubrication systems can be used to apply tiny quantities of lubrication oil (just 5 nanoliters per second) to a bearing. This can save up to 98% of lubrication oil as compared to conventional methods of lubrication. In laboratory technology, silicon micropumps can replace heavy ceramic pistons in air displacement pipettes or microtiter plate robots, making the systems lighter and easier to handle. The field of medical technology offers a wide range of applications. One particular area here is medication dosage by means of externally wearable or implantable systems. The latter can be used in pain therapy (intrathecal or peridural), for treating tinnitus (Lidocaine in the middle ear), in hormone therapy (for treating fertility disorders), tumor therapy (direct dosage of highly concentrated cytostatics into the tumor tissue) and in diabetes therapy. There is particularly promising market potential in the context of insulin treatment for diabetes 18 Microdosage technology is an innovative, future-oriented area but it still poses a number of challenges. These include the management of bubbles, particles and back pressure, monitoring the dosage of minute quantities and chemical resistance. Fraunhofer EMFT works on all these issues so as to be able to develop robust products for its customers. Analysis systems (e.g. water analysis) use microdosage to ensure that the analysis sensor is fed with precisely defined media free of bubbles and particles, enabling exact measurements to be made.

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Project example: Piezolub: Self-sufficient, piezo-powered microdosage component for lubricants Precise lubricant dosage is crucial to ensure smoothrunning production - especially in the case of fully automated processes: it guarantees a long equipment service life, prevents premature wear and tear and extends the maintenance intervals required. Scientists at Fraunhofer EMFT have developed a new type of micro-quantity lubricant system in cooperation with Paul Mller Industrie GmbH & Co KG (GMN). It enables controlled release of minute quantities of lubricant into precision ball bearings in high-power spindles. The self-contained dosage systems with integrated oil reservoir for an anticipated operational service life of approx. 20,000 hours are designed to be mounted decentrally on cutter spindles. Piezoelectrically powered silicon micromembrane pumps are at the heart of the system, developed at Fraunhofer EMFT and with a chip size of just 7 x 7 mm2. A new method of dosage monitoring was also integrated in order to ensure reproducible oil transport. This is based on a sensor principle for minute conveyance volumes, likewise developed at Fraunhofer EMFT: capacitive runtime monitoring of phase boundaries between oil and air. Another particular area of focus was that of solutions to avoid free-flow. GMN supports development work by means of extensive testing on real machine tool spindles so as to assess the optimum oil quantity for stable, efficient bearing lubrication. The newly developed solution based on classic oil/air lubrication offers several advantages as compared to commercially available

lubricant systems. For example, with dosage units of far less than 25 g per second in some cases, only a fraction of the lubricant is used. In addition to making economic sense, there is also an ecological bonus. It is also worth mentioning the health benefit here: after all, it leads to a reduction in oil contamination of the air in production halls. Less oil in the bearing also means a lower coefficient of friction, which in turn increases the efficiency of high-speed spindles.

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1 Foil-based flexible sensor system used to monitor various air parameters

Flexible Systems The area of foil systems, or FOLAE (flexible organic and largearea electronics) has advanced continuously in recent years. At Fraunhofer EMFT today, various products are developed and in some cases produced, including sensors, solar cells, integrated circuits, displays and entire flexible systems. This has primarily been made possible by technological advancements in the field of functional materials, especially those based on organic substances (smart materials). The conductive, semi-conductive, sensoric or luminous properties of these allow direct integration of the most diverse components and functions on a wide variety of surfaces by means of layering techniques. A key focus here is on the extended pressure technologies and additive coating and structuring technologies used to create flexible electronic systems - generally based on the familiar areas of use of printed media. These techniques enable entirely new functionalities. Classic electronics can also be integrated on flexible substrates such as foils or textiles, for example high-performance components based on existing wafer technologies such as silicon CMOS or MEMS. The relevance of this type of application is obvious: in many microelectronic products, the trend nowadays is towards increasingly thin semiconductor elements so as to enhance performance or facilitate handling. Examples include silicon chips for power electronics, solar cells, 3D-integrated chip stacks, micromechanical sensors (MEMS) and also very thin silicon components as have been used for many years in smart labels for logistics applications and identification systems. Flat and flexible multifunctional electronic systems on foil substrates open up a whole new range of potential applications. 20

The Bavarian Polytronic Demonstration Center (BDP) was established in 2002 for this business unit and in recent years it has been fitted with state-of-the-art, production-related equipment for the microfabrication of product demonstrators on foils. For research projects and development work contracted by industry, the facility now has machines which allow modular processing of foil sheets or rolls with a width of 210 mm. A microsystems engineering line is also available which can produce microsystems on a substrate size of 150 mm in a cleanroom. This is used as a standard method for processing silicon wafers on a service basis, but it is also well suited to effective prototyping of foil processes under ideal environmental conditions. Our development work in the area of flexible systems currently focuses on functional integration by combining functional materials with related application-oriented processing. Here the spectrum of integration options ranges from large-area, flexible wiring systems based on foil stacks with three-dimensional assembly and connection structures as well as foil via technologies and the assembly of optical and sensor components in foil technology to produce organic printed circuits and systems. In terms of product development, plastic foils offer a number of benefits as a large-format substrate material. Firstly, they provide a large-area, low-cost substrate that enables the creation of flexible, bendable or rollable systems. But the interim stage of a foil process can also add crucial improvements to non-flexible applications, for example by thinning power semiconductors and sensors or by transfer to the heat sink or device surface by means of foil handling. Foils can also be processed as a continuous substrate in the form of roll material. This type of roll-to-roll technique enables highly efficient manufacturing methods, providing high production volumes especially in the area of low-cost electronics. A now classic example of

this kind of application is the manufacture of RFID systems in which aerial coils are printed and fitted with transponder ICs using a through-feed method.

source and phototransistor are placed opposite each other and are optically linked. In this way, changes in the optical absorption between the

Roll-to-roll processes have paved the way for new applications in other areas, too, ranging from electronic paper and rollable displays to intelligent sensor floors and disposable sensors.

components can be electrically detected and measured. Sensor layers can be inserted in the absorption path for this purpose. In this particular case, laser processing of foils was used to create a fluid channel enabling the change in optical absorption to be detected in fluids. Researchers have refined

Project example: PolyOpto - multifunctional analysis system for point-of-care applications On-site diagnostics in medical technology requires small, portable and automated devices which can be manufactured economically and in large numbers. The project PolyOpto saw Fraunhofer EMFT researchers developing this kind of multifunctional analysis system, incorporating electrical, optical and fluidic functionalities on a plastic foil. Polymer foils as a substrate in combination with roll-to-roll production techniques ensure material costs are kept very low. The individual components for an optical sensor system - light source, photo transistor and fluid channel - are produced on foil using layering techniques. The light source used here is an electroluminescence component. An organic transistor based on semiconductive TIPS pentacene serves as a light-sensitive detector. The light source and the detector are produced on the same foil, so no additional assembly stages are required. In order to achieve the three-dimensional arrangement of the sensor system, the foil is folded around a second foil with fluidic contours. This creates a closed system in which the light

the system by adding a gas analysis module. For this purpose, a chromatic gas sensor material was integrated on foil in modular form together with a pneumatic channel arranged in the same way made of circular EL lighting and a coaxial pentacene phototransistor. This allows the concentration of gases to be determined by reading out color changes in the chromophore based on the EL lighting and the pentacene phototransistor. This optoelectronic system largely dispenses with any assembly of individual components and can be produced by means of one-sided processing. As mentioned above, roll-to-roll production is essentially possible too, increasing manufacturing efficiency so as to be able to handle large volumes. This type of low-cost sensor system for one-off use is also of interest to other areas in addition to medical technology, including environmental analytics, for example. This research is funded by the German Federal Ministry of Education and Research (BMBF) and VDI/VDE Innovation + Technik GmbH, Project PolyOpto FKZ 16SV3870

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1 CC-TLP electrode via

wafer (raised)

Design and Test With its business unit Design and Test, Fraunhofer EMFT offers its customers individually tailored solutions, ranging from system design through to reliability assessment. The services offered are as follows: Design of complete systems as devices, subsystems and integrated components Multiparametric characterization of systems and components Reliability prognoses with regard to the planned application Thereby commercially available technologies are used, as well as technologies produced by Fraunhofer EMFT and adapted to customers specific needs. The leitmotif in this business area is the duality of simulation and experiment. The current focus area in design development is in the field of microprocessor-controlled systems which use sensors to capture, process, store specific parameters and/or ultimately trigger actuators. One example of this is the microfluidic systems including micropumps and microvalves which are controlled by means of sensor measurement technology. The design of integrated components, cells and circuits with low integration density is currently being developed: here Fraunhofer EMFT is focusing on the areas of analog and high frequency. Using multiparametric characterization, it is possible to simulate physical input variables such as voltage, current, temperature, light, moisture, gases etc. under laboratory conditions and compare the reaction of the component to the variable on its own as well as collectively. 22

The results provide a basis for assessing measurement precision and reproducibility. By means of appropriate load tests which address success-related error mechanisms, it is also possible to apply these methods to determine expected reliability and lifetime. The range of services finally includes systematic analysis of the causes of complex errors and reliability problems in electronic components and systems as well as their reproduction under laboratory conditions, including identification of falsifications. As mentioned above, Fraunhofer EMFT has its own in-house developments which usefully complement commercially available equipment. One example of such a specialized system is the M-CDM ESD tester. It is now also used directly by industry with specially adapted software. The M-CDM ESD extension CC-TLP Capacitive Coupled Transmission Line Pulsing and a bending machine for flexible substrates have similar potential.

Project example: i-Tex The FP7 project i-Tex Intelligent and luminous textiles (www.i-tex.nl) researches and develops energy-efficient, large-area lighting systems based on inorganic light-emitting diodes (LED). As part of this project, Fraunhofer EMFT Working Group ATIS runs the work package Characterization and Reliability. Since the lighting systems are initially to be used in architecture and high-quality tents, there is particular focus on reliability as well as the functional, technical aspects and aesthetic properties of the lighting. In addition to visual properties, investigation is carried out into the conductivity of the electrical connections, insulation between the conductors and the impact of temperature and moisture, as well as tensile and flexural stress. Particular importance is attached to electrostatic discharge (ESD): after all, without the appropriate protective measures, the load-sensitive LEDs would be exposed to dangerously high levels of static voltage of many kilovolts even while being woven into the textiles and during roll-to-roll coating. As part of its i-Tex activities, the working group develops methods and test devices for multiparametric electrical, thermal and optical characterization and flexural stress. It also produces computer-controlled, analyzable sensors for room and lighting parameters as well as power sources to supply test vehicles and demonstrators.

