LG W7020 Service Manual

1.
INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of the phones.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for
example, persons other than your company’s employees, agents, subcontractors, or person
working on your company’s behalf) can result in substantial additional charges for your
telecommunications services. System users are responsible for the security of own system.
There are may be risks of toll fraud associated with your telecommunications system. System users
are responsible for programming and configuring the equipment to prevent unauthorized use. LGE
does not warrant that this product is immune from the above case but will prevent unauthorized use
of common-carrier telecommunication service of facilities accessed through or connected to it. LGE
will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long
as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If
these changes could reasonably be expected to affect the use of the phones or compatibility with
the network, the telephone company is required to give advanced written notice to the user,
allowing the user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the LGE or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual.
Theref ore, note that unauthorized alternations or repair may affect the regulatory status of the
system and may void any remaining warranty.
E. Notice of Radiated Emissions

The phones complies with rules regarding radiation and radio frequency emission as defined by
local regulatory agencies. In accordance with these agencies, you may be required to provide
information such as the following to the end user.
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1. INTRODUCTION
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation

An the phones may interfere with sensitive laboratory equipment, medical equipment, etc.
Interference from unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign. Following
information is ESD handling:
Service personnel should ground themselves by using a wrist strap when exchange system
boards.
When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
Use a suitable, grounded soldering iron.
Keep sensitive parts in these protective packages until these are used.
When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
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1. INTRODUCTION
1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
APC Automatic Power Control

BB Baseband
BER Bit Error Ratio
CC-CV Constant Current – Constant Voltage
CLA Cigar Lighter Adapter
DAC Digital to Analog Converter
DCS Digital Communication System
dBm dB relative to 1 milliwatt
DSP Digital Signal Processing
EEPROM Electrical Erasable Programmable Read-Only Memory
EL Electroluminescence
ESD Electrostatic Discharge
FPCB Flexible Printed Circuit Board
GMSK Gaussian Minimum Shift Keying
GPIB General Purpose Interface Bus
GPRS General Packet Radio Service
GSM Global System for Mobile Communications
IPUI International Portable User Identity
IF Intermediate Frequency
LCD Liquid Crystal Display
LDO Low Drop Output
LED Light Emitting Diode
The phones GSM Phone
LGE Electronics
OPLL Offset Phase Locked Loop
PAM Power Amplifier Module
PCB Printed Circuit Board
PGA Programmable Gain Amplifier
PLL Phase Locked Loop
PSTN Public Switched Telephone Network
RF Radio Frequency
RLR Receiving Loudness Rating
RMS Root Mean Square
RTC Real Time Clock
SAW Surface Acoustic Wave
SIM Subscriber Identity Module
SLR Sending Loudness Rating
SRAM Static Random Access Memory
STMR Side Tone Masking Rating
-5-
1. INTRODUCTION
TA Travel Adapter
TDD Time Division Duplex
TDMA Time Division Multiple Access
UART Universal Asynchronous Receiver/Transmitter
VCO Voltage Controlled Oscillator
VCTCXO Voltage Control Temperature Compensated Crystal Oscillator
WAP Wireless Application Protocol
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2. PERFORMANCE
2. PERFORMANCE
2.1 H/W Features

Item Feature Comment
Li-Polymer, 760mAh(820 mAh)
Standard Battery Size: 44 68.6 5.6 mm
Weight: 22 g
Extended Battery T.B.D.
AVG TCVR Current Min: 150mA(Pwr Level 19), Max: 300mA(Pwr Level 5)
Standby Current < 4.1 mA
Talk time Min : 2hr30min (2hr40min) @760(820)mAh
Max : 5hr(5hr20min)
Stand by time Up to 200 hours @820mAh
Charging time 2 hours
RX Sensitivity GSM, EGSM: -108 dBm, DCS: -107 dBm
TX output power GSM, EGSM: 33(32.5) dBm (Level 5)
DCS: 30(29.5) dBm (Level 0)
GPRS compatibility Class 10(This only applies to G7020)
SIM card type Plug-In SIM 3V/5V
Display Main : 65K Color-STN(128X160)
Sub : Mono(96X64)
Status Indicator : 7-color LED
Key Pad :
Status Indicator & KeyPad • 0 ~ 9, #, *, Navigation Key, Up/Down Side Key
• Side Key, Confirm Key, Record Key
• Send Key, END/PWR Key
ANT Fixed Type
EAR Phone Jack Ear-Mic connector
PC Synchronization Yes
Speech coding EFR/FR
Data and Fax Yes
Vibrator Yes
Speaker Yes
Voice Recording Yes
C-Mic Yes
Receiver Yes
Travel Adapter Yes
Options Hands-free kit, CLA, Data Kit
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2. PERFORMANCE
2.2 Technical Specification

Item Description Specification
GSM
TX: 890 + n 0.2 MHz
RX: 935 + n 0.2 MHz (n = 1 ~ 124)
EGSM
1 Frequency Band TX: 890 + (n - 1024) 0.2 MHz
RX: 935 + (n - 1024) 0.2 MHz (n = 975 ~ 1024)
DCS
TX: 1710 + (n-512) 0.2 MHz
Rx: 1805 + (n-512) 0.2 MHz (n = 512 ~ 885)
RMS < 5 degrees
2 Phase Error Peak < 20 degrees
3 Frequency Error < 0.1 ppm
GSM, EGSM
Level Power Toler. Level Power Toler.
5 33 dBm 2dB 13 17 dBm 3dB
6 31 dBm 3dB 14 15 dBm 3dB
7 29 dBm 3dB 15 13 dBm 3dB
8 27 dBm 3dB 16 11 dBm 5dB
9 25 dBm 3dB 17 9 dBm 5dB
10 23 dBm 3dB 18 7 dBm 5dB
11 21 dBm 3dB 19 5 dBm 5dB
4 Power Level 12 19 dBm 3dB
DCS
Level Power Toler. Level Power Toler.
2 26 dBm 3dB 10 10 dBm 4dB
-8-
2. PERFORMANCE

GSM, EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -63
3,000 ~ 6,000 -65
5 Output RF Spectrum 6,000 -71
(due to modulation)
DCS
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600 ~ 1,200 -60
1,200 ~ 1,800 -60
1,800 ~ 3,000 -65
3,000 ~ 6,000 -65
6,000 -73
GSM, EGSM
Offset from Carrier (kHz) Max. (dBm)
400 -19
600 -21
1,200 -21
6 Output RF Spectrum 1,800 -24
(due to switching transient)
GSM
Offset from Carrier (kHz) Max. (dBm)
400 -22
600 -24
1,200 -24
1,800 -27
Conduction, Emission Status
7 Spurious Emissions
Conduction, Emission Status
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2. PERFORMANCE

GSM, EGSM
BER (Class II) < 2.439% @-102 dBm
8 Bit Error Ratio
DCS
BER (Class II) < 2.439% @-100 dBm
9 RX Level Report Accuracy 3 dB
10 SLR 8 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 0 -12
11 Sending Response 1,000 0 -6
2,000 4 -6
3,000 4 -6
3,400 4 -9
4,000 0 -
12 RLR 2 3 dB
Frequency (Hz) Max.(dB) Min.(dB)
100 -12 -
200 0 -
300 2 -7
500 * -5
13 Receiving Response 1,000 0 -5
3,000 2 -5
3,400 2 -10
4,000 2
* Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
14 STMR 13 5 dB
15 Stability Margin > 6 dB
dB to ARL (dB) Level Ratio (dB)
-35 17.5
-30 22.5
-20 30.7
16 Sending Distortion
-10 33.3
0 33.7
7 31.7
10 25.5
17 Side tone Distortion Three stage distortion < 10%
18 System frequency (13 MHz) tolerance ≤ 2.5 ppm
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2. PERFORMANCE

19 32.768KHz tolerance ≤ 30 ppm
At least 80 dB under below conditions:
20 Ringer Volume 1. Ringer set as ringer.
2. Test distance set as 50 cm
Fast Charge : < 500 mA
21 Charge Voltage
Slow Charge: < 60 mA
Antenna Bar Number Power
5 -85 dBm ~
4 -90 dBm ~ -86 dBm
22 Antenna Display 3 -95 dBm ~ -91 dBm
2 -100 dBm ~ -96 dBm
1 -105 dBm ~ -101 dBm
0 ~ -105 dBm
Batter Bar Number Voltage
0 ~ 3.62 V
23 Battery Indicator 1 3.62 ~ 3.73 V
2 3.73 ~ 3.82 V
3 3.82 V ~
3.5 0.03 V (Call)
24 Low Voltage Warning
3.62 0.03 V (Standby)
25 Forced shut down Voltage 3.35 0.03 V
1 Li-Polymer Battery
Standard Voltage = 3.7 V
26 Battery Type
Battery full charge voltage = 4.2 V
Capacity: 760 mAh(820 mAh)
Switching-mode charger
27 Travel Charger Input: 100 ~ 240 V, 50/60 Hz
Out put: 5.2 V, 600 mA
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3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 Receiver
The receiver part consists of a dual band(GSM & DCS) antenna switch, two RF SAW filters, a
external dual RF VCO and a transceiver IC(TRF6150). All active circuits for a complete receiver
chain with the exception of RF VCO are contained in the transceiver IC(TRF6150).
The TRF6150 chip set has direct conversion structure, so the received RF signal is directly
converted to base band I and Q signal by the transceiver IC(IF frequency is 0 Hz), which contains
two LNAs and three direct conversion demodulators for E-GSM, DCS and PCS. The demodulated I
and Q signals pass two base band AGC amplifiers and a channel filter, which are on both I and Q
signal paths. The RF front-end circuit is shown Fig. 3-1.
Figure 3-1. RF front-end circuit.
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3. TECHNICAL BRIEF
3.1.1 RF front end

RF front end consists of an antenna, a dual band antenna switch, two RF SAWs and two LNAs for
E-GSM, DCS band, which are contained in the transceiver IC (TRF6150).
The RF received signals (GSM 925MHz ~ 960MHz, DCS 1805MHz ~ 1880MHz) are input via the
antenna or coaxial connector. An antenna matching circuit is between the antenna and the
connector.
VC2 that are connected to 4-Input NOR Gate (U607) to switch either TX or RX path on. When the
RX path is turned on, the received RF signal, which has passed through the dual band antenna
switch, is filtered by an appropriate RF SAW filter for better stop band rejection. The filtered RF
signal is amplified by an LNA integrated in the transceiver IC(TRF6150) and pass to a direct
conversion demodulator. This process is thecsame both GSM and DCS.
The logic and current is given below. Table 3-1.
Table 3-1. The logic and current
VC1 VC2
GSM TX 2.7 V 0V
DCS TX 0V 2.7 V
GSM/DCS RX 0V 0V
3.1.2 Demodulator and Baseband Processing

IF stage is not necessary in this system because the receiver is based on direct conversion
architecture. So the RX LO frequency is the same as input radio frequency. The amplified signal at
LNA stage passes to a direct conversion demodulator and is mixed down to generate I&Q BB
signals. The BB I&Q signals pass via two integrated baseband amplifiers with digitally
programmable gain and two fully integrated baseband channel filters to the baseband A/D
converters which is contained in baseband chipset. Fig.3-2 shows RX path block diagram.
3.1.3 DC offset compensation

The transceiver IC(TRF6150) is based on direct-conversion architecture. This implies that a
parasitic DC offset may appear at the output of the IQ demodulator. To reduce the static offset due
to components mismatch and LO self-mixing, the IC includes a hardware DC offset compensation
circuit on both I and Q base band paths. The transceiver IC uses a divider by 2 for LO generation in
EGSM and a multiplier by 2 in DCS to minimize the DC offset generated by self mixing and the LO
radiation. In addition, a quadrature demodulator gain mismatch calibration system is used to reduce
the signal distortion.
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3. TECHNICAL BRIEF
Figure 3-2. RX path block diagram.
Table 3-2. Gain and Noise Figure of RX path.
Ant. switch RF SAW Filter I,Q demodulator(LNA+Mixer)

GSM -0.6 -2.5 26
Gain(dB)
DCS -0.7 -3.2 23
GSM 3
NF(dB)
DCS 3.5
Table 3-3. Total Gain and Noise Figure of RX path.
Total Gain Total Noise Figure

GSM, EGSM 22.9 dB 7.2 dB
DCS 19.1 dB 8.2 dB
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3. TECHNICAL BRIEF
3.2 Synthesizer
The TRF6150 includes two synthesizer parts. Two synthesizers consist of an IF synthesizer, which
is an integer-N synthesizer, and a RF synthesizer, which is a fractional-N synthesizer. The TRF6150
is a transceiver IC suitable for GSM and DCS GPRS up to class 12 applications. So, synthesizers
use a number of techniques to improve lock time, making them well suited to GPRS.
The main fractional-N synthesizer (RF synthesizer), which includes a RF VCO with external tank
circuits, is necessary for both transmitting and receiving operation. The RF VCO works only when
the transmitting operation is on. The main fractional-N synthesizer has frequency band from 1294
MHz to 1356 MHz. Output frequency of the RF VCO is set by the factional number, prescaler and
counter. An buffer amplifier follows the RF VCO. The purpose of the buffer is to give reverse
isolation and prevent any frequency pulling of the VCO when the transceiver is powered UP and
DOWN.
A dual band external VCO, which uses the PLL block of the main fractional-N synthesizer, is
necessary for transmitting and receiving operation. The dual band means that it can support GSM,
DCS frequency operation. For transmitting operation, the OPLL block of the TRF6150 directly
modulates the dual band external VCO with I and Q signals. For receiving operation, the external
VCO output frequency band is fr 90902 to 940MHz for DCS Rx and from 1850 to 1920MHz for GSM
Rx. The frequency of the signal from the external VCO is divided by 2 for GSM Rx and is doubled by
2 for DCS Rx operation before entering into the direct conversion mixer.
The auxiliary integer-N synthesizer (IF synthesizer), which includes an IF VCO with external tank
circuits, is necessary for transmitting operation only. The IF VCO has a frequency band from 832
MHz to 858 MHz. Output frequency of IF VCO is settled by prescaler and counter. The fractional
counter in the RF synthesizer just differs from the IF synthesizer. The IF VCO is also followed by a
buffer amplifier, which is to give reverse isolation and prevent any frequency pulling of the VCO
when the transceiver is powered UP and DOWN.
A fixed reference frequency of 1.3MHz for Rx (or 2.6MHz for Tx) is generated by a reference divider
from the external applied 13 MHz crystal oscillator.
The phase frequency detector with charge pump provides programmable output current, which
could drive the capability and the pulse width.
The counter and mode settings of the synthesizer in the TRF6150 are programmed via 3-wire
interface.
Table 3-4. 3-wire BUS of Synthesizer in the TRF6150
Pin Number Description