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/ / Core Com P e T en C e S

1 Smart pigments Microdosage Systems

Sensor Materials

Flexible Systems

Functional Molecules and Surfaces

Silicon Processes, Device and 3D Integration

Heterointegration and Foil Technologies

Systems und Prototypes

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Design and Test

Sensors and

Actuators

OVErVIEw Of COrE COmPETENCES

Frau nhof e r inst it ut e s o ffe r s e l e c te d c o re co mp etenc es ai med at tac kl i ng future tec hnol ogi c al c hal l enges faci ng soc ie t y , busin e s s a n d i n d u s try. Fra u n h o fe r EM F T groups i ts areas of res earc h and dev el opment ex p erti se int o f our c ore c o mp e te n c e a re a s . T h e s e are des c ri bed bel ow. Functional Molecules and Surfaces Fraunhofer EMFT possesses outstanding expertise in the selective synthesis of indicator dyes, in handling polymer systems and in the creation of functional polymers and surfaces by means of chemical modifications. The knowhow in this area has produced a wide range of application-related demonstrators such as optical sensor foils. The production of responsive optical materials starts with the selective synthesis of suitable indicator molecules for fluorescence or absorption tests. The applications are stably immobilized on surfaces so as to be able to adapt the indicators to them. This is carried out by embedding them in polymers (smart dyes) or by bonding them to the surfaces of microparticles or nanoparticles (smart pigments). Where such sensor particles are synthetically structured, core-shell systems can be used to combine multiple functions and generate properties such as hydrophilicity, hydrophobia or polarity. Optical sensor foils Sensor foils can be used in a variety of different ways, in the form of test strips in medical diagnostics, biotechnology, environmental analytics and process characterization, for example. They are likewise used in product authentication by installing fluorescent indicators. Sensor materials also have enormous potential in the textile industry. Foil strips for integration in textiles (e.g. protective 25 In addition to indicator modules, Fraunhofer EMFT also develops a range of optical measurement modules (e.g. incident light module, fluorescence module) and adapts them to the various properties of the sensor materials. In addition to detecting optical signals, these modules also enable measuring data to be stored and transmitted. Surfaces on vehicles and machines can also be coated with sensor materials, allowing 3D imaging of physical parameters such as pressure and temperature. In the area of food monitoring, sensor foils integrated in packaging can determine and display the freshness of the contents. This makes it possible to reliably identify the quality and freshness of food (such as meat and fish products) - a simple and effective method from which all those involved can benefit - from the retail chain through to the end consumer. gloves, laboratory clothing or protective suits) can change color to indicate toxic substances in the environment or contamination by aggressive chemicals.

// CORE COMPETENCES

1 Photodetector system
for sensoric lab-on-chip applications integrated by means of layering technology

Silicon Processes, Device and 3D Integration In addition to CMOS technology, this core competence breaks down into the following areas of work: 3D integration / MEMS technology Thin wafer technology Epitaxy

VS-RS proximity lithography (150, 200 mm) Wafer fusion bond (SFB) Electroplating for copper and tin (100, 150, 200 mm) Wet chemical Si structuring with KOH (150 mm) Release etching with HF steam (150 mm)

The combination of special processes offers an extensive range of technological options - from flexible solutions through to small wafer quantities. Another particular feature is the process sequence to SFB from structured silicon wafers, allowing for complex MEMS components. Technologies for the production of thin wafers are directly linked to 3D integration. Here Fraunhofer EMFT is able to supply any type of thin device at wafer level, drawing on years of experience and expertise (also documented in the relevant patents). Fraunhofer EMFT is excellently equipped to carry out the relatively elaborate process sequence of thinning technology: it has two grinders for fast material removal, a spin etcher for wet chemical removal of strains, two systems for polishing processes (CMP; chemical mechanical polishing) as well as optical and capacitive thickness measurement to monitor thinning results. Wafer cleaners are available for cleaning purposes for use in follow-up processes. The selection of processes for wafer thinning is based on insights gained from material analytics and the flexure and fracture response of thinned semiconductor substrates, as developed at Fraunhofer EMFT over many years. Fraunhofer EMFT offers the patented dicing by thinning method as a chip separation technique for very thin semiconductor wafers: this allows efficient manufacture of individual ultrathin chips with optimum

A key feature of 3D integration by means of through-platings through the silicon of a circuit (through silicon vias, TSV) is the combination of tungsten vias with the structuring of subsystems based on intermetallic connections made of copper and tin. The various electrical circuits are generally produced, tested and supplied externally at wafer level, independently of one another. At Fraunhofer EMFT they are then vertically integrated by means of standard CMOS-compatible slice production processes in a 3D subsystem (wafer level 3D system integration). The flexibility of the technologies allows solutions to be created which are specifically tailored to customer needs. The following process modules are available: Structuring of silicon by means of STS TS Bosch etching process Electrical through-plating based on tungsten CVD Low temperature processes on thinned wafers Solid liquid interdiffusion of Cu/Sn to assemble subsystems (SLID bond) MEMS technology is based on subsequent process modules for the removal of oxides without adhesion of free-moving MEMS structures.

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flexural strength. These techniques permit the production of silicon chips with a thickness of 10 m - 30 m.

Heterointegration and Foil Technologies With its laboratory facilities and technological experience in

The required distribution of the wafers in chips is carried out by means of dry etching systems which use the Bosch process for high-rate silicon etching. Other focus areas are silicon epitaxy for high-impedance, intrinsic layers and SiGe epitaxy for selectively strained layers or sacrificial layers. Combining Si and SiGe epitaxy it is possible to make new components for microsystems engineering such as NEMS (Nano Electro Mechanical Systems with nanogaps). A low-temperature epitaxy system for silicon and SiGe is currently being established as a consistent refinement of the core competence. Depositions are to be carried out at temperatures as low as - 450 C, thereby allowing further handling of ready-processed CMOS circuits.

the area of polytronic technologies - especially roll-to-roll manufacturing technology for foil systems - Fraunhofer EMFT has at its disposal a unique technology platform for the development of multifunctional electronic systems. One area of focus here is heterointegration: the merging of distinct technological worlds paves the way for new, effective solutions to produce components and systems and to integrate systems in flexible substrates. Fraunhofer EMFT combines developed print technologies with technologies and processes from various conventional technological fields (e.g. silicon, MEMS or circuit board technology). These technologies can be diversified and supplemented as needed. What is more, the interfaces between the technologies can be adapted to the application in question. The processes can also be transferred to large-area and large-volume production procedures for system integration and for product manufacture on flexible substrates. Mobile electrostatic carrier With its patented concept of the mobile electrostatic carrier, Fraunhofer EMFT offers a technical solution which enables simple and secure handling of very thin semiconductor wafers. These so-called e-carriers draw on electrostatic forces to reversibly fix a fragile circuit substrate. The carrier itself consists of a silicon wafer of which the electrode surfaces on the front can be electrically charged and discharged by means of through silicon via (TSV) technology using the contact surfaces on the back. In 2011 these carriers with bipolar electrode configuration were also applied to silicon wafers with a diameter of 200 mm for the first time. 27

// CORE COMPETENCES

1 TUDOS microdosage
system for dosage of cytostatics in tumor therapy

Multilayer and through-plating processes Fraunhofer EMFT has many years of experience in the production of high-density wiring systems on foils with conductor path grids of 30 m and less. These enable direct chip integration. However, several conduct path systems usually have to be applied to achieve an efficient layout and increased packaging densities. These are obtained either by means of a multilayer structure on one substrate side or by using the back of the foil for double-sided wiring for the latter. A process technique has been developed at Fraunhofer EMFT which allows continuous manufacture using the roll-to-roll method. Here a via bore is carried out using a combination of laser processing and plasma etching. Other key stages here are electroplating processes to create a number of copper conductor paths several m thick as well as wall metallization of the through-platings. Organic electronics Organic semiconductors are regarded as the material of the future for the production of electronics with additional function since they can be handled using efficient plastics engineering processes. Over a period of more than ten years, Fraunhofer EMFT has acquired broad expertise in roll-to-roll manufacturing - for example of contactless smart sensor applications or complementary organic electronics applied directly to foil substrates. The institutions extensive expertise includes specially developed process stages used to advance the miniaturization of organic components in the m and sub-m range; for example, Fraunhofer EMFT is involved with transistors in this area. For this purpose, novel structuring techniques such as nanoimprinting and microcontact printing have been deve28

loped, as well as processes for the deposition of ultrathin polymer dielectric layers on roll substrates. When scaling transistor geometry down to smaller dimensions, particular importance is attached to the dielectric medium for gate insulation. In view of the increasingly thin layers, errorfree electrical insulation and a high voltage rating has to be ensured. At Fraunhofer EMFT it is already possible to produce layers with a thickness of just 200 nm and an extremely high level of dielectric strength. Increasing miniaturization is a key requirement in order to further raise the switching frequencies of organic transistors, for example, which are currently at 100 kHz. These issues were investigated as part of the EU-sponsored projects INTERFLEX (ICT 247710), COSMIC (ICT 247681) and POLARIC (ICT 247978).

Systems and Prototypes This core competence includes the subareas of system development as well as the analysis and testing of systems. Development expertise includes hardware and software, electronics, mechanics, optics and fluidics with micropumps and microvalves. It is based on the longstanding experience of Fraunhofer EMFT staff in the development of complex systems. Services provided by Fraunhofer EMFT in the field of system development range from the initial concept through to feasibility demonstrators and prototypes, according to needs. Both microcontrollers and PCs are used for control purposes. In the area of analysis and testing, Fraunhofer EMFT has a wealth of experience in investigating the causes of complex errors and reliability problems in electronic components. The institution has developed solutions for ESD and other reliability tests for over 20 years, either under contract to customers or in the context of joint projects. Fraunhofer EMFT experts are able to support customers with special methods of analysis, specialized equipment and services to identify error causes and to harden technologies. The expertise portfolio also includes multiparametric characterization on the wafer or in the system. Among other things, high current pulses are generated with ps rise times and measured with a single-shot bandwidth of up to 50 GHz. The main application of this technology is the development of high-performance ESD protection concepts based on integrated, discreet protective elements. These devices can also be used to determine system responses directly in time domain to individual events which are difficult to reproduce.

CW high-frequency measuring technology can penetrate the lower mm wave range with up to 110 GHz and is supplemented with field and circuit simulations using Agilent ADS. Finding the causes of complex errors and reliability problems in electronic components requires many years of experience with the various development and manufacturing processes throughout the entire supply chain as well as the stress profiles occurring in the application. The expertise of Fraunhofer EMFT staff also provides a valuable basis for successful robustness validation as has been established in automotive electronics.

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/ / R e S ear C h f I e L D S an D S erv I C e S

1 Chips on wafer connected by means of flip chips

2 Fraunhofer scientist in
the laboratory at the FCB3 bonder

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FraUNHOfEr EMFT raNGE Of SErVICES

Microelectronics and microsystems engineering are key innovation drivers in virtually all product areas and sectors of the economy. This is why the areas of application at Fraunhofer EMFT are diverse, ranging from mechanical engineering, automotive electronics, mobile phones and consumer electronics to medical technology and chemical process engineering. Benefits to companies in collaborating with Fraunhofer EMFT include the capacity to explore new types of functions and areas of applications, increased miniaturization, enhanced energy efficiency, low production costs and a high degree of reliability. Fraunhofer EMFT supports its clients throughout the entire development process - from the initial idea right through to implementation. The range of services the institution offers its customers and partners includes the following: Studies Technology analyses Feasibility studies Assessment in the case of damage claims Analysis and Testing Problem cause and risk analysis Robustness and reliability Electrical and physical characterization and load (e.g. ESD) Seminars and training programs Orientation talks Customer-specific workshops Technology concepts and development Industrial contract research and development Customer-specific adaptations Prototype development through to small series Start-ups and joint ventures Creation of a new company through to commercialization of products and systems Manufacturing processes Overall process System response Participation of industrial partners via joint ventures Joint projects funded publicly or by industry, e.g. BMBF, German federal states or the EU Coordination of industrial project consortia Consultancy for national and EU research applications Development of ESD protection structures and concepts

R&D for publicly funded projects

Modeling and simulation

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/ / R E S E A R C H F I E LDS A N D S E R V IC E S

1 Fraunhofer EMFT
scientist at simulation system

FraUNHOfEr EMFT raNGE Of TECHNOLOGIES

C ut t ing- e dge i n fra s tru ctu re , a b ro a d ra n ge of tec hnol ogi es and wel l -dev el oped network of par t ner s in indust r y a s we l l a s a mo n g re s e a rc h i n s ti t utes (uni v ers i ti es ) and publ i c authori ti es make F raunh of er EMFT a n a t t r a c t iv e p a rtn e r i n re s e a rc h a n d d e v el opment, of i nteres t to s mal l and medi um-s i z ed c om panies as w e ll a s la r ge r-s ca l e i n d u s tri a l e n te rp ri s e s. M arketi ng the res ul ts of res earc h i s general l y the res p onsibilit y of t he c or por a te p a rtn e r. S i n ce 2 0 0 7 , Fraunhofer EM F T has al s o offered hi gh-tec h c ompani es t he oppor t unit y t o hire a n d u ti l i z e i ts h i g h -q u a l ity fac i l i ti es (s uc h as c l eanrooms , l aboratori es , workshops and e quipm e nt ) . S e v e ra l co mp a n i e s h a v e e n tered i nto s trategi c c ooperati on wi th F raunhofer EM F T - including S ie m e ns A G, Ke te k G mb H , P a n a s o n i c, S s s M i c roTec G mbH , Thi n M ateri al s and T V Sd. F rame w or k con t r a c t s a re be i n g p re p a re d wi th a n u m b e r of others c ompani es . H ere i s a s el ec ti on of the tec hnological f a c ilit ie s a v a il a b l e a t F ra u n h o fe r E M FT: 200 mm CMOS technology Wet chemical cleaning and etching processes Photolithography Epitaxy (Si, SiGe) Ion implantation and annealing Dielectric layers (thermic oxidation, LPCVD deposition of SiO2 and Si3N4, PECVD of SiO2 and Si3N4) Highly conductive layers (Al/Si, Ti, W, doped poly-Si) Plasma etching processes (Si, SiO2, Si3N4, Al, W) Electroplating (Cu, Sn) Analytics and material characterization Atomic force microscope (AFM): measurements of surface roughness and step measurements up to max. 6 m Proximity exposure Double-sided exposure Contact exposure Electron ray exposure Ion ray exposure i-line stepper Nanoimprint In-line REM (Schottky emitter) and focused ion beam (Ga-FIB) with EDX and gas injection system (GIS) Spectral ellipsometer: measurement of thin layers and transparent materials Spectrometer: measurement of layer thickness of silicon (thick layers) and infrared permeable layers Target grinding device for sample preparation (grinding accuracy: 2 m) 32 Si-MEMS technology Cleanroom technology for 150mm wafers (silicon, ceramics, glass) Metal coating (Cu, Ti, TiW, Pt, Au, Ni) Dielectric layers (SiO2, Si3N4, SiC, PI) Wafer bonding, bonding techniques by means of adhesion Structuring with mask aligner 2 m

200 mm lithography cluster

1 1

X-ray diffractometry (XRD): measurement of SiGe content CVD epitaxy system: quality control of ultrapure gases Plasma-supported etching and deposition systems to test gas compounds Wafer prober for electrical characterization

Analysis and testing Semi-automatic wafer prober up to 300 mm using thermoprint (-55C to +300C) and laser semiconductor parameter analyzers Network analyzers MHz to 110 GHz and Simulator Agilent ADS Generation and measurement of high-current pulses in the ps and ns range Electrostatic discharge characterization and load (CDM, HBM, TLP, VF-TLP, CC-TLP) 160 cc climate chamber Measuring station for biochemical/chemical sensors: gases and liquids Electrochemical impedance spectroscopy Environmental test chamber 100 cc - moisture and gases Oscilloscope

Application of large-area electronics and flexible substrates to foil sheets and using the roll-to-roll method Hot roll laminator for double-sided lamination In-line coating system for liquid coatings such as photoresist, dielectrics and passivation Sputter system for double-sided metallization of chrome and copper UV lithography with high resolution (5 15 m structure width) Wet-chemical etching techniques for structuring metals Screen printing on foil sheets Screen printing using the roll-to-roll method Galvanic deposit of copper on premetallized foils Laser processing for cutting, marking and drilling various materials Plasma process for surface conditioning and reactive etching of polymers with nitrogen, oxygen and CF4 Foil mounting and bonding technology

Substrate processing Wafer grinding Spin-etching Chemo-mechanical polishing (CMP) Wafer cleaning Contactless wafer thickness measurement Flexural and breakage test devices for thin substrates and chips

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/ / Cu S T omer S an C oo P era T I on P ar T ner S

1 Fraunhofer scientist
holding glass wafer

2 MOTT logo

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TECHNOLOGY NETwOrKS

I n orde r t o e na ble e ffi c i e n t a n d e ffe c ti ve c o l l a b orati on wi th i ndus try and dev el op produc t i deas i nto concrete a pplic a t ions m o re s wiftl y, Fra u n h o fe r E M F T has es tabl i s hed three tec hnol ogy networks for s pecif ic th emes a nd re se a rc h a re a s . T h e s e a re a i me d a t l ongs tandi ng c us tomers and dev el opment partners as well as new c ust om e r s wh o wi s h to d ra w o n e xp e rt s upport to i mpl ement thei r i nnov ati v e produc t i deas . Multifunctional On-Top Technologies (MOTT) The development center for multifunctional on-top technologies (MOTT) for standard silicon and CMOS was founded in 2009. Building on the results of previous research into CMOS circuits and 3D-integration, the Munich site offers a technology platform for microsystems and nanosystems engineering which is designed to enable industry to carry out rapid system development closely geared towards end products. The platform supports modular integration of new functions and components in existing silicon standard technologies, resulting in cost-effective solutions even for small and mediumsized companies. A large number of coating and structuring processes for Center for Microsystem Integration Munich (CMM) Together with leading Bavarian companies, Fraunhofer EMFT initiated the founding of the Center for Microsystem Integration Munich (CMM) in 2010. Pooling of the extensive expertise of prestigious partners in the field of technology and product development makes the CMM a high-performance, efficient technology network in the field of microsystems engineering. The CMM acts as the nucleus for a microsystems engineering center and is looking forward to further expansion as it is joined by further experts. foils are developed in collaboration with industry focusing on research projects and development activities for flexible, organic and large-area electronics (FOLAE). The equipment used is consistently designed to process rolls of foil. Current focus areas are functional integration via active organic materials, the assembly of sensors in polymer technology and the creation of large-area, flexible wiring systems. The Bavarian Polytronic Demonstration Center is a technology cluster which enables development of the necessary production processes, including low-cost microsystems. Bavarian Polytronic Demonstration Center (BDP) Providing a networked environment geared towards human needs (Ambient Assisted Living, AAL) requires cost-effective, multifunctional, ubiquitous systems. In order to establish the infrastructures needed for this purpose, electronic systems have to be produced economically in large volumes on largearea substrates.

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/ / C U ST O M E R S A N D C O O P E R A TI O N P A R T N E R S

1 Fraunhofer EMFT
scientist at the wafer prober measuring station

INdUSTrY aNd PrOJECT ParTNErS

T he suc c e ss o f F ra u n h o fe r E M FT i s fo u nded upon s trong i ndus try and proj ec t partners and a n abovea v e r a ge le v el o f cu s to me r s a ti s fa c ti o n . *

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* This double page shows the logos of some of our project partners. If you are a customer and you do not see your logo here but would like to be included in the next annual report, please let us know!