CLK 11 Serial clock input to the synthesizer
DATA 12 Serial data input to the synthesizer
EN 13 Input latches the serial data transferred to the synthesizer
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3. TECHNICAL BRIEF
Figure 3-3. Synthesizer internal Block Diagram.
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3. TECHNICAL BRIEF
The IF and RF output frequencies of the TRF6150 are set by programming the internal divider registers.
The frequency setting equations of the IF and RF frequencies are as follows.
is the output frequency of the IF VCO (the auxiliary integer-N synthesizer) and is the output
frequency of the RF VCO (the main fractional-N synthesizer). The frequency band of the RF VCO is from
1294MHz to 1356 MHz, and the frequency band of the IF VCO is from 832MHz to 858Mhz, which
frequency bands are for the transmitting operation only.
Figure 3-4. Synthesizer Circuit.
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3. TECHNICAL BRIEF
3.3 Transmitter
The Transmitter part contains TRF6150 active parts, PAM, coupler, dual schottky diode and dual
band VCO. The TRF6150 active parts consist of the vector modulator and offset phase-locked loop
block (OPLL) including down-converter, phase detector, and APC IC for power control. The VCO
feed the output frequencies into PAM and TRF6150 for Tx local frequency. The peak output power
of the PAM is controlled by means of a closed feedback loop. A dual band directional coupler is
used to control the RF output from the PAM. The PAM outputs from the directional coupler pass to
the antenna connector via an integrated dual band antenna switch module.
Figure 3-5. Transmitter Block Diagram.
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3. TECHNICAL BRIEF
3.3.1 Tx Modulator
The Tx I & Q signals from BB analog chipset are fed to the TRF6150 Tx modulator, where they are
modulated onto either a Tx of 880 MHz(for GSM-Tx) or 1710 MHz(for DCS-Tx) by the quadrature
mixer inside the U604. The Tx LO signal(1294 – 1356 MHz, 426.4 MHz) is fed from the internal
main and aux.
VCO.
The modulator provides more than 40dBc of carrier and unwanted side-band rejection and
produces a GMSK modulated signal. The BB software is able to cancel out differential DC offsets in
the I/Q BB signals caused by imperfections in the D/A converters. The Tx-Modulator implements a
quadrature modulator. The frequency input signal is split into two precise orthogonal carriers, which
are multiplied by the BB modulation signal IP/IN and QP/QN. It is used as reference signal for the
OPLL.
Figure 3-6. TX IF Modulator and OPLL Circuit.
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3. TECHNICAL BRIEF
3.3.2 OPLL
The down converter contained inside of the TRF6150 (U604) mixes the Tx RF frequency with the
RF VCO signal from the ENFVZ4L07(U600) to generate a feedback signal at 414.4MHz for GSM,
EGSM and DCS operation. The feedback signal passes to one port of the phase detector.
The GMSK reference signal from the Tx IF modulator passes via a second limiter to the other
input port of the phase detector. The phase detector generates an error current proportional to the
phase difference between the feedback signal from the down-converter and the `reference’ signal
from the Tx IF modulator. The error current is filtered by a second order low-pass filter to generate
an output voltage, which depends on the GMSK modulation and the desired channel frequency.
This voltage controls the transmit VCO such that the VCO output signal, centered on the correct RF
channel is frequency modulated with the original GMSK data.
The center frequency of the transmit VCO is offset from the RF VCO frequency by 414.4MHz for
GSM ,EGSM and DCS operation.
3.3.3 Power Amplifier

The PF08122B (U601) is Dual band power amplifier for EGSM (880 to 915 MHz) and DCS (1710 to
1785 MHz). The efficiency of module is the 55% at 35 dBm for E-GSM and the 50% at 32.5 dBm for
DCS for 3.5 V nominal battery use.
This module should be operated under the GSM burst pulse. To avoid permanent degradation, CW
operation should not be applied. To avoid the oscillation at no input power, before the input is cut
off, the control voltage Vapc should be control to less than 0.5 V. We have to improve thermal
resistance, the through holes should be layouted as many as possible on PCB under the module.
And to get good stability, all the GND terminals and the metal cap should be soldered to ground
plane of PCB.
Figure 3-7. Power Amplifier and its Control Part Circuits.
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3. TECHNICAL BRIEF
3.3.4 PA Circuit and Control

The power amplifier control circuit ensures that the RF signal is regulated to the required limits of
operation. RF power is controlled by driving the power control pins of power amplifier and sensing.
The resultant RF output power via a directional coupler (N600). The RF sense voltage is peak
detected using an schottky diode of BAT15-099(D600). This detected voltage is compared to the
DAC voltage in the TRF6150 to control the output power.
An internal input signal (PA_LEVEL) from CALYPSO, digital BB chipset, (U200) is applied to the
APC IC in TRF6150 during the PA_ON mode and a directional coupler near the antenna feeds a
portion of the RF output signal back to the APC IC and peak detector converts this signal to a low
frequency feedback signal that balances the amplifier when this signal equal to the RAMP input
signal level.
3.4 13 MHz Clock

The 13 MHz clock (VC-TCXO-208C) consists of a TCXO (Temperature Compensated Crystal
Oscillator), which oscillates at a frequency of 13 MHz.
The 13MHz clock is used within the Synthesizer block of the TRF6150, BB Analog chip-set
(NAUCICA_CS), and Digital (CALYPSO). The inverter IC, SN74AHC1GU04 buffer the output to
NAUCICA_CS and CALYPSO.
Figure 3-8. VCTCXO Circuit.
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3. TECHNICAL BRIEF
3.5 Power Supplies and Control Signals

Three Regulators are integrated in the TRF6150 to provide DC power to the RF blocks (Regulator
R1, R2 R3). The Regulator R1 is used to provide DC power to the receiver, the transmitter and the
PA control loop of the TRF6150. The Regulator R2 is used to provide DC power to the DC offset
compensation circuit, the auxiliary synthesizer, the main synthesizer and VCOs. The Regulator R3
is used for the external Rx/Tx VCO. An external regulator is used to provide DC power to the
VCTCXO(U605).
Table 3-5. Regulator Specification
Regulator Voltage Powers Enable Signal

Regulator R1, R2, R3 Receiver, Transmitter,
(These are all integrated 2.8 V 0.1 V Synthesizers, VCOs
in the TRF6150)
ADP3330_2V85 (U605) 2.85 V 0.5 V VCTXO RF_ENA, XO_ENA
Figure 3-9. External Regulator Circuit.
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3. TECHNICAL BRIEF
3.6 Digital Baseband (DBB) Processor
Figure 3-10. Top level block diagram of the Calypso G2(HERCROM400G2).
3.6.1 General Description

CALYPSO is a chip implementing the digital base-band processes of a GSM/GPRS mobile phone.
This chip combines a DSP sub-chip (LEAD2 CPU) with its program and data memories, a Micro-
Controller core with emulation facilities (ARM7TDMIE), internal 8Kb of Boot ROM memory, 4M bit
SRAM memory, a clock squarer cell, several compiled single-port or 2-ports RAM and CMOS
gates.
The chip will fully support the Full-Rate, Enhanced Full-Rate and Half-Rate speech coding.
CALYPSO implements all features for the structural test of the logic (full-SCAN, BIST, PMT, JTAG
boundary-SCAN).
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3. TECHNICAL BRIEF
3.6.2 Block Description

CALYPSO architecture is based on two processor cores ARM7 and DSP using the generic RHEA
bus standard as interface with their associated application peripherals.
CALYPSO is composed from the following blocks:
• ARM7TDMIE : ARM7TDMI CPU core

• DSP subchip
• ARM peripherals:
General purpose peripherals
• ARM Memory Interface for external RAM, Flash or ROM
• 4 Mbit Static RAM with write-buffer
Application peripherals
• ARM General purposes I/O with keyboard interface and two PWM modulation signals
• UART 16C750 interface (UART_IRDA) with
- IRDA control capabilities (SIR)
- Software flow control (UART mode).
• UART 16C750 interface (UART_MODEM) with
- hardware flow protocol (DCD, CTS/RTS)
- autobaud function
• SIM Interface.
• TPU(Time Processing Unit) : Processing for GSM time base
• TSP(Time Serial Port) : GSM data interface with RF and ABB
Memory Interface : External/Internal Memory Interface

nCS0 : FLASH1, 16bit access, 3 wait state
nCS1 : FLAHS2, 16bit access, 3 wait state
nCS2 : Ext SRAM, 16bit access, 3 wait state
nCS3 : Main LCD, Sub LCD, MIDI IC addressing, 8bit access, 3 wait state ( See Fig 3-2 )
nCS6 : Int SRAM, 32bit access, 0 wait state
* Calypso internal 39MHz machine → 3wait state is necessary for the 80ns access because of 25ns
machine cycle. (25*4 = 100ns)
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3. TECHNICAL BRIEF
Figure 3-6. Decoding Section Block Diagram
3.6.3 External Devices connected to memory interface

Table 3-6. External Device Spec connected to memory interface
Interface SPEC
Maker Write
Device Name Access Access Read
Time Time
FLASH 1 TH50VPF5683BASB Toshiba 80ns 80ns
FLASH 2 TC58FVB641FT/XB Toshiba 80ns 80ns
SRAM TH50VPF5683BASB Toshiba 70ns 70ns
MAIN LCD S6B0023/S6B0018 SDI TBD TBD
SUB LCD KS0723 SDI 60ns 60ns
Melody IC YMU762 Yamaha 50ns 80ns
3.6.4 RF Interface (TPU, TSP block)

Calypso uses this interface to control Nausica_CS(ABB Processor) and Clara(RF Processor) with
GSM Time Base
Table 3-7. RF Interface Specification
TSP (Time Serial Port)

Resource Interconnection Description
TSPDO ABB & RF main Chip Control Data
TSPEN0 ABB ABB Control Data Enable Signal
TSPEN1 RF main Chip RF Control Data Enable Signal
TPU (Time Processing Unit) Parallel Port
TSPACT00 RESET_RF RF main Chip Reset Signal
TSPACT05 PA_ON Power Amp ON signal
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3. TECHNICAL BRIEF
3.6.5 SIM interface

SIM interface scheme is shown in (Fig. 3-12).
SIM_IO, SIM_CLK, SIM_RST ports are used to communicate DBB with ABB and the Charge Pump
in ABB enables 3V/5V SIM operation
Table 3-8. SIM Interface
SIM (Interface between DBB and ABB)

SIM_RST SIM card async/sync reset
SIM_PWCTRL SIM card power activation
SIM_IO SIM card bidirectional data line
SIM_CLK SIM card reference clock
Figure 3-12. SIM Interface
3.6.6 UART Interface

The phones has two UART Drivers as follow :
- UART1 : Hardware Flow Control / Fax&Data Modem
- UART2 : Handsfree Control / SW trace or IrDA Modem
Table 3-9. UART Interface Specification
UART MODEM(UART1)
Resource Name Note
TX_MODEM TXD Transmit Data
RX_MODEM RXD Receive Data
CTS_MODEM CTS Clear To Send
RTS_MODEM RTS Request To Send
GPIO 3 DSR Data Set Ready
GPIO 2 DCD Data Carrier Detect
UART IRDA(UART2)
TXIR_IRDA TXIR_IRDA Infra-Red Transmit Pulse
TX_IRDA TX Transmit Data(UART2)
RXIR_IRDA RXIR_IRDA Infra-Red Receive Pulse
RX_IRDA RX Receive Data(UART2)
SD_IRDA SD_IRDA IRDA transceiver ShutDown Mode
- 26 -
3. TECHNICAL BRIEF
3.6.7 GPIO map

In total 16 allowable resources, the phones is using 13 resources except 3 resources dedicated to
SIM and Memory. the phones GPIO(General Purpose Input/Output) Map, describing application,
I/O state, and enable level, is shown in below table.
Table 3-10. GPIO Map Table
Resource Inactive Active

I/O # Application I/O State State State
HIGH LOW
I/O (0) FOLDER I GPIO (Open) (Closed)
I/O (1) MELODY_INT I GPIO HIGH LOW
I/O(2) DCD O GPIO LOW HIGH
I/O (3) DSR I GPIO HIGH LOW
I/O (4) Sub_backlight O GPIO LOW HIGH
I/O (5) SIM_PWCTL O SIM
I/O (6) Jack_Detect O GPIO LOW HIGH
I/O (7) LCD_RESET O GPIO HIGH LOW
I/O (8) SPK_EN O GPIO LOW HIGH
I/O (9) MELODY_RESET O GPIO HIGH LOW
I/O (10) SUB_LED1 O GPIO LOW HIGH
I/O (13) HANDSFREE I GPIO HIGH LOW
I/O (14) NBHE O MEMORY
I/O (15) NBLE O MEMORY
3.7 Analog Baseband (ABB) Processor
3.7.1 General Description

Nausica CS is Analog Baseband (ABB)Chip supports GSM900, DCS1800, GPRS Class 10 with
Digital Basband Chip(Calypso G2) Nausica_CS processes GSM modulation/demodulation and
power management operations.
Block Description
- Audio Signal Processing & Interface
- Baseband in-phase(I), quadrature(Q) Signal Processing
- RF interface with DBB (time serial port)
- Supply voltage regulation
- Battery charging control
- Switch ON/OFF
- 3V/5V SIM card Interface
- 4 internal & 5external ADC channels
- 27 -
3. TECHNICAL BRIEF
3.7.2 Audio Signal Processing & Interface

Audio signal processing is divided Uplink path and downlink path..
The uplink path amplifies the audio signal from MIC and converts this analog signal to digital signal
and then transmit it to DBB Chip. This transmitted signal is reformed to fit in GSM Frame format and
delivered to RF Chip. MICBIAS is 2.5Vlevel.
The downlink path amplifies the signal from DBB chip and outputs it to Receiver(or Speaker).
Figure 3-13. Audio Interface Block Diagram
3.7.3 Baseband Codec(BBC)

Baseband codec is composed of baseband uplink path(BUL) and baseband downlink path(BDL).
BUL makes GMSK(Gaussian Minimum Shift Keying) modulated signal which has In-phase(I) com-
ponent and quadrature(Q) component with burst data from DBB. This modulated signal is
transmitted through RF section via air.
BDL process is opposite procedure of BUL. Namely, it performs GMSK demodulation with input
analog I&Q signal from RF section, and then transmit it to DSP of DBB chip with 270KHz data rate
through BSP.
Figure 3-14. Baseband Codec Block Diagram
- 28 -
3. TECHNICAL BRIEF
3.7.4 Voltage Regulation(VREG)

There are 5 LDO(Low Drop Output) regulators in ABB chip.
The output of these 5 LDOs are as following table. (Figure 3-6) shows the power supply related
blocks of DBB/ABB and their interfaces in the phones.
Figure 3-15. Power Supply Scheme
Table 3-11. LDO Output Table
Output Voltage Usage

VR1 1.8V Digital Core of DBB
VR1B 2.0V Digital Core of ABB
VR2 2.9V Memory Interface of DBB
VR2B 2.9V Digital I/Os of DBB & ABB
VR3 2.9V Analog Block
3.7.5 ADC Channels

ABB ADC block is composed of 4 internal ADC(Analog to Digital Converter) channels and 5
external ADC channel. This block operates charging process and other related process by reading
battery voltage and other analog values.
- 29 -
3. TECHNICAL BRIEF
Table 3-12. ADC Channel Spec
ADC 9 channels
Resource Name
VCHG VCHG
VBAT VBAT Charging Management
ICHG ICHG
VBACKUP VBACKUP Backup Battery
ADCIN1 Not Use
ADCIN2 BATT_Themister Battery Detect
ADCIN3 RADIO_TEMP Temperature Sensing
ADCIN4/TSCXP Hook_Detect HOOK_DETECT
ADCIN5/TSCYP Not Use
3.7.6 Charging
Charging block in ABB processes charging operation by using VBAT, ICHG value through ADC
channel. Battery Block Indication and SPEC of the phones is as follow.
Figure 3-16. Battery Block Indication
1. Charging method : CC-CV

2. Charger detect voltage : 4.0V
3. Charging time : 2h
4. Icon stop current : 100mA
5. Charging current : 420mA
6. CV voltage : 4.2V
7. Cutoff current : 40mA
8. Full charge indication current (icon stop current) : 100mA
9. Recharge voltage : 4.16V
10. Low battery alarm
a. Idle : 3.62V
b. Dedicated : 3.50V
11. Low battery alarm interval :
a. Idle : 3min
b. Dedicated:1min
12. Switch-off voltage : 3.35V
13. Charging temperature adc range
a. ~ -2°C : not charging operation.
b. -2°C ~ 47°C : charging.
c. 47°C ~ : not charging operation.
- 30 -
3. TECHNICAL BRIEF
3.7.7 Switch ON/OFF

The phones Power State : Defined 4cases as follow
- Power-ON : mobile is powered by main battery or backup battery.
- Power-OFF : mobile isn’t any battery.
- Switch-ON : mobile powered and waken up from switch-off state.
- Switch-OFF : mobile is powered to maintain only the permanent function(ULPD).
To enter into Switch-ON state, one of following 4 condition is satisfied.
- PWR-ON : pushed after a debouncing time of 30ms.
- ON_REMOTE : After debouncing, when a falling edgeis detected on RPWON pin.
- IT_WAKE_UP : When a rising edge is detected on RTC_ALARM pin.
- CHARGER_IC : When a charger voltage is above VBAT+0.4V on VCHG.
3.7.8 Memories
• 64Mbit/32Mbit Flash/SRAM MCP + 64Mbit Flash
→ 128Mbit Flash + 32Mbit SRAM
• 16 bit parallel data bus
• ADD01 ~ ADD22
3.7.9 Display & FPC Interface