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/ / C U ST O M E R S A N D C O O P E R A TI O N P A R T N E R S

1 European flags in the

wind

EUrOPEaN COmmUNITY PrOJECTS

F r a unhof e r E M F T i s i n vo l ve d i n a n u mb er of European C ommuni ty proj ec ts , c ol l aborati ng wi t h par t ner s f rom sc ie nc e a n d i n d u s try to re s e a rch i nto and dev el op future-ori ented s ol uti ons tac kl i ng maj o r challenge s t ha t f a c e s o c i e ty to d a y. i-Tex - ICT 288262 The FP7 project i-Tex - Intelligent and luminous textiles (www.i-tex.nl) - researches and develops energy-efficient, large-area lighting systems based on inorganic light-emitting diodes (LED). Coated textiles with reliable integrated electronics including LED, sensors and drivers open up a whole new range of application scenarios both indoors and outdoors in architecture as well as facilitating user interaction. The aim is to develop robust assembly and interconnection techniques for commercial components and scale these to the roll-to-roll processes and standards commonly applied in the textile industry. This also includes demonstrating reliability. POLARIC - ICT 247978 The aim of the project is to create high-performance organic, integrated circuitry on large substrate areas. This means increasing switching frequency into the MHz range and reducing the supply voltage to battery level as well as reducing power consumption and increasing production yield. A key element of the POLARIC project is the miniaturization of organic circuits in the sub-m structure range using new structuring methods such as nanoimprint. At the same time, the manufacturing process is optimized with a view to achieving higher throughput with roll-to-roll methods and large-area substrates. Interflex - ICT 247710 In the project Interflex, new assembly and interconnection techniques are drafted and developed so as to be able to produce multilayer foil systems in larger quantities. In order to demonstrate that these technologies are application-ready, Fraunhofer EMFT is involved in a consortium developing a triple-layer foil-based, flexible sensor system which allows various air parameters to be monitored in interior spaces such as humidity, temperature and CO2 concentration. This system-in-foil is energy-autonomous and made up of various subsystems providing the functions of energy harvesting and storage, measurement data capture and analysis as well as wireless data exchange via RF. Due to the temperature sensitivity of the foil substrates, research work is focusing on glue-based integration methods. In 2012, research activities were geared towards reliability testing of the various foil components and those assembled on foil substrates such as solar cells, batteries, printed resistors, foil vias and foil microvias. A key criterion for assessing integration technologies is reliability under flexural stress. It has been demonstrated that the components and laminates under examination well satisfy the defined specifications in terms of resilience to flexural stress.

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COLAE - ICT 288881 Commercialization Clusters of OLAE (Organic and Large Area Electronics) (COLAE) is a European initiative which promotes the commercial use of organic and large-area electronics. OLAE technology provides opportunities for new product ideas, combined with low-cost manufacture, energy-efficiency and environment-friendly materials and processes. Since this is a young technology, there are currently very few companies in Europe who are active in this field and working on product development. COLAE therefore aims to raise the profile of OLAE among potential end users in Europe and point the way forward to innovative product developments. In order to achieve this aim, demonstrators are developed and training programs organized for potential industrial clients. COLAE also seeks to open up new areas of application for OLAE as well as identifying the main needs and challenges relating to research and development. COSMIC - ICT 247681 The project COSMIC has set itself the aim of developing the electrical properties of organic thin-film transistors to achieve a performance range required for application in ID tags, display drivers or other integrated circuits. A key element of the project is the development of a complementary and significantly more robust circuit technology with p-type and n-type conductive organic materials. Development is carried out on various production platforms so as to cover the different fields - from applications with a high degree of integration density through to low-cost mass products. The results of the project can be deployed in a diverse range of application areas such as medical technology, environment, energy, leisure, security and mobility.

NanoMend - ICT 280581 The project NanoMend is dedicated to the development of new technologies to reduce microdefects and nanodefects on thin, coated, large-area foil substrates. Surface defects can arise in various phases of the manufacturing process and have a negative impact on the efficiency and yield of the process as well as on the quality and lifetime of the products. Conventional methods are not able to detect and repair such defects on a micrometer and nanometer scale. For this reason, the project focuses on identifying and characterizing as well as eliminating and repairing this type of defects. These are used in manufacturing such items as flexible illuminants, flexible voltaics, coated packaging materials, billboards and screens. SMART-EC - ICT 258203 The aim of the SMART-EC project is to develop energy-autonomous (EC) components. For this purpose, thin foil-based EC transistors are integrated on flexible substrates with functionalities for energy harvesting and storage. The primary goal is to improve the energy efficiency of the components so as to make the applications more convenient and reliable. The results of the project can be used in such areas as automotive, ID cards and smart packaging. On this project, Fraunhofer EMFT is developing assembly methods for foil subsystems on foil substrates. The aim will be automation using a pick-andplace machine and optical quality control. A new method is also being investigated to integrate ICs on foil.

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/ / C U ST O M E R S A N D C O O P E R A TI O N P A R T N E R S

1 Fluorescence indicators
in solution

e-BRAINS - ICT 257488 The Fraunhofer EMFT is involved in the large-scale integrated project e-BRAINS, funded by the European Commission. e-BRAINS stands for Best-Reliable Ambient Intelligent Nanosensor Systems by Heterogeneous Integration. The aim is to provide technologies for future applications in the field of Ambient Assisted Living which require integration of heterogeneous technologies. One of the main tasks here is to develop suitable and reliable 3D integration technologies for future MEMS/IC products. The e-BRAINS project also involves selective evaluation of medical (DNA sensors and active implants) and safety applications. The project partners are Infineon Technologies (Project Coordinator), eesy-ID, ELA Medical, IQE, Magna Diagnostics, SensoNor, Siemens, Vermon, DMSC (majority owned by Intel Mobile Communications), CEA, EPFL, IMEC, ITE, SINTEF, TUC, TUG, Fraunhofer IIS-EAS and Fraunhofer EMFT (Technical Manager).

CONTEST - ICT 317 488 The FP7 ITN Marie Curie project CONTEST researches into and develops technologies for the electronic skin as a synonym for flexible, compliant electronic systems. The focus is on multifunctional electronics, pliable and flexible large-area electronics and the combination of organic and silicon-based solutions. The electronic skin will simultaneously capture sensoric information over large areas, significantly enhancing the cognitive abilities of robots and the man-machine interface. 14 scientists are involved along with eight companies and research institutes who are leaders in this field.

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UNIVErSITIES
I n orde r t o pur sue its re s e a rc h g o a l s c o n s i s te n tl y , F raunhofer EM F T engages i n c ol l aborati v e res earc h and proj ect s w it h a num b e r o f u n i v e rs i ti e s i n G e rm a ny and el s ewhere i n Europe.

Universitt der Bundeswehr Mnchen It was in 1973 that the first officers and cadets commenced studies at Universitt der Bundeswehr Mnchen (UniBwM), one of the few campus universities in Germany. The 140 ha premises house all the facilities required by students and lecturers for successful learning, teaching and research. The link between the UniBwM Faculty of Electrical Engineering and Information Technology and Fraunhofer EMFT has been intensified in recent years as a result of close staffing connections. In addition to the Fraunhofer EMFT Director Prof. Kutter (Professorship for Solid State Technologies), Prof. Maurer (Professorship for Integrated Circuits and Electronic Components) has also taught at UniBwM since 2012. The cooperation originated under Prof. Eisele, who was appointed UniBwMs first Emeritus of Excellence and also works at Fraunhofer EMFT. The aim of the cooperation is to establish a development center for Multifunctional On-Top Technologies for Standard Silicon and CMOS (MOTT) for the modular integration of innovative and new functionalities and components in existing standard silicon technologies. This cooperation allows UniBwM, Fraunhofer EMFT and industrial companies to benefit mutually and jointly advance development work - from high-risk research through to product maturity and implementation. Fraunhofer EMFTs USP lies in the area of add-on technologies and its ability to supply the necessary expertise in combining these with standard technologies.

Technische Universitt Mnchen Fraunhofer EMFT deepened its ties with Technische Universitt Mnchen last year. Collaboration in the field of simulation of processes, components and MEMS was started with Prof. Wachutkas Chair. The aim of this partnership is to strengthen Fraunhofer EMFTs expertise in this area. There are plans for joint doctoral dissertations on various preliminary research topics. Collaborative themes are also being discussed with other Chairs. University of Regensburg The Fraunhofer EMFT Working Group Sensor Materials was founded at the Regensburg site in May 2009. In close collaboration with the University of Regensburg, the Sensor Materials Working Group is being established with the financial support of the Bavarian Ministry for Trade, Infrastructure, Transportation and Technology through the regional government of the Upper Palatinate. Cooperative ventures are currently in place with the Chair for Analytical Chemistry, Chemosensorics and Biosensorics. Here, fundamental optical sensoric techniques are being developed which can be integrated by joint transfer in applications in the areas of health care, life sciences and environmental analytics. This includes sensors for measuring air pressure, temperature, oxygen, exhaust gas pollutants and ozone. Trace analysis measuring techniques are developed to determine analytes in the gas phase, in solutions and on the surfaces of solid materials. The Chair for Analytical Chemistry, 41

/ / C U ST O M E R S A N D C O O P E R A TI O N P A R T N E R S

1 Visit by Prof. Wu (Tongji

University, Shanghai) to Fraunhofer EMFT. In attendance: Prof. Bock, Prof. Kutter, Prof. Wu, Dr. Nebrich (from left to right)

Chemosensorics and Biosensorics also possesses considerable expertise in the field of biosensorics using physical transducers such as plasmon resonance (SPR) and impedimetry. The cooperation between the Sensor Materials Working Group and the University of Regensburg is constantly expanded through joint acquisition of sponsored projects, participation in lectures and joint support for students.

of semiconductive molecules. This can be brought about by applying technological methods to influence surface states, e.g. microstructuring and nanostructuring of the technological surfaces by depositing molecular interface layers. Politehnica University of Bucharest (UPB), Romania The University POLITEHNICA of Bucharest developed from

Other research topics are in the areas of adhesion, interdiffusion barriers, electrical contacting of polymers and the self-arrangement and selective electronic alignment of semiconductive polymers. The more stable and more efficient layer systems thereby created serve to enhance the stability and reliability of the components of which they form a part - after all, many problems of reliability can be traced back to uncontrolled or impaired boundary layers. Technische Universitt Berlin Technische Universitt Berlin and Fraunhofer EMFT are linked by the Professorship for Polytronic Microsystems under Professor Karlheinz Bock. The aim in this area is to conduct research into the workings of polytronic components and systems. Polytronic microsystems are made up either partially or wholly of active and passive organic materials for conductor, semiconductor and functional layers (heterointegrated plastic microsystems). This department is dedicated to research into polymers, mainly low-cost coating technologies and the characterization and control of polymeric surfaces and boundary layers in polymeric material composites as well as in hybrid multilayer technologies. Increased mobility of the semiconductive polymer layers is of key importance here and can be achieved by improving the short-range order 42

a polytechnic school dating back to 1864 and was named POLITEHNICA in 1920. It is the most important technical university in Bucharest and in the whole of Romania. The University POLITEHNICA of Bucharest has traditionally maintained collaborative links with Fraunhofer EMFT in Munich through the Faculty of Electronics, Telecommunication and Information Technology (ETTI) and the Department of Electronic Technology and Reliability (TEF). This cooperation allows several staff of the TEF Department to undertake scientific internships at Fraunhofer EMFT. A number of doctoral students from the TEF Department also use the experimental facilities at Fraunhofer EMFT. The collaboration between the two institutions has resulted in joint conference presentations and publications.