LCD module include:
Main LCD 128 160 65K Color STN LCD

Sub LCD 96 64 mono FSTN LCD
Main LCD Backlight White LED illumination and AC/DC converter Module
Sub LCD Backlight EL Backlight
7 color Indicator LED KOHA HL006-W11
LCD module is connected to main board with 32 pin FPC and connected to Speaker, Receiver,
Vibrator with 8 pin FPC connector.
FPC Interface Between LCD module and Speaker, Receiver, Vibrator
FPC Interface Between LCD module and main board
- 31 -
3. TECHNICAL BRIEF
Table 3-13. FPC Interface Spec
Pin # NAME Category Description

1 VDD3.0V PWR Driver IC power supply
2 /CS Main Driver Chip Select
3 A(1) Instruction/Data Identification(RS)
4 D0
5 D1
6 D2
MAIN
7 D3
INTERFACE Data BUS
8 D4
9 D5
10 D6
11 D7
12 /WR Main Driver Write Enable
13 /RES Main & Sub LCD driver Reset
14 VSS GND Ground
Main LCD backlight Enable
15 LED_EN BACKLIGHT (Enable High)
16 VBACKUP PWR Backup Battery
17 I_LED1 BACKLIGHT Indicator LED Enable 1(Enable High)
Sub LCD EL backlight Enable
20 EL_EN BACKLIGHT
(Enable High)
21 VBAT PWR VBAT for White LED operation
22 SUB_CS Sub Interface Sub LCD Chip Select1 (Low Enable)
23 CS2(A2) (Parallel) Sub LCD Chip Select2 (High Enable)
24 VSS1 GND Ground
25 VBAT1 PWR VBAT for White LED operation
26 MOTOR VIBRATOR Vibrator Enable
27 REC(-) Receiver Negative
28 REC(+) Receiver Positive
AUDIO
29 SPK(-) Speaker Negative
30 SPK(+) Speaker Positive
- 32 -
3. TECHNICAL BRIEF
3.7.10 KeyPad Switching & Scanning

Table 3-14. Keypad Map
KBC0 KBC1 KBC2 KBC3 KBC4

KBR0 [ ] [ ] [ ] [ ] [CFM]
KBR1 [1] [2] [3] [F4] [Voice Memo]
KBR2 [4] [5] [6] [F1] [Vol Up]
KBR3 [7] [8] [9] 1[F2] [Vol Down]
KBR4 [*] [0] [#] [SEND] [F3]
DBB supports 25 Keymap and Switch-ON Key is directly connected to ABB(see Figure 3-17).
Figure 3-17. Keypad Scanning Scheme
- 33 -
3. TECHNICAL BRIEF
3.7.11 Audio
Figure 3-18. Audio Section Scheme
Uplink
The microphone is soldered to the main PCB. The uplink signal is passed to MICIP and MICIN pins
of Nausica_CS. The MICBIAS voltage is supplied from Nausica_CS(dedicated mode only) through
switching IC(U404) and R401. The MICBIAS voltage path is switchable by control the U404.
When the headset is inserted, U400 outputs 2.8V high state and it’s input of U404(#1) and Calypso
(Jack_Detect). On detecting this 2.8V output, Calypso makes Nausica_CS switches the mic
amplifier path from main to auxiliary. In addition, this 2.8V output applied to U404(#1) and U404
switches the MICBIAS voltage path from main mic to headset mic through D401 and R419.
Figure 3-19. Uplink Path
- 34 -
3. TECHNICAL BRIEF
Downlink
The downlink signal is passed from EARP and EARN pins of Nausica_CS. When the headset is
inserted and Calypso detects ‘Jack_Detect’ signal(output of U400), Calypso makes Nausica_CS
switches the downlink path from ‘EARP’ and ‘EARN’ to ‘AUXOP’ and ‘AUXON’.
Figure 3-20. Downlink Path
Speaker Phone
In speakerphone mode, Calypso makes ‘SPK_EN’ to 2.8V and EARP signal is passed to speaker
through MIDI IC(U403).
3.7.12 KeyPad and Main LCD back-light Illumination

There are 19 Deep Blue LEDs in Main Board and 3 LEDs in LCD module for KeyPad Back-light and
Main LCD Back-light respectively, which are driven by ‘KEYLIGHT’ line from Calypso.
Figure 3-21. KeyPad and Main LCD Back-light Scheme
- 35 -
3. TECHNICAL BRIEF
3.7.13 Sub_LCD EL Illumination

In Sub-LCD EL illumination, there is an EL driver in FPCB Board, which is driven by
SUB_BACKLIGHT line from Calypso(GPIO4).
Figure 3-22. Sub-LCD EL Illumination
3.7.14 Indicator Illumination

Indicator LED control circuit can make 7 colors using multi-color LED. Multi-color LED consists of
Red LED, Green LED and Blue LED. The combination of these LEDs makes 7 colors
Figure 3-23. Indicator LED Illuination
In the case of power off mode(ON_OFF=Low), if TA is inserted, R509 is connected to VCHG and
I_LED1(Red LED) is turned-on. In other cases(ON_OFF=High), Multi-color LED is controlled by
SUB_LED1, SUB_LED2 and SUB_LED3 signal of Calypso
- 36 -
4. SERVICE S/W AND CALIBRATION
4.1 Service S/W
4.1.1 Overview
This service S/W is used for Calibration and Standalone test.
4.1.2 Hardware and software environment

- More than 486 computer
- 16Mbyte RAM
- Remained more than 10Mbyte in Hard Disk Memory
- Under Microsoft windows 98 or more than
4.1.3 Software installation

Unzip the phones service software provided where folder you want there are some files extracted in
that folder. Start Setup.exe in Service software setup folder. RampTable.dat, default transmit
ramping table, and rf_original_L300.epm, default calibration data, are located in window system
folder so that these files are loaded automatically, if you execute LaputaService.exe.
4.1.4 Common Properties of Service Software

When you execute this program, you’ll see the below user interface window titled
LAPUTA_Service Tool in figure 4-1. The LAPUTA_Service Tool has five main frames.
Figure 4-1. LAPUTA Service Tool

- 37 -
A. Target system frame

This is for initializing the target phone. When you use this program to test the phones, you have
to initialize target at first. To initialize target phone, select target (the phones is default) and COM
port used at your computer and then click the Initialize button. If target initializing is ended
successfully, the box in red below the initialize button will turn into green.
B. Rx AGC Test frame

At this part, you can control receiver path of target phone.
- Serving Freq. Setting (TCH)
You can set TCH of phone. The number means ARFCN of Traffic channel. You can change the
value by clicking arrow button by one step or just entering the number directly.
- Beacon Freq. Setting (BCH)
You can set BCH of phone. The number means ARFCN of base station broadcasting channel.
- AGC Value Setting
You can set AGC gain of phone. The number means gain of AGC amplifier in Rx path.
- Power Measurement
The number means channel index according to pre-defined ARFCN. There are 12 pre-defined
ARFCNs within Rx band. 4 ARFCNs are for GSM and others for DCS. Clicking arrow button to
change number, you can see TCH and BCH ARFCN changed automatically.
PM window displays the power level measured in baseband chip. PM value is useful to
calculate the received absolute power. The unit of PM is dBd.
- PM Start
You can measure Rx power that target received from test equipment. When you click this
button the result of power measurement displayed at PM blank in Power Measurement frame.
You can measure PM for all 12-channel indexes by changing Number and clicking PM Start.
- Calculate
You have to do this work after measuring PM for all 12-channel indexes. When you click this
button, service software calculate the calibration data from measured 12 PM data.
- Standalone
This button makes target operate in Rx mode continuously. Target will be operated under the
condition that you set. During continuous receiving mode, label of Standalone button is
changed to Stop. If you want stop receiving mode operating, click this button one more.
- 38 -
C. Tx APC Test frame

At this part, you can control transmit path of target phone.
- Serving Freq. Setting (TCH)
You can set TCH of phone. The number means ARFCN of Traffic channel.
- Beacon Freq. Setting (BCH)
You can set BCH of phone. The number means ARFCN of base station broadcasting channel.
- Power Level Setting
First, you have to choose operating mode (GSM or DCS) according to TCH and BCH frequency
that you selected before. Then select the Level and adjust the DAC value. Level means
GSM/DCS output power level. Usable range is 5 to 19 for GSM, 0 to 15 for DCS. DAC value is
a factor to determine output power. Its variable range is 0 to 1023.
- Uplink Normal Burst test
You can also control the traffic slot number be using by changing TCS value. Because GSM
has 8-time slot, TCS value varies 0 to 7. Patten is to select data format that is transmitted. You
can send all data 0, or 1 or repeating of 1010. But it is good to you to using the default value
because data format doesn’t affect to RF characteristics.
- Test
Transmitting is started when you click this button. During Transmitting, label of Test button is
changed to Stop. If you want stop transmitting, click this button one more.
D. RF Parameter Download frame

- Saving epm file into Flash
When you have a epm file, contains calibrated data, and you want to download into target
Flash, check Flash and click File Download button. Then you can see RF parameters Save
window. Select epm file you want to save into Flash then click Open. During saving file into
Flash, The statement bar indicating download process is displayed under the RF Parameter
Download frame. As successfully ending download, information box will be appeared. Click Ok.
- Saving Cal. Data to Flash
After Rx or Tx calibration, you can save the calibration results into Flash and epm file. Check
Flash and click Calib Save button. Then you can see RF parameters Save window. Write the
file name and click Save button.
E. User Command and Results frame

Whenever you click button or make some event in service software, every ordered event is
displayed in this frame. You can also see calibration results here.
F. Ramp Shape button

This button is for burst shape table. But it is deactivated in service software.
- 39 -
4.2 Calibration
4.2.1 Overview
All tuning operations of the phone are carried out using the service software. The service software
turns the phone into the locals mode, in which the phone can be outwardly controlled via the test
Jig.
The calibration values of the phone reside on the Flash. The contents of the Flash can be read by
the service software and saved as a file. This is advisable when there is need to retain that
information, e.g. in view of replacement of the circuit. The program also enables writing the default
parameters on the Flash, in which case all calibration steps should be carried out. The service
software can’t control the equipment, so only manual calibration process is possible.
4.2.2 Equipment List

Table 4-1. Calibration Equipment List.
Equipment for Calibration Type / Model Brand

Wireless Communication HP8960,HP8922, CMU200, any other call equipmen
Test Set
RS-232 Cable and Test JIG
RF Cable
Power
Service SW (LAPUTA)
Test SIM Card
PC(for Software Installation) Pentium II class above 300MHz
- 40 -
4.2.3 Equipment Setup
+
-
+ -
Figure 4-2. Calibration Equipment Setup
- 41 -
4.2.4 Calibration Steps

A. RX Calibration
In order for the RSSI measurements to be within the GSM specifications, some calibration is
necessary. Also, due to AGC implementation, some AGC specific constants need calibration. In
total, three calibrations are required per receive band, AGC calibration, channel compensation
and temperature compensation. Of these, temperature compensation is not needed in
replacement of the circuit. In AGC calibration the reference power fed into the phone via
permanent antenna connector is –74dBm. In channel compensation, the channel numbers in Rx
band are;
E-GSM band : 0, 40, 124, 975, and 1023.
DCS band : 512, 574, 636, 700, 760, 822 and 885.
- Procedure
a) Initialize phone by clicking Initialize button.
b) Set the GSM test equipment CW mode and BCH and TCH of GSM test equipment ‘0’, same
with phone.
c) Set the power of GSM test equipment ‘–74dBm’.
d) Click the PM Start button, then the value, received power by phone, is displayed in PM
measurement window at service software.
e) Change the BCH and TCH of phone by clicking the Number button and set the channel
(BCH & TCH) of equipment to be same.
f) Click the PM Start button.
g) Repeat above procedure until the displayed number in Power Measurement window is 12.
h) Click the Calculate button, then the service software calculate the channel compensation
parameters.
i) Saving updated calibration data into phone by clicking Calib Saving button.
NOTE
If the calibration does not done for all channels, 5 channels for EGSM900 and 7 channels for
DCS1800, the service software reports, “Please execute after measuring the PM”.
B. TX Calibration
In order for the Tx power to be within the GSM specifications for each Tx level, some calibration
is necessary. In total, four calibrations are required per transmit band, power calibration, channel
compensation, temperature compensation and low voltage compensation. Of these, temperature
compensation and low voltage compensation are not needed in replacement of the circuit and
channel compensation is not needed because the transmit power is in GSM specification with
enough margin.In power compensation, the channel numbers used in Tx band are;
E-GSM band : 62.
DCS band : 699.
And the target powers in dBm for each power level are;
- 42 -
Table 4-2. Tx targer powers
Power level GSM DCS

0 29
1 28
2 26
3 24
4 22
5 32 20
6 31 18
7 29 16
8 27 14
9 25 12
10 23 10
11 21 8
12 19 7
13 17 6
14 15 5
15 13 4
16 11
17 9
18 7
19 6
-Procedure
a) Initialize phone by clicking Initialize button.
b) Set the BCH and TCH of the phone 62 for E-GSM900 and 699 for DCS1800. Of cause you
have to match test equipment’s BCH and TCH ARFCN with this value. For each power level,
adjust the DAC value to get target power and click Test button. Then you can see the output
power displayed on test equipment.
c) Saving updated calibration data into phone by clicking Calib Saving button.
- 43 -
4.2.5 Test JIG Operation

Table 4-3. JIG Power
Description
Power Supply Usually 4.0 V
DC Adaptor 9.5V, 500mA
Table 4-4. JIG DIP Switch
Switch Number Name Description

Switch 1 RPWRON In ON state, phone is awaked.
Switch 2 HF_DETECT Turn on for AUDIO TEST.
Switch 3 Power Supply Power is provided for phone from Power Supply.
Switch 4 D.C power Power is provided for phone from DC adaptor.
Table 4-5. LED Description
LED Number Name Description

LED 1 POWER Power is provided for Test Jig
Indicate charging state of the Phone Battery with Travel
LED 2 CHARGER
Charger.
LED 3 UART IRDA Indicate date transfer state through the UART IRDA.
LED 4 UART MODEM Indicate date transfer state through the UART MODEM.
- Operation
1) Connect the RS232 Serial Cable between COM port of notebook and MON port of test JIG in
general.
2) Set the Power Supply 4.0V. Also DC adapter may be used.
3) Set the 3rd of DIP SW ON state. In case of DC adapter, set 4th ON state.
4) Press the Phone power key. If the Remote Power On is used, switch the 1st of Dip Switch ON.
- 44 -
5. DOWNLOAD
5. DOWNLOAD
5.1 Download Setup
5.1.1 Download Equipment

1) Data Kit
2) Desktop or Notebook PC
3) Download Monitor Program
4) The phones mobile phone
+ -
- 45 -
5. DOWNLOAD
5.2 Download Procedure
5.2.1 General Purpose

This document gives a guideline for upgrading software of the phones using UART port.
5.2.2 Download Environment

In order to download software of the phones, the following working environments should be
prepared: the phones Data Link Kit, DK-10G that is connected to COM1 or COM2 serial port in the
Desktop or Notebook PC.
The phones Data Kit Download Monitor Program that is copied to Desktop PC or Notebook PC.
Target SW* downloaded to the phones mobile phone.
Note : Target SW* means any necessary software to be downloaded to the mobile phone.
Warning
You must use the Data Link Kit(DK-10G) and UART Download Monitor program that are provided
from LGE. Otherwise downloading process won’t properly
- 46 -
5. DOWNLOAD
5.2.3 Download Procedure