VISITOrS aNd dELEGaTIONS

A l arge num be r of v i s i to rs a n d d e l e g a ti o n s o n c e agai n c ame to F raunhofer EM F T i n 2012 to engage in d i al o gue w it h F r a un h o fe r re s e a rc h e rs a n d d e vel opers and take a c l os er l ook at the i ns ti tuti ons o ut s tandi n g t e c hnologic a l i n fra s tru c tu re . Student delegation, Postech Pohang University of Science and Technology, Korea, February 3, 2012 Prof. Peter Lieberzeit, Professor for Analytical Chemistry at the University of Vienna, Austria, February 10, 2012 Prof. Paul Svasta, Ph.D., Dr. h.c., Politehnica University of Bucharest, Romania, Head of Center for Technological Electronics and Interconnection Techniques, March 19, 2012 Assoc. Prof. Norocel Codreanu, Ph.D., Politehnica University of Bucharest, Romania, April 13 - 18, 2012 Center for Technological Electronics and Interconnection Techniques, April 13 - 18, 2012 Student delegation of the Institute of Electromechanical Constructions, TU Darmstadt, June 14, 2012 Business delegation from Turkey, Regional Innovation Center in Konya , Turkey, June 25, 2012 Delegation of the NSTC, Korea, under Dr. Lim, June 28 - 29, 2012 Delegation from the University of Microelectronics MIET, Moscow-Selenograd, October 22, 2012 Student delegation from the University of Landshut, July 14, 2012 Prof. Wu, Tongji University, Shanghai, China, July 11, 2012 Delegation of students and lecturers from Chonnam National University in Gwangju, Korea, July 3 - 4, 2012

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/ / C U ST O M E R S A N D C O O P E R A TI O N P A R T N E R S

1 Fraunhofer EMFT
scientist in cleanroom at the inline REM

BaVarIaN INNOVaTION CLUSTErS

T he Ba v a r ia n g o v e r n me n t ru n s a cl u s te r offens i v e to s upport the c ompeti ti v e c apac i ty of Bav arian com panie s in 19 k e y s e cto rs . F o r th i s p u rp o s e i t has s et up c l us ter pl atforms throughout Bav ari a t o prom ot e ne t w or k ing a m o n g c o mp a n i e s a n d re s e a rc h i ns ti tuti ons . The c l us ters hel p c ompani es bec ome involved in joint produc t d e v e l o p me n t, o p ti m i z e i n t er nal proc es s es and j oi ntl y c onquer markets . F raunhof er EMFT is c lose ly inv olv e d i n th e fo l l o wi n g c l u s te rs : Sensorics cluster Sensors connect technology with our everyday world: they trigger airbags in a fraction of a second, position tiny computer components to the nearest thousandth of a millimeter and measure the level of carbon dioxide in the air. In anything from household appliances to hightech medicine, there is virtually no system that operates without sensors - and the majority of sales in this sector in Germany are generated by Bavarian companies. Bavaria has rightly been referred to as the number one site for sensorics in Germany (source: Cluster Sensorik Bayern). The organization Strategische Partnerschaft Sensorik e.V. in Regensburg is the platform for sensorics as part of the cluster offensive of the state of Bavaria. The association has more than 50 members, including companies and institutes from the worlds of business and science. Fraunhofer EMFT is a founding member of the sensorics cluster and regularly provides information and presentations within the network as well as running its Sensor Materials Working Group at the Regensburg site. Members of the Bavarian sensorics cluster are among Fraunhofer EMFTs customers and cooperation partners. Based on the belief that cooperative partnerships are ultimately superior to competition, Fraunhofer EMFT has set itself the goal of supporting Bavarian small and medium-sized companies through this cluster. Microsystems engineering cluster Fraunhofer EMFT has been involved in in the microsystems engineering cluster ever since it was set up. Several specialist talks have been given at cluster events, for example, and a presentation stand was provided to support the accompanying exhibition at the MST symposium in Landshut. Links continued to be cultivated in 2012 and talks were held to look at how collaboration could be intensified or extended. As a result of this, Fraunhofer EMFT has responded to the MST clusters endeavors to promote a more intensive networking process by organizing meetings of cluster members in the companies and institutions. Fraunhofer EMFT will be hosting a meeting of members on April 23, 2013. Participants will be invited to take a tour of the laboratories, inspiring them to make use of the excellent resources available in the form of machines, technological process engineering and staff experience.

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NeZuMed - Network for innovative suppliers in medical technology The scientific institute for innovation and consultancy senetics Dr. Wolfgang Sening founded the network for innovative suppliers in medical technology (NeZuMed) in 2011, in collaboration with the East Bavaria innovation offensive (ISS) initiated by the Bayreuth Chamber of Industry and Commerce of Upper Franconia. The aim of the network is to establish an innovative organization for research and development in medical technology. The focus here is mainly on supporting small and middle-sized companies based in Franconia, Bavaria and Thuringia who have built up their expertise over many years. Network collaboration will make it easier for them to become established on a lasting basis within the interdisciplinary medical technology market. The network is a platform on which to define and implement measures to serve the advancement of medical technology and related fields. By involving all industrial partners and the user side very early on, the aim is to promote the development of market-oriented and innovative components and products in medical technology. The network also serves as an efficient information network to solve interdisciplinary challenges and generate economical, market-oriented solutions by using synergies. Fraunhofer EMFT has been actively involved in NeZuMed since the end of 2012. It takes part in events, trade fairs, workshops, forums, symposiums and conferences. By pursuing these activities, Fraunhofer EMFT aims to generate technological innovations and R&D projects

by intensifying dialogue and knowledge exchange with potential project partners. This ensures that Fraunhofer EMFT and its project partners are always one step ahead!

45

// HIGhLIGhTS

1 Interdigital capacitors on
glass wafer

2 Honorary doctorate
being awarded to Prof. Dr. Dr. Bock

46

SPECIaL EVENTS
Life i s ne v e r dull a t a re s e a rc h i n s ti tu te . S p e ci a l ev ents are al l part of a day s work. Award of honorary doctorate The senate of Bucharest Polytechnic University awarded Prof. Karlheinz Bock an honorary doctorate at a formal session on November 27, 2012. The speech in his honor was given by the Dean of the Faculty of Electronics, Telecommunication and Information Technology. Extract from the speech: In recognition of his energy and intellectual integrity, the ethical perseverance which is so typical of him, his constant endeavor to advance the developing field of polytronic multifunctional systems, flexible systems applied using layering technology and bioanalytical systems, for his outstanding contribution to teaching and research and for his promotion of international relations, it is a great honor for the University of Bucharest to award Professor Karlheinz Bock an honorary doctorate of our university here today: Doctor Honoris Causa Vivat, Crescat, Floreat! A scientific challenge met with excellence Thermogenerators on foil were developed and produced as part of a project funded by the BMBF entitled OTEPS (Organic thermogenerators for self-sustaining polytronic systems). The newly developed paste systems were provided by the project partners Institut fr Mikrotechnik Mainz GmbH and ESL ElectroScience. These paste system systems were used by Fraunhofer EMFT to create three generations of thermogenerators in hemispheric construction and one in meander structure. The main challenge posed by the hemispheric construction was to produce error-free through-platings by means of screen printing for a thermogenerator. At Fraunhofer EMFT, a special process and a new formulation of the paste by ESL Electro-Science were used to demonstrate a high yield of through-platings made by means of screen printing. 4,400 through-platings had to be printed without error in order to produce a functioning thermogenerator on foil. For the meander structure, a new technique of plasma structuring on PI foils was developed as part of this project. For thermogenerators in meander structure, thermogenerators have to be made through the foil (through-platings). The plasma structuring etches the through-plating in a single process stage, thereby creating the necessary openings in the foil at the same time. The thermogenerator foils developed in the project can be integrated in solar collectors. This combination, for which a patent has been applied (patent no.: DE 10 2012 209 322.2), was set up as a demonstrator and implemented.

47

/ / E ven T S an D Y ou T h D eve L o P men T

1 Fraunhofer EMFT staff in

cleanroom

2 Scientist in the lab with

school students

48

EVENTS aNd wOrKSHOPS

Fraunhof e r E MF T or g a n i z e s s c i e n tifi c e v e n ts on i ts own premi s es ev ery y ear, as wel l as pres enti ng at numerous e x t e r na l e ve n ts . Fo r e xa m p l e , th e i n sti tuti on regul arl y pres ents i ts l ates t res earc h and dev elop ment wor k a t int e r na ti o n a l tra d e fa i rs a n d c o n gres s es . Suc h ev ents s erv e to attrac t new i ndus tri al proj ect s an d co ope r a t ion pa r tn e rs , a s we l l a s a l l o wi n g a n ex c hange of i nformati on wi th potenti al c l i ents , i nterest ed memb e r s of t he pub l i c a n d e x p e rts fro m o th e r sc i entifi c i ns ti tuti ons . Here a re som e e x a m p l e s . Autumn School An event is held every year as part of the projects COSMIC, Interflex, POLARIC and Smart-EC to allow dialogue between the projects and present the results to a broader public. From November 19 - 20, 2012 the latest results and fundamental insights from the projects were presented at Fraunhofer EMFT in some 20 talks. The focus areas this year were measurement and reliability of components in foil systems, materials for printed transistors on foil and materials for electrochrome displays as part of printed electronics and foil mounting. Forum Be-Flexible Fraunhofer EMFT has organized the international Forum Be-Flexible for over 10 years, inviting researchers, scientists, industry partners and users to engage in a lively exchange. In 2012, this event took place on the premises of Fraunhofer EMFT on November 21 and 22. The event mainly focused on the latest R&D results from the areas Thin Semiconductor Devices and Flexible Electronic Systems along with their product potential and future market prospects. 120 international participants visited the two-day event. Fraunhofer Day at BioPark Regensburg Two Fraunhofer project groups work at the successful Danube Innovation Center. One is Fraunhofer EMFTs Sensor Materials Working Group founded in Regensburg in 2009. The working group presented its research and development results to the press and invited guests as part of Fraunhofer Day on June 14, 2012. During the breaks, experts from the Fraunhofer Board, Biopark, the University of Regensburg and the two Fraunhofer institutes based at Biopark made themselves available to answer questions and engage in discussion with the approximately 60 guests.