A. Unzip the phones UART Download monitor program(monitor 663.zip) in PC.
B. Execute monitor663.exe. And then select the “Target” Menu shown in Figure 5-1. Then, choose
“Connect” in the Target Menu.
Figure 5-1.
C. A table will be displayed as shown in Figure 5-2. Then press the arrow-button and choose a
correct serial port. And press “OK” button.
Figure 5-2.
- 47 -
5. DOWNLOAD
D. As the following window shown in Figure 5-3. is displayed, connect the phones Phone to Data
Link Kit, DK-10G and power on the phones. If the connection is succeeded, the following screen
will show the contents as shown in Figure 5-4.
Figure 5-3.
Figure 5-4.
- 48 -
5. DOWNLOAD
E. Click on “Flash” on the top menu and select “Get type” item as shown in Figure 5-4. and select
“Erase and Program Appli Only+Boot” item as shown in Figure 5-5.
Figure 5-5.
F. Finally choose the target SW that you want to download. And then you can see the following
window in Figure 5-6.
Figure 5-6.
- 49 -
5. DOWNLOAD
G. If the downloading procedure is succeeded, then the following window is shown.
Figure 5-7.
- 50 -
6. TROUBLE SHOOTING
6. TROUBLE SHOOTING
Figure 6-1. shows a measurement set-up.
Figure 6-1. Measurement set-up
- 51 -
6. TROUBLE SHOOTING
6.1 Rx Trouble (EGSM)
- 52 -
6. TROUBLE SHOOTING
6.2 Rx Trouble (DCS)
- 53 -
6. TROUBLE SHOOTING
6.3 Tx Trouble
U200 : CALYPSO
(BB Digital Main Chip)
U201 : NAUSICA CS
(BB Analog Main Chip)
U601 : PAM (PF08122B)
U604 : RF Main Chip (TRF6150)
U600 : TXVCO (ENFVZ4LO7)
U603 : Antenna S/W
(SHS-M090B)
N600 : Directional coupler
(LDC15D 190A0007A)
D600 : Shottky Diode
(BAT 15-099)
- 54 -
6. TROUBLE SHOOTING
- 55 -
6. TROUBLE SHOOTING
6.4 Voice Function Trouble

A. Receiver
B. Speaker
- 56 -
6. TROUBLE SHOOTING
C. Microphone
- 57 -
6. TROUBLE SHOOTING
6.5 Display Function Trouble

A. LCD
- 58 -
6. TROUBLE SHOOTING
B. Indicator LED
- 59 -
6. TROUBLE SHOOTING
6.6 Other Function Trouble

A. Vibrator
- 60 -
6. TROUBLE SHOOTING
B. Charger
- 61 -
7. STAND ALONE TEST AND TEST POINTS
7.1 Testing Set-up
7.1.1 Received RF Level and Checks

This section shows the typical RF levels expected throughout the receiver path. A block diagram
showing the locations of the RF measurement points and levels is shown in Figure 7-3.
Receiver Testing Set-up

To check the receiver the following conditions have to be set:
1. On a signal generator or a GSM/DCS test box, output a CW signal of amplitude = -60 dBm at
either: 947.4 MHz (CH62) when testing the GSM RX path or 1842. 6 MHz (CH699) when testing
the DCS RX path.
2. Set the DC power supply to 4.0 V.
Note: All RF values shown are only intended as a guide figure and may differ from readings taken
with other test equipment and leads. Lead and connector losses should always be taken into
account when performing such RF measurements.
Testing Receiver
Using a suitable high frequency probe measure the RF levels at the relevant points shown in
Figure 7-2. and compares your measurements with those shown in the diagram. If there are any
major difference between the readings taken and those indicated then further investigation of that
particular point will be required. It will also be necessary to ensure that all the following power
supplies and signals are present which control this part of the receiver circuit:
1. The Control Signal of Antenna switch (see Figure 7-9,10,11 )
2. Vreg 1,2,3 (see Figure 7-7 )
3. 2V85_VCTCXO (see Figure 7-8)
4. 13MHz(see Figure 7-12)
5. CLK, DATA, EN (see Figure 7-13)
6. RX IP, IN, QP, QN (see Figure 7-16,19)
7. Vtune(see Figure 7-17,18)
- 62 -
7.1.2 Transmitted RF Level and Checks

This section shows the typical RF levels expected throughout the transmitter path. A block diagram
showing the locations of the RF measurement points and levels is shown in Figure 7-5.
Transmitter Testing Set-up

To check the transmitter the following conditions have to be set:
1. Configure the testing equipments as Figure equipment setup.
2. Set the GSM/DCS test equipment to be stand-alone mode (asynchronous mode).
3. Set the BCH and TCH ARFCN ‘62’ for EGSM900 or ‘700’ for DCS1800 on GSM/DCS test
equipment.
4. Set the DC power supply 4.0volts.
5. Initialize target on service software.
6. Set TCH and BCH value to be same with GSM/DCS test equipment on service software.
7. Select GSM or DCS mode on service software.
8. Set DAC ‘600’ for EGSM900 or ‘700’ for DCS1800 on service software.
9. Click Test.
Note: All RF values shown are only intended as a guide figure and may differ from readings taken
with other test equipment and leads. Lead and connector losses should always be taken into
account when performing such RF measurements.
Testing Transmitter
Using a suitable high frequency probe measure the RF levels at the relevant points shown in
Fig. 7-4 and compare your measurements with those shown in the diagram. If there are any major
difference between the readings taken and those indicated then further investigation of that
particular point will be required. It will also be necessary to ensure that all the following power
supplies and signals are present which control this part of the transmitter circuit:
1. The Control Signal of Antenna Switch(see Figure 7-9, 10, 11)
2. Vreg 1,2,3 (see Figure. 7-7)
3. 2V85_VTCXO (see Figure. 7-8)
4. 13 MHz (see Figure. 7-12)
5. PA_ON, PA_LEVEL, Vapc (see Figure. 7-14)
6. TX IP, IN, QP, QN (see Figure. 7-15)
- 63 -
7.2 Testing Points
7.2.1 RF components (Component Side)
N600 D600
SW600
U603
U607
BPF600
U601
D601
BPF601
U602
U604 U605
U600
U606
U629
D602
Figure 7-1. RF components (Component Side).
Table 7-1. RF components
Reference Reference
U604 RF main chipset U600 Dual RF VCO
U603 Antenna Switch U606 VCTCXO
U601 PAM U602 Balun
N600 Coupler BPF601 GSM RF SAW Filter
U607 NOR Gate BPF600 DCS RF SAW Filter
U629 Inverter SW600 Mobile Switch
U605 LDO D600 Dual Schottky Diode
D601 Varactor Diode D602 Varactor Diode
- 64 -
7.2.2 Test point of Rx Levels
2
1
2
5
6
Figure 7-2. Test point of Rx Levels.
- 65 -
GSM: CH.62, -60dBm
DCS: CH.699, -60dBm
- 66 -
Figure 7-3. Receiver RF Levels
7.2.3 Test point of TX Levels
6 13 5
12
11
10
1, 7
9
2, 8
Figure 7-4. Test point of TX Levels.
- 67 -
GSM: Pwr LvI 5, Ch.62, -32dBm
DCS: Pwr LvI 0, Ch.700, -29dBm
- 68 -
Figure 7-5. Transmitter RF Levels
7.2.4 Control signal test points
VC2
VC1
VAPC
I/Q
Regulator 2V85
LB_SW
13MHz
HB_SW
Vtune
TXRX_SW
PA_LEVEL PA_ON CLK, DATA, EN Vtune
Figure 7-6. Control signal test points
- 69 -
Figure 7-7. 2V85_Vreg 1, 2, 3 Output
Figure 7-8. 2V85_VCTCXO Supply Voltage
- 70 -
Figure 7-9. Antenna S/W control voltage in EGSM_TX
VC1
VC2
Figure 7-10. Antenna S/W control voltage in DCS_TX
- 71 -
VC1
VC2
Figure 7-11. Antenna S/W control voltage in RX
Figure 7-12. 13MHz Clock
- 72 -
CLK
DATA
EN
Figure 7-13. CLK, DATA, EN
Figure 7-14. PA_ON, PA_LEVEL, VAPC (GSM Tx Level=7)
- 73 -
Figure 7-15. Tx I / Q Signal
Figure 7-16. Rx I / Q Signal
- 74 -
Figure 7-17. PA_ON, Vtune (U600 pin 13, GSM 1CH)
Figure 7-18. PA_ON, Vtune (U600 pin 13, DCS 512CH)
- 75 -
Figure 7-19. RX I/Q Signal(Extended)
- 76 -
8. DISASSEMBLY INSTRUCTION
1. Remove the battery and screws.
2
1
Figure 8-1. Removing Screws
- 77 -
2. Use a thin plastic sheet to slide and open the gap between front and rear covers, and detach
them carefully with both hands.
3. Then carefully remove the rear cover from the hooks as shown in Figure 8-2.
1
2
1
Figure 8-2. Disassembling covers
4. Unlock the PCB and remove other components as shown in Figure 8-3.
Figure 8-3. Unlocking and removing the PCB
- 78 -
5. Firstly, insert one side of FPCB carefully into the slot.

Then place the PCB under the hook 1 first and push the other end of PCB under the hook 2
1
2
Figure 8-4. Assembly of PCB with the cover
- 79 -
6. Remove the antenna and use a sharp awl to push away the antenna-bushing.
Figure 8-5. Removing antenna-bushing
- 80 -
7. Use a tweezers to remove the battery locker.
1
1
2
Figure 8-6. Removing battery locker
8. When removing the side button from the main front, please see the insert-nut next to the button
and carefully remove it.
Insert-nut
Figure 8-7. Removing a side button
- 81 -
9. Push away the hinge to remove the folder.
Figure 8-8. Removing Folder
10. Remove the hinge, and detach screw caps by using a pin.
Figure 8-9. Removing hinge and screws
- 82 -
11. Use a thin plastic sheet to slide and open the gap between the folders.
Then detach them carefully with both hands.
Figure 8-10. Disassembling Folders
- 83 -
12. Finally detach the rest components as shown in Figure 8-11.
Figure 8-11. Disassembly of the rest components
- 84 -
9. BLOCK DIAGRAM
9. BLOCK DIAGRAM
9.1 Main Board

The phones is made up of two PCBs. In lower part of the folder, there is a main board. And in the
upper part of the folder, there is a FPCB. Below you can see the block diagram of both PCBs.
Figure 9-1. Main Block diagram.
- 85 -
9. BLOCK DIAGRAM
9.2 FPCB
Figure 9-2. FPCB Block diagram.
- 86 -
9. BLOCK DIAGRAM
9.3 RF
Figure 9-3. RF Block diagram
- 87 -
10. CIRCUIT DIAGRAM
10. CIRCUIT DIAGRAM

10.1 BB Circuit
1 2 3 4 5 6 7 8
SIM_CLK
SIM_RST VCHG
SIM_I_O
SIM_VDD C100 C101
HSP100
HSP101
HSP102
HSP103
A 10u/16V 22n A
3
2
A_case
R100
CLK
RST
VCC
C109 C103 20K VR2B

100n/16V 150p 4 6
J100 (2012) ICTL
GND
VPP
Q100
IO
3
LG_AMP_SIM NDC652P
1 2 5
7
6
R117
0R
VBAT_2
5 D100
2 4 CRS08
A(3)
U101 3
VR2B
SN74HC1GU04DCKR VBAT
VR2B R116
0.2R(1%)
VR2B VR2B (2012)
B B
R118
10K
FOLDER R119 C104
OUT
R120 U102 0R 10u

RPWRON VCC_EXT
0R (2012)
GND
R121 1 A0 VCC 14
10K R122
2 B0 A2 13
IN
1 A(2) R123 10K

Q101 MAIN_CS 4
0R
HSP129
2 3 O0 B2 12
RN1307 A(0)
3
ON_OFF U103
P0402FC12C
4 A1 O2 11
NC7SZ32
V102
5 B1 A3 10
SUB_CS
6 O1 B3 9
VCHG VBAT R124
7 GND O3 8 0R
C MIDI_CS C
L100
BLM15AG100PN1 P0402FC12C P0402FC12C
MC74VHC126 VBAT VBACKUP
J102
V100 V101 _CS3 LG_LCD_CON_30P
L102 C105 1
VDD_3.0V
BLM15AG100PN1 47p L103 BLM15AG121PN1 2
MAIN_CS L104 3
MAIN_CS
A(1) BLM15AG121PN1 A0 (D/I)
D(0:7)
BATT_TEMP L105 4
D(0) BLM15AG121PN1 D0
R101 VR2B D(1) L106 BLM15AG121PN1 5
D1
27
26
20K R102 D(2) L107 BLM15AG121PN1 6

D2
33K D(3) L108 BLM15AG121PN1 7
D3
D(4) L109 BLM15AG121PN1 8
D4
4 D(5) L110 BLM15AG121PN1 9
VCHG2
7
5
3
1
D D5 D
5 D(6) L111 BLM15AG121PN1 10
VCHG1 R103 D6
R104 D(7) L112 BLM15AG121PN1 11
MNR04 D7
21
BATT2 10K 10K
22 L113 BLM15AG121PN1 12
BATT1 _WR _WR
8
6
4
2
R105 R106 L114 13

LCD_RESET BLM15AG121PN1
24 100R 47R MNR04 14
_RES
AUXI
23 2 1
AUX_IN R109 VSS
CTS
20 4 3
CTS L190 220R 15
RTS RTS MAIN_BACKLIGHT BLM15AG121PN1 LED_EN
15 6 5 16
TX
14 8 7
TX 17
VBACKUP
TXD TXD I_LED1 18
I_LED1
18 R107 4.7R I_LED2 19
I_LED2
AUXOP
17 R108 4.7R AUXOP I_LED3 L124 BLM15AG121PN1 20
I_LED3
AUXON AUXON SUB_BACKLIGHT 21
EL_EN
R110 VBAT
47R MNR04
13 2 1 L115 BLM15AG121PN1 22
RXD
10 4 3
RXD SUB_CS L116 23
SUB_CS
RX RX A(2) BLM15AG121PN1 CS2 (A2)
3 6 5 24
DSR
2 8 7
DTR 25
VSS1
E HANDSFREE HANDSFREE 26
VBAT1
E
6 R111 1K MOTOR L117 27
MOTOR
POWER_ON RPWRON (REC_N) EARN BLM15AG121PN1 REC-
L118 BLM15AG121PN1 28
REC_P L119 29
REC+
R112 47R MNR04 SPKN BLM15AG121PN1 SPK-
11 2 1 L120 BLM15AG121PN1 30
TDO
9 4 3
TDO SPKP SPK+
TMS
8 6 5
TMS
TCK
7 8 7
TCK
HSP512
HSP127
HSP126
HSP128
HSP513
HSP514
TDI TDI
HSP134
HSP136
HSP135
HSP133
HSP130
HSP131
HSP132
HSP137
16
DCD DCD
1 C108 R114
HSP104
HSP105
HSP106
HSP107
HSP108
HSP109
HSP110
HSP111
HSP112
HSP113
HSP114
HSP115
HSP116
HSP117
HSP118
HSP119
HSP120
HSP121
HSP122
AUXGND R113 n.m MNR04 C110

12 2 1
GND2 PCM_TX 1uF
19 4 3
GND1
6 5
PCM_SYNC 47p 1M (1608)
8 7
PCM_CLK
PCM_RX
25
C106 C107
47p 47p
F F
R115 Section Date Sign & Name Model Sheet/Sheets
0R Designer 02.04.11 D.S.JUNG
J101 1/6
Checked 02.04.11 N.S.KIM Drawing

LG-IO_CONN_24P BASEBAND INTERFACE
Name
Approved
L
LG Drawing
Electronics Inc No.
issue Notice NO. Data Name
1 2 3 4 5 6 7 8
- 89 -
10. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8 9 10 11 12
R231 0R
KEYLIGHT
PWT
VR2B
LCD_RESET
JACK_DETECT
SUB_BACKLIGHT
DTR R672 10K
DCD
MELODY_INT
A FOLDER A
XO_ENA
RF_ENA
SUB_LED2
SUB_LED3
SUB_LED1
MELODY_RESET VDD_RTC
PCM_CLK
PCM_SYNC
PCM_RX
PCM_TX C233
CTS 100p
RXD TP220
VR2B
RTS UPR UPR
B TXD B
C202 C203 R221
RXIR_IRDA 20P UPR UPR
20P n.m
R223
R222
TDO_ARM
TXIR_IRDA VBAT
RPWRON
R201
nBSCAN
SD_IRDA X200
MC-146 R220
220K
GND
_WR
TMS
TDO
TCK
RX 10K
TDI
4 1
TX
10K
n.m
R202 R203
3 2 R224
TP221 0R C204 10K 10K
TP222
18p
VBAT
_WR
ON_OFF
M10
N10
H10
N11
C13
C12
A13
A12
P11
A14
B13
L10
M9
M4
M2
N9
C8
D8
C7
D9
C9
N1
N3
N2
K8
P9
B8
A8
B9
E8
A9
K9
P3
K7
L9
L4
L7
C TDI C
SDO_INT10n
SDI_SDA
SCLK_INT1n
NSCS0_SCL
NSCS1_X_A2
TX_IRDA
RX_IRDA
CLKOUT_DSP_SD_IRDA
X_A4_TXIR_IRDA
X_A1RXIR_IRDA
TX_MODEM
RTS_MODEM_TOUT
DSR_MODEM_LPG
RX_MODEM
CTS_MODEM_XF
TXD_MCSI_1_09
RXD_MCSI_1_010
FSYNCH_MCSI_1_012
CLK_MCSI_1_011
RFEN_NoPC
TCXOEN
niBOOT
I_O0_TPU_WAIT
I_001_TPU_IDLE
I_O2_IRQ4
I_O3_SIM_RnW
TSPDI_I_O4
BCLKX_I_O6
I_O7_NRESET_OUT
ARMCLK_BCLKR
IDDQ
PWT_BU
PWL_LT
VSSO
OSC32K_IN
OSC32K_OUT
CLK32K_OUT
TMS
TCK
TDO
J14
HANDSFREE
CLK H11
TSPCLKX END_ON_OFF
DATA TSPDO
E13
RPWRON
CLKTCXO
F12
13MHZ
H13
START_BIT_CLK13M_OUT MCLK
VBACKUP
B10
A10
TSPEN0 C205 1n
K4
A4
F1
J4
H12
EN H14
TSPEN1
TSPEN2
OSCAS
PWON
RPWON
TDR
TEN
CK13M
G12
nSCS2_TSPEN3 TP216 TP217 TP218 TP204 TP205 TP206 TP219
M12 R225 C5
RESET_RF M14
TSPACT00
1M D201 LCDSYNC
A6
TSPACT01 TSCYM
L12 B6
TSPACT02 1SS388 TSCXM
L13 F10 D10 B5
TSPACT03 ON_OFF ON_OFF ADIN1
J10 D12 F6 A5
K11
TSPACT04 nRESPWON RESPWRONZ ADIN2
E6
BATT_TEMP
PA_ON K13
TSPACT05 ADIN3
D6
RADIO_TEMP
D K12
TSPACT06
B14 D7
ADIN4_TSCXP
C6
HOOK_DETECT D
TP208 TSPACT07 INT4n_IT_WAKEUP RTC_ALARM ADIN5_TSCYP
K14 P1 F7 F10
TSPACT08 EXT_FIQ INT1 DAC
J11 M3 H4 F8
J12
TSPACT09 EXT_IRQ INT2 AFC
F9
AFC
D(0:15) J13
TSPACT10 APC
G8
PA_LEVEL
TSPACT11 AUXGND C206 33n
F2
TESTRESETZ
D(0) B7 C8
DATA00 TEST1
D(1) D7 B11 B8
DATA01 NEMU0_ TEST2
D(2) E7 E10 A9
DATA02 NEMU1_ TEST3
D(3) D6 D11 B9 E10
DATA03 NBSCAN_ TEST4 BDLQM QN
D(4) A6 D10 C7 E9
DATA04 TDI TDO BDLQP QP
D(5)
D(6)
C6
DATA05
U200 TDO
C10 A7
TDI U201 BDLIM
E8
IN
E6 B10 B7 E7
DATA06 TCK TCK BDLIP IP
D(7) C5
DATA07 TMS
E9 A8
TMS NAUSICA_CS BULQM
D9 R204 390R R280 0R
D(8) R205 390R R281 0R
D(9)
B5
D5
DATA08
DATA09
CALYPSO BULQP
BULIM
D8
C10 R206 390R C213 R282 0R
D(10) E5 C9 R207 390R 270p R283 0R
DATA10 BULIP
D(11) B4 L11 J5
DATA11 BFSR BFSX
D(12) C4 K10 K5
DATA12 BDR BDX
D(13) D4 P12 G5
E D(14) A3
DATA13 BFSX
M11 H5
BFSR
C211 E
DATA14 BDX BDR
D(15) B3 270p
A(0:22) DATA15
A(0) F3 P14 K7
ADD00 VDX VDR
A(1) F2 N13 G6 K9
A(2) G5
ADD01 VDR
M13 G7
VDX MICBIAS
H7
MICBIAS
A(3) G4
ADD02 VFSRX
N12 H6
VFS AUXI
J7
AUXI
ADD03 VCLKRX VCK AGNDA1
A(4) G2 K8
A(5) G3
ADD04 MICIP
J8
MICIP
A(6) H1
ADD05 MICIN
H9
MICIN
A(7) H3
ADD06
N7 J6
EARP
H8
EARP
A(8) H2
ADD07 MCUDI
M7 K6
UDX EARN
J9
EARN
A(9) H4
ADD08 MCUDO
M8 F5
UDR AUXOP
J10
AUXOP
A(10) H5
ADD09 MCUEN0
P8
UEN AUXON
K10
AUXON
A(11) J1
ADD10 MCUEN1_I_O8
L8
SPK_EN BUZZOP
ADD11 MCUEN2_I_O13 C215
A(12) J2
ADD12
A(13) J3 G13 B2 A3 220n C216 1u
ADD13 SIM_IO SDIO3 VAUX
A(14) J4
ADD14 SIM_CLK
F13 C4
SCLK3 VS2
A1
A(15) K3 G10 B3 B1 (1608)
ADD15 SIM_RST SRST3 VS1
A(16) K2 G11 VR2B A2
F A(17) K4
ADD16 SIM_CD_MAS0
F14
SVDD
D4
SIM_VDD F
ADD17 SIM_PWCTRL_I_O5 VBAT_2 SDIO5 SIM_I_O
A(18) J5 B4
A(19) L1
ADD18 R208 R209 SCLK5
D5
SIM_CLK
A(20) L2
ADD19 20K SRST5 SIM_RST
A(21) ADD20 1M UPR VBAT
L3
ADD21
A(22) D2 UPR D200 VBACKUP
ADD22
1SS388
KBC4_XD1_02
KBC3_XD1_01
KBC2_XD1_00
XD1_03_KBR0
XD1_04_KBR1
XD1_05_KBR2
XD1_06_KBR3
XD1_07_KBR4
K3 C3
nBHE_I_O14
nFWE_X_A0
VCC1 UPR
nBLE_I_O15
nFOE_X_A3
KBC1_NIRQ
VDDS_MIF0
VDDS_MIF1
VDDS_MIF2
VDDS_MIF3
KBC0_NFIQ
FDP_nIACK
VDDS_RTC
D2 J3
VDDS_1_1
VDDS_1_2
GND_ANG
GND_RTC
VDD_ANG
VDD_RTC
VCC2 VBACKUP
GND_PLL
VDD_PLL
G9 E5
VDDS_2
VCC3 VBAT
nCS3_
nCS2_
nCS1_
nCS0_
GND10
GND11
RnW_
GND0
GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
GND9
VDD0
VDD1
VDD2
VDD3
VDD4
VDD5
E4
VCHG VCHG
N.C
R211 K2 E3
SWITCH ICTL ICTL
TP209
TP210
TP211
TP212
TP213
TP214
20K J1
VDD_RTC VR1 VR2B V1B VR3 VR2 FDBK
N14
D13
D14
C14
C11
A11
B12
E11
E12
E14
F11
L14
M5
M6
M1
G1
N4
N6
D1
N5
N8
P5
K5
K6
P6
A4
B6
A5
P7
E1
K1
P2
P4
A7
A2
B1
G14
F1
L5
L6
P10
P13
A10
H3
RESERVED
C1
C3
C2
D3
B2
E2
E4
E3
F5
F4
E2 G4
VR2IN BGTR1
D3 G3
VR2SEL BGTR2
G2 R226
BGTR3
H1 H2 C217 100n n.m
VR1OUT BGTR4
R227 0R E1 J2
_WR R228 0R H10
VR2OUT BGTR5
G1
_RD R229 0R C1
VR3OUT IBIAS
F4
G VR1BOUT VREF G
REFGND
D1 VDD_RTC
GRND1
GRND2
GRND3
VR2BOUT VBACKUP
_CS3
_CS2 R219
_CS1 C218
K1
C2
G10
F3
_CS0 D202 100n 120K U202

1SS388 3 2
C222 OUT IN
FWE
C223 C224 C225 C226 C227 C234 C219 C220 C221

_BLE 10u 2.2u 10u 10u 10u 1 4
100n 100n 100n 100n 100n
KBC(4)
KBC(3)
KBC(2)
KBC(1)
KBC(0)
KBR(0)
KBR(1)
KBR(2)
KBR(3)
KBR(4)
_BHE (2012) (2012) (2012) (2012) (2012) C228 C229 GND NC

100n 100n C231 C230
FDP S-817
100n 100n
KBC(0:4)
C232
KBR(0:4) 33u/6.3V
A-CASE
H H
Section Date Sign & Name Model Sheet/Sheets

Designer 02.04.11 D.S.JUNG 2/6

Name BASEBAND CHIPSET
Approved
LG Drawing
Electronics Inc No.
1 2 3 4 5 6 7 8 9 10 11 12
- 90 -
10. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8
A A
VR2 VR2
B D(0:15) B
A(1:22)
TP301
U302 U301
TC58FVB641 TH50VSF4683
A(1) G2 G3 D(0) D(0) J3 G2 A(1)
A0 DQ0 DQ0 A0
A(2) F2 K3 D(1) D(1) G4 F2 A(2)
A1 DQ1 DQ1 A1
A(3) E2 G4 D(2) D(2) K4 E2 A(3)
A2 DQ2 DQ2 A2
A(4) C2 K4 D(3) D(3) H5 D2 A(4)
A3 DQ3 DQ3 A3
A(5) D2 K5 D(4) D(4) H6 F3 A(5)
A4 DQ4 DQ4 A4
A(6) F3 G5 D(5) D(5) K7 E3 A(6)
A5 DQ5 DQ5 A5
A(7) E3 K6 D(6) D(6) G7 D3 A(7)
A6 DQ6 DQ6 A6
A(8) C3 G6 D(7) D(7) J8 C3 A(8)
A7 DQ7 DQ7 A7
A(9) D6 H3 D(8) D(8) K3 C7 A(9)
C C6
A8 DQ8
J3 H4
DQ8 A8
E7
C
A(10) A9 DQ9 D(9) D(9) DQ9 A9 A(10)
A(11) E6 H4 D(10) D(10) J4 F7 A(11)
A10 DQ10 DQ10 A10
A(12) F6 J4 D(11) D(11) K5 C8 A(12)
A11 DQ11 DQ11 A11
A(13) D7 H5 D(12) D(12) J7 D8 A(13)
A12 DQ12 DQ12 A12
A(14) C7 J6 D(13) D(13) H7 E8 A(14)
A13 DQ13 DQ13 A13
A(15) E7 H6 D(14) D(14) K8 F8 A(15)
A14 DQ14 DQ14 A14
A(16) F7 J7 D(15) D(15) H8 D9 A(16)
A15 DQ15 DQ15 A15
A(17) G7 G9 A(17)
A16 A16
A(18) D3 J5 J5 F4 A(18)
A17 VDD VCCF A17
A(19) E4 J6 E4 A(19)
A18 VCCS A18
A(20) F5 K2 K6 D7 A(20)
A19 VSS0 DU_CIOS A19
A(21) F4 K7 J9 E6 A(21)
A20 VSS1 VSS0 A20
A(22) E5 G3 E9 A(22)
R302 A21 VSS1 A21
A1
0R NC0
H2 A2 A1 H2 R300 0R
_CS1 J2
CE_ NC1
A7 A10
NC0 CEF_
H3
_CS0
C5
OE_ NC2
A8 B1
NC1 OE_
C6
_RD
H7
WE_ NC3
B1 B10
NC2 WE_
H9
_WR
BYTE_ NC4 NC3 BYTE_
B7 C1 VR2
D NC5 NC4 D
C4 B8 F1 E5
RY_BY_ NC6 NC5 RY_BY_
D4 F10 C5
WP_ NC6 WP_
D5 L1 G1 D5
RESET_ NC7
L2 G10
NC7 RESET_ FDP
NC8 NC8
L7 L1 C4
NC9
L8 L10
NC9 LB_
D4
_BLE
NC10
M1 M1
NC10 UB_
J2 R303 0R _BHE
NC11
M2 M10
NC11 CE1S_
D6
_CS2
NC12 C300 NC12 CE2S_
M7 G8 R305
NC13 DU
M8 100n 10K
NC14
R301 n.m C304
C301 33n
100n
E E
F F

Name MEMORY DEVICE
Approved
LG Drawing
Electronics Inc No.
1 2 3 4 5 6 7 8
- 91 -
10. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8
VR3
R400 2
1K
5 6
MICBIAS 4
A C402 A
C401 47p
C400 10u
1 3
47p (2012) U404 D401 R401
JACK_DETECT MAX4599 KDS160E
2.4K
MICIP
C404
100n C406 C407 HSP400 HSP401 MIC400 Microphone
C405 C403
47p 47p OB-22S40-C33
47p n.m
C408
100n
MICIN
B C409 R402 B
47p 1.2K
VR3 VR3 C410

R419 33p
7.5K
VR3 R404 R405 EARN EARN Receiver

18K 1M REC_P
U400 HSP402 HSP403

MAX9075 C411 C412
5
3
47p 47p
+
JACK_DETECT 1
4
C 2
- C
R407
C413 J400
1M 100n 9001-8905-040
R408 4.7R 2
AUXI R409 4.7R 4
AUX_IN
AUXOP
R410 4.7R 3 Headset jack
1
HSP404 HSP405 HSP406 V400 V401
R420 C414 C415
100R 47p
HOOK_DETECT 47p
C427
47p
VBAT
U401 VCC_EXT P0402FC05C P0402FC05C
D 1 8 D
CNIOSE SD_
2 7
DELAY ERROP_
3 6
GND SENSE_ADJ
4 5
VIN VOUT
C416 SI9182 C417

220n 2.2u
(2012)
VR3
ON_OFF
D(0:7)
C418 R414 R415 C419
D(0)
D(1)
D(2)
D(3)
D(4)
D(5)
D(6)
D(7)
2 22n 33K 39K 10n R421 0R

6
VIBRATOR
+
Speaker
27
26
25
24
23
22
21
20
19
5
E EARP E
MTR
4 R416
D0
D1
D2
D3
D4
D5
D6
D7
R450 82K 390p

- C420 12 18
1 3 13
EQ1 SPOUT2
17
SPKP
150K EQ2 SPOUT1 SPKN
U402 C421 14
U403
EQ3
MAX4624 18p 16
V402 HSP4081 V403 HSP407 1
SPK_EN 28
YMU762 SPVSS
15
_WR 29
WR_ SPVDD
R417 MIDI_CS 30
_CS
11
A(1) 31
A0 HPOUT-R
10 C422 C423
_RD _RD HPOUT-L 2 2
10K 32 47p 47p
IOVDD
VREF
CLK1
PLLC
VR2B
-RST
-IRQ
VDD
VSS
LED
NC
P0402FC05C
P0402FC05C
1
2
3
4
5
6
7
8
MCLK R422 n.m

SUB_LED1
MELODY_INT
F MELODY_RESET F
R418
3.3K
C424 C425
C426 100n 100n Checked 02.04.11 N.S.KIM Drawing
1n Name AUDIO
Approved
LG Drawing
Electronics Inc No.
1 2 3 4 5 6 7 8
- 92 -
10. CIRCUIT DIAGRAM
1 2 3 4 5 6 7 8
KEYPAD BACKLIGHT KBC(0:4)

A A
KBC(0)
KBC(1)
KBC(2)
KBC(3)
KBC(4)
VBAT KBR(0:4)
DOME SWITCH
HSMR-C197X21 1 2 1 2 1 2 1 2 1 2
D500
D501
D502
D503
D504
D505
D506
D507
D508
D509
D510
D511
D512
D513
D514
D515
D516
D517
D518
D519
D520
HSP500 HSP501 HSP502 HSP503 HSP504
SW502
KBR(1)
1
2 VM
3 VU
P0402FC12C
4 VD
CO
V404
HSP505
2
HSP515
HSP516
MAIN LCD BACKLIGHT SW509 SW503 SW504 SW501
SIDE_KEY
1 2 3 MAIL
B R500 Q500 KBR(2) B
1
1.5K 4
2
KEYLIGHT 1
P0402FC12C
3
5
V407
6
HSP506
IMX9 SW508
R501 R502 R503 HSP507 SW505 SW506 SW507 P0402FC12C
100K 27R 27R 6 F1
KBR(3) 4 5 V406
P0402FC12C
V405
HSP508
SUB LCD BACKLIGHT SW510 SW514 SW511 SW512
7 8 9 F2
C MAIN_BACKLIGHT C
R504 KBR(4)
270R
R505
100K
HSP509
SW515 SW516 SW517 SW518 SW519
0 # SEND F3
KBR(0) *
VBAT HSP510
C500 R530 180R