49

/ / E V E N TS A N D Y O U T H D E V E L O P M E N T

1 Electronica,
Munich 2012

SEmINarS aNd TraINING PrOGramS

In orde r t o s u p p o rt p a rtn e rs a n d cu s to mers , F raunhofer EM F T offers s emi nars for profes s i ona l develop m e nt , t r a inin g a n d i n fo rm a ti o n p u rp o s e s whi c h are ei ther open to the publ i c or el s e c an be exclusively t a ilore d t o c o mp a n i e s n e e d s a s i n -h o u s e programs . H ere i s a s mal l s el ec ti on of topi c s . ESD device and design seminar This training programs deals with the basics of characterization of integrated circuits in relation to electrostatic discharge (ESD). Target group: Specialists in the design and layout of I/O cells and those working in the field of measuring technology who are interested in the ESD qualification of integrated circuits. Microfluidics: Dosage of minute volumes The seminar provides information on current developments in the field of dosage modules for minute fluid quantities in the nl range. Target group: Specialists in analytics, medical technology, biotechnology, mechanical engineering and process engineering. Training in cleanroom technology and cleanroom practice, in cooperation with VDI and TV SD This seminar focuses on methods for surface programming, This program provides an overview of the norms and parameters applicable to the design of cleanrooms. Personnel behavior and test measurements in the cleanroom are illustrated with examples. Target group: Technologists and specialists in cleanroom technology. analytics, practical experiments and examples of application. Target group: Specialists in production technology and component assembly. Manufacture and handling of thin silicon wafers The seminar provides an overview of current technologies for very thin silicon wafers and describes new concepts for carrier techniques based on a wide range of practical examples from semiconductor technology. Target group: Specialists in semiconductor technology and process planning. Tensile strength testing of semiconductor materials This seminar looks at current methods of analysis, the influence of process technology on the tensile strength of thin silicon wafers and process concepts. Target group: Specialists in semiconductor technology, process planning and process analysis. Self-assembly and surface programming

50

TradE faIrS
Fraunhof e r E MF T a ims to g o o u t to cu s to me rs regul arl y as wel l as draw attenti on to the s c i entifi c a nd technologic a l se r v ic e s p ro vi d e d b y th e i n s ti tu ti on at nati onal and i nter nati onal ev ents . The i ns ti tuti on was rep res e nt e d onc e a g a i n a t s e l e c te d tra d e fa i rs f or thi s purpos e i n 2012. Here i s a n ov e r v ie w ! 3rd Landshut Symposium for Microsystems Engineering Landshut, March 13 - 14, 2012 Smart Systems Integration Zurich, March 21 - 22, 2012 Hannover Messe Hannover, April 23 - 27, 2012 Sensor + Test Nuremberg, May 22 - 24, 2012 LOPE-C Munich, June 19 - 21, 2012 Electronica Munich, November 13 - 16, 2012 COMPAMED Dsseldorf, November 14 - 16, 2012

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/ / E V E N TS A N D Y O U T H D E V E L O P M E N T

1 School girls on a career

orientation placement at Fraunhofer EMFT

YOUTH dEVELOPmENT
F r a unhof e r E M F T h a s b e e n i n vo l ve d i n promoti ng opportuni ti es for y oung peopl e i n tec hno logy f or a num be r of y e a rs . S i n ce 2 0 0 9 th e i n s ti tu t i on has been a partner to the N ati onal M I N T pac t - mo re w om en in MIN T prof e s s i o n s (M I NT = m a th e m a ti c s , I T, s c i enc e and tec hnol ogy ), offeri ng y oung peopl e an insight int o t he oppo rtu n i ti e s fo r tra i n i n g a n d s tudy i n tec hni c al profes s i ons . Work experience for school students Fraunhofer EMFT offers 5-day work experience placements for school students. Here the institution cooperates with various high schools, lower secondary schools and comprehensive schools in Munich and the surrounding area. In March 2012, students from the Willy-Brandt-Gesamtschule and SamuelHeinicke-Realschule visited the Fraunhofer EMFT in Munich to gain a first-hand impression of the institutions work and the everyday working lives of scientists with a mixture of talks and practical tasks in the lab. Talent School In the Talent Schools of the Fraunhofer-Gesellschaft, scientists offer a range of different workshops for young people with an interest in technology who enjoy tackling current scientific issues. Talks with members of the Fraunhofer management team provide insights into the everyday work of scientific researchers both nationally and internationally. The title of the Fraunhofer Talent School in 2012 was Utopia of moving images - on wallpaper, on the cornflakes packet or in a photo album: 10 school students had the opportunity to find out about the technology for assembling foil displays. In four different laboratories, screen printing was used to print foils as display screens, structures were applied to wafer and A 15-strong delegation from TU Darmstadt visited Fraunhofer EMFT in June 2012 including students (electrical engineering and information technology micromechanics and precision engineering), lecturers and doctoral candidates. In addition to a detailed overview of the institution, the visitors were also given a guided tour of selected laboratory areas. Institution scientists also presented current work on radiation detectors. The subsequent evaluation of the event confirmed experience to date that young people are most interested in lab presentations and the introduction to specific research projects. Visit by students at TU Darmstadt After a very busy and intense weekend, the students were pleased with their self-made circuits and foils and were able to take the items home with them. foil using lithography, a control circuit was assembled and electronic components soldered. The components were then measured and tested for functionality.

52

PROMOTING WOMEN IN MINT PROFESSIONS One of the purposes of career orientation weeks at Fraunhofer EMFT is to train school girls to be contributors for other youth development projects. They are then able to go on and share their knowledge with other girls. The following youth development activities in 2012 were especially aimed at building enthusiasm for careers in technology and science among young women. New: Fraunhofer EMFT Vacation Academy Two groups of 31 Allgu students each attended the first Fraunhofer EMFT Vacation Academy organized in collaboration with Kempten University. A technology rally was offered which ran through various of the institutions themes. The rally stations were:

Workshop for female students at TU Mnchen 16 female students from various departments visited Fraunhofer EMFT as part of the longstanding cooperation with the TU Mnchen mentoring program. In addition to information on Fraunhofer and the research areas in which Fraunhofer EMFT is involved, the students were especially interested in measures Fraunhofer has introduced to attract women and support them in their career planning. After the talks and a guided tour of the laboratories, the young women took the opportunity to engage in talks directly with female research assistants. The following issues were of particular interest to them: Which areas are available for masters and bachelors assignments? Which opportunities are available to gain insights into a research institution through placements or student activities? What do scientists have to say about their experience in their job? How is it possible to make contact with individual scientists?

Live research Cleanroom chic - dressing up for cleanliness Vacuum you can touch A micro world enlarged Are foils afraid of water?

In this context, female Fraunhofer researchers taught practical skills in the handling and separation of wafers as well as the structured conditioning of polymer surfaces. They also provided an overview of some of the research areas in which Fraunhofer EMFT is involved. When he welcomed the participants personally, the institutions director Prof. Kutter particularly emphasized the importance of female engineers for the far-reaching work to be done in research and development for the future of society. 53

/ / E V E N TS A N D Y O U T H D E V E L O P M E N T

1 Scientists in the lab with

school students

Shadowing Day Another interesting event is Shadowing Day. This event is organized by the European Commission in collaboration with leading companies so as to take action against the lack of women in the field of information and communication technologies (ICT) and show young women that ICT is not just for computer freaks. Information technology is ubiquitous: it enriches our lives, connecting people all over the world everywhere and all the time. It even helps save lives! Yet there are still not enough young people opting for a career in information and communication technologies - in particular, there are too few women. In 2012, as in previous years, a school girl shadowed a female scientist for an entire working day, later reporting on her experiences in Brussels. Young prizewinners win Fraunhofer EMFT workshop Their outstanding entry for the Technology Scout competition was recognized by the Bildungswerk der Bayerischen Wirtschaft with a special prize. Five school girls in the 7th grade at Pirckheimer Gymnasium, Nuremberg, won a day at Fraunhofer EMFT: they visited various laboratories with their teacher and carried out handson activities themselves in the institutions cleanrooms. The technological highlight for the students was sawing wafers. General excitement was caused by the impact of an unintentional wafer breakage in the spin dryer.

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CarEErS aT FraUNHOfEr EMFT

Man y y oung pe ople o p t to b e g i n th e i r c a re e r a t F raunhofer EM F T. The i ns ti tuti on offers an ex c el l ent s t ar t fo r trai ne e s in re se a rc h , s ci e n c e , te ch n o l o g y a n d admi ni s trati on. Students i n the fi el d of phy s i c s , el ec tr ical en gi n e e r ing, proc e ss e n g i n e e ri n g , b i o ch e m i s try and rel ated areas hav e the opportuni ty to be i nv ol v ed in ap pl i ed re se a rc h a t a p ra c ti ca l l e v e l . T h e y c a n ta ke an i nter ns hi p, work as a res earc h as s i s tant, wri te th eir di p l o m a / ba c he lor s/ ma s te rs a s s i g n me n t o r e v e n a doc torate.