100n I_LED2 SW520 SW521 SW522 SW523 SW524
D R531 62R LEFT RIGHT UP DOWN CFM D
U502 I_LED1
2 MAX4599 R532 27R
OUT OUT OUT I_LED3
6 5
4 IN IN IN
VCHG R509 END_ON_OFF
10K Q504 Q503 Q502
R508 GND GND GND
RN1307 RN1307 RN1307 VBAT VBAT 1 2
10K 3 1
R510 HSP511
6.2K
LOCKUP SW526
VIBRATOR L500 END-ON/OFF
1
100N PROTECTION
3
D521
ON_OFF VR2B VBAT ISS302
SUB_LED1 C502
E R512 10K E
SUB_LED2 56p
R513 10K L502
SUB_LED3
100N
R516 MOTOR
VR2B
33R U501
FOLDER SWITCH CIM-80S7B R517
1
2 LEDA 4.7R
3 LEDK R533 n.m
TXIR_IRDA 4 TXD PWT
R518 RXIR_IRDA 5 RXD 3
47K 0R SD_IRDA R520
R519 6 SD
FOLDER 1.5K Q506
7 VCC
GND VIBRATOR 2
2SC5585TL
C503 1
R521
2
C504 1u
F C505 SW500 100K F
A3212 100n (1608)
100n Section Date Sign & Name Model Sheet/Sheets
3

Name MMI
Approved
LG Drawing
Electronics Inc No.
1 2 3 4 5 6 7 8
- 93 -
10. CIRCUIT DIAGRAM
10.2 RF Circuit
1 2 3 4 5 6 7 8
VBAT ANT600
C603 C600 C601 C602 ANT_PAD_LGX
R600
18R SW600 C604
L600 MHC-173 27p
R602 R601 470u 47p 12p 1n 0R 2 1
R603 10p 300R 300R C605
12p N600
A 3 6 L601 A
U600 R604 1K 8 L635 4.7N LDC15D190A0007A
VAPC VDD1
GND2 VDD2
PIN_DCS POUT_DCS 5 12n 6 5 4 3
ENFVZ4L07 U602 R605 U603
68R 1 C609 47p 5 2 3 C606 4 SHS-M090B
8 6 LDB32942M05D-429
GND1
POUT_GSM 4 n.m
VCTL
TXRXSW 9
PWR_SW H_H_PWR
5
PIN_GSM
4 8
ANT
HBSW 10
DCS_SW GND2
4 8 7
LBSW GSM_SW H_L_PWR DCS OUTN R607 R606 C608
11 3 2 GSM 6 47p 8 13
100R 100R
2
7
9
VREG3
10
VCC L_L_PWR NC2 U601 7 6 1 DCS_TX GND1
12 2 4 NC1 5 10 12
GND3 GND1 OUTP PF08122B EGSM_TX GND2
13 1 11
VT L_H_PWR C611 C612 C613 C610 GND3
GND1 GND2 9
1.5p n.m 1.2p n.m GND4
GND4 GND5 1 3 6 5
DCS_RX GND5
7 14 2 3
EGSM_RX GND6
C614 C690
R608 R609
VC1
VC2
330p 0.5p
51R 0R
VBAT 1 7
VBAT R610
0R
C620
C621
C622
R615
B C619 B
1n C624 C615
2.2u 12n
(2012) C625 C626
(3216) 4.7u R616 C629 C630
2.2K
R617
27p
27p
27p
1n n.m 27P n.m
P-CASE 51R
(1608) C627 C628
R649 1n 1n
10R D600
BAT15-099
C632
C633
R619
R620
R621
C634
C635 4 2
4.7u
100n
100n
1.2K
P-CASE
4.7p
33R
n.m
R622 R623
120R 1 3 n.m
C636
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
33u/6.3V
A-CASE C687
LB-SW
VCC5
VREG3
VBAT3
R3
TXRXCP
R2
MAINSPUP2
GNDTXCP
VCC6
RXLOP
RXLON
VCC4
OMIXRF
VBAT1
VREG1
2.2u C637
C R624 C
(2012) 39p 620K
1 48
HB-SW VAPC C643
2 47
TXRX-SW FILT 7p
C638 100n 3 46 R625 R626
VCC10 DETD BPF600
C692 1n 4 45 1K 1K
MAINSPUP1 DETR
5 44
MAINCP DCSLNAN SAFSD1G84CB0T00R00
6 43 L632
C641 100n 7
VBAT2 U604 DCSLNAP
42 C642 15p L602 2.7N
VREG2 VCC3 4 3.3N
R656 1K 8 TRF6150 41 2
PA_LEVEL 9
APC PCSMIXN
40 C645 L603 2.7N
PA_ON R657 1K APCEN PCSMIXP 6
10 39 7p
VR4IN GNDLNAN
R629 1K 11 38 C646 100n
1
3
5
CLK 12
CLK VCC2
37
C639
DATA R630 1K DATA GSMLNAN n.m
R631 1K 13 36 L605
EN 14
EN GSMLNAP
35
VR2B AUXCP MAINVCO 18N BPF601
C647 100n 15 34 C648 100n C649
VCC9 VCC1 SAFSD942MCL0T00R00
VBAT C623 16 33 C657 100n
DECRXMIX
L633
AUXVCON
AUXVCOP
BANDGAP
TESTVCO
RXMIXQN
CRF VCC8 3.3p 4

RXMIXQP
BIASREF
C658
RXMIXIN
RXMIXIP
100n
RESETZ
100n 3.3N
C663 C662 3p 2
VCC7
D 3p C660 3.3p 6 D
QN
QP
IN
L606
IP
C661 U605 R678 R679 2 1

2.2u ADP3330_2V85 R632 n.m AN CAT 18N
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
0R
1
3
5
1 0R
(2012) 2 D601 L608 C640
IN OUT
HVC369B 3.3N L609 n.m
C666
C667
C668
C669
5
NR C664
2.2u C665 C691 1.2n 3.9N
n.m
GND
R633 6 3 10n
RF_ENA -SD -ERR (2012)
C672 R634 C671
100n
100n
R637 1K R636 12n

4 1.2n 9.76K(1%)
1n
1n
XO_ENA R635 C670

U606 (1608) 2.7K(1%) R638 (3216) 1K 1.2n U607
R640 VC-TCXO-208C 2.2K(1%)
n.m 4 NC7WZ02
VR3
VCC C673 HBSW 1 8
1 3
5.6n C674 7
AFC CTL OUT
1n
R642 R643 (1608) C678 R641 (2012) TXRXSW 2
GND C675 n.m
1K 1M
2 1n 390R(1%) 6
C679
3
E 12p E
4 5
5 C680
2 1n
4
13MHZ
R644 3 U629
1.5K SN74HC1GU04DCKR
LBSW
C681 C682 VREG3
R645 1K TP610 L611 4.7p 4.7p L612 LB_LP LB_HP HB_LP HB_HP
RESET_RF C683
QN 6.8N 6.8N
TXRXSW 1 0 1 0 100n
QP
IN LBSW 0 0 1 1
IP R648 HBSW 1 1 0 0
2.2K
TH601 R646
C686 22K_NTC R647 2 1
2.2K
12p 3.3N
A2
A1
CAT
R675
R673 R674 4.7k
680R C684
270k n.m C685 3 C698
F 100n D602 100n F
HVB387BWK
Designer 02.04.11 Y.M.CHO 6/6
R677 0R
Checked 02.04.11 D.H.KIM Drawing
Name RF MAIN
R676 n.m Approved
RADIO_TEMP
LG Drawing
Electronics Inc No.
1 2 3 4 5 6 7 8
- 94 -
11. PCB LAYOUT
11. PCB LAYOUT
11.1 TOP
- 95 -
11. PCB LAYOUT
11.2 BOTTOM
- 96 -
12. EXPLODED VIEW & REPLACEMENT PART LIST
12.1 Exploded View
M28
M31 M32
M27 M30
M23
M22 M26
M20
M19
M29
M16
M12 M13
M11
M10 M21 M24

M18 M25
M4 M17
M34
M2 M15
M8 M14
M1 M3
M9
M5
M7
M6
M33 M35
- 97 -
< Parts List Of Exploded View >

No. Location No. Part No. Description QTY Specification Color Sevice Remark
M1 MWAF00 MWAF0005701 WINDOW,LCD(SUB) 1 G7020 G7028 Common use (ALL BRAND) Y
M2 ACGJ00 ACGJ0016302 COVER ASSY,FOLDER(UPPER) 1 Cobalt Blue Y
ACGJ0016301 COVER ASSY,FOLDER(UPPER) 1 Metal Silver Y
ACGJ0016303 COVER ASSY,FOLDER(UPPER) 1 Red Y
M3 MHFD00 MHFD0002101 HINGE,FOLDER 1 G7000 5 PHI Y
M4 SVLM00 SVLM0003701 LCD MODULE 1 128*160, 96*64 ,32.05*40.20 ,39.5*58.7*6.4(t), 65K COLOR LCD Y
M5 SUSY00 SUSY0006001 SPEAKER 1 ASSY ,8 ohm,86 dB,15 mm,G7000 SPEAKER Y
M6 SACY00 SURY0004501 RECEIVER 1 Y
M7 SJMY00 SJMY0002801 VIBRATOR,MOTOR 1 3.0 V,80 mA,12*15 ,height 2.7+0.1T Y
M8 SBCL00 SBCL0001001 BATTERY,CELL,LITHIUM 1 3 V,1.2 mAh,COIN ,ASAHI BATTERY (ML414NB/F9D) Y
M9 SACY00 SACY0004601 PCB ASSY,FLEXIBLE 1 G7000 Receiver Y
M10 SACY01 SACY0004501 PCB ASSY,FLEXIBLE 1 G7000 LCD Y
M11 ACGH00 ACGH0006702 COVER ASSY,FOLDER(LOWER) 1 Cobalt Blue Y
ACGH0006703 COVER ASSY,FOLDER(LOWER) 1 Metal Silver Y
ACGH0006704 COVER ASSY,FOLDER(LOWER) 1 Red Y
M12 GMZZ00 GMZZ0003201 SCREW MACHINE 2 3.5 mm,3.5 mm,MSWR3(FN) ,N ,STR ,- , M1.7X3.5 DIA3.5 Y
M13 MCCH00 MCCH0003902 CAP,SCREW 2 Cobal Blue Y
MCCH0003903 CAP,SCREW 2 Metal Silver Y
MCCH0003904 CAP,SCREW 2 Red Y
Cobalt Blue
MBHY0003503 BUMPER 1 LG-510,511,512,common use for METALIC SILVER,diameter=2.4 Metal Silver Y
M14 MBHY00
MBHY0003505 BUMPER 1 LG-510,511,512,common use, diameter=2.4 Red Y
M15 MWAC00 MWAC0021401 WINDOW,LCD 1 65K COLOR (LG Brand) Y
M16 ABGC00 ABGC0000701 BUTTON ASSY,SIDE 1 G7000 Y
M17 ACGK00 ACGK0014702 COVER ASSY,FRONT 1 Cobalt Blue Y
ACGK0014703 COVER ASSY,FRONT 1 Metal Silver Y
ACGK0014704 COVER ASSY,FRONT 1 Red Y
M18 MDAC00 MDAC0005001 DECO,SIDE 2 G7000 Y
M19 MCCC00 MCCC0003502 CAP,EARPHONE JACK 1 G7000 Pearl White Color Cobalt Blue Y
MCCC0003501 CAP,EARPHONE JACK 1 Metal Silver Y
MCCC0003503 CAP,EARPHONE JACK 1 Red Y
M20 ABGA00 ABGA0000901 BUTTON ASSY,DIAL 1 OK key + i (English version) Y
M21 ADCA00 ADCA0006001 DOME ASSY,METAL 1 G7000 Y
M22 SAKY00 SAKY0001101 PCB ASSY,SIDEKEY 1 G7000 Y
M23 SAFY00 SAFY0050102 PCB ASSY,MAIN 1 65K color PCB ASSY MAIN Y
M24 SUMY00 SUMY0003503 MICROPHONE 1 FPCB,-40 dB,6*1.8,TOLERANCE +-2 Y
M25 MLEA00 MLEA0003802 LOCKER,BATTERY 1 Cobalt Blue Y
MLEA0003803 LOCKER,BATTERY 1 Metal Silver Y
MLEA0003804 LOCKER,BATTERY 1 Red Y
M26 MWAZ00 MWAZ0001701 WINDOW 1 G7000 IrDA Y
M27 ACGM00 ACGM0011902 COVER ASSY,REAR 1 Cobalt Blue Y
ACGM0011903 COVER ASSY,REAR 1 MetalSilver Y
ACGM0011904 COVER ASSY,REAR 1 Red Y
M28 SNGF00 SNGF0000702 ANTENNA,GSM,FIXED 1 1.5 ,-2.5 dBd,P426C ,G7000 ANTENNA Cobalt Blue Y
SNGF0000701 ANTENNA,GSM,FIXED 1 1.5 ,-2.5 dBd,P427 ,G7000 ANTENNA (PANTONE 427C) Metal Silver Y
SNGF0000702 ANTENNA,GSM,FIXED 1 1.5 ,-2.5 dBd,P426C ,G7000 ANTENNA Red Y
M29 ACFY00 ACFY0000701 CONTACT ASSY,ANTENNA 1 G7000 Y
M30 MCCF00 MCCF0002002 CAP,MOBILE SWITCH 1 LG-510,511,512 Cobalt Blue Y
MCCF0002003 CAP,MOBILE SWITCH 1 LG-510,511,512 Metal Silver Y
MCCF0002005 CAP,MOBILE SWITCH 1 LG-510,511,512 Red Y
M31 GMZZ00 GMZZ0003201 SCREW MACHINE 2 3.5 mm,3.5 mm,MSWR3(FN) ,N ,STR ,- , M1.7X3.5 DIA3.5 Y
M32 SBPP00 SBPP0005103 BATTERY PACK,LI-POLYMER 1 3.7 V,820 mAh,1 CELL,PRISMATIC ,G7000-BATTERY PACK (CB) Cobalt Blue Y
SBPP0005102 BATTERY PACK,LI-POLYMER 1 3.7 V,820 mAh,1 CELL,PRISMATIC ,G7000-BATTERY PACK (SV) Metal Silver Y
SBPP0005104 BATTERY PACK,LI-POLYMER 1 3.7 V,820 mAh,1 CELL,PRISMATIC ,G7000-BATTERY PACK (RD) Red Y
M33 MTAE00 MTAE0004901 TAPE,WINDOW(SUB) 1 G7020 G7028 Common use Y
M34 MCCZ00 MCCZ0002702 CAP 1 Cobalt Blue Y
MCCZ0002703 CAP 1 Metal Silver Y
MCCZ0002704 CAP 1 Red Y
M35 ACGG00 ACGG0021702 COVER ASSY,FOLDER 1 Cobalt Blue Y
ACGG0021701 COVER ASSY,FOLDER 1 Metal Silver Y
ACGG0021703 COVER ASSY,FOLDER 1 Red Y
- 98 -
12.2 Accessories
Portable Handsfree Travel Adapter
Cigar Lighter Adapter Data-cable
< Accessories >

No. Location No. Part No. Description QTY Specification Color Service Remark
2 SGEY00 SGEY0002901 EAR PHONE/EAR MIKE SET 1 EG890B, G5200 3P EAR MIC (EM-412GS) Yes
2 SSAD00 SSAD0007806 TRAVEL ADAPTOR,AC-DC 1 100-240V, 50/60 Hz,5.2 V,850 mA,CE (Europe: TA-20G) Yes
SSAD0007807 TRAVEL ADAPTOR,AC-DC 1 100-240V, 50/60 Hz,5.2 V,850 mA,CE (Russian(CIS): TA-20GR) Yes
2 SGCC00 SGCC0001802 CIGARETTE LIGHT ADOPTER 1 CLA (CLA-20G) Yes
2 SGDY00 SGDY0004401 DATACABLE 1 (DK-20G) Yes
- 99 -
12.3REPLACEMENT PARTS
<Mechanic components>
Level Location No. Part No. Description QTY Specification Service Color Remark
3 ABGA00 — BUTTON ASSY,DIAL 1 Please refer to the 'Exploded View' Y M20
3 ACGG00 — COVER ASSY,FOLDER 1 Please refer to the 'Exploded View' Y Cobalt Blue M35
3 ACGG00 — COVER ASSY,FOLDER 1 Please refer to the 'Exploded View' Y Metal Silver
3 ACGG00 — COVER ASSY,FOLDER 1 Please refer to the 'Exploded View' Y Red
4 ACGH00 — COVER ASSY,FOLDER(LOWER) 1 Please refer to the 'Exploded View' Y Cobalt Blue M11
4 ACGH00 — COVER ASSY,FOLDER(LOWER) 1 Please refer to the 'Exploded View' Y Metal Silver
4 ACGH00 — COVER ASSY,FOLDER(LOWER) 1 Please refer to the 'Exploded View' Y Red
5 MBHY00 — BUMPER 2 Please refer to the 'Exploded View' Y M14
4 MCCH00 — CAP,SCREW 2 Please refer to the 'Exploded View' Y Cobalt Blue M13
4 MCCH01 — CAP,SCREW 2 Please refer to the 'Exploded View' Y Metal Silver
4 MCCH02 — CAP,SCREW 2 Please refer to the 'Exploded View' Y Red
5 MCJH00 MCJH0004203 COVER,FOLDER(LOWER) 1 N
5 MDAF00 MDAF0000702 DECO,FOLDER(LOWER) 1 N Cobalt Blue
5 MDAF00 MDAF0000703 DECO,FOLDER(LOWER) 1 N Metal Silver
5 MDAF00 MDAF0000704 DECO,FOLDER(LOWER) 1 N Red
5 MDAH01 MDAH0000201 DECO,RECEIVER 1 G7000 N
5 MFBB00 MFBB0001901 FILTER,RECEIVER 1 G7000 N
5 MPBG00 MPBG0004801 PAD,LCD 1 G7000 N
5 MPBJ00 MPBJ0003201 PAD,MOTOR 1 G7000 N
5 MTAA00 MTAA0006801 TAPE,DECO 1 G7000 RECEIVER N Pearl White
5 MTAA00 MTAA0006501 TAPE,DECO 1 G7000 FOLDER(LOWER) N Metal Silver
5 MTAA00 MTAA0006401 TAPE,DECO 1 G7000 FRONT N Red
5 MTAA01 MTAA0006501 TAPE,DECO 1 G7000 FOLDER(LOWER) N Pearl White
5 MTAA01 MTAA0006801 TAPE,DECO 1 G7000 RECEIVER N Metal Silver
5 MTAA01 MTAA0006701 TAPE,DECO 2 G7000 SIDE N Red
5 MTAD00 MTAD0010301 TAPE,WINDOW 1 NITTO No.5000NS (t=0.16) N
4 ACGJ00 — COVER ASSY,FOLDER(UPPER) 1 Please refer to the 'Exploded View' Y Cobalt Blue M2
4 ACGJ00 — COVER ASSY,FOLDER(UPPER) 1 Please refer to the 'Exploded View' Y Metal Silver
4 ACGJ00 — COVER ASSY,FOLDER(UPPER) 1 Please refer to the 'Exploded View' Y Red
5 ADBY00 ADBY0001202 DECO ASSY 1 Y Cobalt Blue
5 ADBY00 ADBY0001201 DECO ASSY 1 PROJECTION ASSY (RUSSIA) Y Metal Silver
5 ADBY00 ADBY0001203 DECO ASSY 1 Y Red
6 MDAE00 MDAE0009802 DECO,FOLDER(UPPER) 1 N Cobalt Blue
6 MDAE00 MDAE0009801 DECO,FOLDER(UPPER) 1 PROJECTION N Metal Silver
6 MDAE00 MDAE0009803 DECO,FOLDER(UPPER) 1 N Red
6 MFBC00 MFBC0001901 FILTER,SPEAKER 1 G7010,G7020 COMMON USE N
6 MTAA00 MTAA0016601 TAPE,DECO 1 UPPER DECO(LEATHER ASSY) N
5 MCCZ00 — CAP 1 Please refer to the 'Exploded View' Y Cobalt Blue M34
5 MCCZ00 — CAP 1 Please refer to the 'Exploded View' Y Metal Silver
5 MCCZ00 — CAP 1 Please refer to the 'Exploded View' Y Red
5 MCJJ00 MCJJ0010202 COVER,FOLDER(UPPER) 1 N Cobalt Blue
5 MCJJ00 MCJJ0010201 COVER,FOLDER(UPPER) 1 G7028 (EASTCOM BRAND) N Metal Silver
5 MCJJ00 MCJJ0010203 COVER,FOLDER(UPPER) 1 N Red
5 MDAE00 MDAE0008403 DECO,FOLDER(UPPER) 1 W7020 LG-COLOR DISPLAY (RUSSIA) N
5 MDAY00 MDAY0004201 DECO 1 G7020 G7028 Common use (SUS) N
5 MIAA00 MIAA0006701 INDICATOR,LED 1 G7020 G7028 COMMON USE N
5 MICA00 MICA0001201 INSERT,FRONT 2 LG-G510,511,512 common use, DIA = 1.7mm+2.3t N
5 MMAA00 MMAA0000901 MAGNET,SWITCH 1 G7000 12x2x0.7t N
5 MPBQ00 MPBQ0005501 PAD,LCD(SUB) 1 G7010 & G7020 SUB LCD PAD N
5 MPBZ00 MPBZ0017401 PAD 1 G7010, G7020 INDICATOR PAD (Common use) N
5 MPFD00 MPFD0001001 PLATE,GROUND 1 G7010 N
5 MTAA00 MTAA0015501 TAPE,DECO 1 G7020 folder uppper (Electro Forming) ) N
5 MTAA01 MTAA0015601 TAPE,DECO 1 G7020 FOLDER UPPER SUS (#615 OR#668) N
5 MTAE00 — TAPE,WINDOW(SUB) 1 Please refer to the 'Exploded View' Y M33
5 MTAZ00 MTAZ0005401 TAPE 1 G7000 MAGNET SWITCH N
- 100 -
4 ACGK00 — COVER ASSY,FRONT 1 Please refer to the 'Exploded View' Y Cobalt Blue M17
4 ACGK00 — COVER ASSY,FRONT 1 Please refer to the 'Exploded View' Y Metal Silver
4 ACGK00 — COVER ASSY,FRONT 1 Please refer to the 'Exploded View' Y Red
5 ABGC00 — BUTTON ASSY,SIDE 1 Please refer to the 'Exploded View' Y M16
5 MCCC00 — CAP,EARPHONE JACK 1 Please refer to the 'Exploded View' Y Cobalt Blue M19
5 MCCC00 — CAP,EARPHONE JACK 1 Please refer to the 'Exploded View' Y Pearl White
5 MCCC00 — CAP,EARPHONE JACK 1 Please refer to the 'Exploded View' Y Red
5 MCJK00 MCJK0006602 COVER,FRONT 1 N Cobalt Blue
5 MCJK00 MCJK0006603 COVER,FRONT 1 N Metal Silver
5 MCJK00 MCJK0006604 COVER,FRONT 1 N Red
5 MDAC00 — DECO,SIDE 2 Please refer to the 'Exploded View' Y M18
5 MDAG00 MDAG0000902 DECO,FRONT 1 N Cobalt Blue
5 MDAG00 MDAG0000903 DECO,FRONT 1 N Metal Silver
5 MDAG00 MDAG0000904 DECO,FRONT 1 N Red
5 MICA00 MICA0001201 INSERT,FRONT 4 LG-G510,511,512 common use, DIA = 1.7mm+2.3t N
5 MPBH00 MPBH0001101 PAD,MIKE 1 G7000 FRONT N
5 MTAA00 MTAA0006401 TAPE,DECO 1 G7000 FRONT N
5 MTAA01 MTAA0006701 TAPE,DECO 2 G7000 SIDE N
4 GMZZ00 — SCREW MACHINE 2 Please refer to the 'Exploded View' Y M12
4 MGAD00 MGAD0006001 GASKET,SHIELD FORM 2 G7000 10x5x1.5t N
4 MHFD00 — HINGE,FOLDER 1 Please refer to the 'Exploded View' Y M3
4 MTAB00 MTAB0005101 TAPE,PROTECTION 1 G7000 FOLDER UPPER PROTECTION TAPE Y
4 MTAB01 MTAB0005001 TAPE,PROTECTION 1 G7000 MAIN LCD WINDOW PROTECTION TAPE N
4 MTAB02 MTAB0005201 TAPE,PROTECTION 1 G7000 sublcd window tape N
4 MWAC00 — WINDOW,LCD 1 Please refer to the 'Exploded View' Y M15
4 MWAF00 — WINDOW,LCD(SUB) 1 Please refer to the 'Exploded View' Y M1
4 SACY00 — PCB ASSY,FLEXIBLE 1 Please refer to the 'Exploded View' Y M9
5 SACY00 — RECEIVER 1 Please refer to the 'Exploded View' Y M6
5 SBCL00 — BATTERY,CELL,LITHIUM 1 Please refer to the 'Exploded View' Y M8
5 SJMY00 — VIBRATOR,MOTOR 1 Please refer to the 'Exploded View' Y M7
5 SPCY00 SPCY0007304 PCB,FLEXIBLE 1 POLYI ,0.3 mm,DOUBLE ,G7000 Receiver N
5 SUSY00 — SPEAKER 1 Please refer to the 'Exploded View' Y M5
4 SACY01 — PCB ASSY,FLEXIBLE 1 Please refer to the 'Exploded View' Y M10
5 ENBY00 ENBY0011001 CONNECTOR,BOARD TO BOARD 1 30 PIN,0.5 mm,STRAIGHT , ,B to B CNT (SOCKET) N
5 ENBY01 ENBY0010901 CONNECTOR,BOARD TO BOARD 1 30 PIN,0.5 mm,STRAIGHT , ,B to B CNT (HEAER) N
5 SPCY00 SPCY0007202 PCB,FLEXIBLE 1 POLYI ,0.3 mm,DOUBLE ,G7000 LCD N
4 SPCY00 SPCY0013401 PCB,FLEXIBLE 1 FR-1 ,0.07 mm,DOUBLE ,GND FPCB N
4 SVLM00 — LCD MODULE 1 Please refer to the 'Exploded View' Y M4
3 ACGM00 — COVER ASSY,REAR 1 Please refer to the 'Exploded View' Y Cobalt Blue M27
3 ACGM00 — COVER ASSY,REAR 1 Please refer to the 'Exploded View' Y Metal Silver
3 ACGM00 — COVER ASSY,REAR 1 Please refer to the 'Exploded View' Y Red
4 ACFY00 — CONTACT ASSY,ANTENNA 1 Please refer to the 'Exploded View' Y M29
5 MBIA00 MBIA0000301 BUSHING,ANTENNA 1 G7000 (KS-D-5101 C3603B ), N
3 MCCF00 MCCF0002002 CAP,MOBILE SWITCH 1 Please refer to the 'Exploded View' Y Cobalt Blue M30
3 MCCF01 MCCF0002003 CAP,MOBILE SWITCH Please refer to the 'Exploded View' Metal Silver
3 MCCF02 MCCF0002005 CAP,MOBILE SWITCH Please refer to the 'Exploded View' Red
5 MCIA00 MCIA0003701 CONTACT,ANTENNA 1 G7000 N
4 MCJN00 MCJN0005402 COVER,REAR 1 N Cobalt Blue
4 MCJN00 MCJN0005403 COVER,REAR 1 N Metal Silver
4 MCJN00 MCJN0005404 COVER,REAR 1 N Red
4 MGAD00 MGAD0011901 GASKET,SHIELD FORM 1 (2.8X7.5X0.3t) N
4 MGAD01 MGAD0012001 GASKET,SHIELD FORM 1 (6.0X6.0X3.0t) N
4 MIDZ00 MIDZ0008001 INSULATOR 1 G7000 BB INSULATOR N
4 MIDZ01 MIDZ0008101 INSULATOR 1 G7000 RF INSULATOR N
4 MLEA00 — LOCKER,BATTERY 1 Please refer to the 'Exploded View' Y Cobalt Blue M25
- 101 -
4 MLEA00 — LOCKER,BATTERY 1 Please refer to the 'Exploded View' Y Metal Silver
4 MLEA00 — LOCKER,BATTERY 1 Please refer to the 'Exploded View' Y Red
4 MPBH00 MPBH0001201 PAD,MIKE 1 G7000 BACK N
4 MSAZ00 MSAZ0007603 SHEET 1 FDK Company(PE72 11.0*11.0*0.25t) N
4 MSAZ01 MSAZ0007602 SHEET 1 FDK Company (PE72 4.2*11.8 0.25t) N
4 MSDB00 MSDB0001701 SPRING,COIL 1 G7000 N
4 MWAZ00 — WINDOW 1 Please refer to the 'Exploded View' Y M26
3 ADCA00 — DOME ASSY,METAL 1 Please refer to the 'Exploded View' Y M21
3 GMZZ00 — SCREW MACHINE 4 Please refer to the 'Exploded View' Y M31
3 MLAK00 MLAK0006301 LABEL,MODEL 1 LG (30.5x21.54-1R) Y
3 SAKY00 — PCB ASSY,SIDEKEY 1 Please refer to the 'Exploded View' Y M22
3 SUMY00 — MICROPHONE 1 Please refer to the 'Exploded View' Y M24
2 SBPP00 — BATTERY PACK,LI-POLYMER 1 Please refer to the 'Exploded View' Y Cobalt Blue M32
2 SBPP00 — BATTERY PACK,LI-POLYMER 1 Please refer to the 'Exploded View' Y Metal Silver
2 SBPP00 — BATTERY PACK,LI-POLYMER 1 Please refer to the 'Exploded View' Y Red
2 SNGF00 — ANTENNA,GSM,FIXED 1 Please refer to the 'Exploded View' Y Cobalt Blue M28
2 SNGF00 — ANTENNA,GSM,FIXED 1 Please refer to the 'Exploded View' Y Metal Silver
2 SNGF00 — ANTENNA,GSM,FIXED 1 Please refer to the 'Exploded View' Y Red
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< Main PCB >
Leve Location No. Part No. Description QTY Specification Service Remark
3 SAFY00 — PCB ASSY,MAIN 1 Please refer to 'Exploded View' Y M23
4 SAFA00 SAFA0015702 PCB ASSY,MAIN,AUTO 1 65K color PCB ASSY MAIN AUTO N
5 BPF600 SFSY0012301 FILTER,SAW 1 1842.5 MHz,2.0*2.5*1.0 ,SMD ,DCS BAND Y
5 BPF601 SFSY0012201 FILTER,SAW 1 942.5 MHz,2.0*2.5*1.0 ,SMD ,GSM BAND Y
5 BPF602 SFSY0014101 FILTER,SAW 1 897 MHz,2.0*2.0*1.8 ,SMD , Y
5 C100 ECTZ0003901 CAP,TANTAL,CHIP,MAKER 1 10 uF,16V ,M ,STD ,ETC ,R/TP Y
5 C101 ECCH0000179 CAP,CERAMIC,CHIP 1 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C103 ECCH0000130 CAP,CERAMIC,CHIP 1 150 pF,50V,J,SL,TC,1005,R/TP Y
5 C104 ECCH0000379 CAP,CERAMIC,CHIP 1 2.2 uF,6.3V ,K ,X5R ,HD ,2012 ,R/TP Y
5 C105 ECCH0000122 CAP,CERAMIC,CHIP 1 47 pF,50V,J,NP0,TC,1005,R/TP Y
5 C108 ECCH0000143 CAP,CERAMIC,CHIP 1 1 nF,50V,K,X7R,HD,1005,R/TP Y
5 C109 ECZH0003902 CAP,CHIP,MAKER 1 0.1 uF,50V ,K ,X7R ,HD ,2012 ,R/TP Y
5 C110 ECCH0000276 CAP,CERAMIC,CHIP 1 1 uF,10V,Z,Y5V,HD,1608,R/TP Y
5 C118 ECCH0000186 CAP,CERAMIC,CHIP 1 33 pF,50V ,J ,NP0 ,TC ,1005 ,R/TP Y
5 C124 SEVY0004901 VARISTOR 1 5.6 V, ,SMD ,CAP=370pF+-30% Y
5 C211 ECCH0000135 CAP,CERAMIC,CHIP 1 270 pF,50V ,K ,X7R ,HD ,1005 ,R/TP Y
5 C215 ECCH0001811 CAP,CERAMIC,CHIP 1 0.22 uF,50V ,Z ,Y5V ,HD ,1005 ,R/TP Y
5 C217 ECCH0000182 CAP,CERAMIC,CHIP 1 0.1 uF,10V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C410 ECCH0000189 CAP,CERAMIC,CHIP 1 680 pF,50V ,J ,X7R ,HD ,1005 ,R/TP Y
- 103 -
5 C416 ECCH0001811 CAP,CERAMIC,CHIP 1 0.22 uF,50V ,Z ,Y5V ,HD ,1005 ,R/TP Y
5 C418 ECCH0000179 CAP,CERAMIC,CHIP 1 22 nF,16V ,K ,X5R ,HD ,1005 ,R/TP Y
5 C450 ECCH0003401 CAP,CERAMIC,CHIP 1 10 uF,6.3V ,Z ,Y5V ,HD ,2012 ,R/TP Y
5 C603 ECTZ0003801 CAP,TANTAL,CHIP,MAKER 1 470 uF,6.3V ,M ,L_ESR ,ETC ,R/TP Y
5 C611 ECCH0000103 CAP,CERAMIC,CHIP 1 1.5 pF,50V,C,NP0,TC,1005,R/TP Y
5 C613 ECCH0000701 CAP,CERAMIC,CHIP 1 1.2 pF,50V ,C ,NP0 ,TC ,1005 ,R/TP Y
5 C615 ECFD0000101 CAP,FILM,MPP 1 8200 pF,16V ,J ,NI ,SMD ,2012 mm,R/TP Y
5 C625 ECFD0000601 CAP,FILM,MPP 1 1 nF,16V ,J ,NI ,SMD ,1608 mm,R/TP Y
5 C626 ECTZ0003401 CAP,TANTAL,CHIP,MAKER 1 4.7 uF,6.3V ,M ,STD ,2012 ,R/TP Y
5 C635 ECTZ0003401 CAP,TANTAL,CHIP,MAKER 1 4.7 uF,6.3V ,M ,STD ,2012 ,R/TP Y
5 C643 ECCH0000108 CAP,CERAMIC,CHIP 1 7 pF,50V,D,NP0,TC,1005,R/TP Y
5 C645 ECCH0000108 CAP,CERAMIC,CHIP 1 7 pF,50V,D,NP0,TC,1005,R/TP Y
5 C649 ECCH0000104 CAP,CERAMIC,CHIP 1 3 pF,50V,C,NP0,TC,1005,R/TP Y
- 104 -
5 C662 ECCH0000104 CAP,CERAMIC,CHIP 1 3 pF,50V,C,NP0,TC,1005,R/TP Y
5 C670 ECCH0000144 CAP,CERAMIC,CHIP 1 1.2 nF,50V,K,X7R,HD,1005,R/TP Y
5 C690 ECCH0000101 CAP,CERAMIC,CHIP 1 0.5 pF,50V,C,NP0,TC,1005,R/TP Y
5 D100 EDSY0005201 DIODE,SWITCHING 1 SMD ,30 V,1.5 A,R/TP , Y
5 D200 EDSY0010401 DIODE,SWITCHING 1 1-1G1A ,40 V,300 A,R/TP ,Silicon Epitaxial Schottky Barrier Type Diode Y
5 D401 EDSY0009901 DIODE,SWITCHING 1 ESC ,80 V,300 A,R/TP ,1.6*0.8*0.6(t) Y
5 D501 EDLH0004502 DIODE,LED,CHIP 1 BLUE ,1608 ,R/TP ,0.35T Y
5 D521 EDSY0005301 DIODE,SWITCHING 1 SC-70 ,80 V,0.1 A,R/TP , Y
5 D600 EDSY0010301 DIODE,SWITCHING 1 SOT-143 ,4 V,.11 A,R/TP ,Silicon Dual Schottky Diode Y
5 D601 EDVY0001201 DIODE,VARIABLE CAP 1 UFP ,4.65 pF,R/TP ,diode capacitance:C1:4.65~5.15pF/C4:1.85~2.15pF Y
5 D602 EDVY0001401 DIODE,VARIABLE CAP 1 CMPAK ,4.50 pF,R/TP ,diode capacitance:C1:4.50~5.00pF/C3:1.85~2.80pF Y
5 HSP402 ERHY0000201 RES,CHIP 1 0 ohm,1/16W,J,1005,R/TP Y
5 J100 ENSY0007601 CONN,SOCKET 1 6 PIN,ETC ,SOCKET ,2.54 mm,G7000 SIM CNT (2.4t) Y
5 J101 ENRY0000901 CONNECTOR,I/O 1 24 PIN,0.5 mm,ETC , , Y
5 J102 ENBY0010901 CONNECTOR,BOARD TO BOARD 1 30 PIN,0.5 mm,STRAIGHT , ,B to B CNT (HEAER) Y
5 J400 ENJE0002301 CONN,JACK/PLUG,EARPHONE 1 3,5 PIN,G7000 EAR JACK 3 pole, 5 pin KSD Y
5 L100 SFBH0007102 FILTER,BEAD,CHIP 1 10 ohm,1005 ,Ferrite Bead Y
- 105 -
5 L500 ELCH0005009 INDUCTOR,CHIP 1 100 nH,J ,1005 ,R/TP , Y
5 L600 ECCH0000112 CAP,CERAMIC,CHIP 1 15 pF,50V,J,NP0,TC,1005,R/TP Y
5 L602 ELCH0005002 INDUCTOR,CHIP 1 2.7 nH,S ,1005 ,R/TP , Y
5 L605 ELCH0001402 INDUCTOR,CHIP 1 18 nH,J,1005,R/TP Y
5 L606 ELCH0001402 INDUCTOR,CHIP 1 18 nH,J,1005,R/TP Y
5 L608 ELCH0001405 INDUCTOR,CHIP 1 3.3 nH,S,1005,R/TP Y
5 L611 ELCH0001003 INDUCTOR,CHIP 1 6.8 nH,J,1005,R/TP Y
5 L612 ELCH0001003 INDUCTOR,CHIP 1 6.8 nH,J,1005,R/TP Y
5 N600 SCHY0000101 COUPLER,RF HYBRID 1 19.0 dB,0.35 dB,24.0 dB,2.0*1.25*0.95 ,SMD ,DUAL COUPLER Y
5 Q100 EQFP0003301 TR,FET,P-CHANNEL 1 SOT-6 ,1.6 W,30 V,2.4 A,R/TP ,use for charge P- CHANNEL FET Y
5 Q101 EQBN0007001 TR,BJT,NPN 1 SC-70 ,0.1 W,R/TP , Y
5 Q500 EQBN0004801 TR,BJT,NPN 1 SMT6 ,0.2 W,R/TP , Y
5 Q506 EQBN0007101 TR,BJT,NPN 1 EMT3 ,0.15 W,R/TP ,LOW FREQUENCY Y
5 R100 ERHY0000265 RES,CHIP 1 20K ohm,1/16W,J,1005,R/TP Y
5 R102 ERHY0000299 RES,CHIP 1 33000 ohm,1/16W ,J ,1005 ,R/TP Y
5 R103 ERNR0000403 RES,ARRAY,R 1 10000 ohm, ohm,8 PIN,J ,1/32 W ,SMD ,R/TP Y
5 R105 ERHY0000220 RES,CHIP 1 100 ohm,1/16W,J,1005,R/TP Y
5 R107 ERHY0000202 RES,CHIP 1 4.7 ohm,1/16W,J,1005,R/TP Y
5 R114 ERHY0000296 RES,CHIP 1 1M ohm,1/16W,J,1005,R/TP Y
5 R116 ERHY0001102 RES,CHIP 1 0.2 ohm,1/4W ,F ,2012 ,R/TP Y
5 R118 ERHY0000250 RES,CHIP 1 3.3K ohm,1/16W,J,1005,R/TP Y
- 106 -
- 107 -
5 R603 ECCH0000110 CAP,CERAMIC,CHIP 1 10 pF,50V,D,NP0,TC,1005,R/TP Y
5 R624 ERHY0006602 RES,CHIP 1 620 Kohm,1/16W ,J ,1005 ,R/TP Y
5 R634 ERHY0008503 RES,CHIP 1 9.76 Kohm,1/16W ,F ,1005 ,R/TP Y
5 R647 ELCH0001405 INDUCTOR,CHIP 1 3.3 nH,S,1005,R/TP Y
5 SPFY00 SPFY0031306 PCB,MAIN 1 FR-4 ,0.8 mm,MULTI-8 ,Ver1.3 N
5 SW500 EUSY0129501 IC 1 SC-74A FIT ,3 PIN,R/TP ,HALL EFFECT SWITCH Y
5 SW600 ENWY0000101 CONN,RF SWITCH 1 ANGLE ,SMD ,0.5 dB, Y
5 TH601 SETY0001201 THERMISTOR 1 NTC ,22 Kohm,SMD ,1.0*0.5 / NSM4 SERIES Y
5 U101 EUSY0077201 IC 1 SOT(DCK) ,5 PIN,R/TP , Y
TSSOP ,14 PIN,R/TP ,
5 U102 EUSY0111901 IC 1 QUAD BUS BUFFER WITH 3_STATE CONTROL INPUTS Y
5 U103 EUSY0100504 IC 1 SC70 ,5 PIN,R/TP ,UHS 2-INPUT OR GATE Y
5 U200 EUSY0116401 IC 1 179GHH PBGA ,179 PIN,BK ,DIGITAL BB CHIP N
5 U201 EUSY0116501 IC 1 100GGM PBGA ,100 PIN,BK ,ANALOG BB CHIP N
5 U202 EUSY0122401 IC 1 SC-82AB ,4 PIN,R/TP ,CMOS LDO 1.8V OUTPUT/ 2.0 X 2.1 Y
P-FBGA69 ,69 PIN,R/TP ,
5 U301 EUSY0134901 IC 1 64M FLASH 32M PSRAM / BOTTOM BOOT N
5 U302 EUSY0105201 IC 1 P-TFBGA63 ,63 PIN,R/TP ,64 M-bit CMOS FLASH / 70 ns N
5 U400 EUSY0077701 IC 1 SC70-5 ,5 PIN,R/TP , Y
5 U401 EUSY0077602 IC 1 MSOP-8 ,8 PIN,R/TP , Y
250mA CMOS LDO WIHT ERROR FLAG / 3.3V
5 U402 EUSY0077401 IC 1 SOT23-6 ,6 PIN,R/TP ,SPDT ANALOG SWITCH Y
5 U403 EUSY0111601 IC 1 32-PIN QFN ,32 PIN,R/TP , Y
MA-3 / 40 TONES / FM + WAVEFORM TABLE
5 U404 EUSY0077301 IC 1 SC70-6/SOT23-6 ,6 PIN,R/TP , Y
- 108 -
SURFACE MOUNT ,7 PIN,R/TP ,
5 U501 EUSY0122301 IC 1 IRDA DATA 1.3 LOW POWER TRANSCEIVER / 115.2kb/s Y
5 U502 EUSY0077301 IC 1 SC70-6/SOT23-6 ,6 PIN,R/TP , Y
1887 MHz, PPM, pF,SMD ,9.8*8.0*1.8 , VCO Y
5 U600 EXSC0005101 VCO 1 QUAD VCO( TX/RX )897/921/1747/1885 QUAD
RF-K ,12 PIN,R/TP ,
5 U601 EUSY0100102 IC 1 RF POWER AMPLIFIER / E-GSM:55%, DCS1800:50% Y
5 U602 STMY0018201 TRANSFORMER,MATCHING 1 8 PIN,SMD ,3.2*2.5*1.5mm DUAL Y
880/960 ,1710/1880 ,1.3 dB,1.5 dB,
5 U603 SFAY0001201 FILTER,SEPERATOR 1 30 dB,25 dB,ETC ,5.4*4.0*1.8 Antenna switch Y
5 U604 EUSY0116701 IC 1 S-PQFP ,64 PIN,R/TP ,RF TRANSCEIVER Y
5 U605 EUSY0076701 IC 1 SOT-23-6 ,6 PIN,R/TP , Y
5 U606 EXSK0000801 VCTCXO 1 13.0 MHz, PPM,10 pF,SMD ,5.0*3.2*1.5 , Y
5 U607 EUSY0100503 IC 1 8-LEAD US8 ,8 PIN,R/TP ,UHS DUAL 2-INPUT NOR GATE Y
5 U629 EUSY0077201 IC 1 SOT(DCK) ,5 PIN,R/TP , Y
5 V102 SEVY0004901 VARISTOR 1 5.6 V, ,SMD ,CAP=370pF+-30% Y
5 X200 EXXY0004601 X-TAL 1 0.32768 MHz,20 PPM,12.5 pF,65000 ohm,SMD ,6.9*1.4*1.3 , Y
- 109 -
- 110 -