I found out about training opportunities at Fraunhofer EMFT during an internship and put in an application. I got in right away: I started training as an IT specialist for system integration in September 2009 and completed the course successfully last autumn. I especially liked the fact that my trainers taught me much more than just the prescribed standard material - I now know a number of practical tricks to solve awkward problems. All my colleagues were very friendly and they were always willing to help out if I had a question. After three years at Fraunhofer EMFT I can definitely say: I have turned my hobby into my profession. (Philipp Rhee, age 21, staff member in the IT department)

I wrote my masters thesis on the topic of Immobilization of DNA oligonucleotides on foil substrates at Fraunhofer EMFT. For this I was able to draw on my two interdisciplinary courses - biological engineering and a masters in microtechnology and nanotechnology - as well as contributing some ideas of my own. I also thought it was great to be involved in putting on workshops and mentoring programs for school and university students and inspire others to take up science. (Stefanie Bauer, age 26, masters student in the Polytronics and Multifunctional Systems Division)

After completing my degree in electrical engineering and information technology at TU Mnchen in 2008 I really wanted to be able to apply my knowledge to the practical development of systems, but still retain the freedom of scientific thinking. At Fraunhofer EMFT I was offered the opportunity to establish system development expertise for microfluidic dosage systems and use the insights gained for my doctoral thesis. (Sebastian Kibler, age 29, research assistant in the Micromechanics, Actuators and Fluidics Division)

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/ / A C a D em I C P u P L I C a T I on S an D T a L K S

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1 68

ACADEMIC PUBLICATIONS AND TALKS

Co mmunic a t iv e e x c h a n g e i s v e ry i mp o rta n t i n s c i enc e and res earc h. F or thi s reas on, F raunhofer EMFT sci enti st s onc e a ga in p u b l i s h e d th e i r i n i n s i g h ts i n v ari ous forms i n 2012. The fol l owi ng c ompi l ati on is a smal l se le c t ion of t h e a ca d e mi c p u b l i c a ti o n s a n d tal ks by F raunhofer EM F T s c i enti s ts .

Publications Ohlander, A.; Hammerle, T.; Klink, G.; Zilio, C.; Damin, F.; Chiari, M.; Russom, A.; Bock, K. DNA melting curve analysis on semi-transparent thin film microheater on flexible lab-on-foil substrat Proc. of the International conference on Miniaturized Systems for Chemistry and Life Sciences (TAS), Okinawa, Japan, 2012, M. 8.180

Richter, M. Hochdruck-Mikropumpe fr anspruchsvolle Anwendungen Fraunhofer VE Microelectronic News, June 2012, p. 15 Landesberger, C.; Yacoub-George, E.; Bock, K. Modular system integration on flexible film substrates EE Times Europe, June 2012 Nettinger, K.; Schaber, U.; Drost, A.

Alberti, M.; Meixner, L.; Rckerl, A.; Eder, M.; Endres, H.-E.; Bock, K. Sensorfilter ein intelligentes Mikro-Filtersystem in Folientechnologie fr Anwendungen in Prozesskontrolle, Zellkultur und Life Sciences Procedia Engineering 47, 2012, p. 212-215 Nebrich, L. Effektivere Diagnosen durch neues Sensorelement Fraunhofer VE Microelectronic News, September 2012, p.16

Anwendung des Plasma-tzens in der Rolle-zu-Rolle Prozessierung von Folien PLUS Nr: 4, May 2012, pp. 937-1208, Bd. 14, ISSN 14367505 Bock, K. Vor-Ort-Diagnostik, neuartige Lab-on-a-Chip-Analysesysteme GIT Labor-Fachzeitschrift 4/2012 Nebrich, L.; Wiest, F.

Endres, H.-E. Intelligenter Mikrofilter berwacht seinen Beladungszustand Fraunhofer VE Microelectronic News, June 2012, p. 9

Hochempfindliche Strahlungsdetektoren fr medizinische Anwendungen Tagungsband 3., Landshuter Symposium Mikrosystemtechnik, March 2012, pp. 245-253

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/ / A C A D E M IC P U B LIC A TI O N S A N D T A LKS

1 Basic unit of a highgrade steel micropump

Endres, H.-E.; Alberti, M. Sensorfilter: Intelligenter Mikro-Filter in Folientechnologie fr Anwendungen in Prozesskontrolle und Zellkultur Sensor Magazin 1/2012 March 2012, p. 38 Nebrich, L. X-ray detectors to discover dangerous substances Fraunhofer VE Microelectronic News, March 2012, p.11 Nebrich, L.; Wiest, F., Eisele, I. Highly Sensitive Radiation Detectors for Medical Applications Proc. Smart Systems Integration, Zurich, March 2012

Klumpp, A.; Ramm, P. Temporary Adhesive Bonding with Reconfiguration of Known Good Dies for Three-Dimensional Integrated Systems Handbook of Wafer Bonding, Wiley VCH, ISBN 978-3-52732646-4, Weinheim, 2012 Landesberger, C.; Klumpp, A.; Bock, K. Temporary Bonding: Electrostatic Handbook of Wafer Bonding, Wiley VCH, ISBN 978-3-52732646-4, Weinheim, 2012

Talks Garrou P.; Jian-Qiang Lu, J.; Ramm, P. Three-Dimensional Integration Handbook of Wafer Bonding, Wiley VCH, ISBN 978-3-52732646-4, Weinheim, 2012 Klumpp, A.; Nebrich, L.; Eisele, I. Heterogene Systemintegration von Halbleitersensoren Microsystems Technology in Germany 2012 / Mikrosystemtechnologie in Deutschland 2012, Trias Consult Johannes GmbH, 2012, pp. 34-35 Ramm P., Lu Jian-Qiang, Taklo M.M.V. (Eds.) Handbook of Wafer Bonding Wiley VCH, ISBN 978-3-527-32646-4, Weinheim, 2012 Bonfert, D.; Hemmetzberger, D.; Klink, G.; Bock, K. Ageing behavior of printed flexible resistors by thermal, mechanical and electrical stresses COSMIC Autumn School 2012, November 19. - 20, 2012 Klink, G. Advantages of Organic and Large Area Electronics for small area devices Forum Be-Flexible, Munich, Germany, November 21. - 22, 2012 Ramm, P. 3D Integration Where do we need to go now? Panel 3D Integration, International Wafer-Level PackagingConference IWLPC 2012, San Jose, California, November 2012

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Landesberger, C. High accuracy self-assembly of thin silicon dies Forum Be-Flexible, Munich, Germany, November, 21. - 22, 2012 Alberti, M.; Meixner, L.; Rckerl, A.; Eder, M.; Endres, H.-E.; Bock, K. Sensorfilter ein intelligentes Mikro-Filtersystem in Folientechnologie fr Anwendungen in Prozesskontrolle, Zellkultur und Life Sciences 4. GMM Workshop MNI, Berlin, Germany, November 12. - 13, 2012 Ramm,P. 3D Integration Welcome Note, Proc. Sematech Workshop on Underfill Challenges for 3D ICs, San Jose, USA, November 09, 2012 Klumpp, A.; Ramm, P. Low-Temperature 3D Integration Processes for Reliable Heterogeneous Systems e-BRAINS and ESiP workshop ESREF, Cagliari, USA, October 01, 2012 Alberti, M.; Meixner, L.; Rckerl, A.; Eder, M.; Endres, H.-E.; Bock, K. Sensor filter Intelligent micro filter system in foil technology Eurosensors 2012, Krakau, Poland, September 09. - 12, 2012

Bonfert, D.; Hemmetzberger, D.; Klink, G.; Bock, K. Ageing behavior of printed flexible resistors by thermal, mechanical and electrical stresses 4th Electronics System Integration Technologies Conference ESTC 2012, Amsterdam, Netherlands, September 17. - 20, 2012 Landesberger, C.; Scherbaum, S.; Weber, J.; Bock, K.; Hiroshima, M.; Oberhofer, B. Plasma dicing enables high accuracy self-alignment of thin silicon dies for 3D-device-integration 4th Electronics System Integration Technologies Conference ESTC 2012, Amsterdam, Netherlands, September 17. - 20, 2012 Bose, I.; Ohlander, A.; Stich, M.; Kiesl, C.; Hemmetzberger, D.; Klink, G.; Trupp, S.; Bock, K. Polymer opto-chemical-electronic based module as a detection system for volatile analytes on a foil substrate SPIE Organic Photonics + Electronics Conference, San Diego, USA, August 16, 2012 Trupp, S. Sensor materials and integrated packaging for smart systems PTS, Munich, Germany, June 13, 2012 Endres, H.-E.; Alberti, M.; Bock, K. Plastic and silicon based (bio-)chemical transducers 8th Nano-Bio Conference, Varese, Italy, June 18. - 20, 2012

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1 Piezo-electrically
powered membrane actuator

Endres, H.-E. Elektrochemische Sensoren fr Umwelt und Medizin Achema, Frankfurt, Germany, June 18. - 22, 2012 Richter, M. TUDOS Microdosing for Tumor Therapy Innovationen aus Wissenschaft und Zuliefererindustrie fr die Medizintechnik, Erlangen, Germany, June 20. - 21, 2012 Trupp, S. Sensormaterialien fr intelligente Textilien Innovationnetzwerk Textil e.V., Chemnitz, Germany, June 19, 2012 Bonfert, D.; Hemmetzberger, D.; Klink, G.; Bock, K.; Svasta, P.; Ionescu, C. Electrical Stress on Intrinsically Conductive Polymer Layer ISSE 2012: 35th International Spring Seminar on Electronics Technology, Bad Aussee, Austria, May 09. - 13, 2012 Endres, H.-E.; Rose, K.; Faul, R.; Yacoub-George, E.; Bock, K. A flexible indoor air quality system IMCS 2012 - The 14th International Meeting on Chemical Sensors, Nuremberg, Germany, May, 20. - 23, 2012 Richter, M. Bioreactors with microfluidic components for tissue engineering Strategies in Tissues Engineering, Wrzburg, Gremany, May 23. - 25, 2012