LG W7020 Service Manual

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LG W7020 Service Manual

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1.

1.2 Regulatory Information

E. Notice of Radiated Emissions

G. Interference and Attenuation

H. Electrostatic Sensitive Devices

APC Automatic Power Control

2.1 H/W Features

2.2 Technical Specification

Item Description Specification

Item Description Specification

Item Description Specification

Figure 3-1. RF front-end circuit.

3.1.1 RF front end

Table 3-1. The logic and current

3.1.2 Demodulator and Baseband Processing

3.1.3 DC offset compensation

Figure 3-2. RX path block diagram.

Table 3-2. Gain and Noise Figure of RX path.

Ant. switch RF SAW Filter I,Q demodulator(LNA+Mixer)

Table 3-3. Total Gain and Noise Figure of RX path.

Total Gain Total Noise Figure

Table 3-4. 3-wire BUS of Synthesizer in the TRF6150

Pin Number Description

Figure 3-3. Synthesizer internal Block Diagram.

Figure 3-4. Synthesizer Circuit.

Figure 3-5. Transmitter Block Diagram.

Figure 3-6. TX IF Modulator and OPLL Circuit.

3.3.3 Power Amplifier

Figure 3-7. Power Amplifier and its Control Part Circuits.

3.3.4 PA Circuit and Control

3.4 13 MHz Clock

Figure 3-8. VCTCXO Circuit.

3.5 Power Supplies and Control Signals

Table 3-5. Regulator Specification

Regulator Voltage Powers Enable Signal

Figure 3-9. External Regulator Circuit.

3.6 Digital Baseband (DBB) Processor

Figure 3-10. Top level block diagram of the Calypso G2(HERCROM400G2).

3.6.1 General Description

3.6.2 Block Description

• ARM7TDMIE : ARM7TDMI CPU core

Memory Interface : External/Internal Memory Interface

Figure 3-6. Decoding Section Block Diagram

3.6.3 External Devices connected to memory interface

3.6.4 RF Interface (TPU, TSP block)

TSP (Time Serial Port)

3.6.5 SIM interface

SIM (Interface between DBB and ABB)

Figure 3-12. SIM Interface

3.6.6 UART Interface

Table 3-9. UART Interface Specification

3.6.7 GPIO map

Table 3-10. GPIO Map Table

Resource Inactive Active

3.7 Analog Baseband (ABB) Processor

3.7.1 General Description

3.7.2 Audio Signal Processing & Interface

Figure 3-13. Audio Interface Block Diagram

3.7.3 Baseband Codec(BBC)

Figure 3-14. Baseband Codec Block Diagram

3.7.4 Voltage Regulation(VREG)

Figure 3-15. Power Supply Scheme

Table 3-11. LDO Output Table

Output Voltage Usage