Eisele, I. Trends in der Mikrosystemtechnik Innovationen in Mikrosystemtechnologie 2012, Bayern Innovativ, Nuremberg, Germany, May 15, 2012 Mohr, G. J.; Hezinger, A. F. E.; Trupp, S.; Stich M. I. J.; Schmidt, J.; Wenninger, F.; Meixner, L.; Neumaier, K.; Bock, K. Fabrication of Optical Sensor Materials and Modules for Food Quality Control Europtode XI, XI Conference on optical chemical sensors and biosensors, Barcelona, Spain, April 01. - 04, 2012 Nebrich, L.; Wiest, F. Hochempfindliche Strahlungsdetektoren fr medizinische Anwendungen 3. Landshuter Symposium fr Mikrosystemtechnik, Landshut, Germany, March 13. - 14, 2012 Wieland, R.; Xuan Anh Bui, T.; Merkel K.-R.; Al Kuzee, J. Optimization of DRIE-based TSVs for 3D/MEMS MAM 2012; Workshop Materials for Advanced Metallization, Grenoble, France, March 11. - 14, 2012 Klumpp, A. Manufacturing of 3D integrated ICs Design, Automation and Test in Europe, Dresden, Germany, March 12. - 16, 2012 Faul, R. FuE fr flexible, polytronische Systeme 3. Landshuter Symposium fr Mikrosystemtechnik, Landshut, Germany, March 13. - 14, 2012

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Weber, J.; Klumpp, A.; Ramm, P. 3D-TSV Integration heterogener Mikrosysteme 3. Landshuter Symposium fr Mikrosystemtechnik, Landshut, Germany, March 13. - 14, 2012 Endres, H.-E.; Alberti, M. ; Eder, M.; Rckerl, A.; Bock, K. Intelligenter Mikrofilter fr die Mikroalgenkultur 5. Bundesalgenstammtisch, Pullach, Germany, March 26, 2012 Nebrich, L.; Wiest, F.; Eisele, I. Highly Sensitive Radiation Detectors for Medical Applications Smart Systems Integration, International Conference and Exhibition on Integration Issues of Miniaturized Systems, Zurich, Switzerland, March 21. - 22, 2012 Yacoub-Georg, E.; Bock, K. Multifunktionale Foliensysteme fr Textilien TITV-Konferenz, Zeulenroda, Germany, February 23. - 24, 2012

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/ / Pa T en T S

1 Sensor foil for parallel

measurement of O2 and CO2

1 74

PaTENTS
The follow ing F r a un h o fe r E M F T p a te n ts we re d i s c l os ed i n 2012: Verpackung Gerhard Mohr, Anna Hezinger, Sabine Trupp, Jennifer Schmidt, Matthias Stich DE 10 2011 075 667.1 Method for manufacturing a three-dimensional electronic Verfahren und Vorrichtung zum justierten Laminieren von folienbasierten Schaltungstrgern zur Herstellung von flexiblen, mehrlagigen Schaltungssubstraten Erwin Yacoub, Christof Landesberger DE 10 2011 004 383.7 Flexibles, mehrschichtiges Schaltungssubstrat und Verfahren zur Herstellung desselben Robert Faul, Andreas Drost DE 10 2011003 622.9 Kleidungsstck Dr. Gerhard Mohr, Dr. Sabine Trupp, Dr. Matthias Stich WO 2012 / 104328 Verfahren zur Herstellung eines Chip-Package Christof Landesberger, Robert Faul DE 10 2010 042 567.2 Organischer Transistor und Verfahren zur Herstellung desselben Markus Burghart, Gerhard Klink DE 10 2010 061 978.7 system Peter Ramm, Armin Klumpp US 2010/0289146 Microfluidic device, microfluidic dosing system Martin Richter, Sebastian Kibler WO 2012 031630

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/ / M ember S h I P S an D a C T I v I T I e S

1 Fraunhofer scientist
holding a MEMS wafer

2 MEMS microphone
wafer

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MEMBERSHIPS AND ACTIVITIES

Frau nhof e r E MF T st a ff p ro m o te th e tra n s fe r o f knowl edge through members hi p of a wi de range of diff erent ne t w or k s a nd c o o p e ra ti o n s . T h i s e n a b l e s them to tac kl e i nterdi s c i pl i nary tas ks bey ond the bounds of the Fra unhof e r inst itu ti o n i ts e lf. Prof. Dr. rer. nat. Christoph Kutter IEEE Components, Packaging & Manufacturing Technology Society and Electron Devices Society: Member Deutsche Physikalische Gesellschaft: Member Association for Electrical, Electronic & Information Technologies (VDE): Member VDE GMM (Gesellschaft fr Mikroelektronik, Mikromechanik und Feinwerktechnik): Deputy Chairman Innovationspreis der deutschen Wirtschaft: Member of the awards advisory board VDI VDE IT GmbH: Member of the Supervisory Board AMA, AMA Wissenschaftsrat und AMA Sensor-Innovationspreis: Member Arbeitsgemeinschaft Organic Electronics Association OEA, VDMA: Member Compound Semiconductor Manufacturing Technology, CS MANTECH, USA: Member of the Technical Program Committee EITI European Interconnect Techology Initiative: Member FlexTech Alliance, USA: International Advisory Board Forum MedTech Pharma, Bayern Innovativ: Member Institute of Electrical and Electronics Engineers IEEE: Member IEEE Components, Packaging & Manufacturing Technology Society and Electron Devices Society: Member International Electronic Components and Technologies Conference, ECTC, USA: Sub-committee chairEmerging technologies International Electron Devices Meeting IEDM, USA: Member of the Executive Committee and European Arrangement Chair International Conference on Flexible and Printed Electronics (ICFPE), Japan: European Committee Micro- and Nanotechnology Journal der Bentham Science Publisher Ltd.: Member of the Board of Editors and Consultant MRS - Materials Research Society: Member Plastic Electronics Conference: Conference cochair for the Integrated Smart Systems Conference part Prof. Dr.-Ing. Dr. h. c. Karlheinz Bock IEEE Electron Devices Letters EDL: Consultant Applied Physics Letters APL: Consultant German Israeli Foundation for Scientific Research and typo Development (G.I.F): Consultant Electronics Systems Integration Technology Conference ESTC, Technical Program Committee: Member Journal of Micromachines: Consultant VDE und Kerngruppe des Arbeitskreises fr Mikroelektronik und Feinwerktechnik: Member Smart Systems Integration Conference, SSI: Technical Program Committee and Founding Member Design and Technology in Electronic Packaging (SIITME): Member of the Steering Committee Interconnection techniques in Electronics (TIE contest): Member of the Steering Committee

77

/ / / M E M B E R und S H IPS A N D A CTI V ITI E S ///Mitgliedschaften Aktivitten

1 Fraunhofer scientist
with MEMS wafer

Prof. Dr. rer. nat. Ignaz Eisele Robert Bosch Zentrum Reutlingen: Member of the Advisory Board IHP, Frankfurt/Oder: Member of the Scientific Advisory Board Prof. Dr. techn. Linus Maurer IEEE, Institute of Electrical and Electronics Engineers: Member ITG Informationstechnische Gesellschaft im VDE: Member VDE Verband der Elektrotechnik Elektronik Informationstechnik e.V.: Member IEEE MTT-27 (wireless-enabled automotive and vehicular applications): Member Dr. rer. nat. Peter Ramm International Microelectronics and Packaging Society iMAPS: Fellow of Society and Life Member Electronic Components and Technologies Conference (ECTC): Sub-Committee Advanced Packaging International Microelectronics and Packaging Society iMAPS: Award Committee iMAPS Device Packaging Conference (iMAPS DPC): Technical Co-Chair 3D Packaging Sematech ITRS Interconnect Working Group: Key Contributor SEMI North America: Committee Standards 3DS-IC, Technical Committee Electrochemical Society (ECS): Symposium Organizer

Institute of Electrical and Electronics Engineers IEEE: Organizing Committee and Founding Member 3DIC Conference

Future Fab International Magazine: Editorial Board Member Advanced Metallization Conference (AMC): Executive Committee Surface Mount Technology Association (SMTA): Technical Committee Member IWLPC and 3D Integration Chair

Dr.-Ing. Martin Richter VDE/VDI-Gesellschaft Mikroelektronik, Mikro- und Feinwerktechnik (GMM), Fachbereich 2; Mikro- und Nanotechnik, Fachausschuss 2.4 Mikroaktorik: Member Association Multi Material Micromanufacturing (4M): Head of division microfluidics MST Kongress: : Member of program committee

Dr.-Ing. Detlef Bonfert IEEE, Institute of Electrical and Electronics Engineers: Senior Member IEEE, Society: CPMT, EDS, CS, MTT: Member International Microelectronics and Packaging SocietyiMAPS: Member International Symposium for Design and Technology in Electronic Packaging SIITME, Technical Program Committee Chair, Steering Committee and Scientific Committee Member International Spring Seminar in Electronics ISSE: Steering Committee Member

78

Design of Electronic Modules and Assemblies, TIE: Technical Committee Member

EOS/ESD Symposium, USA: Technical Program Committee International Electrostatic Workshop (IEW): Technical Program Committee

Dieter Bollmann Dr. rer. nat. Armin Klumpp Fraunhofer-Gesellschaft: Elected Representative on the Scientific Technical Council Dr.-Ing. Hanns-Erik Endres Christof Landesberger Cluster-Offensive Bayern, Cluster Sensorik: Member and Technical Advisor Fraunhofer-Netzwerk Elektrochemie: Member Cluster-Offensive Bayern, Cluster Leistungselektronik: Technical Advisor Sabine Scherbaum ZAK-Zentrum fr angewandte Kompetenz und Mentoring der Frauenakademie Mnchen: Mentor mst|femNet meets Nano and Optics in: Nationalen Pakt fr Frauen in MINT-Berufen: Fraunhofer EMFT Advisor Dr.-Ing. Heinrich Wolf EOS/ESD Association, USA: Member EOS/ESD Symposium, USA: Technical Program Committee International Electrostatic Workshop (IEW): Technical Program Committee Axel Wille Deutsche Physikalische Gesellschaft: Member VDI Verein Deutscher Ingenieure: Member 79 International Electron Devices Meeting IEDM, USA: Technical Committee

Robert Faul Hochschule Landshut, Cluster Mikrosystemtechnik: Technical Advisor Cluster-Offensive Bayern, Cluster Mechatronik und Automation: Technical Advisor Dr.-Ing. Horst A. Gieser ESD-FORUM e.V.: Board Chairman and Founding Member Industry Council on ESD-Target Levels: Member EOS/ESD Association, USA: Member EOS/ESD Symposium, USA: Technical Program Committee International Electrostatic Workshop IEW: Management Committee European Symposium on Reliability of Electron Devices, Failure Physics and Analysis ESREF: Technical Program Committee EOS/ESD Association, USA: Member